367 results about "Electrical testing" patented technology

The invention provides a circuit board electrical performance test and diagnosis method, which comprises the following steps of: constructing a structured process-electrical data set by collecting process parameters such as etching time, pressing temperature, drilling precision, copper foil thickness and the like and electrical test indexes such as impedance deviation, leakage current, signal attenuation and the like; screening key process variables by adopting mutual information analysis and a maximum correlation-minimum redundancy criterion; through modeling of a three-layer causal diagram and a structural equation, quantitative influence evaluation of process parameters on electrical performance and fault types is realized; when a fault is detected, the system can automatically perform reverse reasoning, identify a main manufacturing deviation item and generate attribution diagnosis and process optimization suggestions, so that the accuracy of fault diagnosis and the pertinence of process adjustment are improved, and the fault occurrence rate is reduced and the product quality is improved.

The invention relates to the technical field of electrical testing, in particular to a battery testing method and system, and the method comprises the steps: obtaining a voltage data sequence and historical log data of each cell in a to-be-tested battery pack; determining a dynamic instability score of each battery cell according to the parameter volatility index of each battery cell and the spatial correlation weight between each battery cell and the adjacent battery cell; on the basis of the historical log data, analyzing a repeated cumulative effect of all historical damage events corresponding to each battery cell, and determining a historical damage degree of each battery cell; performing deep fusion on the dynamic instability score and the historical damage degree through a nonlinear function to obtain a comprehensive risk index of each battery cell; and based on the extreme values and distribution of the comprehensive risk indexes of all the cells, determining a fault degree capable of representing the overall health risk of the battery pack, and determining a health test result of the battery pack according to the fault degree. According to the method, the accuracy and reliability of battery pack testing are improved.

The invention provides an intrinsic solid-state ion diffusion coefficient test method and device based on optical imaging, and relates to the technical field of solid-state ion test.The method comprises the steps that a test sample is pretreated; carrying out a photoelectric test on the test sample; placing the electrochemical cell in an optical imaging system, connecting the electrochemical cell with an electrical testing system, applying a constant voltage deviating from a steady state to the monodisperse electrode plate, collecting the real-time change condition of the material under the modulation of the constant voltage in real time through an industrial camera, and outputting relational data of optical intensity and time; analyzing the diffusion path through in-situ characterization equipment, and obtaining an ion diffusion path corresponding to the to-be-detected ion battery electrode material particles in combination with dynamic information provided by an optical imaging system; and determining the characteristic time according to the relational data of the optical intensity and the time, and determining the intrinsic solid ion diffusion coefficient corresponding to the test sample by combining the characteristic time and the ion diffusion path corresponding to the to-be-tested ion battery electrode material particles.

The invention belongs to the technical field of power distribution switches, and particularly discloses a test mechanism suitable for a switch cabinet handle, which comprises a substrate, the upper end of the substrate is fixedly connected with a plurality of support frames, the upper ends of the support frames are fixedly connected with a support plate, and the upper end of the support plate is provided with a transmission groove. A rotating assembly used for rotating the handle is arranged on the base plate corresponding to the transmission groove, a detection assembly used for detecting the insulation state of the rotating handle is arranged on the side, close to the rotating assembly, of the supporting plate, and when the handle rotates along with the second square rod, the first square rod, the transmission block and the trigger protruding block are driven to rotate synchronously. The trigger bump can instantly extrude the micro-touch switch, the power supply module and the resistance detector are started, through a detection loop formed by a lead, insulation resistance changes of the connection part of the handle and the square rod under the action of mechanical friction and stress in the rotation process are accurately captured, dynamic insulation data of the handle are captured, and an electrical property detection test of the handle is realized.

