1082results about "Semiconductor electrostatic transducers" patented technology

A demodulation signal generator, coupled to an air-pulse generator comprising a flap pair, includes a resonance circuit. The resonance circuit produces a first demodulation signal and a second demodulation signal. The resonance circuit and the flap pair co-perform a resonance operation, such that the first demodulation signal and the second demodulation signal are generated via the co-performed resonance operation and have opposite polarity. The flap pair performs a differential movement to form an opening to perform a demodulation operation on a modulated air pressure variation.

An air-pulse generating device includes a film structure including a first flap and a second flap opposite to each other. The film structure is actuated to operate at an ultrasonic frequency, and the air-pulse generating device produces a plurality of air pulses at an ultrasonic pulse rate. The first flap and the second flap are actuated to perform a differential movement to form an opening or a virtual valve. A slit is formed between the first flap and the second flap, and the opening or the virtual valve is formed because of the slit. The slit is formed as a zigzagging pattern on the film structure.

A method of making an acoustic sensor includes forming or providing a mold having one or more grooves extending in a direction of the length of the mold to a distal end of the mold. The method also includes forming or depositing a structure having one or more piezoelectric layers over the top surface of the mold to define a beam with a proximal portion and a distal portion, the distal portion having a corrugated section including one or more grooves that correspond to the one or more grooves of the mold. The method also includes forming or applying an electrode to the proximal portion of the structure and releasing the structure from the mold to form one or more cantilever beams. The corrugated section inhibits bending of the corrugated section along the length of the distal portion of the structure when the acoustic sensor is subjected to sound pressure.

An air-pulse generating device includes a film structure including a first flap and a second flap opposite to each other. The film structure is actuated to operate at an ultrasonic frequency, and the air-pulse generating device produces a plurality of air pulses at an ultrasonic pulse rate. The first flap and the second flap are actuated to perform a differential movement to form an opening or a virtual valve. A slit is formed between the first flap and the second flap, and the opening or the virtual valve is formed because of the slit. The slit is formed as a zigzagging pattern on the film structure.

A logarithmic amplifier includes programmable gain amplifiers each having a different gain, wherein an input of each of the programmable gain amplifiers is coupled to an input of the logarithmic amplifier; and a summing circuit having inputs coupled to a corresponding output of each of the programmable gain amplifiers and an output coupled to an output of the logarithmic amplifier, wherein the summing circuit generates a logarithmic transfer function having piecewise linear segments.

A method of operating a microelectromechanical system (MEMS) includes, in a first operational mode, converting an analog output of the MEMS into a first internal data stream and a first external data stream having a first sampling rate; transitioning from the first operational mode to a second operation mode without restarting the MEMS; and in the second operational mode, converting the analog output of the MEMS into a second internal data stream having a second sampling rate different from the first sampling rate, and performing a sampling rate conversion of the second internal data stream to generate a second external data stream.

A drying implement may include a first portion having a diatomaceous earth slab and a resilient slab covering, and a second portion that is coupled to the first panel. The resilient slab covering may include a mesh of openings that allow water from an article placed on the resilient slab covering to drip through the mesh of openings, onto the diatomaceous earth slab. The second panel may include a plurality of cross pieces that are overmolded with a resilient second covering.

An acoustic sensor device includes a substrate, a cavity formed in the substrate, and a microelectromechanical system (MEMS) transducer having a diaphragm supported by the substrate. The diaphragm includes a first portion configured to be fixed to the substrate and a second portion extending from the first portion and suspended over the cavity. The second portion is configured to vibrate when the MEMS transducer is subject to an external stimulus. The diaphragm also includes an anchor portion that attaches the first portion of the diaphragm to the substrate on at least two sides of the substrate such that an interface between the first portion of the diaphragm and the second portion of the diaphragm is moved away from an edge of the substrate along the cavity.

An acoustic sensor device comprises a package, a substrate disposed in the package or forming a part of the package, and a plurality of microelectromechanical system (MEMS) transducers supported by the substrate and packaged in the package. The plurality of sound ports configured to couple the plurality of MEMS transducers to an ambient environment of the acoustic sensor device. The plurality of sound ports are arranged in the package such that respective MEMS transducers, among the plurality of MEMS transducers, exhibit different directional pick-up patterns with respect to sound waves traveling in the ambient environment of the acoustic sensor device.

