6 results about "Thermocompression bonding" patented technology

The present invention relates to a coil component in which a terminal electrode and a terminal end of a wire are connected by thermocompression bonding at a bottom surface of a flange portion, and the following effects are obtained as a result of thermocompression bonding being appropriately performed without being excessively insufficient, that is, a stable fixing force is obtained for the connection state between the terminal electrode and the terminal end of the wire, and problems caused by the terminal end of the wire protruding from the terminal electrode are less likely to occur. A terminal end (21a) of a wire (21) is in a state of being at least partially disposed inside a terminal electrode (17) and extending along a main surface (25) of the terminal electrode, and has a top surface (33) located at a side opposite to the bottom surface (23) of a flange portion (13) from the main surface. A solder tail surface (37) that rises from the main surface toward the top surface and forms a concave curved surface is formed on an outer surface of the terminal electrode. The main surface is realized by a parent solder material layer (31) composed of tin or a tin alloy that constitutes an outermost layer of the terminal electrode.

Heat transfer couplers, which can also be referred to as nozzles, for semiconductor manufacturing are provided. The heat transfer couplers can include a cavity on a side that is opposite the side a semiconductor chip is attached to during an assembly process. In the assembly process, the semiconductor chip can be electrically coupled to a package substrate forming electrical interconnects. The assembly process can be a thermocompression bonding process in which first level interconnects are formed.

Provided is a biaxially stretched polyester film for metal sheet lamination molding. With reference to can lid production by thermocompression bonding in a lamination process, this biaxially stretched polyester film exhibits an excellent adhesiveness and an excellent openability free of feathering during opening. This film can also prevent corrosion even for contents that readily cause metal corrosion. The laminated film for metal sheet lamination molding has a layer containing an amorphous polyester resin B provided on one surface of a biaxially stretched polyester film that contains a polyester resin A. In measurement of the laminated film using a dynamic viscoelasticity measurement instrument, the maximum temperature peak temperature Te1 (°C) of the loss elastic modulus of the film and the temperature Te2 (°C) of the peak at the next highest temperature after Te1 satisfy 15 ≤ Te1 (°C) - Te2 (°C) ≤ 90.

Heat transfer couplers, which can also be referred to as nozzles, for semiconductor manufacturing are provided. The heat transfer couplers can include a cavity on a side that is opposite the side a semiconductor chip is attached to during an assembly process. In the assembly process, the semiconductor chip can be electrically coupled to a package substrate forming electrical interconnects. The assembly process can be a thermocompression bonding process in which first level interconnects are formed.

This application discloses a packaging method, packaging structure, and a superconducting quantum computer, belonging to the field of chip packaging. The packaging method includes providing a chip and a printed circuit board; positioning the chip and the printed circuit board such that a second post in the circuit board is inserted into a positioning hole while ensuring that the flux and solder balls do not contact; and performing thermocompression bonding while heating the chip but not the printed circuit board. The above packaging method enables more convenient packaging alignment and spacing control, and significantly reduces the probability of warping of the packaged printed circuit board.

Heat transfer couplers, which can also be referred to as nozzles, for semiconductor manufacturing are provided. The heat transfer couplers include non-continuous channels on opposite faces. In an assembly process, semiconductor chips can be electrically coupled to a devices forming electrical interconnects. The assembly process can be a thermocompression bonding process in which first level interconnects are formed.