2957 results about "Flexible circuits" patented technology

The invention discloses a hot-pressing control method and system for a flexible circuit board, and particularly relates to the technical field of flexible electronic manufacturing process control, and the method comprises the following steps: calculating a heat conduction equilibrium coefficient through collecting the temperature and heat flux density data of each region in the flexible circuit board, and achieving the real-time evaluation of a heat diffusion characteristic; in combination with an infrared scanning mode, acquiring reflectivity data, analyzing dynamic change of the reflectivity data along with time, and identifying an abnormal region in which coating residues possibly exist; further comparing the position relationship between the thermal diffusion anomaly and the infrared reflection anomaly, screening a space overlapping region as a high-risk point, and executing a preset regulation and control strategy; according to the method, the heat conduction equilibrium coefficient is calculated by collecting heat flow and temperature data, the coating residue abnormal area is recognized by combining infrared reflectivity time sequence characteristics, the high-risk area is screened based on the space overlap ratio for dynamic regulation and control, accurate recognition, differential control and closed-loop optimization of hot pressing defects are achieved, and the hot pressing quality and consistency are improved.

The invention discloses a roll-to-roll cleaning control method and system for a flexible circuit board electronic structural member, and relates to the technical field of electronic manufacturing, and the method comprises the steps: carrying out the partitioning processing of a to-be-cleaned member, and obtaining a thin region and a thick region; the drying cavity is partitioned on the basis of the thin area and the thick area, and a partitioned temperature control method is constructed; a dehumidification drying module is placed, and a hot air drying method is obtained based on a chilled mirror dew-point instrument; the roll-to-roll cleaning control method is used for solving the problems that in an existing roll-to-roll cleaning control method for the flexible circuit board electronic structural part, differential temperature control is not carried out on a thick area and a thin area, and the influence of environment humidity in a drying cavity on the drying effect is not considered; the problems that a thin plate is overheated after being dried, water in a thick plate is not completely evaporated, watermarks which cannot be wiped appear on the surface of the electronic structural part, and then the practicability of the cleaned electronic structural part is affected are solved.

The invention discloses a panel lamp light source integration system based on a flexible circuit board, and relates to the technical field of panel lamp light source integration. Generating an initial design drawing of the flexible circuit board containing a plurality of layers of conductive circuits and a plurality of light source bonding pads; the channel configuration module configures a driving control channel for the bonding pad and establishes a mapping table with the lighting function area; the thermal load optimization module calculates power consumption and thermal load distribution according to the mapping table and the performance parameters and adjusts routing topology to generate a final design drawing; and the manufacturing and assembling module is used for manufacturing a circuit board according to the drawing and mounting a micro light source to finish assembling. Wiring is matched with the shape of a panel and the characteristics of a light source during planning, heat distribution optimization is achieved in the layout stage, the number of times of modification is reduced, and local overheating is restrained. According to the invention, high-fit compact integration of the flexible circuit board and the panel lamp is realized, and the assembly efficiency and the operation stability are improved.

The invention relates to the technical field of flexible circuit board manufacturing and packaging, in particular to an FPC assembly injection molding packaging structure and method based on dynamic mold flow control, and the structure comprises an FPC assembly, a first injection molding layer wrapping a welding spot area of the FPC assembly, and a second injection molding layer wrapping the first injection molding layer and the FPC assembly. The second injection molding layer is provided with an anchoring column penetrating through the reserved channel of the first injection molding layer or the through hole of the FPC assembly, and the anchoring column and the FPC assembly or the first injection molding layer form a mechanical interlocking structure. According to the FPC assembly injection molding packaging structure and method based on dynamic mold flow control, the electronic equipment and the storage medium, through a sandwich structure and in-situ mechanical interlocking design, the process control of a non-Newtonian fluid shear model and an unsteady state heat conduction equation is combined; the technical problems that in the prior art, procedures are tedious, stress concentration is caused by CTE mismatching, and welding spots are prone to being damaged in the injection molding process are solved.

The invention discloses a flexible circuit board warping degree non-contact detection method and system, and the method comprises the steps: carrying out the multi-angle scanning of a target flexible circuit board, and obtaining three-dimensional point cloud data; separating a component area and a circuit board substrate area based on a deep learning algorithm, and constructing a circuit board substrate three-dimensional model; a reference reflecting plate is arranged at the bottom of the three-dimensional model, relative spatial position parameters of a reference plane and the detection device are obtained in real time, and a circuit board three-dimensional substrate model is constructed; constructing a self-adaptive coordinate system, and mapping the three-dimensional substrate model of the circuit board into a reference plane coordinate system; curvature parameters of all nodes of the three-dimensional model are calculated through differential geometric analysis, and a curved surface gradient tensor field is constructed; and obtaining a maximum warping amount, a regional warping gradient value and an overall warping degree distribution parameter. The method has the advantages that the warping degree of the circuit board is accurately evaluated through three-dimensional scanning, a deep learning algorithm and differential geometric analysis, and the method has the advantages of high precision, full automation and quick response.