The invention discloses an MEMS microphone and a manufacturing method thereof. The MEMS microphone comprises a first microphone structure and a second microphone structure. The first microphone structure comprises a first vibrating diaphragm, a first back plate and a second vibrating diaphragm which are arranged at intervals from bottom to top, a first cavity is formed between the first vibrating diaphragm and the second vibrating diaphragm, and the first back plate is parallel to the first vibrating diaphragm and the second vibrating diaphragm and penetrates through the first cavity; the second microphone structure comprises a third vibrating diaphragm, a second backboard and a fourth vibrating diaphragm which are arranged at intervals from top to bottom, a second cavity is formed between the third vibrating diaphragm and the fourth vibrating diaphragm, and the second backboard is parallel to the third vibrating diaphragm and the fourth vibrating diaphragm and penetrates through the second cavity; and the common vibrating diaphragm is formed by directly bonding a second vibrating diaphragm and a fourth vibrating diaphragm. According to the MEMS microphone and the manufacturing method thereof provided by the invention, a microphone structure with three vibrating diaphragms and double backboards is formed by forming the common vibrating diaphragm, so that the performance of the MEMS microphone is improved, and the process difficulty of manufacturing the MEMS microphone is reduced.

Disclosed are a micro-electromechanical system (MEMS) structure and an MEMS microphone comprising same. The MEMS structure comprises a back plate; and a diaphragm located on one side of the back plate, wherein the diaphragm and the back plate forms a variable capacitor, the diaphragm comprises multiple first through holes and air release structures respectively corresponding to the first through holes, and the diaphragm further comprises one or more second through holes penetrating through the diaphragm.

A calibration method comprises adjusting an operating frequency of an air-pulse generating device, such that a sound pressure level (SPL) of the air-pulse generating device is within a specific range. The sound producing module comprises the air-pulse generating device configured to produce sound via generating a plurality of air pulses at a pulse rate corresponding to the operating frequency.

According to an embodiment, a digital microphone includes an analog-to-digital converter (ADC) for receiving an analog input signal; a DC blocker component coupled to the ADC; a digital low pass filter coupled to the DC block component; and a nonlinear compensation component coupled to the digital low pass filter for providing a digital output signal.

In an example, the present invention provides a micro-speaker device. The device has a movable diaphragm device comprising a thickness of silicon or graphene material which has a first surface and a second surface opposite of the first surface and sensor to track position of the diaphragm. The device has a housing enclosing the movable diaphragm device, the electrode device and an encapsulation device. The electrode device can be part of a CMOS device with electronics integrated on to the device that converts input audio signal in to signal that electrostatically actuates the micro-speaker from one or more surfaces.

A MEMS microphone includes a substrate, a base, a capacitance system, and at least one cantilever structure. The substrate includes a back cavity, the base is disposed on one side of the substrate, and the capacitance system is disposed on the base. The capacitance system includes at least one back plate assembly, at least one first vibration diaphragm, and at least one second vibration diaphragm. The at least one first vibration diaphragm includes a first sub-vibration diaphragm, and the at least one second vibration diaphragm includes a second sub-vibration diaphragm. The sub-vibration diaphragm and the second sub-vibration diaphragm form a cantilever beam structure on the base, which increase compliance of the at least one first vibration diaphragm and the at least one second vibration diaphragm and reduce tension of the at least one first vibration diaphragm and the at least one second vibration diaphragm, thereby improving sensitivity of the microphones.

A diaphragm and a MEMS microphone. The diaphragm comprises a vibrating portion (1) and supporting structures (2) connected to the vibrating portion (1). Each supporting structure (2) comprises a cantilever portion (21) extending outwards from the periphery of the vibrating portion (1), and a first anchoring portion (22) and a second anchoring portion (23), both of which are connected to the end of the cantilever portion (21) away from the vibrating portion (1). The lengths of both the first anchoring portion (22) and the second anchoring portion (23) extend along the circumference of the vibrating portion (1), and the length of the first anchoring portion (22) and the length of the second anchoring portion (23) extend in opposite directions. As the lengths of both the first anchoring portion (22) and the cantilever portion (21) extend along the circumference of the vibrating portion (1), and the length of the first anchoring portions (22) and the length of the second anchoring portion (23) extend in opposite directions, the first anchoring portion (22), the cantilever portion (21), and the second anchoring portion (23) are connected to form a T shape, that is, each supporting structure is a T-shaped beam, enabling the diaphragm to have a wider range of vibration displacement, and thereby improving the sensitivity and adaptability of the MEMS microphone.

