164 results about "Soldering" patented technology

The present application relates to a kind of jigs and terminal welding method for facilitating welding, jig includes for limiting terminal on the product to be welded on terminal limiting assembly, terminal limiting assembly includes first jig block, limiting piece, second jig block, first jig block is equipped with hollow space and the positioning part compatible with product, hollow space is equipped with the terminal positioning slot for positioning terminal, limiting piece is set on first jig block and can be moved in hollow space relative to first jig block, limiting piece is used to be in abutment with terminal to limit terminal movement;Second jig block is compatible with the product to be welded, second jig block is connected on first jig block, second jig block is opened in hollow space Corresponding to the hole, when terminal is positioned in terminal positioning slot, it can be exposed from the hole.The jig provided by the present application, by setting terminal limiting assembly, terminal can be accurately positioned in the corresponding position of product, and terminal movement can be limited in welding, reduce welding position debugging, improve welding efficiency.

Disclosed is a highly reliable multilayer ceramic through-hole capacitor. It includes a multilayer ceramic through-hole capacitor body, which has at least one inner hole for inserting a first controlled expansion alloy tube. A guide pin is inserted into the first controlled expansion alloy tube, which undergoes annealing and surface electroplating treatment. The guide pin, first controlled expansion alloy tube, and inner hole are all fixed using lead-free solder. By welding the first controlled expansion alloy tube with the inner hole of the disk-shaped multilayer ceramic capacitor, the stress resistance capability of the capacitor is improved. This eliminates the need for lead-containing soldering materials with high ductility in the production process, allowing the capacitor to withstand multiple temperature changes without ceramic cracking. As a result, the multilayer ceramic through-hole capacitor achieves high reliability even in harsh external environments.

The application discloses an automatic production method and equipment for a height-limited preformed soldering sheet, and relates to the technical field of welding. The automatic production method for the height-limited preformed soldering sheet comprises the following steps: step one, preparing a preformed soldering sheet material; step two, automatically generating production parameters of the preformed soldering sheet; step three, producing and processing the preformed soldering sheet according to the automatically generated parameters; step four, optimizing the production parameters of the preformed soldering sheet; step five, determining the production parameters of the preformed soldering sheet; and step six, continuously and automatically producing the preformed soldering sheet product. According to the automatic production method for the height-limited preformed soldering sheet, the production parameters are automatically generated in step two, the same product parameters are automatically inquired from a database, or estimated parameters are generated based on a part family and a typical process template, so that the parameters can quickly converge to the optimal value, nitrogen is continuously introduced, air is isolated, and a pre-plating layer structure is further adopted on the soldering wire, thereby further reducing the oxidation risk.

The present invention provides a method for manufacturing a terminal block that suppresses corrosion of injection molds caused by flux residue resulting from soldering, and suppresses deterioration of the appearance of the resin part. [Solution] In a method for manufacturing a terminal block 1 having an assembly 2 and a resin part 3, which can be attached to a case 9 housing electronic equipment, the prepared assembly 2 is set in an injection molding die and an injection molding process is carried out. The assembly 2 has a bus bar 21, a mounting part 22, a printed circuit board 23 to which a chip capacitor 231 is soldered, and a covering material 24. The covering material 24 is a hardened covering material filled in a resin frame 4 which has at least a frame-shaped frame part 41, and covers the chip capacitor 231 and the soldered part. In the injection molding process, the assembly 2 with the frame 4 removed from the covering material 24, or the assembly 2 with the frame 4 still attached to the covering material 24, is set in the injection molding die and injection molding is carried out.

A press-forming device for forming individual solder bodies from a wire of soldering material includes a press-forming mechanism and a separation means. The press-forming mechanism forms a continuous strand of preformed solder sections from the wire by using two notched rollers that rotate in opposite directions and that press opposite notches into the wire. The preformed solder sections are disposed equidistantly along the strand and are connected to each other by connecting links disposed at the notches. The separation means forms individual solder bodies by separating the preformed solder sections one by one at the connecting links. The separation means separates individual preformed solder sections using a cutting mechanism that moves in a direction perpendicular to the length direction of the strand. Individual solder bodies are transported to a solder jetting section where they are liquefied by a laser beam and jetted from the solder jetting section by gas pressure.

