The invention provides a
radio frequency chip high-frequency performance test process and a clamp. The
radio frequency chip high-frequency performance test process comprises the following steps: S1,
welding a crimping shaft sleeve to one end of a
radio frequency cable; by adopting the scheme of combining the
coaxial cable and the PCB, the PCB part can be used for
digital signal transmission and product power supply, and the
coaxial cable is used for
radio frequency signal transmission, so that the
microwave interference caused by the use of a PCB
microstrip line and the
signal influence caused by 90-degree switching between the conductive part and a PCB plane
microstrip can be reduced, the high-frequency test requirement of a radio frequency
chip is met, and the
test efficiency is improved. Through the crimping mode, the problems of long
welding time, high operation requirements, unmaintainability and the like in the
welding process are solved, the situation that after a radio frequency cable is heated for a long time, the high-frequency test index of the clamp is affected is avoided, the independently designed elastic conductive film serves as a transmission elastic carrier of the clamp, the influence of the conductive film on the radio frequency index is reduced to the minimum, and the reliability of the clamp is improved. The fixture is suitable for double-sided chip
layout, and the top of the fixture is also provided with a test
assembly, so that double-sided radio frequency chip test can be realized.