788results about "Electrostatic transducer microphones" patented technology

A method of making an acoustic sensor includes forming or providing a mold having one or more grooves extending in a direction of the length of the mold to a distal end of the mold. The method also includes forming or depositing a structure having one or more piezoelectric layers over the top surface of the mold to define a beam with a proximal portion and a distal portion, the distal portion having a corrugated section including one or more grooves that correspond to the one or more grooves of the mold. The method also includes forming or applying an electrode to the proximal portion of the structure and releasing the structure from the mold to form one or more cantilever beams. The corrugated section inhibits bending of the corrugated section along the length of the distal portion of the structure when the acoustic sensor is subjected to sound pressure.

A logarithmic amplifier includes programmable gain amplifiers each having a different gain, wherein an input of each of the programmable gain amplifiers is coupled to an input of the logarithmic amplifier; and a summing circuit having inputs coupled to a corresponding output of each of the programmable gain amplifiers and an output coupled to an output of the logarithmic amplifier, wherein the summing circuit generates a logarithmic transfer function having piecewise linear segments.

Disclosed in the present invention is a high-dynamic capacitive digital microphone system based on electrostatic force feedback. The system comprises an MEMS microphone and an interface circuit chip thereof, wherein the interface circuit chip comprises a charge pump, an analog front end, an analog-to-digital conversion circuit, an amplitude detection module, an amplitude adjustment control module and a pulse density modulation module. In the present invention, the characteristic of the sensitivity being able to be adjusted by means of changing a bias voltage by a capacitive sensor is used, and a charge pump with an adjustable output voltage is used to provide electrostatic force feedback, thereby further expanding the adjustable range of a front-end gain, and also reducing requirements for the noise performance of a readout circuit. Therefore, the system in the present application has the characteristics of high dynamic range and high-precision quantization.

In an example, the present invention provides a micro-speaker device. The device has a movable diaphragm device comprising a thickness of silicon or graphene material which has a first surface and a second surface opposite of the first surface and sensor to track position of the diaphragm. The device has a housing enclosing the movable diaphragm device, the electrode device and an encapsulation device. The electrode device can be part of a CMOS device with electronics integrated on to the device that converts input audio signal in to signal that electrostatically actuates the micro-speaker from one or more surfaces.

A digital microphone includes at least one integrator; a state detection and parameter control component directly coupled to an output of the integrator; and a signal processing component coupled to an output of the state detection and parameter control component, wherein a parameter of the signal processing component includes a first value in a first operational mode and a second value in a second operational mode different from the first operational mode.

The invention provides electronic equipment and a pickup device, the electronic equipment is provided with an appearance surface, the appearance surface is provided with a first pickup port and a plurality of second pickup ports distributed at intervals, and each second pickup port and the first pickup port are arranged at intervals; a microphone, a first sound channel and a plurality of second sound channels are arranged in the electronic equipment, the first sound channel is communicated with the first pickup port and a first cavity of the microphone, the second sound channels are communicated with the second pickup ports in a one-to-one correspondence mode, and the second sound channels are communicated with a second cavity of the microphone. And the first cavity of the microphone and the second cavity of the microphone are respectively positioned on two sides of a vibrating diaphragm of the microphone. A plurality of pickup vectors can be formed between the plurality of second pickup ports and the first pickup port. A vector obtained by adding the plurality of pickup vectors is consistent with the sensitivity direction of the microphone. The microphone of the electronic equipment can better receive sound from the sensitivity direction of the microphone, and the microphone can realize directional pickup.

A piezoelectric microelectromechanical system microphone comprises a support substrate, a diaphragm including a piezoelectric material attached to the support substrate and configured to deform and generate an electrical potential responsive to impingement of sound waves on the diaphragm, and a compliant anchor formed of a material with a greater compliance than a compliance of the piezoelectric material, the compliant anchor defined in the diaphragm in an anchor region between the piezoelectric material of the diaphragm and the support substrate to improve sensitivity and reduce residual stress impact of the piezoelectric microelectromechanical system microphone.

