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846results about "Printed electric component incorporation" patented technology
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Stator structure and alternating current motor
The invention discloses a stator structure and an AC motor, and relates to the technical field of AC motors, and the stator structure comprises a stator magnet yoke and a flexible circuit board. A cavity with two through ends is formed in the stator magnet yoke; the flexible circuit board is wound and attached to the cavity wall of the cavity, one end of the flexible circuit board is provided with a wiring end used for being connected with an external alternating-current power source, the flexible circuit board at least comprises two conducting layers, a plurality of wires are arranged in each conducting layer, the wires in one conducting layer are electrically connected with the wires in the other conducting layer to form a coil in an enclosing mode, and the coil is arranged in the cavity. The plurality of coils are arranged at intervals along the circumferential direction of the stator magnet yoke and are electrically connected with the wiring terminal; the flexible circuit board is attached to the inner wall of the stator magnet yoke, current passes through the coil and generates a radial magnetic field perpendicular to the stator magnet yoke, and the magnetic field forms a magnetic field loop through the stator magnet yoke. According to the stator winding, the installation of the stator structure can be realized through a fitting mode, and the processing and assembling convenience of the stator structure of the motor is improved.
Owner:ZHEJIANG SANHUA PRECISION DRIVE FUTURE TECHNOLOGY CO LTD
Broadband multi-level three-dimensional vertical interconnection structure based on HTCC technology
ActiveCN119562433Aefficient inputstrong interactionCross-talk/noise/interference reductionPrinted electric component incorporationHigh densityHemt circuits
The invention discloses a broadband multi-level three-dimensional vertical interconnection structure based on an HTCC technology, and belongs to the field of radio frequency front-end system integration. The structure comprises a PCB mother board, a ball grid array and an SiP module which are sequentially arranged from bottom to top, in the SiP module, the chips are distributed among different levels, and a connection mode of the chips among the different levels is set; a radio frequency signal is transmitted upwards through the PCB mother board, and after flowing through the lower-layer bare chip, the radio frequency signal is orderly transmitted upwards through the strip line and the signal via hole in the HTCC and finally transmitted to the surface-layer chip, so that a complete and efficient vertical interconnection signal transmission system is formed. According to the invention, the layout flexibility of interconnection lines among the chips is improved, the wiring crosstalk among the chips is reduced, the three-dimensional integration scene of bare chips in the HTCC is greatly widened, high-density SiP packaging is realized, and the strict technical requirements on radio frequency signal transmission, processing and chip interconnection under a complex circuit architecture can be met.
Owner:UNIV OF ELECTRONICS SCI & TECH OF CHINA
Miniaturized and low-loss secondary winding PCB assembly and transformer
PendingCN119730019ATransformers/reacts mounting/support/suspensionTransformers/inductances coolingTransformerMiniaturization
The invention belongs to the technical field of transformer loss control, and particularly relates to a miniaturized and low-loss secondary winding PCB assembly and a transformer. The device comprises at least two PCBs (Printed Circuit Board) for shunting; the control circuits are integrated on two sides of the PCB and are used for adjusting current; the PCB comprises a first area and a second area; the first area is provided with at least one first through hole; at least one side wall of the first area is provided with a metal layer; the second region is away from the secondary winding; the control circuit comprises a first control circuit and a second control circuit; the first driving control circuit is electrically connected with the first control circuit and is used for driving and controlling the first control circuit; the circuit also comprises a second driving control circuit which is electrically connected with the second control circuit and is used for driving and controlling the second control circuit. The third control circuit is used for filtering the output voltage; therefore, miniaturization and low loss of the transformer are realized, namely, the loss of the transformer caused by current can be reduced.
Owner:DONGGUAN SEGOTEP ELECTRONICS TECH
Radio frequency module
PendingUS20250070037A1Printed circuit detailsPrinted electric component incorporationElectrical conductorInductor
In a radio frequency module, a magnetic core included in an inductor is disposed inside a through hole of a core board. An axis of winding of a coil is perpendicular to a thickness direction defined for the core board. A magnetic core has a first side surface and a second side surface intersecting with the axis of winding of the coil. A first shield portion includes a first feedthrough ground via conductor provided for the core board. A second shield portion includes a second feedthrough ground via conductor provided for the core board. The first feedthrough ground via conductor and the second feedthrough ground via conductor are arranged to interpose the magnetic core between the first feedthrough ground via conductor and the second feedthrough ground via conductor in a direction aligned with the axis of winding of the coil.
