673 results about "Test probe" patented technology

The invention discloses a large language model agent security test method and device based on a model context agreement, and the method comprises the steps: firstly deploying a test tool in a test server, defining an application program interface which comprises function parameters and test probe parameters, describing the test probe parameters as necessary technical requirements for executing nominal functions, and executing the nominal functions according to the test probe parameters; and inducing the tested LLM agent to transmit complete session context data when calling. The test server receives a tool call request including a function parameter value and session context data, a back-end concurrently processes the request, executes a nominal function to generate a benign result, and extracts the session context data at the same time. Afterwards, a benign result is returned to the tested LLM agent, and the extracted data is asynchronously transmitted to a remote log server for recording as a test log. And finally, comparing the test log with the actual operation history, judging whether a session context data leakage vulnerability exists or not, and quantifying the severity level so as to detect whether the LLM agent leaks session memories such as the user interaction history or not.

The invention provides a performance test and evaluation method, system and device for a power grid credential environment and a medium, and the method comprises the steps: obtaining real-time data of each node through employing a distributed test probe and a data flow distribution strategy, and constructing a digital twinborn body of the power grid credential environment; the digital twin body comprises twin nodes corresponding to the nodes; extracting multi-dimensional performance test data of each twin node under the performance test load by adopting a classification dimension convergence method; and based on the performance test prediction data of each twin node, performing risk assessment on each twin node by adopting an entropy weight-comprehensive sorting algorithm. According to the method, dynamic load balance of each node is ensured through a data traffic distribution strategy, normal operation of the power grid credential environment is prevented from being influenced during test evaluation, and the method is suitable for a complex scene in which the power grid credential environment is easily impacted by a high load; data evaluation is carried out through performance test prediction data, data exception can be captured, and potential performance risk bottlenecks of a power grid credential environment can be found in advance.

The utility model relates to a lateral touch spring type touch button circuit board testing machine, which comprises a test board, a positioning jig, a test board, a lifting assembly and a touch test assembly, a plurality of test probes are arranged on the test board, the test probes extend towards the direction of the positioning jig, the positioning jig is used for placing a circuit board to be tested, and the lifting assembly is arranged on the test board. The positioning jig is arranged on the test board and arranged on the test board in a floating mode, the test board is movably arranged over the positioning jig through the lifting assembly, and the test board presses the circuit board to be tested downwards through the lifting assembly so as to enable the circuit board to be tested to be in contact conduction with the plurality of test probes; the touch test assembly comprises a touch pen and a lateral driving piece, the touch pen is movably arranged on the side edge of the positioning jig through the lateral driving piece, and the touch pen cooperates with the pressed circuit board to be tested so as to laterally touch the spring type touch key. According to the utility model, the spring type touch key is automatically touched through the touch test assembly, and the touch pen touches the spring type touch key in the side direction, so that the circuit board can be better compatible with other electrical tests of the circuit board.

The utility model discloses an automatic bending and tin dipping device based on electromagnetic coil pins, which comprises a loading turntable structure provided with a controllable rotary turntable surface and a plurality of groups of electromagnetic coil stations; the loading and unloading carrying structure is arranged corresponding to the loading turntable structure; the pin bending structure is used for outputting stamping kinetic energy to bend electromagnetic coil pins; the soldering-aid dipping structure comprises a soldering-aid shifting and transposition assembly and a soldering flux lifting assembly, the soldering-aid shifting and transposition assembly is provided with a transposition kinetic energy output end, and the soldering flux lifting assembly is provided with a soldering flux lifting end; the pin tin immersion structure comprises a tin immersion transfer assembly and a tin melting liquid storage assembly. And the impedance detection structure comprises an upper and lower limit alarm resistance meter and a test probe, and can be arranged corresponding to the plurality of groups of electromagnetic coil stations in a switchable manner. The problems that in the prior art, bending and tin immersion processes of electromagnetic coil pins generally depend on manual operation, so that the overall automation degree, the operation efficiency and the qualified rate are low, and the labor cost is high are solved.

