A photoelectric packaging structure disclosed by the present invention comprises a packaging substrate, an optical
chip, an electric
chip, a lens and a micro connector, the packaging substrate is provided with a first upper surface, the first upper surface is provided with a groove, the optical
chip is installed in the groove, the optical chip is provided with a second upper surface, the second upper surface is flush with the first upper surface, and the optical chip is installed in the groove. The electric chip is electrically connected with the second upper surface and the first upper surface at the same time; the lens is arranged on the packaging substrate, is positioned on one side of the optical chip and is optically coupled with the optical chip; the micro connector is installed on the packaging substrate, the micro connector is connected with an
optical fiber, and the optical chip is optically coupled with the
optical fiber through the lens and the micro connector. According to the photoelectric packaging structure, the
signal transmission path is shortened, the possibility of impedance mismatching and
signal crosstalk is reduced, the high-frequency performance and
signal integrity of packaging are improved, efficient
optical coupling of the optical chip and the
optical fiber is achieved, the stability and efficiency of optical signal transmission are improved, and the cost is reduced. And the aspects of compactness, connection efficiency,
optical coupling performance and the like are remarkably improved.