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The invention relates to a microfabricated device for the rapid detection of DNA, proteins or other molecules associated with a particular disease. The devices and methods of the invention can be used for the simultaneous diagnosis of multiple diseases by detecting molecules (e.g. amounts of molecules), such as polynucleotides (e.g., DNA) or proteins (e.g., antibodies), by measuring the signal of a detectable reporter associated with hybridized polynucleotides or antigen/antibody complex. In the microfabricated device according to the invention, detection of the presence of molecules (i.e., polynucleotides, proteins, or antigen/antibody complexes) are correlated to a hybridization signal from an optically-detectable (e.g. fluorescent) reporter associated with the bound molecules. These hybridization signals can be detected by any suitable means, for example optical, and can be stored for example in a computer as a representation of the presence of a particular gene. Hybridization probes can be immobilized on a substrate that forms part of or is exposed to a channel or channels of the device that form a closed loop, for circulation of sample to actively contact complementary probes. Universal chips according to the invention can be fabricated not only with DNA but also with other molecules such as RNA, proteins, peptide nucleic acid (PNA) and polyamide molecules.

The invention relates to a lens antenna which comprises a metal loudspeaker (4) and a lens (1), wherein the metal loudspeaker (4) is provided with a feed source; the feed source is embedded in the smaller-diameter end of the metal loudspeaker (4), and the lens (1) is embedded in the larger-diameter end of the metal loudspeaker (4); the lens (1) comprises a core plate (2); the core plate (2) is a planar dielectric plate, and one of the planes is provided with a plurality of core-plate disresonance basic units; a core-plate metal square frame (5) is printed in each core-plate disresonance basicunit; and the areas of the core-plate disresonance basic units and the core-plate metal square frames (5) gradually decrease from the center to the edge of the core plate (2). As the core plate (2) is planar, the lens (1) is easy to manufacture. In addition, the lens (1) also comprises matching plates (3) positioned on both sides of the core plate (2). The matching plates (3) can reduce the reflection of the electromagnetic waves on the interface of the lens (1) and the air.

A thin film transistor structure in which a source electrode and a drain electrode formed from a metal material are in direct contact with an oxide semiconductor film may lead to high contact resistance. One cause of high contact resistance is that a Schottky junction is formed at a contact plane between the source and drain electrodes and the oxide semiconductor film. An oxygen-deficient oxide semiconductor layer which includes crystal grains with a size of 1 nm to 10 nm and has a higher carrier concentration than the oxide semiconductor film serving as a channel formation region is provided between the oxide semiconductor film and the source and drain electrodes.

Storage stability of an assay device, comprising an assay strip and sensitive reagents such as antibodies within a plastics casing, is maintained by moulding some or all of the casing from dessicant-containing plastics material, especially a blend of about 60-65% polystyrene and about 30% silica dust. Ideally the desiccant-containing plastics material is used in the moulding of a removable cap for the device. The cap can be made by sandwich injection moulding, using the dessicant-containing polystyrene as a core, surrounded by conventional polystyrene.

An objet of the present invention is to provide a semiconductor device with a new structure. Disclosed is a semiconductor device including a first transistor which includes a channel formation region on a substrate containing a semiconductor material, impurity regions formed with the channel formation region interposed therebetween, a first gate insulating layer over the channel formation region, a first gate electrode over the first gate insulating layer, and a first source electrode and a first drain electrode which are electrically connected to the impurity region; and a second transistor which includes a second gate electrode over the substrate containing a semiconductor material, a second gate insulating layer over the second gate electrode, an oxide semiconductor layer over the second gate insulating layer, and a second source electrode and a second drain electrode which are electrically connected to the oxide semiconductor layer.

Provided is a forceps tip assembly capable of supporting a forceps tip with high rigidity in order to realize a laparoscopic surgery requiring a significant power with the forceps tip, such as an organ removal surgery which has been heretofore difficult to be performed by a robot for medical use. The forceps tip assembly includes: a forceps tip supporting member which has a supporting part for supporting a forceps tip and three leg parts which are disposed at even intervals in a circumferential direction around a central axis line C1 and fixed to the supporting part so as to protrude backward from the supporting part; and three back-and-forth moving members which are disposed at even intervals in a circumferential direction around a predetermined central axis line C2 extending in a front-to-rear direction, which have their front end portions coupled with the three leg pads swingably and slidably in a direction orthogonal to the predetermined central axis line C2 and which are mutually coupled together as relatively movable in the extending direction of central axis line C2.

As a display device has a higher definition, the number of pixels, gate lines, and signal lines are increased. When the number of the gate lines and the signal lines are increased, a problem of higher manufacturing cost, because it is difficult to mount an IC chip including a driver circuit for driving of the gate and signal lines by bonding or the like. A pixel portion and a driver circuit for driving the pixel portion are provided over the same substrate, and at least part of the driver circuit includes a thin film transistor using an oxide semiconductor interposed between gate electrodes provided above and below the oxide semiconductor. Therefore, when the pixel portion and the driver portion are provided over the same substrate, manufacturing cost can be reduced.

An ablation catheter having distal and proximal ends for performing ablation on a human tissue region comprises at least one electrode. These elements are formed on a conductive sheet situated at the distal end of the catheter. A flex circuit assembly couples the at least one electrode to a measurement and power circuit attached to the proximal end of the catheter. The measurement and power circuit supplies power to the at least one electrode via the flex circuit.

