554 results about "Electrical testing" patented technology

The invention provides a circuit board electrical performance test and diagnosis method, which comprises the following steps of: constructing a structured process-electrical data set by collecting process parameters such as etching time, pressing temperature, drilling precision, copper foil thickness and the like and electrical test indexes such as impedance deviation, leakage current, signal attenuation and the like; screening key process variables by adopting mutual information analysis and a maximum correlation-minimum redundancy criterion; through modeling of a three-layer causal diagram and a structural equation, quantitative influence evaluation of process parameters on electrical performance and fault types is realized; when a fault is detected, the system can automatically perform reverse reasoning, identify a main manufacturing deviation item and generate attribution diagnosis and process optimization suggestions, so that the accuracy of fault diagnosis and the pertinence of process adjustment are improved, and the fault occurrence rate is reduced and the product quality is improved.

The invention relates to the technical field of electrical testing, in particular to a battery testing method and system, and the method comprises the steps: obtaining a voltage data sequence and historical log data of each cell in a to-be-tested battery pack; determining a dynamic instability score of each battery cell according to the parameter volatility index of each battery cell and the spatial correlation weight between each battery cell and the adjacent battery cell; on the basis of the historical log data, analyzing a repeated cumulative effect of all historical damage events corresponding to each battery cell, and determining a historical damage degree of each battery cell; performing deep fusion on the dynamic instability score and the historical damage degree through a nonlinear function to obtain a comprehensive risk index of each battery cell; and based on the extreme values and distribution of the comprehensive risk indexes of all the cells, determining a fault degree capable of representing the overall health risk of the battery pack, and determining a health test result of the battery pack according to the fault degree. According to the method, the accuracy and reliability of battery pack testing are improved.

The invention provides an intrinsic solid-state ion diffusion coefficient test method and device based on optical imaging, and relates to the technical field of solid-state ion test.The method comprises the steps that a test sample is pretreated; carrying out a photoelectric test on the test sample; placing the electrochemical cell in an optical imaging system, connecting the electrochemical cell with an electrical testing system, applying a constant voltage deviating from a steady state to the monodisperse electrode plate, collecting the real-time change condition of the material under the modulation of the constant voltage in real time through an industrial camera, and outputting relational data of optical intensity and time; analyzing the diffusion path through in-situ characterization equipment, and obtaining an ion diffusion path corresponding to the to-be-detected ion battery electrode material particles in combination with dynamic information provided by an optical imaging system; and determining the characteristic time according to the relational data of the optical intensity and the time, and determining the intrinsic solid ion diffusion coefficient corresponding to the test sample by combining the characteristic time and the ion diffusion path corresponding to the to-be-tested ion battery electrode material particles.

The invention relates to the technical field of lighting electrical testing, in particular to a lamp testing system and method, and the system comprises an electrical parameter collection module, a harmonic analysis module, an optical collection module, a light fluctuation analysis module and an abnormality judgment module. Wherein the electrical parameter acquisition module is used for acquiring a real-time voltage waveform of an input end of a lamp; the harmonic analysis module is used for extracting a fundamental wave and each harmonic component and calculating a harmonic distortion rate; the optical acquisition module is used for synchronously acquiring light signal time sequence data of the light emitting surface of the lamp; the light fluctuation analysis module calculates the light fluctuation frequency of the light source; and the abnormity judgment module is used for generating an electrical-optical relevance index and comparing the electrical-optical relevance index with a preset threshold value so as to output a stroboscopic qualification judgment result of the lamp. According to the method, the accuracy of lamp stroboscopic detection and the causal identification capability are effectively improved by constructing the electrical-optical correlation index and realizing synchronous judgment.

