8045results about "Microelectromechanical systems" patented technology

Improved microneedle arrays are provided having a sufficiently large separation distance between each of the individual microneedles to ensure penetration of the skin while having a sufficiently small separation distance to provide high transdermal transport rates. A very useful range of separation distances between microneedles is in the range of 100-300 microns, and more preferably in the range of 100-200 microns. The outer diameter and microneedle length is also very important, and in combination with the separation distance will be crucial as to whether or not the microneedles will actually penetrate the stratum corneum of skin. For circular microneedles, a useful outer diameter range is from 20-100 microns, and more preferably in the range of 20-50 microns. For circular microneedles that do not have sharp edges, a useful length for use with interstitial fluids is in the range of 50-200 microns, and more preferably in the range of 100-150 microns; for use with other biological fluids, a useful length is in the range of 200 microns—3 mm, and more preferably in the range of 200-400 microns. For circular microneedles having sharp side edges, a useful length for use with interstitial fluids is in the range of 50-200 microns, and more preferably in the range of 80-150 microns; for use with other biological fluids, a useful length is again in the range of 200 microns—3 mm, and more preferably in the range of 200-400 microns. For solid microneedles having a star-shaped profile with sharp edges for its star-shaped blades, a useful length for use with interstitial fluids is in the range of 50-200 microns, and more preferably in the range of 80-150 microns; for use with other biological fluids, a useful length is again in the range of 200 microns—3 mm, and more preferably in the range of 200-400 microns, while the radius of each of its blades is in the range of 10-50 microns, and more preferably in the range of 10-15 microns.

A silicon condenser microphone package is disclosed. The silicon condenser microphone package comprises a transducer unit, a substrate, and a cover. The substrate includes an upper surface having a recess formed therein. The transducer unit is attached to the upper surface of the substrate and overlaps at least a portion of the recess wherein a back volume of the transducer unit is formed between the transducer unit and the substrate. The cover is placed over the transducer unit and includes an aperture.

A method of bonding of germanium to aluminum between two substrates to create a robust electrical and mechanical contact is disclosed. An aluminum-germanium bond has the following unique combination of attributes: (1) it can form a hermetic seal; (2) it can be used to create an electrically conductive path between two substrates; (3) it can be patterned so that this conduction path is localized; (4) the bond can be made with the aluminum that is available as standard foundry CMOS process. This has the significant advantage of allowing for wafer-level bonding or packaging without the addition of any additional process layers to the CMOS wafer.

A thin film made of an amorphous material having supercooled liquid phase region is formed on a substrate. Then, the thin film is heated to a temperature within the supercooled liquid phase region and is deformed by its weight, mechanical external force, electrostatic external force or the like, thereby to form a thin film-structure. Thereafter, the thin film-structure is cooled down to room temperature, which results in the prevention of the thin film's deformation.

An interference display unit with a first electrode, a second electrode and posts located between the two electrodes is provided. The characteristic of the interference display unit is that the second electrode's stress is released through a thermal process. The position of the second electrode is shifted and the distance between the first electrode and the second electrode is therefore defined. A method for fabricating the structure described as follow. A first electrode and a sacrificial layer are sequentially formed on a substrate and at least two openings are formed in the first electrode and the sacrificial layer. A supporter is formed in the opening and the supporter may have at least one arm on the top portion of the supporter. A second electrode is formed on the sacrificial layer and the supporter and a thermal process is performed. Finally, The sacrificial layer is removed.

There is described a micromachined ultrasonic transducers (MUTS) and a method of fabrication. The membranes of the transducers are fusion bonded to cavities to form cells. The membranes are formed on a wafer of sacrificial material. This permits handling for fusions bonding. The sacrificial material is then removed to leave the membrane. Membranes of silicon, silicon nitride, etc. can be formed on the sacrificial material. Also described are cMUTs, pMUTs and mMUTs.