759results about "Semiconductor electrostatic transducers" patented technology

A demodulation signal generator, coupled to an air-pulse generator comprising a flap pair, includes a resonance circuit. The resonance circuit produces a first demodulation signal and a second demodulation signal. The resonance circuit and the flap pair co-perform a resonance operation, such that the first demodulation signal and the second demodulation signal are generated via the co-performed resonance operation and have opposite polarity. The flap pair performs a differential movement to form an opening to perform a demodulation operation on a modulated air pressure variation.

An air-pulse generating device includes a film structure including a first flap and a second flap opposite to each other. The film structure is actuated to operate at an ultrasonic frequency, and the air-pulse generating device produces a plurality of air pulses at an ultrasonic pulse rate. The first flap and the second flap are actuated to perform a differential movement to form an opening or a virtual valve. A slit is formed between the first flap and the second flap, and the opening or the virtual valve is formed because of the slit. The slit is formed as a zigzagging pattern on the film structure.

A method of making an acoustic sensor includes forming or providing a mold having one or more grooves extending in a direction of the length of the mold to a distal end of the mold. The method also includes forming or depositing a structure having one or more piezoelectric layers over the top surface of the mold to define a beam with a proximal portion and a distal portion, the distal portion having a corrugated section including one or more grooves that correspond to the one or more grooves of the mold. The method also includes forming or applying an electrode to the proximal portion of the structure and releasing the structure from the mold to form one or more cantilever beams. The corrugated section inhibits bending of the corrugated section along the length of the distal portion of the structure when the acoustic sensor is subjected to sound pressure.

An air-pulse generating device includes a film structure including a first flap and a second flap opposite to each other. The film structure is actuated to operate at an ultrasonic frequency, and the air-pulse generating device produces a plurality of air pulses at an ultrasonic pulse rate. The first flap and the second flap are actuated to perform a differential movement to form an opening or a virtual valve. A slit is formed between the first flap and the second flap, and the opening or the virtual valve is formed because of the slit. The slit is formed as a zigzagging pattern on the film structure.

A logarithmic amplifier includes programmable gain amplifiers each having a different gain, wherein an input of each of the programmable gain amplifiers is coupled to an input of the logarithmic amplifier; and a summing circuit having inputs coupled to a corresponding output of each of the programmable gain amplifiers and an output coupled to an output of the logarithmic amplifier, wherein the summing circuit generates a logarithmic transfer function having piecewise linear segments.

A method of operating a microelectromechanical system (MEMS) includes, in a first operational mode, converting an analog output of the MEMS into a first internal data stream and a first external data stream having a first sampling rate; transitioning from the first operational mode to a second operation mode without restarting the MEMS; and in the second operational mode, converting the analog output of the MEMS into a second internal data stream having a second sampling rate different from the first sampling rate, and performing a sampling rate conversion of the second internal data stream to generate a second external data stream.

Disclosed are a micro-electromechanical system (MEMS) structure and an MEMS microphone comprising same. The MEMS structure comprises a back plate; and a diaphragm located on one side of the back plate, wherein the diaphragm and the back plate forms a variable capacitor, the diaphragm comprises multiple first through holes and air release structures respectively corresponding to the first through holes, and the diaphragm further comprises one or more second through holes penetrating through the diaphragm.

A calibration method comprises adjusting an operating frequency of an air-pulse generating device, such that a sound pressure level (SPL) of the air-pulse generating device is within a specific range. The sound producing module comprises the air-pulse generating device configured to produce sound via generating a plurality of air pulses at a pulse rate corresponding to the operating frequency.

In an example, the present invention provides a micro-speaker device. The device has a movable diaphragm device comprising a thickness of silicon or graphene material which has a first surface and a second surface opposite of the first surface and sensor to track position of the diaphragm. The device has a housing enclosing the movable diaphragm device, the electrode device and an encapsulation device. The electrode device can be part of a CMOS device with electronics integrated on to the device that converts input audio signal in to signal that electrostatically actuates the micro-speaker from one or more surfaces.

A digital microphone includes at least one integrator; a state detection and parameter control component directly coupled to an output of the integrator; and a signal processing component coupled to an output of the state detection and parameter control component, wherein a parameter of the signal processing component includes a first value in a first operational mode and a second value in a second operational mode different from the first operational mode.