The utility model relates to the technical field of coil processing discloses a kind of coil inner side lead wire soldering machine, including rack, soldering jig, jig driving part and soldering assembly are set on rack, jig driving part is transmission connection with soldering jig, jig driving part drives soldering jig to approach or away from soldering assembly, soldering assembly is used to carry out soldering to the coil on soldering jig;By setting soldering jig on rack to facilitate the coil to be soldered is placed, simultaneously by jig driving part drives soldering jig to move to soldering assembly, by controlling soldering depth and soldering time to grasp the soldering effect of corresponding coil lead, and then improve soldering efficiency and soldering progress, improve processing efficiency and yield.

This invention discloses a high-precision assembly and welding device and fixture for semiconductor device skeletons, relating to the field of semiconductor skeleton welding technology. It includes a base with a support mounted on its top. A laser welder is mounted on the support via an electric push rod. A track is mounted inside the base, and a clamping assembly is slidably mounted inside the track. This application first clamps the semiconductor device skeleton using a skeleton fixture. Then, the rotation of a threaded rod controls the movement of a slider. As the slider moves, rollers move on a shaped plate, pushing a connecting plate upwards to match the height of the laser welder. After the initial welding, the slider moves in the opposite direction until the push rod pushes a rectangular rod, causing the elastic telescopic rod to rotate and change its orientation. This causes the slider to move again, moving the repositioned semiconductor device skeleton below the laser welder for secondary welding, achieving a fast and efficient welding operation.

This invention provides a eutectic bonding fixture and bonding method, relating to the technical field of chip processing. The eutectic bonding fixture includes a base, an assembly plate, and a cover plate. The cover plate has a through-hole for machining. The assembly plate and the cover plate are arranged from bottom to top. There are multiple assembly plates arranged sequentially along a direction perpendicular to the base. Each assembly plate is equipped with a housing positioning stage, and at least two assembly plates have housing positioning stages of different types. The assembly plate and / or the cover plate are movably connected to the base so that the downward projection of the machining hole can fall on the housing positioning stage to be worked, and the unworked housing positioning stage is located within the downward projection path of the cover plate.

This invention discloses a component packaging and welding system and method. The system includes a first acquisition module that collects optical data of the welding area; a second acquisition module that collects gas data of the welding area; a third acquisition module that collects negative pressure stress data at each preset solder joint within the welding area; a data processing module that is communicatively connected to the first, second, and third acquisition modules, and is configured to preprocess the optical and gas data to obtain a first mapping between the two, and is also configured to preprocess the gas data to obtain a second mapping between the two; a signal generation module that is configured to determine the state parameters of a solder joint and its adjacent solder joints in the welding area based on the first and second mappings, and generate a control signal based on the state parameters; and an execution module that executes the control signal to adjust the gas output parameters so that the state parameters of each solder joint reach the target value.

This invention provides a fully automated selective soldering system and method, comprising: a flux spraying mechanism arranged sequentially; a first conveying mechanism for conveying a PCB board to the spraying station of the flux spraying mechanism; a preheating mechanism for preheating the sprayed PCB board, wherein the preheating mechanism includes a third conveying mechanism; a second conveying mechanism for conveying the preheated PCB board above a rotary soldering mechanism; and a rotary soldering mechanism for soldering the preheated PCB board. The flux spraying mechanism is located below the first conveying mechanism, and the rotary soldering mechanism is located below the second conveying mechanism. The first and second conveying mechanisms are respectively connected to both ends of the third conveying mechanism. This arrangement simplifies the structure of the transmission section, making the overall equipment structure more compact; and significantly shortens the path of the PCB board between different processes, resulting in a substantial improvement in work efficiency.

This utility model relates to the field of transformer manufacturing technology, specifically an automatic soldering device for surface-mount transformers. It includes a base, a solder bath fixedly installed on the rear side of the top of the base, and a cooling tank fixedly installed on the top of the base in front of the solder bath. A conveyor belt is positioned above the top of the base, in front of the cooling tank. This automatic soldering device for surface-mount transformers, through the coordinated use of a solder bath, servo motor, heating rod, stirring shaft, stirring roller, and temperature sensor, effectively controls and stirs the temperature of the molten solder in the solder bath. The temperature sensor monitors the molten solder temperature in real time, and by adjusting the power of the heating rod, the temperature of the molten solder can be precisely stabilized within a suitable process range. The servo motor drives the stirring roller to rotate, causing convection in the molten solder, resulting in a more uniform temperature distribution, preventing localized overheating or undercooling, ensuring consistent chemical composition, and significantly improving the fluidity of the molten solder.

