1732 results about "Characteristic impedance" patented technology

A communication device consistent with certain implementations has a coaxial cable having length and first and second ends. The coaxial cable further has a central conductor, a dielectric insulator surrounding the central conductor, and an electric shield conductor surrounding the dielectric insulator. The dielectric insulator serves as a dielectric waveguide having a characteristic impedance Z at an operating frequency range. A termination for electrical energy coupled into or out of the dielectric insulator at approximately the characteristic impedance Z at the operating frequency range to utilize the dielectric insulator as a waveguide for transmission of signals along the length of the coaxial cable, and wherein the center conductor is further used to communicate an electrical signal between the first and second ends. This abstract is not to be considered limiting, since other embodiments may deviate from the features described in this abstract.

An apparatus is provided for high frequency multiplexed electrical line communication for cable TV, telephone, internet, security and other control applications over the mid and low voltage power lines and directly through the transformers. The apparatus includes a transmitter, a receiver, a modem, a multiplexer and multiple couplers at each of two or more locations along an electrical line. The couplers have capacitive circuits serially connected with an air-core or dielectric-core transformer. The capacitive circuits resonate with the transformer at a preselected frequency. The coupler eliminates noise and is matched to the characteristic impedance of the line at the preselected frequency, which linearizes communication on the line and allows high speed data and voice communication over long distances. Multiple modulators and demodulators are used to produce multiple modulated carrier frequencies.

A differential signal transmission cable structure for transmitting differential signals having GHz frequency band in the present invention is provided with a differential signal transmission pair cable 30 connecting a driver circuit 23a and a receiver circuit 23b, for transmitting differential signals having GHz frequency band, and a power supply ground transmission pair cable 31 connecting ground and a first power supply 26a connected to the driver circuit and ground and a second power supply 26b connected to the receiver circuit. Further characteristic impedance of the differential signal transmission pair cable is matched to that of the driver circuit and the receiver circuit, thereby enabling TEM waves of differential signals having GHz frequency band transmission mode to be maintained when the differential signals are transmitted.

A wire (a twisted pair cable) that transmits a gigahertz band signal and that is provided with a pair of core wires that are twisted with each other, a first insulation coating material, a second insulation coating material, and a shield material that shields evanescent waves emitted from the pair of core wires. The pair of core wires have a twisting pitch, a diameter, and a spacing so that the wire has a characteristic impedance of 100 to 200Ω and the phases of the TEM (Transverse Electro-Magnetic) wave and the evanescent wave that are emitted from the pair of core wires are matched.

A connector for transmitting signals using electrostatic coupling, comprises an inner first conductor portion and an outer first conductor portion respectively connected to two signal lines, an inner electrode portion having a facing area larger than the cross-sectional area of the inner first conductor portion in the direction perpendicular to the direction of the common axis, an outer electrode portion outside it, an inner second conductor portion for electrically connecting between the inner first conductor portion and the inner electrode portion, and an outer second conductor portion outside it, wherein the ratio of outer diameter of the inner second conductor portion to inner diameter of the outer second conductor portion is set to provide substantially fixed characteristic impedance at every position along the direction of the common axis.

Provided is a plasma processing apparatus having a coaxial waveguide structure in which characteristic impedance of an input side and characteristic impedance of an output side are different. A microwave plasma processing apparatus, which plasma-processes a substrate by exciting a gas by using a microwave, includes: a processing container; a microwave source, which outputs a microwave, a first coaxial waveguide, which transmits the microwave output from the microwave source; and a dielectric plate, which is adjacent to the first coaxial waveguide while facing an inner side of the processing container, and emits the microwave transmitted from the first coaxial waveguide into the processing container. A thickness ratio between an inner conductor and an outer conductor of the first coaxial waveguide is not uniform along a longitudinal direction.

The invention relates to a microwave waveguide element for matching a standard waveguide input port to an enlarged waveguide output port. In the waveguide element, a plurality of intermediate waveguide segments is cascaded in the propagation direction of the microwave energy to first split the waveguide element into two symmetrical waveguide branches and then combine the branches at the output port. Thus, the width of the waveguide element is gradually enlarged and the input port is matched to the output port. The intermediate waveguide segments are preferably dimensioned such that respective characteristic impedances are approximately matched with each other for the fundamental mode.

A voltage compensation unit reduces the effects of induced voltages upon a device having a single wire line. The single wire line has balanced characteristic impedance. The voltage compensation unit includes a tunable compensation circuit connected to the wire line. The tunable compensation circuit applies supplemental impedance to the wire line. The supplemental impedance causes the characteristic impedance of the wire line to become unbalanced, thereby reducing the effects of induced voltages caused by changing magnetic fields.

