380results about "Semiconductor electrostatic transducers" patented technology

A calibration method comprises adjusting an operating frequency of an air-pulse generating device, such that a sound pressure level (SPL) of the air-pulse generating device is within a specific range. The sound producing module comprises the air-pulse generating device configured to produce sound via generating a plurality of air pulses at a pulse rate corresponding to the operating frequency.

A digital microphone includes at least one integrator; a state detection and parameter control component directly coupled to an output of the integrator; and a signal processing component coupled to an output of the state detection and parameter control component, wherein a parameter of the signal processing component includes a first value in a first operational mode and a second value in a second operational mode different from the first operational mode.

An airflow generating device includes a first cell and a second cell. The first cell is disposed within a first region and generates a first air pressure with a first polarity. The second cell is disposed within a second region and generates a second air pressure with a second polarity. The second polarity is opposite to the first polarity.

MEMS device (10) with a movable displacement element (12) and a drive device (14) for driving the movable displacement element (12), wherein the drive device (14) has at least one drive electrode (16), characterized in that the drive electrode (16) is segmented and at least one functional electrode (18) is provided for measuring the deflection of the displacement element (12).

The present application relates to an abnormal signal detection device using a dual acoustic wave sensor. The abnormal signal detection device using a dual acoustic wave sensor comprises: a housing including a first acoustic wave transmission portion and a second acoustic wave transmission portion; a base substrate located inside the housing and including a first surface and a second surface; a first acoustic wave sensor mounted on the first surface and converting an acoustic wave in a first band into a first electrical signal; a second acoustic wave sensor mounted on the second surface and converting an acoustic wave in a second band into a second electrical signal.

The invention provides an MEMS device, which increases the displacement of a movable part, reduces the stress of the MEMS device, enables the MEMS device to be miniaturized, and improves the resonance frequency. The MEMS device is provided with a frame-shaped fixed part, a movable part arranged on the inner side of the fixed part in plan view, four torsion beams for supporting the movable part, driving beams which are respectively arranged relative to the torsion beams, one ends of the driving beams are connected with the torsion beams, and the other ends of the driving beams are connected with the inner edge of the fixed part, and driving sources arranged on the driving beams. Each of the drive beams is arranged to be point-symmetric with respect to the center of the movable part in plan view, and each of the drive beams has a region in which the width in a direction parallel to a first side connected to the inner edge gradually increases toward the first side in plan view. The movable part is provided with extension parts extending radially from the center in plan view, the number of the extension parts is the same as the number of the torsion beams, each extension part comprises an upper surface, a lower surface, one end surface and two side surfaces connected with the end surface, and each torsion beam is connected with two adjacent side surfaces included in different extension parts.

A MEMS audio device includes a first wafer having a top with a first cavity and a bottom with a vent hole coupled to the first cavity, wherein the bottom having first contacts, a second wafer disposed upon the first wafer having a flexible material layer disposed above the first cavity, a third wafer disposed upon the second wafer having physical contacts coupled to the second wafer, wherein the third wafer includes a second cavity disposed above the flexible material layer, a wiring wafer disposed below the first wafer having a second vent hole coupled to the first cavity, wherein the wiring wafer having second contacts coupled to the first contacts, and wherein the flexible material layer forms a diaphragm for the MEMS audio device.

A method for manufacturing a microelectromechanical systems (MEMS) microphone comprises depositing a membrane on a first sacrificial layer, wherein the first sacrificial layer is deposited on a substrate, etching the substrate to define a cavity, releasing the membrane by removing at least the first sacrificial layer, and forming at least one anchor at the edge of the membrane.

A microelectromechanical sensor component. The component includes: a substrate; a movable sensor structure connected to the substrate and having a seismic mass portion and a deflection electrode arranged thereon; and at least one evaluation electrode arranged on the substrate. The deflection electrode is arranged so as to be movable relative to the evaluation electrode. The evaluation electrode is configured for capacitive detection of a deflection of the deflection electrode. The deflection electrode and the evaluation electrode form a comb structure. The deflection electrode has a plurality of deflection electrode fingers extending from a deflection electrode bar in the direction of the evaluation electrode. The evaluation electrode has a plurality of evaluation electrode fingers extending, parallel at least in portions to the deflection electrode fingers, from an evaluation electrode bar in the direction of the deflection electrode.

