102results about "Electrostatic transducer microphones" patented technology

A kind of heart sound sensing structure and its preparation method, the structure includes double SOI substrate, center mass, elastic support beam, piezoresistive sensing unit and capacitive sensing unit.The front surface of center mass is provided with additional mass layer, and the back surface is kept bottom layer silicon to increase thickness;Elastic support beam connects mass and frame;Piezoresistive sensing unit is composed of four piezoresistors to form wheatstone bridge, and capacitive sensing unit includes movable and fixed comb-tooth capacitive plate crossing each other.When the sound pressure gradient of heart sound signal drives mass to deviate, elastic support beam bends to change piezoresistive value, and at the same time, comb-tooth capacitive plate overlapping area changes to cause capacitive value change, to realize piezoresistive and capacitive dual-mode synchronous detection.Two kinds of detection mechanisms calibrate each other, which significantly improves the sensitivity and anti-interference ability of low-frequency heart sound signal.The preparation method is based on double SOI substrate, integrated by ion implantation, etching, metal deposition and 3D printing process, suitable for miniaturized wearable heart sound monitoring application.

The present invention relates to a microelectromechanical system (MEMS) (100) comprising a MEMS component (110) with a surface (120) and at least one contact column (1) having a top surface (2) on the surface (120), wherein the top surface (2) comprises a conductive material (4) and is designed and configured to supply the MEMS component (110) with a supply and / or signal voltage (130). The invention further relates to a method for manufacturing such a MEMS (100) with at least one contact column (1) and to the use of the MEMS (100) according to the invention in systems for interacting with fluids.

A MEMS microphone according to the present embodiment comprises: a first substrate; a second substrate disposed on the first substrate; an adhesive layer disposed between the first and second substrates; a MEMS structure disposed on the second substrate; a signal processing device disposed on the second substrate and spaced apart from the MEMS structure; and a capacitor disposed to be spaced apart from the MEMS structure and the signal processing device, wherein the capacitor comprises a first external electrode and a second external electrode disposed at opposite ends thereof, and a plurality of internal electrodes and dielectric layers disposed between the first external electrode and the second external electrode, and the first substrate, the second substrate, and the MEMS structure are stacked in a first direction, while the plurality of internal electrodes are stacked in a second direction perpendicular to the first direction.

The application provides a method, system, device and medium for reducing microphone howling, and relates to the technical field of audio signal processing, and the method comprises the following steps: acquiring sound signals collected by a silicon microphone array arranged in a vehicle compartment; determining spatial position coordinates of a handheld microphone in the vehicle compartment according to the sound signals; controlling the silicon microphone array to generate a sound pickup beam following the spatial position coordinates; acquiring position information of a loudspeaker in the vehicle compartment; controlling the sound pickup beam to form a low-gain area in a direction pointing to the position of the loudspeaker according to the position information, wherein the low-gain area is an area for performing attenuation processing on the sound signals; performing enhancement processing on an initial sound signal processed by a directional beam to generate a target sound signal; and outputting the target sound signal to the loudspeaker to enable the loudspeaker to play the target sound signal. The application has the technical effect of reducing the influence on the naturalness and clarity of sound quality when suppressing howling.

A MEMS transducer includes a deflectable membrane where the deflectable membrane includes two first layers and a second layer arranged between the two first layers. The two first layers comprise low-stress silicon nitride, and the second layer comprises doped silicon.

An audio converter power supply is provided with a cascade regulator comprising a current regulator (140) in an inner loop, which operates in the audio frequency range, and a voltage regulator (150) in an outer loop, which only operates below the audio frequency range and essentially does not operate in the audio frequency range. The audio frequency range is between 20 Hz and 22 kHz.

It is planned that, at least in certain areas, electrode structures will be inserted between deformable membrane regions of membrane structures and a central electrode structure or a counter electrode structure located between two membrane structures. These additional electrode structures, i.e., the first and second electrode structures, will be attached to the support structures that mechanically connect the membrane structures and freely penetrate the central electrode structure, specifically at a distance from the deformable membrane regions of the membrane structures (i.e., the first and second membranes) and at a distance from the central electrode structure.

