4094 results about "Soldering" patented technology

A touch sensor device is provided that uses a flexible circuit substrate to provide an improved input device. Specifically, the present invention uses a touch sensor controller affixed to the flexible circuit substrate, which is coupled to a sensor component to provide a flexible, reliable and cost effective touch sensor suitable for a wide variety of applications. In one embodiment the touch sensor uses a flexible circuit substrate that provides relatively high temperature resistance. This allows the touch sensor controller to be affixed using reliable techniques, such as various types of soldering. The sensor component can comprise a relatively low-temperature-resistant substrate that can provide a cost effective solution. Taken together, this embodiment of the touch sensor provides reliability and flexibility at relatively low cost.

An electrical connector includes an inner shielding shell, an insulating housing, a plurality of terminals and an outer shielding shell. The inner shielding shell defines an accommodating chamber therein. The insulating housing has a base body engaged with a rear of the accommodating chamber and a tongue portion extended forward from the base portion to stretch into a front of the accommodating chamber. A ring-shaped cavity is opened in a periphery of the base body for receiving a waterproof washer therein. An outer periphery of the waterproof washer abuts against insides of the inner shielding shell. The terminals are disposed in the insulating housing. The outer shielding shell surrounds the inner shielding shell. The outer shielding shell has at least one soldering arm soldered to a printed circuit board for achieving a ground function of the inner shielding shell through the outer shielding shell.

An electromagnetic interference filter terminal assembly for active implantable medical devices includes a structural pad in the form of a substrate or attached wire bond pad, for convenient attachment of wires from the circuitry inside the implantable medical device to the capacitor structure via thermal or ultrasonic bonding, soldering or the like while shielding the capacitor from forces applied to the assembly during attachment of the wires.

This paper presents the fabrication and preliminary testing of a novel piezoelectric microvalve. Fabrication has three steps, which are the actuator fabrication, valve body fabrication and assembly of the microvalve. Fabricating an actuator involves cutting piezoelectric and brass beams, gluing the brass and piezoceramic beams into a trimorph sandwich structure, and curing them under pressure at elevated temperatures. Actuators are then wired either by using conductive epoxy or soldering. Valve body parts are constructed from single crystal silicon substrates using deep reactive ion etching (DRIE). DRIE is a subtractive process, whereby a mask is created on the surface of the stock, which will shield the parts that are not to be machined. Refinements in the actuator manufacturing process are made to increase the quality and decrease the fabrication time. Using a photonic probe, tip deflections of the actuators have been tested at various temperature and voltage levels. Currently, the valves are being assembled. Once assembled, multiple microvalves will undergo cold flow testing with air followed by extensive flow extensive flow testing at elevated temperatures with humidified hydrogen.

A power semiconductor module with its thermal resistance and overall size reduced. Insulating substrates with electrode metal layers disposed thereon are joined to both the surfaces of a power semiconductor chip by using, for example, soldering. Metal layers are disposed also on the reverse surfaces of the insulating substrates and the metal layers are joined to the heat spreaders by using brazing. Heat radiating fins are provided on the heat radiating surface of at least one of the heat spreaders. The heat radiating side of each of the heat spreaders is covered by a casing to form a refrigerant chamber through which refrigerant flows to remove heat transmitted from the semiconductor chip to the heat spreader.

An LED lamp has an LED lamp board mounted in a lamp tube and two LED holder caps respectively mounted around two ends of the lamp tube. Each LED holder cap has a cap body, two pins and two parallel holding walls. One end of each pin is mounted in the circular board. One of the holding walls is conductive and connected with the pins. When the LED holder caps are respectively mounted around two ends of the lamp tube, the holding walls of each LED holder cap holds one end of the LED lamp board, and the conducting holding wall is electrically connected with a corresponding power contact of the LED lamp board so that the pins are respectively electrically connected with the power contacts. Accordingly, the problem of soldering wires with the LED lamp board and the pins of the LED holder caps can be eliminated.

A golf club head includes a head body having a recessed area defined in a central area of the head body and abutting faces formed along a periphery defining the recessed area. A soldering seam is formed on an outer periphery defining the recessed area and at least one positioning block is formed on one of the abutting faces and has a bottom face flush with a top face of the recessed area. A striking face is abutted to the abutting faces and the bottom face of the positioning block to allow the soldering seam to securely combine the head body and the striking face.

