521results about "Electrostatic transducer microphones" patented technology

The present application relates to an abnormal signal detection device using a dual acoustic wave sensor. The abnormal signal detection device using a dual acoustic wave sensor comprises: a housing including a first acoustic wave transmission portion and a second acoustic wave transmission portion; a base substrate located inside the housing and including a first surface and a second surface; a first acoustic wave sensor mounted on the first surface and converting an acoustic wave in a first band into a first electrical signal; a second acoustic wave sensor mounted on the second surface and converting an acoustic wave in a second band into a second electrical signal.

A MEMS audio device includes a first wafer having a top with a first cavity and a bottom with a vent hole coupled to the first cavity, wherein the bottom having first contacts, a second wafer disposed upon the first wafer having a flexible material layer disposed above the first cavity, a third wafer disposed upon the second wafer having physical contacts coupled to the second wafer, wherein the third wafer includes a second cavity disposed above the flexible material layer, a wiring wafer disposed below the first wafer having a second vent hole coupled to the first cavity, wherein the wiring wafer having second contacts coupled to the first contacts, and wherein the flexible material layer forms a diaphragm for the MEMS audio device.

A method for manufacturing a microelectromechanical systems (MEMS) microphone comprises depositing a membrane on a first sacrificial layer, wherein the first sacrificial layer is deposited on a substrate, etching the substrate to define a cavity, releasing the membrane by removing at least the first sacrificial layer, and forming at least one anchor at the edge of the membrane.

The invention discloses an underwater communication energy supply network system based on MEMS acoustic modulation and piezoelectric energy collection, which combines an MEMS acoustic modulation technology and the energy collection capability of a piezoelectric material to realize a self-energy-supply wireless communication network of underwater equipment. An underwater communication node in the system sends and receives sound wave signals in water through an MEMS acoustic transducer for data communication, and meanwhile, a piezoelectric energy collection module is used for converting electric energy from environmental mechanical vibration such as water flow and waves to provide continuous power supply for a communication module, a sensor and the like without depending on a battery or an external power supply. According to the system, the reliability and efficiency of underwater acoustic communication are improved by adopting a specific acoustic modulation strategy, and efficient storage and utilization of energy are realized through the energy management circuit, so that underwater nodes can stably operate for a long time. The method is suitable for marine environment monitoring, underwater Internet of Things and other scenes, and the cruising ability and the data transmission efficiency of the underwater sensor network are remarkably improved.

A microelectromechanical sensor component. The component includes: a substrate; a movable sensor structure connected to the substrate and having a seismic mass portion and a deflection electrode arranged thereon; and at least one evaluation electrode arranged on the substrate. The deflection electrode is arranged so as to be movable relative to the evaluation electrode. The evaluation electrode is configured for capacitive detection of a deflection of the deflection electrode. The deflection electrode and the evaluation electrode form a comb structure. The deflection electrode has a plurality of deflection electrode fingers extending from a deflection electrode bar in the direction of the evaluation electrode. The evaluation electrode has a plurality of evaluation electrode fingers extending, parallel at least in portions to the deflection electrode fingers, from an evaluation electrode bar in the direction of the deflection electrode.

Embodiments include an array microphone comprising a plurality of microphone sets arranged in a linear pattern relative to a first axis and configured to cover a plurality of frequency bands. Each microphone set comprises a first microphone arranged along the first axis and a second microphone arranged along a second axis orthogonal to the first microphone, wherein a distance between adjacent microphones along the first axis is selected from a first group consisting of whole number multiples of a first value, and within each element, a distance between the first and second microphones along the second axis is selected from a second group consisting of whole number multiples of a second value.

