888 results about "Test probe" patented technology

The invention discloses a high-conductivity palladium alloy for a chip test probe and a preparation method of the high-conductivity palladium alloy, and the palladium alloy comprises the following components in percentage by mass: 50-58% of Pd, 35-40% of Cu, 5-10% of Ag, 0.05-1.0% of Cr and 0.1-1.5% of auxiliary elements, the auxiliary element is selected from at least one of Al, Zn, In and Si; the resistivity of the palladium alloy is 8.0 mu omega.cm or below, the Vickers hardness is 450 HV or above, the 90-degree bending frequency is 8 or above, the tensile strength is 1500 MPa or above, and the ductility is 6% or above, the palladium alloy is subjected to pre-smelting and secondary smelting, and at least part of Cu and at least part of Cr in raw materials are mixed and pre-smelted to obtain a copper-chromium intermediate alloy; and the copper-chromium intermediate alloy and the remaining raw materials are mixed and then subjected to secondary smelting. The palladium alloy can meet the urgent requirements of probes in various forms on low resistance, high plasticity and toughness, fatigue resistance, mechanical strength and the like at the same time.

The invention discloses a large language model agent security test method and device based on a model context agreement, and the method comprises the steps: firstly deploying a test tool in a test server, defining an application program interface which comprises function parameters and test probe parameters, describing the test probe parameters as necessary technical requirements for executing nominal functions, and executing the nominal functions according to the test probe parameters; and inducing the tested LLM agent to transmit complete session context data when calling. The test server receives a tool call request including a function parameter value and session context data, a back-end concurrently processes the request, executes a nominal function to generate a benign result, and extracts the session context data at the same time. Afterwards, a benign result is returned to the tested LLM agent, and the extracted data is asynchronously transmitted to a remote log server for recording as a test log. And finally, comparing the test log with the actual operation history, judging whether a session context data leakage vulnerability exists or not, and quantifying the severity level so as to detect whether the LLM agent leaks session memories such as the user interaction history or not.

The invention is applicable to the technical field of PCB testing, and particularly relates to a PCB electrical performance testing method, which comprises the following steps of: acquiring test object information; wherein the object information comprises a PCB image and at least one test area, the PCB image corresponds to the PCB and reflects the circuit structure of the PCB, the test area is marked on the PCB image, and the test area comprises a main test position and an auxiliary test position; when an electrical performance test instruction is received, contact judgment information is obtained based on the test object information; when it is detected that the auxiliary test probe is in stable contact with the auxiliary test position, the control device controls the main test probe to continuously send test signals and collect test results in real time, and test analysis information is obtained based on the test results. According to the PCB electrical performance test method provided by the embodiment of the invention, the problem of high test error caused by asynchronous actions of the main test probe and the auxiliary test probe can be improved.

The utility model provides a testing device for chip testing, and relates to the technical field of chip testing. A plurality of test probes penetrate through an upper base, a conductive part is mounted at the bottom of the upper base and comprises a plurality of insulating component groups and a plurality of conductive component groups arranged at intervals along a first direction, each conductive component group comprises at least one conductive sheet, the top of each conductive sheet is in contact with the corresponding test probe, and the bottom of each conductive sheet is in contact with a tested chip. An insulating component group is arranged between two adjacent conductive component groups, and each insulating component group comprises at least one insulating sheet. According to the utility model, the conductive member is equivalently arranged between the tested chip and the test probe, the effective contact area with the tested chip is increased by using the conductive sheet of the conductive member, and the contact pressure between the conductive sheet and the tested chip is reduced relative to the contact pressure between the test probe and the tested chip, so that the current is shunted, and the test efficiency is improved. The current distribution is more uniform, and the situation that the tested chip is scratched due to the fact that the test probe is heated and softened is avoided.

The utility model relates to a motor stator electrical performance detection mechanism and equipment, which belongs to the technical field of motor stator electrical performance detection, and comprises a bottom plate, a plurality of clamping jaws arranged on the bottom plate, a top plate, an air cylinder arranged on the top plate, and a lifting plate connected with the output end of the air cylinder, the inclined blocks are fixed on the lifting plate; the clamping jaw comprises a fixed seat, a test probe arranged on the fixed seat, a jaw body and an elastic structure, the middle part of the jaw body is rotationally connected with the fixed seat through a pin shaft, and the jaw body comprises an inclined arm positioned at the upper part of the jaw body and a bent hook positioned at the lower part of the jaw body. A device comprises a fixing frame, a lifting mechanism, a carrying mechanism and a motor stator electrical performance detection mechanism. According to the scheme, the number of used air cylinders is small, cost is low, the space occupancy rate is low, and clamping force is stable.