A MEMS element in which a backplate including a fixed electrode and a vibrating membrane including a movable electrode are disposed on a substrate including a back chamber, so as to face each other via a spacer, the vibrating membrane includes a pillar connected to the backplate, pillar side slits, and peripheral portion side slits, and a plurality of vibrating portion is formed in the vibrating membrane. The central portion of the vibrating membrane is connected to the backplate by the pillar, so that the amplitude of the central portion can be suppressed. In each of a plurality of vibrating portions, the pillar side slits are disposed on a portion side in which the pillar and the vibrating membrane are joined and the peripheral portion side slits are disposed at the peripheral portion, thereby decreasing the difference in the amplitude amount between the central portion and the peripheral portion.A MEMS element in which a backplate including a fixed electrode and a vibrating membrane including a movable electrode are disposed on a substrate including a back chamber, so as to face each other via a spacer, the vibrating membrane includes a pillar connected to the backplate, pillar side slits, and peripheral portion side slits, and a plurality of vibrating portion is formed in the vibrating membrane. The central portion of the vibrating membrane is connected to the backplate by the pillar, so that the amplitude of the central portion can be suppressed. In each of a plurality of vibrating portions, the pillar side slits are disposed on a portion side in which the pillar and the vibrating membrane are joined and the peripheral portion side slits are disposed at the peripheral portion, thereby decreasing the difference in the amplitude amount between the central portion and the peripheral portion.

The invention provides electronic equipment and a pickup device, the electronic equipment is provided with an appearance surface, the appearance surface is provided with a first pickup port and a plurality of second pickup ports distributed at intervals, and each second pickup port and the first pickup port are arranged at intervals; a microphone, a first sound channel and a plurality of second sound channels are arranged in the electronic equipment, the first sound channel is communicated with the first pickup port and a first cavity of the microphone, the second sound channels are communicated with the second pickup ports in a one-to-one correspondence mode, and the second sound channels are communicated with a second cavity of the microphone. And the first cavity of the microphone and the second cavity of the microphone are respectively positioned on two sides of a vibrating diaphragm of the microphone. A plurality of pickup vectors can be formed between the plurality of second pickup ports and the first pickup port. A vector obtained by adding the plurality of pickup vectors is consistent with the sensitivity direction of the microphone. The microphone of the electronic equipment can better receive sound from the sensitivity direction of the microphone, and the microphone can realize directional pickup.

A piezoelectric microelectromechanical system microphone comprises a support substrate, a diaphragm including a piezoelectric material attached to the support substrate and configured to deform and generate an electrical potential responsive to impingement of sound waves on the diaphragm, and a compliant anchor formed of a material with a greater compliance than a compliance of the piezoelectric material, the compliant anchor defined in the diaphragm in an anchor region between the piezoelectric material of the diaphragm and the support substrate to improve sensitivity and reduce residual stress impact of the piezoelectric microelectromechanical system microphone.

Disclosed are a vibration sensor, an electronic device and a vibration detection method. The vibration sensor comprises a circuit board assembly, a housing, a chip assembly, a vibration-pickup assembly and a through-hole. A back cavity is formed inside the circuit board assembly, the housing is mounted over the circuit board assembly, and the chip assembly is provided on a side of the circuit board assembly proximate to the housing and is electrically connected to the circuit board assembly. The vibration-pickup assembly is provided inside the cavity and dividing the cavity into a first cavity and a second cavity. The through-hole of the vibration sensor may be in communication with the back cavity and the second cavity.

The invention relates to a MEMS component, in particular an acoustic transducer or pressure sensor, comprising: a substrate with a cavern and a mainland, an interaction element arranged above the cavern and connected to the mainland, where the interaction element is a bending beam, a boundary layer arranged at a distance from the bending beam via connecting elements, which defines a cavity with the bending beam, and a back plate located within the cavity, which is designed as a back electrode, wherein the back plate is designed to be stiffer with respect to the boundary layer and the bending beam, at least one electrode which forms a readable capacitance with a back electrode of the back plate in order to capacitively detect a deflection of at least one of the bending beam, the connecting elements and the boundary layer, at least one stop element which is designed to be displaced into a mechanical stop, wherein the stop element in the stop has at least one fluid flow resistance, in particular a fluid seal, between the cavity on a substrate-facing side and a volume on a substrate-facing side of the cavity.

