222results about "Semiconductor electrostatic transducers" patented technology

A calibration method comprises adjusting an operating frequency of an air-pulse generating device, such that a sound pressure level (SPL) of the air-pulse generating device is within a specific range. The sound producing module comprises the air-pulse generating device configured to produce sound via generating a plurality of air pulses at a pulse rate corresponding to the operating frequency.

An airflow generating device includes a first cell and a second cell. The first cell is disposed within a first region and generates a first air pressure with a first polarity. The second cell is disposed within a second region and generates a second air pressure with a second polarity. The second polarity is opposite to the first polarity.

The present application relates to an abnormal signal detection device using a dual acoustic wave sensor. The abnormal signal detection device using a dual acoustic wave sensor comprises: a housing including a first acoustic wave transmission portion and a second acoustic wave transmission portion; a base substrate located inside the housing and including a first surface and a second surface; a first acoustic wave sensor mounted on the first surface and converting an acoustic wave in a first band into a first electrical signal; a second acoustic wave sensor mounted on the second surface and converting an acoustic wave in a second band into a second electrical signal.

A MEMS audio device includes a first wafer having a top with a first cavity and a bottom with a vent hole coupled to the first cavity, wherein the bottom having first contacts, a second wafer disposed upon the first wafer having a flexible material layer disposed above the first cavity, a third wafer disposed upon the second wafer having physical contacts coupled to the second wafer, wherein the third wafer includes a second cavity disposed above the flexible material layer, a wiring wafer disposed below the first wafer having a second vent hole coupled to the first cavity, wherein the wiring wafer having second contacts coupled to the first contacts, and wherein the flexible material layer forms a diaphragm for the MEMS audio device.

A microelectromechanical sensor component. The component includes: a substrate; a movable sensor structure connected to the substrate and having a seismic mass portion and a deflection electrode arranged thereon; and at least one evaluation electrode arranged on the substrate. The deflection electrode is arranged so as to be movable relative to the evaluation electrode. The evaluation electrode is configured for capacitive detection of a deflection of the deflection electrode. The deflection electrode and the evaluation electrode form a comb structure. The deflection electrode has a plurality of deflection electrode fingers extending from a deflection electrode bar in the direction of the evaluation electrode. The evaluation electrode has a plurality of evaluation electrode fingers extending, parallel at least in portions to the deflection electrode fingers, from an evaluation electrode bar in the direction of the deflection electrode.

Provided is a speaker, including: a diaphragm structure including first and second diaphragms, the first diaphragm is configured to push air to vibrate to generate initial sound wave, and a signal of which is modulated based on a signal within an audible sound frequency band; and a cover plate structure enclosing with the diaphragm structure to form sound-generating cavity, the cover plate structure has a sound outlet hole connecting the sound-generating cavity with outside, the initial sound wave in the sound-generating cavity is transmitted to the outside through the at least one sound outlet hole to form a sound signal, the second diaphragm and the cover plate structure generate an acoustic environmental impedance used to modulate the initial sound wave to change sound pressure of the sound signal. The speaker can modulate and output a sound signal covering the audible sound frequency band based on the acoustic environmental impedance.

A MEMS device comprises a housing with an interior volume, wherein the housing comprises an access port to the interior volume; a MEMS sound transducer in the housing, and a mechanical barrier structure having a plate element which is fixed by means of elastic spacers to a carrier and overlaps the access port, and providing a ventilation path passing a boundary region of the plate element, wherein a clearance of the ventilation path is set by the distance of the boundary region of the plate element to the housing or by the distance of the boundary region of the plate element to a blocking structure which opposes the boundary region of the plate element.

The present disclosure concerns a MEMS pressure transducer Wafer-Level Chip-Scale Package (100) and a method for manufacturing the same. The method comprises a step of providing a MEMS wafer (110) comprising a plurality of adjacently arranged MEMS membrane structures (120). The method comprises a further step of providing an ASIC wafer (210) comprising a plurality of adjacently arranged integrated electronic components (220), and bonding the MEMS wafer (110) with the ASIC wafer (210) with their respective front sides (111, 211) facing each other. The method comprises a further step of structuring at least one first cavity (150) into MEMS wafer (110) and structuring a smaller second cavity (160) into the first cavity (150).

The present invention relates to a microelectromechanical system (MEMS) (100) comprising a MEMS component (110) with a surface (120) and at least one contact column (1) having a top surface (2) on the surface (120), wherein the top surface (2) comprises a conductive material (4) and is designed and configured to supply the MEMS component (110) with a supply and / or signal voltage (130). The invention further relates to a method for manufacturing such a MEMS (100) with at least one contact column (1) and to the use of the MEMS (100) according to the invention in systems for interacting with fluids.

An attenuator circuit includes a microelectromechanical system (MEMS) device having an output for providing an analog output voltage; a switch having a first controlled node coupled to an output of the MEMS device, a second controlled node for receiving a replica analog output voltage, and a control node for receiving a control signal; and a capacitor coupled to the switch.