The invention discloses integrated electronic brake system PCBA program burning and detecting equipment which comprises a whole machine frame and a burning and testing mechanism, and a burning and testing machine base and a burning and testing upper tool are arranged on the lower portion in the frame of the burning and testing mechanism. A clamping block is slidably arranged at the upper end opening of a butt joint through hole in the burning test upper tool, a hydraulic fluid channel is annularly distributed, and the upper end opening is in linkage with the clamping block through a sleeve spring piston. A reciprocating lead screw in a lead screw box on the rear side is connected with a plate unloading motor and a grabbing clamp through a driving seat, path sliding blocks on the two sides of the grabbing clamp are matched with a downward pressing sliding way on the surface of an upper tool to achieve lifting, the lower portion of the lead screw box is communicated with a liquid pipe through a spring piston, and a toothed plate in a burning frame is meshed with a driving gear; pCBA automatic feeding, discharging, overturning and discharging are achieved through linkage of a grabbing clamp and a transmission mechanism, and the productivity is improved through synchronous operation of a front station and a rear station; the clamping blocks are hydraulically driven to form annular flexible support for the test probe, the posture of the probe is self-adaptively corrected through the arc-shaped clamping blocks, and probe inclination caused by PCBA positioning deviation is avoided.

The invention belongs to the technical field of underwater measurement, and discloses a test probe underwater depth automatic positioning method and system, and the method comprises the steps: collecting an absolute water pressure value of a current underwater environment, and carrying out the calculation of a hydrostatic pressure value through combining with water surface reference air pressure data; meanwhile, acoustic signals from the water surface base station are received, response is returned, and the round-trip propagation time of sound waves in the water body is measured and obtained; collecting water body temperature data and salinity change data, estimating density information of the current water body, and converting a hydrostatic pressure value into a pressure depth value; calculating an average sound wave propagation speed by adopting an empirical sound velocity model, and calculating an acoustic depth value of the probe in combination with back-and-forth propagation time of sound waves in the water body; the depth positioning precision and stability of the underwater probe in a complex environment are effectively improved, and high-reliability and high-precision underwater depth automatic positioning is realized.

The invention provides a performance test and evaluation method, system and device for a power grid credential environment and a medium, and the method comprises the steps: obtaining real-time data of each node through employing a distributed test probe and a data flow distribution strategy, and constructing a digital twinborn body of the power grid credential environment; the digital twin body comprises twin nodes corresponding to the nodes; extracting multi-dimensional performance test data of each twin node under the performance test load by adopting a classification dimension convergence method; and based on the performance test prediction data of each twin node, performing risk assessment on each twin node by adopting an entropy weight-comprehensive sorting algorithm. According to the method, dynamic load balance of each node is ensured through a data traffic distribution strategy, normal operation of the power grid credential environment is prevented from being influenced during test evaluation, and the method is suitable for a complex scene in which the power grid credential environment is easily impacted by a high load; data evaluation is carried out through performance test prediction data, data exception can be captured, and potential performance risk bottlenecks of a power grid credential environment can be found in advance.

The utility model relates to a lateral touch spring type touch button circuit board testing machine, which comprises a test board, a positioning jig, a test board, a lifting assembly and a touch test assembly, a plurality of test probes are arranged on the test board, the test probes extend towards the direction of the positioning jig, the positioning jig is used for placing a circuit board to be tested, and the lifting assembly is arranged on the test board. The positioning jig is arranged on the test board and arranged on the test board in a floating mode, the test board is movably arranged over the positioning jig through the lifting assembly, and the test board presses the circuit board to be tested downwards through the lifting assembly so as to enable the circuit board to be tested to be in contact conduction with the plurality of test probes; the touch test assembly comprises a touch pen and a lateral driving piece, the touch pen is movably arranged on the side edge of the positioning jig through the lateral driving piece, and the touch pen cooperates with the pressed circuit board to be tested so as to laterally touch the spring type touch key. According to the utility model, the spring type touch key is automatically touched through the touch test assembly, and the touch pen touches the spring type touch key in the side direction, so that the circuit board can be better compatible with other electrical tests of the circuit board.