The invention discloses a resistivity static sounding in-situ test probe for evaluating unfrozen water content and ice content of frozen soil and a working method thereof.The test probe comprises a sounding probe body and a probe rod which are vertically distributed, the sounding probe body is located at the bottom end of the probe rod, and a coaxial cable is arranged in the probe rod in a penetrating mode; a broadband signal generator, an embedded data processor, an inclinometer, an annular electrode array, a temperature sensor, a pressure measuring assembly and a friction cylinder are sequentially arranged in the probe rod from top to bottom. According to the invention, resistivity inversion calculation and temperature compensation calculation are carried out through the embedded data processor, and end resistance, friction resistance, inclination, temperature, unfrozen water content, ice content and thaw collapse coefficient are output; according to the method, mechanical parameters and electrical parameters are synchronously obtained, multi-physical field coupling analysis is combined, the frozen soil thaw collapse deformation in-situ testing method based on broadband resistivity static sounding is constructed, and the defect that the content of unfrozen water and the content of ice in a soil body cannot be detected through an existing static sounding technology in China is overcome.

The invention relates to the technical field of semiconductor device testing and testing probes thereof, in particular to a semiconductor device testing probe and a semiconductor device testing method thereof. The method comprises the following steps: firstly, acquiring a contact stability coefficient of a test probe at each test monitoring moment, further determining all abnormal contact moments under each abnormal contact type in a preset historical test time period, and further determining the abnormal contact moments according to the total number of the abnormal contact types and the contact stability coefficient; according to the different abnormal contact types and the change distribution of the contact resistance in the preset time domain at the abnormal contact moment under the different abnormal contact types, acquiring the pressure application abnormal coefficient of the test probe and adjusting the applied pressure. According to the invention, the contact state is evaluated by analyzing the change characteristics of the contact resistance, and then the pressure application abnormal condition of the test probe is evaluated to adjust the pressure application, so that the good contact between the test probe and the device test point is ensured, and the test accuracy of the semiconductor device is improved.

The invention discloses an impedance matching method and system for chip testing, electronic equipment and a medium, and relates to the technical field of data processing. The method comprises the following steps: establishing electrical connection between a test probe and a to-be-tested chip test point, and sending a preset detection signal; acquiring incident power and reflection power of the detection signal; calculating a first signal reflection coefficient based on the incident power and the reflection power, and determining an impedance deviation value and an adjustment direction according to a difference value between the first signal reflection coefficient and a preset standard reflection coefficient; determining a parameter adjustment step length according to the impedance deviation value; sequentially adjusting a variable resistor, a variable capacitor and a variable inductor in the impedance matching network according to the step length and the adjusting direction; detecting a second signal reflection coefficient when the impedance real part and imaginary part of the variable element reach the target range; and judging whether the second signal reflection coefficient converges to a preset range, and if yes, taking the current matching network parameter as an impedance matching result. By implementing the technical scheme provided by the invention, the impedance matching accuracy of the chip test can be improved.

The invention relates to the technical field of insertion loss test, and discloses a spring force control insertion loss test probe device which comprises a mounting seat, an elastic probe assembly and a fine adjustment assembly. A supporting frame is arranged at the bottom of the mounting base, the elastic probe assembly is located below the mounting base, the elastic probe assembly is connected with the supporting frame, the height of the elastic probe assembly is adjustable, the fine adjustment assembly is located on one side of the probe assembly, one end of the fine adjustment assembly is connected with the elastic probe assembly, and the fine adjustment assembly is used for adjusting the elastic value of the elastic probe assembly. The optimal contact pressure can be accurately set according to the characteristics of different circuit boards, poor contact caused by too small pressure or needle mark damage caused by too large pressure is avoided, the same set of device can adapt to the test pressure requirements of different circuit boards, and the problem that the fixed elastic K value cannot be adjusted, and consequently the needle mark difference between different boards is large is solved.

The invention belongs to the technical field of semiconductor testing, and discloses a WAT test probe card life cycle management method and system. The method comprises the following steps: collecting full-life-cycle multi-source data of a probe card, performing unified management, and constructing a probe card digital twin data model; carrying out change point detection and segmentation on monitoring time sequence data, and constructing a stable fragment library; extracting a unified feature vector including electrical contact, test distribution, space structure and life load; calculating a needle card health index based on a machine learning regression model; predicting the remaining service life and the failure probability by using a proportional risk survival model; according to the health index, the remaining life and the failure probability, generating a maintenance decision suggestion and recommending execution time; the model is updated through maintenance result feedback, and closed-loop optimization is achieved. By means of the mode, accurate evaluation and predictive maintenance of the health state of the probe card are achieved.

