17 results about "Capacitive microphone" patented technology

The invention relates to the technical field of noise measurement systems, in particular to a noise measurement system for a new energy tire, which comprises a tire positioning and driving unit, a sensor unit, a data acquisition and synchronization unit, a data processing unit, a data analysis unit and a man-machine interaction and display unit, the tire positioning and driving unit simulates different loads, different speeds and different road conditions of a tire by using a rack type tire positioning device, and drives the tire to rotate by using a brushless mute motor, so that a high-speed rotating effect without introducing extra mechanical noise is realized; the sensor unit is arranged on the two sides of the tire and at the position close to the ground through an acoustic sensor free field type condenser microphone array, is fixed to the suspension support through an acceleration sensor and is used for collecting vibration signals; the running states of the tire under different loads, speeds and road conditions are accurately simulated, noise data of the tire under various actual working conditions are obtained, and the measurement result is closer to the real situation.

The invention provides a condenser microphone, a semiconductor device and a manufacturing method thereof, which are applied to the technical field of semiconductors. According to the invention, the trench isolation structure is arranged in the substrate under the diaphragm structure, so that a high-insulation resistor is additionally arranged at the weakest part of the substrate under the diaphragm structure, and a leakage current path possibly generated between the diaphragm structure and the substrate is avoided by utilizing physical isolation; the leakage resistance between the vibrating diaphragm structure and the substrate is further increased, the parasitic capacitance between the vibrating diaphragm structure and the substrate is reduced, and the problems that the leakage resistance between the vibrating diaphragm structure and the substrate is reduced and the signal-to-noise ratio is reduced due to the loss of the isolating layer caused by the fillet first opening formed in the first sacrificial layer are solved.

The invention discloses a resonant piezoelectric MEMS microphone with a high signal-to-noise ratio and application thereof, and belongs to the technical field of MEMS acoustic sensors. According to the resonant piezoelectric MEMS microphone, the suspended annular-film composite structure with the two ends symmetrically and fixedly supported is adopted, the high Young modulus film is sensitive to tiny stress change caused by sound waves, the rigid boundary is restrained through the film, vibration caused by the sound waves is more efficiently transmitted to the annular piezoelectric structure, the energy loss of the sound waves can be effectively reduced, and the reliability of the microphone is improved. And the sensitivity of the resonant microphone is obviously improved. Besides, the suspended annular-film composite structure with two ends symmetrically and fixedly supported overcomes the problems of low Q value and large energy loss of a traditional resonant microphone (such as a cantilever beam structure), so that the resonant peak is sharper, and the microphone is more sensitive to tiny resonant frequency deviation caused by sound waves. Moreover, the larger the Q value is, the smaller the noise is, and compared with a traditional capacitive microphone and a traditional piezoelectric microphone, the SNR can be greatly improved in a low-frequency band.

The application provides a condenser microphone, a semiconductor device and a manufacturing method thereof, and is applied to the technical field of semiconductors.In the application, a groove isolation structure is arranged in a substrate under a vibrating diaphragm structure, a high insulation resistance is additionally arranged at the weakest position of the substrate under the vibrating diaphragm structure, then a possible leakage current path between the vibrating diaphragm structure and the substrate is avoided by physical isolation, the leakage resistance between the vibrating diaphragm structure and the substrate is further increased, the parasitic capacitance between the vibrating diaphragm structure and the substrate is reduced, and the problems of the reduced leakage resistance between the vibrating diaphragm structure and the substrate and the reduced signal-to-noise ratio caused by the loss of the first opening with a rounded corner in the first sacrificial layer to the isolation layer are solved.

The application relates to the field of shield model testing and monitoring, and particularly discloses a slurry balance shield model testing device, which comprises a soil bin, a counterforce frame fixed to one side of the soil bin, a moving cabin capable of reciprocating sliding between the soil bin and the counterforce frame, and a multi-source sensor system. The moving cabin comprises a slurry cabin and an air cushion cabin which are independent of each other. A cutter head is arranged at the front end of the slurry cabin. A centrifugal pump is connected in series to a slurry inlet pipeline and a slurry discharge pipeline of the slurry cabin. The multi-source sensor system comprises a torque sensor connected to the cutter head, a pressure sensor connected to the slurry cabin, a pump body acceleration sensor connected to the centrifugal pump, and a condenser microphone arranged in the soil bin and facing a tunneling face. The device can simulate the coupling process of shield tunneling and slurry circulation under laboratory conditions in a high simulation mode, and can realize the synchronous and real-time collection of key multi-source physical parameters of cabin pressure, cutter head load, pumping vibration and tunneling face acoustic signals, thereby providing technical support for in-depth research on the evolution mechanism of complex working conditions such as slurry balance shield lagging.