The invention discloses an FAKRA wire harness error code testing device and method, and relates to the technical field of error code testing. The method comprises the following steps of preparation before test, basic electrical test, limit plugging test, vibration test, stability test and test result analysis. According to the method, the initial bit error rate of the to-be-tested FAKRA wire harness is tested by using the bit error tester after the test equipment is calibrated, then the connectors at the two ends and the matched connector are subjected to the limit plugging test, then the vibration test is performed, and the simulation degree of the vibration test is evaluated, so that whether vibration simulation optimization is performed or not is determined; according to the method and the device, firstly, the fluctuation condition of the bit error rate is monitored in the test period, so that whether a clock optimization measure is taken or not is determined, finally, all test data are collected, the stability of the bit error test is ensured, and the problem that the bit error test accuracy is reduced due to the fact that the vibration test simulation degree is not high enough and the simulation quality is unstable in the prior art is solved.

The disclosure relates to air transfer free of solid state batteries and electrical testing of solid state batteries in scanning electron microscopes. In one embodiment, an apparatus includes a sample stage including a base member and a sample support assembly coupled to the base member, where the sample support assembly includes a bracket having opposing first and second bracket portions, the first holder portion and the second holder portion are configured to compress a sample within the holder receiving portion, wherein the base member is configured to engage a sample stage within a microscope chamber. A method includes securing a sample stage in a microscope chamber and charging and / or discharging the sample at least partially through an electrical coupling in the chamber.

The invention provides a conduction tester for a wire harness connector, and particularly relates to the technical field of electrical testing of connectors, the conduction tester comprises a testing table plate and a tester body mounted on the top surface of the testing table plate, one side of the tester body is provided with an accommodating cabin, and one side of the tester body is provided with a display and a main controller; according to the conduction tester of the wiring harness connector, the limiting sliding block is stably matched with the limiting sliding rail on the cabin wall of the containing cabin, the probe seat can be accurately aligned with the connector in the clamping groove seat through the servo air cylinder, the probability of poor contact caused by manual insertion is greatly reduced, it is guaranteed that the test is smoothly carried out, and meanwhile the testing efficiency is improved. Through the cooperation of the pressure sensing part, the main controller and the force value regulator, the driving force of the linear driving part can be kept in a proper range, and the stable contact state of the probe and the connector is ensured, so that the test result is more reliable, and the test error caused by the contact problem is reduced.

The invention relates to the field of sensor performance testing, and discloses a photoelectric sensor testing braiding machine which comprises a workbench, an inclined table plate, a testing track, a testing sorting mechanism and a qualified discharging track, the testing track, the testing sorting mechanism and the qualified discharging track are sequentially arranged on the inclined table plate, an overturning discharging mechanism is arranged below the qualified discharging track, and a three-dimensional visual detection module is arranged on the side of the qualified discharging track. And a braid packaging mechanism is arranged on the workbench. The test track is provided with a shading electrical test mechanism, and the top end is loaded through a loading mechanism; the testing and sorting mechanism is used for distributing qualified parts and abnormal parts; a rotating disc of the overturning discharging mechanism is provided with a material suction assembly, and a material taking station, an image detection station and a discharging station are formed. According to the invention, multiple procedures are integrated, a cross-equipment transfer link is omitted, the production cycle is shortened, the efficiency is improved, and secondary damage to the photoelectric sensor is reduced; the shading electrical property test guarantees the test accuracy of a dark environment, the three-dimensional visual detection solves the problem of pin coplanarity detection pain points, double screening is achieved, and the product quality is comprehensively guaranteed.

A method and a testing system for testing a semiconductor chip package are provided. The method includes fixing, by a mechanical testing sub-system of the testing system, the semiconductor chip package within the mechanical testing sub-system, such that the semiconductor chip package is aligned with pressure components of the mechanical testing sub-system and is electrically connected to an electrical testing sub-system of the testing system; simultaneously performing, by the mechanical testing sub-system and the electrical testing sub-system, a first stage of a mechanical testing and an electrical testing on the semiconductor chip package; and in response to determining, by a controller of the testing system, that a preset trigger condition of the mechanical testing or the electrical testing is reached, controlling the mechanical testing sub-system to switch the first stage of the mechanical testing to a second stage of the mechanical testing.

