530results about "Semiconductor electrostatic transducers" patented technology

A method of making an acoustic sensor includes forming or providing a mold having one or more grooves extending in a direction of the length of the mold to a distal end of the mold. The method also includes forming or depositing a structure having one or more piezoelectric layers over the top surface of the mold to define a beam with a proximal portion and a distal portion, the distal portion having a corrugated section including one or more grooves that correspond to the one or more grooves of the mold. The method also includes forming or applying an electrode to the proximal portion of the structure and releasing the structure from the mold to form one or more cantilever beams. The corrugated section inhibits bending of the corrugated section along the length of the distal portion of the structure when the acoustic sensor is subjected to sound pressure.

A logarithmic amplifier includes programmable gain amplifiers each having a different gain, wherein an input of each of the programmable gain amplifiers is coupled to an input of the logarithmic amplifier; and a summing circuit having inputs coupled to a corresponding output of each of the programmable gain amplifiers and an output coupled to an output of the logarithmic amplifier, wherein the summing circuit generates a logarithmic transfer function having piecewise linear segments.

A calibration method comprises adjusting an operating frequency of an air-pulse generating device, such that a sound pressure level (SPL) of the air-pulse generating device is within a specific range. The sound producing module comprises the air-pulse generating device configured to produce sound via generating a plurality of air pulses at a pulse rate corresponding to the operating frequency.

In an example, the present invention provides a micro-speaker device. The device has a movable diaphragm device comprising a thickness of silicon or graphene material which has a first surface and a second surface opposite of the first surface and sensor to track position of the diaphragm. The device has a housing enclosing the movable diaphragm device, the electrode device and an encapsulation device. The electrode device can be part of a CMOS device with electronics integrated on to the device that converts input audio signal in to signal that electrostatically actuates the micro-speaker from one or more surfaces.

A digital microphone includes at least one integrator; a state detection and parameter control component directly coupled to an output of the integrator; and a signal processing component coupled to an output of the state detection and parameter control component, wherein a parameter of the signal processing component includes a first value in a first operational mode and a second value in a second operational mode different from the first operational mode.

The invention provides electronic equipment and a pickup device, the electronic equipment is provided with an appearance surface, the appearance surface is provided with a first pickup port and a plurality of second pickup ports distributed at intervals, and each second pickup port and the first pickup port are arranged at intervals; a microphone, a first sound channel and a plurality of second sound channels are arranged in the electronic equipment, the first sound channel is communicated with the first pickup port and a first cavity of the microphone, the second sound channels are communicated with the second pickup ports in a one-to-one correspondence mode, and the second sound channels are communicated with a second cavity of the microphone. And the first cavity of the microphone and the second cavity of the microphone are respectively positioned on two sides of a vibrating diaphragm of the microphone. A plurality of pickup vectors can be formed between the plurality of second pickup ports and the first pickup port. A vector obtained by adding the plurality of pickup vectors is consistent with the sensitivity direction of the microphone. The microphone of the electronic equipment can better receive sound from the sensitivity direction of the microphone, and the microphone can realize directional pickup.

A piezoelectric microelectromechanical system microphone comprises a support substrate, a diaphragm including a piezoelectric material attached to the support substrate and configured to deform and generate an electrical potential responsive to impingement of sound waves on the diaphragm, and a compliant anchor formed of a material with a greater compliance than a compliance of the piezoelectric material, the compliant anchor defined in the diaphragm in an anchor region between the piezoelectric material of the diaphragm and the support substrate to improve sensitivity and reduce residual stress impact of the piezoelectric microelectromechanical system microphone.

Disclosed are a vibration sensor, an electronic device and a vibration detection method. The vibration sensor comprises a circuit board assembly, a housing, a chip assembly, a vibration-pickup assembly and a through-hole. A back cavity is formed inside the circuit board assembly, the housing is mounted over the circuit board assembly, and the chip assembly is provided on a side of the circuit board assembly proximate to the housing and is electrically connected to the circuit board assembly. The vibration-pickup assembly is provided inside the cavity and dividing the cavity into a first cavity and a second cavity. The through-hole of the vibration sensor may be in communication with the back cavity and the second cavity.