Provided is an MEMS sensor module, comprising a side wall (1) enclosing a cavity, a first circuit board (2), a second circuit board (3), a partition wall (4) dividing the cavity into a first cavity (11) and a second cavity (12), a first MEMS sensor assembly (5) arranged in the first cavity (11) and encapsulated by glue (6), a second MEMS sensor assembly (7) arranged in the second cavity, a first gold finger layer (8) arranged between the side wall (1) and the partition wall (4) and the first circuit board (2), and a second gold finger layer (9) arranged between the side wall (1) and the partition wall (4) and the second circuit board (3), wherein the first gold finger layer (8) surrounds both the first cavity (11) and the second cavity (12), the second gold finger layer (9) surrounds both the first cavity (11) and the second cavity (12), and the first gold finger layer (8) at the partition wall (4) is provided with a slot (80) communicating the first cavity (11) with the second cavity (12). The MEMS sensor module can prevent a large amount of heat generated by an ASIC chip of one MEMS sensor assembly during operation from affecting the other MEMS sensor assembly.

A microphone includes a microelectromechanical system (MEMS) device responsive to sound waves or vibrations having an output coupled to a first node; a programmable gain amplifier or source follower having an input coupled to a second node, and an output for generating an analog signal, wherein the MEMS device output and the programmable gain amplifier or source follower input comprise a first nonlinear equivalent capacitance having a first capacitance-to-voltage (CV) profile; and a nonlinear capacitance component coupled to the first node, the second node, and at least one reference voltage node, wherein the nonlinear capacitance component comprises a second nonlinear equivalent capacitance having a second CV profile.

An assembly includes an acoustic device. The acoustic device can include a polyethylene membrane. The polyethylene membrane can have first direction and a second direction, the second direction being orthogonal to the first direction. The polyethylene membrane can have a surface area per volume of at least 39×106 / m. The polyethylene membrane can have a geometric mean tensile modulus of 250 to 750 MPa. The polyethylene membrane can have a maximum tensile modulus in the first direction of 440 to 915 MPa. The polyethylene membrane can have a maximum tensile modulus in the second direction of 275 to 515 MPa. The polyethylene membrane can be an expanded polyethylene membrane.

The invention preferably relates to a process for producing a MEMS transducer comprising a membrane and a carrier, wherein the membrane has a meandering structure comprising vertical and horizontal sections. This comprises initially providing a shaping component which is coated with a membrane layer system. The membrane layer system comprises at least one actuator ply comprising an actuator material. Structuring the membrane layer system provides membranes that may be attached to a carrier. The shaping component can be completely removed. The invention preferably further relates to a MEMS transducer producible by the process.

A digital filter includes a delay line; coefficients coupled to the delay line; and a summer coupled to at least one of the of coefficients, wherein the coefficients each include a first value during a normal mode of operation, and wherein at least one of the coefficients comprises a second value during a transient mode of operation.

MEMS apparatus (10) having a movable displacement element (12) and a drive device (14) for driving the movable displacement element (12), the drive device (14) having at least one drive electrode (16), characterized in that the drive electrode (16) is segmented and at least one functional electrode (18) is provided for measuring the deflection of the displacement element (12).

To provide a calibration method for a sound generation module that produces consistent acoustic performance, and the sound generation module.SOLUTION: In the calibration system, the calibration method comprises a step of adjusting the operating frequency fv of the air pulse generation device so that the sound pressure level (SPL) of the air pulse generation device falls within a certain range. The sound generation module includes an air pulse generation device that generates sound by generating a plurality of air pulses at a pulse rate corresponding to the operating frequency.SELECTED DRAWING: Figure 8

The invention relates to an electromechanical system (2) comprising: - a frame (10); - a first element (13a) movable relative to the frame (10); - capacitive measurement or actuation means (15') comprising: - a first electrode (151) movable relative to the frame (10); and - at least one electrode fixed relative to the frame (10) and separated from the first movable electrode (151) by a first dielectric medium; - a first movement transmission device (14a) connecting the first movable element (13a) to the first movable electrode (151), the first transmission device (14a) being rotatably movable relative to the frame (10) by means of a plurality of first pivot hinges (16a); - a second element (13b) movable relative to the frame (10), the second movable element (13b) being connected to the capacitive measurement or actuation means (15'), the first movable element (13a) being disposed between the capacitive measurement or actuation means (15') and the second movable element (13b).

A MEMS transducer includes a deflectable membrane where the deflectable membrane includes two first layers and a second layer arranged between the two first layers. The two first layers comprise low-stress silicon nitride, and the second layer comprises doped silicon.

Method in an electrical audio signaling circuit comprising a feedback loop (280) with a digital filter (285) coupled to a current-to-digital-to-analog converter (240, 320), the method comprising: providing (560, 625) an output signal from the current-to-digital-to-analog converter (240, 320) to analog elements of the electrical audio signaling circuit, wherein the output signal from the current-to-digital-to-analog converter (240, 320) is based on a reference signal input to the current-to-digital-to-analog converter (240, 320) while no output from the digital filter (285) is input to the current-to-digital-to-analog converter (240, 320); comparing (565, 630) an output signal of the electrical audio signaling circuit with a reference; and calibrating (570, 635) the electrical audio signal circuit, such that the output signal of the electrical audio signal circuit corresponds to the reference,wherein the calibration of the electrical audio signal circuit enables more precise control of a cutoff frequency of a microphone signal, while the output of the digital filter (285) is input into the current-to-digital-to-analog converter (240, 320).

