4238 results about "Flexible circuits" patented technology

A radio frequency chip package is formed by assembling a connecting element such as a circuit board or flexible circuit tape having chips thereon with a bottom plane element such as a lead frame incorporating a large thermally-conductive plate and leads projecting upwardly from the plane of the plate. The assembly step places the rear surfaces of the chips on the bottom side of the connecting element into proximity with the thermal conductor and joins the conductive traces on the connecting element with the leads. The resulting assembly is encapsulated, leaving terminals at the bottom ends of the leads exposed. The encapsulated assembly may be surface-mounted to a circuit board. The leads provide robust electrical connections between the connecting element and the circuit board.

An antenna for an electromagnetic tool having a longitudinal axis and a core. The antenna includes a flexible dielectric substrate flexibly conformed about the core and an electrical conductor disposed on the dielectric substrate. The electrical conductor is disposed on the substrate such that the antenna has a dipole moment having any desired direction relative to the longitudinal axis of the tool.

An ablation catheter having distal and proximal ends for performing ablation on a human tissue region comprises at least one electrode. These elements are formed on a conductive sheet situated at the distal end of the catheter. A flex circuit assembly couples the at least one electrode to a measurement and power circuit attached to the proximal end of the catheter. The measurement and power circuit supplies power to the at least one electrode via the flex circuit.

A handheld device with a compact integrated touch panel is disclosed. A handheld device incorporating a touch panel display requiring electrical connections is reduced in size by incorporating electrical pathways within the support structure of the touch panel display, obviating the need for a flex circuit extension from the touch panel display for connection to the handheld device. A further reduction in size is obtained by providing an inherent visually homogeneous perimeter for the touch panel display by matching the colors of the conductive and dielectric materials, thereby eliminating the need for a bezel.

Devices, systems and methods are provided for stimulation of tissues and structures within a body of a patient. In particular, implantable leads are provided which are comprised of a flexible circuit. Typically, the flexible circuit includes an array of conductors bonded to a thin dielectric film. Example dielectric films include polyimide, polyvinylidene fluoride (PVDF) or other biocompatible materials to name a few. Such leads are particularly suitable for stimulation of the spinal anatomy, more particularly suitable for stimulation of specific nerve anatomies, such as the dorsal root (optionally including the dorsal root ganglion).

System, devices and methods are presented that integrate stretchable or flexible circuitry, including arrays of active devices for enhanced sensing, diagnostic, and therapeutic capabilities. The invention enables conformal sensing contact with tissues of interest, such as the inner wall of a lumen, a the brain, or the surface of the heart. Such direct, conformal contact increases accuracy of measurement and delivery of therapy. Further, the invention enables the incorporation of both sensing and therapeutic devices on the same substrate allowing for faster treatment of diseased tissue and fewer devices to perform the same procedure.

A light source arrangement for a battery-powered light source unit of an endoscope comprises a cylindrical housing, a base disposed at one end of the housing, a plurality of LEDs connected to a flexible circuit board supported on the base and a focusing lens. A light guide for directing light emanating from the LEDs. The light guide comprises a reflective surface formed on an inner wall of the housing, a reflector having a concave reflective surface which is disposed at one end of the housing so as to surround the LEDs or a micro-lens array disposed in front of the LEDs with each micro lens aligned with the LED.

The invention is directed to a method of bonding a hermetically sealed electronics package to an electrode or a flexible circuit and the resulting electronics package, that is suitable for implantation in living tissue, such as for a retinal or cortical electrode array to enable restoration of sight to certain non-sighted individuals. The hermetically sealed electronics package is directly bonded to the flex circuit or electrode by electroplating a biocompatible material, such as platinum or gold, effectively forming a plated rivet-shaped connection, which bonds the flex circuit to the electronics package. The resulting electronic device is biocompatible and is suitable for long-term implantation in living tissue.

