710 results about "Electrical testing" patented technology

The invention provides a circuit board electrical performance test and diagnosis method, which comprises the following steps of: constructing a structured process-electrical data set by collecting process parameters such as etching time, pressing temperature, drilling precision, copper foil thickness and the like and electrical test indexes such as impedance deviation, leakage current, signal attenuation and the like; screening key process variables by adopting mutual information analysis and a maximum correlation-minimum redundancy criterion; through modeling of a three-layer causal diagram and a structural equation, quantitative influence evaluation of process parameters on electrical performance and fault types is realized; when a fault is detected, the system can automatically perform reverse reasoning, identify a main manufacturing deviation item and generate attribution diagnosis and process optimization suggestions, so that the accuracy of fault diagnosis and the pertinence of process adjustment are improved, and the fault occurrence rate is reduced and the product quality is improved.

The invention relates to the technical field of electrical testing, in particular to a battery testing method and system, and the method comprises the steps: obtaining a voltage data sequence and historical log data of each cell in a to-be-tested battery pack; determining a dynamic instability score of each battery cell according to the parameter volatility index of each battery cell and the spatial correlation weight between each battery cell and the adjacent battery cell; on the basis of the historical log data, analyzing a repeated cumulative effect of all historical damage events corresponding to each battery cell, and determining a historical damage degree of each battery cell; performing deep fusion on the dynamic instability score and the historical damage degree through a nonlinear function to obtain a comprehensive risk index of each battery cell; and based on the extreme values and distribution of the comprehensive risk indexes of all the cells, determining a fault degree capable of representing the overall health risk of the battery pack, and determining a health test result of the battery pack according to the fault degree. According to the method, the accuracy and reliability of battery pack testing are improved.

The invention provides an intrinsic solid-state ion diffusion coefficient test method and device based on optical imaging, and relates to the technical field of solid-state ion test.The method comprises the steps that a test sample is pretreated; carrying out a photoelectric test on the test sample; placing the electrochemical cell in an optical imaging system, connecting the electrochemical cell with an electrical testing system, applying a constant voltage deviating from a steady state to the monodisperse electrode plate, collecting the real-time change condition of the material under the modulation of the constant voltage in real time through an industrial camera, and outputting relational data of optical intensity and time; analyzing the diffusion path through in-situ characterization equipment, and obtaining an ion diffusion path corresponding to the to-be-detected ion battery electrode material particles in combination with dynamic information provided by an optical imaging system; and determining the characteristic time according to the relational data of the optical intensity and the time, and determining the intrinsic solid ion diffusion coefficient corresponding to the test sample by combining the characteristic time and the ion diffusion path corresponding to the to-be-tested ion battery electrode material particles.

The invention discloses an AVI one-driving-two testing and sorting integrated automation device and method. The device comprises an automatic feeding lifting table A, an automatic feeding lifting table B, an electrical testing machine A, an electrical testing machine B, a post-material-number-test OK and NG plate table storage table A, a post-material-number-test OK and NG plate table storage table B, a buffer section A, a buffer section B, a discharging conveyor A, a discharging conveyor B, a signal transmission sensor, an AVI detection machine, a discharging lifting table and temporary storage area, a feeding section, a sorting manipulator and an OK plate storage area. An NG plate storage area and an NG plate maintenance area. According to the AVI one-driving-two testing and sorting integrated automation device and method, the production efficiency is remarkably improved, the tedious process of manual carrying and circulation is successfully replaced, and great convenience is brought to field management. And meanwhile, the quality risk and the labor cost are effectively reduced, and powerful technical support is provided for optimization and upgrading of an automatic production line.

The invention relates to the technical field of lighting electrical testing, in particular to a lamp testing system and method, and the system comprises an electrical parameter collection module, a harmonic analysis module, an optical collection module, a light fluctuation analysis module and an abnormality judgment module. Wherein the electrical parameter acquisition module is used for acquiring a real-time voltage waveform of an input end of a lamp; the harmonic analysis module is used for extracting a fundamental wave and each harmonic component and calculating a harmonic distortion rate; the optical acquisition module is used for synchronously acquiring light signal time sequence data of the light emitting surface of the lamp; the light fluctuation analysis module calculates the light fluctuation frequency of the light source; and the abnormity judgment module is used for generating an electrical-optical relevance index and comparing the electrical-optical relevance index with a preset threshold value so as to output a stroboscopic qualification judgment result of the lamp. According to the method, the accuracy of lamp stroboscopic detection and the causal identification capability are effectively improved by constructing the electrical-optical correlation index and realizing synchronous judgment.