The application discloses a method for manufacturing a large-heat-exchange-capacity low-flow-resistance low-temperature helium cabin, which comprises radiation red copper plates, red copper cooling coil pipes and a helium cabin support, the interior of the radiation red copper plate of the helium cabin is sprayed with special low-temperature black paint to make the internal emissivity greater than 0.92, and the radiation efficiency is greatly improved, the red copper cooling coil pipe adopts three-branch flow parallel cooling of the radiation red copper plate of the helium cabin, the temperature rise of the cooling helium flow is reduced, and the temperature difference of the whole helium cabin is very small, the low-temperature freezing red copper pipe bending process of the special equipment is adopted to ensure that the cooling coil pipe is not concave and wrinkled, the cooling helium flow resistance meets the requirements, the optimized low-temperature tin soldering welding process and the use of red copper pressing sheets and special aluminum foils greatly improve the heat transfer area and ensure the heat transfer efficiency.

The application discloses a kind of photovoltaic welding band and preparation method thereof, specifically relates to photovoltaic welding band technical field, and photovoltaic welding band includes main band, the top end of the main band is equipped with multiple vice bands, the two ends of the vice band are welded and fixed with main band, the middle part of the vice band is not welded and fixed with main band, the upper and lower ends of the main band and vice band are equipped with solder layer, the main band and vice band are welded and fixed by solder layer, the main band, vice band are made of copper, and the raw material of the solder layer includes tin 60 parts and lead 40 parts according to weight fraction.The application is welded with multiple vice bands on the main band, when the photovoltaic welding band is used as bus band, corresponding one end of interconnecting strip is inserted into the gap between the main band and one of vice bands, then heating is welded, and the upper and lower sides of interconnecting strip are welded and fixed in this welding mode, so that the strength of welding is effectively improved.

The utility model relates to glass welding technical field and disclose a kind of glass welding vacuum jig, including base, the top of base is equipped with fixed base, the both sides outer wall of fixed base is fixedly connected with the connecting block of symmetrical distribution, when installation, the output shaft rotation of motor drives bidirectional screw rod rotation and further drives movable plate to move, movable plate moves through connecting rod and drives pressing plate, and further make pressing plate close to fixed base, when positioning plate and fixed base contact, fixed base makes positioning plate move and enter into recess, first spring deformation, glass body along positioning plate enters fixed base, until two groups of glass body are pasted, at this time, the cavity is sealed by first sealing gasket and second sealing gasket, start vacuum pump, vacuum pump carries out vacuumizing in the cavity through conduit, it is convenient to install, ensure that the glass to be welded between is vacuum state, make two layers of glass to be welded stick tighter to reach better welding effect.

The utility model discloses a transformer framework belongs to electronic transformer technical field. A transformer framework, including the reel for winding wire package, still include the first boss of fixed setting in the secondary terminal board one end, the second boss of fixed setting for fixing secondary intermediate pin in secondary terminal board other end, and the working surface of second boss is higher than the working surface of first boss, when hot dipping tin, and the connection of secondary outside pin root and secondary intermediate pin root is parallel with tin liquid level, the utility model discloses through the working surface of high second boss, through the main body of partial lifting framework, immerse secondary outside pin and secondary intermediate pin in tin liquid, can solder tin under the state of inclination, can utilize existing tool and technology to realize fast accurate soldering tin, avoid scalding and form the risk of badness, and do not increase the equipment of investment, give both sides production reliability and production feasibility, help to improve production efficiency, satisfy customer high safety standard requirement and withstand voltage requirement.

The utility model discloses a kind of heating disc and the liquid heater applied to it, it is related to heating disc technical field, comprising have: stainless steel contact layer, the stainless steel contact layer is used to directly contact with liquid, realize the heating conduction of liquid;Stainless steel base layer, the stainless steel base layer is used to bear thick film circuit or heating element, realize heat generation and conduction;Aluminum alloy soldering layer, the aluminum alloy soldering layer is between stainless steel contact layer and stainless steel base layer, for the welding of auxiliary stainless steel contact layer and stainless steel base layer;Stainless steel contact layer and stainless steel base layer of using S316 or S304 material, collocation porous aluminum alloy soldering layer, avoid heating disc surface rust, corrosion, prolong the service life of heating disc, while enhanced the overall structural stability of heating disc, and effectively improve heating efficiency, shorten the time of liquid heating.

