176results about "Microelectromechanical systems" patented technology

A method for forming a semiconductor structure includes following operations. An interconnect structure is formed over a substrate. The interconnect structure includes a top conductive layer. A dielectric structure is formed over the interconnect structure. The dielectric structure is patterned to simultaneously form a cavity and a protrusion in the cavity. A MEMS substrate is bonded to the dielectric structure to seal the cavity. The protrusion is separated from the MEMS substrate.

The invention relates to a method for forming (P1) a primary stack (30) comprising: a supply step (E1) of an initial stack (10) comprising an initial substrate (11) having a front face (Fav) comprising a central zone (Zc) and a peripheral contouring zone (Zdp), and a resonant thin layer (13) of piezoelectric material; and a protection step (E2), in which a protective thin layer (17) is deposited on the initial stack (10) and covering the peripheral contouring zone (Zdp); the protective thin layer (17) being of a material having an acoustic impedance greater than 20 MRayl for longitudinal waves and / or greater than 12 MRayl for shear waves. The invention also relates to a resonant electronic device (100) and a method (P2) for manufacturing a resonant electronic device (100) from such a primary stack (30). Figure 2

Techniques and / or systems are disclosed herein for forming a window cavity wafer that includes fabricating a window wafer by: providing a window wafer substrate having two faces; etching fiducials onto one or more faces of the window wafer substrate; and applying one or more optical coatings to on one or more faces of the window wafer substrate. Next, fabricating a spacer wafer separate from the window wafer by: providing a spacer wafer substrate having two faces; and forming an array of through-holes in the spacer wafer substrate. Then, bonding the spacer wafer to the window wafer to form the window cavity wafer; and forming discrete metal frames on a face of the window cavity wafer.

Measurements are performed on biological subjects by using microstructures to penetrate the functional barriers of the target. [Solution] A system for performing measurements on a biological object, comprising: at least one substrate 511 including a plurality of plate microstructures 512.1, 512.2 configured to penetrate the stratum corneum of the object; at least one sensor operably connected to at least one microstructure and configured to measure a response signal from at least one microstructure; and one or more electronic processing devices configured to perform at least one of the following: determine the measured response signal, provide an output based on the measured response signal, perform an analysis using at least part of the measured response signal, and store data indicating at least part of the measured response signal.

An example of a genotyping or sequencing platform generally includes a negatively-charged substrate including a plurality of depressions defined therein that are separated by interstitial regions. The genotyping or sequencing platform further includes an exposed passivation layer positioned over an entirety of a surface of the negatively-charged substrate, wherein the exposed passivation layer at least partially fills each depression in the plurality of depressions and at least partially overlies each interstitial region across the entirety of the surface.

Provided is a sacrificial composition. The sacrificial composition comprises a polymer (A) that undergoes acid-catalyzed decomposition, a compound (B) that generates an acid by heat, and a solvent (C), wherein the compound (B) that generates the acid by heat consists of a carboxylic acid and a base, and a content of the compound (B) is 1 to 60 parts by mass based on 100 parts by mass of the polymer (A). The sacrificial composition may exhibit at least one of properties as an advanced material or as a high performance material. The sacrificial composition may be used in the nanotechnology process to make semiconductor device / display device application, for example semiconductor chip, or a liquid crystal, quantum dot, OLED display fabricated on a substrate controlled by semiconductors.

A micro electro mechanical system (MEMS) includes a circuit substrate comprising electronic circuitry, a support substrate having a recess, a bonding layer disposed between the circuit substrate and the support substrate, through holes passing through the circuit substrate to the recess, a first conductive layer disposed on a front side of the circuit substrate, and a second conductive layer disposed on an inner wall of the recess. The first conductive layer extends into the through holes and the second conductive layer extends into the through holes and coupled to the first conductive layer.

The present invention relates to a microelectromechanical system (MEMS) (100) comprising a MEMS component (110) with a surface (120) and at least one contact column (1) having a top surface (2) on the surface (120), wherein the top surface (2) comprises a conductive material (4) and is designed and configured to supply the MEMS component (110) with a supply and / or signal voltage (130). The invention further relates to a method for manufacturing such a MEMS (100) with at least one contact column (1) and to the use of the MEMS (100) according to the invention in systems for interacting with fluids.

An actuator (140) includes an arm starting end (141) on which a piezoelectric element is formed, a first end of the arm starting end (141) being connected to an inner side of a fixed frame (110), the arm starting end extending in a straight line, along a Y-axis direction through a gap between the fixed frame (110) and a mirror surface (130), from the first end to beyond a middle point (N) of an outer side of the mirror surface (130); an arm terminating end (142) including a first end connected to the middle point (N) of the outer side of the mirror surface (130), the arm terminating end (142) extending parallel to the arm starting end (141); and an arm relay (143) that connects a second end of the arm starting end (141) to a second end of the arm terminating end (142), the arm relay (143) being formed in a zigzag by alternately connecting an arm connector (143B) extending along the Y-axis direction and an arm extension (143A) extending parallel to the arm starting end (141) and on which the piezoelectric element is formed.