A digital microphone includes at least one integrator; a state detection and parameter control component directly coupled to an output of the integrator; and a signal processing component coupled to an output of the state detection and parameter control component, wherein a parameter of the signal processing component includes a first value in a first operational mode and a second value in a second operational mode different from the first operational mode.

A MEMS microphone includes substrate, housing, MEMS chip and ASIC chip. The substrate is provided with sound inlet channel communicating the receiving space with the outside. The MEMS chip includes diaphragm located on sound inlet path of sound inlet channel. The sound inlet channel includes buffering cavity, first sound inlet hole, and second sound inlet hole provided in the substrate and communicating the buffering cavity with the back cavity. The second sound inlet hole includes at least two sub-holes spaced apart from each other. When external air pressure enters the sound inlet channel, the air pressure entering from the first sound inlet hole may not directly act on the diaphragm through the second sound inlet hole, and the sub-holes can further block the airflow, which can effectively buffer the impact of the air pressure on the diaphragm, reduce diaphragm rupture, and improve reliability and performance of the MEMS microphone.

A MEMS element in which a backplate including a fixed electrode and a vibrating membrane including a movable electrode are disposed on a substrate including a back chamber, so as to face each other via a spacer, the vibrating membrane includes a pillar connected to the backplate, pillar side slits, and peripheral portion side slits, and a plurality of vibrating portion is formed in the vibrating membrane. The central portion of the vibrating membrane is connected to the backplate by the pillar, so that the amplitude of the central portion can be suppressed. In each of a plurality of vibrating portions, the pillar side slits are disposed on a portion side in which the pillar and the vibrating membrane are joined and the peripheral portion side slits are disposed at the peripheral portion, thereby decreasing the difference in the amplitude amount between the central portion and the peripheral portion.A MEMS element in which a backplate including a fixed electrode and a vibrating membrane including a movable electrode are disposed on a substrate including a back chamber, so as to face each other via a spacer, the vibrating membrane includes a pillar connected to the backplate, pillar side slits, and peripheral portion side slits, and a plurality of vibrating portion is formed in the vibrating membrane. The central portion of the vibrating membrane is connected to the backplate by the pillar, so that the amplitude of the central portion can be suppressed. In each of a plurality of vibrating portions, the pillar side slits are disposed on a portion side in which the pillar and the vibrating membrane are joined and the peripheral portion side slits are disposed at the peripheral portion, thereby decreasing the difference in the amplitude amount between the central portion and the peripheral portion.

The invention provides electronic equipment and a pickup device, the electronic equipment is provided with an appearance surface, the appearance surface is provided with a first pickup port and a plurality of second pickup ports distributed at intervals, and each second pickup port and the first pickup port are arranged at intervals; a microphone, a first sound channel and a plurality of second sound channels are arranged in the electronic equipment, the first sound channel is communicated with the first pickup port and a first cavity of the microphone, the second sound channels are communicated with the second pickup ports in a one-to-one correspondence mode, and the second sound channels are communicated with a second cavity of the microphone. And the first cavity of the microphone and the second cavity of the microphone are respectively positioned on two sides of a vibrating diaphragm of the microphone. A plurality of pickup vectors can be formed between the plurality of second pickup ports and the first pickup port. A vector obtained by adding the plurality of pickup vectors is consistent with the sensitivity direction of the microphone. The microphone of the electronic equipment can better receive sound from the sensitivity direction of the microphone, and the microphone can realize directional pickup.

A piezoelectric microelectromechanical system microphone comprises a support substrate, a diaphragm including a piezoelectric material attached to the support substrate and configured to deform and generate an electrical potential responsive to impingement of sound waves on the diaphragm, and a compliant anchor formed of a material with a greater compliance than a compliance of the piezoelectric material, the compliant anchor defined in the diaphragm in an anchor region between the piezoelectric material of the diaphragm and the support substrate to improve sensitivity and reduce residual stress impact of the piezoelectric microelectromechanical system microphone.

Disclosed are a vibration sensor, an electronic device and a vibration detection method. The vibration sensor comprises a circuit board assembly, a housing, a chip assembly, a vibration-pickup assembly and a through-hole. A back cavity is formed inside the circuit board assembly, the housing is mounted over the circuit board assembly, and the chip assembly is provided on a side of the circuit board assembly proximate to the housing and is electrically connected to the circuit board assembly. The vibration-pickup assembly is provided inside the cavity and dividing the cavity into a first cavity and a second cavity. The through-hole of the vibration sensor may be in communication with the back cavity and the second cavity.