The utility model provides a prevent the pcb board of tin, including core layer, isolation support layer, protection layer, function layer, character layer and prevent tin group, both sides of core layer are connected with isolation support layer in compound, the side of two isolation support layers is connected with protection layer in compound away from core layer, the side of two protection layers is connected with function layer in compound away from isolation support layer, the side of two function layers is connected with character layer in compound away from protection layer, two character layers are provided with prevent tin group away from function layer's side. The utility model discloses utilize the character resistance soldering strip of increasing on the pcb board, and cooperate prevent tin groove, can avoid when welding, solder tin flows to the adjacent soldering pad or solder foot place, leads to the emergence of tin situation, prevents the influence pcb board's performance, reliability and safety, and the size of pcb board's soldering foot and soldering pad is invariable, will not affect the quality of welding, is more convenient for the use of pcb board.

This application discloses a high-weld-resistance copper-chromium contact and its preparation method, belonging to the field of contact material technology. The preparation method includes: using high-purity electrolytic chromium powder and electrolytic copper powder as raw materials, mixing them via acoustic resonance, and then sequentially passing them through powder pressing and cold isostatic pressing to obtain a blank; subjecting the blank to gradient sintering and finishing to obtain a copper-chromium electrode rod; then atomizing the copper-chromium electrode rod to obtain copper-chromium alloy powder; sequentially passing the copper-chromium alloy powder through cladding, heat treatment, sealing welding, and hot isostatic pressing sintering, and then removing the cladding to obtain a preform; after processing the preform, remelting the surface with a green laser to obtain a high-weld-resistance copper-chromium contact. This method improves the purity of the copper-chromium contact and optimizes the morphology and distribution of chromium particles, resulting in a contact with high purity, fine and uniformly distributed chromium particles, excellent weld resistance and breaking performance, suitable for high-voltage arc-extinguishing chambers.

The utility model discloses a photovoltaic module junction box welding quality detection equipment, include: frame, be provided with the transport line for transporting photovoltaic module on the frame, X -ray detection module is installed on the frame, include: light source subassembly and X -ray detector, the light source subassembly is located the X -ray detector upside, positioning assembly is set up in the side surface positioning module group of the transport line side and set up in the multiple position positioning module group of transport line. The utility model has the advantages that realize the automatic detection of photovoltaic module mounting panel, accurately detect the poor such as false soldering, empty soldering, missed soldering, and the welding area is few, guarantee the factory quality of photovoltaic module.

The application provides a stator automatic soldering and soldering visual detection equipment, and particularly relates to the technical field of stator coil welding, and comprises a main machine table, four-station transposition mechanisms capable of realizing step-by-step station switching are arranged on the main machine table, and a plurality of groups of combined loading assemblies are arranged on the four-station transposition mechanisms in a circumferential direction. The stator automatic soldering and soldering visual detection equipment is provided with the four-station transposition mechanisms, the plurality of groups of combined loading assemblies, a welding mechanism, a visual recognition detection mechanism and a mechanical servo picking mechanism on the main machine table, and is matched with feeding conveying structures and OK / NG product conveying structures and connected with a discharging end of a previous equipment, so that the problems of dispersed processes, low efficiency, disconnected detection and sorting and inability to link production lines of the existing stator soldering equipment are solved, batch feeding, soldering, detection and sorting integrated operations are realized, and the welding efficiency and production control level of the equipment are improved.

This invention discloses a lamp holder welding fixture, comprising a housing. Two L-shaped support plates are fixedly connected to the top of the housing near the left side. The two L-shaped support plates are symmetrically arranged. A placement box is disposed between the two L-shaped support plates. The top of the placement box has several placement slots. Through the cooperation between components such as the top plate, limiting plate, lead screw, side plate, rotating plate, meshing plate, first lifting plate, second lifting plate, and elliptical plate, this invention enables automated feeding when the transfer plate moves the placement box to the rear. When the placement box is placed on the two L-shaped support plates, a third motor can be started to move the placement box intermittently. When the placement box moves, a trigger can be started to drive the soldering machine to add solder to the lamp holder, achieving convenient, fast, and reliable soldering of existing bulb holders and avoiding inconsistent soldering positions each time.

