1442 results about "Test probe" patented technology

The invention relates to the technical field of probe testing, and discloses a probe testing device and method, and the method comprises the steps: carrying out the synchronous collection of the electric signal response characteristics of a plurality of chip testing probes in a chip contact process, analyzing the signal transmission interference relation between the probes, and obtaining a multi-probe signal coupling feature pattern; identifying a target signal transmission channel to obtain a first test probe configuration scheme; performing test signal input and response acquisition on the chip to obtain electrical characteristic time-frequency data of the chip; and performing multi-probe collaborative analysis and feature extraction on the time-frequency data of the electrical characteristics of the chip to obtain abnormal indication information of the electrical performance of the chip, and adjusting test parameters and contact positions of a plurality of chip test probes to obtain a configuration scheme of a second test probe. Therefore, the test system can intelligently adjust the subsequent test strategy according to the preliminary test result, and the intelligence and automation of the test process are realized.

The invention discloses an automatic bending and tin immersion device and method based on electromagnetic coil pins, and the device comprises a loading turntable structure which is provided with a controllable rotary turntable surface and a plurality of groups of electromagnetic coil stations; the loading and unloading carrying structure is arranged corresponding to the loading turntable structure; the pin bending structure is used for outputting stamping kinetic energy to bend electromagnetic coil pins; the soldering-aid dipping structure comprises a soldering-aid shifting and transposition assembly and a soldering flux lifting assembly, the soldering-aid shifting and transposition assembly is provided with a transposition kinetic energy output end, and the soldering flux lifting assembly is provided with a soldering flux lifting end; the pin tin immersion structure comprises a tin immersion transfer assembly and a tin melting liquid storage assembly. And the impedance detection structure comprises an upper and lower limit alarm resistance meter and a test probe, and can be arranged corresponding to the plurality of groups of electromagnetic coil stations in a switchable manner. The problems that in the prior art, bending and tin immersion processes of electromagnetic coil pins generally depend on manual operation, so that the overall automation degree, the operation efficiency and the qualified rate are low, and the labor cost is high are solved.

The invention discloses a high-conductivity palladium alloy for a chip test probe and a preparation method of the high-conductivity palladium alloy, and the palladium alloy comprises the following components in percentage by mass: 50-58% of Pd, 35-40% of Cu, 5-10% of Ag, 0.05-1.0% of Cr and 0.1-1.5% of auxiliary elements, the auxiliary element is selected from at least one of Al, Zn, In and Si; the resistivity of the palladium alloy is 8.0 mu omega.cm or below, the Vickers hardness is 450 HV or above, the 90-degree bending frequency is 8 or above, the tensile strength is 1500 MPa or above, and the ductility is 6% or above, the palladium alloy is subjected to pre-smelting and secondary smelting, and at least part of Cu and at least part of Cr in raw materials are mixed and pre-smelted to obtain a copper-chromium intermediate alloy; and the copper-chromium intermediate alloy and the remaining raw materials are mixed and then subjected to secondary smelting. The palladium alloy can meet the urgent requirements of probes in various forms on low resistance, high plasticity and toughness, fatigue resistance, mechanical strength and the like at the same time.

The invention discloses a large language model agent security test method and device based on a model context agreement, and the method comprises the steps: firstly deploying a test tool in a test server, defining an application program interface which comprises function parameters and test probe parameters, describing the test probe parameters as necessary technical requirements for executing nominal functions, and executing the nominal functions according to the test probe parameters; and inducing the tested LLM agent to transmit complete session context data when calling. The test server receives a tool call request including a function parameter value and session context data, a back-end concurrently processes the request, executes a nominal function to generate a benign result, and extracts the session context data at the same time. Afterwards, a benign result is returned to the tested LLM agent, and the extracted data is asynchronously transmitted to a remote log server for recording as a test log. And finally, comparing the test log with the actual operation history, judging whether a session context data leakage vulnerability exists or not, and quantifying the severity level so as to detect whether the LLM agent leaks session memories such as the user interaction history or not.