An airflow generating device includes a first cell and a second cell. The first cell is disposed within a first region and generates a first air pressure with a first polarity. The second cell is disposed within a second region and generates a second air pressure with a second polarity. The second polarity is opposite to the first polarity.

The invention relates to a microelectromechanical sensor (10) for measuring an environmental variable (12) of a sensor environment (16), comprising at least one deflection element (20) which can be deflected in a vertical direction (18) depending on the environmental variable (12), at least one counter electrode (32), at least one electrode surface (34) which is coupled to the deflection element (20) and which can be moved relative to the counter electrode (32) depending on the deflection of the deflection element (20) by changing an electrode spacing (38) and which faces the counter electrode (32), wherein stiffening means (44) are arranged between the electrode surface (34) and the deflection element (20),which extend in a first direction (48) perpendicular to the vertical direction (18) alternating with at least one free first gap (50) between the deflection element (20) and the electrode surface (34) and in a second direction (52) perpendicular to the vertical direction (18) and the first direction (48) alternating with at least one free second gap (54) between the deflection element (20) and the electrode surface (34) and which connect the electrode surface (34) and the deflection element (20) to one another at a distance in the vertical direction (18).

A vibration sensor (200) is provided, comprising: a vibration receiver (210) including a housing (211) and a vibration unit (212), the housing (211) forming an acoustic cavity, the vibration unit (212) being located in the acoustic cavity and separating the acoustic cavity into a first acoustic cavity (213) and a second acoustic cavity (214); and an acoustic transducer (220) acoustically connected to the first acoustic cavity (213). The housing (211) is configured to generate a vibration based on an external vibration signal, the vibration unit (212) changes an acoustic pressure within the first acoustic cavity (213) in response to the vibration of the housing (211), causing the acoustic transducer (220) to generate an electrical signal. The vibration unit (212) includes a quality element (2121) and an elastic element (2122), an area of the quality element (2121) on a side away from the acoustic transducer (220) is smaller than an area of the quality element (2121) on a side close to the acoustic transducer. The elastic element (2122) is connected around a side wall of the quality element (2121).

MEMS device (10) with a movable displacement element (12) and a drive device (14) for driving the movable displacement element (12), wherein the drive device (14) has at least one drive electrode (16), characterized in that the drive electrode (16) is segmented and at least one functional electrode (18) is provided for measuring the deflection of the displacement element (12).

The present application relates to an abnormal signal detection device using a dual acoustic wave sensor. The abnormal signal detection device using a dual acoustic wave sensor comprises: a housing including a first acoustic wave transmission portion and a second acoustic wave transmission portion; a base substrate located inside the housing and including a first surface and a second surface; a first acoustic wave sensor mounted on the first surface and converting an acoustic wave in a first band into a first electrical signal; a second acoustic wave sensor mounted on the second surface and converting an acoustic wave in a second band into a second electrical signal.

The invention provides an MEMS device, which increases the displacement of a movable part, reduces the stress of the MEMS device, enables the MEMS device to be miniaturized, and improves the resonance frequency. The MEMS device is provided with a frame-shaped fixed part, a movable part arranged on the inner side of the fixed part in plan view, four torsion beams for supporting the movable part, driving beams which are respectively arranged relative to the torsion beams, one ends of the driving beams are connected with the torsion beams, and the other ends of the driving beams are connected with the inner edge of the fixed part, and driving sources arranged on the driving beams. Each of the drive beams is arranged to be point-symmetric with respect to the center of the movable part in plan view, and each of the drive beams has a region in which the width in a direction parallel to a first side connected to the inner edge gradually increases toward the first side in plan view. The movable part is provided with extension parts extending radially from the center in plan view, the number of the extension parts is the same as the number of the torsion beams, each extension part comprises an upper surface, a lower surface, one end surface and two side surfaces connected with the end surface, and each torsion beam is connected with two adjacent side surfaces included in different extension parts.

