114 results about "Test probe" patented technology

This utility model relates to the field of solenoid valve testing technology and discloses a solenoid valve life test bench that is easy to fix. It includes a bench body, a vertical plate fixedly mounted on the upper end of the bench body, a groove formed at the upper end of the vertical plate, a movable component slidably mounted inside the groove, and a mounting groove formed at the upper end of the movable component. A test probe connected to a multimeter is mounted inside the mounting groove. A placement plate is fixedly mounted on the upper end of the bench body, and a fastening structure is provided on the upper end of the placement plate. The fastening structure includes a fastening seat fixedly mounted on the upper end of the placement plate, a fixing plate fixedly mounted on the rear side of the upper end of the fastening seat, a movable rod movably mounted inside the front end of the fastening seat, a movable plate fixedly mounted on the rear end of the movable rod, and a spring mounted on the outer wall of the movable rod. A solenoid valve body is positioned between the movable plate and the fixing plate. This utility model discloses a solenoid valve life test bench that is easy to fix, which can speed up the fastening of the solenoid valve and accelerate the energization test of the solenoid valve.

Disclosed is a test probe. The test probe includes a barrel having a shape of a cylinder and a terminal including a terminal body portion partially inserted into a first end of the barrel, and a contact portion integrally extended from the terminal body portion to contact a protruding terminal of a test object. The contact portion includes a tip support portion including a support body provided on the terminal body portion and a tip base protruding in a horn shape from a first end of the support body, and a tip portion plated on an outer surface of the tip base and an upper surface of the support body surrounding a lower end of the tip base in a material having a higher hardness than the tip support portion, and the tip portion is formed thicker at an upper portion of the tip base than at a lower portion.

This invention provides a semiconductor oxidation prevention testing method and apparatus. The semiconductor oxidation prevention testing method includes: arranging multiple units under test (DUTs) on the top surface of a test sample; depositing a first film layer on the top surface of the test sample, ensuring the first film layer completely covers the multiple DUTs on the test sample; squeezing out the air between the first film layer and the test sample; and inserting a test probe through the first film layer and contacting the DUTs for testing, until all DUTs on the test sample have been tested. This invention protects the test sample and the DUTs on it by depositing a film to form a first film layer on the test sample. Furthermore, squeezing out the air between the first film layer and the test sample prevents the test probe from discharging during testing and from reacting with oxygen to form an oxide film. It is suitable for inter-process storage, long-term storage, and long-distance transportation. It saves production costs and improves testing efficiency.

Disclosed is a test probe including barrel including tubular barrel main body, and skirt portions separated from each other by slits formed in first end portion of barrel main body in lengthwise direction; and plunger including sliding portion accommodated in barrel main body and sliding along lengthwise direction of barrel, and terminal contact portion extending from the sliding portion along lengthwise direction and exposed beyond skirt portion. Skirt portion includes skirt main body extending in lengthwise direction of barrel main body, and skirt diameter-reducing portion curved reducing diameter thereof in fore-end area of skirt main body in lengthwise direction of barrel and including facing end portion to face surface of terminal contact portion. Sliding portion includes small diameter portion positioned in skirt main body and having a first diameter, and a large diameter portion positioned in the barrel main body and having a second diameter larger than the first diameter.

A method for detecting and removing at least one atmospheric pollutant from a surface of an aircraft engine component includes detecting the at least one atmospheric pollutant on the surface of the aircraft engine component using a test probe and treating the at least one aircraft engine component to generate a layer of at least one of a soot or other carbonaceous substance on the at least one aircraft engine component to at least partially remove the at least one atmospheric pollutant from the surface of the aircraft engine component.