The invention belongs to the technical field of power distribution switches, and particularly discloses a test mechanism suitable for a switch cabinet handle, which comprises a substrate, the upper end of the substrate is fixedly connected with a plurality of support frames, the upper ends of the support frames are fixedly connected with a support plate, and the upper end of the support plate is provided with a transmission groove. A rotating assembly used for rotating the handle is arranged on the base plate corresponding to the transmission groove, a detection assembly used for detecting the insulation state of the rotating handle is arranged on the side, close to the rotating assembly, of the supporting plate, and when the handle rotates along with the second square rod, the first square rod, the transmission block and the trigger protruding block are driven to rotate synchronously. The trigger bump can instantly extrude the micro-touch switch, the power supply module and the resistance detector are started, through a detection loop formed by a lead, insulation resistance changes of the connection part of the handle and the square rod under the action of mechanical friction and stress in the rotation process are accurately captured, dynamic insulation data of the handle are captured, and an electrical property detection test of the handle is realized.

The invention discloses an FAKRA wire harness error code testing device and method, and relates to the technical field of error code testing. The method comprises the following steps of preparation before test, basic electrical test, limit plugging test, vibration test, stability test and test result analysis. According to the method, the initial bit error rate of the to-be-tested FAKRA wire harness is tested by using the bit error tester after the test equipment is calibrated, then the connectors at the two ends and the matched connector are subjected to the limit plugging test, then the vibration test is performed, and the simulation degree of the vibration test is evaluated, so that whether vibration simulation optimization is performed or not is determined; according to the method and the device, firstly, the fluctuation condition of the bit error rate is monitored in the test period, so that whether a clock optimization measure is taken or not is determined, finally, all test data are collected, the stability of the bit error test is ensured, and the problem that the bit error test accuracy is reduced due to the fact that the vibration test simulation degree is not high enough and the simulation quality is unstable in the prior art is solved.

Invention relates to a wiring harness insulation testing device, comprising a first testing chamber for receiving one end of tested wiring harness with an electrical connector and a second testing chamber for receiving another end of tested wiring harness with an electrical connector. Each testing chamber comprising a chamber bottom and chamber top, which are openable in a released state and lockable into a hermetically closed state around said electrical connectors and around the insulation at the ends of said wiring harness to be tested. Each testing chamber comprising electrical testing means, an inlet connected to the means for generating negative or positive gas pressure inside said testing chamber, means for measuring pressure in said testing chamber, a control unit, which is configured to perform high-voltage tests on said wiring harness with said electrical testing means.

The disclosure relates to air transfer free of solid state batteries and electrical testing of solid state batteries in scanning electron microscopes. In one embodiment, an apparatus includes a sample stage including a base member and a sample support assembly coupled to the base member, where the sample support assembly includes a bracket having opposing first and second bracket portions, the first holder portion and the second holder portion are configured to compress a sample within the holder receiving portion, wherein the base member is configured to engage a sample stage within a microscope chamber. A method includes securing a sample stage in a microscope chamber and charging and / or discharging the sample at least partially through an electrical coupling in the chamber.

The invention provides a conduction tester for a wire harness connector, and particularly relates to the technical field of electrical testing of connectors, the conduction tester comprises a testing table plate and a tester body mounted on the top surface of the testing table plate, one side of the tester body is provided with an accommodating cabin, and one side of the tester body is provided with a display and a main controller; according to the conduction tester of the wiring harness connector, the limiting sliding block is stably matched with the limiting sliding rail on the cabin wall of the containing cabin, the probe seat can be accurately aligned with the connector in the clamping groove seat through the servo air cylinder, the probability of poor contact caused by manual insertion is greatly reduced, it is guaranteed that the test is smoothly carried out, and meanwhile the testing efficiency is improved. Through the cooperation of the pressure sensing part, the main controller and the force value regulator, the driving force of the linear driving part can be kept in a proper range, and the stable contact state of the probe and the connector is ensured, so that the test result is more reliable, and the test error caused by the contact problem is reduced.

