1470results about "Electrostatic transducer microphones" patented technology

A method of making an acoustic sensor includes forming or providing a mold having one or more grooves extending in a direction of the length of the mold to a distal end of the mold. The method also includes forming or depositing a structure having one or more piezoelectric layers over the top surface of the mold to define a beam with a proximal portion and a distal portion, the distal portion having a corrugated section including one or more grooves that correspond to the one or more grooves of the mold. The method also includes forming or applying an electrode to the proximal portion of the structure and releasing the structure from the mold to form one or more cantilever beams. The corrugated section inhibits bending of the corrugated section along the length of the distal portion of the structure when the acoustic sensor is subjected to sound pressure.

A logarithmic amplifier includes programmable gain amplifiers each having a different gain, wherein an input of each of the programmable gain amplifiers is coupled to an input of the logarithmic amplifier; and a summing circuit having inputs coupled to a corresponding output of each of the programmable gain amplifiers and an output coupled to an output of the logarithmic amplifier, wherein the summing circuit generates a logarithmic transfer function having piecewise linear segments.

A method of operating a microelectromechanical system (MEMS) includes, in a first operational mode, converting an analog output of the MEMS into a first internal data stream and a first external data stream having a first sampling rate; transitioning from the first operational mode to a second operation mode without restarting the MEMS; and in the second operational mode, converting the analog output of the MEMS into a second internal data stream having a second sampling rate different from the first sampling rate, and performing a sampling rate conversion of the second internal data stream to generate a second external data stream.

A drying implement may include a first portion having a diatomaceous earth slab and a resilient slab covering, and a second portion that is coupled to the first panel. The resilient slab covering may include a mesh of openings that allow water from an article placed on the resilient slab covering to drip through the mesh of openings, onto the diatomaceous earth slab. The second panel may include a plurality of cross pieces that are overmolded with a resilient second covering.

Disclosed in the present invention is a high-dynamic capacitive digital microphone system based on electrostatic force feedback. The system comprises an MEMS microphone and an interface circuit chip thereof, wherein the interface circuit chip comprises a charge pump, an analog front end, an analog-to-digital conversion circuit, an amplitude detection module, an amplitude adjustment control module and a pulse density modulation module. In the present invention, the characteristic of the sensitivity being able to be adjusted by means of changing a bias voltage by a capacitive sensor is used, and a charge pump with an adjustable output voltage is used to provide electrostatic force feedback, thereby further expanding the adjustable range of a front-end gain, and also reducing requirements for the noise performance of a readout circuit. Therefore, the system in the present application has the characteristics of high dynamic range and high-precision quantization.

An acoustic sensor device includes a substrate, a cavity formed in the substrate, and a microelectromechanical system (MEMS) transducer having a diaphragm supported by the substrate. The diaphragm includes a first portion configured to be fixed to the substrate and a second portion extending from the first portion and suspended over the cavity. The second portion is configured to vibrate when the MEMS transducer is subject to an external stimulus. The diaphragm also includes an anchor portion that attaches the first portion of the diaphragm to the substrate on at least two sides of the substrate such that an interface between the first portion of the diaphragm and the second portion of the diaphragm is moved away from an edge of the substrate along the cavity.

The invention discloses an MEMS microphone and a manufacturing method thereof. The MEMS microphone comprises a first microphone structure and a second microphone structure. The first microphone structure comprises a first vibrating diaphragm, a first back plate and a second vibrating diaphragm which are arranged at intervals from bottom to top, a first cavity is formed between the first vibrating diaphragm and the second vibrating diaphragm, and the first back plate is parallel to the first vibrating diaphragm and the second vibrating diaphragm and penetrates through the first cavity; the second microphone structure comprises a third vibrating diaphragm, a second backboard and a fourth vibrating diaphragm which are arranged at intervals from top to bottom, a second cavity is formed between the third vibrating diaphragm and the fourth vibrating diaphragm, and the second backboard is parallel to the third vibrating diaphragm and the fourth vibrating diaphragm and penetrates through the second cavity; and the common vibrating diaphragm is formed by directly bonding a second vibrating diaphragm and a fourth vibrating diaphragm. According to the MEMS microphone and the manufacturing method thereof provided by the invention, a microphone structure with three vibrating diaphragms and double backboards is formed by forming the common vibrating diaphragm, so that the performance of the MEMS microphone is improved, and the process difficulty of manufacturing the MEMS microphone is reduced.

Techniques for biometric authentication using a voice accelerometer and an acoustic transducer includes receiving a first signal representing an output by a voice accelerometer of a device and a second signal representing an output by an acoustic transducer of the device. Characteristics of each of the first signal and the second signal are compared with stored biometric characteristics for a user of the device. The user of the device is then authenticated based on the comparison.

