1079results about "Electrostatic transducer microphones" patented technology

A method of making an acoustic sensor includes forming or providing a mold having one or more grooves extending in a direction of the length of the mold to a distal end of the mold. The method also includes forming or depositing a structure having one or more piezoelectric layers over the top surface of the mold to define a beam with a proximal portion and a distal portion, the distal portion having a corrugated section including one or more grooves that correspond to the one or more grooves of the mold. The method also includes forming or applying an electrode to the proximal portion of the structure and releasing the structure from the mold to form one or more cantilever beams. The corrugated section inhibits bending of the corrugated section along the length of the distal portion of the structure when the acoustic sensor is subjected to sound pressure.

A logarithmic amplifier includes programmable gain amplifiers each having a different gain, wherein an input of each of the programmable gain amplifiers is coupled to an input of the logarithmic amplifier; and a summing circuit having inputs coupled to a corresponding output of each of the programmable gain amplifiers and an output coupled to an output of the logarithmic amplifier, wherein the summing circuit generates a logarithmic transfer function having piecewise linear segments.

A method of operating a microelectromechanical system (MEMS) includes, in a first operational mode, converting an analog output of the MEMS into a first internal data stream and a first external data stream having a first sampling rate; transitioning from the first operational mode to a second operation mode without restarting the MEMS; and in the second operational mode, converting the analog output of the MEMS into a second internal data stream having a second sampling rate different from the first sampling rate, and performing a sampling rate conversion of the second internal data stream to generate a second external data stream.

Disclosed in the present invention is a high-dynamic capacitive digital microphone system based on electrostatic force feedback. The system comprises an MEMS microphone and an interface circuit chip thereof, wherein the interface circuit chip comprises a charge pump, an analog front end, an analog-to-digital conversion circuit, an amplitude detection module, an amplitude adjustment control module and a pulse density modulation module. In the present invention, the characteristic of the sensitivity being able to be adjusted by means of changing a bias voltage by a capacitive sensor is used, and a charge pump with an adjustable output voltage is used to provide electrostatic force feedback, thereby further expanding the adjustable range of a front-end gain, and also reducing requirements for the noise performance of a readout circuit. Therefore, the system in the present application has the characteristics of high dynamic range and high-precision quantization.

In an example, the present invention provides a micro-speaker device. The device has a movable diaphragm device comprising a thickness of silicon or graphene material which has a first surface and a second surface opposite of the first surface and sensor to track position of the diaphragm. The device has a housing enclosing the movable diaphragm device, the electrode device and an encapsulation device. The electrode device can be part of a CMOS device with electronics integrated on to the device that converts input audio signal in to signal that electrostatically actuates the micro-speaker from one or more surfaces.

A digital microphone includes at least one integrator; a state detection and parameter control component directly coupled to an output of the integrator; and a signal processing component coupled to an output of the state detection and parameter control component, wherein a parameter of the signal processing component includes a first value in a first operational mode and a second value in a second operational mode different from the first operational mode.

The invention provides electronic equipment, relates to the technical field of electronic equipment, and aims at thinning the electronic equipment and centering an outer end opening of a pickup channel. The electronic equipment comprises a screen, a middle frame, a pickup channel and a microphone. The screen includes a display surface. The middle frame and the pickup channel are arranged on one side, back to the display surface, of the screen. The pickup channel comprises a first channel section and a second channel section. The first end of the first channel section is located on the outer side face of the middle frame, the first channel section extends towards the middle of the middle frame from the first end to the second end of the first channel section, and the second end is closer to the screen than the first end in the direction perpendicular to the screen. The third end of the second channel section is connected with the second end, the second channel section extends in the direction away from the screen from the third end to the fourth end of the second channel section, and the fourth end penetrates through the surface, back to the screen, of the middle frame. The microphone is located on the side, back to the screen, of the middle frame, the microphone is provided with a pickup hole, and the pickup hole is communicated with the fourth end.