An electrical connector comprises an insulative housing, a plurality of conductive contacts, and first and a metal shell. The housing includes a main body, and a tongue board extending forwardly from a front of the main body. The shell comprises first and second conductive shields. The first shield includes a pair of two-pronged fixing portions depending from opposite sides of the first shield respectively, for engaging in a circuit board. The second shield includes two arms depending from a top thereof over outer faces of opposite sidewalls thereof. Each arm forms a bent portion at a lower end thereof, for soldering to the circuit board. Each bent portion is located higher than a bottom of the shell. The fixing portions are disposed higher than the bottom of the shell. The connector is thus attached to the circuit board at four points evenly distributed around a periphery of the connector.

An ultrasound transducer includes an array of PZT elements mounted on a non-recessed distal surface of a backing block. Between each element and the backing block is a conductive region formed as a portion of a metallic layer sputtered onto the distal surface. Traces on a longitudinally extending circuit board—preferably, a substantially rigid printed circuit board, which may be embedded within the block—connect the conductive region, and thus the PZT element, with any conventional external ultrasound imaging system. A substantially “T” or “inverted-L” shaped electrode is thereby formed for each element, with no need for soldering. At least one longitudinally extending metallic member mounted on a respective lateral surface of the backing block forms a heat sink and a common electrical ground. A thermally and electrically conductive layer, such as of foil, transfers heat from at least one matching layer mounted on the elements to the metallic member.

A plug connector has an insulative housing, a plurality of first terminals, a plurality of second terminals and a positioning bracket. The terminals are mounted in the insulative housing and each terminal has a soldering portion. The positioning bracket is mounted on the insulative housing and has a positioning protrusion having a top surface and a bottom surface respectively holding the soldering portions on two levels. The soldering portions are arranged in two levels to facilitate soldering wires to the soldering portions.

A socket assembly for multichip in-line modules comprises: at least three parallel in-line sockets, one of which is an edge-card socket adapted to matably engage electrodes on the edge of a printed circuit board, and the others of which are module sockets adapted to accept multichip in-line modules; and, internal connections between respective pins in each of the parallel sockets, whereby signals from the printed circuit board may be simultaneously carried to each of the multichip in-line modules. Alternatively, a socket assembly for multichip in-line modules comprises: a substantially rigid housing structure; at least two parallel in-line sockets adapted to accept multichip in-line modules; a set of electrodes adapted for soldering to a printed circuit board; and, internal connections between respective pins in each of the parallel sockets and the set of electrodes, whereby signals from the printed circuit board may be simultaneously carried to each of the multichip in-line modules.

An insulative shield is co-bonded to the top of a ceramic capacitor in a feedthrough terminal assembly on an active implantable medical device. The insulative shield is a thin substrate that provides protection against damage and degradation of the feedthrough capacitor and/or its conformal coating from heat, splatter or debris resulting from the electromechanical connection of components during construction of the assembly. Laser welding, thermal or ultrasonic bonding, soldering, brazing or related lead attachment techniques can create such heat, splatter or debris. In a preferred embodiment, the insulative shield is co-bonded using the capacitor's own conformal coating.

An automatic soldering machine for soldering wires, each exposing at least one core wire and electronic components with at least one soldering portion respectively is disclosed. The automatic soldering machine comprises an equipment, a delivery mechanism, a plurality of clamps, a feeding mechanism, an insulation removing mechanism, a soldering mechanism, an unloading mechanism and a programmable control system. The delivery mechanism delivers the wires. The clamps locate the wires. The feeding mechanism conveys the electronic components. The insulation removing mechanism cuts the core wires and strips insulations at tops of the core wires. The soldering mechanism solders the core wires and the soldering portions of the electronic components. The unloading mechanism separates the soldered electronic components and core wires off from the clamps. The programmable control system is connect to the aforesaid mechanisms and controls thereof with high production efficacy and stable production quality.