The invention belongs to the technical field of PCB detection equipment, particularly relates to a flying probe test probe deviation compensation method, device and equipment and a medium, and provides a method for directly calculating and compensating deviation through a flying probe machine camera system. According to the method, the center of the driving end of the probe serves as a reference point, the probe is controlled to move in the preset direction till the visual center position coincides with the preset position of a target plate, related coordinates and distance values are obtained through a camera system, the motion compensation value of the probe to be compensated is calculated and determined, and finally the driving end is controlled to move to complete deviation compensation. According to the invention, external tools are not needed, rapid and accurate needle point deviation compensation is realized, and the test efficiency and precision of the flying probe machine are improved.

The invention discloses a solar cell process passivation monitoring and repairing device, which relates to the technical field of crystalline silicon solar cell manufacturing, and comprises a test probe row, a roller slide platform, a data analysis system and a laser, the laser is a purple picosecond laser, the pulse energy density is 500W / cm < 2 >-8000W / cm < 2 >, the laser repetition frequency is 500KHz-2000KHz, and the pulse stability is less than 3% RMS. According to the invention, monitoring data is collected, an abnormal area and repair data are analyzed and fed back to the laser, the laser adopts laser with a certain pulse signal to carry out thermal processing, crystal lattices are enabled to vibrate orderly through thermal driving, and internal doping of polycrystalline silicon is redistributed, so that the purpose of repairing an abnormal silicon wafer is achieved. And the manufacturing cost of the solar cell is further reduced.

The invention is applicable to the technical field of PCB testing, and particularly relates to a PCB electrical performance testing method, which comprises the following steps of: acquiring test object information; wherein the object information comprises a PCB image and at least one test area, the PCB image corresponds to the PCB and reflects the circuit structure of the PCB, the test area is marked on the PCB image, and the test area comprises a main test position and an auxiliary test position; when an electrical performance test instruction is received, contact judgment information is obtained based on the test object information; when it is detected that the auxiliary test probe is in stable contact with the auxiliary test position, the control device controls the main test probe to continuously send test signals and collect test results in real time, and test analysis information is obtained based on the test results. According to the PCB electrical performance test method provided by the embodiment of the invention, the problem of high test error caused by asynchronous actions of the main test probe and the auxiliary test probe can be improved.

The invention provides an automatic observation device for inclination deformation in a rock-soil body, which relates to the technical field of geotechnical engineering monitoring and comprises a host control terminal, a lifting power mechanism, a lifting positioning mechanism, a lifting protection mechanism, a posture rotating mechanism and a limiting self-locking mechanism which are arranged above an orifice of a monitoring hole, and the lifting inclinometer probe is arranged in the monitoring hole inclinometer pipe. The host control terminal drives the lifting power mechanism, the lifting positioning mechanism, the lifting protection mechanism, the posture rotating mechanism and the limiting self-locking mechanism to control the lifting inclinometer probe to freely ascend and descend in the inclinometer pipe in the 0-degree posture and the 180-degree posture, and zero-point limiting self-locking is achieved. The lifting inclinometer probe is internally provided with a three-axis MEMS inclination angle sensor, continuously collects inclination data of strata along a cruise line, and autonomously completes wireless transmission and non-contact induction charging of observation data. The single probe is used for realizing whole-hole inclination deformation measurement, repeated use is supported, and low-cost, full-automatic and high-precision observation of inclination deformation in the rock-soil body is realized.