The invention discloses an MEMS device and a manufacturing method thereof, and the method comprises the steps: forming a first MEMS structure: providing a first substrate, forming a first sensing layer on the first substrate, and sequentially forming a first cavity and a second sensing layer on the first sensing layer; forming a second MEMS structure: providing a second substrate, forming a third sensing layer on the second substrate, and sequentially forming a second cavity and a fourth sensing layer on the third sensing layer; bonding the second sensing layer and the fourth sensing layer to form a common sensing layer; the part, corresponding to the first cavity, of the first substrate is removed, and the first sensing layer forms a movable sensing layer. According to the MEMS device and the manufacturing method thereof provided by the invention, the stacked double-layer capacitor structure is prepared by adopting a heterogeneous bonding mode, the process is simple, the implementation is high, the prepared device structure does not need to be plugged, the problem that the sensing layer is uneven due to hole plugging is avoided, and the reliability of the device is improved. The reliability problems of air leakage and the like of the hole blocking structure caused by repeated pressure measurement motion of the upper-layer pressure sensing film of the sealing cavity are also avoided, and the service life and the yield of the device are improved.

Provided is an acoustic processing apparatus in which a microelectromechanical systems (MEMS) device is effectively arranged. The acoustic processing apparatus includes an enclosure, a sound duct extending from the enclosure, and a MEMS device housed in the sound duct.

The present disclosure discloses a microphone including a shell, a printed circuit board enclosing a cavity together with the shell, a first chip assembly located in the cavity, and a second chip assembly embedded and accommodated in the printed circuit board. The printed circuit board is a multilayer structure including a chip mounting layer, a first alignment layer, a plurality of shielding layers, a second alignment layer, and an SMT layer arranged in sequence, each of the plurality of shielding layers is connected with a grounding point of the printed circuit board and provided with an avoiding aperture running through it. Compared with the related art, the microphone disclosed by the present disclosure could avoid a heat generated by the operation of the first AISC chip and the second ASIC chip affecting the performance of other devices.

The invention relates to the technical field of chip packaging, in particular to a packaging structure and a microphone. The packaging structure comprises a shell and a substrate, a packaging cavity is defined by the shell and the substrate, a mounting groove is formed in the side, facing the packaging cavity, of the substrate, a sound hole is formed in the mounting groove, the packaging structure further comprises an MEMS chip and an ASIC chip, at least part of the MEMS chip is arranged in the mounting groove in the height direction of the substrate and communicated with the sound hole, and the ASIC chip is arranged in the mounting groove and communicated with the sound hole. The mounting groove is arranged on one side, facing the packaging cavity, of the substrate and electrically connected with the MEMS chip and the substrate, and the bonding part is arranged between the MEMS chip and the mounting groove and connected with the MEMS chip and the mounting groove. Sunken installation of the MEMS chip is achieved through the installation groove, lamination occupation in the height direction is reduced, the overall packaging height is reduced, the bonding part achieves fixed positioning and sealing through a gap in the groove, the risk that a thick glue layer at the bottom occupies high is reduced, the assembling stability and the sealing reliability are improved, and therefore the structural strength of the substrate is guaranteed after the packaging height is further compressed.

A lavalier microphone has improved dynamic range. The lavalier microphone incorporates a pair of microphone transducer elements into the same housing or attached housings, with one of the microphone transducer elements being more sensitive to acoustic input than the other. The voltage signals from the respective transducer elements are processed and combined, resulting in a digital output audio signal with improved signal to noise both at lower and higher input acoustic levels.

Operating an electrostatic acoustic device simultaneously as a speaker and as a microphone. The electrostatic acoustic device includes a membrane and an electrode disposed proximate to the membrane. An input varying audio signal is input to the electrostatic acoustic device. The membrane is configured to respond mechanically to a varying electric field responsive to the varying audio signal input. A portion of the input varying audio signal is tapped to produce a reference signal. A signal is detected responsive to motion of the membrane, to convert the signal to an output varying voltage signal. The output varying voltage signal is compared to the reference signal to produce a microphone signal. The microphone signal is responsive to motion of the membrane induced by air pressure variations of ambient sound.