Peptide ligands having affinity for serum albumin are useful for tumor targeting. Conjugate molecules comprising a serum albumin binding peptide fused to a biologically active molecule demonstrate modified pharmacokinetic properties as compared with the biologically active molecule alone, including tissue (e.g., tumor) uptake, infiltration, and diffusion.

There is provided an optical device including a light-transmitting substrate having at least two major surfaces and edges, optical means for coupling light into the substrate by total internal reflection and at least one partially reflecting surface located win the substrate.

A display device includes a pixel portion in which a pixel is arranged in a matrix, the pixel including an inverted staggered thin film transistor having a combination of at least two kinds of oxide semiconductor layers with different amounts of oxygen and having a channel protective layer over a semiconductor layer to be a channel formation region overlapping a gate electrode layer and a pixel electrode layer electrically connected to the inverted staggered thin film transistor. In the periphery of the pixel portion in this display device, a pad portion including a conductive layer made of the same material as the pixel electrode layer is provided. In addition, the conductive layer is electrically connected to a common electrode layer formed on a counter substrate.

Provided is a method for controlling a wireless power transmitter transmitting wireless power to at least one wireless power receiver. The method for controlling a wireless power transmitter, according to the present invention, can comprise the steps of: receiving information related to a wireless power receiver from at least one of each of the wireless power receiver; and controlling each of a plurality of power transmitting units included in the wireless power transmitter on the basis of the information related to the wireless power receiver.

A phased array antenna system includes an RF front end, a radome, and an optical calibrator embedded in the radome for enabling in-situ calibration of the RF front end. The optical calibrator employs an optical timing signal generator (OTSG), a Variable Optical Amplitude and Delay Generator array (VOADGA) for receiving the modulated optical output signal and generating a plurality of VOADGA timing signals, and an optical timing signal distributor (OTSD). The in-situ optical calibrator allows for reduced calibration time and makes it feasible to perform calibration whenever necessary.

A micropump in which a fluid is pumped by the interaction of longitudinal acoustic waves and the fluid in the microchannel. The micropump having an acoustical transducer responsive to a high-frequency input and directing a longitudinal acoustic wave into the channel which induces a pressure gradient. The fluid in the channel flowing in the direction of travel of the acoustic wave in the channel.

An intensity distribution of an electric field of a high frequency power used for generating plasma is controlled by using an electrode made of a homogeneous material and a moving body. There is provided a plasma processing apparatus for introducing a processing gas into an evacuable processing chamber 100 and generating plasma by a high frequency power and performing a plasma process on a wafer W by the plasma. The plasma processing apparatus includes a dielectric base 105a having a multiple number of fine holes A; a varying member 200 as the moving body provided with a multiple number of rod-shaped members B capable of being inserted into and separated from the fine holes A; and a driving mechanism 215 configured to drive the varying member 200 to allow the rod-shaped members B to be inserted into and separated from the fine holes A.

A lifting sling and a lifting grommet are disclosed which can be fabricated of a high tensile strength polymeric material, preferably a woven polymer such as liquid crystal polymer fibers, that are woven in a rope or cable configuration. The apparatus features an elongated woven material length of cable that is spliced. Plastic, preferably polyurethane spring cut tube sleeves are positioned as a grip on the splices to allow for handling in the field without concern for the splice becoming disassembled or undone. The sling and grommet of the present invention can each be provided with a clear cover spring cut tube that serves as a flexible protective cover for minimizing abrasion and maintaining the slings appearance.

Apparatus and method for selectively engaging and securing an array of shelf dividers to a mounting device which is securable to a display shelf. In the first form a divider is characterized by a divider structure having an elongated vertical wall and elongated horizontal base that operates to divide, organize and support the displayed merchandise. A resilient latch located on the underside of the base of the divider structure selectively engages and secures the divider structure onto a mounting device comprising a receiving member running longitudinally along the length of the surface of the mounting device which is securable along the front edge of a display shelf. The latch and the receiving member each comprise reciprocating (i.e. complementary) protrusions to allow the cooperative engagement of the divider structure and mounting device, thus locking the divider member to and unlocking the divider member from the mounting device to permit the repositioning of the display as desired without necessitating removal of the merchandise from the display. In addition when the divider structure and mounting device are fully engaged, a second protrusion on the underside of the divider member cooperates with a flange or lip on the mounting device to prevent lateral movement of the divider structure and maintain the position of the divider perpendicular to the mounting device and the front edge of the shelf. In a second embodiment, the divider structure comprises a pusher track and a spring urged pusher assembly to automatically push merchandise to the front of the shelf. Another embodiment comprises a divider base without a vertical divider wall, and with or without a pusher track and spring urged pusher assembly, thus pushers and dividers can be used in various convenient combinations within a shelf management system.

Conductive through vias are formed in electronic devices and electronic device carrier, such as, a silicon chip carrier. An annulus cavity is etched into the silicon carrier from the top side of the carrier and the cavity is filled with insulating material to form an isolation collar around a silicon core region. An insulating layer with at least one wiring level, having a portion in contact with the silicon core region, is formed on the top side of the carrier. Silicon is removed from the back side of the carrier sufficient to expose the distal portion of the isolation collar. The core region is etched out to expose the portion of the wiring level in contact with the silicon core region to form an empty via. The via is filled with conductive material in contact with the exposed portion of the wiring level to form a conductive through via to the wiring level. A solder bump formed, for example, from low melt C4 solder, is formed on the conductive via exposed on the carrier back side. The process acts to make the conductive via fill step independent of the via isolation step.