The invention relates to the technical field of semiconductor micro-nano manufacturing, and discloses a novel semiconductor test probe manufacturing process which comprises the following steps: preparing an ionic liquid electrolyte containing a high-pressure priority adsorbent and a low-pressure priority adsorbent; a first voltage pulse is applied between the microelectrode and the conductive base, the amplitude of the first voltage pulse enables the high-voltage preferential adsorbent to preferentially adsorb on the surface of the microelectrode, and a flexible probe root and a flexible probe body are formed through deposition; then, a second voltage pulse is applied, and the amplitude of the second voltage pulse is lower than that of the first voltage pulse, so that the low-voltage preferential adsorbent preferentially adsorbs and deposits to form a superhard probe tip. The probe with the functional gradient structure is integrally manufactured by programmed voltage regulation and control in single continuous deposition, high hardness of the needle tip and high flexibility of the needle body are simultaneously realized on a single structure, the manufacturing process is remarkably simplified, and the cost is reduced.

The utility model relates to the technical field of electronic testing, in particular to a test probe. The test probe is used for detecting a tested product, the test probe comprises a plurality of contact parts, the plurality of contact parts are located at one end of the test probe, and the plurality of contact parts can be contacted with the tested product at the same time. The contact area between the test probe and the tested product during the open and short circuit test is increased, and the good contact between the test probe and the tested product (such as an FPC extension socket) is realized, so that the high misjudgment rate of the open and short circuit test is improved, and the production efficiency of equipment is improved.

The invention discloses an elastic sheet contact type large-current test probe which comprises a tube body, an upper probe body is arranged at one end of the tube body, a lower probe body is arranged at the other end, away from the upper probe body, of the tube body, the tube body, the upper probe body and the lower probe body form partial wrapping, and the lower probe body can move along the inner wall of the tube body in the tube body. A spring is arranged between the upper needle body and the lower needle body, a positioning piece extends from one end, close to the upper needle body, of the lower needle body, a clamping part extends from one end, close to the lower needle body, of the upper needle body, and when the spring is compressed, the clamping part is opened towards the tube body and keeps elastic clamping contact with the positioning piece. According to the invention, the positioning piece and the clamping part which are opposite to each other are arranged in the tube body, so that the spring is compressed when the spring is in a test state. The clamping part can elastically clamp the positioning piece after being opened, so that the upper probe body and the lower probe body are in stable contact, and therefore, in a large-current transmission test, the resistance is constant without attenuation, and the current stability is far better than that of a traditional probe.

The invention discloses a silver-gold-palladium-chromium-indium-yttrium alloy and a preparation method and application thereof, and belongs to the technical field of precise materials for semiconductor detection. The alloy comprises the following components in percentage by mass: 15%-20% of Au, 15%-18% of Pd, 8%-12% of Cr, 0.1%-0.3% of In, 0.2%-0.4% of Y and the balance of Ag. According to the preparation method, alloy component design is optimized, and an optimized preparation method is combined, so that a nano-to-micron Pd-Cr dispersed phase and Y element grain boundary segregation composite strengthened structure is formed through a multi-element synergistic strengthening mechanism, and the problems of In low-melting-point volatilization, columnar crystal length-diameter ratio control, high processing wire breakage rate and the like are solved; the alloy material with excellent comprehensive performance such as hardness, resistivity and machinability is obtained, meanwhile, the preparation cost of the alloy material is reduced, and the alloy material has better adaptability to a test probe subsequently matched with a process chip below 5nm.

Inconclusive and inconsistent results from existing haptic testing systems, e.g. for trackpads, which include rigidly mounted resistive load cells and accelerometers, prevent accurate results, especially in a high-volume production context. The use of a rigidly mounted sensor is unsuitable because a trackpad will generally be softer than the actuation system, whereby, when the haptic event is fired, the vast majority of the energy will be lost in the trackpad, while the sensor remains almost stationary. Accordingly, an improved test probe for a haptic device configured for mounting on a robotic arm, comprises: a contact tip configured for contacting the haptic device; a sensor configured for measuring a threshold force of the piezoelectric actuator device, and an haptic characteristic, e.g. acceleration, of a resulting haptic response thereof at a same time and a same location; and a compliant element configured for enabling the sensor to move relative to the haptic device.