The invention relates to a power device dynamic on-resistance detection method, system and equipment, a storage medium and a program product, and is applied to a power device dynamic on-resistance detection system, and the power device dynamic on-resistance detection system comprises an upper computer, a controller, a double-pulse test circuit and a signal collector, the double-pulse test circuit is provided with a tested gallium nitride power device. The method comprises the following steps: under the condition that the test temperature of a tested gallium nitride power device meets a preset test condition, sending multiple groups of double-pulse test signals to a double-pulse test circuit through a controller; collecting multiple groups of electrical test parameters of the tested gallium nitride power device under the multiple groups of double-pulse test signals through a signal collector; and detecting the on-resistance of the tested gallium nitride power device through the upper computer based on the plurality of groups of electrical test parameters. By adopting the method, the detection accuracy of the dynamic on-resistance detection of the power device is improved.

The invention discloses an electric energy meter data interaction and management method and system based on metering production scheduling, and relates to the technical field of intelligent electric power metering, and the method comprises the steps: carrying out the appearance inspection, electrical test and function inspection of an electric energy meter, collecting the detection data of the electric energy meter in real time, analyzing the detection data through edge calculation, and carrying out the data interaction and management according to the analysis result. Feature extraction is carried out through a deep learning model, a fault mode and a trend are identified, early warning is carried out according to a fault prediction result, a fault log is recorded, abnormal conditions are classified, fault equipment is isolated, a detection model is trained, detection efficiency, a fault rate and an equipment utilization rate are evaluated, and an optimization suggestion is generated according to an analysis result; and adjusting detection equipment parameters. By integrating edge calculation, a deep learning model and real-time data preprocessing, comprehensive management of appearance inspection, electrical test and function inspection of the electric energy meter is realized, and meanwhile, powerful data support is provided for power dispatching management.

The invention discloses a power grid graph structure data generation method, apparatus and device, and a storage medium. The method comprises the steps of obtaining power grid structure data including electrical nodes of a power grid and edges representing a connection relationship between the electrical nodes; scattering the electrical nodes in a preset blank graph in the form of points, connecting the edges with the corresponding electrical nodes in the form of line segments, and generating a scatter diagram corresponding to the power grid structure data; generating a corresponding electrical test chart according to the node type of the electrical node and the connection type of the edge; according to the node type of each electrical node and the node type of the electrical node connected with each edge, generating textual description of each type of electrical node in the power grid; and generating graph structure data corresponding to the power grid structure data according to the scatter diagram, the electrical test diagram and the textualized description. According to the invention, the precision and interpretability of the generated power grid graph structure can be improved.

The invention discloses a fault injection board card and a case, and relates to the technical field of electrical testing, and the fault injection board card comprises an ECU connector, an external input interface, an external channel switch, a switching module and a fault injection circuit. An external channel switch and an external input interface form a fault injection channel capable of injecting faults from the outside of a board card, and the fault injection channel and a fault injection circuit are connected with an ECU connector through a switching module. Therefore, a user can freely select whether the ECU to be tested is tested by the fault generated by the fault injection circuit in the board card or by the fault injected into the board card by the external input interface through the switching module. According to the board card, the ECU to be tested can be tested through internal and external fault injection modes, and the situation that the board card cannot be used due to the fact that a controller in the fault injection board card is damaged or communication faults occur can be avoided.