The invention discloses a highly dustproof MEMS microphone packaging substrate and a processing method thereof. The highly dustproof MEMS microphone packaging substrate is characterized in that a capacitor-embedded resistor-embedded substrate is provided with a sound hole processing area; the two outermost layers of the capacitor-embedded resistor-embedded substrate are respectively covered with an ultrathin copper layer, and a window is manufactured on one ultrathin copper layer at a position corresponding to a sound hole processing area through a pattern manufacturing process. And after the position, corresponding to the sound hole machining area, on the other ultrathin copper layer is thickened, a copper net pattern formed by connecting a plurality of copper wires in a crossed mode is manufactured. Based on the window, at least part of the sound hole machining area is hollowed out through a laser groove burning technology, and a sound hole communicated with the copper net pattern is manufactured; cleaning the sound hole and the copper mesh pattern; and plating a protective layer on the copper net pattern. The processing method is novel and reasonable, the obtained MEMS microphone packaging substrate has the advantages of being small in size, thin in structure, excellent in ventilation and dustproof performance, high in sound transmission quality, high in reliability, high in anti-interference performance and the like, and market requirements are met.

The invention discloses a combined sensor and electronic equipment, and relates to the technical field of sensors, the combined sensor comprises a packaging shell, an MEMS chip and an ASIC chip which are in signal connection, a waterproof breathable film and a water residue detection assembly, the packaging shell forms a containing cavity and is provided with a breathable hole communicating the containing cavity with the external environment, the MEMS chip is arranged in the containing cavity, and the ASIC chip is arranged in the waterproof breathable film. The ASIC chip is arranged in the accommodating cavity or embedded in the packaging shell; the waterproof breathable film covers the breathable hole, the water residue detection assembly is arranged on the packaging shell and corresponds to the waterproof breathable film, and the water residue detection assembly is in signal connection with the ASIC chip; the water residue detection assembly is used for detecting whether water residues exist at the waterproof breathable film or not, and the ASIC chip is used for starting heating to remove the water residues when detecting that the water residues exist. According to the technical scheme, the waterproof requirement can be met, and meanwhile the measurement precision of the acoustic signal and the air pressure signal is improved.

The invention relates to a microelectromechanical sensor (10) for measuring an environmental variable (12) of a sensor environment (16), comprising at least one deflection element (20) which can be deflected in a vertical direction (18) depending on the environmental variable (12), at least one counter electrode (32), at least one electrode surface (34) which is coupled to the deflection element (20) and which can be moved relative to the counter electrode (32) depending on the deflection of the deflection element (20) by changing an electrode spacing (38) and which faces the counter electrode (32), wherein stiffening means (44) are arranged between the electrode surface (34) and the deflection element (20),which extend in a first direction (48) perpendicular to the vertical direction (18) alternating with at least one free first gap (50) between the deflection element (20) and the electrode surface (34) and in a second direction (52) perpendicular to the vertical direction (18) and the first direction (48) alternating with at least one free second gap (54) between the deflection element (20) and the electrode surface (34) and which connect the electrode surface (34) and the deflection element (20) to one another at a distance in the vertical direction (18).

A vibration sensor (200) is provided, comprising: a vibration receiver (210) including a housing (211) and a vibration unit (212), the housing (211) forming an acoustic cavity, the vibration unit (212) being located in the acoustic cavity and separating the acoustic cavity into a first acoustic cavity (213) and a second acoustic cavity (214); and an acoustic transducer (220) acoustically connected to the first acoustic cavity (213). The housing (211) is configured to generate a vibration based on an external vibration signal, the vibration unit (212) changes an acoustic pressure within the first acoustic cavity (213) in response to the vibration of the housing (211), causing the acoustic transducer (220) to generate an electrical signal. The vibration unit (212) includes a quality element (2121) and an elastic element (2122), an area of the quality element (2121) on a side away from the acoustic transducer (220) is smaller than an area of the quality element (2121) on a side close to the acoustic transducer. The elastic element (2122) is connected around a side wall of the quality element (2121).

The invention provides a microphone and an electronic device. The microphone comprises a substrate, a sound hole arranged on the substrate, and an MEMS chip covering the sound hole. A conduction cavity is arranged in the substrate, the sound holes comprise a first sound hole and a second sound hole, one side of the conduction cavity is conducted with the outside through the first sound hole, and the other side of the conduction cavity is conducted with the MEMS chip through the second sound hole; the MEMS chip is conducted with the outside through the second sound hole, the conduction cavity and the first sound hole in sequence; a partition assembly is arranged in the communicating cavity and used for shunting and buffering air flow entering the communicating cavity. According to the invention, the airflow impact resistance of the microphone can be improved.