To remove a resonance frequency from an acoustic band of a microphone.SOLUTION: An electronic acoustic device 12 comprises: a primary MEMS microphone 14 having a frequency response including a resonance frequency; a reference MEMS microphone 18 having the frequency response containing the resonance frequency; and an equalization module 22. The primary MEMS microphone and the reference MEMS microphone substantially simultaneously receive a common acoustic signal, and produce a transduced signal of the microphone and a transduced signal of the reference microphone. The resonance frequency of the reference MEMS microphone is different from the resonance frequency of the primary MEMS microphone. The equalization module equalizes the frequency response of the microphone based on the transduced signal of the primary MEMS microphone and the transduced signal of the reference MEMS microphone.SELECTED DRAWING: Figure 2A

The application provides a MEMS microphone, comprising a substrate and a MEMS chip, an ASIC chip, a pressure sensing module and a pressure data tuning processing module arranged on the substrate; wherein the pressure sensing module is arranged at the bottom of the MEMS chip. The pressure sensing module is used for sensing the pressure at the bottom of the MEMS chip and outputting a first pressure signal; the ASIC chip is used for converting the pressure signal output by the MEMS chip into a second pressure signal and outputting the second pressure signal to the pressure data tuning processing module; and the pressure data tuning processing module is used for compensating the second pressure signal according to the first pressure signal and outputting the compensated second pressure signal as a target pressure signal. The MEMS microphone can sense the pressure of different use interfaces through the pressure sensing module, compensate the output of the MEMS chip, and thus keep the pressure sensitivity of the MEMS microphone consistent in different use scenarios.

A MEMS microphone according to the present embodiment comprises: a first substrate; a second substrate disposed on the first substrate; a MEMS structure disposed on the second substrate; and a signal processing device disposed on the second substrate and spaced apart from the MEMS structure, wherein the first substrate comprises a plurality of first front-surface pads provided on one surface thereof, each of the plurality of first front-surface pads has a via formed therein, and the signal processing device is wire-connected to the vias.

A MEMS device for generating sound and / or detecting sound includes a diaphragm that is deflectable along a stroke axis and a MEMS unit. The MEMS unit includes at least one cantilever arm for generating and / or detecting a stroke motion of the diaphragm and which is spaced apart from the diaphragm along the stroke axis such that a cavity is formed between the cantilever arm and the diaphragm. The MEMs unit also includes a stroke structure arranged in the cavity and connected to the diaphragm, and a connecting element that movably connects the cantilever arm to the stroke structure. The connecting element narrows and / or widens in at least one area in the direction of the stroke structure, and / or has at least one recess.

The present invention relates to a MEMS microphone module including a dual case and, more specifically, to a MEMS microphone module having a dual protection structure by incorporating a second case for protecting a first case which forms an inner space including a transducer and a semiconductor unit disposed on a base substrate, the module thus being capable of preventing noise from entering the inside of a set and external pressure from causing deformation.

A sensor component can include a housing, an electrical interface, and a capacitive transducer, the capacitive transducer including a first electrode and a second electrode. The sensor component can include an electrical circuit including a bias voltage source coupled to the first electrode. The bias voltage source can include a voltage booster circuit coupled to the charge pump and coupled to a reference voltage source. The voltage booster circuit can receive a reference voltage and a clock signal, increase the reference voltage, and increase a voltage of the clock signal provided to a charge pump clock input based on the increased reference voltage. The voltage booster circuit can provide the increased reference voltage to the charge pump input. The voltage booster circuit can also include a switch control circuit that controls at least two transistors of the voltage booster circuit independent of the reference voltage.

Small form-factor MEMS devices and methods of using the devices. An exemplary MEMS device includes an ACM. Certain devices comprise nanometer scale sensing gaps in the out-of-plane direction to increase vibration sensitivity in a vacuum casing. Certain devices described herein provide a differential sensing mechanism. Accelerometer contact microphones having an operational bandwidth ranging from 0 Hz and 10,000 Hz are also disclosed. The vibration acceleration sensitivity of certain devices described herein is better 100 μg√Hz.

This invention relates to the field of MEMS silicon microphone product testing technology, and provides a calibration system for testing MEMS silicon microphone products, including a robotic arm, a acoustic cavity, and a test fixture; characterized in that: the test fixture includes a microphone carrying assembly and a microphone alignment assembly; the microphone carrying assembly includes a disc-shaped microphone carrying plate, on which are provided measuring slots spaced apart along its circumference, and through holes extending vertically through the bottom of the measuring slots; wherein, the microphone is mounted in the measuring slot with its package shell facing down and the PCB board facing up, the sound inlet on the microphone's package shell is set downward and communicates with the through holes, and the PCB board is higher than the measuring slots; the microphone alignment assembly is used to position the microphone around its perimeter in the measuring slots, so that the sound inlet and the through holes are directly aligned and communicate; the calibration system also includes a pin clamping assembly, which clamps the pin onto the microphone contacts to form an electrical connection.

This utility model discloses a MEMS microphone assembly and audio system, including a middle ring, a MEMS assembly, and a cap. The middle ring has a cavity extending through both ends, and a first connecting portion with a positioning structure is provided at the first end of the middle ring. The MEMS assembly includes a connected flexible circuit board module and a reinforcing plate. The reinforcing plate is connected to the positioning structure and has a first sound receiving hole. Electrical connecting portions are provided at both ends of the flexible circuit board module and pass through the cavity of the middle ring. The cap has an opening and a cover plate at both ends, respectively. The cover plate has a second sound receiving hole adapted to the first sound receiving hole. The opening of the cap connects to the first connecting portion, and the cover plate abuts against the reinforcing plate. This utility model enables miniaturization and improves the compactness of the internal structure.

