757 results about "Optical interconnect" patented technology

Opto-electrical systems having electrical and optical interconnections formed in thin layers are disclosed. In one set of preferred embodiments, optical signals are conveyed between layers by respective vertical optical couplers disposed on the layers. In other preferred embodiments, optical signals are conveyed by stack optical waveguide coupling means. Yet other preferred embodiments have electrical via means formed in one or more layers to covey electrical signals between two or more layers.

A new photopolymerizable material allows single-step, fast recording of volume holograms with properties that can be electrically controlled. Polymer-dispersed liquid crystals (PDLCs) in accordance with the invention preferably comprise a homogeneous mixture of a nematic liquid crystal and a multifunctional pentaacrylate monomer in combination with photoinitiator, coinitiator and cross-linking agent. Optionally, a surfactant such as octancic acid may also be added. The PDLC material is exposed to coherent light to produce an interference pattern inside the material. Photopolymerization of the new PDLC material produces a hologram of clearly separated liquid crystal domains and cured polymer domains. Volume transmission gratings made with the new PDLC material can be electrically switched between nearly 100% diffraction efficiency and nearly 0% diffraction efficiency. By increasing the frequency of the switching voltage, switching voltages in the range of 50 Vrms can be achieved. The optional use of a surfactant allows low switching voltages at lower frequencies than without a surfactant. In an alternative embodiment, a PDLC material in accordance with the invention can be utilized to form reflection gratings, including switchable reflection gratings. In still further embodiments, a PDLC material in accordance with the invention can be used to form switchable subwavelength gratings. By further processing, static transmission, reflection, and subwavelength PDLC materials can be formed. In addition, PDLC materials in accordance with the present invention can be used to form switchable slanted transmission gratings suitable for switchable optical coupling and reconfigurable optical interconnects.

Methods and apparatus are described for distribution optical elements and compound collector lenses for a broadcast interconnect. An apparatus includes a broadcast optical interconnect including: a plurality of nodes positioned to define a node array, each of the plurality of nodes having at least one optical signal emitter and a plurality of optical signal receivers positioned to define a receiver array that substantially corresponds to the node array; and a plurality of optics optically coupled to the array of nodes, the plurality of optics positioned to define an optics array that substantially corresponds to the node array and the receiver array, each of the plurality of optics including at least one optical distributing element and an optical collecting element, wherein an optical signal from the optical signal emitter is fanned-out by the at least one optical distributing element of one of the optics and broadcast to one of the plurality of receivers of all of the plurality of nodes by the optical collecting element of all of the plurality of optics.

A surface-emitting laser diode device that oscillates in a direction perpendicular to the substrate is provided. This surface-emitting laser diode device includes: an active layer; a resonator structure including a first distributed Bragg reflector and a second distributed Bragg reflector that face each other and sandwich the active layer; a hole passage that extends from a first electrode to the active layer; an electron passage that extends from a second electrode to the active layer; a hole restricting structure that is located in the hole passage and defines a region for confining holes to the active layer; and an optical mode control structure that includes a non-oxide region provided in the resonator structure and an oxide region surrounding the non-oxide region, each region containing Al as a constituent element. In this surface-emitting laser diode, the area of the non-oxide region is smaller than the area of the hole restricting structure.

A chip-to-chip optical interconnect includes a substrate, an optoelectronic die, and a waveguide structure. The substrate includes an optical via passing through the substrate. The optoelectronic die is disposed on the substrate and aligned to optically communicate through the optical via. A waveguide structure is positioned proximate to the substrate and aligned with the optical via to communicate optical signals with the optoelectronic die through the optical via.

Optical fiber interconnection devices, which can take the form of a module, are disclosed that include an array of optical fibers and multi-fiber optical-fiber connectors, for example, a twenty-four-port connector or multiples thereof, and three eight-port connectors or multiples thereof. The array of optical fibers is color-coded and is configured to optically interconnect the ports of the twenty-four-port connector to the three eight-port connectors in a manner that preserves transmit and receive polarization. In one embodiment, the interconnection devices provide optical interconnections between twenty-four-fiber optical connector configurations to eight-fiber optical connector configurations, such as from twenty-four-fiber line cards to eight-fiber line cards, without having to make structural changes to cabling infrastructure. In one aspect, the optical fiber interconnection devices provide a migration path from duplex optics to parallel optics.

A packaged smart pixel array for a reconfigurable intelligent optical interconnect is described. The smart pixel array (298) comprises an optical-to-electronic optical I / O channel 68 input means, an electronic-to-optical optical I / O channel 68 output means, an electrical channel input means (134), an electrical channel output means (114), a data switching means (110) for switching data from optical channel input means to electrical channel output means, a data switching means (130) for switching data from electrical channel input means and optical channel input means to optical channel output means and a packaging means (300) which packages all these means onto a single package with identifiable input and output port means. The smart pixel array makes possible the realization of a reconfigurable optical interconnect which implements multiple reconfigurable optical communication channels.