The present application relates to an abnormal signal detection device using a dual acoustic wave sensor. The abnormal signal detection device using a dual acoustic wave sensor comprises: a housing including a first acoustic wave transmission portion and a second acoustic wave transmission portion; a base substrate located inside the housing and including a first surface and a second surface; a first acoustic wave sensor mounted on the first surface and converting an acoustic wave in a first band into a first electrical signal; a second acoustic wave sensor mounted on the second surface and converting an acoustic wave in a second band into a second electrical signal.

A MEMS audio device includes a first wafer having a top with a first cavity and a bottom with a vent hole coupled to the first cavity, wherein the bottom having first contacts, a second wafer disposed upon the first wafer having a flexible material layer disposed above the first cavity, a third wafer disposed upon the second wafer having physical contacts coupled to the second wafer, wherein the third wafer includes a second cavity disposed above the flexible material layer, a wiring wafer disposed below the first wafer having a second vent hole coupled to the first cavity, wherein the wiring wafer having second contacts coupled to the first contacts, and wherein the flexible material layer forms a diaphragm for the MEMS audio device.

The invention relates to the technical field of microelectronics, and provides an MEMS microphone and a preparation method thereof, and an electronic device, the microphone comprises a substrate, the substrate comprises a first wafer and a first sacrificial layer, the first wafer is provided with a sealed cavity diaphragm, the first sacrificial layer is used for separating the sealed cavity diaphragm from the first wafer, and the substrate comprises a sound transmission hole penetrating through the first wafer and the first sacrificial layer; a second wafer on which a back plate is prepared; wherein the first wafer and the second wafer are bonded in a low-pressure environment, so that the sealed cavity vibrating diaphragm and the back plate form a capacitor. According to the method, the signal-to-noise ratio of the microphone is improved, and the reliability of the MEMS microphone is enhanced.

A MEMS acoustic sensing chip, a microphone, and an electronic device are disclosed in embodiments of the present disclosure. The MEMS acoustic sensing chip includes a substrate, a first diaphragm, a second diaphragm, a backplate, and a support structure, the substrate being provided with a back cavity; the first diaphragm, the second diaphragm, and the backplate are provided on one side of the substrate through the support structure, the first diaphragm and the second diaphragm are provided with an inner cavity therebetween, and the backplate is suspended in the inner cavity; the support structure is provided with a vent hole, the vent hole being in communication with the back cavity and being independent of the inner cavity; and at least one of the first diaphragm and the second diaphragm is provided with a release hole, which is in communication with the inner cavity.

A head-mounted device for generating binaural audio content includes a first rod coupled to a first microphone housing enclosing a first front microphone and a first rear microphone, respectively, that generate acoustic signals. The first microphone housing includes a first front port facing downward and a first rear port facing rearward. The apparatus includes a second rod coupled to a second microphone housing enclosing a second front microphone and a second rear microphone, respectively, that generate acoustic signals. The second microphone housing includes a second front port facing downward and a second rear port facing rearward. In one embodiment, an apparatus includes a binaural audio processor including a beamformer and a storage device. The beamformer generates a first beamformer signal based on acoustic signals from the first front microphone and the first rear microphone and a second beamformer signal based on acoustic signals from the second front microphone and the second rear microphone. A storage device stores the first and second beamformer signals as a two-channel file.

An electronic device includes a substrate, a sensor, an inner cover, a water proof member, and an outer cover. The sensor is disposed on the substrate. The inner cover is disposed on the substrate and covers the sensor. The inner cover includes an opening. The water proof member is disposed on the inner cover and covers the opening. The outer cover is disposed on the substrate and covers the inner cover, so that a drainage chamber is formed between the inner cover and the outer cover. The drainage chamber communicates with outside through a first hole and a second hole. The first hole and the second hole are staggered with the opening. A portion of the drainage chamber between the first hole and the second hole acts as a drainage channel. A length of the drainage channel is greater than a diameter of the opening.