The utility model discloses a low-leakage double-signal test probe, which comprises a probe arm, a double-tip coaxial probe and a pair of connectors are regularly mounted on the probe arm, the pair of connectors comprises a Force end connector and a Sense end connector, two tips at the front end of the double-tip coaxial probe are bent towards each other and are close to each other but not in contact to form a double-tip structure, and the Force end connector is connected with the Sense end connector. And two needle rods at the rear end of the connector are electrically connected to the Force end connector and the Sense end connector respectively. According to the utility model, through the designed double-needle-point structure, the contact area between the needle point and the PAD can be increased, so that the contact resistance between the needle point and the PAD is effectively reduced, and the parasitic resistance of the probe and the contact resistance between the needle point and the PAD are perfectly eliminated. Meanwhile, the needle point only needs to be in effective contact with the PAD, the requirement for the needle inserting depth is low, damage to the PAD is small, the service life of the PAD can be remarkably prolonged, and the accuracy of a test result can still be guaranteed after repeated testing.

The invention relates to the technical field of precision machinery manufacturing technology, and discloses a high-efficiency wafer test probe station, which comprises a base, the upper surface of the base is fixedly connected with a loading base and a motion control system, the output end of the motion control system is fixedly connected with a microscope, the upper surface of the loading base is fixedly connected with an objective table, and the objective table is fixedly connected with the output end of the motion control system. The interior of the base is in threaded connection with a synchronous adjusting mechanism and a support protection mechanism, the top of the synchronous adjusting mechanism is fixedly connected with a probe angle adjusting mechanism, and the upper surface of the probe angle adjusting mechanism is clamped with a probe seat, so that simultaneous adjustment of a plurality of probes can be realized, the test time is shortened, and the test efficiency is improved. Adjustment is carried out according to different wafer sizes to adapt to different test scenes; the angle of the probe is adjusted by adjusting the angle of the probe seat, so that the influence of resistance on a test signal is reduced in a low-resistance test.

The invention provides a mainboard testing method and system, and relates to the technical field of mainboard testing methods.The mainboard testing method comprises the steps that firstly, an impedance compensation matrix is generated through pre-calibration sweep frequency signals, full-band dynamic calibration is conducted on probe impedance characteristics, and signal attenuation and phase deviation caused by impedance mismatch between a testing probe and a mainboard interface are eliminated; secondly, based on multi-channel frequency domain filtering and linear combination, separating frequency domain sensitive frequency bands and time domain fluctuation characteristics of test parameters, calculating parameter weights by fusing frequency domain energy and time domain variance, avoiding the limitation of single domain analysis, and enhancing the detection sensitivity of the hidden defects of the mainboard; according to the test parameter weight vector and the probe weight mapping matrix, the test parameter weight vector is converted into a test probe weight vector, finally, the parameter importance is quantified as a basis for probe excitation intensity and sampling rate adjustment, and the beneficial effect that test resources are distributed according to needs is achieved.

The invention discloses a circuit board defect detection method and system based on multi-band impedance matching, and relates to the technical field of circuit board quality inspection, and the method comprises the steps: determining corresponding test bias voltages of a reconfigurable impedance matching network at a plurality of test frequency points according to a band bias voltage relation table; for each test frequency point, test bias voltage matched with the test frequency point is applied to each adjustable element, and a radio frequency signal is injected into the circuit board to be tested, so that a corresponding reflection coefficient is acquired through a test probe; based on the multi-frequency sparse dictionary and a compressed sensing algorithm, reconstructing a three-dimensional scattering image in the circuit board; and calculating negative logarithm likelihood distribution corresponding to the three-dimensional scattering image, and respectively solving a hierarchy anomaly score of the corresponding circuit physical layer by combining the spatial information of each circuit physical layer so as to screen at least one abnormal circuit physical layer. Therefore, signal feature reconstruction is used for replacing high-precision physical imaging, and hierarchical space identification of circuit board defects is realized.