This invention discloses a MEMS capacitive microphone, comprising a substrate, a support, and a diaphragm, wherein: the diaphragm is supported above the substrate by the support, and the substrate, the support, and the diaphragm form a vacuum cavity; the side of the diaphragm near the vacuum cavity is connected to an electrostatic clutch via a connecting rod; the electrostatic clutch is connected to a capacitive sensing structure. Compared with the prior art, the advantage of this invention is that it allows the microphone to operate under a wide range of atmospheric pressures that customers may expect. This is achieved electrostatically in a purely passive manner, which is advantageous over other designs that require complex electronics and active control. Since only small AC disturbances of the rotor need to be considered, without considering DC changes in rotor position, the diaphragm and sensing structure are physically decoupled, thereby simplifying the design of the sensing structure.

The invention relates to the technical field of biomedical electronic engineering and physiological signal processing, and discloses a special MEMS sensor for heart sound, which comprises an MEMS sensor shell, a silicon substrate is fixedly connected to the inner bottom of the MEMS sensor shell, and a central acoustic unit and a peripheral inertial unit are integrated on the silicon substrate in a monolithic manner; the central acoustic unit is used for collecting sound pressure signals; the central acoustic unit is arranged in the MEMS sensor shell, the peripheral inertial unit is arranged around the central acoustic unit and is used for collecting three-axis acceleration signals, a processor is arranged in the MEMS sensor shell and is electrically connected with the central acoustic unit and the peripheral inertial unit, the central acoustic unit is of a capacitive MEMS microphone structure, and the central acoustic unit and the peripheral inertial unit are arranged in the MEMS sensor shell. The peripheral inertia unit is of a three-axis MEMS accelerometer structure. Through multi-modal signal fusion and closed-loop adaptive adjustment, the problems that traditional heart sound collection is low in signal-to-noise ratio, unstable in signal and lack of comparability are solved.

The utility model discloses an outdoor noise monitoring sensor relates to noise monitoring sensor technical field. This outdoor noise monitoring sensor, including support sleeve, terminal, connecting wire, terminal and connecting wire electric connection, the inside of support sleeve is provided with sensor mainboard and condenser microphone, sensor mainboard and connecting wire electric connection, the outer wall of support sleeve is close to the top and is provided with the sound hole, the sound hole is in the outside of support sleeve and is distributed in the circular array, the outside of support sleeve is sleeved with T type mounting disc, the outer wall of T type mounting disc is provided with screw hole, the inner wall screw thread connection of screw hole has fastening bolt. The utility model discloses through multiple structure cooperation, avoids the erosion of wind and rain, dust to internal condenser microphone, sensor mainboard, guarantees the stable collection of sound wave signal again, has improved the monitoring precision and equipment durability under the outdoor complex environment significantly.

1. Name of the product in this design: Capacitive Microphone (Dual-Network GB40). 2. Purpose of this design: A microphone used for amplification. 3. The key design feature of this product is its shape. 4. The image or photograph that best illustrates the design's key points: a 3D model.

The invention discloses a photoacoustic spectrometry gas detection device and method based on a pi-type Helmholtz photoacoustic cell, and the device comprises a distributed feedback type semiconductor laser, a laser collimator, the pi-type Helmholtz photoacoustic cell, a condenser microphone, a control and data acquisition system, and a computer. Wherein the distributed feedback type semiconductor laser outputs modulated laser, the modulated laser is collimated by the laser collimator and then enters the Pi-type Helmholtz photoacoustic cell to excite target gas to be measured in the Pi-type Helmholtz photoacoustic cell, and the target gas to be measured generates periodic pressure fluctuation after absorbing laser energy; after being conducted by a connecting pipe of the Pi-type Helmholtz photoacoustic cell, a photoacoustic signal is generated at the detection cavity, the photoacoustic signal at the detection cavity is detected by using a condenser microphone, and the detected photoacoustic signal is transmitted to a control and data acquisition system and a computer for demodulation and subsequent processing. The device has the advantages of being good in resonant frequency matching performance, high in photoacoustic signal intensity and high in anti-noise capacity.

The invention relates to the technical field of sleep monitoring, in particular to a sleep and sign state monitoring method based on a microphone sensor. According to the method, sound signals of a human body in the sleep process at night are collected through a condenser microphone sensor, and vital sign signals such as heart rate, breath, body movement and BCG are separated through filtering and short-time Fourier transform processing; and in combination with the sleep stage labels, a deep learning algorithm is utilized to train and establish a sleep stage classifier, and automatic identification of different sleep stages is realized. According to the method, the heart rate, the respiration rate and the body movement data can be calculated at the same time in the actual monitoring process, the classification result and the physical sign data are fused, and the sleep staging state of the whole night and the overall sleep condition are obtained. Compared with the prior art, the method has the advantages of non-contact acquisition, high comfort, low cost, comprehensive monitoring indexes and the like, and is suitable for family long-term sleep health monitoring.