A MEMS device comprises a housing with an interior volume, wherein the housing comprises an access port to the interior volume; a MEMS sound transducer in the housing, and a mechanical barrier structure having a plate element which is fixed by means of elastic spacers to a carrier and overlaps the access port, and providing a ventilation path passing a boundary region of the plate element, wherein a clearance of the ventilation path is set by the distance of the boundary region of the plate element to the housing or by the distance of the boundary region of the plate element to a blocking structure which opposes the boundary region of the plate element.

An MEMS microphone includes a substrate with a back cavity and a capacitor system arranged on the substrate. The capacitor system includes a back plate and a diaphragm opposite to and spaced apart from the back plate. Surface of the back plate facing diaphragm or surface of diaphragm facing the back plate being provided with an anti-adhesion member. When the diaphragm moves until the anti-adhesion member is in contact with the diaphragm and the back plate at the same time, the anti-adhesion member is elastically deformable along a vibrating direction of the diaphragm. The anti-adhesion member of the present disclosure is elastic and may provide cushioning for movement of the diaphragm, which prevents rapid concentration of stress at a position of the diaphragm in contact with the anti-adhesion member, thereby preventing formation of pits in the diaphragm and preventing breakage of the diaphragm under repeated impact of the anti-adhesion member.

A microphone, comprising a housing (1), a circuit board (2) covering and fixed to the housing (1) and defining a first cavity (104) and a second cavity (105) together with the housing (1), a first chip assembly (3) fixed on the side of the circuit board (2) close to the housing (1) and located in the first cavity (104), and a second chip assembly (4) fixed on the side of the circuit board (2) close to the housing (1) and located in the second cavity (105), wherein the first chip assembly (3) comprises a first ASIC chip (301) and a first MEMS chip (302), and the second chip assembly (4) comprises a second ASIC chip (401) and a second MEMS chip (402). The microphone further comprises a first metal layer (5) fixed on the side of the circuit board (2) close to the housing (1) and surrounding both the first chip assembly (3) and the second chip assembly (4). The microphone can prevent the problem that heat generated by operation of the ASIC chips affects performance of other components by means of heat conduction via a substrate of the circuit board (2) or heat dissipation via thermal motion of air.

A kind of heart sound sensing structure and its preparation method, the structure includes double SOI substrate, center mass, elastic support beam, piezoresistive sensing unit and capacitive sensing unit.The front surface of center mass is provided with additional mass layer, and the back surface is kept bottom layer silicon to increase thickness;Elastic support beam connects mass and frame;Piezoresistive sensing unit is composed of four piezoresistors to form wheatstone bridge, and capacitive sensing unit includes movable and fixed comb-tooth capacitive plate crossing each other.When the sound pressure gradient of heart sound signal drives mass to deviate, elastic support beam bends to change piezoresistive value, and at the same time, comb-tooth capacitive plate overlapping area changes to cause capacitive value change, to realize piezoresistive and capacitive dual-mode synchronous detection.Two kinds of detection mechanisms calibrate each other, which significantly improves the sensitivity and anti-interference ability of low-frequency heart sound signal.The preparation method is based on double SOI substrate, integrated by ion implantation, etching, metal deposition and 3D printing process, suitable for miniaturized wearable heart sound monitoring application.

The invention discloses a composite film, a composite film preparation method and a microphone. The composite membrane comprises a fiber membrane layer, the fiber membrane layer is provided with a plurality of pores, the pores are filled with silicone rubber filler, and / or at least one surface of the fiber membrane layer in the thickness direction is covered with a silicone rubber layer. The fiber membrane layer can provide high mechanical strength for the composite membrane, and the silicone rubber filler filled in the gaps and / or the silicone rubber layer covering the surface of the fiber membrane layer can improve the waterproof performance of the composite membrane, so that the overall strength and waterproof performance of the composite membrane can be improved.