The invention discloses a flexible FPC nickel sheet electrical test module and a test machine thereof, the flexible FPC nickel sheet electrical test module comprises a bearing driving assembly and a test assembly, and a support is provided with a first test channel and a second test channel in parallel at an interval; a bearing driving assembly and a testing assembly are arranged in the first testing channel and the second testing channel; the bearing driving assembly is arranged on the bracket; the mounting frame is of a U-shaped frame body structure with a downward opening, and concave mounting sliding grooves of strip-shaped structures are formed in the front side wall and the rear side wall of the mounting frame; the test assembly comprises a test support plate, a floating plate, a test part and a pre-pressing piece. Two-stage flexible connection of floating plate overall flexible support and test probe flexible connection of the test component is adopted, elastic contact between the test probe and the nickel sheet in the process of pressing down to contact the nickel sheet is achieved, bending deformation of the test probe in the pressing down contact process is effectively avoided, the test precision is improved, and the test efficiency is improved. And the test assembly is integrally mounted in a sideslip adjustable manner, so that the mounting position can be accurately adjusted while the detachable mounting is met.

The invention provides a novel semiconductor test probe manufacturing process, which comprises the following steps of: coating a first photoresist layer on a silicon substrate, photoetching and developing; growing a metal layer on the silicon substrate by using an electroplating method; cleaning after removing the first photoresist layer; growing a silicon oxide layer on the silicon substrate and the metal layer; coating a second photoresist layer, photoetching and developing to form a probe beam etching position; performing dry etching on the silicon oxide layer below the etching position of the probe beam; performing partial dry etching on the metal layer below the etching position of the probe beam to form the probe beam; cleaning after removing the second photoresist layer; cleaning after removing the silicon oxide layer; coating a third photoresist layer, photoetching and developing to form a probe angle etching position; partially etching the metal layer below the probe angle etching position to form a probe head; and cleaning after removing the third photoresist layer. According to the novel semiconductor test probe manufacturing process provided by the invention, the process flow is simplified, and the tip angle of the probe can be well controlled.

The invention belongs to the technical field of disc-shaped flange part detection equipment, and discloses rotor inner cavity bolt connection rigidity detection equipment. The rotor inner cavity bolt connection rigidity automatic detection equipment comprises a clamping module, a lifting module, a rotation module and a probe test module which are all integrated on a main body rack, the clamping module is used for clamping and positioning, the lifting module is used for providing pressing force for a test probe and a tested piece, and the rotation module is used for rotating the test probe and the tested piece. The rotation module is used for circumferential indexing positioning among different measurement positions, and the probe test module is used for testing the connection rigidity of a single bolt. All the functions are realized by adopting a semi-automatic means, so that the test working efficiency and the test precision can be improved. According to the automatic detection equipment, a solution of a method for placing a test probe in a space circumferential rotation mode, wherein the test probe is carried in a restricted space on one side, and automatic operation of the evaluation parameter testing and obtaining process of bolt connection in the restricted space of an inner cavity of a disc-shaped part is achieved.

The utility model provides a chip testing device and a chip testing system, and relates to the technical field of chip testing. According to the utility model, a probe seat is installed on a first PCB through a bolt, the probe seat is provided with an installation position used for installing a tested chip and a test probe installed at the installation position, the test probe penetrates through the probe seat, the top of the test probe is contacted with the tested chip, and the probe seat is provided with at least one second positioning hole at a position close to the installation position. And the shaft pin passes through the second positioning hole and the first positioning hole, so that the bottom of the test probe is in full contact with the first PCB. According to the technical scheme, the gap between the probe seat and the first PCB is reduced equivalently by using the shaft pin, so that the test probe can abut against the first PCB, normal conduction of a circuit is ensured, and the stability of testing the tested chip is ensured.

The utility model provides a testing device for chip testing, and relates to the technical field of chip testing. A plurality of test probes penetrate through an upper base, a conductive part is mounted at the bottom of the upper base and comprises a plurality of insulating component groups and a plurality of conductive component groups arranged at intervals along a first direction, each conductive component group comprises at least one conductive sheet, the top of each conductive sheet is in contact with the corresponding test probe, and the bottom of each conductive sheet is in contact with a tested chip. An insulating component group is arranged between two adjacent conductive component groups, and each insulating component group comprises at least one insulating sheet. According to the utility model, the conductive member is equivalently arranged between the tested chip and the test probe, the effective contact area with the tested chip is increased by using the conductive sheet of the conductive member, and the contact pressure between the conductive sheet and the tested chip is reduced relative to the contact pressure between the test probe and the tested chip, so that the current is shunted, and the test efficiency is improved. The current distribution is more uniform, and the situation that the tested chip is scratched due to the fact that the test probe is heated and softened is avoided.