The invention relates to the field of sensor performance testing, and discloses a photoelectric sensor testing braiding machine which comprises a workbench, an inclined table plate, a testing track, a testing sorting mechanism and a qualified discharging track, the testing track, the testing sorting mechanism and the qualified discharging track are sequentially arranged on the inclined table plate, an overturning discharging mechanism is arranged below the qualified discharging track, and a three-dimensional visual detection module is arranged on the side of the qualified discharging track. And a braid packaging mechanism is arranged on the workbench. The test track is provided with a shading electrical test mechanism, and the top end is loaded through a loading mechanism; the testing and sorting mechanism is used for distributing qualified parts and abnormal parts; a rotating disc of the overturning discharging mechanism is provided with a material suction assembly, and a material taking station, an image detection station and a discharging station are formed. According to the invention, multiple procedures are integrated, a cross-equipment transfer link is omitted, the production cycle is shortened, the efficiency is improved, and secondary damage to the photoelectric sensor is reduced; the shading electrical property test guarantees the test accuracy of a dark environment, the three-dimensional visual detection solves the problem of pin coplanarity detection pain points, double screening is achieved, and the product quality is comprehensively guaranteed.

The present application provides a method and structure for detecting the tip condition of a probe card, a wafer, and a wafer testing method. It relates to a method for detecting the tip condition of a probe card, including: determining a plurality of probes to be tested on the probe card; determining a plurality of probe pads, and sequentially arranging a metal wire structure between two probe pads to form a test circuit by connection; respectively inserting the probes to be tested into the corresponding probe pads for contact connection; dividing and designing a plurality of test groups based on the positions of the probe pads in the test circuit, and measuring the contact resistance between the probes to be tested and the corresponding probe pads; and judging the tip state of the probes to be tested based on the contact resistance between the probes to be tested and the corresponding probe pads. The present application monitors the tip condition of the probe card by means of electrical testing, which not only reduces the testing cost, but also further improves the testing accuracy and detection efficiency.

The invention relates to an LED packaging detection method and system, and the method comprises the steps: firstly obtaining a light source image of a to-be-detected LED light source, and then carrying out the feature extraction and analysis of the light source image, thereby obtaining image feature information; meanwhile, electrical testing is carried out on the to-be-detected LED, and electrical characteristic information is obtained; carrying out a thermal shock test and a vibration shock test on the to-be-detected LED package to respectively obtain corresponding thermal characteristic information and mechanical characteristic information; and finally, inputting the image feature information, the optical feature information, the thermal feature information and the mechanical feature information into a package detection model trained by combining a plurality of machine learning classifiers to obtain an LED package quality detection report, and judging the package detection quality grade by the report according to a preset threshold value. The detection accuracy and reliability are improved by comprehensively evaluating the quality of LED packaging in multiple aspects such as optics, electricity, thermal and mechanical properties.

A method and a testing system for testing a semiconductor chip package are provided. The method includes fixing, by a mechanical testing sub-system of the testing system, the semiconductor chip package within the mechanical testing sub-system, such that the semiconductor chip package is aligned with pressure components of the mechanical testing sub-system and is electrically connected to an electrical testing sub-system of the testing system; simultaneously performing, by the mechanical testing sub-system and the electrical testing sub-system, a first stage of a mechanical testing and an electrical testing on the semiconductor chip package; and in response to determining, by a controller of the testing system, that a preset trigger condition of the mechanical testing or the electrical testing is reached, controlling the mechanical testing sub-system to switch the first stage of the mechanical testing to a second stage of the mechanical testing.

An electrical test of a semiconductor device is conducted by electrically connecting a plurality of leads of the semiconductor device with a plurality of electrodes of a test board via a plurality of socket terminals of a socket of a test apparatus, respectively. At least a part of the socket is disposed inside a chamber of the test apparatus, and the test board is disposed outside the chamber. The semiconductor device is to be cooled by a cool air circulating in the chamber. The socket has a cavity portion through which the cool air circulating in the chamber can pass, and a part of each of the plurality of socket terminals is exposed in the cavity portion of the socket. The plurality of socket terminals is to be cooled by the cool air passing through the cavity portion of the socket.