Acoustic and other activity detection signaling is provided herein. Operations of a method can include determining a micro-electromechanical system (MEMS) device is no longer in an initialization state and receiving a first signal that instructs the MEMS device to perform event activity detection. The method can also include receiving one or more event signals and determining that an event signal of one or more event signals satisfies a defined event characteristic. The method can also include outputting a second signal that comprises information indicative of a detection of event activity at the MEMS device being more than the defined event characteristic.

A method for manufacturing a microelectromechanical systems (MEMS) microphone comprises depositing a membrane on a first sacrificial layer, wherein the first sacrificial layer is deposited on a substrate, etching the substrate to define a cavity, releasing the membrane by removing at least the first sacrificial layer, and forming at least one anchor at the edge of the membrane.

An electrostatic transducer that enables improvement of detection accuracy or driving precision while allowing flexibility is provided. The electrostatic transducer (1) is provided with: an insulator sheet (11); at least one electrode sheet (12) which is laminated on the insulator sheet (11), constitutes a target region to be used as a detection region or a driving region, is formed of an elastomer comprising a conductive filler, and includes at least one terminal part (12b); and at least one bypass conductor (13) which has an electrical resistivity less than that of the electrode sheet (12), is disposed in contact with the electrode sheet (12) along the surface of a part of the electrode sheet (12), and is electrically connected to the electrode sheet (12) in the area in contact with the electrode sheet (12).

The invention discloses an underwater communication energy supply network system based on MEMS acoustic modulation and piezoelectric energy collection, which combines an MEMS acoustic modulation technology and the energy collection capability of a piezoelectric material to realize a self-energy-supply wireless communication network of underwater equipment. An underwater communication node in the system sends and receives sound wave signals in water through an MEMS acoustic transducer for data communication, and meanwhile, a piezoelectric energy collection module is used for converting electric energy from environmental mechanical vibration such as water flow and waves to provide continuous power supply for a communication module, a sensor and the like without depending on a battery or an external power supply. According to the system, the reliability and efficiency of underwater acoustic communication are improved by adopting a specific acoustic modulation strategy, and efficient storage and utilization of energy are realized through the energy management circuit, so that underwater nodes can stably operate for a long time. The method is suitable for marine environment monitoring, underwater Internet of Things and other scenes, and the cruising ability and the data transmission efficiency of the underwater sensor network are remarkably improved.

The invention provides an MEMS microphone and a manufacturing method thereof.The MEMS microphone comprises a substrate with a cavity, a vibrating diaphragm supported on the substrate and a back plate spaced from the vibrating diaphragm, the vibrating diaphragm comprises a fixing part fixedly connected with the substrate and a vibrating part suspended above the cavity, and the fixing part is fixedly connected with the substrate. The vibration part comprises a plane part, a plurality of concave diaphragm parts arranged on the plane part at intervals and a connecting part for connecting the plane part and the concave diaphragm parts, each concave diaphragm part comprises a first silicon nitride layer, a silicon oxide layer and a second silicon nitride layer which are sequentially stacked along the vibration direction of the diaphragm, and the first silicon nitride layer is closer to the substrate than the second silicon nitride layer. According to the MEMS microphone, the composite material is adopted to manufacture the vibrating diaphragm with the corrugated shape, the vibrating diaphragm can generate large displacement under sound pressure, so that high sensitivity is obtained, the corrugated vibrating diaphragm made of the composite material can decompose stress, the strength of the vibrating diaphragm is enhanced, and the reliability of the MEMS microphone is improved.

The invention discloses an MEMS sensor, a microphone module and electronic equipment, and relates to the technical field of electronic equipment, the MEMS sensor comprises a substrate and at least one capacitor system arranged on the substrate, the capacitor system comprises a backboard, a first vibrating diaphragm and a second vibrating diaphragm, and the first vibrating diaphragm and the second vibrating diaphragm are arranged on the two sides of the backboard; a connecting column is arranged between the first vibrating diaphragm and the second vibrating diaphragm, and under the connection of the connecting column, the connecting rigidity between the first vibrating diaphragm and the second vibrating diaphragm is greater than the vibrating diaphragm bending rigidity of the first vibrating diaphragm and the second vibrating diaphragm; and / or, the distance between the back plate and the first vibrating diaphragm is a first polar plate distance, the distance between the back plate and the second vibrating diaphragm is a second polar plate distance, the first polar plate distance is in negative correlation with the vibrating diaphragm bending rigidity of the first vibrating diaphragm, and the second polar plate distance is in negative correlation with the vibrating diaphragm bending rigidity of the second vibrating diaphragm. The invention provides an MEMS sensor. The MEMS sensor solves the technical problem that the sensitivity of vibrating diaphragms of an existing MEMS sensor is inconsistent.