A MEMS element in which a backplate including a fixed electrode and a vibrating membrane including a movable electrode are disposed on a substrate including a back chamber, so as to face each other via a spacer, the vibrating membrane includes a pillar connected to the backplate, pillar side slits, and peripheral portion side slits, and a plurality of vibrating portion is formed in the vibrating membrane. The central portion of the vibrating membrane is connected to the backplate by the pillar, so that the amplitude of the central portion can be suppressed. In each of a plurality of vibrating portions, the pillar side slits are disposed on a portion side in which the pillar and the vibrating membrane are joined and the peripheral portion side slits are disposed at the peripheral portion, thereby decreasing the difference in the amplitude amount between the central portion and the peripheral portion.A MEMS element in which a backplate including a fixed electrode and a vibrating membrane including a movable electrode are disposed on a substrate including a back chamber, so as to face each other via a spacer, the vibrating membrane includes a pillar connected to the backplate, pillar side slits, and peripheral portion side slits, and a plurality of vibrating portion is formed in the vibrating membrane. The central portion of the vibrating membrane is connected to the backplate by the pillar, so that the amplitude of the central portion can be suppressed. In each of a plurality of vibrating portions, the pillar side slits are disposed on a portion side in which the pillar and the vibrating membrane are joined and the peripheral portion side slits are disposed at the peripheral portion, thereby decreasing the difference in the amplitude amount between the central portion and the peripheral portion.

The invention provides electronic equipment and a pickup device, the electronic equipment is provided with an appearance surface, the appearance surface is provided with a first pickup port and a plurality of second pickup ports distributed at intervals, and each second pickup port and the first pickup port are arranged at intervals; a microphone, a first sound channel and a plurality of second sound channels are arranged in the electronic equipment, the first sound channel is communicated with the first pickup port and a first cavity of the microphone, the second sound channels are communicated with the second pickup ports in a one-to-one correspondence mode, and the second sound channels are communicated with a second cavity of the microphone. And the first cavity of the microphone and the second cavity of the microphone are respectively positioned on two sides of a vibrating diaphragm of the microphone. A plurality of pickup vectors can be formed between the plurality of second pickup ports and the first pickup port. A vector obtained by adding the plurality of pickup vectors is consistent with the sensitivity direction of the microphone. The microphone of the electronic equipment can better receive sound from the sensitivity direction of the microphone, and the microphone can realize directional pickup.

A piezoelectric microelectromechanical system microphone comprises a support substrate, a diaphragm including a piezoelectric material attached to the support substrate and configured to deform and generate an electrical potential responsive to impingement of sound waves on the diaphragm, and a compliant anchor formed of a material with a greater compliance than a compliance of the piezoelectric material, the compliant anchor defined in the diaphragm in an anchor region between the piezoelectric material of the diaphragm and the support substrate to improve sensitivity and reduce residual stress impact of the piezoelectric microelectromechanical system microphone.

Disclosed are a vibration sensor, an electronic device and a vibration detection method. The vibration sensor comprises a circuit board assembly, a housing, a chip assembly, a vibration-pickup assembly and a through-hole. A back cavity is formed inside the circuit board assembly, the housing is mounted over the circuit board assembly, and the chip assembly is provided on a side of the circuit board assembly proximate to the housing and is electrically connected to the circuit board assembly. The vibration-pickup assembly is provided inside the cavity and dividing the cavity into a first cavity and a second cavity. The through-hole of the vibration sensor may be in communication with the back cavity and the second cavity.

A dynamic capacitive sensor configuration is disclosed which imposes minimal force and resistance to motion on the moving electrode. Moving electrodes avoid adverse effects of large bias voltages such as pull-in instability, despite arbitrary levels of compliance. This configuration facilitates incorporation of highly compliant and thin electrode materials that present the least possible resistance to motion. This type of material is particularly useful for sensing sound. A large bias voltage can be applied without influencing its motion, e.g., 400 V. The electrical sensitivity to sound is high, e.g., approximately 0.5 volts / pascal, two orders of magnitude greater than typical acoustic sensors.