The present invention relates to a microelectromechanical system (MEMS) (100) comprising a MEMS component (110) with a surface (120) and at least one contact column (1) having a top surface (2) on the surface (120), wherein the top surface (2) comprises a conductive material (4) and is designed and configured to supply the MEMS component (110) with a supply and / or signal voltage (130). The invention further relates to a method for manufacturing such a MEMS (100) with at least one contact column (1) and to the use of the MEMS (100) according to the invention in systems for interacting with fluids.

A MEMS microphone according to the present embodiment comprises: a first substrate; a second substrate disposed on the first substrate; an adhesive layer disposed between the first and second substrates; a MEMS structure disposed on the second substrate; a signal processing device disposed on the second substrate and spaced apart from the MEMS structure; and a capacitor disposed to be spaced apart from the MEMS structure and the signal processing device, wherein the capacitor comprises a first external electrode and a second external electrode disposed at opposite ends thereof, and a plurality of internal electrodes and dielectric layers disposed between the first external electrode and the second external electrode, and the first substrate, the second substrate, and the MEMS structure are stacked in a first direction, while the plurality of internal electrodes are stacked in a second direction perpendicular to the first direction.

The invention discloses an MEMS sensor and an electro-acoustic conversion device, and the MEMS sensor comprises a vibrating diaphragm which comprises a first diaphragm and a second diaphragm which are oppositely arranged, and an accommodation space is formed between the first diaphragm and the second diaphragm; the counter electrode is arranged in the accommodating space; the vibrating diaphragm is provided with a first area and a second area, the second area is located in the peripheral direction of the first area, in the first area, the surface of the side, away from the second diaphragm, of the first diaphragm is covered with a first electrode, the surface of the side, away from the first diaphragm, of the second diaphragm is covered with a second electrode, and the first electrode and the second electrode are oppositely arranged; at least in the second area, the side, away from the second membrane, of the first membrane is covered with an additional membrane layer. Compared with the prior art, the MEMS sensor has the advantages that the additional film layer covers the first film, so that the material loss of the first film in the etching processing process is compensated, the symmetry of the MEMS sensor is improved, and the performance of the MEMS sensor is improved.

Systems and methods for a MEMS microphone package are disclosed. The MEMS microphone package may include a first port to direct sound to a MEMS system, including a die substrate, an acoustic membrane, and one or more plates. The MEMS microphone package may include an ASIC to produce microphone output based on an electrical signal, a PCB, a lid, and a second port. The first port and the second port may define a front volume and a back volume respectively. The second port may increase the back volume to improve sensitivity and reduce the acoustic sensor's noise floor to improve signal-to-noise ratio.

An attenuator circuit includes a microelectromechanical system (MEMS) device having an output for providing an analog output voltage; a switch having a first controlled node coupled to an output of the MEMS device, a second controlled node for receiving a replica analog output voltage, and a control node for receiving a control signal; and a capacitor coupled to the switch.

This document discloses a microelectromechanical system (MEMS) magnetic sensor unit, its calibration and manufacturing method, and an electronic device thereof. The calibration method includes: scanning a DC bias voltage on the MEMS magnetic sensor using a fixed AC excitation; obtaining a first DC bias voltage corresponding to the maximum AC output amplitude of the MEMS magnetic sensor; applying the first DC bias voltage to the MEMS magnetic sensor; applying acoustic source excitation to the MEMS magnetic sensor; measuring a first output sensitivity of the MEMS magnetic sensor; and obtaining the gain parameters of the ASIC chip corresponding to the MEMS magnetic sensor based on the first output sensitivity.

Provided is an MEMS sensor module, comprising a side wall (1) enclosing a cavity, a first circuit board (2), a second circuit board (3), a partition wall (4) dividing the cavity into a first cavity (11) and a second cavity (12), a first MEMS sensor assembly (5) arranged in the first cavity (11) and encapsulated by glue (6), a second MEMS sensor assembly (7) arranged in the second cavity, a first gold finger layer (8) arranged between the side wall (1) and the partition wall (4) and the first circuit board (2), and a second gold finger layer (9) arranged between the side wall (1) and the partition wall (4) and the second circuit board (3), wherein the first gold finger layer (8) surrounds both the first cavity (11) and the second cavity (12), the second gold finger layer (9) surrounds both the first cavity (11) and the second cavity (12), and the first gold finger layer (8) at the partition wall (4) is provided with a slot (80) communicating the first cavity (11) with the second cavity (12). The MEMS sensor module can prevent a large amount of heat generated by an ASIC chip of one MEMS sensor assembly during operation from affecting the other MEMS sensor assembly.