An airflow generating device includes a first cell and a second cell. The first cell is disposed within a first region and generates a first air pressure with a first polarity. The second cell is disposed within a second region and generates a second air pressure with a second polarity. The second polarity is opposite to the first polarity.

The invention relates to a microelectromechanical sensor (10) for measuring an environmental variable (12) of a sensor environment (16), comprising at least one deflection element (20) which can be deflected in a vertical direction (18) depending on the environmental variable (12), at least one counter electrode (32), at least one electrode surface (34) which is coupled to the deflection element (20) and which can be moved relative to the counter electrode (32) depending on the deflection of the deflection element (20) by changing an electrode spacing (38) and which faces the counter electrode (32), wherein stiffening means (44) are arranged between the electrode surface (34) and the deflection element (20),which extend in a first direction (48) perpendicular to the vertical direction (18) alternating with at least one free first gap (50) between the deflection element (20) and the electrode surface (34) and in a second direction (52) perpendicular to the vertical direction (18) and the first direction (48) alternating with at least one free second gap (54) between the deflection element (20) and the electrode surface (34) and which connect the electrode surface (34) and the deflection element (20) to one another at a distance in the vertical direction (18).

A vibration sensor (200) is provided, comprising: a vibration receiver (210) including a housing (211) and a vibration unit (212), the housing (211) forming an acoustic cavity, the vibration unit (212) being located in the acoustic cavity and separating the acoustic cavity into a first acoustic cavity (213) and a second acoustic cavity (214); and an acoustic transducer (220) acoustically connected to the first acoustic cavity (213). The housing (211) is configured to generate a vibration based on an external vibration signal, the vibration unit (212) changes an acoustic pressure within the first acoustic cavity (213) in response to the vibration of the housing (211), causing the acoustic transducer (220) to generate an electrical signal. The vibration unit (212) includes a quality element (2121) and an elastic element (2122), an area of the quality element (2121) on a side away from the acoustic transducer (220) is smaller than an area of the quality element (2121) on a side close to the acoustic transducer. The elastic element (2122) is connected around a side wall of the quality element (2121).

MEMS device (10) with a movable displacement element (12) and a drive device (14) for driving the movable displacement element (12), wherein the drive device (14) has at least one drive electrode (16), characterized in that the drive electrode (16) is segmented and at least one functional electrode (18) is provided for measuring the deflection of the displacement element (12).

The present application relates to an abnormal signal detection device using a dual acoustic wave sensor. The abnormal signal detection device using a dual acoustic wave sensor comprises: a housing including a first acoustic wave transmission portion and a second acoustic wave transmission portion; a base substrate located inside the housing and including a first surface and a second surface; a first acoustic wave sensor mounted on the first surface and converting an acoustic wave in a first band into a first electrical signal; a second acoustic wave sensor mounted on the second surface and converting an acoustic wave in a second band into a second electrical signal.

The invention provides an MEMS device, which increases the displacement of a movable part, reduces the stress of the MEMS device, enables the MEMS device to be miniaturized, and improves the resonance frequency. The MEMS device is provided with a frame-shaped fixed part, a movable part arranged on the inner side of the fixed part in plan view, four torsion beams for supporting the movable part, driving beams which are respectively arranged relative to the torsion beams, one ends of the driving beams are connected with the torsion beams, and the other ends of the driving beams are connected with the inner edge of the fixed part, and driving sources arranged on the driving beams. Each of the drive beams is arranged to be point-symmetric with respect to the center of the movable part in plan view, and each of the drive beams has a region in which the width in a direction parallel to a first side connected to the inner edge gradually increases toward the first side in plan view. The movable part is provided with extension parts extending radially from the center in plan view, the number of the extension parts is the same as the number of the torsion beams, each extension part comprises an upper surface, a lower surface, one end surface and two side surfaces connected with the end surface, and each torsion beam is connected with two adjacent side surfaces included in different extension parts.