The invention discloses an MEMS microphone and an electronic device. The MEMS microphone comprises a substrate structure, a diaphragm structure, a support structure and a back electrode structure. The vibrating diaphragm structure is stacked on one side of the substrate structure, the vibrating diaphragm structure comprises a first functional area located in the center and a plurality of second functional areas connected to the peripheral side of the first functional area and arranged in pairs, and each pair of second functional areas are located on the two opposite sides of the first functional area respectively; the supporting structure is stacked on one side of the substrate structure and surrounds the outer side of the vibrating diaphragm structure, and the supporting structure comprises a supporting part and a plurality of functional parts corresponding to the plurality of second functional areas; the back electrode structure is stacked on the side, away from the substrate structure, of the supporting structure and can form a parallel plate capacitor with the first functional area, and when the voltage between the vibrating diaphragm structure and the back electrode structure is larger than a set value, the first functional area can be attracted to the back electrode structure, so that the second functional area can form an interdigital capacitor with the corresponding functional part.

The invention relates to a MEMS component, in particular an acoustic transducer or pressure sensor, comprising: a substrate with a cavern and a mainland, an interaction element arranged above the cavern and connected to the mainland, where the interaction element is a bending beam, a boundary layer arranged at a distance from the bending beam via connecting elements, which defines a cavity with the bending beam, and a back plate located within the cavity, which is designed as a back electrode, wherein the back plate is designed to be stiffer with respect to the boundary layer and the bending beam, at least one electrode which forms a readable capacitance with a back electrode of the back plate in order to capacitively detect a deflection of at least one of the bending beam, the connecting elements and the boundary layer, at least one stop element which is designed to be displaced into a mechanical stop, wherein the stop element in the stop has at least one fluid flow resistance, in particular a fluid seal, between the cavity on a substrate-facing side and a volume on a substrate-facing side of the cavity.

Acoustic and other activity detection signaling is provided herein. Operations of a method can include determining a micro-electromechanical system (MEMS) device is no longer in an initialization state and receiving a first signal that instructs the MEMS device to perform event activity detection. The method can also include receiving one or more event signals and determining that an event signal of one or more event signals satisfies a defined event characteristic. The method can also include outputting a second signal that comprises information indicative of a detection of event activity at the MEMS device being more than the defined event characteristic.

The invention discloses a highly dustproof MEMS microphone packaging substrate and a processing method thereof. The highly dustproof MEMS microphone packaging substrate is characterized in that a capacitor-embedded resistor-embedded substrate is provided with a sound hole processing area; the two outermost layers of the capacitor-embedded resistor-embedded substrate are respectively covered with an ultrathin copper layer, and a window is manufactured on one ultrathin copper layer at a position corresponding to a sound hole processing area through a pattern manufacturing process. And after the position, corresponding to the sound hole machining area, on the other ultrathin copper layer is thickened, a copper net pattern formed by connecting a plurality of copper wires in a crossed mode is manufactured. Based on the window, at least part of the sound hole machining area is hollowed out through a laser groove burning technology, and a sound hole communicated with the copper net pattern is manufactured; cleaning the sound hole and the copper mesh pattern; and plating a protective layer on the copper net pattern. The processing method is novel and reasonable, the obtained MEMS microphone packaging substrate has the advantages of being small in size, thin in structure, excellent in ventilation and dustproof performance, high in sound transmission quality, high in reliability, high in anti-interference performance and the like, and market requirements are met.

The invention discloses a combined sensor and electronic equipment, and relates to the technical field of sensors, the combined sensor comprises a packaging shell, an MEMS chip and an ASIC chip which are in signal connection, a waterproof breathable film and a water residue detection assembly, the packaging shell forms a containing cavity and is provided with a breathable hole communicating the containing cavity with the external environment, the MEMS chip is arranged in the containing cavity, and the ASIC chip is arranged in the waterproof breathable film. The ASIC chip is arranged in the accommodating cavity or embedded in the packaging shell; the waterproof breathable film covers the breathable hole, the water residue detection assembly is arranged on the packaging shell and corresponds to the waterproof breathable film, and the water residue detection assembly is in signal connection with the ASIC chip; the water residue detection assembly is used for detecting whether water residues exist at the waterproof breathable film or not, and the ASIC chip is used for starting heating to remove the water residues when detecting that the water residues exist. According to the technical scheme, the waterproof requirement can be met, and meanwhile the measurement precision of the acoustic signal and the air pressure signal is improved.