A microphone includes a microelectromechanical system (MEMS) device responsive to sound waves or vibrations having an output coupled to a first node; a programmable gain amplifier or source follower having an input coupled to a second node, and an output for generating an analog signal, wherein the MEMS device output and the programmable gain amplifier or source follower input comprise a first nonlinear equivalent capacitance having a first capacitance-to-voltage (CV) profile; and a nonlinear capacitance component coupled to the first node, the second node, and at least one reference voltage node, wherein the nonlinear capacitance component comprises a second nonlinear equivalent capacitance having a second CV profile.

A display device in which a front electrode serving as a diaphragm in a condenser-type microphone module is disposed on one surface of a display panel, and a rear electrode is disposed under a frame, so that a change in capacitance between the front electrode and the rear electrode caused by the vibration of the front electrode is sensed with high sensitivity. Accordingly, the condenser-type high-sensitivity microphone can be integrated into the display device.

In an example, the present invention provides a micro-speaker device. The device has a movable diaphragm device comprising a thickness of silicon or graphene material which has a first surface and a second surface opposite of the first surface and sensor to track position of the diaphragm. The device has a housing enclosing the movable diaphragm device, the electrode device and an encapsulation device. The electrode device can be part of a CMOS device with electronics integrated on to the device that converts input audio signal in to signal that electrostatically actuates the micro-speaker from one or more surfaces.

The utility model relates to the technical field of electronic microphones, and discloses a vibration-proof noise-reduction silicon microphone, which comprises a metal shell, the inner wall of the metal shell is fixedly connected with a mounting seat, the inner wall of the mounting seat is provided with a noise-reduction sound-transmission assembly, the inner wall of the metal shell is fixedly connected with an elastic steel sheet, and the elastic steel sheet is provided with a vibration-reduction sound-transmission assembly. The inner wall of the elastic steel sheet is fixedly connected with four silica gel supports in a circumferential array, and a substrate is arranged in the metal shell. According to the silicon microphone capable of preventing vibration and reducing noise, noise interference can be effectively reduced and the definition and the purity of audio acquisition can be improved through the arrangement of the noise reduction sound transmission assembly and the acoustic resistance matching film, and then low-frequency vibration can be absorbed and the transmission efficiency of mechanical energy can be reduced through the action of the silica gel bracket and the micro spring; under the action of the silica gel shock pad, high-frequency shock can be reduced, and meanwhile, the elastic steel sheet can provide buffering of low-and-medium-frequency shock, so that multi-stage shock absorption can be formed, the audio quality can be remarkably improved, and the device can keep stable performance output in various environments.

The application provides a method, system, device and medium for reducing microphone howling, and relates to the technical field of audio signal processing, and the method comprises the following steps: acquiring sound signals collected by a silicon microphone array arranged in a vehicle compartment; determining spatial position coordinates of a handheld microphone in the vehicle compartment according to the sound signals; controlling the silicon microphone array to generate a sound pickup beam following the spatial position coordinates; acquiring position information of a loudspeaker in the vehicle compartment; controlling the sound pickup beam to form a low-gain area in a direction pointing to the position of the loudspeaker according to the position information, wherein the low-gain area is an area for performing attenuation processing on the sound signals; performing enhancement processing on an initial sound signal processed by a directional beam to generate a target sound signal; and outputting the target sound signal to the loudspeaker to enable the loudspeaker to play the target sound signal. The application has the technical effect of reducing the influence on the naturalness and clarity of sound quality when suppressing howling.