The invention provides a power battery echelon utilization evaluation method, device and equipment and a storage medium, and the method comprises the steps: carrying out the first qualified battery screening of a to-be-evaluated battery based on historical traceability information, and carrying out the second qualified battery screening of the to-be-evaluated battery based on real-time monitoring data, determining the non-destructive grade of the cascade utilization of the to-be-evaluated battery according to the two screening results; performing performance test on the to-be-evaluated battery based on the electrical test data, the electrochemical test data and the electrical property test data to obtain a test grade of echelon utilization of the to-be-evaluated battery; and performing consistency evaluation on the to-be-evaluated batteries under the condition that both the nondestructive grade and the test grade meet preset conditions, and sorting the to-be-evaluated batteries based on a consistency evaluation result. According to the method, the nondestructive grade is determined through two times of screening, and the performance test is further performed, so that the accuracy of power battery echelon utilization evaluation is improved.

The present invention provides a whole-satellite thermal cycle test method and system, relating to the field of spacecraft thermal testing technology. The method comprises the following steps: S1: satellite loading, S2: test state establishment, S3: satellite electrical testing, S4: optical chamber opening, S5: nitrogen replacement, S6: high-temperature baking, S7: normal-pressure thermal cycle test operating conditions, S8: chamber temperature recovery, S9: air replacement, S10: chamber door opening, S11: test withdrawal, and S12: satellite unloading. Compared to traditional whole-satellite thermal vacuum testing, the present invention's whole-satellite normal-pressure thermal cycle test offers significant advantages in terms of liquid nitrogen consumption, personnel requirements, test time, external heat flux equipment, specialized tooling, and operator safety.

Disclosed is an upper press head for mechanical testing and electrical testing of a semiconductor chip package. The upper press head includes: a force receiving component configured to receive a downward force; a force delivering component, having an upper portion connected with the force receiving component and having a first lateral sectional area, and a lower portion having a second lateral sectional area less than the first lateral sectional area; a force applying component connected with the lower portion of the force delivering component and configured to apply the downward force to the semiconductor chip package, the force applying component including: a plurality of protrusions that are laterally separated from each other and are configured to simultaneously press the semiconductor chip package; and a space between two adjacent protrusions matches portions of solder balls of the semiconductor chip package.

The invention discloses an electric arc characteristic-based alloy material electric contact performance electrical test method, which comprises the following steps of: providing basic information for a high-voltage rotating arc diffusion arc and intermediate-frequency large-current breaking simulation test by acquiring contact data of a circuit breaker, and triggering a controllable rotating arc or diffusion arc between contacts by utilizing an alternating-current high-voltage small-current system, so that the contact performance of the high-voltage rotating arc and the intermediate-frequency large-current breaking simulation test is realized. An intermediate-frequency low-voltage large-current system is used for simulating the on-off working condition of an intermediate-frequency circuit breaker, electrical performance data and ablation damage information of a contact under the action of an intermediate-frequency arc are collected, weighted calculation is carried out on the arc temperature, the electrical performance and an ablation index, and a comprehensive electrical contact performance index is generated; the performance of the alloy contact under different working conditions is comprehensively evaluated, the electric contact performance test of the alloy material is realized, and the test accuracy is improved.

The invention relates to the technical field of electrical test equipment, and discloses a circuit breaker mechanical characteristic tester, which comprises a detection assembly, the detection assembly comprises a box body, a detector body is arranged in the box body, a winder is arranged on one side of the detection assembly, a speed sensor assembly is arranged on the winder, and the speed sensor assembly is connected with the detection assembly. A universal frame is arranged on one side of the winder; the detector body is provided with a speed sensor interface; the speed sensor assembly comprises a speed sensor plug, and the speed sensor plug is matched with the speed sensor interface. By organically combining the winder, the speed sensor assembly and the universal frame, the problems of cable management and speed sensor plug fixation in a traditional tester are solved, the stability of signal transmission of the detection assembly in the detection process is ensured, signal interruption in the test process is avoided, and the test efficiency is improved. Therefore, the data acquisition accuracy and the test precision are improved.