The invention discloses a sensitive film, an MEMS chip and a sensor, and relates to the technical field of acoustic-electric conversion equipment.The sensitive film comprises a film body and a first annular fold part, the film body comprises a first face and a second face, the first annular fold part is arranged on the second face, the first annular fold part forms a first open slot penetrating through the first face, and the first open slot penetrates through the second face; the number of the first annular fold parts is at least two, the membrane body is provided with a central area, and the at least two first annular fold parts are sequentially arranged in the central area in a surrounding mode in the first direction; any two adjacent first annular fold parts are not completely the same in shape and size, the shape and size comprise at least one of the thickness size of the first annular fold parts, the depth size and the width size of the first opening grooves, and the first direction is perpendicular to the vibration direction. The mechanical sensitivity of the MEMS microphone chip is adjusted by adjusting the shape and size of the first annular fold part, so that the mechanical sensitivity of the MEMS microphone chip is further improved.

The invention relates to a microelectromechanical sensor (10) for measuring an environmental variable (12) of a sensor environment (16), comprising at least one deflection element (20) which can be deflected in a vertical direction (18) depending on the environmental variable (12), at least one counter electrode (32), at least one electrode surface (34) which is coupled to the deflection element (20) and which can be moved relative to the counter electrode (32) depending on the deflection of the deflection element (20) by changing an electrode spacing (38) and which faces the counter electrode (32), wherein stiffening means (44) are arranged between the electrode surface (34) and the deflection element (20),which extend in a first direction (48) perpendicular to the vertical direction (18) alternating with at least one free first gap (50) between the deflection element (20) and the electrode surface (34) and in a second direction (52) perpendicular to the vertical direction (18) and the first direction (48) alternating with at least one free second gap (54) between the deflection element (20) and the electrode surface (34) and which connect the electrode surface (34) and the deflection element (20) to one another at a distance in the vertical direction (18).

A vibration sensor (200) is provided, comprising: a vibration receiver (210) including a housing (211) and a vibration unit (212), the housing (211) forming an acoustic cavity, the vibration unit (212) being located in the acoustic cavity and separating the acoustic cavity into a first acoustic cavity (213) and a second acoustic cavity (214); and an acoustic transducer (220) acoustically connected to the first acoustic cavity (213). The housing (211) is configured to generate a vibration based on an external vibration signal, the vibration unit (212) changes an acoustic pressure within the first acoustic cavity (213) in response to the vibration of the housing (211), causing the acoustic transducer (220) to generate an electrical signal. The vibration unit (212) includes a quality element (2121) and an elastic element (2122), an area of the quality element (2121) on a side away from the acoustic transducer (220) is smaller than an area of the quality element (2121) on a side close to the acoustic transducer. The elastic element (2122) is connected around a side wall of the quality element (2121).

The invention provides a microphone and an electronic device. The microphone comprises a substrate, a sound hole arranged on the substrate, and an MEMS chip covering the sound hole. A conduction cavity is arranged in the substrate, the sound holes comprise a first sound hole and a second sound hole, one side of the conduction cavity is conducted with the outside through the first sound hole, and the other side of the conduction cavity is conducted with the MEMS chip through the second sound hole; the MEMS chip is conducted with the outside through the second sound hole, the conduction cavity and the first sound hole in sequence; a partition assembly is arranged in the communicating cavity and used for shunting and buffering air flow entering the communicating cavity. According to the invention, the airflow impact resistance of the microphone can be improved.

Acoustic activity detection is provided herein. Operations of a method can include receiving an acoustic signal at a micro-electromechanical system (MEMS) microphone. Based on portions of the acoustic signal being determined to exceed a threshold signal level, output pulses are generated. Further, the method can include extracting information representative of a frequency of the acoustic signal based on respective spacing between rising edges of the output pulses.