The invention discloses a CIS wafer test probe card which comprises a PCB, a main frame used for fixing the PCB, an installation plate fixedly installed on the back face of the PCB, a lens module substrate fixed to the installation plate, an adapter plate installed on the front face of the PCB and a ceramic substrate fixedly installed on the front face of the adapter plate. A plurality of lens modules are fixedly mounted on the lens module substrate, the mounting plate, the PCB, the adapter plate and the ceramic substrate are all provided with lens mounting holes allowing lens bodies to penetrate through, and a plurality of spring needles electrically connected with the ceramic substrate and the PCB are arranged in the adapter plate. And a plurality of cantilever probes are arranged on the front surface of the ceramic substrate.

The invention discloses a test fixture and a test method suitable for various circuit boards, and the test fixture comprises a bottom plate, the top of which is provided with at least one first positioning groove; each fixing assembly comprises a fixing plate and a clamping groove structure, and the bottom of each fixing plate is provided with a fixing rib in sliding fit with the corresponding first positioning groove; the test probe assembly is detachably installed on the first set of fixing assemblies, the test probe assembly comprises a PCB, test probes and a probe pressure adjusting structure, the probe pressure adjusting structure comprises an elastic support installed on the PCB and a driving mechanism driving the elastic support to stretch out and draw back, and the multiple test probes are installed on the elastic support; and the electric connection assembly is detachably mounted on the second group of fixing assemblies. The test fixture provided by the invention can adapt to the test requirements of different types of circuit boards, the test pressure of the probe can be freely adjusted, the test fixture is simple and reliable in structure, and the fault rate and the maintenance cost are effectively reduced.

The invention discloses a control method of electronic test equipment and the electronic test equipment, and relates to the technical field of electronic products, and the control method of the electronic test equipment comprises the following steps: obtaining identification information of the electronic products to confirm a detection sequence; controlling a resistance test probe, a capacitance test probe and an insulation test probe to work in sequence according to a detection sequence so as to obtain test data of the electronic product, and comparing the test data with a preset condition to obtain a test result. Through a multi-parameter parallel measurement mode, the corresponding probes can be controlled to automatically switch the test modes according to the detection sequence, the electronic test requirements can be met, the requirements of different electronic product detection sequences can be matched, and the scheme can perform real-time analysis and comparison on multi-parameter test data through a unified data processing center. According to the invention, the process which needs to be completed by a plurality of independent test devices originally is integrated into one platform, so that the test process of the electronic product is optimized.

The invention discloses a test system and a test method. The test system comprises a control circuit, a detection circuit, a control unit, a feedback circuit, a test fixture structure, a test thimble and a placement table, a to-be-tested functional circuit board is placed on the placement table, the test fixture structure is used for fixing the to-be-tested functional circuit board, and the relative positions of test pins and test ejector pins of the to-be-tested functional circuit board are fixed; the control unit is connected with the control circuit, and the control unit is used for controlling the control circuit to be communicated with the burning ejector pin and the output end of an external burner in a power-on state and starting a burning action; the detection circuit is respectively connected with the function ejector pin of the test ejector pin and the control unit and is used for performing communication detection on the to-be-tested function circuit board after the control circuit stops acting; and the feedback circuit is connected with the control unit and is used for representing the detection result of the to-be-detected functional circuit board according to the detection signal provided by the control unit. The test efficiency of the functional circuit board is improved, and the complexity of the test process and the test cost are reduced.

The invention relates to the technical field of battery cell testing, in particular to a restraining tray and detection mechanism for battery cell testing, which comprises a first detection assembly arranged on the inner side of a supporting plate, and the first detection assembly is used for detecting the liquid leakage condition of a battery cell. An extrusion plate driven by a first push rod is matched with a limiting plate to stably clamp a battery cell, a limiting ring and a clamping grabbing ring are matched with a cushioning piece, the battery cell can be stably positioned, clamping damage can be avoided, the clamping grabbing ring can be made of an anti-skid material, the anti-skid performance of the clamped battery cell is improved, and the service life of the battery cell is prolonged. The first detection assembly is matched with driving of a motor to drive a battery cell to rotate so that a conductive sponge can collect leaked liquid, a humidity sensor can accurately recognize a leaked liquid signal, the real-time performance and reliability of leaked liquid detection are achieved, the second detection assembly enables a test probe to flexibly adjust the position through lifting adjustment of a lifting frame and bidirectional adaptation of a transverse adjusting groove and a longitudinal adjusting hole, and the detection accuracy is improved. Positive and negative electrode detection requirements of different specifications of battery cells are met, and the tray assembly does not need to be replaced.