A process for encapsulating a component made of organic semiconductors is provided which includes steps of: a) providing a housing including a substrate with electrical connections and a cover; b) mixing a soldering glass with at least one of a binder and a solvent; c) applying the soldering glass at least to the cover, in the form of an encircling bank; d) expelling the binder or solvent; e) sintering-on of the solder; f) covering the substrate with layers which represent the semiconductor component together with electrodes; g) placing the cover onto the substrate; and h) locally heating the soldering glass by means of a light source with a predetermined peak wavelength, wherein the housing parts and soldering glass are matched to one another such that their coefficients of thermal expansion differ from one another by less than 1.0×10⁻⁶K⁻¹.

A lighting assembly includes a circuit board having light emitting diodes, a heat conductive plate, a soldering plate removably connected to the circuit board and having multiple LED holes to correspond to the LEDs on the circuit board and a fixing plate securely connected to the circuit board after the soldering plate is removed from engagement with the circuit board. A cover has multiple positioning holes to allow extension of threaded bolts through the positioning holes, the fixing holes, the circuit board and into the heat conductive plate to secure engagement among the heat conductive plate, the circuit board, the fixing plate, the transparent plate and the cover.

The present invention is to replace the original light sources with LED lamps in conventional lamp settings designed for fluorescent lamps, incandescent bulbs, and the bulb-based flash lights. It provides an LED lamp, comprising a plurality of LEDs, a circuit board for soldering said LEDs, a connecting base. The circuit board includes a plurality of solder points, each for soldering an LED, and a conductive line to electrically connect the soldered LEDs. The connecting base is electrically connected to the conductive line of said circuit board. The connecting base is also used to mount in the conventional lamp socket and make electrical connection. The connecting base is a column for encompassing the circuit board, wherein said circuit board is shaped according to the shape of the column, and the position of connecting to the column is designed according to the use in the preferred embodiments, such as fluorescent lights, incandescent bulbs, and bulb-based flash lights.

This invention provides a small diameter snare device consisting of a hollow, elongate, thin-walled polymer outer sheath. A single central core wire extends through the entire length of the sheath. The outer diameter of the core wire is sized close to the inner diameter of the sheath while allowing for axial sliding, in order to maximize the support to the body portion of the snare device. The distal end of the core wire has a tapered section of reduced diameter or cross section to provide a “guidewire-like” flexibility to the distal portion of the device. A second wire of about fifty percent of the inner diameter of the sheath is shaped to form a snare loop and the two ends are attached to the distal most portion of the central core wire via welding, soldering, or brazing. After assembly of the core and sheath, a second short, hollow tube is fitted over the proximal end of the central core and attached thereto to provide an actuating handle to slideably move the central core within the sheath, thus exposing and retracting the snare loop from the open distal end of the sheath. The loop is typically circular or oval shaped and can also be multiplanar (for example, a twisted, figure eight shape) so as to increase the ability to ensnare and capture objects. The loop attachment to the core wire is facilitated and strengthened by a wrapped coupling coil formed typically of 0.001-inch platinum wire applied to secure the loop prior to soldering (brazing or other metal-flowing joining techniques), and through which solder flows to permanently secure the loop to the core wire.

A cable assembly includes an insulated housing defining a cavity portion along a longitudinal direction; a first contact module including a first insulator combined with a plurality of first contacts, each of the first contacts having a mating portion extending beyond a front surface of the first insulator and a tail portion disposed outside a back surface of the first insulator; a second contact module including a second insulator combined with a plurality of second contacts, each of the second contacts having a mating portion extending beyond a front surface of the second insulator and a tail portion disposed outside a back surface of the second insulator;

the first insulator overlapped with the second insulator, with each of the mating portions of the first contacts disposed into a corresponding gap between two adjacent mating portions of the second contacts, and the tail portions of first contacts spaced apart the tail portions of second contacts; and the first and second contact module inserted into the cavity portion of the insulated housing, with the mating portions of the first contacts and the second contacts extending into a mating port of the insulated housing, and the tail portions of the first and second contacts disposed outside of the cavity portion of the insulated housing and adapted for soldering to wires.