A semiconductor integrated circuit device capable of inputting a signal of a MEMS transducer 2 includes: a power supply circuit 11 for the MEMS transducer 2; an input amplifier 12 for inputting and amplifying a signal of the MEMS transducer 2; a line driver 13 for amplifying an output from the input amplifier 12 and allowing for driving of a load connected to an output terminal T3, the line driver 13 having an input terminal; and the output terminal T3 for outputting an output of the line driver 13, wherein the power supply circuit 11, the input amplifier 12, and the line driver 13 are integrally formed on a semiconductor substrate, and wherein a gain setting circuit 14 for determining gain of the line driver 13 and a DC potential of the output terminal T3 is connected to the input terminal of the line driver 13.

The invention discloses an MEMS device and a manufacturing method thereof, and the method comprises the steps: forming a first MEMS structure: providing a first substrate, forming a first sensing layer on the first substrate, and sequentially forming a first cavity and a second sensing layer on the first sensing layer; forming a second MEMS structure: providing a second substrate, forming a third sensing layer on the second substrate, and sequentially forming a second cavity and a fourth sensing layer on the third sensing layer; bonding the second sensing layer and the fourth sensing layer to form a common sensing layer; the part, corresponding to the first cavity, of the first substrate is removed, and the first sensing layer forms a movable sensing layer. According to the MEMS device and the manufacturing method thereof provided by the invention, the stacked double-layer capacitor structure is prepared by adopting a heterogeneous bonding mode, the process is simple, the implementation is high, the prepared device structure does not need to be plugged, the problem that the sensing layer is uneven due to hole plugging is avoided, and the reliability of the device is improved. The reliability problems of air leakage and the like of the hole blocking structure caused by repeated pressure measurement motion of the upper-layer pressure sensing film of the sealing cavity are also avoided, and the service life and the yield of the device are improved.

Provided is a speaker, including: a diaphragm structure including first and second diaphragms, the first diaphragm is configured to push air to vibrate to generate initial sound wave, and a signal of which is modulated based on a signal within an audible sound frequency band; and a cover plate structure enclosing with the diaphragm structure to form sound-generating cavity, the cover plate structure has a sound outlet hole connecting the sound-generating cavity with outside, the initial sound wave in the sound-generating cavity is transmitted to the outside through the at least one sound outlet hole to form a sound signal, the second diaphragm and the cover plate structure generate an acoustic environmental impedance used to modulate the initial sound wave to change sound pressure of the sound signal. The speaker can modulate and output a sound signal covering the audible sound frequency band based on the acoustic environmental impedance.

In an embodiment a MEMS structure includes a back-plate structure, a support structure having a cavity, a membrane structure between the back-plate structure and the support structure, a first clamping structure having a first structured oxide layer between the support structure and the membrane structure, wherein an inner edge of the first clamping structure is laterally offset from an edge of the cavity, and wherein an offset of the first clamping structure forms a gap between the support structure and the membrane structure, and a second clamping structure having a second structured oxide layer and a first structured taper layer between the back-plate structure and the membrane structure, wherein the second structured oxide layer is arranged between the back-plate structure and the first structured taper layer, wherein an inner edge of the second structured oxide layer laterally extends over the cavity, and wherein the first structured taper layer is arranged between the second structured oxide layer.

An electromechanical system includes a frame; an element movable relative to the frame, the movable element comprising a membrane and a rigidifying structure for the membrane; a capacitive measurement or actuation device; a first transmission device for a movement between the movable element and the capacitive measurement or actuation device, the first transmission device being rotatably movable relative to the frame by a plurality of first pivot hinges; in which system: a first opening is arranged in the movable element; the frame includes a first island extending into the first opening; and the first transmission device is connected to the first island via one of the first pivot hinges.

A MEMS device comprises a housing with an interior volume, wherein the housing comprises an access port to the interior volume; a MEMS sound transducer in the housing, and a mechanical barrier structure having a plate element which is fixed by means of elastic spacers to a carrier and overlaps the access port, and providing a ventilation path passing a boundary region of the plate element, wherein a clearance of the ventilation path is set by the distance of the boundary region of the plate element to the housing or by the distance of the boundary region of the plate element to a blocking structure which opposes the boundary region of the plate element.