A flexible lighting device includes an elongated flexible tube with a translucent tube shell and opposed tube ends and a flexible circuit board set in the tube so that it extends between the tube ends. The flexible circuit board has opposed interior and exterior surfaces. Electrical circuitry is mounted to the circuit board and connected to an external input source and an output source of electrical power. The circuit board defines a number of cut-outs, preferably those of a generally diamond shape. The device is described in two embodiments: one with inwardly directed LEDs on the circuit board directed into the tube and one with outwardly directed LEDs on the circuit board directed out of the tube. The method of making the flexible lighting device is also described.

A touch sensor device is provided that uses a flexible circuit substrate to provide an improved input device. Specifically, the present invention uses a touch sensor controller affixed to the flexible circuit substrate, which is coupled to a sensor component to provide a flexible, reliable and cost effective touch sensor suitable for a wide variety of applications. In one embodiment the touch sensor uses a flexible circuit substrate that provides relatively high temperature resistance. This allows the touch sensor controller to be affixed using reliable techniques, such as various types of soldering. The sensor component can comprise a relatively low-temperature-resistant substrate that can provide a cost effective solution. Taken together, this embodiment of the touch sensor provides reliability and flexibility at relatively low cost.

A probe for use in medical procedures includes a longitudinal member, a flexible sheath, and a flexible circuit. The longitudinal member includes at least one electrode and at least one thermocouple disposed thereon. The flexible sheath is coupled to and at least partially surrounding the longitudinal member. The flexible circuit is coupled to the sheath and also to the at least one electrode and the at least one thermocouple. The flexible circuit is configured to provide power to the at least one electrode and a return path to the at least one thermocouple.

In some embodiments, a lighting element comprising at least first and second solid state light emitters, a first heat sink structure with a fold region between first and second heat sink regions, and at least one light emitter on each of the heat sink regions, and methods of making. In some embodiments, a lighting element, comprising plural heat sink regions on respective regions of a flexible circuit board, and plural light emitters on respective regions of the flexible circuit board, and methods of making. In some embodiments, heat sink structures comprising plural heat sink regions and a circuit board with plural regions, and lighting elements comprising them. In some embodiments, a heat sink structure, comprising plural heat sink regions and an internal flow guide structure, and lighting elements comprising same. Also, other lighting elements, lamps and heat sink structures.

Systems and methods described herein may comprise RFID data acquisition technology which may be embedded in a fob or tag for use in completing financial transactions. This fob may a self-contained device which includes a transponder and which may be contained on any portable form factor and may comprise flexible circuitry. For instance, the fob may be housed in a wearable transaction instrument, such as a bracelet, ring, wrist band, retractable id, necklace, jewelry charm, lanyard, key ring fob, watch, band, pin, and/or the like. The fob is configured to be used in concert with an RFID reader device.

Sensors and transponders combined on a single semiconductor substrate package. The invention includes an RFID tag and a sensor commonly assembled onto a common substrate. The substrates can be provided in the form of a flex circuit or printed circuit board. The flex circuit would be fabricated using standard flex circuit fabrication methods. It is a polymer/metal laminate film structure and incorporates the antenna pattern for the sensor and RFID tag system on the circuit. The flex circuit can also combine antennas for the sensor and the RFID tag onto a single flex circuit substrate, thus eliminating the need for separate antennas.

A flexible circuit assembly for accommodating a plurality of power electronic devices, including an insulating cover layer having first openings for power electronic devices, a flexible conductive layer arranged under the insulating cover layer and attached with a first adhesive to the insulating cover layer, an intermediate insulating layer arranged under the flexible conductive layer and attached with a second adhesive to the flexible conductive layer, the intermediate insulating layer having second openings, a plurality of heat-conductive elements arranged inside the second openings, a first thin heat sink layer, the heat-conductive elements arranged to be in contact with an upper surface of the thin heat sink layer and the lower surface of the islands via heat-conductive material; and a second thin heat sink layer, upper surfaces of the power electronic devices arranged to be in contact with a lower surface of the thin heat sink layer and the lower surface of the islands via heat-conductive material.

