This invention provides a coupler and an RF front-end module. The coupler includes a substrate and input waveguides, switching waveguides,
coupling waveguides, isolation waveguides, transition waveguides, and output port lines formed on the substrate. The substrate includes a high-resistivity
silicon substrate, an
oxide buried insulating layer, a first
metal layer, a second
metal layer, and a third
metal layer stacked sequentially. The input waveguides,
coupling waveguides, isolation waveguides, and output port lines are spaced apart and formed on the third metal layer, while the switching waveguides and transition waveguides are spaced apart and formed on the second metal layer. This invention enables the coupler to have low parasitics, high
narrowband, stable sampling, and low
power consumption.