A voltage compensation unit reduces the effects of induced voltages upon a device having a single wire line. The single wire line has balanced characteristic impedance. The voltage compensation unit includes a tunable compensation circuit connected to the wire line. The tunable compensation circuit applies supplemental impedance to the wire line. The supplemental impedance causes the characteristic impedance of the wire line to become unbalanced, thereby reducing the effects of induced voltages caused by changing magnetic fields.

Methods and systems for a multi-port distributed antenna are disclosed and may include configuring one or more amplifiers to communicate signals via one or more ports on a distributed antenna. A characteristic impedance of the distributed antenna at each of the one or more ports may be configured by a location of the one or more ports on the distributed antenna. The amplifiers may be impedance matched to the distributed antenna by coupling each of the amplifiers to the ports based on the characteristic impedance. The amplifiers may include power amplifiers and / or low noise amplifiers. The signals may be time division duplexed. The signals communicated via the ports on the distributed antenna may include RF signals. The distributed antenna may be integrated on a chip with the amplifiers or may be located external to a chip with the amplifiers. The distributed antenna may include a microstrip antenna.

The present invention relates to systems and devices for delivering energy to tissue for a wide variety of applications, including medical procedures (e.g., tissue ablation, resection, cautery, vascular thrombosis, treatment of cardiac arrhythmias and dysrhythmias, electrosurgery, tissue harvest, etc.). In particular, the present invention relates to systems and devices for the delivery of energy with heat transfer ability. In some embodiments, the systems and devices also have variable characteristic impedance as a result of the use of heat transfer materials. In certain embodiments, methods are provided for treating a tissue region (e.g., a tumor) through application of energy with the systems and devices of the present invention.

A differential electrical test probe tip for sensing a plurality of electric signals and generating a differential signal including an elongate common substrate having a two signal test points at one end and a differential amplifier at the second end. Two transmission lines are on the common substrate, each connecting a respective signal test point a signal input of the differential amplifier. The characteristic impedances of the two transmission lines are substantially equal. In one preferred embodiment, the common substrate is a flexible substrate. In one preferred embodiment an over-mold, which may have gaps therein, at least partially encloses the common substrate, the first transmission line, and the second transmission line.

An improved open pin field connector is provided for enhanced performance when carrying high speed signals by selective application of one or more techniques for controlling electrical performance parameters. Lossy material may be positioned adjacent to conductive elements of the connector so as to reduce resonance in pairs of conductive elements and / or to provide a desired characteristic impedance for pairs of differential signal conductors. The lossy material may be shaped and positioned to avoid capacitive coupling that might otherwise increase cross talk. In a right angle connector, the lossy material may have a step-wise increase in thickness to provide comparable loss along longer and shorter conductive elements. Conductive elements may be shaped to balance performance characteristics of pairs selected to carry differential signals regardless of orientation along a row or column. Alternatively, conductive elements may have narrowed regions, covered with lossy portions, for reducing resonance while supporting DC signal propagation.

Ultrasound bulk wave transducers and bulk wave transducer arrays for wide band or multi frequency band operation, in which the bulk wave is radiated from a front surface and the transducer is mounted on a backing material with sufficiently high absorption that reflected waves in the backing material can be neglected. The transducer is formed of layers that include a high impedance section comprised of at least one piezoelectric layer covered with electrodes to form an electric port, and at least one additional elastic layer, with all of the layers of the high impedance section having substantially the same characteristic impedance to yield negligible reflection between the layers. The transducer further includes a load matching section comprised of a set of elastic layers for impedance matching between the high impedance section and the load material and, optionally, impedance matching layers between the high impedance section and the backing material for shaping the transducer frequency response. For multiband operation, the high impedance section includes multiple piezoelectric layers covered with electrodes to form multiple electric ports that can further be combined by electric parallel, anti-parallel, serial, or anti-serial galvanic coupling to form electric ports with selected frequency transfer functions. Each electric port may be separately transceiver-connected to obtain parallel, anti-parallel, serial or anti-serial port coupling for multi-band transmission, and extremely wide-band reception.

A microwave hyperthermia apparatus that can be inserted into the body which includes a hollow central tube for the insertion of radioactive therapy sources. The use of a coaxial transmission line impedance transformation along the insertable portion of the coaxial cable enables a reduction in the characteristic impedance by increasing the outer diameter of the inner coaxial conductor so that the center conductor can be a metal tube. If the ratio of the outer coaxial conductor diameter vs. the inner coaxial conductor is decreased, the characteristic impedance of the transmission line is lowered. This enables the inner conductor diameter to increase sufficiently to make the central hollow opening large enough to receive standard radioactive sources therein. This provides for a good impedance match that improves microwave energy efficiency while at the same time permitting a large hollow center opening. The combination of the microwave antenna device and brachytherapy sources provides for enhanced effectiveness when the two treatments are delivered simultaneously or in close time proximity to each other.