A MEMS audio device includes a first wafer having a top with a first cavity and a bottom with a vent hole coupled to the first cavity, wherein the bottom having first contacts, a second wafer disposed upon the first wafer having a flexible material layer disposed above the first cavity, a third wafer disposed upon the second wafer having physical contacts coupled to the second wafer, wherein the third wafer includes a second cavity disposed above the flexible material layer, a wiring wafer disposed below the first wafer having a second vent hole coupled to the first cavity, wherein the wiring wafer having second contacts coupled to the first contacts, and wherein the flexible material layer forms a diaphragm for the MEMS audio device.

The present invention relates to vibration sensor comprising a pressure detecting arrangement for detecting generated pressure variations, wherein the pressure detecting arrangement comprises a MEMS die and a signal processor, wherein the MEMS die comprises a front volume and a MEMS cartridge, and wherein the MEMS die comprises oppositely arranged first and second surfaces; a pressure generating arrangement for generating pressure variations in a coupling volume in response to vibrations of the vibration sensor, wherein the pressure generating arrangement comprises a frame structure comprising an indentation, a suspension member comprising first and second surfaces and a moveable mass secured to at least part of the first or second surfaces of the suspension member; and a PCB comprising a first surface, and a housing secured to the first surface of the PCB using an adhesive, wherein the housing and the first surface of the PCB define, in combination, a volume within which volume the pressure detecting arrangement and the pressure generating arrangement are arranged, wherein the coupling volume is defined by the indentation of the frame structure and at least part of the second surface of the suspension member, and wherein said coupling volume is acoustically connected to the MEMS cartridge of the MEMS die via an acoustical opening in the frame structure, and wherein the first surface of the MEMS die is secured to at least part of the frame structure, and wherein at least part of the second surface of the MEMS die is secured to the first surface of the PCB. The present invention further relates to a hearing device comprising such a vibration sensor, and to use of such a vibration sensor for detecting voice induced vibrations in the skull of a user of a hearing device.

The invention relates to a MEMS sound transducer (1), in particular for generating and / or detecting sound waves in the audible wavelength spectrum and / or in the ultrasound range, comprising a carrier (2) and at least one piezoelectric element (4, 17) arranged on the carrier (2) and deflectable in the direction of a stroke axis (3), the piezoelectric element having at least one piezoelectric layer (5, 25) and at least one structural layer (6, 31), wherein electrical signals and deflections of the piezoelectric element (4) can be converted into one another by means of the at least one piezoelectric layer (5, 25). According to the invention, the at least one piezoelectric layer (5, 25) is made of scandium aluminum nitride. The invention further relates to a method for manufacturing a MEMS sound transducer (1).

A MEMS transducer for interacting with a volumetric flow of fluid comprises a substrate having a cavity; and an electromechanical transducer connected to the substrate within the cavity, which has an element deformable along a lateral direction of motion, wherein deformation of the deformable element in-plane along the lateral direction of motion and the volumetric flow of the fluid are causally related. The cavity has an opening in the substrate, wherein a valve structure is arranged in a region of the opening, configured to reduce the flow of the volumetric flow through the opening in at least one direction out of and / or into the cavity.

A cantilever structure includes an anchor portion and a film structure. The film structure covers over a cavity and vibrates within the cavity. A length of the film structure is less than a width of the film structure. The anchor portion includes at least one protrusion protruding toward the cavity, and the film structure is anchored on the anchor portion with the at least one protrusion.

A method for manufacturing a microelectromechanical systems (MEMS) microphone comprises depositing a membrane on a first sacrificial layer, wherein the first sacrificial layer is deposited on a substrate, etching the substrate to define a cavity, releasing the membrane by removing at least the first sacrificial layer, and forming at least one anchor at the edge of the membrane.

A MEMS-transducer comprises a membrane structure having a first main surface and a second main surface opposing the first main surface. A substrate structure is configured to hold the membrane structure, wherein the substrate structure overlaps with the first main surface of the membrane structure in a first edge region being adjacent to a first inner region of the first main surface. A gap is formed between the membrane structure and the substrate structure in the first edge region and extends from the first inner region into the first edge region.