Disclosed are a micro-electromechanical system (MEMS) structure and an MEMS microphone comprising same. The MEMS structure comprises a back plate; and a diaphragm located on one side of the back plate, wherein the diaphragm and the back plate forms a variable capacitor, the diaphragm comprises multiple first through holes and air release structures respectively corresponding to the first through holes, and the diaphragm further comprises one or more second through holes penetrating through the diaphragm.

According to an embodiment, a digital microphone includes an analog-to-digital converter (ADC) for receiving an analog input signal; a DC blocker component coupled to the ADC; a digital low pass filter coupled to the DC block component; and a nonlinear compensation component coupled to the digital low pass filter for providing a digital output signal.

In an example, the present invention provides a micro-speaker device. The device has a movable diaphragm device comprising a thickness of silicon or graphene material which has a first surface and a second surface opposite of the first surface and sensor to track position of the diaphragm. The device has a housing enclosing the movable diaphragm device, the electrode device and an encapsulation device. The electrode device can be part of a CMOS device with electronics integrated on to the device that converts input audio signal in to signal that electrostatically actuates the micro-speaker from one or more surfaces.

A MEMS microphone includes a substrate, a base, a capacitance system, and at least one cantilever structure. The substrate includes a back cavity, the base is disposed on one side of the substrate, and the capacitance system is disposed on the base. The capacitance system includes at least one back plate assembly, at least one first vibration diaphragm, and at least one second vibration diaphragm. The at least one first vibration diaphragm includes a first sub-vibration diaphragm, and the at least one second vibration diaphragm includes a second sub-vibration diaphragm. The sub-vibration diaphragm and the second sub-vibration diaphragm form a cantilever beam structure on the base, which increase compliance of the at least one first vibration diaphragm and the at least one second vibration diaphragm and reduce tension of the at least one first vibration diaphragm and the at least one second vibration diaphragm, thereby improving sensitivity of the microphones.

A diaphragm and a MEMS microphone. The diaphragm comprises a vibrating portion (1) and supporting structures (2) connected to the vibrating portion (1). Each supporting structure (2) comprises a cantilever portion (21) extending outwards from the periphery of the vibrating portion (1), and a first anchoring portion (22) and a second anchoring portion (23), both of which are connected to the end of the cantilever portion (21) away from the vibrating portion (1). The lengths of both the first anchoring portion (22) and the second anchoring portion (23) extend along the circumference of the vibrating portion (1), and the length of the first anchoring portion (22) and the length of the second anchoring portion (23) extend in opposite directions. As the lengths of both the first anchoring portion (22) and the cantilever portion (21) extend along the circumference of the vibrating portion (1), and the length of the first anchoring portions (22) and the length of the second anchoring portion (23) extend in opposite directions, the first anchoring portion (22), the cantilever portion (21), and the second anchoring portion (23) are connected to form a T shape, that is, each supporting structure is a T-shaped beam, enabling the diaphragm to have a wider range of vibration displacement, and thereby improving the sensitivity and adaptability of the MEMS microphone.

The invention provides a piezoelectric MEMS microphone and a preparation method thereof, and relates to the technical field of semiconductors, the piezoelectric MEMS microphone comprises a base layer with a cavity and a composite vibration layer laminated on the cavity of the base layer, the composite vibration layer is provided with at least one gap, and the gap is arranged along the lamination direction; when there are multiple gaps, the multiple gaps are located in the same plane in the horizontal direction perpendicular to the stacking direction. At least one gap enables the composite vibration layer to form a cantilever beam supported by the base layer; the opening width of the gap is gradually reduced in the direction from the composite vibration layer to the cavity. The slit width of the slit is gradually reduced from the composite vibration layer to the cavity, and the slit forms a certain slit width difference, so that the slit width as small as possible can be obtained at the bottommost part of the slit; and the slit width difference is formed in different layers by the slit, so that the slit is easy to prepare in process, smaller slit width can be obtained, the microphone has wider low-frequency response, and the product quality can be ensured.

A digital microphone includes at least one integrator; a state detection and parameter control component directly coupled to an output of the integrator; and a signal processing component coupled to an output of the state detection and parameter control component, wherein a parameter of the signal processing component includes a first value in a first operational mode and a second value in a second operational mode different from the first operational mode.