A band-pass filter has a ladder-type circuit including first and second terminals whose characteristic impedances are Z0, and series elements and shunt elements disposed between a first terminal and a second terminal, each of the series elements and shunt elements containing a film bulk acoustic resonator. Assuming that characteristic impedance of any one of the series elements is Z1 and that characteristic impedance of any one of the shunt elements is Z2, the characteristic impedances Z0, Z1, and Z2 have a relation of 1<(Z1 / Z0)<2, preferably 1.3<(Z1 / Z0)<1.7, and 0.5<(Z2 / Z0)<1, preferably 0.6<(Z2 / Z0)<0.8.

An interconnection structure for interconnecting circuitry on a first conductive layer to circuitry on a second conductive layer is provided. The interconnection structure of the present invention comprises a signal conductor via surrounded by a plurality of ground vias. The plurality of ground vias shield the signal conductor via, thus providing electrical isolation for the conductor via from the rest of the circuitry. One feature of the present invention is that the plurality of ground vias can be modified, adjusting their diameters and their placement relative to the signal conductor via, in order to affect the overall characteristic impedance of the interconnection structure. This feature is useful when propagating high frequency signals between signal traces on different conductive layers of a printed circuit board. In view of the high frequencies used in today's wireless communication systems, the interconnection structure proposed aids in the practical implementation of radio frequency modules by mitigating the effects of impedance discontinuities ordinarily present at signal trace-to-via transition regions.

An improved open pin field connector is provided for enhanced performance when carrying high speed signals by selective application of one or more techniques for controlling electrical performance parameters. Lossy material may be positioned adjacent to conductive elements of the connector so as to reduce resonance in pairs of conductive elements and / or to provide a desired characteristic impedance for pairs of differential signal conductors. The lossy material may be shaped and positioned to avoid capacitive coupling that might otherwise increase cross talk. In a right angle connector, the lossy material may have a step-wise increase in thickness to provide comparable loss along longer and shorter conductive elements. Conductive elements may be shaped to balance performance characteristics of pairs selected to carry differential signals regardless of orientation along a row or column. Alternatively, conductive elements may have narrowed regions, covered with lossy portions, for reducing resonance while supporting DC signal propagation.

A probe board provides signal paths between an integrated circuit (IC) tester and probes accessing terminals on the surfaces of ICs formed on a semiconductor wafer for receiving test signals form the IC tester. A branching signal path within the probe board distributes a test signal produced by one channel of the IC tester to several probes. Resistors within the branching signal path resistively isolate the probes from one another so that a fault occurring at any one IC terminal will not affect the logic state of the test signal arriving at any other IC terminal. The isolation resistors are sized relative to signal path characteristic impedances so as to substantially minimize test signal reflections at the branch points.

The present invention relates to systems and devices for delivering energy to tissue for a wide variety of applications, including medical procedures (e.g., tissue ablation, resection, cautery, vascular thrombosis, treatment of cardiac arrhythmias and dysrhythmias, electrosurgery, tissue harvest, etc.). In particular, the present invention relates to systems and devices for the delivery of energy with optimized characteristic impedance. In certain embodiments, methods are provided for treating a tissue region (e.g., a tumor) through application of energy with the systems and devices of the present invention.

An information handling system is disclosed herein. The system includes at least one system transmission line having a characteristic impedance and a plurality of clusters, each cluster being coupled to each other cluster through at least one of the system transmission lines. Each cluster comprises at least one cluster transmission line each having a characteristic impedance equal to the characteristic impedance of the system transmission lines, and is coupled to a the system transmission line and a circuit chosen from the following: a driver, an on-chip terminator, an off-chip terminator; each driver having a pull-up circuit having an output resistance matching the characteristic impedance of the cluster transmission lines. A method for operating the system provided herein includes designating one of the drivers as an active driver, designating each driver other than the active driver as a terminating driver, causing each terminating driver to be configured in a nonactive pull-up terminating configuration; and causing the active driver to drive a signal onto the transmission line to which the active driver is connected.

An output buffer for driving a capacitively-terminated transmission line produces a waveform which comprises a first portion during which the waveform transitions from a voltage V1 to a voltage V2; a second portion during which it remains fixed at V2; a third portion during which it transitions to a voltage V3; and a fourth portion during which it remains fixed at V3. The waveform is created within a unit interval whenever successive data bits transition between logic states. The first and second portions are generated with circuitry arranged such that V2 is maximized by reducing the buffer's output impedance. The fourth portion is generated with circuitry which has a non-zero output impedance preferably equal to the transmission line's characteristic impedance, to absorb transitions reflected back to the source circuitry by the capacitive termination.