Conductive elastomeric circuits are used in various simulated physiological structures such as tissues and organs, enabling feedback to be provided indicating whether a simulated task is being performed correctly. For example, a surgical trainer has a simulated human tissue structure made of an elastomeric composition, at least one reinforcing layer of a fibrous material, and at least one flexible electrical circuit. The surgical trainer preferably includes multiple areas for practicing surgical skills, each with evaluation circuits for providing feedback regarding that skill. Conductive elastomers are also incorporated into other types of medical training simulators, to similarly provide feedback. In another embodiment, a simulated organ has a conductive elastomeric circuit in the periphery of the simulated organ, enabling feedback to be provided to evaluate whether a person is properly manipulating the organ in response to a manual applied pressure.

A disposable surgical device is constructed to include a shell, a smart block mounted in one end of the shell, the smart block electronic having components mounted to a circuit embedded therein, front contact pins for insertion into respective contact holes in the connector of an industry standard connector interface, and rear wire terminal points, a medical treatment terminal installed in the other side of the shell and adapted for performing surgery and treatments, and a flex circuit termination electrically connected between the smart block and the medical treatment terminal, the flex circuit termination having embedded conductor lines respectively connected to the medical treatment terminal and wire terminal points at the ends of the conductor lines respectively soldered to the wire terminal points of the smart block.

A modular electronic architecture is provided. In particular, one or more unit sub-arrays providing at least a portion of the antenna radiator elements and supporting circuitry comprising at least part of a phased array antenna are provided. Each unit sub-array includes a first area comprising a rigid circuit board on which one or more antenna radiator elements are formed. In addition, a second area of rigid circuit board material for supporting circuitry is provided. The first and second areas are interconnected to one another by a region of flexible circuit board material having connective traces. Methods for forming unit sub-arrays providing antenna radiator elements and supporting circuitry are also provided. More particularly, a completed unit sub-array may be formed while the associated circuit boards are in a flat or planar condition. Following any desired verification of the operating status of the circuit board, supporting structure can be machined away, allowing the unit sub-array to be folded for inclusion in a phased array antenna assembly.

An electrical interconnect apparatus has a mounting member with a plurality of sides. The mounting member is formed from an insulator as a cuboid. Moreover, the mounting member also may be formed from a flexible circuit. Among other things, the plurality of sides includes an interface side. At least two of the plurality of sides are in electrical communication with the interface side.

A disk drive comprising an actuator including a head, a disk, and a processor connected to the actuator by a flex circuit cable. The processor under the control of a program to: apply a control signal for a seek operation and to apply a bias signal to the control signal to approximate the bias imparted by the flex circuit cable. The bias is determined from a data structure that stores: bias values for track zones representative of a first and second bias curves that approximate a bias imparted by the flex circuit cable upon the actuator as the actuator moves the head from the OD to the ID of the disk and from the ID to the OD of the disk, respectively. The bias values representative of the first and second bias curves are determined based upon a non-linear apportionment of track zones.

A flexible circuit board for being inserted into an in-vivo imaging device is provided. The flexible circuit board may include a plurality of flexible installation units connected to one another through flexible connection units. The flexible installation units may be capable of having electrical components disposed thereon at a size suitable for being included in an in-vivo imaging device which may be inserted into a body lumen, e.g., a capsule endoscope. A method of assembling an in-vivo imaging device which may enclose such a full-flexible circuit board is also provided.

A flexible circuit electronic package including a heat sink, a flexible circuit having a semiconductor chip positioned thereon and electrically coupled thereto, and a quantity of heat shrunk adhesive securing the flexible circuit to the heat sink such that the flexible circuit is planar. This package is then adapted for being positioned on and electrically coupled to a circuitized substrate such as a printed circuit board. A method of making this package is also provided.

An in vivo imaging device having a flexible circuit board, for example, a one-sheet flexible circuit board. The flexible circuit board may enable folding components attached to the flexible circuit board according to a predefined angle.

A multichip module comprises: a first rigid member defining one outer wall of a chamber; a second rigid member defining the opposite wall of the chamber; a sealable interface joining the first and second rigid members at their peripheries, whereby a hollow chamber is formed; a flex circuit having a plurality of integrated circuit chips disposed thereon, the flex circuit affixed to at least one of the first and second rigid members; electrical contacts at least partially extending outward through the sealable interface; and, a fluid inlet and a fluid outlet configured to permit fluid to flow through the chamber whereby heat generated by the integrated circuit chips may be removed from the module.