The invention belongs to the technical field of power distribution switches, and particularly discloses a test mechanism suitable for a switch cabinet handle, which comprises a substrate, the upper end of the substrate is fixedly connected with a plurality of support frames, the upper ends of the support frames are fixedly connected with a support plate, and the upper end of the support plate is provided with a transmission groove. A rotating assembly used for rotating the handle is arranged on the base plate corresponding to the transmission groove, a detection assembly used for detecting the insulation state of the rotating handle is arranged on the side, close to the rotating assembly, of the supporting plate, and when the handle rotates along with the second square rod, the first square rod, the transmission block and the trigger protruding block are driven to rotate synchronously. The trigger bump can instantly extrude the micro-touch switch, the power supply module and the resistance detector are started, through a detection loop formed by a lead, insulation resistance changes of the connection part of the handle and the square rod under the action of mechanical friction and stress in the rotation process are accurately captured, dynamic insulation data of the handle are captured, and an electrical property detection test of the handle is realized.

The invention discloses a cabinet fault diagnosis system, method and device and a storage medium, relates to the field of servers, and aims to solve the problem of low efficiency of troubleshooting cable backboard faults one by one in a traditional electrical test. The first manager is a manager in a node included in the cabinet under different networking configurations, the first manager is configured to generate a routing table corresponding to each node of the cabinet and burn the routing table into the cable backboard, and in response to a received fault monitoring instruction, the corresponding second manager is accessed through the switching component according to the routing table, and the second manager is configured to perform fault monitoring according to the received fault monitoring instruction. Obtaining a fault diagnosis result; and the second manager is configured to obtain the current state of the communication link of the node corresponding to the second manager and update the link state column corresponding to the second manager in the routing table according to the current state of the communication link. According to the invention, local fault diagnosis can be carried out on the cable backboard under the condition that the remote management software is not deployed, and the fault diagnosis efficiency is improved.

The invention discloses an FAKRA wire harness error code testing device and method, and relates to the technical field of error code testing. The method comprises the following steps of preparation before test, basic electrical test, limit plugging test, vibration test, stability test and test result analysis. According to the method, the initial bit error rate of the to-be-tested FAKRA wire harness is tested by using the bit error tester after the test equipment is calibrated, then the connectors at the two ends and the matched connector are subjected to the limit plugging test, then the vibration test is performed, and the simulation degree of the vibration test is evaluated, so that whether vibration simulation optimization is performed or not is determined; according to the method and the device, firstly, the fluctuation condition of the bit error rate is monitored in the test period, so that whether a clock optimization measure is taken or not is determined, finally, all test data are collected, the stability of the bit error test is ensured, and the problem that the bit error test accuracy is reduced due to the fact that the vibration test simulation degree is not high enough and the simulation quality is unstable in the prior art is solved.

The invention discloses an electrical testing method and device for a liquid crystal display panel, and the method comprises the steps: providing an array circuit which comprises a plurality of groups of gate lines, a plurality of pixel units and a plurality of data lines, the different pixels of the plurality of pixel units are sequentially and longitudinally arranged, and the same pixels of the plurality of pixel units are sequentially and transversely arranged; and driving one group of the plurality of groups of gate lines and the corresponding data lines, writing data into the same type of pixels of all rows connected with the group of gate lines, displaying a test picture, setting the gate lines of the rest groups as low levels, and driving the gate lines of the rest groups and the corresponding data lines until all types of electrical test pictures are tested. The electric measurement of three pure color pictures is realized, a liquid crystal display panel NG product is prevented from entering a subsequent process, and the problem that red, green and blue electric measurement pure color pictures cannot be displayed is solved.

Invention relates to a wiring harness insulation testing device, comprising a first testing chamber for receiving one end of tested wiring harness with an electrical connector and a second testing chamber for receiving another end of tested wiring harness with an electrical connector. Each testing chamber comprising a chamber bottom and chamber top, which are openable in a released state and lockable into a hermetically closed state around said electrical connectors and around the insulation at the ends of said wiring harness to be tested. Each testing chamber comprising electrical testing means, an inlet connected to the means for generating negative or positive gas pressure inside said testing chamber, means for measuring pressure in said testing chamber, a control unit, which is configured to perform high-voltage tests on said wiring harness with said electrical testing means.