The invention discloses an in-situ detection device and method integrating an electrochemical impedance spectroscopy technology and static sounding, and aims to realize synchronous in-situ detection of macromechanical parameters and microcosmic electrochemical properties of a soil body so as to improve the comprehensiveness and accuracy of geotechnical engineering field test. The device comprises an electrochemical test probe rod, a static sounding annular probe and a test analyzer, and the electrochemical test probe rod is provided with a linearly arranged three-electrode system and is integrally installed through an insulation module; the static sounding annular probe is provided with a plurality of sensors; the test method comprises the steps of connection of the test analyzer and the probe rod, penetration of the probe into the soil body, electrochemical test parameter setting, impedance spectrum acquisition, data fitting analysis and the like. Compared with a traditional drilling collection method, the method has the advantages that the original state of the soil body can be effectively kept, and meanwhile, the stratum structure identification, the moisture distribution prediction and the unfrozen water content analysis are realized in combination with the microscopic information obtained by the electrochemical impedance spectroscopy and the static sounding mechanical indexes, so that the macroscopic and microscopic properties of the soil layer are comprehensively reflected.

The application provides a wafer test probe card and a wafer test system. The wafer test probe card provided by the application comprises a mainboard, an interface assembly and a detection assembly. The interface assembly is arranged between the mainboard and the detection assembly. The mainboard comprises m first resource configuration modules. The detection assembly comprises a resource assembly module. The first resource configuration modules and the resource assembly module are connected through the interface assembly. The wafer test probe card provided by the application splits the construction of a test resource circuit into a general first resource configuration module for providing a test channel resource corresponding to a test task and a corresponding circuit component, and a special resource assembly module for assembling a test circuit corresponding to the test task based on the test channel resource and the circuit component provided by the first resource configuration module. In this way, the special components can be reduced, the general components can be compatible and reused during wafer testing, and the cost can be reduced.

This invention discloses a fully automated semiconductor testing probe device, including a support stage, a transport component, a rotating component, a telescopic component, and a driving component. The rotating component is located in the middle of the support stage, the transport component is located behind the rotating component, a test stage is located to the right of the rotating component, and an output stage is located in front of the rotating component. Stacked wafers to be tested are arranged inside the transport component, and the telescopic component is located inside the rotating component. When the output end of the rotating component rotates to the bottom of the transport component, the telescopic component reciprocates and drives the wafer at the bottom of the transport component to slide out of the transport component. The rotating component continues to rotate to the top of the test stage, and the telescopic component drives the wafer to slide to the top of the test stage. After the test is completed, the rotating component and the telescopic component drive the wafer to slide to the top of the output stage.

The application discloses a positioning pin detection method and device, and relates to the technical field of automatic testing, and comprises the following steps: in response to a target test tool entering a test station, obtaining a to-be-detected image of a region where a positioning pin is located on the target test tool; determining at least one region-of-interest subgraph in the to-be-detected image according to standard coordinate information of the target test tool; and comparing the region-of-interest subgraph with a corresponding standard template image to obtain an existence state detection result of the positioning pin in the region-of-interest subgraph. The application realizes automatic detection without interrupting continuous production, guarantees high detection accuracy and efficiency, avoids a quality detection vacuum period between problem occurrence and the next manual inspection, and further prevents the risk of misjudgment or missed judgment of a large number of products due to inaccurate contact of a test probe, so that the test tool can be detected in a timely and accurate manner without interrupting production.

A system and method provides for safeguarded selection of a polarity for selected application of power or ground to a test circuit via a circuit tester test probe. A positive polarity selection switch is aligned with a negative polarity selection switch on a probe surface. A virtual switch indicia is shown on a probe display with an actuation axis of the virtual switch oriented to correspond to relative alignment of the polarity switches. Pressing the positive polarity switch places the virtual switch in a first position indicating a positive probe polarity selection and pressing the negative polarity switch places the virtual switch in a second position indicating a negative probe polarity selection. Additional polarity selection indicia are generated to reinforce user recognition of a selected polarity to avoid circuit or probe damage.

The present invention relates to a test probe (10) for contactless measuring of the electromagnetic properties of a radio unit (20), in particular an antenna unit, the test probe (10) comprising a waveguide (1) for transmitting electromagnetic waves, a filler element (2) made of dielectric material and disposed in the waveguide (1), a lens element (3) for coupling electromagnetic waves into the waveguide (1), the lens element (3) being made of dielectric material and being disposed at one end of the waveguide (1), and a contact portion (4) for coupling out a measurement signal, the contact portion (4) being disposed at an end of the waveguide (1) opposite the lens element (3).