The utility model discloses an automatic bending and tin dipping device based on electromagnetic coil pins, which comprises a loading turntable structure provided with a controllable rotary turntable surface and a plurality of groups of electromagnetic coil stations; the loading and unloading carrying structure is arranged corresponding to the loading turntable structure; the pin bending structure is used for outputting stamping kinetic energy to bend electromagnetic coil pins; the soldering-aid dipping structure comprises a soldering-aid shifting and transposition assembly and a soldering flux lifting assembly, the soldering-aid shifting and transposition assembly is provided with a transposition kinetic energy output end, and the soldering flux lifting assembly is provided with a soldering flux lifting end; the pin tin immersion structure comprises a tin immersion transfer assembly and a tin melting liquid storage assembly. And the impedance detection structure comprises an upper and lower limit alarm resistance meter and a test probe, and can be arranged corresponding to the plurality of groups of electromagnetic coil stations in a switchable manner. The problems that in the prior art, bending and tin immersion processes of electromagnetic coil pins generally depend on manual operation, so that the overall automation degree, the operation efficiency and the qualified rate are low, and the labor cost is high are solved.

According to the test probe assembly, the test system and the test method provided by the invention, in the test probe assembly, the active test probe is additionally provided with the power detector and / or the signal generator on the basis of the passive test probe, so that the transceiving performance test of the tested piece can be realized under the condition that a test instrument is not used, the test cost is reduced, and the test efficiency is improved. The total transmitting power or the total receiving power of the tested piece can be accurately obtained in one-time transmitting testing or one-time receiving testing, the testing efficiency is greatly improved, and the method is particularly suitable for rapid testing of a production line.

The invention discloses a resistivity static sounding in-situ test probe for evaluating unfrozen water content and ice content of frozen soil and a working method thereof.The test probe comprises a sounding probe body and a probe rod which are vertically distributed, the sounding probe body is located at the bottom end of the probe rod, and a coaxial cable is arranged in the probe rod in a penetrating mode; a broadband signal generator, an embedded data processor, an inclinometer, an annular electrode array, a temperature sensor, a pressure measuring assembly and a friction cylinder are sequentially arranged in the probe rod from top to bottom. According to the invention, resistivity inversion calculation and temperature compensation calculation are carried out through the embedded data processor, and end resistance, friction resistance, inclination, temperature, unfrozen water content, ice content and thaw collapse coefficient are output; according to the method, mechanical parameters and electrical parameters are synchronously obtained, multi-physical field coupling analysis is combined, the frozen soil thaw collapse deformation in-situ testing method based on broadband resistivity static sounding is constructed, and the defect that the content of unfrozen water and the content of ice in a soil body cannot be detected through an existing static sounding technology in China is overcome.

The invention relates to the technical field of semiconductor device testing and testing probes thereof, in particular to a semiconductor device testing probe and a semiconductor device testing method thereof. The method comprises the following steps: firstly, acquiring a contact stability coefficient of a test probe at each test monitoring moment, further determining all abnormal contact moments under each abnormal contact type in a preset historical test time period, and further determining the abnormal contact moments according to the total number of the abnormal contact types and the contact stability coefficient; according to the different abnormal contact types and the change distribution of the contact resistance in the preset time domain at the abnormal contact moment under the different abnormal contact types, acquiring the pressure application abnormal coefficient of the test probe and adjusting the applied pressure. According to the invention, the contact state is evaluated by analyzing the change characteristics of the contact resistance, and then the pressure application abnormal condition of the test probe is evaluated to adjust the pressure application, so that the good contact between the test probe and the device test point is ensured, and the test accuracy of the semiconductor device is improved.

The utility model discloses a testing tool of a current sensor, which relates to the technical field of chip testing and comprises the current sensor, a shell is arranged on the outer side of the current sensor, a magnetic core is arranged on the inner side of the shell, a Hall chip is arranged on the inner side of the magnetic core, pins are arranged on the side face of the Hall chip, and the pins are arranged on the side face of the Hall chip. According to the utility model, the pin part of the chip adopts the contact of the test probe for signal transmission, the test probe is fixed on the probe base, and then the test probe and the probe base are fixed on the slide block with the guide rail together, so that the purpose that the test probe is rapidly separated from or contacted with the pin of the chip is achieved; the rotatable screw on the limiting block on one side can be used for abutting against the probe base after the test probe is in contact with the chip pin, so that the probe is prevented from being separated from the pin, and the limiting effect is achieved. According to the invention, a plurality of current sensors can be conveniently tested at the same time, and the current sensors can be rapidly mounted and dismounted in a lossless manner, so that the production efficiency is remarkably improved, and the risks of chip pin deformation and the like caused by testing are reduced.