The invention discloses an on-line withstand voltage test device for transformer oil, relates to the technical field of electrical test instruments, and is used for testing the dielectric constant of the transformer oil. The device can be directly installed between the oil pumping pipe and the oil filling pipe of the transformer oil arc extinguishing on-load tap-changer without being carried back and forth, the automatic oil pumping device is designed, oil is directly pumped out of the transformer without being in contact with the outside, obtained detection data are accurate, and insulating oil is not wasted. The device consists of a transformer oil withstand voltage tester and an automatic oil pumping device, wherein a test unit is arranged in the automatic oil pumping device. The automatic oil pumping device is directly communicated with an oil pumping pipe and an oil injection pipe of the transformer oil arc extinguishing on-load tap-changer, so that totally-closed sampling and reinjection processes are realized. Exposure of an oil sample is avoided, the purity of an oil product is kept in the whole process, and then the accuracy of data is improved.

The invention relates to the technical field of product tin pick-up testing, and discloses a tin pick-up testing workstation which comprises a rack, and a feeding station, a soldering flux pick-up station, a tin pick-up station, an automatic electric testing station and a discharging station are sequentially arranged on the rack; a tin soldering gantry module is further arranged above the soldering flux dipping station and the tin dipping station; at least one welding rod group is clamped on a feeding hollow rotating module of the feeding station; the tin soldering gantry module clamps a group of welding rods carrying products on the feeding hollow rotating module to sequentially pass through a soldering flux dipping station and a tin dipping station; the transfer module clamps the welding rod group of the product carried on the tin soldering gantry module to an automatic electric measurement station for automatic electric measurement; and the welding rod group product after the automatic electrical testing is completed is discharged to the discharging disc module through the manipulator discharging module. Compared with the prior art, the automatic tin pick-up test work of a plurality of products is realized through the plurality of stations and the tin soldering gantry module which are arranged in sequence, so that the working efficiency is greatly improved.

The disclosure relates to air transfer free of solid state batteries and electrical testing of solid state batteries in scanning electron microscopes. In one embodiment, an apparatus includes a sample stage including a base member and a sample support assembly coupled to the base member, where the sample support assembly includes a bracket having opposing first and second bracket portions, the first holder portion and the second holder portion are configured to compress a sample within the holder receiving portion, wherein the base member is configured to engage a sample stage within a microscope chamber. A method includes securing a sample stage in a microscope chamber and charging and / or discharging the sample at least partially through an electrical coupling in the chamber.

The invention provides a conduction tester for a wire harness connector, and particularly relates to the technical field of electrical testing of connectors, the conduction tester comprises a testing table plate and a tester body mounted on the top surface of the testing table plate, one side of the tester body is provided with an accommodating cabin, and one side of the tester body is provided with a display and a main controller; according to the conduction tester of the wiring harness connector, the limiting sliding block is stably matched with the limiting sliding rail on the cabin wall of the containing cabin, the probe seat can be accurately aligned with the connector in the clamping groove seat through the servo air cylinder, the probability of poor contact caused by manual insertion is greatly reduced, it is guaranteed that the test is smoothly carried out, and meanwhile the testing efficiency is improved. Through the cooperation of the pressure sensing part, the main controller and the force value regulator, the driving force of the linear driving part can be kept in a proper range, and the stable contact state of the probe and the connector is ensured, so that the test result is more reliable, and the test error caused by the contact problem is reduced.

The invention relates to the technical field of relay protection tests, in particular to intelligent substation relay protection test equipment. The device comprises an operation table, the two sides of the upper portion of the operation table are provided with testing mechanisms used for electrical testing, and the operation table is provided with a sliding rail used for guiding an electrical component to move. The synchronous jacking assembly and the opposite positioning assembly can be driven to work synchronously through the driving assembly, a telescopic push rod is driven to move upwards through the driving shaft, a jacking block frame made of an insulating ceramic material is extruded to jack an electrical component, and meanwhile the driving shaft synchronously drives two linkage frames to move upwards; the two linkage frames extrude the two positioning extrusion blocks made of the insulating ceramic material to move oppositely on the sliding rails to clamp the electrical component oppositely, so that jacking insulation and opposite positioning are synchronously carried out, the electrical component is enabled to enter a to-be-tested state rapidly, and the test efficiency is improved.

