This disclosure provides an interconnect structure impedance measurement circuit. By optimizing the
Wheatstone bridge structure, it employs three parallel branches. In one
branch, the interconnect structure to be measured is connected in series. In the other two branches, two resistors are connected in series. By controlling the
branch containing the interconnect structure and one of the other two branches to be simultaneously turned on, the
voltage between the two turned-on branches is measured. The impedance of the two interconnect structures is calculated based on the current flowing into the interconnect structure impedance measurement circuit, the measured
voltage, and the resistance in the branches. This disclosure allows for convenient, large-scale, and accurate measurement of interconnect structure impedance, and enables real-time and accurate monitoring of the impedance of a single interconnect structure in reliability experiments. This disclosure also provides an interconnect structure impedance
measurement device and method.