The invention provides a to-be-tested antenna positioning method and an antenna test system, and the method comprises the steps: carrying out the calibration compensation of a test pseudo-range between each test probe and a to-be-tested antenna at different test points through a calibration compensation value between each test probe, which is obtained through a time difference of arrival method; therefore, the calibrated and compensated test pseudo-range of each test probe between different test points and the to-be-tested antenna is obtained, the position of the to-be-tested antenna is calculated according to the calibrated and compensated test pseudo-range, the accuracy of the finally calculated position information of the to-be-tested antenna is good, and the to-be-tested antenna can be accurately positioned.

The invention discloses an impedance matching method and system for chip testing, electronic equipment and a medium, and relates to the technical field of data processing. The method comprises the following steps: establishing electrical connection between a test probe and a to-be-tested chip test point, and sending a preset detection signal; acquiring incident power and reflection power of the detection signal; calculating a first signal reflection coefficient based on the incident power and the reflection power, and determining an impedance deviation value and an adjustment direction according to a difference value between the first signal reflection coefficient and a preset standard reflection coefficient; determining a parameter adjustment step length according to the impedance deviation value; sequentially adjusting a variable resistor, a variable capacitor and a variable inductor in the impedance matching network according to the step length and the adjusting direction; detecting a second signal reflection coefficient when the impedance real part and imaginary part of the variable element reach the target range; and judging whether the second signal reflection coefficient converges to a preset range, and if yes, taking the current matching network parameter as an impedance matching result. By implementing the technical scheme provided by the invention, the impedance matching accuracy of the chip test can be improved.

The invention relates to the technical field of insertion loss test, and discloses a spring force control insertion loss test probe device which comprises a mounting seat, an elastic probe assembly and a fine adjustment assembly. A supporting frame is arranged at the bottom of the mounting base, the elastic probe assembly is located below the mounting base, the elastic probe assembly is connected with the supporting frame, the height of the elastic probe assembly is adjustable, the fine adjustment assembly is located on one side of the probe assembly, one end of the fine adjustment assembly is connected with the elastic probe assembly, and the fine adjustment assembly is used for adjusting the elastic value of the elastic probe assembly. The optimal contact pressure can be accurately set according to the characteristics of different circuit boards, poor contact caused by too small pressure or needle mark damage caused by too large pressure is avoided, the same set of device can adapt to the test pressure requirements of different circuit boards, and the problem that the fixed elastic K value cannot be adjusted, and consequently the needle mark difference between different boards is large is solved.

The invention belongs to the technical field of semiconductor testing, and discloses a WAT test probe card life cycle management method and system. The method comprises the following steps: collecting full-life-cycle multi-source data of a probe card, performing unified management, and constructing a probe card digital twin data model; carrying out change point detection and segmentation on monitoring time sequence data, and constructing a stable fragment library; extracting a unified feature vector including electrical contact, test distribution, space structure and life load; calculating a needle card health index based on a machine learning regression model; predicting the remaining service life and the failure probability by using a proportional risk survival model; according to the health index, the remaining life and the failure probability, generating a maintenance decision suggestion and recommending execution time; the model is updated through maintenance result feedback, and closed-loop optimization is achieved. By means of the mode, accurate evaluation and predictive maintenance of the health state of the probe card are achieved.

The invention relates to the technical field of semiconductor micro-nano manufacturing, and discloses a novel semiconductor test probe manufacturing process which comprises the following steps: preparing an ionic liquid electrolyte containing a high-pressure priority adsorbent and a low-pressure priority adsorbent; a first voltage pulse is applied between the microelectrode and the conductive base, the amplitude of the first voltage pulse enables the high-voltage preferential adsorbent to preferentially adsorb on the surface of the microelectrode, and a flexible probe root and a flexible probe body are formed through deposition; then, a second voltage pulse is applied, and the amplitude of the second voltage pulse is lower than that of the first voltage pulse, so that the low-voltage preferential adsorbent preferentially adsorbs and deposits to form a superhard probe tip. The probe with the functional gradient structure is integrally manufactured by programmed voltage regulation and control in single continuous deposition, high hardness of the needle tip and high flexibility of the needle body are simultaneously realized on a single structure, the manufacturing process is remarkably simplified, and the cost is reduced.

