According to the three-dimensional stacked photoelectric co-packaging structure and the packaging method thereof provided by the invention, the three-dimensional stacked structure is formed by bonding the optical chips with C2W of the adapter plate
wafer, and the optical chips can be allowed to be processed separately and then bonded on the adapter plate
wafer, so that the complexity of the packaging process is reduced, and the packaging reliability is improved; besides, a bonding pad of each layer of optical
chip bonding pad region is in contact connection with a part of conductive via holes of the electric
interconnection region, and an upper layer
optical coupling region is arranged to shrink outwards relative to a lower layer
optical coupling region to
expose a first
optical coupler in the lower layer
optical coupling region, so that the areas of the optical chips are sequentially increased from bottom to top along the thickness stacking direction of the photoelectric switching structure; the electric
interconnection structure is arranged on the outer side edge of the optical
chip to form an
inverted pyramid shape, the electric
interconnection structure is distributed on the outer side edge of the optical
chip, a conductive
column structure can be effectively prevented from being manufactured on the optical chip, the
process complexity is reduced, meanwhile, the optical interconnection structure is also distributed on the outer side edge of the optical chip, light in the optical chip can be directly coupled to a photoelectric transmission layer, and too high efficiency loss caused by too many optical
coupling times is avoided.