The invention provides a power battery echelon utilization evaluation method, device and equipment and a storage medium, and the method comprises the steps: carrying out the first qualified battery screening of a to-be-evaluated battery based on historical traceability information, and carrying out the second qualified battery screening of the to-be-evaluated battery based on real-time monitoring data, determining the non-destructive grade of the cascade utilization of the to-be-evaluated battery according to the two screening results; performing performance test on the to-be-evaluated battery based on the electrical test data, the electrochemical test data and the electrical property test data to obtain a test grade of echelon utilization of the to-be-evaluated battery; and performing consistency evaluation on the to-be-evaluated batteries under the condition that both the nondestructive grade and the test grade meet preset conditions, and sorting the to-be-evaluated batteries based on a consistency evaluation result. According to the method, the nondestructive grade is determined through two times of screening, and the performance test is further performed, so that the accuracy of power battery echelon utilization evaluation is improved.

Disclosed is an upper press head for mechanical testing and electrical testing of a semiconductor chip package. The upper press head includes: a force receiving component configured to receive a downward force; a force delivering component, having an upper portion connected with the force receiving component and having a first lateral sectional area, and a lower portion having a second lateral sectional area less than the first lateral sectional area; a force applying component connected with the lower portion of the force delivering component and configured to apply the downward force to the semiconductor chip package, the force applying component including: a plurality of protrusions that are laterally separated from each other and are configured to simultaneously press the semiconductor chip package; and a space between two adjacent protrusions matches portions of solder balls of the semiconductor chip package.

The invention discloses an electric arc characteristic-based alloy material electric contact performance electrical test method, which comprises the following steps of: providing basic information for a high-voltage rotating arc diffusion arc and intermediate-frequency large-current breaking simulation test by acquiring contact data of a circuit breaker, and triggering a controllable rotating arc or diffusion arc between contacts by utilizing an alternating-current high-voltage small-current system, so that the contact performance of the high-voltage rotating arc and the intermediate-frequency large-current breaking simulation test is realized. An intermediate-frequency low-voltage large-current system is used for simulating the on-off working condition of an intermediate-frequency circuit breaker, electrical performance data and ablation damage information of a contact under the action of an intermediate-frequency arc are collected, weighted calculation is carried out on the arc temperature, the electrical performance and an ablation index, and a comprehensive electrical contact performance index is generated; the performance of the alloy contact under different working conditions is comprehensively evaluated, the electric contact performance test of the alloy material is realized, and the test accuracy is improved.

The invention relates to the technical field of electrical test equipment, and discloses a circuit breaker mechanical characteristic tester, which comprises a detection assembly, the detection assembly comprises a box body, a detector body is arranged in the box body, a winder is arranged on one side of the detection assembly, a speed sensor assembly is arranged on the winder, and the speed sensor assembly is connected with the detection assembly. A universal frame is arranged on one side of the winder; the detector body is provided with a speed sensor interface; the speed sensor assembly comprises a speed sensor plug, and the speed sensor plug is matched with the speed sensor interface. By organically combining the winder, the speed sensor assembly and the universal frame, the problems of cable management and speed sensor plug fixation in a traditional tester are solved, the stability of signal transmission of the detection assembly in the detection process is ensured, signal interruption in the test process is avoided, and the test efficiency is improved. Therefore, the data acquisition accuracy and the test precision are improved.

The invention relates to wafer test equipment, which comprises an electric test assembly, which is arranged on a mounting rack and comprises a telescopic member, a fixed end of the telescopic member is provided with a probe disc, the probe disc is provided with a plurality of probes corresponding to electrode pads of a wafer chip to be tested one by one, the probe disc is provided with a plurality of through holes between the probes, and the through holes are communicated with the probe disc. The telescopic end of the telescopic piece is provided with a suction cup, the suction cup is located below the probe disc, and the suction cup is provided with a plurality of suction rods extending into the through holes; and a light testing assembly. According to the wafer test equipment, the to-be-tested wafer is fixed on the suction rod after the angle and the position of the to-be-tested wafer are adjusted, and then the suction cup is driven to move downwards, so that the probes on the probe disc can be in contact with the metal bonding pads of the chips on the to-be-tested wafer, and electrical performance tests can be simultaneously carried out on all the chips on the wafer through the plurality of probes; and the optical fiber array disc is moved to be positioned on the wafer, so that all chips can be subjected to optical testing at one time, and the testing efficiency of the wafer is greatly improved.