Methods for bonding semiconductor wafers requiring the transfer of electrical and optical signals between the bonded wafers and across the bonding interface. The methods incorporate the formation of both electrical and optical interconnect vias within the wafer bonding interface to transfer electrical and optical signals between the bonded wafers. The electrical vias are formed across the bonding surface using multiplicity of metal posts that are interfused across the bonding surface. The optical vias are formed across the bonding surface using multiplicity of optical waveguides each comprised of a dielectric material that interfuses across the bonding interface and having an index of refraction that is higher than the index of refraction of the dielectric intermediary bonding layer between the bonded wafers. The electrical and optical vias are interspersed across the bonding surface between the bonded wafers to enable uniform transfer of both electrical and optical signals between the bonded wafers.

To provide an optical interconnection circuit among wavelength multiplexing chips, capable of increasing signal transmission speed and of being easily made minute thereby being simply and easily fabricated, an electro-optical device, and an electronic apparatus, an optical interconnection circuit among wavelength multiplexing chips, which is disposed on a substrate, includes micro-tile shaped elements having a light emitting function or a light receiving function with wavelength selectivity.

An optical path deflecting element, an optical path deflecting apparatus, an image displaying apparatus, an optical writing apparatus, an optical interconnection apparatus, an optical element, and a fabrication method thereof. The optical path deflecting element includes a pair of transparent substrates, transparent electrode films on the substrates to which a voltage having an inverse polarity is selectively applied, an alignment layer in the inner sides of the substrates, and a liquid crystal layer formed of a chiral smectic C phase between the substrates via the alignment layer and homogeneously aligned by the alignment layer. The optical deflecting element can realize the uniformly-aligned liquid crystal layer more easily than a case in which the liquid crystal is aligned to become in a bistable condition. For this reason, it is possible to improve yield in the fabrication.

A multiplexer / demultiplexer is provided for optical interconnection between electronic components on an integrated circuit chip. The multiplexer / demultiplexer includes a substrate formed with an array of photo emitters / detectors and conditioning electronics coupled thereto. A first layer of optically transparent material is formed on the substrate overlying the emitters / detectors and a second layer of optically transparent material, functioning as an optical waveguide, is formed on the first layer. A binary blazed grating is formed at the interface of the two layers. For multiplexing, discrete wavelength optical signals are modulated with data, emitted by the emitters, intercepted by the binary blazed grating, and multiplexed into a polychromatic beam for transmission through the waveguide. For demultiplexing, the discrete wavelengths are separated by the binary blazed grating and directed to corresponding detectors. The conditioning electronics receive and demodulate the output of the detectors to extract data, and format the data for communication with electronic components.

A method and device for interconnecting optical components, such as optical fibers and optical circuits, in a flexible, repeatable, and cost-effective manner. Two or more optical components are interconnected by a flexible optical circuit substrate bearing one or more embedded optical fibers with a lens at each end of each fiber. The flexible optical circuit may be incorporated into a housing bearing apertures for receiving optical connectors of the optical components that are to be interconnected with the device. The lensed ends of the fibers embedded in the flexible optical circuit are positioned adjacent to the apertures for optically connecting to the fibers within the connectors installed in the apertures without conventional mating connectors disposed inside the housing.

Optical fiber interconnection devices, which can take the form of a module, are disclosed that include an array of optical fibers and multi-fiber optical-fiber connectors, for example, two twelve-port connectors or multiples thereof, and three eight-port connectors or multiples thereof. The array of optical fibers is color-coded and is configured to optically interconnect the ports of the two twelve-port connectors to the three eight-port connectors in a manner that preserves transmit and receive polarization. In one embodiment, the interconnection devices provide optical interconnections between twelve-fiber optical connector configurations to eight-fiber optical connector configurations, such as from twelve-fiber line cards to eight-fiber line cards, without having to make structural changes to cabling infrastructure. In one aspect, the optical fiber interconnection devices provide a migration path from duplex optics to parallel optics.

Both high light receiving sensitivity and high speed of a photodiode are achieved at the same time. The photodiode is provided with a semiconductor layer (1) and a pair of metal electrodes (2) which are arranged on the surface of the semiconductor layer (1) at an interval (d) and form an MSM junction. The interval (d) satisfies the relationship of λ>d>λ100, where λ is the wavelength of incident light. The metal electrodes (2) can induce surface plasmon. At least one of the electrodes forms a Schottky junction with the semiconductor layer (1), and a low end portion is embedded in the semiconductor layer (1) to a position at a depth less than λ / 2n, where n is the refractive index of the semiconductor layer (1).