A MEMS audio device includes a first wafer having a top with a first cavity and a bottom with a vent hole coupled to the first cavity, wherein the bottom having first contacts, a second wafer disposed upon the first wafer having a flexible material layer disposed above the first cavity, a third wafer disposed upon the second wafer having physical contacts coupled to the second wafer, wherein the third wafer includes a second cavity disposed above the flexible material layer, a wiring wafer disposed below the first wafer having a second vent hole coupled to the first cavity, wherein the wiring wafer having second contacts coupled to the first contacts, and wherein the flexible material layer forms a diaphragm for the MEMS audio device.

A cantilever structure includes an anchor portion and a film structure. The film structure covers over a cavity and vibrates within the cavity. A length of the film structure is less than a width of the film structure. The anchor portion includes at least one protrusion protruding toward the cavity, and the film structure is anchored on the anchor portion with the at least one protrusion.

A method for manufacturing a microelectromechanical systems (MEMS) microphone comprises depositing a membrane on a first sacrificial layer, wherein the first sacrificial layer is deposited on a substrate, etching the substrate to define a cavity, releasing the membrane by removing at least the first sacrificial layer, and forming at least one anchor at the edge of the membrane.

A microelectromechanical sensor component. The component includes: a substrate; a movable sensor structure connected to the substrate and having a seismic mass portion and a deflection electrode arranged thereon; and at least one evaluation electrode arranged on the substrate. The deflection electrode is arranged so as to be movable relative to the evaluation electrode. The evaluation electrode is configured for capacitive detection of a deflection of the deflection electrode. The deflection electrode and the evaluation electrode form a comb structure. The deflection electrode has a plurality of deflection electrode fingers extending from a deflection electrode bar in the direction of the evaluation electrode. The evaluation electrode has a plurality of evaluation electrode fingers extending, parallel at least in portions to the deflection electrode fingers, from an evaluation electrode bar in the direction of the deflection electrode.

The present disclosure provides a capacitive microphone (100, 800, 1000) comprising a diaphragm (120) and a backplate (130). The diaphragm (120) is provided with a first hole array (121) that allows airflow to pass through, and the backplate (130) is provided with a second hole array (131) that allows airflow to pass through. The diaphragm (120) and the backplate (130) are spaced apart from each other to form a capacitor.

A method of operating a microelectromechanical system (MEMS) includes, in a first operational mode, converting an analog output of the MEMS into a first internal data stream and a first external data stream having a first sampling rate; transitioning from the first operational mode to a second operation mode without restarting the MEMS; and in the second operational mode, converting the analog output of the MEMS into a second internal data stream having a second sampling rate different from the first sampling rate, and performing a sampling rate conversion of the second internal data stream to generate a second external data stream.

A semiconductor integrated circuit device capable of inputting a signal of a MEMS transducer 2 includes: a power supply circuit 11 for the MEMS transducer 2; an input amplifier 12 for inputting and amplifying a signal of the MEMS transducer 2; a line driver 13 for amplifying an output from the input amplifier 12 and allowing for driving of a load connected to an output terminal T3, the line driver 13 having an input terminal; and the output terminal T3 for outputting an output of the line driver 13, wherein the power supply circuit 11, the input amplifier 12, and the line driver 13 are integrally formed on a semiconductor substrate, and wherein a gain setting circuit 14 for determining gain of the line driver 13 and a DC potential of the output terminal T3 is connected to the input terminal of the line driver 13.

The invention discloses an MEMS device and a manufacturing method thereof, and the method comprises the steps: forming a first MEMS structure: providing a first substrate, forming a first sensing layer on the first substrate, and sequentially forming a first cavity and a second sensing layer on the first sensing layer; forming a second MEMS structure: providing a second substrate, forming a third sensing layer on the second substrate, and sequentially forming a second cavity and a fourth sensing layer on the third sensing layer; bonding the second sensing layer and the fourth sensing layer to form a common sensing layer; the part, corresponding to the first cavity, of the first substrate is removed, and the first sensing layer forms a movable sensing layer. According to the MEMS device and the manufacturing method thereof provided by the invention, the stacked double-layer capacitor structure is prepared by adopting a heterogeneous bonding mode, the process is simple, the implementation is high, the prepared device structure does not need to be plugged, the problem that the sensing layer is uneven due to hole plugging is avoided, and the reliability of the device is improved. The reliability problems of air leakage and the like of the hole blocking structure caused by repeated pressure measurement motion of the upper-layer pressure sensing film of the sealing cavity are also avoided, and the service life and the yield of the device are improved.