1. Name of the product in this design: Electrician's Pliers (Electrical Testing Version). 2. Purpose of this design: For use in electrical construction processes such as wire stripping and crimping. 3. The key design feature of this product is its shape. 4. The image or photograph that best illustrates the design's key points: a 3D model.

A voltage and current testing device of a perovskite photovoltaic cell comprises a camera obscura body, a testing platform deck, an electrical testing board and a light source, the testing platform deck, the electrical testing board and the light source are located in the camera obscura body, and the electrical testing board is arranged on the testing platform deck and provided with a plurality of rows of probes. The plurality of rows of probes are used for being electrically contacted with electrodes of a plurality of rows of perovskite photovoltaic cells on the perovskite photovoltaic substrate; the light source is arranged at the top of the camera obscura body, faces the test platform deck and is used for providing illumination for at least one row of perovskite photovoltaic cells in the multiple rows of perovskite photovoltaic cells in the test process; the system also comprises a volt-ampere measurement module which is electrically connected with the electrodes of the at least one row of perovskite photovoltaic cells through the electrical test board, so as to form a test loop of each perovskite photovoltaic cell in the at least one row of perovskite photovoltaic cells, and measure the voltage and current in each test loop. According to the scheme provided by the invention, the high-flux parallel test of the perovskite photovoltaic cell can be realized, and the test efficiency can be improved.

The utility model discloses a test adapter plate and a chip test device. The test adapter plate comprises a control module, a gating module and a plurality of interfaces, the control module comprises a gating signal output end; the gating signal output end is electrically connected with the control end of the gating module; the plurality of interfaces comprise a plurality of first interfaces and a plurality of second interfaces; the first interface and the second interface are electrically connected through the gating module; the control module is used for providing a gating signal for the gating module; the gating module is used for switching a connection path between the first interface and the second interface according to the gating signal. According to the technical scheme of the utility model, automatic switching of connection paths between the test platform and a plurality of test instruments can be realized, so that the electrical test efficiency of the chip is improved.

The invention discloses a discrete combination optimization control method of a switchable series-parallel current limiting circuit based on an IGBT and a contactor, and relates to the technical field of power electronic control and electrical testing, the control method comprises the following steps: S1, a real-time sensing step: collecting a target current limiting value and a bus voltage of a system, and real-time state data of each reconfigurable power module, wherein the real-time state data at least comprises a current value, a voltage value and a device temperature. According to the discrete combination optimization control method of the switchable series-parallel current limiting circuit based on the IGBT and the contactor, by dynamically sensing a real-time working condition and constructing a discrete optimization model containing multiple targets, a scheme meeting static and dynamic performance requirements can be automatically and accurately screened out from massive possible topologies; the problems that a traditional fixed topology circuit is limited in adjusting range and insufficient in precision are solved, and the response reliability and the control accuracy of the system under the wide-range working condition are ensured.

A device for testing a voltage level in an electrical terminal cavity including a testing body and a probe for contacting the electrical terminal cavity. The probe includes a tip portion having a first cross-sectional area, a base portion having a second cross-sectional area, and an intermediate portion extending from the tip portion to the base portion having a third cross-sectional area. The first cross-sectional area is smaller than the third cross-sectional area, the third cross-sectional area is smaller than the second cross-sectional area, and the intermediate portion is concentric with the tip portion and the base portion. An axis extends between a center of the tip portion, a center of the intermediate portion, a center of the base portion, and a center of the testing body. The device also includes a circuit operatively coupled with the probe to sense the voltage level in the electrical terminal cavity.