The application discloses an iridium element reinforced palladium-gold-copper alloy and a preparation method and application thereof, and relates to the technical field of electric contact metal materials. The raw material composition of the iridium element reinforced palladium-gold-copper alloy prepared by the application comprises, in percentage by mass, 0.5-1.5% of Ir, 9-16% of Au and 20-40% of Cu, and the balance is Pd. The specific preparation method is as follows: raw materials are weighed and mixed in proportion to obtain mixed raw material powder; the mixed raw material powder is vacuum smelted under an inert atmosphere to obtain alloy liquid; the alloy liquid is suction cast to obtain an ingot; the ingot is subjected to multi-pass rolling, drawing, intermediate annealing treatment, solid solution treatment and aging treatment to obtain an iridium element reinforced palladium-gold-copper alloy wire; and through the synergistic effect of component design and process control, the prepared iridium element reinforced palladium-gold-copper alloy has good processing performance under the premise of considering the strength, contact stability and low contact resistance of the contact material, and meets the stringent requirements of high-end alloy base materials for current semiconductor test probes.

The application discloses a multifunctional drilling soil body anisotropy parameter testing device and method, which comprises a supporting mechanism, a variable-diameter driving mechanism and a penetration testing mechanism; two supporting mechanisms are respectively arranged at two ends of the hole testing device and are provided with bidirectional air cylinders, and supporting plates are connected to two ends of the bidirectional air cylinders; the variable-diameter driving mechanism is arranged at the middle part of the hole testing device and comprises three structural connecting discs which are arranged at intervals along the axial direction, a structural support rod is arranged to connect the three structural connecting discs, two series air cylinders are fixed to the upper and lower sides of the middle structural connecting disc; a connecting rod support is connected to the piston of the series air cylinder, and the connecting rod support is hingedly connected to the first ends of four connecting rods; a probe sliding seat is arranged on the upper and lower structural connecting discs, a probe is arranged in the sliding seat, and the tail end of the connecting rod is hingedly connected to the probe through a through groove; a conical sounding probe head is arranged at the first end of the probe, and a direct current method testing probe head is arranged at the bottom of the conical sounding probe head; and the two are combined to test and obtain the anisotropy parameters of the soil in the hole.

The utility model discloses a terminal anti -swing test seat, including upper insulating seat, lower insulating seat and conductive terminal structure, the upper end surface of lower insulating seat is provided with the accommodation groove, the conductive terminal structure includes the action terminal and static terminal of setting in the accommodation groove, the one end of action terminal and static terminal elastic abutment, the lower end of upper insulating seat is provided with the anti -swing structure, and the anti -swing structure is used for action terminal horizontal limit, the bottom of accommodation groove is provided with terminal action groove, in the utility model, through setting the anti -swing structure in the lower end of upper insulating seat, can be in horizontal direction to action terminal horizontal limit, reduce the horizontal deviation of action terminal, thereby reduce the influence of the assembly precision of action terminal to its deformation amount in the test state, avoid action terminal after the probe insertion of test probe and cause the excessive deformation and lead to the original state of being unable to restore.

To provide a coil module, a probe for detecting an eddy current, and an eddy current detector which can be manufactured at low cost in a short time.SOLUTION: The coil module includes: a cross coil having a first coil forming an annular shape surrounding a first axial line, and a second coil forming an annular shape surrounding a second axial line intersecting the first axial line and covering a part of an outer peripheral side of the first coil; and a coil holder having a storage recessed part for holding a plurality of cross coils formed in a state where a plurality of cross coils are arrayed in an arraying direction extending in a direction intersecting with the first axial line and the second axial line in a surface formed by the first axial line and the second axial line. In a pair of cross coils adjacent to each other in the arraying direction, the first coil of the cross coil on one side faces the second coil of the cross coil on the other side, and the second coil of the cross coil on one side faces the first coil of the cross coil on the other side.SELECTED DRAWING: Figure 3

Disclosed is test probe including barrel including tubular barrel main body, and skirt portions separated from each other by slits formed in first end portion of barrel main body in lengthwise direction; and plunger including sliding portion accommodated in barrel main body and sliding along the lengthwise direction of the barrel, and a terminal contact portion extending from the sliding portion beyond the skirt portion along the lengthwise direction. The skirt portion includes a skirt main body extending in the lengthwise direction of the barrel main body, and a skirt diameter-reducing portion curved reducing a diameter thereof in a fore-end area of the skirt main body in an axial-line direction of the barrel and including a facing end portion to face a surface of the terminal contact portion. The facing length of the facing end portion in the axial-line direction is greater than the thickness of the skirt diameter-reducing portion.