The invention discloses a method for realizing TSV failure verification of a 3D chip product, and the method comprises the steps: enabling the upper end of a TSV group to be connected to an upper chip in a 3D chip, enabling the lower end of the TSV group to be connected to a bottom chip in the 3D chip, and screening and positioning a suspected TSV structure in the TSV group through a chip testing technology; grinding the upper chip and the bottom chip to expose the metal layers at the top and the bottom of each TSV structure, and establishing electrical interconnection of each TSV structure on the bottom metal layer; and based on the electrical interconnection of the metal layers, performing an electrical test on the suspected TSV structure and the contrast TSV structure in the TSV group, and determining whether the suspected TSV structure is abnormal or not according to comparison information of an electrical test result. According to the scheme of the invention, non-destructive TSV electrical testing is realized.

The invention relates to the field of sensor performance testing, and discloses a photoelectric sensor testing braiding machine which comprises a workbench, an inclined table plate, a testing track, a testing sorting mechanism and a qualified discharging track, the testing track, the testing sorting mechanism and the qualified discharging track are sequentially arranged on the inclined table plate, an overturning discharging mechanism is arranged below the qualified discharging track, and a three-dimensional visual detection module is arranged on the side of the qualified discharging track. And a braid packaging mechanism is arranged on the workbench. The test track is provided with a shading electrical test mechanism, and the top end is loaded through a loading mechanism; the testing and sorting mechanism is used for distributing qualified parts and abnormal parts; a rotating disc of the overturning discharging mechanism is provided with a material suction assembly, and a material taking station, an image detection station and a discharging station are formed. According to the invention, multiple procedures are integrated, a cross-equipment transfer link is omitted, the production cycle is shortened, the efficiency is improved, and secondary damage to the photoelectric sensor is reduced; the shading electrical property test guarantees the test accuracy of a dark environment, the three-dimensional visual detection solves the problem of pin coplanarity detection pain points, double screening is achieved, and the product quality is comprehensively guaranteed.

The present application provides a method and structure for detecting the tip condition of a probe card, a wafer, and a wafer testing method. It relates to a method for detecting the tip condition of a probe card, including: determining a plurality of probes to be tested on the probe card; determining a plurality of probe pads, and sequentially arranging a metal wire structure between two probe pads to form a test circuit by connection; respectively inserting the probes to be tested into the corresponding probe pads for contact connection; dividing and designing a plurality of test groups based on the positions of the probe pads in the test circuit, and measuring the contact resistance between the probes to be tested and the corresponding probe pads; and judging the tip state of the probes to be tested based on the contact resistance between the probes to be tested and the corresponding probe pads. The present application monitors the tip condition of the probe card by means of electrical testing, which not only reduces the testing cost, but also further improves the testing accuracy and detection efficiency.

The invention relates to the technical field of electrical testing, and discloses a low-resistance insulation electronic multiplexing test module, which comprises a circuit integrated board card, and a power supply module is arranged on the left side of the top of the circuit integrated board card and is used for providing a stable power supply in electronic equipment; the multi-path switching module is arranged at the top of the circuit integrated board card and is used for quickly switching among test channels; the signal conditioning module is arranged at the top of the circuit integrated board card and is used for ensuring a stable switching process between test channels; the driving module is arranged at the top of the circuit integrated board card and is used for driving the switch element between the test channels; and the control module is arranged at the top of the circuit integrated board card and is used for controlling switching among different test channels. According to the invention, by integrating the multi-channel switching module, a plurality of electrical test channels can be rapidly switched, the low-efficiency process of manual switching one by one of the traditional test equipment is avoided, and the design of the multi-channel switching module enables the system to complete a multi-channel test in a short time, so that the test efficiency is greatly improved.

The invention relates to an LED packaging detection method and system, and the method comprises the steps: firstly obtaining a light source image of a to-be-detected LED light source, and then carrying out the feature extraction and analysis of the light source image, thereby obtaining image feature information; meanwhile, electrical testing is carried out on the to-be-detected LED, and electrical characteristic information is obtained; carrying out a thermal shock test and a vibration shock test on the to-be-detected LED package to respectively obtain corresponding thermal characteristic information and mechanical characteristic information; and finally, inputting the image feature information, the optical feature information, the thermal feature information and the mechanical feature information into a package detection model trained by combining a plurality of machine learning classifiers to obtain an LED package quality detection report, and judging the package detection quality grade by the report according to a preset threshold value. The detection accuracy and reliability are improved by comprehensively evaluating the quality of LED packaging in multiple aspects such as optics, electricity, thermal and mechanical properties.