The present disclosure provides a chip failure analysis method and device, which can solve the technical problem that related technologies cannot perform failure analysis on advanced processes. The method comprises: in the case of chip delayering to the contact layer, obtaining electrical measurement results by testing the combination of body diodes of a plurality of metal oxide semiconductor (MOS) tubes and testing the combination of MOS tubes and body diodes; and obtaining a chip failure analysis result according to the electrical measurement results. In the case of chip delayering to the contact layer (i.e. Via 0), the body diode effect of the MOS tube is utilized to directly determine whether Via 0 is abnormal through electrical measurement. The body diode of the MOS tube, the combination of the body diode and the MOS tube are utilized to quickly locate Via 0, and the chip failure analysis result is obtained. At most three pins are required for abnormal electrical testing, and the testing time is shortened by 50%. Furthermore, the carbon deposition on the surface of the sample is reduced, and the introduction of analysis noise is reduced.

The utility model discloses a four-in-one equipment relates to wire harness production equipment technical field, wherein four-in-one equipment includes operating platform, measuring device, two electrical measurement device, labeling device and dotting device, measuring device includes clamping subassembly and measuring subassembly, two electrical measurement device are arranged on operating platform opposite to each other, and the two electrical measurement device is equipped with the labeling device and dotting device. Wherein one electrical testing device is arranged on one side of the clamping assembly, and the other electrical testing device is arranged on the other side of the clamping assembly. According to the four-in-one equipment provided by the utility model, the length of the wire harness is automatically measured through the measuring device, the conduction condition of the wire harness is automatically tested through the electric measuring device, and the wire harness is automatically labeled through the labeling device, so that the wire harness is automatically labeled, and the production efficiency is improved. And finally, automatic dotting is carried out on the labeled wire harness through the dotting device, manual production is replaced by automatic production, the manpower and material resource cost and the labor intensity are reduced, the production efficiency and the product percent of pass are improved, the product quality can be better guaranteed, and production waste is reduced.

The invention discloses a power panel automatic test method and system based on a drawer type jig, and belongs to the technical field of electrical testing, and the method comprises the steps: obtaining a serial number of a to-be-tested power panel to call a test program; identifying the ID code of the jig to carry out matching verification; the driving module is controlled to form preliminary contact, and a contact quality characteristic value is measured and generated; if the characteristic value does not reach the contact quality threshold value, generating a driving compensation parameter to adjust a driving module, and determining a final driving parameter; performing a comprehensive electrical test on the to-be-tested power panel to generate a test result; and associating the final driving parameter, the test result and the serial number information to generate process associated data. According to the invention, closed-loop iterative compensation is carried out on the driving module based on the contact electrical characteristics measured in real time, and the technical scheme of dual automatic verification of the serial number of the to-be-tested board and the ID of the jig is combined, so that intelligent mistake proofing of the test process and data tracing of the whole process can be realized while high reliability of test contact is guaranteed.

The invention discloses a test instrument digital access system and method for distribution network operation situation awareness. The method comprises the steps that a multi-mode access terminal is connected with a distribution network on-site multi-source heterogeneous electrical test instrument in a wired / wireless mode; a built-in protocol adaptation module calls a corresponding protocol from a preset protocol library according to the equipment model, and constructs a request packet to obtain original data; the data standardization module converts the original data into a standard data object according to a preset mapping relation; the artificial intelligence module performs multi-dimensional analysis on the standard data to generate classification and grading labels; the mobile application end receives the data and the label and generates a detection report; and the rear-end platform stores the report and the tag to detect object association historical data, implement differential storage strategies and alarm priorities according to the hierarchical tag, and perform identification and structured analysis on the unstructured report, thereby realizing standardized and automatic data access to various electrical test instruments to support accurate real-time situation awareness of the power distribution network.

In one aspect, a receiving substrate is produced, configured to receive thereon one or more dies by hybrid bonding in one or more first landing areas and / or one or more dies by solder bonding in one or more second landing areas. In the two types of landing areas, contact pads are formed which are embedded in a dielectric layer or a stack of dielectric layers, enabling hybrid bonding in the hybrid bonding landing areas. The contact pads in the solder landing areas are configured to receive solder material directly on the contact pads after bonding of the hybrid bonded dies, without requiring the formation of under bump metal pads. In another aspect, at least the solder contact pads include two layers, a bottom layer and a top layer, the bottom layer being formed of a material exhibiting slower intermetallic compound formation when reacting with solder than the material of the top layer. In another aspect, additional contact pads are incorporated in a stack of dielectric material into which the hybrid and / or solder contact pads are embedded, in a manner that enables revealing the additional contact pads after hybrid and solder bonding. The additional contact pads may be configured for electrical testing of bonded dies or dies within the receiving substrate, or for bonding of further dies.