A time domain reflectometer having a first impedance when in a first test mode and a second impedance when in a second test mode. The first impedance is substantially the same as the nominal characteristic impedance of a network link cable not connected to a network and the second impedance is substantially different from the impedance of a network link cable that is terminated into a network. A method for measuring the length of a terminated network cable includes the steps of determining that the network cable is terminated at a network, selecting a test mode suitable for testing the terminated network cable, and performing time domain reflectometry testing on the terminated network cable.

A compact via transmission line for a printed circuit board having preferred characteristic impedance and capable of miniaturizing the printed circuit board including a multilayer printed circuit board, and extending the frequency range of a via transmission line mounted on the printed circuit board, and a design method of the same. The transmission line has a central conductor forming an inner conductor layer boundary make up a signal via hole, a plurality of via holes arranged around the central conductor form an outer conductor layer boundary, and a plurality of conductor plates formed of a printed circuit board conductor layer, is further provided with a constitutive parameter adjustment clearance hole between the inner and outer conductor layer boundaries of the compact via transmission line, and electrically isolates to prevent cross-talk of a signal propagating through a signal via hole with other signals in a high-frequency signal band.

Cable diagnostic test methods, systems and apparatus are disclosed that utilize “standing wave” principles to facilitate identification and location of insulation defect(s) along a power cable. The methods / systems measure dissipation factors and dielectric constants associated with the power cable insulation and the impedance of the power cable conductor at any number of points or sections along the axial length of the cable. In an exemplary embodiment, the disclosed method involves (i) connecting an alternating voltage source to a cable at a “sending end” thereof; (ii) applying a voltage to the cable at a first frequency to set up a traveling wave along the cable that is reflected at the “receiving end” thereof; (iii) permitting a standing wave pattern to be established along the cable by the traveling wave and the reflection thereof; (iv) measuring the total complex power loss (Sin) at the sending end of the cable; (v) calculating the standing wave voltage at any point / section of the cable based on the load impedance (ZL) connected at the receiving end of the cable, and the characteristic impedance (ZO) of the cable, or the measured / calculated cable parameters for the first frequency of the voltage source, (vi) repeating the foregoing steps while one of: (1) varying at least one of: the load impedance (ZL) connected at the receiving end of the cable, the first frequency of the voltage source; the output impedance of the voltage source, a combination of the load impedance (ZL), the output impedance of the voltage source and the first frequency of the voltage source, and combinations thereof; (2) interchanging sending and receiving cable ends; and (3) a combination thereof, and (vii) determining a dissipation factor (tan δ) and a dielectric constant (∈′), for the insulation, and an impedance, for the conductor at predetermined points / sections along the axis of the cable.

The embodiment of the invention discloses a high-frequency patch resistor which comprises a substrate, a back electrode, a surface electrode, a resistor body and a first lateral conducting electrode, wherein in order to enable characteristic impedance to be matched with anticipatory target impedance, the resistor body is provided with an external cutting notch, i.e. cutting is started from the edge of the resistor body, the partial area of the resistor body is directly cut off from the resistor body, and the cross-sectional area of the resistor body can be decreased to a greater degree, so that the high-frequency patch resistor has a larger resistance-adjusting range and is beneficial to the matching of the characteristic impedance of the characteristic impedance resistor and the anticipatory target impedance. The invention also provides a manufacturing method of the high-frequency patch resistor to manufacture the high-frequency patch resistor with the larger resistance-adjusting range. The high-frequency patch resistor provided by the invention is suitable for microwave radio-frequency structures and chipping, and meanwhile, the high-frequency patch resistor can be manufactured in large scales and with high efficiency by utilizing the manufacturing method of the high-frequency patch resistor provided by the invention.

Multilayer high speed flex printed circuit boards (FLEX-PCBs) are disclosed including a dielectrics systems with the back-side trenches, adhesives, signal lines and ground planes, wherein the signal line and ground plane lane are located on the dielectrics. Using of the open trenches in the substrate help to reduce the microwave loss and dielectric constant and thus increasing the signal carrying speed of the interconnects. Thus, according to the present invention, it is possible to provide a simply constructed multiplayer high speed FLEX-PCB using the conventional material and conventional FLEX-PCB manufacturing which facilitates the design of circuits with controlled bandwidth based on the trench opening in the dielectrics, and affords excellent connection reliability. As the effective dielectric constant is reduced, the signal width is required to make wider or the dielectric thickness is required to make thinner keeping fixed characteristics impedance. The fundamental techniques disclosed here can also be used for high-speed packaging.