The invention belongs to the technical field of circuit board manufacturing, and discloses a layer deviation detection system and method for a multilayer printed wiring board, and the method comprises the steps: obtaining real-time images and coordinate data of a detection hole and an inner-layer isolation ring through an automatic optical detection device, and carrying out the feature extraction of the real-time images of the detection hole and the inner-layer isolation ring; constructing an offset calculation model, determining the center offset, the offset direction angle and the dynamic offset trend by using the offset calculation model, and judging the layer offset tolerance; a compensation instruction is generated through a PID algorithm, and the compensation amount of the drilling machine table is adjusted; and recording offset data, updating parameters of the offset calculation model, and detecting the offset again. According to the invention, by designing the layer deviation detection module, poor layer deviation quality can be tested during normal electrical testing, no process is added, high-precision input of data is realized, and a reliable basis is provided for subsequent calculation; during normal electrical testing, the multi-layer board layer deviation can be effectively prevented from flowing to a next process or a client, the efficiency is improved, and the response is accelerated.

The invention discloses a horizontal pin LCD testing device which is composed of a fixed platform, a pressing plate, a pair of pneumatic connecting rods, a pneumatic actuator and a pneumatic switch. The electrical testing plate and the to-be-tested horizontal pin LCD are located on the same fixed platform, the pressing plate is driven by the pneumatic actuator to vertically move downwards, and all pins of the to-be-tested horizontal pin LCD are tightly attached to all electrical testing leads of the electrical testing plate in a one-to-one correspondence mode through downward pressing force. According to the invention, the problems that the pins of the horizontal pin LCD deform due to impact when the current electrical testing device designed based on the vertical pin LCD is directly used for testing the electrical performance of the horizontal pin LCD, and the electrical testing lead of the electrical testing plate and the pins of the LCD are in poor contact or misplaced due to various reasons can be solved; the horizontal pin LCD electrical performance testing device has the advantages of being easy to operate, high in efficiency and the like.

The present invention belongs to the technical field of transformer oil-SF6 bushing interface test devices and discloses an efficient transformer oil-SF6 bushing interface test device, comprising a test device including a test riser, a test bushing, a disconnect switch, and a contact seat. The oil-SF6 bushing includes a first lead, an interface, a first and a second equalizing ball, with the first lead disposed below the oil-SF6 bushing. By integrating the riser, the oil-SF6 bushing, the test riser, the test bushing, the disconnect switch, and the contact seat, the present invention enables connection and disconnection of a test circuit without disassembling the test device. After disconnection, the disconnected portion of the test device meets the insulation requirements of electrical testing, significantly improving factory testing efficiency. The test device features a compact structure, ease of maintenance, and high cost-effectiveness, providing a new and efficient testing solution for transformers using oil-SF6 bushings.

The invention relates to wafer test equipment, which comprises an electric test assembly, which is arranged on a mounting rack and comprises a telescopic member, a fixed end of the telescopic member is provided with a probe disc, the probe disc is provided with a plurality of probes corresponding to electrode pads of a wafer chip to be tested one by one, the probe disc is provided with a plurality of through holes between the probes, and the through holes are communicated with the probe disc. The telescopic end of the telescopic piece is provided with a suction cup, the suction cup is located below the probe disc, and the suction cup is provided with a plurality of suction rods extending into the through holes; and a light testing assembly. According to the wafer test equipment, the to-be-tested wafer is fixed on the suction rod after the angle and the position of the to-be-tested wafer are adjusted, and then the suction cup is driven to move downwards, so that the probes on the probe disc can be in contact with the metal bonding pads of the chips on the to-be-tested wafer, and electrical performance tests can be simultaneously carried out on all the chips on the wafer through the plurality of probes; and the optical fiber array disc is moved to be positioned on the wafer, so that all chips can be subjected to optical testing at one time, and the testing efficiency of the wafer is greatly improved.

1. Name of the product in this design: Electrician's Pliers (Electrical Testing Version). 2. Purpose of this design: For use in electrical construction processes such as wire stripping and crimping. 3. The key design feature of this product is its shape. 4. The image or photograph that best illustrates the design's key points: a 3D model.

The utility model discloses a test socket for enhancing integrated circuit test, which comprises an insulating support structure with a plurality of first through holes and a plurality of elastic conductive columns, and second through holes penetrating through the elastic conductive columns are arranged among the elastic conductive columns so as to improve compressibility and heat dissipation performance. The insulating support structure may include soft and hard support layers. The test socket is suitable for the electrical test of a high-power IC, and has good thermal management and mechanical elastic properties.