Various high-strength microwave antenna assemblies are described herein. The microwave antenna has a radiating portion connected by a feedline to a power generating source, e.g., a generator. The antenna is a dipole antenna with the distal end of the radiating portion being tapered and terminating at a tip to allow for direct insertion into tissue. Antenna rigidity comes from placing distal and proximal radiating portions in a pre-stressed state, assembling them via threaded or overlapping joints, or fixedly attaching an inner conductor to the distal portion. The inner conductor is affixed to the distal portion by, e.g., welding, brazing, soldering, or by adhesives. A junction member made from a hard dielectric material, e.g., ceramic, can be placed between the two portions and can have uniform or non-uniform shapes to accommodate varying antenna designs. Electrical chokes may also be used to contain returning currents to the distal end of the antenna.

A monolithic inductor (10) comprises an elongated substrate having opposite distal ends (14) and (16), each end having an end cap extending from the opposite ends to support the substrate (12) in spaced relation from a PC board, the end caps being formed with non-mounting areas and a deflection area for preventing the substrate resting on the non-mounting area, a substantially steep side wall (16) on the substrate side of the end cap (14) at the non-mounting area, and an inclined ramp extending up to a top of the end cap on the substrate side substantially opposite the non-mounting area, an electrically conductive soldering band (30) extending partially around each end cap, each soldering band having a gap (34) at the non-mounting area for thereby reducing parasitic conduction in the band (30), and an electrically conductive layer formed on the substrate in a helical path extending between the opposite ends and in electrical contact with the conductive soldering bands (30) at the ramps (120).

A high frequency micro connector has an insulating housing, multiple first terminals and multiple terminals. The insulating housing has a base, a first tongue and a second tongue. The first and second terminals are mounted through the base respectively on the first and second tongue. The second tongue includes pairs of high frequency signal transmission terminals each having a transverse extension section and a soldering section formed on the transverse extension section. The transverse extension sections of each pair protrude reversely and oppositely to increase the distance between the soldering sections therefore to prevent crosstalk between the high frequency signal transmission terminals.

The invention is a spiral weld manual scanner walking on pipelines, which is used for detecting spiral welds of steel pipelines on service with phased array combined with TOFD ultrasonic. The invention relates to the fields of equipment test and pipeline system technology, which are not included in other categories. The invention is composed of a scan rack [1], a probe rack [6], a rolling wheel mechanism and a code device, the rectangle scan rack [1] is equipped with four rolling wheel mechanisms on the four corners, the probe rack [6] is installed on probe rack mobile railways on double sides of the scan rack [1], the code device mechanism is installed on one side out of the scan rack [1]. The scanner can walk on pipelines steadily and reliably, when the scanner detects spiral welds of steel pipelines on service, the probe is parallel to the surface of the pipeline weld accurately all the time and keeps a certain distance with that, in order to provide reliable and accurate tests for detecting spiral welds of steel pipelines on service with phased array combined with TOFD ultrasonic.

An automated soldering system with an intelligent power supply that can automatically configure the power output to interchangeable soldering cartridges, where the soldering cartridges include readable information to allow the power supply to properly power the cartridge to achieve a desired, entered operating temperature. The system includes a cartridge with an identifier that contains information particular to that cartridge, a reader able to read that information, and an indicator positioned on a connector into which the cartridge is inserted.

The invention discloses a method for preparing a bimetal composite plate by stirring friction braze welding. The method comprises that: a plate with small hardness is used as a covering layer metal plate; a plate with high hardness is used as a base layer metal plate; the covering layer metal plate and the base layer metal plate are horizontally fixed on a working platform surface in a lap joint mode; solders which can generate eutectic reaction with one of the upper/base layer metal plates are preset between the upper/base layer metal plates; a non-needle type cylinder friction device is arranged over the covering layer metal plate; the non-needle type cylindrical friction device is made to rotate and be pressed to be closely contacted with the surface layer of the covering layer metal plate, but not penetrate the covering layer metal plate, and the non-needle type cylindrical friction device rotates in the original position or moves forward along the surface of the covering layer metal plate while rotating; by utilizing frictional heat to melt the solders, the upper/base layer metal plates are both quickly melted in the solders, thereby achieving excellent interface combination; and the excessive solders are squeezed out, and a thin and dense soldering seam is formed, so that the bimetal composite plate is prepared. Compared with the braze welding in a furnace, the method has the advantages of high efficiency, energy conservation, pressure lead-in, unnecessary soldering flux and gas protection and short holding time at a high temperature.