The embodiment of the invention provides a flexible circuit board and electronic equipment, relates to the technical field of signal transmission, and is used for relieving the problem of relatively high signal loss of an FPC (Flexible Printed Circuit) caused by electromagnetic shielding. The flexible circuit board may have a first region and a second region. A reference layer of the flexible circuit board is located in the first area, and the reference layer and the signal layer are stacked. The first shielding layer is located in the first area, and the first shielding layer is stacked on the side, away from the reference layer, of the signal layer. The second shielding layer is located in the second area, and the second shielding layer and the signal layer are stacked. The first grounding wire is electrically connected with the first shielding layer and the reference layer. The first grounding wire is also electrically connected with the second shielding layer. A backflow signal of a signal transmitted by the signal line in the signal layer can flow through the first grounding line from the second shielding layer in the second area, and respectively flows into the first shielding layer and the reference layer in the first area.

The invention relates to the field of application of electrochromic glass, in particular to an environment response type self-powered electrochromic glass intelligent collaborative transparent enclosure structure which comprises an enclosure structure body, and the enclosure structure body is of a sandwich type structure with a hollow interlayer. A self-powered module, an electrochromic glass unit, an environment sensing module and an intelligent regulation and control module are arranged on the enclosure structure main body; in addition, the invention further discloses a dynamic regulation and control method which comprises the steps of collecting data in real time, calculating an energy state and a dynamic regulation and control strategy and the like. The high-efficiency laminated photovoltaic glass and the energy storage unit are integrated, a dynamic regulation and control algorithm is combined, environment response type self power supply is achieved, the light transmittance is adjusted in real time to meet the illumination requirement, the operation cost and the energy consumption are remarkably reduced, modular design is combined with the flexible circuit interconnection technology, and the flexible circuit interconnection technology is optimized. The whole system gets rid of the limitation of complex wiring when being applied to building external windows, curtain walls or daylighting roofs, the installation process is greatly simplified, and the convenience of later maintenance is improved.

The invention discloses an intelligent detection method and system for a flexible circuit board based on machine vision, and relates to the field of circuit board detection.The method comprises the steps that firstly, through a global coarse registration step, rigid transformation such as translation, rotation and zooming of the whole to-be-detected FPC image is rapidly corrected, and preliminary alignment with a standard template is achieved; then, local fine registration is introduced for nonlinear deformation such as local stretching and wrinkles caused by the characteristics of the FPC material, so that the fine and non-uniform local dislocation is accurately sensed and compensated, and nearly pixel-level accurate matching between the to-be-detected image and the template is realized. On the basis of high-precision alignment, differential attention deficit segmentation is carried out, so that false differences caused by inaccurate deformation registration can be effectively eliminated, real defects can be accurately identified, the false alarm rate is remarkably reduced, and the reliability and practicability of a detection scheme are greatly improved.

The invention relates to the technical field of flexible electronic integrated systems, in particular to a multilayer flexible circuit, a preparation method thereof and a flexible electronic system. The multi-layer flexible circuit comprises a flexible substrate layer and a flexible conductive layer which are arranged in a stacked mode, and the flexible conductive layer comprises metal nanowire aerogel and a filled flexible base material. The flexible base material and the flexible substrate layer in the flexible conductive layer have tensile properties. The metal nanowire aerogel is in lap joint in the flexible conductive layer to form a rich conductive network, so that the flexible conductive layer has good conductivity. The special form of the metal nanowire aerogel enables the flexible conductive layer to have good electrical stability, namely resistance-strain insensitivity and resistance stability after long-term deformation, and when the flexible conductive layer deforms, the resistance does not change obviously. Due to the stacked structure design, the mechanical stretchable upper limit of the multi-layer flexible circuit is remarkably improved, the resistance change rate under the same deformation is remarkably reduced, and the resistance change is low after long-term use.