A device for measuring in-situ drilling rock hardness based on a high-pressure water pressure head comprises a hydraulic power system, a data acquisition system, a test probe and a push rod, the front end of the push rod is connected with the rear end of the test probe; the hydraulic power system comprises a manual hydraulic plunger pump; the manual hydraulic plunger pump is connected with the test probe through a reversing three-way valve; the data acquisition system comprises a data recorder, a displacement sensor and a pressure sensor, the displacement sensor and the pressure sensor are arranged on the manual hydraulic plunger pump, and the displacement sensor and the pressure sensor are connected with the data recorder through a signal receiver. The device is simple in structure, convenient to operate and capable of measuring the rock strength of different drill holes, different depths and different point positions so as to obtain the distribution condition of the roadway rock strength, the measuring result is close to the on-site rock mass, a water medium is used for pressure transmission, the measuring process is simple, convenient, environment-friendly and safe, errors in the processes of sampling, processing and the like are avoided, and the working efficiency is improved. And the measurement cost is reduced.

The utility model relates to the technical field of medical instruments, in particular to a multifunctional testing device applied to an oximeter, which comprises a test bench, a first detection area and a second detection area, an electric leakage detection station and a low voltage detection station are arranged in the first detection area, and a plurality of blood oxygen detection stations are arranged in the second detection area; a positioning seat is arranged in the first detection area, a test assembly is arranged above the positioning seat, and the test assembly comprises a stand column, a detection plate and a driving assembly; two test probes corresponding to the two positioning seats are arranged on the detection plate and used for synchronously testing electric leakage and low voltage of the oximeter, and a simulation finger is arranged at the blood oxygen detection station and used for testing blood oxygen of the oximeter. According to the utility model, the electric leakage and the low voltage are synchronously tested through the two test probes on the detection plate, so that the test waiting time is greatly reduced, a plurality of blood oxygen detection stations can simultaneously test a plurality of oximeters, and the test efficiency is further improved.

The embodiment of the utility model relates to the field of battery testing, and provides a testing device and a testing system.The testing device used for testing a back contact battery comprises a plurality of insulating supports and a plurality of conductive supports, the plurality of rows of test probes are arranged at intervals, each row of test probes are fixed on the conductive support, and one end, far away from the conductive support, of each test probe is used for abutting against the back contact battery; the multiple rows of suction nozzles are arranged at intervals, each row of suction nozzles is fixed on the insulation support, one end, far away from the insulation support, of each suction nozzle is used for abutting against the back contact battery, and the suction nozzles can telescopically move towards the insulation support or far away from the insulation support, so that the back contact battery can be conveniently tested.

The utility model discloses a semiconductor device testing tool, and relates to the technical field of electronic equipment testing. The semiconductor device test tool comprises a test board and a mounting seat slidably arranged above the test board, a test circuit is arranged in the test board, a test probe electrically connected with the test circuit is arranged above the test board, a driving device is arranged above the test board, and the driving device is electrically connected with the test circuit. And the driving device linearly moves towards the mounting seat for a preset stroke and then drives the mounting seat to move towards the test board, so that the test probe penetrates through the mounting seat and is electrically connected with a semiconductor device in the mounting seat. The test stability of the semiconductor device can be improved.

This utility model relates to the field of solenoid valve testing technology and discloses a solenoid valve life test bench that is easy to fix. It includes a bench body, a vertical plate fixedly mounted on the upper end of the bench body, a groove formed at the upper end of the vertical plate, a movable component slidably mounted inside the groove, and a mounting groove formed at the upper end of the movable component. A test probe connected to a multimeter is mounted inside the mounting groove. A placement plate is fixedly mounted on the upper end of the bench body, and a fastening structure is provided on the upper end of the placement plate. The fastening structure includes a fastening seat fixedly mounted on the upper end of the placement plate, a fixing plate fixedly mounted on the rear side of the upper end of the fastening seat, a movable rod movably mounted inside the front end of the fastening seat, a movable plate fixedly mounted on the rear end of the movable rod, and a spring mounted on the outer wall of the movable rod. A solenoid valve body is positioned between the movable plate and the fixing plate. This utility model discloses a solenoid valve life test bench that is easy to fix, which can speed up the fastening of the solenoid valve and accelerate the energization test of the solenoid valve.