The utility model relates to the technical field of electronic testing, in particular to a test probe. The test probe is used for detecting a tested product, the test probe comprises a plurality of contact parts, the plurality of contact parts are located at one end of the test probe, and the plurality of contact parts can be contacted with the tested product at the same time. The contact area between the test probe and the tested product during the open and short circuit test is increased, and the good contact between the test probe and the tested product (such as an FPC extension socket) is realized, so that the high misjudgment rate of the open and short circuit test is improved, and the production efficiency of equipment is improved.

The invention provides wafer testing equipment, and relates to the technical field of wafer testing. A heating part, a test probe assembly and a tested wafer are placed in a test cavity formed by connecting a test seat and a first PCB (printed circuit board), a first Pad position is arranged at the bottom of the test seat, and a first switching probe is in contact with the heating part and is connected with the first Pad position. The switching assembly and the power-up mechanism are located at the bottom of the wafer test fixture, and the driving mechanism is located at the top of the wafer test fixture and is arranged to controllably drive the wafer test fixture to move downwards, so that the first PCB is in contact with the switching assembly and the first Pad position is in contact with the household appliance mechanism, and the test of the tested wafer is realized. According to the technical scheme, the heating component is placed in the testing cavity and is close to the tested wafer, generated heat can be quickly transferred to the tested wafer, the temperature rise rate is high, the high-temperature testing efficiency of the tested wafer is improved, and the influence on the environment temperature is small.

The present invention discloses a packaging shell protection structure for a temperature sensor, which belongs to the field of sensor technology and includes a packaging shell. A dual PT temperature sensor and a PE vibration sensor are provided in the packaging shell. The packaging shell includes a probe end, a connection end, and a sensor conversion end. The probe end includes a probe temperature sensing cover, a central partition mounting member is provided in the probe temperature sensing cover, and a vibration test probe is provided at the end of the probe temperature sensing cover. The present invention completely avoids the problem of the vibration core squeezing the PT sensor lead in traditional assembly by fixing the PE integrated circuit board and the internal control column threading hole through a U-shaped card slot, significantly improving the product molding quality and long-term stability, increasing the electrical gap, and enhancing the insulation withstand voltage performance. Two sets of platinum resistance temperature sensing elements are used in conjunction with a temperature isolation chamber design. The sensors are quickly switched through a magnetic control system without waiting for temperature recovery, and the response speed is greatly improved. The dual sensor data are mutually calibrated to improve the temperature measurement accuracy and reliability.

The invention discloses an elastic sheet contact type large-current test probe which comprises a tube body, an upper probe body is arranged at one end of the tube body, a lower probe body is arranged at the other end, away from the upper probe body, of the tube body, the tube body, the upper probe body and the lower probe body form partial wrapping, and the lower probe body can move along the inner wall of the tube body in the tube body. A spring is arranged between the upper needle body and the lower needle body, a positioning piece extends from one end, close to the upper needle body, of the lower needle body, a clamping part extends from one end, close to the lower needle body, of the upper needle body, and when the spring is compressed, the clamping part is opened towards the tube body and keeps elastic clamping contact with the positioning piece. According to the invention, the positioning piece and the clamping part which are opposite to each other are arranged in the tube body, so that the spring is compressed when the spring is in a test state. The clamping part can elastically clamp the positioning piece after being opened, so that the upper probe body and the lower probe body are in stable contact, and therefore, in a large-current transmission test, the resistance is constant without attenuation, and the current stability is far better than that of a traditional probe.

The invention discloses a silver-gold-palladium-chromium-indium-yttrium alloy and a preparation method and application thereof, and belongs to the technical field of precise materials for semiconductor detection. The alloy comprises the following components in percentage by mass: 15%-20% of Au, 15%-18% of Pd, 8%-12% of Cr, 0.1%-0.3% of In, 0.2%-0.4% of Y and the balance of Ag. According to the preparation method, alloy component design is optimized, and an optimized preparation method is combined, so that a nano-to-micron Pd-Cr dispersed phase and Y element grain boundary segregation composite strengthened structure is formed through a multi-element synergistic strengthening mechanism, and the problems of In low-melting-point volatilization, columnar crystal length-diameter ratio control, high processing wire breakage rate and the like are solved; the alloy material with excellent comprehensive performance such as hardness, resistivity and machinability is obtained, meanwhile, the preparation cost of the alloy material is reduced, and the alloy material has better adaptability to a test probe subsequently matched with a process chip below 5nm.