The utility model relates to a motor stator electrical performance detection mechanism and equipment, which belongs to the technical field of motor stator electrical performance detection, and comprises a bottom plate, a plurality of clamping jaws arranged on the bottom plate, a top plate, an air cylinder arranged on the top plate, and a lifting plate connected with the output end of the air cylinder, the inclined blocks are fixed on the lifting plate; the clamping jaw comprises a fixed seat, a test probe arranged on the fixed seat, a jaw body and an elastic structure, the middle part of the jaw body is rotationally connected with the fixed seat through a pin shaft, and the jaw body comprises an inclined arm positioned at the upper part of the jaw body and a bent hook positioned at the lower part of the jaw body. A device comprises a fixing frame, a lifting mechanism, a carrying mechanism and a motor stator electrical performance detection mechanism. According to the scheme, the number of used air cylinders is small, cost is low, the space occupancy rate is low, and clamping force is stable.

A method for bonding tested wafers is provided. The method includes the following operations. A first wafer having a first surface is received, and the first wafer includes a test pad and a conductive pad at the first surface of the first wafer and the test pad has a recess caused by a test probe and the conductive pad is electrically connected to the test pad. The first surface of the first wafer is planarized. A first hybrid bonding layer is formed over the first surface of the first wafer. The first wafer and a second wafer are bonded to connect the first hybrid bonding layer and a second hybrid bonding layer on the second water. A semiconductor structure and a method for testing pre-bonded wafers are also provided.

The invention discloses a needle bed for testing an integrated circuit, and relates to the technical field of test needle beds. The device comprises a transverse plate, the top of the transverse plate is in sliding fit with a storage plate, the transverse plate is in sliding fit with a mounting plate, a plurality of elastic probes are mounted on the mounting plate, and each elastic probe comprises a fixed section and a pointed-cone-shaped movable section. During cleaning, the cleaning plate can be driven to be far away from the mounting plate, the driving mechanism synchronously drives the movable plates to be close to each other, and finally the driving part synchronously drives the movable section to rotate, so that the surface oxide layer of the test probe can be cleaned on the premise of not dismounting the test probe, and the test probe cleaning device is relatively convenient and easy to use.

The invention discloses a test method for a three-terminal laminated cell IV, and belongs to the technical field of solar cell testing, and the method comprises the steps: moving a three-terminal laminated cell to an IV test bearing platform, stabilizing the cell through an index plate, starting an upper end positioning camera, recognizing a mark point of the cell, and obtaining position information; the dividing plate rotates according to a set program and conveys the positioned battery piece to a test probe by means of high-precision mechanical transmission; probe pressing and position correction: after the battery piece is in place, upper and lower probes are accurately pressed into the front and back surfaces of the battery piece, and a test connection circuit is constructed; the IV test of the three-terminal laminated solar cell is realized through one-time probe pressing and two-time flash test. The brand-new three-terminal laminated cell IV test method provided by the invention ensures accurate measurement, avoids the risk of cell piece breakage caused by secondary pressing, realizes one-time pressing of the three-terminal cell, improves the test efficiency, and simplifies the operation links.