Optical interconnection methods for high-speed data-rate optical transport systems are disclosed that optically interconnect active assemblies to a fiber optic cable in a polarization-preserving manner. The methods include defining active-assembly-wise connector ports that connect to active assembly transmit and receive ports, and defining or establishing a pairings method between the active-assembly-wise connector ports. In a first optical interconnection assembly, an active-assembly-wise port is optically connected to a cable-wise port. In the second optical interconnection assembly, the cable-wise port that corresponds to the connected cable-wise port in the first optical interconnection assembly is optically connected to a select active-assembly-wise port as defined by the pairings method. The optical connection process is then repeated from the second to the first optical interconnection assembly. The optical interconnection acts are repeated until all of the active-assembly-wise ports are connected.

Optical interconnection methods for high-speed data-rate optical transport systems are disclosed that optically interconnect active assemblies to a fiber optic cable in a polarization-preserving manner. The methods include defining active-assembly-wise connector ports that connect to active assembly transmit and receive ports, and defining or establishing a pairings method between the active-assembly-wise connector ports. In a first optical interconnection assembly, an active-assembly-wise port is optically connected to a cable-wise port. In the second optical interconnection assembly, the cable-wise port that corresponds to the connected cable-wise port in the first optical interconnection assembly is optically connected to a select active-assembly-wise port as defined by the pairings method. The optical connection process is then repeated from the second to the first optical interconnection assembly. The optical interconnection acts are repeated until all of the active-assembly-wise ports are connected.

Provided is an optical connection apparatus for a parallel optical interconnect module and a parallel optical interconnect module using the same for reducing a coupling loss generated due to an alignment error when coupled with an optical fiber, comprising: a 2D reflector in a prism shape and having at least two rows of cylinder type lens attached thereto; a 2D optical waveguide having at least two layers of core arrays; at least two rows of 2D optical benches; and a 2D ferrule capable of loading at least two layers of optical fibers so as to facilitate the fixing of the 2D optical waveguide for optical interconnection.

Provided is an optical connection apparatus for a parallel optical interconnect module and a parallel optical interconnect module using the same for reducing a coupling loss generated due to an alignment error when coupled with an optical fiber, comprising: a 2D reflector in a prism shape and having at least two rows of cylinder type lens attached thereto; a 2D optical waveguide having at least two layers of core arrays; at least two rows of 2D optical benches; and a 2D ferrule capable of loading at least two layers of optical fibers so as to facilitate the fixing of the 2D optical waveguide for optical interconnection.

Optical fiber interconnection devices, which can take the form of a module, are disclosed that include an array of optical fibers and multi-fiber optical-fiber connectors, for example, two twelve-port connectors or multiples thereof, and three eight-port connectors or multiples thereof. The array of optical fibers is color-coded and is configured to optically interconnect the ports of the two twelve-port connectors to the three eight-port connectors in a manner that preserves transmit and receive polarization. In one embodiment, the interconnection devices provide optical interconnections between twelve-fiber optical connector configurations to eight-fiber optical connector configurations, such as from twelve-fiber line cards to eight-fiber line cards, without having to make structural changes to cabling infrastructure. In one aspect, the optical fiber interconnection devices provide a migration path from duplex optics to parallel optics.

Fiber optic assemblies and systems for high-speed data-rate optical transport systems are disclosed that allow for optically interconnecting active assemblies to a trunk cable in a polarization-preserving manner. The fiber optic assembly includes at least first and second multifiber connectors each having respective pluralities of first and second ports that define respective pluralities of at least first and second groups of at least two ports each. The first and second multifiber connectors are capable of being disposed so that the at least first and second groups of ports are located on respective termination sides of each ferrule. The fiber optic assembly also has a plurality of optical fibers that connect the first and second ports according to a pairings method that maintains polarity between transmit and receive ports of respective active assemblies. At least one of the first and second groups are optically connected without flipping the fibers, and at least one of the first and second groups are optically connected by flipping the fibers.

The invention provides an optical interconnection circuit between chips, an electrooptical device including the circuit, and electronic equipment including the circuit. In particular, the invention provides such a circuit, device, and equipment in which a signal transmission speed can be increased, and which can be easily microminiaturized and manufactured. An optical interconnection circuit between chips includes a substrate, a micro tile element having a light emitting function which is provided on the substrate, the micro tile element having a light receiving function which is provided on the substrate, an optical wave-guide optically connecting the micro tile element having a light emitting function and the micro tile element having a light receiving function with each other and including an optical wave-guide member formed on the substrate, and an electrode provided on the substrate and electrically connected to the micro tile element having a light emitting function or the micro tile element having a light receiving function.