A MEMS pressure transducer includes a semiconductor body, a fixed electrode region, and a membrane suspended above the fixed electrode region to delimit a cavity, the membrane being deformable as a function of pressure. The membrane includes a lower conductive region made of polysilicon which delimits the cavity at the top and is traversed by holes which face the cavity, the lower conductive region being impermeable to gases, except for the holes; an intermediate structure made of polysilicon permeable to gases, which closes the holes. The membrane also includes an upper conductive region made of polysilicon or amorphous silicon, which extends on the intermediate structure and the lower conductive region and is impermeable to gases. The membrane is laterally delimited by a lateral surface, which is formed by the lower conductive region and the upper conductive region. The intermediate structure does not face the lateral surface of the membrane.

Procedure (100; 300), comprising: Providing (110) a machined substrate arrangement (10; 70) comprising a machined semiconductor substrate (12) and a metallization layer structure (14) on a major surface (16) of the machined semiconductor substrate (12), and Release etching (120) from an area of ​​the metallization layer structure (14) towards the processed semiconductor substrate (12) to create a cut (22) in the metallization layer structure (14) at a separation region (25) in the processed semiconductor substrate (12), wherein the separation region (25) defines a boundary between a die region (27; 34a-b) of the processed substrate arrangement (10; 70) and at least a second region of the processed substrate arrangement (10; 70); where the release etching (120) further includes: Exposure of a MEMS functional element (18) arranged on the machined semiconductor substrate (12), wherein the MEMS functional element is a MEMS sensor and / or comprises a silicon material.

The invention relates to a micromechanical component for a sensor device, having a substrate (10) with a substrate surface (10a), at least one stator electrode arranged on the substrate surface and / or on at least one intermediate layer at least partially covering the substrate surface, the at least one stator electrode each being formed from a first semiconductor layer and / or a metal layer, at least one actuator electrode arranged adjustably, the at least one actuator electrode each being formed from a second semiconductor and / or metal layer (P2), a membrane spanning the at least one stator electrode and the at least one actuator electrode, the membrane having a membrane outer side (18a) oriented away from the at least one stator electrode and the at least one actuator electrode, the membrane outer side being formed from a third semiconductor layer and / or a metal layer (P3), a stiffening structure and / or a protection structure (54) protruding on the membrane outer side being formed from a fourth semiconductor layer and / or a metal layer (P4).

This application relates to the technical field of semiconductor processes, and more particularly to piezoelectric multilayer structures and methods for manufacturing the same. The piezoelectric multilayer structure includes a substrate and further includes a strain limiting layer, a piezoelectric layer, and a structural layer sequentially stacked on the front surface of the substrate, wherein the piezoelectric layer bends in the direction of the substrate, and the structural layer bends in the direction of the piezoelectric layer. The method includes the steps of growing a strain limiting layer on the front surface of a substrate layer, growing a piezoelectric layer on the surface of the strain limiting layer and, under stress, the piezoelectric layer bends in the direction of the substrate, causing the front surface of the substrate to deform accordingly and bend to the back surface, depositing a structural layer on the surface of a PZT upper electrode using a low-temperature PECVD process and causing the structural layer to deform and bend into a piezoelectric layer, and patterning the structural layer and the substrate to form the required piezoelectric multilayer structure. In this application, the structural layer grown on the surface of the piezoelectric layer is deformed into a piezoelectric layer, the initial strain of the multilayer structure is made negative, the residual stress and vibration stress in the effective operating region are superimposed, and the performance of the device is improved.

An accelerometer includes first to fourth measuring units. Each of the first to fourth measuring units includes a mass element moving in a y direction and first and second fixed structures. The mass element forms a differential capacitor with the first and second fixed structures. Each of the first to fourth measuring units includes a center line, and in each of the first to fourth measuring units, the first and second fixed structures are on opposite sides of the center line. The first and second capacitors are identically laid out with respect to the center line in the first and third measuring units. The first and second capacitors are identically laid out with respect to the center line in the second and fourth measuring units. The first and second capacitors are oppositely laid out with respect to the center line in the first measuring unit and in the second measuring unit.

A microelectromechanical array includes a substrate, a plurality of first ring elements, a plurality of second ring elements, and a plurality of electrodes. The substrate has a plurality of anchor pieces. The first ring elements include a plurality of first ring portions and a plurality of first coupling segments. The first ring elements are spaced apart from the substrate. The first coupling segments are connected to the first ring portions, so as to jointly have a node. Each of the second ring elements includes a plurality of second ring portions and a plurality of second coupling segments. The phases of each of second ring portions and the phases of each of the first ring portions are opposite. The electrodes are disposed on the substrate. Each of the electrodes is surrounded by any one of the first ring portions or the second ring portions, without coming in contact therewith.