The invention belongs to the technical field of circuit board processing, and particularly relates to flexible circuit board drilling equipment and a drilling method thereof.The flexible circuit board drilling equipment comprises a box body, a filtering piece arranged on the box body and an electric sliding rail, and further comprises two workbenches which are slidably connected to the electric sliding rail and used for being alternately located at a feeding and discharging station and a drilling station; the negative pressure mechanism is arranged on the back surface of the box body and is used for applying negative pressure to the workbench at the drilling station for dust extraction during drilling; the auxiliary mechanism comprises a cleaning part arranged above the box body, a linkage part arranged at the rear end of the box body and an impurity removing part arranged below the filtering part; the guide grooves are formed in the inner walls of the front side and the rear side of the box body; and the trapezoidal block is fixedly connected in the box body. According to the device, integrated operation of efficient drilling, automatic dust removal and cleaning and safety protection can be achieved.

The utility model provides a management function board applied to a mobile phone battery, which belongs to the technical field of mobile phone battery function boards and comprises a battery management module, a battery management module and a battery management module. An FPC flexible circuit layer and a PCB hard circuit layer; the through hole windows are formed in the upper end of the FPC flexible circuit layer, line conduction is achieved through alignment of the multiple layers of through hole windows, the overall mechanical stability of the provided mobile phone battery management function board is remarkably enhanced by adopting the integrated forming and pressing design of the FPC flexible circuit layer and the PCB rigid circuit layer, the FPC and the PCB are tightly combined through the pressing technology, and the reliability of the mobile phone battery management function board is improved. Compared with the prior art, the power management system has the advantages that the interlayer separation risk caused by long-term use or external impact is reduced, the durability and reliability of the whole power management system are improved, in addition, the high reliability of electrical connection is ensured through the accurate via hole windowing design and the SMT high-temperature processing technology, signal transmission is more stable, and power transmission is more efficient.

The utility model relates to the technical field of LED lamp strips, in particular to a sterilization and illumination switchable LED lamp strip, which comprises a flexible circuit board, a plurality of LED lamp strips, a plurality of LED lamp strips and a plurality of LED lamp strips, the LED white light lamp beads are attached to the bonding pads of the flexible circuit board and used for converting electric energy into visible light, and the lighting function is achieved; the UVC and UVA two-in-one lamp bead is mounted on a bonding pad of the flexible circuit board and is used for converting electric energy into ultraviolet light, so that a sterilization function is realized; the LED lamp strip capable of being switched between the sterilization function and the illumination function is novel in structure, the illumination function and the sterilization function are integrated on one lamp strip, and the illumination function and the sterilization function can be switched freely through the same lamp strip.

The utility model provides an electrocardiogram electrode patch. The electrocardiogram electrode patch comprises a transmission part, a first attaching part and a connecting wire, the transmission part is used for being detachably connected with electrocardiogram detection equipment, and the first attaching part is used for being attached to a to-be-detected first target position; the transmission part is connected with the first attaching part through the connecting line; the transmission part comprises a shielding grounding contact and a first transmission contact; the first attaching part comprises a first flexible circuit board, and the first flexible circuit board comprises a first shielding layer and a detection contact layer; the connecting line comprises a signal transmission core and a second shielding layer wrapping the signal transmission core. The first shielding layer is connected with the shielding grounding contact through the second shielding layer, and the detection contact layer is connected with the first transmission contact through the signal transmission core. By means of the configuration, signals and interference signals can be transmitted independently, and the stability of electrocardiosignal transmission can be effectively improved.

The invention belongs to the technical field of motors, and particularly relates to a motor which comprises a coil in a connecting layer, the coil is provided with at least two turns of conductors connected in series, each turn of conductor is provided with a first main body section and a connecting section connected in series, the first main body sections are parallel to the axial direction of the motor, and the connecting layer is provided with two adjacent first main body sections. The connecting sections, connected at the same end of the motor, of every two adjacent first main body sections are located in different connecting layers. The connecting sections, connected at the same end of the motor, of the first main body sections of the flexible circuit piece are arranged in different connecting layers, so that the mutual influence between the connecting sections connected with the adjacent first main body sections in the same layer is reduced, the width of the connecting sections can be increased, and the resistance of the connecting sections is reduced; conductor heating of the connection section of the flexible circuit member is reduced, and the service life of the motor is prolonged.