This utility model relates to the field of PCB probe technology, and more particularly to a PCB test probe anti-offset fixture. The technical solution includes a guide plate one and a guide plate two. The lower surface of the guide plate one is fixedly connected to the guide plate two via a fixing post. The surface of the guide plate one has evenly distributed screw holes one through it. The guide plate two has screw holes two corresponding to the screw holes one. A needle sleeve is threadedly installed between the screw holes one and the corresponding screw holes two, and a probe is slidably connected inside the needle sleeve. This utility model, through the cooperation between the guide plate one and the guide plate two, fixes both ends of the needle sleeve to the two guide plates, thereby making the needle sleeve more stable. Simultaneously, the threaded engagement between the contact surfaces of the needle sleeve and the guide plates one and two further stabilizes the needle sleeve, and makes replacement more convenient and quick. After the needle sleeve is stably fixed, the offset and shaking of the probe passing through the needle sleeve during testing can be reduced.

The application discloses a double-head double-motion spring for a semiconductor test probe and a processing method thereof, and relates to the technical field of semiconductor testing.The first effective part and the second effective part are provided with the integrated coaxial line structure but different middle diameters, and the spring is fixed in the middle part of the probe shell by the fixed clamping groove, so that the single spring provides differentiated elastic force for two independent motion probes.The effective part with the smaller middle diameter has greater rigidity, can exert greater test pressure on the driven probe, and avoids the problems of excessive contact resistance and signal distortion, and the other end can generate smaller test pressure to prevent the problem of physical damage.

The application discloses a universal motor insulation detection device, and relates to the technical field of motor insulation detection.The universal motor insulation detection device comprises a conveying device, a conveying belt is arranged in the conveying device, one rack is arranged on one side of the conveying device, a first electric sliding rail is slidably connected to the inner side wall of the top end of the rack, and a motor body is arranged on the conveying belt.The test probe can be flexibly adjusted in position and posture, so that a single detection device can automatically adapt to and accurately contact diversified wiring terminals of different types of motors, such as AC asynchronous motors, DC motors, synchronous motors and servo motors, thereby realizing efficient and automatic universal detection of the insulation performance of various types of motors, significantly improving equipment utilization and detection efficiency, and being especially suitable for multi-model sampling inspection in mass production and detection requirements of various types of repair motors after use failure, and effectively solving the problems of poor universality and inconvenient switching of existing automatic detection devices.

The application relates to an austenite sensitization detection method, a system, an electronic device, a readable storage medium and a program product, the method is applied to a control module of an austenite sensitization detection system, and the method comprises the following steps: acquiring magnetic adsorption force information corresponding to an austenite component to be detected; the magnetic adsorption force information is obtained based on the magnetic adsorption force between the austenite component to be detected and a test probe of the austenite sensitization detection system; and the sensitization degree of the austenite component to be detected is determined according to the magnetic adsorption force information. The application can effectively improve the sensitization degree detection efficiency of the austenite.

A test fixture, a test device, and a test method are provided. The test fixture includes: a top cover having a floating pressing assembly and an input plate connected to the floating pressing assembly; the input plate is configured to input a test signal and has a first test probe, the first test probe being configured to connect to a pad on the top surface of a component under test; the floating pressing assembly has a pre-compressed first spring, the first spring being configured to be compressible secondaryly; and a base including a second test probe, the second test probe being configured to connect to a pad on the bottom surface of the component under test. The top cover can be flipped relative to the base to engage or disengage. The pre-compressed first spring in the floating pressing assembly of the test fixture facilitates the application of force to the component under test by the floating pressing assembly after the first test probe contacts the component under test, thereby causing the component under test to move downwards, which facilitates the connection of the second test probe to the pad on the bottom surface of the component under test.