The invention belongs to the field of acoustic transducers, and particularly relates to a piezoelectric MEMS acoustic device. The device comprises a slotted substrate, a bonding pad and a protective layer, the bonding pad is arranged on the slotted substrate, and the protective layer is deposited on the slotted substrate; the slotted base body is of a single-layer slotted structure or a double-layer slotted structure; each of the single-layer slotted structure and the double-layer slotted structure comprises a substrate, an insulating layer, a silicon substrate, an electrode layer and a piezoelectric layer; the insulating layer is arranged above the substrate, the silicon substrate is deposited on the insulating layer, the electrode layers and the piezoelectric layers are alternately stacked to form a stacked body and are stacked on the silicon substrate, and the uppermost layer and the lowermost layer of the stacked body are the electrode layers; the piezoelectric MEMS acoustic sensor solves the problem that an existing piezoelectric MEMS acoustic sensor is high in resonant frequency and difficult to meet the low-frequency working requirement, and popularization and application of the piezoelectric MEMS acoustic sensor in a low-frequency band are facilitated.

A package includes a substrate having a first surface and an opposing second surface, a first cavity adjacent to the first surface of the substrate within the package, and a second cavity adjacent to the second surface of the substrate within the package, wherein the second cavity includes a fluid opening for allowing a fluid to enter the second cavity; a through hole in the substrate providing fluid communication between the first and second cavities; a MEMS sound transducer disposed in one of the first cavity or the second cavity; a MEMS pressure sensor disposed in the other one of the first cavity or the second cavity; and a discrete transfer block arranged on the substrate and configured to provide an electric path between the package pad and the MEMS sound transducer and the MEMS pressure sensor, wherein the transfer block is a discrete component separate from the substrate.

The invention relates to a MEMS component, in particular an acoustic transducer or pressure sensor, comprising: a substrate with a cavern and a mainland, an interaction element arranged above the cavern and connected to the mainland, where the interaction element is a bending beam, a boundary layer arranged at a distance from the bending beam via connecting elements, which defines a cavity with the bending beam, and a back plate located within the cavity, which is designed as a back electrode, wherein the back plate is designed to be stiffer with respect to the boundary layer and the bending beam, at least one electrode which forms a readable capacitance with a back electrode of the back plate in order to capacitively detect a deflection of at least one of the bending beam, the connecting elements and the boundary layer, at least one stop element which is designed to be displaced into a mechanical stop, wherein the stop element in the stop has at least one fluid flow resistance, in particular a fluid seal, between the cavity on a substrate-facing side and a volume on a substrate-facing side of the cavity.

Embodiments relate to systems and methods for compensating nonlinear distortions. The system receives a signal corresponding to an input sound pressure which is detected by a capacitive MEMS microphone. The capacitive MEMS microphone includes an active capacitance and a parasitic capacitance. The system determines a nonlinear relationship between the signal and the input sound pressure; and determines, based on the signal, an input parameter associated with the active capacitance and the parasitic capacitance. The system further determines an output signal based on the input parameter and the output signal and the input sound pressure have a linear relationship. The system compensates the signal based on the determined output signal and outputs the compensated signal as an output so that the output has the linear relationship with the input sound pressure.

An airflow generating device includes a first cell and a second cell. The first cell is disposed within a first region and generates a first air pressure with a first polarity. The second cell is disposed within a second region and generates a second air pressure with a second polarity. The second polarity is opposite to the first polarity.

The invention relates to a microelectromechanical sensor (10) for measuring an environmental variable (12) of a sensor environment (16), comprising at least one deflection element (20) which can be deflected in a vertical direction (18) depending on the environmental variable (12), at least one counter electrode (32), at least one electrode surface (34) which is coupled to the deflection element (20) and which can be moved relative to the counter electrode (32) depending on the deflection of the deflection element (20) by changing an electrode spacing (38) and which faces the counter electrode (32), wherein stiffening means (44) are arranged between the electrode surface (34) and the deflection element (20),which extend in a first direction (48) perpendicular to the vertical direction (18) alternating with at least one free first gap (50) between the deflection element (20) and the electrode surface (34) and in a second direction (52) perpendicular to the vertical direction (18) and the first direction (48) alternating with at least one free second gap (54) between the deflection element (20) and the electrode surface (34) and which connect the electrode surface (34) and the deflection element (20) to one another at a distance in the vertical direction (18).