The present invention relates to the field of flexible circuit board production, and particularly relates to a production device and process for die cutting and wire laminating of a double-sided combined flexible circuit board. The production device comprises a frame, and a die cutting head on the frame, used for die cutting a flexible circuit board to be processed. A wire laminating unit used for laminating wires on the flexible circuit board is provided on the side of the frame away from the die cutting head, and the die cutting head and the wire laminating unit work in conjunction with each other to achieve the effects of die cutting the front side of the flexible circuit board and laminating the wires on the back surface of the flexible circuit board. By implementing die cutting and wire laminating of a flexible circuit board on a single machine, the present invention effectively avoids the problems that materials need to be moved multiple times during use, and after the materials are moved multiple times, the relative position between the materials and the machine and the relative position of the materials need to be adjusted multiple times to ensure alignment, which affects the accuracy and consistency of a final circuit board.

The invention relates to the technical field of MEMS radiator processing, in particular to a processing method of an MEMS radiator, which comprises the following steps of: 1, manufacturing an air inlet grid opening, a gas advection bin body, a vibration upper opening binding ring, a piezoelectric vibrator, a flexible circuit board, a vibrator amplification layer, a gas beam dense hole layer and an impact platform according to the size; 2, the flexible circuit board and the piezoelectric vibrator form a circuit piezoelectric vibrator through reflow soldering; 3, the air inlet advection bin body, the vibration upper opening binding ring, the circuit piezoelectric vibrator, the vibrator amplification layer, the air beam dense hole layer and the impact platform are assembled from top to bottom. According to the machining method of the MEMS radiator, firstly, solder paste is printed on a flexible circuit board steel mesh to lead welding spots, the flexible circuit board steel mesh and the piezoelectric vibrator are placed into a clamp together to be fixed, and then the flexible circuit board steel mesh is welded to the piezoelectric vibrator; the circuit piezoelectric vibrator prepared by the method is reliable and durable, and welding spots are not easy to fall off, so that the piezoelectric vibrator can have better stability in high-frequency vibration.

The utility model relates to the technical field of battery packs, and discloses a battery pack and electric equipment with the battery pack, the battery pack has a first direction, a second direction and a third direction, and the battery pack comprises a box body with an accommodating cavity; the box cover is connected to the box body and covers and seals the accommodating cavity; the multiple battery packs are located in the containing cavity and arranged at intervals in the first direction, each battery pack comprises multiple single batteries, and each single battery comprises a cover plate; the isolation plate extends in the first direction, the isolation plate comprises base body parts and connecting parts, the multiple base body parts are arranged at intervals in the first direction, the connecting parts are connected with the two adjacent base body parts in the first direction, hollow holes are formed in the connecting parts, and the cover plate is exposed out of the hollow holes; and the multiple pressing strips are arranged at intervals in the first direction, extend in the second direction and are connected with the cover plate. According to the battery pack disclosed by the utility model, the flexible circuit board is pressed through the isolation plate.

A flexible circuit board and a foldable electronic device includes a first multi-layer region, a second multi-layer region and a highly bendable region disposed between the first multi-layer region and the second multi-layer region. The first multi-layer region and the second multi-layer region include a structure in which a plurality of copper clad laminates (CCLs) are stacked. The highly bendable region includes a structure in which a single CCL extending from one CCL among the plurality of CCLs in the first multi-layer region and the second multi-layer region is stacked. The single CCL may be configured such that a first ground wire, a second ground wire, and a plurality of sub wires disposed to be spaced apart between the first ground wire and the second ground wire transmit a single RF signal.

A flexible circuit base board and a flexible flat cable are provided. The flexible flat cable includes the flexible circuit base board and a transmission element. The flexible circuit base board includes a base film, multiple conductive wires, a transmission signal pad, a conductive structure, a collecting signal pad and a cover film. The conductive wires are spaced and placed on the base film. The transmission signal pad and the collecting signal pad are electrically connected to and are disposed on the base film. The conductive structure is disposed on the base film, and is electrically connected to at least one of the conductive wires and the transmission signal pad. The cover film is disposed on the base film, and covers the conductive wires, the conductive structure, the transmission signal pad, and the collecting signal pad. The transmission element is electrically connected to the collecting signal pad.

The embodiment of the utility model provides folding display equipment, relates to the technical field of electronic products, and is used for weakening the problem of abnormal sound generated in the opening and closing process of the folding display equipment. The folding display equipment comprises a first door plate, a second door plate, a third door plate, a hinge structure and a flexible circuit board, the first door plate and the third door plate are positioned on two opposite sides of the second door plate; the hinge structure is located on one side of the second door plate. The first door plate and the third door plate are rotationally connected with the hinge structure; the flexible circuit board comprises a fixed part and a bendable part; the folding display device further comprises a limiting structure which is located between the flexible circuit board and the second door plate and covers at least part of the bendable part. By utilizing the limiting structure, the mechanical property of the flexible circuit board can be improved, the sudden change of the form of the flexible circuit board can be limited, the problem of the sudden change of the form in the opening and closing process of the folding display equipment can be effectively solved, and the problem of abnormal sound generated in the opening and closing process of the folding display equipment can be further solved.