Decorative design of an electronic detector. 2.1) Plan view, rear view, perspective view; 2.2) Plan view, rear view, perspective view; 2.3) Bottom view, rear view, perspective view; 2.4) Bottom view, rear view, perspective view; 2.5) Plan view, front view, perspective view; 2.6) Plan view, front view, perspective view; 2.7) Bottom view, front view, perspective view; 2.8) Bottom view, front view, perspective view; 2.9) Right side view; 2.10) Rear view; 2.11) Left side view; 2.12) Front view; 2.13) Bottom view; 2.14) Plan view

A method and a testing system for testing a semiconductor chip package are provided. The method includes fixing, by a mechanical testing sub-system of the testing system, the semiconductor chip package within the mechanical testing sub-system, such that the semiconductor chip package is aligned with pressure components of the mechanical testing sub-system and is electrically connected to an electrical testing sub-system of the testing system; simultaneously performing, by the mechanical testing sub-system and the electrical testing sub-system, a first stage of a mechanical testing and an electrical testing on the semiconductor chip package; and in response to determining, by a controller of the testing system, that a preset trigger condition of the mechanical testing or the electrical testing is reached, controlling the mechanical testing sub-system to switch the first stage of the mechanical testing to a second stage of the mechanical testing.

An electrical test of a semiconductor device is conducted by electrically connecting a plurality of leads of the semiconductor device with a plurality of electrodes of a test board via a plurality of socket terminals of a socket of a test apparatus, respectively. At least a part of the socket is disposed inside a chamber of the test apparatus, and the test board is disposed outside the chamber. The semiconductor device is to be cooled by a cool air circulating in the chamber. The socket has a cavity portion through which the cool air circulating in the chamber can pass, and a part of each of the plurality of socket terminals is exposed in the cavity portion of the socket. The plurality of socket terminals is to be cooled by the cool air passing through the cavity portion of the socket.

The invention provides a power battery echelon utilization evaluation method, device and equipment and a storage medium, and the method comprises the steps: carrying out the first qualified battery screening of a to-be-evaluated battery based on historical traceability information, and carrying out the second qualified battery screening of the to-be-evaluated battery based on real-time monitoring data, determining the non-destructive grade of the cascade utilization of the to-be-evaluated battery according to the two screening results; performing performance test on the to-be-evaluated battery based on the electrical test data, the electrochemical test data and the electrical property test data to obtain a test grade of echelon utilization of the to-be-evaluated battery; and performing consistency evaluation on the to-be-evaluated batteries under the condition that both the nondestructive grade and the test grade meet preset conditions, and sorting the to-be-evaluated batteries based on a consistency evaluation result. According to the method, the nondestructive grade is determined through two times of screening, and the performance test is further performed, so that the accuracy of power battery echelon utilization evaluation is improved.

The present invention provides a whole-satellite thermal cycle test method and system, relating to the field of spacecraft thermal testing technology. The method comprises the following steps: S1: satellite loading, S2: test state establishment, S3: satellite electrical testing, S4: optical chamber opening, S5: nitrogen replacement, S6: high-temperature baking, S7: normal-pressure thermal cycle test operating conditions, S8: chamber temperature recovery, S9: air replacement, S10: chamber door opening, S11: test withdrawal, and S12: satellite unloading. Compared to traditional whole-satellite thermal vacuum testing, the present invention's whole-satellite normal-pressure thermal cycle test offers significant advantages in terms of liquid nitrogen consumption, personnel requirements, test time, external heat flux equipment, specialized tooling, and operator safety.

Disclosed is an upper press head for mechanical testing and electrical testing of a semiconductor chip package. The upper press head includes: a force receiving component configured to receive a downward force; a force delivering component, having an upper portion connected with the force receiving component and having a first lateral sectional area, and a lower portion having a second lateral sectional area less than the first lateral sectional area; a force applying component connected with the lower portion of the force delivering component and configured to apply the downward force to the semiconductor chip package, the force applying component including: a plurality of protrusions that are laterally separated from each other and are configured to simultaneously press the semiconductor chip package; and a space between two adjacent protrusions matches portions of solder balls of the semiconductor chip package.