The invention discloses a frequency adjustment control method and device for an
ultrahigh frequency wafer, and relates to the technical field of
semiconductor production. Determining a target area of the coated
wafer, dividing the target area to obtain a plurality of to-be-detected areas, and obtaining the area vibration frequency of the to-be-detected areas; if the area vibration frequency is larger than a preset frequency threshold value, the area to be detected is judged to be an abnormal area, a
feature code is added, and the area vibration frequency and the
feature code are uploaded to a feature
database; working parameters of the
laser etching equipment are determined according to the feature
database, and the abnormal area is etched according to the working parameters; the vibration frequency of each to-be-detected area is detected, the area with the abnormal vibration frequency is identified, a
feature code is added to the area, the area vibration frequency and the feature code are uploaded to a feature
database,
rapid identification and intelligent marking of the abnormal area are achieved, and data support is provided for subsequent
laser etching equipment working parameter optimization. And the accuracy and the high efficiency of the
etching operation are ensured.