The invention relates to a display screen assembling device and a display screen assembling system. The device comprises a bending module and a first feeding module, the bending module is provided with a moving assembly capable of moving in the X direction and an adsorption panel capable of moving in the Z direction, and the bending module is used for adsorbing and moving a display assembly; the first feeding module is provided with a first moving platform and a first bearing table and used for bearing a backlight assembly. Through cooperative driving of the moving assembly and the adsorption panel, the flexible circuit board of the display assembly can accurately penetrate through the backlight assembly to complete hole passing. According to the device, automatic alignment and accurate assembly of the display assembly and the backlight assembly are achieved through integrated module design, the technical problem that the flexible circuit board is prone to deflection, clamping stagnation and damage in the perforating process is effectively solved, and the assembly precision, the production efficiency and the product yield are remarkably improved.

The invention relates to the technical field of server testing equipment, and discloses a controllable device applied to server backboard testing and a control method thereof.The controllable device comprises a master device and at least one slave device, the master device is connected with the slave device through an FPC flexible circuit board, the master device is used for receiving a testing instruction, and the slave device is used for receiving the testing instruction; and a control instruction is sent to the slave device according to the test instruction, and the slave device is used for executing the control instruction to realize connection and disconnection of the data link. The slave device is embedded into the data link based on the SAS protocol, link on-off is achieved through electronic control, traditional manual insertion and extraction operation is replaced, manual intervention is reduced, and full-process automatic testing is achieved. The device not only improves the test efficiency, but also avoids mechanical wear of interfaces such as SFF-8643, Slimline x4 and the like caused by physical plugging and unplugging, and avoids the risk of damage caused by low positioning precision of traditional equipment at the same time.

The utility model discloses a shading structure of a power key fingerprint light-emitting module, belongs to the technical field of power keys, and aims to solve the problems that the local light leakage phenomenon of a product is caused due to the fact that a locating notch is formed in the structural design, and the sheet-shaped light leakage phenomenon of the product is caused due to the fact that a shading glue position shrinks after injection molding. Comprising a light guide lens, an LED lamp, a first key, a second key, a fingerprint module, a flexible circuit board, a bottom plate, an elastomer material layer and an insulating material layer, the LED lamp is arranged on one side in the light guide lens, a containing through groove is formed in the light guide lens, the bottom plate is arranged on the bottom face of the containing through groove of the light guide lens, and the flexible circuit board is arranged above the bottom plate; according to the utility model, through the arrangement of the light guide lens and the first key, a positioning notch in the original light guide lens is removed, the structural position of light leakage is effectively reduced, the original positioning effect is independently changed into the first key, and the first key is designed into a connected whole, so that the first key has a positioning effect.

The invention relates to a flexible circuit board and a manufacturing method thereof, the manufacturing method of the flexible circuit board comprises a typesetting step, an electroplating step, a through hole step and an insulation step, the typesetting step is to provide a base material and form a bottom layer circuit on the base material; in the electroplating step, the bottom layer circuit is electroplated so as to thicken or widen the bottom layer circuit into a conductive circuit; in the through hole step, a through hole is formed in a port of the conductive circuit or at a position adjacent to the port, the through hole penetrates through the base material and the conductive circuit, and a section is formed on the conductive circuit at the through hole; in the insulation step, an insulation structure is provided, the insulation structure is arranged on the base material to cover the conductive circuit, and part of the insulation structure is located in the through hole and covers the fracture surface; therefore, the use of an etching process can be avoided to reduce environmental pollution, metal consumption and power consumption, and the conductive circuit can be effectively prevented from being exposed to influence reliability.

An electronic device includes a hinge, a first housing and a second housing rotatably connected to each other by the hinge, a flexible display disposed in the first housing and the second housing, a first circuit board disposed in the first housing, a flexible circuit board which is electrically connected to the first circuit board and extends from the first housing and across the hinge, and a slide structure which is connected to the flexible circuit board and is slidably connected with the first housing, wherein the slide structure slides together with a portion of the flexible circuit board in the first housing while the electronic device is being folded or unfolded via the hinge.