This invention relates to the field of condenser microphone technology, and more particularly to a micro-perforated waterproof condenser microphone. It includes a mounting ring with multiple mounting mechanisms fixedly connected to it. A headlamp is fitted inside the mounting ring. A protective cover is fixedly connected to one side of the mounting ring. Two baffles are symmetrically connected and rotatably mounted at the bottom opening of the protective cover. A movable ring is located inside the protective cover, and a rotating ring is rotatably connected to the movable ring. The condenser microphone is rotatably connected to the rotating ring. By using the protective cover and baffles, when the condenser microphone is not in use, it can be retracted into the protective cover, which in turn closes the baffles, thus protecting the microphone. Furthermore, by having several micro-perforations on the microphone's receiving surface, liquid surface tension can be used to fix the liquid within these micro-perforations, preventing external liquid from entering the microphone and effectively providing waterproofing.

The invention discloses a circular capacitive MEMS microphone packaging structure and process, and belongs to the technical field of semiconductor packaging. The structure comprises a PCB substrate adopting a circular design, and the substrate is provided with a through hole so as to form a front cavity with a self-contained cavity of an MEMS capacitive chip; the ASIC integrated chip and the MEMS capacitive chip are mounted on the substrate and are electrically connected with each other; the circular shell covers the periphery of the substrate, and a circular expansion back cavity surrounding the double chips is formed in the circular shell. The process comprises the steps of substrate dispensing and chip mounting, baking and curing, gold wire bridging, COB glue dispensing and coating, tin drawing, shell reflow soldering and curing and the like. According to the invention, through the cooperation of the circular substrate and the housing, the space of the back cavity is increased, and the SNR signal-to-noise ratio performance is effectively optimized; meanwhile, according to the packaging structure, the harsh requirement for the height of chip glue is lowered, the technological process is simplified, the operation cost is lowered, and product miniaturization and performance optimization are facilitated.

The application relates to a differential capacitive MEMS microphone and a manufacturing method thereof, the microphone comprising: a substrate comprising a second back plate; a first support layer arranged on the substrate; a diaphragm arranged on the first support layer; a second support layer arranged on the diaphragm; and a first back plate arranged on the second support layer, the diaphragm being located between the first back plate and the second back plate; wherein the diaphragm and the first back plate form a first capacitor for outputting a first capacitance value signal, the diaphragm and the second back plate form a second capacitor for outputting a second capacitance value signal, and the first capacitance value signal and the second capacitance value signal constitute a differential signal. The application uses a part of the structure of the substrate as the second back plate, so that the second back plate itself does not increase the thickness of the microphone. Moreover, the capacitive signals output by the capacitors formed by the diaphragm and the first back plate and the second back plate constitute a differential signal, so that the signal-to-noise ratio of the microphone can be improved.

A circuit includes: a capacitive micro-electromechanical system (MEMS) microphone configured to generate a voltage signal in response to a sound signal; a voltage-controlled oscillator (VCO) coupled to the capacitive MEMS microphone, where the VCO is configured to generate a frequency modulated signal having a frequency proportional to the voltage signal; a frequency-to-digital (FTD) converter coupled to an output terminal of the VCO; a random number generator configured to generate random numbers; and a phase modulator configured to generate a phase modulated clock signal by modulating a phase of a system sampling clock signal in accordance with the random numbers, where the FTD converter is configured to generate a digital signal in accordance with the frequency modulated signal and the phase modulated clock signal, and is configured to sample the digital signal by the phase modulated clock signal to generate a digital output signal of the FTD converter.

The application discloses a condenser microphone preparation method and a condenser microphone, and relates to the technical field of condenser microphone preparation methods. The condenser microphone preparation method comprises the following steps: taking a polymer substrate as a substrate, and sequentially forming a microphone main body and a dustproof screen on the polymer substrate by using a three-dimensional printing technology; turning over the polymer substrate, the microphone main body and the dustproof screen which are connected in an integrated mode, so that the polymer substrate is placed upwards; peeling the polymer substrate from one side of the microphone main body which is far away from the dustproof screen; and depositing an electrode on one side of the microphone main body which is far away from the dustproof screen, so as to form a complete condenser microphone. The technical scheme is aimed at reducing the preparation difficulty of the condenser microphone preparation method, thereby improving the structural stability of the condenser microphone.

The invention discloses a condenser microphone, a semiconductor structure and a testing method thereof. The semiconductor structure comprises a supporting layer, a capacitor structure and a plurality of bonding pads. The capacitor structure comprises a back plate and a vibrating diaphragm which are oppositely arranged. And the plurality of bonding pads are located on the surface, far away from the substrate, of the supporting layer and are electrically connected with the vibrating diaphragm through the conductive structures. The conductive structure comprises a conductive hole located in the capacitor structure, and after the conductive hole penetrates through the backboard, the bottom of the conductive hole is in direct contact with the vibrating diaphragm. Therefore, when the semiconductor structure is used for performing defect detection on the conductive holes, a plurality of probes can be applied by a plurality of bonding pads, so that the problem that the probes directly applied to the conductive holes due to a single bonding pad cannot find positions due to small sizes and inconsistent depths (caused by multiple times of etching) of the conductive holes is avoided, and the defect detection accuracy is improved. The problems that detection cannot be carried out and detection data is unstable are further caused.