An automatic soldering system includes a conveyance mechanism, a vehicle, a first part assembling mechanism, a first soldering mechanism, a turn-over mechanism, a second part assembling mechanism, a second soldering mechanism, and a control system. The vehicle is conveyed by the conveyor mechanism for carrying a workpiece. The first part assembling mechanism and the first soldering mechanism assemble and solder a first part to the primary workpiece carried by the vehicle. The turn-over mechanism turns the vehicle that is conveyed by the conveyor mechanism and carries the primary workpiece having the first part assembled thereto by a predetermined angle. The second part assembling mechanism and the second soldering mechanism assemble and solder and position a second part to the primary workpiece. The control system is electrically connected to and thus controls the first part and second part assembling mechanisms, the first and second soldering mechanisms, and the turn-over mechanism.

A guidewire is formed from a wire twisted around a portion of a longitudinal axis. The guidewire has a first longitudinal edge and a second longitudinal edge. The guidewire may be formed from a kink-resistant material such as Nitinol, stainless steel or titanium. The first and second longitudinal edges form a helical configuration such that the guidewire is capable of transmitting torque while remaining flexible. In one embodiment of the invention, the first and second longitudinal edges and the amount of twisting or pitching remain constant throughout the full length of the guidewire. In other embodiments of the invention, the dimensions of the longitudinal edges and the amount of twisting or pitching may vary widely over the full length or different sections of the guidewire depending on the intended application of the wire. The guidewire may be formed from a single twisted wire of different cross-sections or a plurality of wires having similar or different shapes twisted together around a longitudinal axis. The plurality of wires may be two wires having generally rectangular cross-sections with different dimensions, one wire having a generally rectangular cross-section and the other wire having a generally round cross-section, one wire having a generally rectangular cross-section and the other wire having a generally triangular cross-section, and a plurality of wires having generally round cross-sections, and the wires may be helically twisted together forming a guidewire. The wires may be held together by the sheer force of being twisted together around a longitudinal axis, or the wires may be glued or soldered together, either along the entire length of the wires or by spot gluing or soldering.

The invention discloses a copper base soldering alloy, belonging to metal material area. Said soldering alloy utilizes copper as base material, which adds several or all ones of manganese, zinc, silver, nickel, silicon, tin, aluminum, lithium and rare earth. The welding property of inventive soldering alloy is similar with silver solder while its cost is one times less than common silver solder to reduce cost effectively.

A high-speed plug connector has an insulating housing, a mounting bracket, multiple first terminals, multiple second terminals and a shell. The first terminals are mounted on the insulating housing. The second terminals are mounted on the mounting bracket. Each terminal has a mounting section, a soldering section and a contacting section. The soldering sections are arranged in a transverse row instead of two rows to make the high-speed plug connector compact and reduce mounting surface areas of a PCB on which the soldering sections is soldered.

A multilayer ceramic electronic component is prepared by covering a capacitor element with a thermoplastic resin layer that is mounted on a substrate by soldering. The thermoplastic resin layer is molten due to the heat required for soldering. The molten resin layer flows to expose external electrodes of the electronic component. The exposed external electrodes are soldered to electrodes of the substrate. In the resultant mounting structure, the thermoplastic resin layer covers substantially the entire surface except for the soldered portion of the electronic component and a portion of the solder.

A lead-free alloy solder containing rare-earth elements and multiple other elements for electronic package contains Ag (0.1-5 wt.%), Cu (0.1-1 wt.%), Bi (0.1-8 wt.%), In (0.1-7.5 wt.%), Sb (0-8 wt.%), the mixture of La and Ce or the mixture of La, Ce and one or both of Pr and Nd (0.01-2 wt.%) and Sn (the balance). It has liquidus temp less than 210 deg.c (even 190 deg.C or lower), less than 15 deg.c for liquidus and solidus temp difference, at least 60 MPa of yield strength, at least 18% of elongation percentage, excellent wetting ability, and high soldering quality.