The invention discloses integrated electronic brake system PCBA program burning and detecting equipment which comprises a whole machine frame and a burning and testing mechanism, and a burning and testing machine base and a burning and testing upper tool are arranged on the lower portion in the frame of the burning and testing mechanism. A clamping block is slidably arranged at the upper end opening of a butt joint through hole in the burning test upper tool, a hydraulic fluid channel is annularly distributed, and the upper end opening is in linkage with the clamping block through a sleeve spring piston. A reciprocating lead screw in a lead screw box on the rear side is connected with a plate unloading motor and a grabbing clamp through a driving seat, path sliding blocks on the two sides of the grabbing clamp are matched with a downward pressing sliding way on the surface of an upper tool to achieve lifting, the lower portion of the lead screw box is communicated with a liquid pipe through a spring piston, and a toothed plate in a burning frame is meshed with a driving gear; pCBA automatic feeding, discharging, overturning and discharging are achieved through linkage of a grabbing clamp and a transmission mechanism, and the productivity is improved through synchronous operation of a front station and a rear station; the clamping blocks are hydraulically driven to form annular flexible support for the test probe, the posture of the probe is self-adaptively corrected through the arc-shaped clamping blocks, and probe inclination caused by PCBA positioning deviation is avoided.

The invention belongs to the technical field of underwater measurement, and discloses a test probe underwater depth automatic positioning method and system, and the method comprises the steps: collecting an absolute water pressure value of a current underwater environment, and carrying out the calculation of a hydrostatic pressure value through combining with water surface reference air pressure data; meanwhile, acoustic signals from the water surface base station are received, response is returned, and the round-trip propagation time of sound waves in the water body is measured and obtained; collecting water body temperature data and salinity change data, estimating density information of the current water body, and converting a hydrostatic pressure value into a pressure depth value; calculating an average sound wave propagation speed by adopting an empirical sound velocity model, and calculating an acoustic depth value of the probe in combination with back-and-forth propagation time of sound waves in the water body; the depth positioning precision and stability of the underwater probe in a complex environment are effectively improved, and high-reliability and high-precision underwater depth automatic positioning is realized.

The invention provides an LCD display screen production visual angle testing device, and relates to the technical field of display screen visual angle testing. The LCD display screen production visual angle testing device comprises a testing table, a horizontal rotating mechanism is arranged on the testing table, a vertical rotating mechanism is coaxially and fixedly connected to the horizontal rotating mechanism, a display screen is clamped to the vertical rotating mechanism, two sets of deflection restraining mechanisms are arranged on a rotating table and a side skirt edge respectively, and the two sets of deflection restraining mechanisms are arranged on the rotating table and the side skirt edge respectively. One of the two groups of deflection inhibiting mechanisms is vertically arranged, and the other group of deflection inhibiting mechanisms is transversely arranged; the two groups of deflection inhibiting mechanisms respectively apply pulling force to the rotating table and the side skirt edge; the test bench is also provided with a test probe, two groups of deflection inhibition mechanisms on the bottom side of the rotating table are used to apply pulling forces in the axial direction and the radial direction respectively, the axial offset generated in the rotating process of the rotating table is corrected, and the accuracy and the efficiency of a test result are improved.

The invention relates to the technical field of wafer testing, and discloses a wafer testing probe card and a wafer testing device. The discharging opening is formed in the outer surface wall of the machine shell; the control panel is fixedly installed on the side face of the machine shell. The movable seat is movably mounted on the inner bottom wall of the machine shell; the lifting seat is fixedly mounted on the top surface of the moving seat; and the detection seat is arranged at the top end of the lifting seat. Through the arrangement of the air blowing assembly, when the detection seat drives the wafer to move up and down, the pressing plate compresses or stretches the air guide bag along with pressing and releasing of the supporting plate, periodic compression and stretching of the air guide bag are controlled through the one-way valve between the guide pipe and the nozzle, intermittent air blowing to the probe is formed, extra energy supply is not needed, and the detection efficiency is improved. And moreover, the real-time performance and continuity of probe cleaning are realized, continuous cleaning of the surface of the probe in the test process is ensured, and test errors and chip damage caused by probe pollution are effectively prevented.