An MEMS microphone includes a substrate with a back cavity and a capacitor system arranged on the substrate. The capacitor system includes a back plate and a diaphragm opposite to and spaced apart from the back plate. Surface of the back plate facing diaphragm or surface of diaphragm facing the back plate being provided with an anti-adhesion member. When the diaphragm moves until the anti-adhesion member is in contact with the diaphragm and the back plate at the same time, the anti-adhesion member is elastically deformable along a vibrating direction of the diaphragm. The anti-adhesion member of the present disclosure is elastic and may provide cushioning for movement of the diaphragm, which prevents rapid concentration of stress at a position of the diaphragm in contact with the anti-adhesion member, thereby preventing formation of pits in the diaphragm and preventing breakage of the diaphragm under repeated impact of the anti-adhesion member.

A microphone, comprising a housing (1), a circuit board (2) covering and fixed to the housing (1) and defining a first cavity (104) and a second cavity (105) together with the housing (1), a first chip assembly (3) fixed on the side of the circuit board (2) close to the housing (1) and located in the first cavity (104), and a second chip assembly (4) fixed on the side of the circuit board (2) close to the housing (1) and located in the second cavity (105), wherein the first chip assembly (3) comprises a first ASIC chip (301) and a first MEMS chip (302), and the second chip assembly (4) comprises a second ASIC chip (401) and a second MEMS chip (402). The microphone further comprises a first metal layer (5) fixed on the side of the circuit board (2) close to the housing (1) and surrounding both the first chip assembly (3) and the second chip assembly (4). The microphone can prevent the problem that heat generated by operation of the ASIC chips affects performance of other components by means of heat conduction via a substrate of the circuit board (2) or heat dissipation via thermal motion of air.

The present disclosure concerns a MEMS pressure transducer Wafer-Level Chip-Scale Package (100) and a method for manufacturing the same. The method comprises a step of providing a MEMS wafer (110) comprising a plurality of adjacently arranged MEMS membrane structures (120). The method comprises a further step of providing an ASIC wafer (210) comprising a plurality of adjacently arranged integrated electronic components (220), and bonding the MEMS wafer (110) with the ASIC wafer (210) with their respective front sides (111, 211) facing each other. The method comprises a further step of structuring at least one first cavity (150) into MEMS wafer (110) and structuring a smaller second cavity (160) into the first cavity (150).

The invention relates to a method for manufacturing a transducer unit (1), in particular a MEMS transducer unit, for converting electrical signals into displacements and / or displacements into electrical signals, in which at least one transducer element (3) is arranged on a carrier element (2), and the transducer element (3) is coupled to a membrane unit (5) that is deflectable along a stroke axis (H). According to the invention, to form at least one flexible membrane element (14), a flowable and curable membrane material is cast at least section by section onto a reinforcement element (4) of the membrane unit (5) that is coupled or can be coupled to the transducer element (3), so that the membrane element (14) together with the reinforcement element (4) at least partially forms the membrane unit (5). The invention further relates to the transducer unit (1).

The invention relates to a microelectromechanical component (1) with a housing (2) and a displacer structure (3) arranged in the housing (2), wherein the displacer structure (3) has a coupling element (4) movable within the housing (2) and a plurality of displacer walls (5) extending parallel to each other and perpendicular to the coupling element (4), wherein the displacer walls (5) define laterally adjacent volume chambers (6), wherein a fluid can be conveyed into and displaced from the volume chambers (6) by a relative movement between each pair of adjacent displacer walls (5), wherein at least one first displacer wall (5, 5') is mechanically connected to the movable coupling element (4) and is movable together with the coupling element (4), and wherein the at least one first displacer wall (5, 5') movable together with the coupling element (4) mechanically connected to the housing (2).The invention further relates to a microelectromechanical loudspeaker (12) with such a microelectromechanical component (1).

A microelectromechanical device for interaction with a fluid. A displacer structure, wherein the displacer structure is arranged in a cavity, wherein the displacer structure comprises a movable lamella that is deflectable for interaction with a fluid pressure in a pressure region of a cavity, wherein the lamella has at least one edge region, wherein the edge region of the lamella is movable along at least one boundary surface of the cavity when the lamella is deflected, wherein a flow channel is formed between the boundary surface and the edge region, wherein fluid can flow out of the pressure region via the flow channel, wherein the edge region and / or the boundary surface comprise means that make it more difficult for fluid to flow out of the pressure region via the flow channel.