An optoelectronic device having a flexible substrate and an optical interconnect (i.e. waveguide) comprising a sol-gel based material formed on the substrate. The sol-gel based waveguide is capable of being integrated into an all-optical system and provides for greater interconnect distance and lower signal loss. Other sol-gel based optical devices, such as filters, optical source, detectors, sensors, switches and the like, will be implemented in conjunction with the sol-gel based waveguides to provide for an integrated optical system. Methods of formulating the sol-gel based material and methods for fabricating the sol-gel based devices are also provided.

The present invention relates to a system and methodology to reduce size, weight and cost, improve data processing rates and serviceability, and accommodate higher I / O multi-chip modules (MCMs) for printed circuit board (PCB) assemblies employed in the electronics industry. This is accomplished by selecting low cost, pre-assembled, plastic chip type MCMs for constructing a daughter card where the daughter card material can accommodate high density lines and spaces. Optical interconnects are employed between the daughter card and the motherboard to provide a high speed interface that is substantially not effected by contaminates or limitations associated with electrical lead wires and solder bonds. The result is a high performance card that meets current and projected future demands in signal processing.

A chip-to-chip optical interconnect includes a substrate, an optoelectronic die, and a waveguide structure. The substrate includes an optical via passing through the substrate. The optoelectronic die is disposed on the substrate and aligned to optically communicate through the optical via. A waveguide structure is positioned proximate to the substrate and aligned with the optical via to communicate optical signals with the optoelectronic die through the optical via.

To automate fiber connectivity management in optical systems, a dedicated low bit-rate communications channel unique to each fiber connection in an optical system is provided. The dedicated communications channel simplifies fiber connectivity management by supporting the exchange of port identification information from one optical component to another after which processing determines if the specific connection is a desired association. The dedicated communications channel supports optical interconnection surveillance for all card-to-card optical connections within a group of related cards or within an optical network link. Automating fiber connectivity management in this manner will enhance future products by simplifying the fiber connection validation process and ensuring that any specific connection between optical components is the required association. This will be particularly useful in complex optical environments with many interconnected devices and where troubleshooting faulty connections would be time-consuming and, therefore, very costly.

Micro-resonant structures form a part of an optical interconnect system that allows various integrated circuits to communicate with each other without being connected by signal wires. Substrates have mounted thereon integrated circuits which include at least one optical communications section. Each optical communications section includes at least one transmitter and / or at least one receiver. Such transmitters may include at least one resonant structure, and such receivers may include a receiver for receiving optical emissions from at least one resonant structure. Substrates may also include, mounted thereon, at least one optical directing element such as a mirror, a lens, or a prism. Optical communications sections may also be isolated from each other using filters.

Examples of a computer system packaged in a three-dimensional stack of dies are described. The package includes an electrical die and an optical die coupled to and stacked with the electrical die. The electrical die includes circuitry to process and communicate electrical signals, and the optical die includes structures to transport optical signals. The electrical die has a smaller area than the optical die so that the optical die includes an exposed mezzanine which is configured with optical input / output ports. Additionally, the packaging can be configured to provide structural support against insertion forces for external optical connections.

A multi-chip module (MCM), which includes a three-dimensional (3D) stack of chips that are coupled using optical interconnects, is described. In this MCM, disposed on a first surface of a middle chip in the 3D stack, there are: a first optical coupler, an optical waveguide, which is coupled to the first optical coupler, and a second optical coupler, which is coupled to the optical waveguide. The first optical coupler redirects an optical signal from the optical waveguide to a first direction (which is not in the plane of the first surface), or from the first direction to the optical waveguide. Moreover, the second optical coupler redirects the optical signal from the optical waveguide to a second direction (which is not in the plane of the first surface), or from the second direction to the optical waveguide. Note that an optical path associated with the second direction passes through an opening in a substrate in the middle chip.

An optical interconnect architecture provides three dimensional optical interconnects, with the optical interconnects provided along a plane such as a wafer or a substrate. One or more integrated circuits is provided on a second “electronic” plane that is spaced from the optical interconnect plane. Signals from the circuit on the electronic plane are coupled to the optical interconnect plane using various strategies, including metal or optical interlayer interconnects extending perpendicular to the optical plane. Once on the optical interconnect plane, the signals from the circuits on the electronic plane are propagated optically.

An optical interconnection assembled circuit capable of reducing the number of parts and components, as well as the number of manufacturing processes and capable of mounting those parts and components at a high density in an optical module, thereby realizing a low price. The optical interconnection assembled circuit includes a substrate including plural optical waveguides having partial tapered surfaces respectively, as well as an optical element array facing each of the tapered surfaces. In the optical interconnection assembled circuit, the tapered surfaces and the optical element array are fastened so that they face each other and the optical elements of the optical element array are staggered in disposition.