A MEMS transducer has a deflectable diaphragm, the deflectable diaphragm comprising two first layers and a second layer positioned between the two first layers. The two first layers consist of low-stress silicon nitride, and the second layer consists of doped silicon.

The present disclosure relates to a MEMS pressure transducer Wafer-Level Chip-Scale Package and a method for manufacturing the same. The method comprises a step of providing a MEMS wafer comprising adjacently arranged MEMS membrane structures. The method comprises a further step of providing an ASIC wafer comprising adjacently arranged integrated electronic components, and bonding the MEMS wafer with the ASIC wafer with their respective front sides facing each other. The method comprises a further step of structuring at least one first cavity into MEMS wafer and structuring a smaller second cavity into the first cavity.

It is planned that, at least in certain areas, electrode structures will be inserted between deformable membrane regions of membrane structures and a central electrode structure or a counter electrode structure located between two membrane structures. These additional electrode structures, i.e., the first and second electrode structures, will be attached to the support structures that mechanically connect the membrane structures and freely penetrate the central electrode structure, specifically at a distance from the deformable membrane regions of the membrane structures (i.e., the first and second membranes) and at a distance from the central electrode structure.

Digital microphone arrangement (100) configured to be integrated into a host device, the assembly comprising: a housing (110) which has a host interface (113); a transducer (102) for microelectromechanical systems (MEMS) which is arranged in the housing; an integrated circuit (103, 200) arranged in the housing, the integrated circuit comprising: a signal processing circuit (201) coupled to an output of the converter; an interface protocol circuit (202) coupled to an output of the signal processing circuit; a first output driver circuit (203) coupled to the interface protocol circuit and comprising a corresponding plurality of parallel driver stages (230), wherein each driver stage has a driver (231) and a configurable resistor (232, 300) which couples an output (233) of the driver to a first contact (290) of the host interface, wherein the configurable resistors of the first output driver circuit form a first series termination resistor (Z O ) form; and a controller (204, 501) coupled to and configured with the first output driver circuit to set a resistance of at least one configurable resistance to compensate for process error deviations, such that the configurable resistance of at least one driver stage is different from the configurable resistance of at least one other driver stage of the first output driver circuit.

The invention discloses a micro-electro-mechanical microphone and a manufacturing method thereof. The MEMS microphone includes a substrate, a diaphragm, and a back plate. The substrate has a cavity. The diaphragm is disposed on the substrate and spans the cavity. The back plate is arranged above the vibrating diaphragm and is separated from the vibrating diaphragm through an air gap. The diaphragm has a corrugated structure. And the back plate is provided with a part which corresponds to the corrugated structure and is positioned right above the corrugated structure. The height difference of the part is smaller than or equal to 20% of the height difference of the corrugated structure.

To provide a microphone unit with a small size and a low cost, which corresponds to a maximum level IPX9K of an on-vehicle IP(K) test.SOLUTION: A microphone unit comprises: a cylindrical case in which an upper surface and a lower surface are opened; a metal waterproof film having a thickness of 0.01 mm or more and 0.05 mm or less, a hardness of 100HV or more, a bearing force of 70 N / mm2 or more, a tension strength of 350 N / mm2 or more, and fixed to a lower surface of the case so as to block an open part of the lower surface of the case; a substrate arranged within the case; a microphone mounted on the substrate; and a sealing member that seals the open part of the upper surface of the case.SELECTED DRAWING: Figure 2

An apparatus is described which comprises a substrate having a through opening and a membrane over the through opening. In at least one example, the apparatus comprises a first beam coupled between a first side of the membrane and the substrate, the first beam including a first stress sensor. In at least one example, the apparatus further comprises a second beam coupled between a second side of the membrane and the substrate, the second side opposing the first side, and the second beam including a second stress sensor.

A method of operating a microelectromechanical system (MEMS) includes, in a first operational mode, converting an analog output of the MEMS into a first internal data stream and a first external data stream having a first sampling rate; transitioning from the first operational mode to a second operation mode without restarting the MEMS; and in the second operational mode, converting the analog output of the MEMS into a second internal data stream having a second sampling rate different from the first sampling rate, and performing a sampling rate conversion of the second internal data stream to generate a second external data stream.

To remove a resonance frequency from an acoustic band of a microphone.SOLUTION: An electronic acoustic device 12 comprises: a primary MEMS microphone 14 having a frequency response including a resonance frequency; a reference MEMS microphone 18 having the frequency response containing the resonance frequency; and an equalization module 22. The primary MEMS microphone and the reference MEMS microphone substantially simultaneously receive a common acoustic signal, and produce a transduced signal of the microphone and a transduced signal of the reference microphone. The resonance frequency of the reference MEMS microphone is different from the resonance frequency of the primary MEMS microphone. The equalization module equalizes the frequency response of the microphone based on the transduced signal of the primary MEMS microphone and the transduced signal of the reference MEMS microphone.SELECTED DRAWING: Figure 2A