A loudspeaker device (200) is provided. The loudspeaker device (200) comprises a micro-electromechanical unit (100). The micro-electromechanical unit (100) comprises a diaphragm (10) having a planar extension. The diaphragm (10) comprises a semiconductor structure (20) comprising a first (22) and a second (24) layer, each layer extending in the planar extension. The first layer (22) comprises Al(1-x)Ga(x)N, wherein 0.2≤x≤0.4, and the second layer (24) comprises GaN. The diaphragm (10) is arranged to oscillate in an extension transverse to the planar extension to thereby generate sound waves. A calibrating weight (17) is arranged on a surface of the diaphragm (10). The micro-electromechanical unit (214) further comprises a support structure (30) supporting the diaphragm (10), an electrode arranged (50) on a surface of the diaphragm (10), and a resonant box.

Aspects of the disclosure relate to microelectromechanical systems (MEMS) devices for pressure measurements. In particular, various examples herein describe techniques for limiting a diaphragm displacement of capacitive MEMS transducers to enable high sound pressure level (SPL) measurements. A reduced diaphragm displacement may be achieved by using a cap over the diaphragm of the MEMS transducer to reduce a volume of a back cavity of a MEMS transducer. A smaller back cavity may acoustically load the diaphragm and reduce the diaphragm displacement. Additionally, or alternatively, a reduced diaphragm displacement may also be achieved by stacking multiple MEMS transducers over each other such that the multiple MEMS transducers are in series acoustically.

An acoustic band-pass filter assembly includes an inlet, a microphone configured to receive acoustic energy from the inlet, and a plurality of resonator chambers disposed in series between the inlet and the microphone and configured to transmit acoustic energy between the inlet and the microphone. Each of the plurality of resonator chambers has a different cross-sectional area.

Devices, systems, and methods herein relate to the measurement of reflected acoustic waveforms to generate vocal data and avoid undesired noise, minimize calibration and set up, and improve continuous usability. These systems, devices, and methods may include transmitting an acoustic waveform through air to a skin of a subject, measuring a reflected acoustic waveform reflected by the skin of the subject, and processing the measured reflected acoustic waveform to generate vocal data of the subject.

A MEMS sound transducer element is operable in an audio and an ultrasonic range. The MEMS sound transducer element includes a first electrode structure, wherein a conductive material of the first electrode structure includes a plurality of electrically isolated electrode segments, and a second electrode structure spaced apart from the first electrode structure, wherein the first electrode structure and the second electrode structure are operable as an audio sound transducer. A first subset of the plurality of electrically isolated electrode segments of the first electrode structure is, in conjunction with the second electrode structure, operable as an ultrasonic or audio emitter, and a second subset of the plurality of the electrically isolated electrode segments of the first electrode structure is, in conjunction with the second electrode structure, operable as an ultrasonic or audio receiver.

The utility model provides a kind of MEMS microphone, it includes the shell with accommodating space and the ASIC chip and the MEMS chip with back cavity accommodated in accommodating space, shell includes shell and the PCB board with shell cover interface and form accommodating space, PCB board is equipped with the first sound hole through PCB board and with back cavity communication, MEMS microphone further include waterproof membrane fixed between MEMS chip and PCB board and cover first sound hole;The utility model provides MEMS microphone further include support plate that is fixedly glued to PCB board and cover first sound hole, support plate is equipped with the second sound hole through support plate and with first sound hole communication, waterproof membrane is fixed to the surface of support plate towards MEMS chip and cover second sound hole, first sound hole and second sound hole are staggered and set, effectively buffer the impact of water pressure to waterproof membrane, avoid that waterproof membrane can be destroyed due to the impact of water pressure, and then improve the stability of MEMS microphone product performance.

The application provides a micro-electro-mechanical system microphone, comprising: a substrate comprising a first cavity; a dielectric layer disposed on the substrate, having a first side in contact with the substrate and a second side opposite to the first side, wherein the dielectric layer has a second cavity corresponding to the first cavity; a diaphragm located in the second cavity, comprising a joint area, a sensing area and an elastic structure, wherein the joint area is in contact with the dielectric layer, the sensing area comprises a peripheral area and a central area, the peripheral area is connected to the central area by the elastic structure, and the elastic structure has a first gap on one side close to the central area; a first back plate disposed on the dielectric layer and located on the second side of the dielectric layer; and a protruding structure located on the first side of the diaphragm opposite to the first cavity; wherein the diaphragm has a first area, the first area is a projection of an opening of the first cavity on the opposite side of the diaphragm on the diaphragm; and wherein the position of a first part of the protruding structure in the radial direction of the diaphragm is located between the first gap and the first area.