Disclosed is disk drive comprising an actuator including a head, a disk having a plurality of tracks, and a processor to control the movement of the actuator and the head relative to the disk. The processor is coupled to the actuator by a flex circuit cable. The processor commands the application of a pre-calibrated bias signal to the actuator during an idle mode to compensate for a bias force imparted by the flex circuit cable upon the actuator such that the head is maintained proximate a pre-determined track of the disk within a pre-determined idle zone of tracks and further determines if a back electromagnetic force (BEMF) reading associated with the actuator is greater than the threshold value, and if so, commands an exit out of the idle mode.

A portable, low power, low cost, endoscope having a removable probe with a miniature digital CCD imager, single white LED illuminator and an imaging lens on the distal end and a miniature multi pin connector on the proximal end; both ends connected with a multi trace flexible circuit hidden inside of the protecting flexible sleeve; and a full color LCD monitor and associated image signal processing electronics and powered by the small battery cells.

A battery pack containing a plurality of battery modules, these modules comprising a plurality of individual battery units, these battery units comprising a plurality of bicells with opposing terminals. The battery modules are connected in series by use of a flexible circuit and by opposing positive and negative terminals of each battery unit. The terminals of each battery unit contain a region of apertures which allow the adhesive of the packaging material to seal more effectively, thereby eliminating or reducing the amount of leakage from an individual battery unit.

The present invention provides a method and apparatus for fabricating densely stacked ball-grid-array packages into a three-dimensional multi-package array. Integrated circuit packages are stacked on one another to form a module. Lead carriers provide an external point of electrical connection to buried package leads. Lead carriers are formed with apertures that partially surround each lead and electrically and thermally couple conductive elements or traces in the lead carrier to each package lead. Optionally thin layers of thermally conductive adhesive located between the lead carrier and adjacent packages facilitates the transfer of heat between packages and to the lead carrier. Lead carriers may be formed of custom flexible circuits having multiple layers of conductive material separated by a substrate to provide accurate impedance control and providing high density signal trace routing and ball-grid array connection to a printed wiring board.

A two-dimensional ultrasound phased array transducer includes an acoustic backing, a first circuit, which may be a flexible circuit disposed over the acoustic backing or a ground plane, an acoustically absorptive interface layer disposed over the flexible circuit, and a piezoelectric layer disposed over the interface layer. A matching layer may be disposed over the piezoelectric layer, and a second circuit, which may be a ground plane or a flexible circuit, may be disposed over the matching layer. The piezoelectric layer and the matching layer are diced by forming kerfs extending through these layers and at least partially into the interface layer. Extending the kerfs into the interface layer reduces cross-talk between elements, electrically isolates the elements, and facilitates manufacturing by reducing the precision required in controlling the depth of the cut. The acoustically absorptive interface layer may have acoustic properties similar to the backing material and may be formed of the same material as the backing material. Electrical interconnection between the piezoelectric elements and the first circuit is provided through the interface layer. The electrical connection may be formed by laser drilled vias in the interface layer, coated with gold or another suitable material.

An automated, flexible and programmable system to update delivery and inventory status for an aggregate of remote mailboxes, bins, shelves, sorter bins, and/or a plurality of bins to distant customers and vendors through email, pager, personal digital assistant (PDA), cellular phone mail, voice mail at call centers and/or web site mailboxes. It can function as a delivery notice to mailbox recipients or as inventory stock management to store owners and vendors at remote locations. Various sensors mounted on flexible circuit boards located on the mailboxes, bins, or shelves together with distributed microcontrollers report status through a common bus to a master controller and then to a computer system. The computer in turn dispatches reports and information to various owners and vendors via a remote network operation center accessed through a dedicated line, a wireless service or an Internet Service Provider. The frequency of report update, changing of locations of update, and the relational database can also be reprogrammed at any time from a remote central service location.