The present invention relates to a microelectromechanical system (MEMS) (100) comprising a MEMS component (110) with a surface (120) and at least one contact column (1) having a top surface (2) on the surface (120), wherein the top surface (2) comprises a conductive material (4) and is designed and configured to supply the MEMS component (110) with a supply and / or signal voltage (130). The invention further relates to a method for manufacturing such a MEMS (100) with at least one contact column (1) and to the use of the MEMS (100) according to the invention in systems for interacting with fluids.

The present invention relates to split electrodes for microelectromechanical system (MEMS) microphones. In one embodiment, a MEMS sensor includes a membrane, a membrane electrode formed in a portion of the membrane, and a backplate situated parallel to the membrane and separated by a gap. The backplate includes a first region of the backplate, where the first region of the backplate has first perforations of a first density, a backplate electrode is formed in a portion of the first region of the backplate, and a portion of the membrane electrode overlaps a portion of the backplate electrode in a sensing region forming a sensing capacitor, the sensing capacitor being configured to sense motion of the membrane in response to acoustic pressure. The backplate also includes a second region of the backplate having second perforations of a second density, where the second density is greater than the first density.

The invention relates to operating point stabilization of VCO-ADC using switched capacitor frequency to current conversion. A circuit includes a micro-electro-mechanical system (MEMS) microphone configured to generate a voltage signal at an output terminal of the MEMS microphone in response to a sound signal; a voltage controlled oscillator (VCO) coupled to an output terminal of the MEMS microphone and configured to output a frequency modulated signal at an output terminal of the VCO, the frequency modulated signal having a frequency proportional to the voltage signal; a frequency-to-digital (FTD) converter coupled to an output terminal of the VCO and configured to convert the frequency modulated signal to a frequency proportional digital output signal; a frequency voltage (FTV) conversion circuit coupled to an output terminal of the VCO and configured to generate a bias voltage at the output terminal of the FTV conversion circuit according to a frequency modulation signal; and a resistor coupled between the output terminal of the MEMS microphone and the output terminal of the FTV conversion circuit.

Systems and methods for a MEMS microphone package are disclosed. The MEMS microphone package may include a first port to direct sound to a MEMS system, including a die substrate, an acoustic membrane, and one or more plates. The MEMS microphone package may include an ASIC to produce microphone output based on an electrical signal, a PCB, a lid, and a second port. The first port and the second port may define a front volume and a back volume respectively. The second port may increase the back volume to improve sensitivity and reduce the acoustic sensor's noise floor to improve signal-to-noise ratio.

An attenuator circuit includes a microelectromechanical system (MEMS) device having an output for providing an analog output voltage; a switch having a first controlled node coupled to an output of the MEMS device, a second controlled node for receiving a replica analog output voltage, and a control node for receiving a control signal; and a capacitor coupled to the switch.

Provided is an MEMS sensor module, comprising a side wall (1) enclosing a cavity, a first circuit board (2), a second circuit board (3), a partition wall (4) dividing the cavity into a first cavity (11) and a second cavity (12), a first MEMS sensor assembly (5) arranged in the first cavity (11) and encapsulated by glue (6), a second MEMS sensor assembly (7) arranged in the second cavity, a first gold finger layer (8) arranged between the side wall (1) and the partition wall (4) and the first circuit board (2), and a second gold finger layer (9) arranged between the side wall (1) and the partition wall (4) and the second circuit board (3), wherein the first gold finger layer (8) surrounds both the first cavity (11) and the second cavity (12), the second gold finger layer (9) surrounds both the first cavity (11) and the second cavity (12), and the first gold finger layer (8) at the partition wall (4) is provided with a slot (80) communicating the first cavity (11) with the second cavity (12). The MEMS sensor module can prevent a large amount of heat generated by an ASIC chip of one MEMS sensor assembly during operation from affecting the other MEMS sensor assembly.

A microphone includes a microelectromechanical system (MEMS) device responsive to sound waves or vibrations having an output coupled to a first node; a programmable gain amplifier or source follower having an input coupled to a second node, and an output for generating an analog signal, wherein the MEMS device output and the programmable gain amplifier or source follower input comprise a first nonlinear equivalent capacitance having a first capacitance-to-voltage (CV) profile; and a nonlinear capacitance component coupled to the first node, the second node, and at least one reference voltage node, wherein the nonlinear capacitance component comprises a second nonlinear equivalent capacitance having a second CV profile.