An electrical testing device comprises a machine table, a pair of conveying rails and a first moving device. The machine table is provided with a bearing face, and the bearing face is configured to bear the jig combination. The conveying rail is configured to convey an object to be detected, and the conveying rail and the bearing face are spaced by a plurality of distances. The first moving device is arranged on the machine table and connected with the conveying rail, and the first moving device is configured to move the conveying rail relative to the machine table so as to change the distance. According to the electrical testing equipment, the efficiency of placing the jig combination in the electrical testing equipment can be improved, and the opportunity that the lower jig and the upper jig are placed in a misplaced manner generally can be avoided.

The invention provides a battery pack test method and device, electronic equipment and a computer readable storage medium. The method comprises the following steps: determining an electrical test type of a to-be-tested battery pack; determining test parameters of the electrical test equipment and a connection mode of the electrical test equipment and the to-be-tested battery pack according to the electrical test type; controlling the grounding function of the electrical test equipment to be in a failure state; and after detecting that the electrical test equipment is connected with the to-be-tested battery pack according to the connection mode, controlling the electrical test equipment to load voltage to the to-be-tested battery pack according to the test parameters so as to perform an electrical test corresponding to the electrical test type on the to-be-tested battery pack. The accuracy of the electrical test of the battery pack can be improved.

The present application belongs to the technical field of oil and gas drilling, and particularly relates to a multiphase fluid acoustic and electric testing device and method for drilling overflow simulation. The device is characterized in that: a multifunctional interface integrated on the upper part of the pressure-resistant reaction kettle cylinder is used to complete the injection of different component multiphase fluids and pressure setting; a heating jacket is used to complete the setting of a predetermined temperature; and continuous stirring is used to make the multiphase fluid reach a stable state with uniform composition. Under the conditions of a set temperature and pressure, electrical and acoustic signals are collected to analyze the multiphase fluid. The electrical testing component distinguishes different fluid components by monitoring the changes of resistance and dielectric constant; and the acoustic monitoring component detects the content of bubbles in the fluid through acoustic signals. The acoustic and electric cooperative monitoring can effectively distinguish different overflow types such as gas invasion, oil invasion and water invasion, and overcome the limitations of single monitoring method, thereby providing a reliable technical means for the mechanism research and practical application of downhole overflow monitoring.

A method for manufacturing a probe unit according to an embodiment of the present invention is for manufacturing a probe unit that is to be installed on an electrical inspection device for inspecting electrical characteristics of an electronic circuit board and that includes a probe pin 11 that can contact the surface of the electronic circuit board, the method comprising using a pedestal 10 having an alignment mechanism that determines the position in the electrical inspection device, adjusting the relative position and orientation of the tip of the probe pin 11 with respect to the pedestal 10, and fixing the probe pin 11 to the pedestal 10 while maintaining the relative position.

The application discloses a kind of liquid cooling wire harness detection method, device, storage medium and electronic device, it is related to vehicle technical field.Therein, the method comprises: according to test requirement determines test working condition;In test working condition, obtain first temperature, wherein, first temperature includes the temperature of liquid cooling wire harness, the temperature of environmental chamber and the temperature of electrical connection point, environmental chamber is used to isolate liquid cooling wire harness with external environment, and electrical connection point is the connecting point of environmental chamber and temperature sensor;In response to first temperature greater than or equal to temperature threshold value, adjust cooling parameter, wherein, cooling parameter is used to indicate the flow rate and water temperature of cooling loop;In the preset time period after adjusting cooling parameter, obtain second temperature;According to second temperature, liquid cooling wire harness is detected.The application solves the technical problem that related art tests liquid cooling wire harness by appearance inspection or electrical test, resulting in complex method, not easy to implement, low efficiency, low accuracy, low safety.