The invention relates to the technical field of coal mine underground geological survey, and provides a coal mine drill hole rock mechanical parameter testing system and method.The coal mine drill hole rock mechanical parameter testing system comprises a main machine; the rock parameter testing probe is electrically connected with the host machine, and the rock parameter testing probe is provided with an orientation measuring device; the end part of the push rod is connected with the rock parameter test probe, and the push rod is used for driving the rock parameter test probe to enter a test drill hole in the roadway surrounding rock; various rock mechanical parameters can be measured at the same time through one-time testing, comprehensive surrounding rock mechanical property data are provided, the testing time and cost are reduced, and the testing efficiency is improved; measurement in multiple different directions is accurately achieved in the testing process, all directions of the circumference of the drill hole can be covered, mechanical parameters of the roadway surrounding rock in different directions can be comprehensively obtained, and the overall mechanical characteristics of the surrounding rock can be reflected more truly.

Inconclusive and inconsistent results from existing haptic testing systems, e.g. for trackpads, which include rigidly mounted resistive load cells and accelerometers, prevent accurate results, especially in a high-volume production context. The use of a rigidly mounted sensor is unsuitable because a trackpad will generally be softer than the actuation system, whereby, when the haptic event is fired, the vast majority of the energy will be lost in the trackpad, while the sensor remains almost stationary. Accordingly, an improved test probe for a haptic device configured for mounting on a robotic arm, comprises: a contact tip configured for contacting the haptic device; a sensor configured for measuring a threshold force of the piezoelectric actuator device, and an haptic characteristic, e.g. acceleration, of a resulting haptic response thereof at a same time and a same location; and a compliant element configured for enabling the sensor to move relative to the haptic device.

The invention discloses a CIS wafer test probe card which comprises a PCB, a main frame used for fixing the PCB, an installation plate fixedly installed on the back face of the PCB, a lens module substrate fixed to the installation plate, an adapter plate installed on the front face of the PCB and a ceramic substrate fixedly installed on the front face of the adapter plate. A plurality of lens modules are fixedly mounted on the lens module substrate, the mounting plate, the PCB, the adapter plate and the ceramic substrate are all provided with lens mounting holes allowing lens bodies to penetrate through, and a plurality of spring needles electrically connected with the ceramic substrate and the PCB are arranged in the adapter plate. And a plurality of cantilever probes are arranged on the front surface of the ceramic substrate.

The invention discloses a test fixture and a test method suitable for various circuit boards, and the test fixture comprises a bottom plate, the top of which is provided with at least one first positioning groove; each fixing assembly comprises a fixing plate and a clamping groove structure, and the bottom of each fixing plate is provided with a fixing rib in sliding fit with the corresponding first positioning groove; the test probe assembly is detachably installed on the first set of fixing assemblies, the test probe assembly comprises a PCB, test probes and a probe pressure adjusting structure, the probe pressure adjusting structure comprises an elastic support installed on the PCB and a driving mechanism driving the elastic support to stretch out and draw back, and the multiple test probes are installed on the elastic support; and the electric connection assembly is detachably mounted on the second group of fixing assemblies. The test fixture provided by the invention can adapt to the test requirements of different types of circuit boards, the test pressure of the probe can be freely adjusted, the test fixture is simple and reliable in structure, and the fault rate and the maintenance cost are effectively reduced.

The invention discloses a control method of electronic test equipment and the electronic test equipment, and relates to the technical field of electronic products, and the control method of the electronic test equipment comprises the following steps: obtaining identification information of the electronic products to confirm a detection sequence; controlling a resistance test probe, a capacitance test probe and an insulation test probe to work in sequence according to a detection sequence so as to obtain test data of the electronic product, and comparing the test data with a preset condition to obtain a test result. Through a multi-parameter parallel measurement mode, the corresponding probes can be controlled to automatically switch the test modes according to the detection sequence, the electronic test requirements can be met, the requirements of different electronic product detection sequences can be matched, and the scheme can perform real-time analysis and comparison on multi-parameter test data through a unified data processing center. According to the invention, the process which needs to be completed by a plurality of independent test devices originally is integrated into one platform, so that the test process of the electronic product is optimized.