This application provides a near-field delay correction method for optical true-delay phased array surfaces, relating to the field of phased array technology. The method includes: sending a drive signal to a scanning gantry via an automatic control test system to align a test probe located on top of the scanning gantry with the channel under test; sending a single-measurement start signal to a beam control system via the automatic control test system, causing the beam control system to control the activation of the corresponding channel under test based on the single-measurement start signal; sending a single-pulse point frequency signal to a pulse signal generator via the beam control system; measuring the delay of the current channel under test using a delay measurement unit and saving the delay data; and after determining that all channels under test have completed measurement, sending the delay data of all units to the automatic control test system or a debugging computer. This application uses a delay measurement unit, which can accurately measure the time delay between a reference pulse signal and the pulse signal under test, thereby correcting the transmission and reception delays of all channels.

The application provides a wind power blade lightning receptor conduction test terminal and a conduction test method, and relates to the technical field of wind power equipment detection. The conduction test terminal is arranged at the end of a mechanical arm. A force sensing module arranged between the mechanical arm and a test probe is used to detect the contact force between the probe and the lightning receptor in real time. A servo control module is used to control the corresponding driving mechanism of the probe based on the feedback signal of the contact force to keep the contact force constant. An electrical measurement module is used to test the electrical performance of the lightning receptor under the condition of maintaining constant contact force. The technical problems of large conduction test error and poor reliability are solved, and the technical effects of improving the accuracy, stability and automation degree of the conduction test are achieved.

The application discloses a copper-embedded multilayer board defect detection method and system based on eddy current thermal imaging and impedance spectrum fusion, relates to the technical field of multilayer board defect detection, and comprises the following steps: applying a high-frequency alternating pulse magnetic field to a copper-embedded multilayer board to be detected; continuously collecting thermal field cooling sequence images after pulse excitation, then extracting thermal diffusion coefficients of copper-embedded regions a and thermal field isotheral line distribution characteristics; using test probes of an automatic machine to contact copper-embedded blocks and corresponding network test points on the copper-embedded multilayer board to be detected, injecting a wideband sweep signal, obtaining impedance spectrum and extracting characteristic parameters; and a , thermal field isotheral line asymmetry, Z LF , R HF and Δ θ are constructed into a multi-dimensional feature vector, input into a fusion judgment model, and a judgment result of the copper-embedded multilayer board defect is output according to a preset multiple threshold. The application realizes non-destructive defect detection, and the micro-crack detection rate is about 97%, and the copper-embedded offset and interlayer short-circuit detection rate is 100%.

This utility model discloses a novel chip testing probe, comprising two needles (21), a needle tube (22), and a spring (26). The needle tube (22) has connecting tubes (23) at both ends. The inner diameter of the connecting tubes (23) is equal to that of the needle tube (22), and the outer diameter of the connecting tubes (23) is smaller than that of the needle tube (22). The two needles (21) are respectively installed inside the two connecting tubes (23). The spring (26) is installed inside the needle tube (22) and located between the two needles (21). A limiting member (25) is provided at the outer end of each needle (21), and the outer diameter of the limiting member (25) is larger than the inner diameter of the connecting tube (23). Multiple riveting points (24) are provided at the end of the connecting tube (23) near the needle tube (22). This utility model facilitates needle assembly and prevents deformation of the needle tube and needles.

This utility model provides an automotive electrostatic testing device, including a base shell. A gear shaft is rotatably fitted to the inner wall of the base shell. Two U-shaped sliding plates are arranged opposite each other inside the base shell. A toothed plate is fixedly connected to one side of each of the two U-shaped sliding plates. A U-shaped frame is slidably and elastically fitted to one side of each of the two U-shaped sliding plates. Multiple locking components are provided on one side of each of the two U-shaped frames. By setting a synchronous transmission structure of cylinder drive, gear shaft, belt, and lead screw, a single power source is transformed into a coordinated action of device clamping and test probe lifting. After the cylinder is activated, the drive plate moves the U-shaped sliding plates to achieve device clamping. Simultaneously, the gear shaft rotates and transmits power via the belt, causing the lead screw to drive the test probe to descend precisely. This avoids the cumbersome steps of manually operating clamping and testing separately, improving testing efficiency and addressing the problems of independent operation and low efficiency in existing devices.