The utility model discloses a kind of soldering flux feeding devices for inductance production, it is related to electronic component production equipment technical field.The utility model includes heating groove, pivot rod and liquid level control component, the opening of heating groove is upward, the both ends of pivot rod are rotatably installed in the inboard of heating groove, pivot rod outside lateral array fixed sleeve is connected with a group of axle sleeve, a group of sponge strips is arranged in the lateral array of axle sleeve outer wall, and liquid level control component is arranged in the outside one end of heating groove and is communicated with heating groove.The utility model adds soldering flux to heating groove, and inductance is stretched to heating groove by grabbing arm, so that the pin surface of inductance is contacted with sponge strip, so that the pin surface of inductance is coated with soldering flux, to avoid inductance side being coated with soldering flux;The liquid level height of soldering flux in heating groove is controlled by liquid level control component, so that sponge strip can absorb soldering flux in heating groove after being rotated downward.

This invention relates to a quality evaluation and automatic process control technology for PCBA welding scenarios, comprising: establishing a quantitative standard evaluation system for welding quality based on multiple performance indicators of the product; fusing multimodal sensor data with process parameters to construct a mathematical model; and optimizing processing parameters based on machine learning. Starting from the intelligent problem of PCBA welding process quality control, this invention proposes a quantitative evaluation system for PCBA welding quality, uses process modeling based on multi-sensor fusion of testing, innovatively introduces machine learning-based process parameter optimization methods, develops a PCBA welding prototype with online process control, achieves closed-loop automatic process optimization, and simultaneously solves the crucial data collection problem in big data analysis.

This utility model relates to the field of PCB bare board technology, and in particular to a circuit connection module based on PCB bare board. It includes a PCB bare board assembly, with the inner side of the PCB bare board assembly attached to the outer side of a frame assembly. A soldering auxiliary assembly is fixedly connected to one side of the frame assembly. The frame assembly includes a base plate, with a guide post fixedly connected to the top of the base plate. An operating groove is formed on the inner side of the base plate, and a support crossbeam is fixedly connected to the inner side of the operating groove. The soldering auxiliary assembly includes a metal sleeve, with a crack and soldering hole formed on the inner side of the metal sleeve. An anti-detachment ring is fixedly connected to the top of the metal sleeve, with a vent hole and an exhaust groove formed on the inner side of the anti-detachment ring. Metal stripes are fixedly connected to the inner side of the metal sleeve, and the bottom end of the metal sleeve is fixedly connected to the top of the support crossbeam. In this utility model, the device facilitates the insertion of component pins without the need for tools, significantly reducing the probability of component damage due to improper operation during installation.

The chip welding jig comprises a bottom plate, a positioning groove is formed in the left side of the upper end of the bottom plate, and positioning pressing blocks are movably arranged at the four corners of the upper end of the positioning groove; a shaping strip is fixedly connected to the rear side of the upper end of the bottom plate, a plurality of shaping openings are formed in the upper side of the shaping strip at equal intervals, shaping blocks are rotationally connected to the left sides and the right sides of the lower sides of the interiors of the shaping openings, and shaping arc grooves are oppositely formed in the upper portions between the shaping blocks. And a plurality of arc grooves are equidistantly formed in the right side of the upper end of the bottom plate and the right side of the placement positioning groove. According to the overall structure provided by the embodiment of the invention, along with leftward displacement of the wire dividing plate, the two positioning sub-strips are forced to relatively displace so as to extrude the wire placed in the arc groove, when the wire dividing plate displaces to the leftmost side, the positioning extrusion of the wire is more stable, and the lower end of the rolling shaft also extrudes the upper end of the wire, so that the wire is more stably positioned and extruded. And the wire welding position is more accurate.

The application belongs to the technical field of electronic component welding, in particular to an electronic component welding device, which comprises two U-shaped plates, a rectangular plate is arranged on one side of the U-shaped plate in a sliding mode, a first rectangular strip is arranged on the upper end of the rectangular plate in a sliding mode, a second clamping assembly is arranged at one end of the first rectangular strip, a circular ring is fixedly connected at one end of the first rectangular strip, a first circular plate is rotatably arranged in the middle of the circular ring, a second clamping plate is arranged on both sides of the lower end of the first circular plate in a sliding mode, a second rectangular strip is arranged on one side of the U-shaped plate, the U-shaped plate is rotatably arranged on one side of the second rectangular strip, and electric irons are arranged on both sides of the upper end of the U-shaped plate in a sliding mode. The electronic component and the circuit board are always kept fixed during the overturning process, the electronic component is prevented from shaking during rotation, then welding is carried out, the pins are not damaged, and the welding effect is improved.