The invention discloses a display device. The display device comprises a display panel, a backlight module printed circuit board and a flexible circuit board, the backlight module comprises a back plate and a supporting piece. The back plate comprises a bottom plate and a side plate, the side plate is arranged on the bottom plate and extends along the peripheral side of the bottom plate, the side edge, away from the bottom plate, of the side plate is bent inwards to form a mounting convex plate for placing the display panel, and a first preset hole is formed in the surface, away from the bottom plate, of the mounting convex plate; the supporting piece is provided with two end parts, one end part is provided with a first connecting convex part, the first connecting convex part is fixed in the first preset hole and fills the first preset hole, and the supporting piece extends towards the outer side of the back plate and is used for detachably mounting the printed circuit board; one end of the flexible circuit board is fixed on the mounting convex plate and is bound with the display panel, and the other end of the flexible circuit board is connected with the printed circuit board.

An integrated pressure and temperature hydrogel array sensor, which comprises: a plurality of sensing array units arranged in an array. Each sensing array unit comprises interdigitated electrodes (101) and a hydrogel layer (102) covering the surface of the interdigitated electrodes (101), wherein the hydrogel layer (102) is fixed to the interdigitated electrodes (101) by means of photocuring, and the hydrogel layer (102) is in intimate contact with the surface of the interdigitated electrodes (101); the interdigitated electrodes (101) are two coplanar nested interdigitated electrodes prepared on a flexible circuit board; the hydrogel layer (102) is a hydrogel layer having variations in crosslink density and height; and the hydrogel layer (102) comprises a high-crosslink-density hydrogel region (102a) and a low-crosslink-density hydrogel region (102b). A flexible sensing structure based on photocurable hydrogel that features an arrayed electrode design can simultaneously monitor variations in a pressure signal and a temperature signal by means of an array module acquisition system. Further disclosed is a preparation method for an integrated pressure and temperature hydrogel array sensor.

The utility model relates to the technical field of electric vehicles, in particular to a battery module controller and a battery pack. The battery module controller comprises a flexible circuit board and a battery cell monitoring controller; the battery cell monitoring controller comprises a printed circuit board and an analog front-end chip integrated on the printed circuit board; the flexible circuit board is connected with the printed circuit board, and the flexible circuit board is used for collecting temperature information and voltage information of the battery module and transmitting the collected temperature information and voltage information to the analog front-end chip for processing through the printed circuit board. According to the battery module controller and the battery pack, the problems that in a CMC system layout in an existing scheme, the whole CMC occupies a large space, the surface utilization rate of a PCB is not high, production waste is too much, and the weight of the PCB is large are solved.

The invention discloses a MicroLED chip packaging unit, a head-mounted display device and a preparation method of the MicroLED chip packaging unit. The MicroLED chip packaging unit comprises a substrate and a MicroLED chip, and the substrate is provided with a plurality of first bonding pads which are insulated from one another; the MicroLED chip is arranged on the first surface and is electrically connected with the first bonding pad. According to the packaging structure of the MicroLED chip, the packaging structure can be connected with an external circuit board through the first bonding pad on the substrate, so that control over the MicroLED chip is achieved, the size of the packaging unit of the MicroLED chip can be made to be smaller, universality is better, the defect that an existing packaging structure for packaging the MicroLED chip on the flexible circuit board is insufficient in application scene is overcome, and the inventory risk is reduced. Moreover, the MicroLED chip packaging unit can be welded and connected with an external circuit board through a reflow soldering mode, and the connection is very convenient.

The utility model discloses an adsorption platform and a character printer, and relates to the technical field of printers, the adsorption platform comprises a fixed station, a driving transmission module and a flattening mechanism, the fixed station is provided with a plurality of adsorption holes for adsorbing and fixing a flexible circuit board; the driving transmission module is arranged below the fixing table, the driving transmission module comprises a first driving assembly, a driving wheel, a driven wheel and a synchronous belt, the synchronous belt is arranged on the driving wheel and the driven wheel in a sleeving mode, the first driving assembly is connected with the driving wheel, and the flattening mechanism is provided with a pressing piece connected with the synchronous belt and located above the fixing table in a pressing mode; when the first driving assembly works, the first driving assembly drives the driving wheel to rotate so as to drive the synchronous belt to move, and then the flattening mechanism is driven to move in the length direction of the fixing table, and the pressing piece moves and flattens the flexible circuit board. According to the adsorption platform, the flexible circuit board is adsorbed and flattened, the printing module can be directly adopted to print the flexible circuit board subsequently, and the printing efficiency is indirectly improved.