This utility model discloses an elastic cleaning probe structure for an ICT test probe bed, including a probe body, a first protective cover, a second protective cover, an elastic band ring, a limiting plate, and a guide groove. The probe body is externally provided with the first and second protective covers, which can form a hollow cylindrical structure. The first and second protective covers are positioned opposite each other and are secured together using the elastic band ring. A limiting plate is located on one side above the first and second protective covers, and is fixed to the frame of the test probe bed. A guide groove is provided on the limiting plate, allowing the first and second protective covers to move along the groove. This utility model has a reasonable design; the first and second protective covers can shield and protect the probe body when it is not in use.

The invention relates to a test needle for measuring electrically conductive layers in holes of printed circuit boards, as well as to a test probe equipped with such a test needle and to a flying probe tester for testing printed circuit boards equipped with such a test needle or such a test probe.The test needle has a capacitive measuring body, which is connected via a cable to a capacitive measuring device. The cable is shielded so that only the capacitive measuring body can form a capacitive coupling with other electrically conductive bodies. This makes it possible to determine this capacitive coupling with a high local resolution.

This application discloses a method and system for detecting circuit board defects based on multi-band impedance matching, relating to the field of circuit board quality inspection technology. The method includes: determining the corresponding test bias voltage of a reconfigurable impedance matching network at multiple test frequencies based on a frequency bias voltage relationship table; applying a test bias voltage matching the test frequency to each adjustable element for each test frequency, and injecting an RF signal into the circuit board under test to acquire the corresponding reflection coefficient through a test probe; reconstructing a three-dimensional scattering image inside the circuit board based on a multi-frequency sparse dictionary and compressed sensing algorithm; calculating the negative log-likelihood distribution corresponding to the three-dimensional scattering image, and combining the spatial information of each circuit physical layer to obtain the hierarchical anomaly score of the corresponding circuit physical layer, thereby screening at least one abnormal circuit physical layer. Thus, by using signal feature reconstruction instead of high-precision physical imaging, hierarchical spatial identification of circuit board defects is achieved.

The present invention relates to a device 1 for contacting a cable 2 having an electrical conductor 3 and insulation 4, comprising a clamping device 7 for laterally clamping the cable 2 and a test probe 5 for electrically contacting an open end face 6 of the cable 2 such that an electrical test of the cable 2 is enabled. This allows for a gentle testing of the cable and its conductor 3.

The utility model relates to the technical field of semiconductor detection, and disclose a kind of semiconductor test probe needle tip protection device, the semiconductor test probe needle tip protection device, including needle tube, the bottom end fixed mounting of needle tube has expansion pipe, the top inner wall movable mounting of needle tube has needle, the inside of needle tube is provided with protection component.This semiconductor test probe needle tip protection device, by being provided with protection component, when needle head is contacted with the surface of semiconductor to be measured, the needle head is continuously contracted towards the inside of needle tube by continuous extrusion, when it is contracted to limit distance, needle head, rotating sleeve, speed reducer and contraction sleeve form an integral downward movement to approach switch and trigger, approach switch sends signal to mechanical arm control structure, at this time, mechanical arm control structure controls the drive equipment of mechanical arm and stops, so that mechanical arm does not continue to press down, avoid the end of needle head and produce greater pressure, leading to the damage of needle head and semiconductor equipment.

The utility model discloses a chip test auxiliary device, which comprises a test seat, a test groove is arranged in the test seat, a plurality of test pins are arranged below the test groove of the test seat, an auxiliary frame is arranged above the test seat, a frame body groove hole is arranged in the auxiliary frame, and a plurality of test pins are arranged in the frame body groove hole. An alignment plate is arranged in a frame body groove hole of the auxiliary frame, a bottom hole is formed in the lower portion of the interior of the alignment plate, a positioning groove is formed in the upper portion of the interior of the alignment plate, the bottom hole is communicated with the positioning groove, side grooves are symmetrically formed in the interior of the test seat along the two sides of the test groove respectively, and the side grooves are communicated with the test groove. According to the utility model, the auxiliary alignment capability is realized, and the practicability is improved, so that the problem that the bottom surface of a chip is scratched by a test needle due to the fact that accurate alignment cannot be realized and the position needs to be adjusted through translation when the chip is placed in a test seat is solved.