A mirror device manufacturing method includes a forming step of forming a structure by forming a base portion, a movable portion, and a coupling portion coupling the base portion and the movable portion to each other such that the movable portion is able to swing with respect to the base portion through processing of a wafer, and forming a mirror layer in the movable portion; and a collecting step of performing collection of foreign substances from the structure using a collection member after the forming step. A mirror unit manufacturing method includes a sealing step of sealing the mirror device after the collecting step.

A direct drive scanning micromirror includes a mirror body defining a mirror surface, and a plurality of curved cantilevers that each extend directly from the mirror body. The shape of the cantilevers and the geometry of the interface between the cantilevers and the mirror body are configured to decrease peak stresses within the micromirror during operation, which may beneficially impact performance and lifetime.

A fluid transfer system is described. The fluid transfer system includes an active element, a structural element coupled with the active element, and a cushion. The active element has a leading edge and is configured to undergo vibrational motion. The cushion is between the leading edge of the active element and a portion of the structural element. The cushion mitigates collisions between the portion of the structural element and the leading edge of the active element.

An inertial measurement unit and a manufacturing method therefor. The inertial measurement unit comprises: a first substrate (1); a dielectric layer (2), wherein the dielectric layer (2) is stacked on the first substrate (1), and notches (15) are formed on the dielectric layer (2); a first conductive layer (3), wherein the first conductive layer (3) is stacked on the dielectric layer (2); a second conductive layer (5), wherein the second conductive layer (5) is supported on the first conductive layer (3) by means of support portions (7); a second substrate (9), wherein the second substrate (9) covers the second conductive layer (5) by means of a bonding structure (8), a sealed space is formed between the second substrate (9) and the first substrate (1), the sealed space comprises a plurality of separated chambers (14), and the chambers (14) have different chamber pressures; an exhaust channel (12), communicated with at least one chamber (14), wherein the exhaust channel (12) is used for communicating the chamber (14) with the outside; and a sealing portion, used for sealing the exhaust channel (12). A plurality of chambers (14) having different chamber pressures are provided on a single wafer, which is conducive to manufacturing of an inertial measurement unit in which two or more inertial sensors are integrated.

A MEMS transducer includes a deflectable membrane where the deflectable membrane includes two first layers and a second layer arranged between the two first layers. The two first layers comprise low-stress silicon nitride, and the second layer comprises doped silicon.

An aircraft recorder system is provided in which a vibration sensor including at least one of a micro-electromechanical systems (MEMS) microphone and a MEMS accelerometer. The system further includes a cockpit voice recorder (CVR) and an active microphone. The active microphone and the vibration sensor each output signals to a signal processor including a subtractor configured to output, to the CVR, a signal that is a result of a subtraction of the signal from the vibration sensor from the signal from the active microphone.

A MEMS micromirror, an optical apparatus, and a terminal device. The MEMS micromirror comprises a galvanometer (31) and a structure layer. The structure layer carries the galvanometer (31). The structure layer comprises a motion structure. The motion structure controls the galvanometer (31) to move to process light. At least part of the motion structure is made of a material having a Mohs hardness of 9 or greater.

It is planned that, at least in certain areas, electrode structures will be inserted between deformable membrane regions of membrane structures and a central electrode structure or a counter electrode structure located between two membrane structures. These additional electrode structures, i.e., the first and second electrode structures, will be attached to the support structures that mechanically connect the membrane structures and freely penetrate the central electrode structure, specifically at a distance from the deformable membrane regions of the membrane structures (i.e., the first and second membranes) and at a distance from the central electrode structure.

The invention relates to a method for producing a microelectromechanical device (1) comprising a functional unit (2), a cavity (3), and a cap structure (4) that covers the cavity (3) and has at least one cavity access (5), in which method the cap structure (4) is produced by sequentially depositing material layers on a cap substrate (6), the functional unit (2) is attached to the cap structure (4), and at least one inlet channel (7) in the at least one cavity access (5) is formed in the cap structure (4) by means of etching, wherein, during the production of the cap structure (4), at least one inlet channel (7), at least one outlet channel (9) opening into the cavity (3), and at least one lateral channel (8) running parallel to a surface of the cap substrate (6) and opening into the at least one inlet channel (7) and into the at least one outlet channel (9) are formed in the cap structure (4), and wherein, during the production of the cap structure (4), a first etch-stop structure (10a) is formed in order to limit the insertion depth of the inlet channel (7) into the cap structure (4). The invention also relates to a microelectromechanical device (1).

To remove a resonance frequency from an acoustic band of a microphone.SOLUTION: An electronic acoustic device 12 comprises: a primary MEMS microphone 14 having a frequency response including a resonance frequency; a reference MEMS microphone 18 having the frequency response containing the resonance frequency; and an equalization module 22. The primary MEMS microphone and the reference MEMS microphone substantially simultaneously receive a common acoustic signal, and produce a transduced signal of the microphone and a transduced signal of the reference microphone. The resonance frequency of the reference MEMS microphone is different from the resonance frequency of the primary MEMS microphone. The equalization module equalizes the frequency response of the microphone based on the transduced signal of the primary MEMS microphone and the transduced signal of the reference MEMS microphone.SELECTED DRAWING: Figure 2A