A voltage and current testing device of a perovskite photovoltaic cell comprises a camera obscura body, a testing platform deck, an electrical testing board and a light source, the testing platform deck, the electrical testing board and the light source are located in the camera obscura body, and the electrical testing board is arranged on the testing platform deck and provided with a plurality of rows of probes. The plurality of rows of probes are used for being electrically contacted with electrodes of a plurality of rows of perovskite photovoltaic cells on the perovskite photovoltaic substrate; the light source is arranged at the top of the camera obscura body, faces the test platform deck and is used for providing illumination for at least one row of perovskite photovoltaic cells in the multiple rows of perovskite photovoltaic cells in the test process; the system also comprises a volt-ampere measurement module which is electrically connected with the electrodes of the at least one row of perovskite photovoltaic cells through the electrical test board, so as to form a test loop of each perovskite photovoltaic cell in the at least one row of perovskite photovoltaic cells, and measure the voltage and current in each test loop. According to the scheme provided by the invention, the high-flux parallel test of the perovskite photovoltaic cell can be realized, and the test efficiency can be improved.

The utility model discloses a test adapter plate and a chip test device. The test adapter plate comprises a control module, a gating module and a plurality of interfaces, the control module comprises a gating signal output end; the gating signal output end is electrically connected with the control end of the gating module; the plurality of interfaces comprise a plurality of first interfaces and a plurality of second interfaces; the first interface and the second interface are electrically connected through the gating module; the control module is used for providing a gating signal for the gating module; the gating module is used for switching a connection path between the first interface and the second interface according to the gating signal. According to the technical scheme of the utility model, automatic switching of connection paths between the test platform and a plurality of test instruments can be realized, so that the electrical test efficiency of the chip is improved.

The invention discloses a discrete combination optimization control method of a switchable series-parallel current limiting circuit based on an IGBT and a contactor, and relates to the technical field of power electronic control and electrical testing, the control method comprises the following steps: S1, a real-time sensing step: collecting a target current limiting value and a bus voltage of a system, and real-time state data of each reconfigurable power module, wherein the real-time state data at least comprises a current value, a voltage value and a device temperature. According to the discrete combination optimization control method of the switchable series-parallel current limiting circuit based on the IGBT and the contactor, by dynamically sensing a real-time working condition and constructing a discrete optimization model containing multiple targets, a scheme meeting static and dynamic performance requirements can be automatically and accurately screened out from massive possible topologies; the problems that a traditional fixed topology circuit is limited in adjusting range and insufficient in precision are solved, and the response reliability and the control accuracy of the system under the wide-range working condition are ensured.

A device for testing a voltage level in an electrical terminal cavity including a testing body and a probe for contacting the electrical terminal cavity. The probe includes a tip portion having a first cross-sectional area, a base portion having a second cross-sectional area, and an intermediate portion extending from the tip portion to the base portion having a third cross-sectional area. The first cross-sectional area is smaller than the third cross-sectional area, the third cross-sectional area is smaller than the second cross-sectional area, and the intermediate portion is concentric with the tip portion and the base portion. An axis extends between a center of the tip portion, a center of the intermediate portion, a center of the base portion, and a center of the testing body. The device also includes a circuit operatively coupled with the probe to sense the voltage level in the electrical terminal cavity.

The present invention is applicable to the field of electrical testing technologies, and particularly relates to a testing circuit and a testing device. The testing circuit includes a wiring component, a first switch unit group, and a second switch unit group. The first switch unit group and the second switch unit group respectively include a plurality of first switch units and second switch units. The testing circuit is provided with wiring ports for connecting cables, replacing the original method of manual testing. The cables are fixed, eliminating the risks of terminal contact and equipment shutdown caused by cable dropping. At the same time, by providing the first switch unit group and the second switch unit group, during testing, only the corresponding switch unit needs to be triggered to achieve insulation detection and continuity detection of the cables, without repeatedly plugging in the cables, improving the convenience and reliability of testing.