This utility model discloses an auxiliary testing device for measuring the thickness at the radius (R) corner of a crucible. In conjunction with a Hall effect thickness gauge, it enables the measurement of the thickness at the crucible's radius (R). The Hall effect thickness gauge includes a test probe and a magnetic bead. The auxiliary testing device includes a base, with the test probe fixedly mounted vertically on its top surface. A rotatable rotating body is fixedly mounted on a support above the base, with its rotation axis set horizontally. A through hole is provided on the rotating body, through which the top of the test probe passes. A support assembly for supporting the crucible under test is provided on the rotating body. The top of the test probe contacts one side of the outer edge (R) corner of the crucible under test, and the contact point between the top of the test probe and one side of the outer edge (R) corner of the crucible under test is collinear with the rotation axis of the rotating body. This auxiliary testing device for measuring the thickness at the radius (R) corner of a crucible improves detection accuracy and efficiency, and avoids the drawback of the magnetic bead being easily lost during the testing process.

This invention belongs to the field of test probe fabrication technology, specifically a method for preparing a special coating for spring probes. The method includes: depositing a Si gradient transition layer on the surface of a spring substrate, followed by oxygen plasma activation treatment to form a specific active pinning layer of 3 to 5 nanometers; then depositing a DLC coating using a specific process, employing a specific peak voltage and a specific duty cycle pulse bias mode to pre-position dispersed carbon clusters. The SixOy pinning layer provides dual anchoring of chemical bonding and mechanical interlocking for the DLC coating during cyclic stress-induced graphitization transformation, preventing microcracks from propagating to the interface and ensuring the safe operation of the adaptive lubrication process. This invention overcomes the technical bottleneck of fatigue spalling of DLC coatings on elastic components, significantly improving the service life of spring probes.

This invention relates to the field of memory chip testing technology and discloses an insertion test mechanism for memory chip testing. The mechanism includes a testing body, with clamping and positioning mechanisms on the inner sides of both ends. Each clamping and positioning mechanism includes a test probe assembly. A fixed seat is located on one side of the test probe assembly. A bidirectional adjusting rod is rotatably connected to the inner wall of the fixed seat. Two adjusting blocks are threaded onto the outer surface of the bidirectional adjusting rod. A clamping block is fixedly connected to one end of each adjusting block. A positioning post is fixedly connected to one side of each clamping block. A docking block is fixedly connected to one side of the fixed seat. A positioning seat is slidably connected to the inner wall of the docking block. An auxiliary positioning mechanism, including an arc-shaped positioning block, is located inside the docking block. This invention achieves convenient clamping, fixing, and precise positioning of the test probe assembly through the clamping and positioning mechanism, and, in conjunction with the auxiliary positioning mechanism, completes pre-fixation, ensuring the stability and accuracy of the testing process.

The utility model relates to probe test technical field especially, and it is a kind of test probe anti-deviation guide structure, including probe elastic lamination guide component, detect upper cover plate, a plurality of test probes, detect lower substrate, control support component and two electric telescopic rods, probe elastic lamination guide component is installed on detect upper cover plate, detect upper cover plate is equipped with a plurality of test probes, detect lower substrate is set on control support component, detect lower substrate is directly below detect upper cover plate, control support component and detect upper cover plate both sides are connected through electric telescopic rod between evenly. The utility model can be through probe elastic lamination guide component to the elastic contact needle tube of test probe and carry out lamination anti-deviation guide, make the elastic contact needle head of test probe not appear the phenomenon of deviation when operating, avoid causing damage to test probe, and help to improve the accuracy of test result.