A microelectromechanical sensor component. The component includes: a substrate; a movable sensor structure connected to the substrate and having a seismic mass portion and a deflection electrode arranged thereon; and at least one evaluation electrode arranged on the substrate. The deflection electrode is arranged so as to be movable relative to the evaluation electrode. The evaluation electrode is configured for capacitive detection of a deflection of the deflection electrode. The deflection electrode and the evaluation electrode form a comb structure. The deflection electrode has a plurality of deflection electrode fingers extending from a deflection electrode bar in the direction of the evaluation electrode. The evaluation electrode has a plurality of evaluation electrode fingers extending, parallel at least in portions to the deflection electrode fingers, from an evaluation electrode bar in the direction of the deflection electrode.

The present disclosure provides a capacitive microphone (100, 800, 1000) comprising a diaphragm (120) and a backplate (130). The diaphragm (120) is provided with a first hole array (121) that allows airflow to pass through, and the backplate (130) is provided with a second hole array (131) that allows airflow to pass through. The diaphragm (120) and the backplate (130) are spaced apart from each other to form a capacitor.

A method of operating a microelectromechanical system (MEMS) includes, in a first operational mode, converting an analog output of the MEMS into a first internal data stream and a first external data stream having a first sampling rate; transitioning from the first operational mode to a second operation mode without restarting the MEMS; and in the second operational mode, converting the analog output of the MEMS into a second internal data stream having a second sampling rate different from the first sampling rate, and performing a sampling rate conversion of the second internal data stream to generate a second external data stream.

A semiconductor integrated circuit device capable of inputting a signal of a MEMS transducer 2 includes: a power supply circuit 11 for the MEMS transducer 2; an input amplifier 12 for inputting and amplifying a signal of the MEMS transducer 2; a line driver 13 for amplifying an output from the input amplifier 12 and allowing for driving of a load connected to an output terminal T3, the line driver 13 having an input terminal; and the output terminal T3 for outputting an output of the line driver 13, wherein the power supply circuit 11, the input amplifier 12, and the line driver 13 are integrally formed on a semiconductor substrate, and wherein a gain setting circuit 14 for determining gain of the line driver 13 and a DC potential of the output terminal T3 is connected to the input terminal of the line driver 13.

Embodiments include an array microphone comprising a plurality of microphone sets arranged in a linear pattern relative to a first axis and configured to cover a plurality of frequency bands. Each microphone set comprises a first microphone arranged along the first axis and a second microphone arranged along a second axis orthogonal to the first microphone, wherein a distance between adjacent microphones along the first axis is selected from a first group consisting of whole number multiples of a first value, and within each element, a distance between the first and second microphones along the second axis is selected from a second group consisting of whole number multiples of a second value.

The invention discloses an MEMS device and a manufacturing method thereof, and the method comprises the steps: forming a first MEMS structure: providing a first substrate, forming a first sensing layer on the first substrate, and sequentially forming a first cavity and a second sensing layer on the first sensing layer; forming a second MEMS structure: providing a second substrate, forming a third sensing layer on the second substrate, and sequentially forming a second cavity and a fourth sensing layer on the third sensing layer; bonding the second sensing layer and the fourth sensing layer to form a common sensing layer; the part, corresponding to the first cavity, of the first substrate is removed, and the first sensing layer forms a movable sensing layer. According to the MEMS device and the manufacturing method thereof provided by the invention, the stacked double-layer capacitor structure is prepared by adopting a heterogeneous bonding mode, the process is simple, the implementation is high, the prepared device structure does not need to be plugged, the problem that the sensing layer is uneven due to hole plugging is avoided, and the reliability of the device is improved. The reliability problems of air leakage and the like of the hole blocking structure caused by repeated pressure measurement motion of the upper-layer pressure sensing film of the sealing cavity are also avoided, and the service life and the yield of the device are improved.