The present application relates to an abnormal signal detection device using a dual acoustic wave sensor. The abnormal signal detection device using a dual acoustic wave sensor comprises: a housing including a first acoustic wave transmission portion and a second acoustic wave transmission portion; a base substrate located inside the housing and including a first surface and a second surface; a first acoustic wave sensor mounted on the first surface and converting an acoustic wave in a first band into a first electrical signal; a second acoustic wave sensor mounted on the second surface and converting an acoustic wave in a second band into a second electrical signal.

A MEMS audio device includes a first wafer having a top with a first cavity and a bottom with a vent hole coupled to the first cavity, wherein the bottom having first contacts, a second wafer disposed upon the first wafer having a flexible material layer disposed above the first cavity, a third wafer disposed upon the second wafer having physical contacts coupled to the second wafer, wherein the third wafer includes a second cavity disposed above the flexible material layer, a wiring wafer disposed below the first wafer having a second vent hole coupled to the first cavity, wherein the wiring wafer having second contacts coupled to the first contacts, and wherein the flexible material layer forms a diaphragm for the MEMS audio device.

The invention relates to the technical field of microelectronics, and provides an MEMS microphone and a preparation method thereof, and an electronic device, the microphone comprises a substrate, the substrate comprises a first wafer and a first sacrificial layer, the first wafer is provided with a sealed cavity diaphragm, the first sacrificial layer is used for separating the sealed cavity diaphragm from the first wafer, and the substrate comprises a sound transmission hole penetrating through the first wafer and the first sacrificial layer; a second wafer on which a back plate is prepared; wherein the first wafer and the second wafer are bonded in a low-pressure environment, so that the sealed cavity vibrating diaphragm and the back plate form a capacitor. According to the method, the signal-to-noise ratio of the microphone is improved, and the reliability of the MEMS microphone is enhanced.

A digital microphone includes a logarithmic amplifier; an analog-to-digital converter (ADC) coupled to the logarithmic amplifier; a digital decompression component coupled to the ADC; and a digital filter coupled to the digital decompression component, wherein the digital filter includes a controlled upsampling component coupled to an input of the digital filter and a controlled downsampling component coupled to an output of the digital filter.

A MEMS acoustic sensing chip, a microphone, and an electronic device are disclosed in embodiments of the present disclosure. The MEMS acoustic sensing chip includes a substrate, a first diaphragm, a second diaphragm, a backplate, and a support structure, the substrate being provided with a back cavity; the first diaphragm, the second diaphragm, and the backplate are provided on one side of the substrate through the support structure, the first diaphragm and the second diaphragm are provided with an inner cavity therebetween, and the backplate is suspended in the inner cavity; the support structure is provided with a vent hole, the vent hole being in communication with the back cavity and being independent of the inner cavity; and at least one of the first diaphragm and the second diaphragm is provided with a release hole, which is in communication with the inner cavity.

A head-mounted device for generating binaural audio content includes a first rod coupled to a first microphone housing enclosing a first front microphone and a first rear microphone, respectively, that generate acoustic signals. The first microphone housing includes a first front port facing downward and a first rear port facing rearward. The apparatus includes a second rod coupled to a second microphone housing enclosing a second front microphone and a second rear microphone, respectively, that generate acoustic signals. The second microphone housing includes a second front port facing downward and a second rear port facing rearward. In one embodiment, an apparatus includes a binaural audio processor including a beamformer and a storage device. The beamformer generates a first beamformer signal based on acoustic signals from the first front microphone and the first rear microphone and a second beamformer signal based on acoustic signals from the second front microphone and the second rear microphone. A storage device stores the first and second beamformer signals as a two-channel file.

An electronic device includes a substrate, a sensor, an inner cover, a water proof member, and an outer cover. The sensor is disposed on the substrate. The inner cover is disposed on the substrate and covers the sensor. The inner cover includes an opening. The water proof member is disposed on the inner cover and covers the opening. The outer cover is disposed on the substrate and covers the inner cover, so that a drainage chamber is formed between the inner cover and the outer cover. The drainage chamber communicates with outside through a first hole and a second hole. The first hole and the second hole are staggered with the opening. A portion of the drainage chamber between the first hole and the second hole acts as a drainage channel. A length of the drainage channel is greater than a diameter of the opening.