A digital microphone includes a log amplifier having an input for receiving an analog signal; an analog-to-digital converter (ADC) coupled to the log amplifier; a digital low-pass filter coupled to the ADC; a digital decompression component coupled to the digital low-pass filter; and a predictor filter coupled to the digital decompression component, the predictor filter having an output for generating a digital signal. The digital low-pass filter is a positive group delay filter and the predictor filter is a negative group delay filter. The digital microphone has an improved Signal-to-Noise Ratio (SNR) due to filtering, but without increasing overall group delay.

Provided is a speaker, including: a diaphragm structure including first and second diaphragms, the first diaphragm is configured to push air to vibrate to generate initial sound wave, and a signal of which is modulated based on a signal within an audible sound frequency band; and a cover plate structure enclosing with the diaphragm structure to form sound-generating cavity, the cover plate structure has a sound outlet hole connecting the sound-generating cavity with outside, the initial sound wave in the sound-generating cavity is transmitted to the outside through the at least one sound outlet hole to form a sound signal, the second diaphragm and the cover plate structure generate an acoustic environmental impedance used to modulate the initial sound wave to change sound pressure of the sound signal. The speaker can modulate and output a sound signal covering the audible sound frequency band based on the acoustic environmental impedance.

In an embodiment a MEMS structure includes a back-plate structure, a support structure having a cavity, a membrane structure between the back-plate structure and the support structure, a first clamping structure having a first structured oxide layer between the support structure and the membrane structure, wherein an inner edge of the first clamping structure is laterally offset from an edge of the cavity, and wherein an offset of the first clamping structure forms a gap between the support structure and the membrane structure, and a second clamping structure having a second structured oxide layer and a first structured taper layer between the back-plate structure and the membrane structure, wherein the second structured oxide layer is arranged between the back-plate structure and the first structured taper layer, wherein an inner edge of the second structured oxide layer laterally extends over the cavity, and wherein the first structured taper layer is arranged between the second structured oxide layer.

An electromechanical system includes a frame; an element movable relative to the frame, the movable element comprising a membrane and a rigidifying structure for the membrane; a capacitive measurement or actuation device; a first transmission device for a movement between the movable element and the capacitive measurement or actuation device, the first transmission device being rotatably movable relative to the frame by a plurality of first pivot hinges; in which system: a first opening is arranged in the movable element; the frame includes a first island extending into the first opening; and the first transmission device is connected to the first island via one of the first pivot hinges.

The present application provides a sound capture method applied to a microphone. The microphone comprises a laser self-mixing device and a diaphragm device, the diaphragm device comprises a membrane configured to respond to sound vibration, and the laser self-mixing device and the diaphragm device are separately configured to detect the vibration of the membrane. In the method, a first voltage signal is obtained using the laser self-mixing device, and a second voltage signal is simultaneously obtained using the diaphragm device. If the first voltage signal is equal to or less than a preset threshold, the first voltage signal is converted into an audio signal, or if the first voltage signal is greater than a preset threshold, the second voltage signal is converted into an audio signal. According to the method of the present application, the audio signal may be collected in two different manners, so that the switching between the two signals is realized using a preset threshold, and the more consistent signal is selected and converted into an audio signal. This can ensure the quality of the audio signal. The present application further relates to a microphone and an electronic device.

A MEMS device comprises a housing with an interior volume, wherein the housing comprises an access port to the interior volume; a MEMS sound transducer in the housing, and a mechanical barrier structure having a plate element which is fixed by means of elastic spacers to a carrier and overlaps the access port, and providing a ventilation path passing a boundary region of the plate element, wherein a clearance of the ventilation path is set by the distance of the boundary region of the plate element to the housing or by the distance of the boundary region of the plate element to a blocking structure which opposes the boundary region of the plate element.