1. The name of this design product: test probe (flat head SCPC028MG). 2. Purpose of this design product: This design is used for semiconductor and chip testing. 3. The design key point of this appearance design product lies in the shape. 4. The picture or photo that best illustrates the design points: three-dimensional picture.

The invention provides a performance test and evaluation method, system and device for a power grid credential environment and a medium, and the method comprises the steps: obtaining real-time data of each node through employing a distributed test probe and a data flow distribution strategy, and constructing a digital twinborn body of the power grid credential environment; the digital twin body comprises twin nodes corresponding to the nodes; extracting multi-dimensional performance test data of each twin node under the performance test load by adopting a classification dimension convergence method; and based on the performance test prediction data of each twin node, performing risk assessment on each twin node by adopting an entropy weight-comprehensive sorting algorithm. According to the method, dynamic load balance of each node is ensured through a data traffic distribution strategy, normal operation of the power grid credential environment is prevented from being influenced during test evaluation, and the method is suitable for a complex scene in which the power grid credential environment is easily impacted by a high load; data evaluation is carried out through performance test prediction data, data exception can be captured, and potential performance risk bottlenecks of a power grid credential environment can be found in advance.

The invention discloses a new energy automobile battery testing device, relates to the field of battery testing, and solves the problem of poor convenience of an existing battery testing device.The new energy automobile battery testing device comprises an operation table and a supporting seat fixedly installed at the bottom of the operation table, a positioning cylinder is fixedly installed at the top of the operation table, and a top box is fixedly installed at the top of the positioning cylinder; the bottom of the top box is provided with two symmetrically distributed test rods, and the bottom of the top box is fixedly provided with a test probe; the feeding mechanism is used for conveying and testing the battery on the operation table, and the feeding mechanism is mounted at the top of the operation table; a plurality of batteries are sequentially conveyed in a rotary conveying mode through the feeding mechanism, the two testing rods are in butt joint with the positive electrodes and the negative electrodes of the batteries correspondingly, appearance testing is conducted on the batteries through the testing probes, and the problem that workers need to repeatedly move for feeding and discharging is solved; therefore, the effect of improving the convenience of battery testing is achieved.

The invention provides a probe card tip condition detection method, a probe card tip condition detection structure, a wafer and a wafer test method, and relates to a probe card tip condition detection method, which comprises the following steps: determining a plurality of probes to be tested of a probe card; a plurality of probe pads are determined, and a metal wire structure is arranged between every two probe pads in sequence so as to be connected to form a test circuit; probes to be tested are inserted into the corresponding probe pads for contact connection; dividing and designing a plurality of test groups based on the positions of the probe pads in the test circuit, and measuring the contact resistance of the to-be-tested probes and the corresponding probe pads; and judging the tip state of the to-be-tested probe based on the contact resistance of the to-be-tested probe and the corresponding probe pad. The probe point condition of the probe card is monitored by using an electrical test means, so that the test cost is reduced, and the test accuracy and the detection efficiency are further improved.

The invention discloses PCB chip testing equipment, relates to the field of PCB chip testing equipment, and solves the problem that chips in different placement states are difficult to automatically clamp and detect when the existing PCB chip testing equipment is used, the PCB chip testing equipment comprises a machine body, a conveying mechanism, a testing mechanism and an opening and closing mechanism, and a first detection frame and a second detection frame are arranged in the machine body; the conveying mechanism comprises a supporting plate and a conveying belt, the testing mechanism comprises a testing probe, a PCB chip is input to a set position through the conveying belt to be tested, the first detection frame is driven by the testing mechanism to move downwards, the testing probe on the upper side is made to test the top face of the PCB chip, when detection cannot be conducted, the PCB chip and the supporting plate are continuously pushed to move downwards, and the PCB chip can be tested. And controlling the support plate to slide and open towards two sides, and stopping the opening state after the PCB chip slides to the edge position of the support plate until the bottom surface of the PCB chip is in contact detection with the test probe on the second detection frame, so that the test efficiency is improved.