The invention provides electronic equipment, relates to the technical field of electronic equipment, and aims at thinning the electronic equipment and centering an outer end opening of a pickup channel. The electronic equipment comprises a screen, a middle frame, a pickup channel and a microphone. The screen includes a display surface. The middle frame and the pickup channel are arranged on one side, back to the display surface, of the screen. The pickup channel comprises a first channel section and a second channel section. The first end of the first channel section is located on the outer side face of the middle frame, the first channel section extends towards the middle of the middle frame from the first end to the second end of the first channel section, and the second end is closer to the screen than the first end in the direction perpendicular to the screen. The third end of the second channel section is connected with the second end, the second channel section extends in the direction away from the screen from the third end to the fourth end of the second channel section, and the fourth end penetrates through the surface, back to the screen, of the middle frame. The microphone is located on the side, back to the screen, of the middle frame, the microphone is provided with a pickup hole, and the pickup hole is communicated with the fourth end.

A MEMS microphone includes substrate, housing, MEMS chip and ASIC chip. The substrate is provided with sound inlet channel communicating the receiving space with the outside. The MEMS chip includes diaphragm located on sound inlet path of sound inlet channel. The sound inlet channel includes buffering cavity, first sound inlet hole, and second sound inlet hole provided in the substrate and communicating the buffering cavity with the back cavity. The second sound inlet hole includes at least two sub-holes spaced apart from each other. When external air pressure enters the sound inlet channel, the air pressure entering from the first sound inlet hole may not directly act on the diaphragm through the second sound inlet hole, and the sub-holes can further block the airflow, which can effectively buffer the impact of the air pressure on the diaphragm, reduce diaphragm rupture, and improve reliability and performance of the MEMS microphone.

A MEMS element in which a backplate including a fixed electrode and a vibrating membrane including a movable electrode are disposed on a substrate including a back chamber, so as to face each other via a spacer, the vibrating membrane includes a pillar connected to the backplate, pillar side slits, and peripheral portion side slits, and a plurality of vibrating portion is formed in the vibrating membrane. The central portion of the vibrating membrane is connected to the backplate by the pillar, so that the amplitude of the central portion can be suppressed. In each of a plurality of vibrating portions, the pillar side slits are disposed on a portion side in which the pillar and the vibrating membrane are joined and the peripheral portion side slits are disposed at the peripheral portion, thereby decreasing the difference in the amplitude amount between the central portion and the peripheral portion.A MEMS element in which a backplate including a fixed electrode and a vibrating membrane including a movable electrode are disposed on a substrate including a back chamber, so as to face each other via a spacer, the vibrating membrane includes a pillar connected to the backplate, pillar side slits, and peripheral portion side slits, and a plurality of vibrating portion is formed in the vibrating membrane. The central portion of the vibrating membrane is connected to the backplate by the pillar, so that the amplitude of the central portion can be suppressed. In each of a plurality of vibrating portions, the pillar side slits are disposed on a portion side in which the pillar and the vibrating membrane are joined and the peripheral portion side slits are disposed at the peripheral portion, thereby decreasing the difference in the amplitude amount between the central portion and the peripheral portion.

Embodiments relate to systems and methods for compensating nonlinear distortions. The system receives a signal corresponding to an input sound pressure which is detected by a capacitive MEMS microphone. The capacitive MEMS microphone includes an active capacitance and a parasitic capacitance. The system determines a nonlinear relationship between the signal and the input sound pressure; and determines, based on the signal, an input parameter associated with the active capacitance and the parasitic capacitance. The system further determines an output signal based on the input parameter and the output signal and the input sound pressure have a linear relationship. The system compensates the signal based on the determined output signal and outputs the compensated signal as an output so that the output has the linear relationship with the input sound pressure.

The invention provides electronic equipment and a pickup device, the electronic equipment is provided with an appearance surface, the appearance surface is provided with a first pickup port and a plurality of second pickup ports distributed at intervals, and each second pickup port and the first pickup port are arranged at intervals; a microphone, a first sound channel and a plurality of second sound channels are arranged in the electronic equipment, the first sound channel is communicated with the first pickup port and a first cavity of the microphone, the second sound channels are communicated with the second pickup ports in a one-to-one correspondence mode, and the second sound channels are communicated with a second cavity of the microphone. And the first cavity of the microphone and the second cavity of the microphone are respectively positioned on two sides of a vibrating diaphragm of the microphone. A plurality of pickup vectors can be formed between the plurality of second pickup ports and the first pickup port. A vector obtained by adding the plurality of pickup vectors is consistent with the sensitivity direction of the microphone. The microphone of the electronic equipment can better receive sound from the sensitivity direction of the microphone, and the microphone can realize directional pickup.

A piezoelectric microelectromechanical system microphone comprises a support substrate, a diaphragm including a piezoelectric material attached to the support substrate and configured to deform and generate an electrical potential responsive to impingement of sound waves on the diaphragm, and a compliant anchor formed of a material with a greater compliance than a compliance of the piezoelectric material, the compliant anchor defined in the diaphragm in an anchor region between the piezoelectric material of the diaphragm and the support substrate to improve sensitivity and reduce residual stress impact of the piezoelectric microelectromechanical system microphone.

Disclosed are a vibration sensor, an electronic device and a vibration detection method. The vibration sensor comprises a circuit board assembly, a housing, a chip assembly, a vibration-pickup assembly and a through-hole. A back cavity is formed inside the circuit board assembly, the housing is mounted over the circuit board assembly, and the chip assembly is provided on a side of the circuit board assembly proximate to the housing and is electrically connected to the circuit board assembly. The vibration-pickup assembly is provided inside the cavity and dividing the cavity into a first cavity and a second cavity. The through-hole of the vibration sensor may be in communication with the back cavity and the second cavity.

A dynamic capacitive sensor configuration is disclosed which imposes minimal force and resistance to motion on the moving electrode. Moving electrodes avoid adverse effects of large bias voltages such as pull-in instability, despite arbitrary levels of compliance. This configuration facilitates incorporation of highly compliant and thin electrode materials that present the least possible resistance to motion. This type of material is particularly useful for sensing sound. A large bias voltage can be applied without influencing its motion, e.g., 400 V. The electrical sensitivity to sound is high, e.g., approximately 0.5 volts / pascal, two orders of magnitude greater than typical acoustic sensors.

The invention discloses an MEMS microphone and an electronic device. The MEMS microphone comprises a substrate structure, a diaphragm structure, a support structure and a back electrode structure. The vibrating diaphragm structure is stacked on one side of the substrate structure, the vibrating diaphragm structure comprises a first functional area located in the center and a plurality of second functional areas connected to the peripheral side of the first functional area and arranged in pairs, and each pair of second functional areas are located on the two opposite sides of the first functional area respectively; the supporting structure is stacked on one side of the substrate structure and surrounds the outer side of the vibrating diaphragm structure, and the supporting structure comprises a supporting part and a plurality of functional parts corresponding to the plurality of second functional areas; the back electrode structure is stacked on the side, away from the substrate structure, of the supporting structure and can form a parallel plate capacitor with the first functional area, and when the voltage between the vibrating diaphragm structure and the back electrode structure is larger than a set value, the first functional area can be attracted to the back electrode structure, so that the second functional area can form an interdigital capacitor with the corresponding functional part.

A package includes a substrate having a first surface and an opposing second surface, a first cavity adjacent to the first surface of the substrate within the package, and a second cavity adjacent to the second surface of the substrate within the package, wherein the second cavity includes a fluid opening for allowing a fluid to enter the second cavity; a through hole in the substrate providing fluid communication between the first and second cavities; a MEMS sound transducer disposed in one of the first cavity or the second cavity; a MEMS pressure sensor disposed in the other one of the first cavity or the second cavity; and a discrete transfer block arranged on the substrate and configured to provide an electric path between the package pad and the MEMS sound transducer and the MEMS pressure sensor, wherein the transfer block is a discrete component separate from the substrate.

The invention relates to a MEMS component, in particular an acoustic transducer or pressure sensor, comprising: a substrate with a cavern and a mainland, an interaction element arranged above the cavern and connected to the mainland, where the interaction element is a bending beam, a boundary layer arranged at a distance from the bending beam via connecting elements, which defines a cavity with the bending beam, and a back plate located within the cavity, which is designed as a back electrode, wherein the back plate is designed to be stiffer with respect to the boundary layer and the bending beam, at least one electrode which forms a readable capacitance with a back electrode of the back plate in order to capacitively detect a deflection of at least one of the bending beam, the connecting elements and the boundary layer, at least one stop element which is designed to be displaced into a mechanical stop, wherein the stop element in the stop has at least one fluid flow resistance, in particular a fluid seal, between the cavity on a substrate-facing side and a volume on a substrate-facing side of the cavity.

Embodiments relate to systems and methods for compensating nonlinear distortions. The system receives a signal corresponding to an input sound pressure which is detected by a capacitive MEMS microphone. The capacitive MEMS microphone includes an active capacitance and a parasitic capacitance. The system determines a nonlinear relationship between the signal and the input sound pressure; and determines, based on the signal, an input parameter associated with the active capacitance and the parasitic capacitance. The system further determines an output signal based on the input parameter and the output signal and the input sound pressure have a linear relationship. The system compensates the signal based on the determined output signal and outputs the compensated signal as an output so that the output has the linear relationship with the input sound pressure.

Acoustic and other activity detection signaling is provided herein. Operations of a method can include determining a micro-electromechanical system (MEMS) device is no longer in an initialization state and receiving a first signal that instructs the MEMS device to perform event activity detection. The method can also include receiving one or more event signals and determining that an event signal of one or more event signals satisfies a defined event characteristic. The method can also include outputting a second signal that comprises information indicative of a detection of event activity at the MEMS device being more than the defined event characteristic.