Owner:MURATA MFG CO LTD
Manufacturing method of high-precision carbon oil resistor circuit board for vehicle
ActiveCN120456446APrinted electric component incorporationConductive pattern formationScreen printingResistive circuits
The invention discloses a method for manufacturing a high-precision carbon oil resistor circuit board for a vehicle, which comprises the following steps of: attaching a thick copper layer and a micro-adhesive film to form an attaching plate, and manufacturing a groove in the attaching plate corresponding to a resistor pattern; the thickness of the thick copper layer is greater than the depth of the groove; the grooves are filled with carbon oil, then curing processing is carried out, carbon oil patterns are formed, and the whole board forms a carbon oil pattern board; laminating the first single-sided copper-clad plate and the carbon oil pattern plate; the first single-sided copper-clad plate is opposite to the carbon oil pattern; removing the micro-adhesive film, carrying out copper reduction treatment on the thick copper layer, exposing the carbon oil pattern, forming a carbon oil pattern double-sided board, then manufacturing a circuit pattern, and carrying out post-process processing to form a circuit board; the precision of the carbon oil pattern manufactured through the reverse manufacturing process is far higher than that of traditional silk-screen printing, and the problem that the resistance value of the carbon oil pattern exceeds the standard due to the fact that the processing size of the carbon oil pattern is not easy to control in a silk-screen printing ink manufacturing mode in the prior art is solved.
Owner:深せん市実锐泰科技有限公司
Electronic component and component built-in substrate comprising same
PCT designated stage expiredWO2025018092A1Transformers/reacts mounting/support/suspensionPrinted electric component incorporationElectrical conductorElectronic component
[Problem] To form a terminal electrode such that an appropriate area is exposed from a magnetic element part. [Solution] The present invention comprises a coil part 111 which is embedded in a magnetic element part M and in which terminal electrodes 121, 122 are respectively exposed at main surfaces 101, 102. A conductor layer L1 includes terminal patterns 141, 142, end surfaces of which are respectively exposed at the main surfaces 101, 102, and a coil pattern C11 which is connected to the terminal pattern 141. A conductor layer L2 includes terminal patterns 143, 144, end surfaces of which are respectively exposed at the main surfaces 101, 102. The end surfaces of the terminal patterns 141, 143 are connected to each other via a via conductor 151 that is exposed at the main surface 101. The end surfaces of the terminal patterns 142, 144 are connected to each other via a via conductor 152 that is exposed at the main surface 102. The terminal electrodes 121, 122 are surrounded by an interlayer insulating film 130 on the main surfaces 101, 102.
Owner:TDK CORP
Millimeter wave radar PCB of antenna area Hoz
ActiveCN223024684UPrinted electric component incorporationPrinted circuit detailsMillimetre waveRadio frequency
The utility model discloses a millimeter wave radar PCB of an antenna area Hoz, and belongs to the technical field of PCBs. The millimeter wave radar PCB comprises n layers of circuit boards, wherein n is an even number; the n layers of circuit boards respectively form antenna radio frequency layers and digital signal control layers, the L1-L2 layers are the antenna radio frequency layers, and the L3-Ln layers are the digital signal control layers; the antenna radio frequency layer comprises an antenna pattern, the outer EA position of the antenna pattern is provided with a triangular protruding part protruding outwards, and the inner EA position of the antenna pattern is provided with a triangular notch part recessed inwards. The antenna has the beneficial effects that the 45-degree triangle design is additionally arranged at the outer EA position of the antenna pattern, 25 microns are added outwards, the 45-degree triangle design is designed at the inner EA position, and 25 microns are cut inwards, so that the precision of the feeder line, the bonding pad and the EA is ensured.
Owner:ZHUHAI MUTAILAI CIRCUIT CO LTD
Electronic device including flexible printed circuit board and operating method thereof
ActiveUS12490374B2Flexible printed circuitsPrinted circuit detailsStructural engineeringFlexible electronics
A foldable electronic device includes a display including a first and second areas; a first and second housings; a hinge structure foldably connecting the first housing and the second housing to each other on a folding axis; a flexible printed circuit board (FPCB) extending across the folding axis from a first space between the first housing and the display to a second space between the second housing and the display and including a first bending portion and a second bending portion; a sensor configured to identify an impedance in the FPCB; and a processor configured to identify a folding angle between the first housing and the second housing based on the impedance. The first bending portion includes a first sensing pattern part including a first pattern forming a first electrical path and a second pattern forming a second electrical path.
Owner:SAMSUNG ELECTRONICS CO LTD
Electromagnetic leakage suppression structure and application thereof
ActiveCN119545646Alimit transmissionreduce the possibilityPrinted electric component incorporationPrinted circuit aspectsMechanical engineeringPrinted circuit board
The invention provides an electromagnetic leakage suppression structure and application thereof. The electromagnetic leakage suppression structure is located between the metal plate and the printed circuit board which are stacked; a first through hole is formed in the surface of the metal plate; a second through hole is formed in the surface of the printed circuit board; the projection of the first through hole in the direction perpendicular to the metal plate coincides with the projection of the second through hole in the direction perpendicular to the metal plate. The electromagnetic leakage suppression structure comprises more than one annular bulge which is concentrically arranged and is arranged on the surface of the metal plate corresponding to the periphery of the first through hole; when electromagnetic waves pass through the gap between the metal plate and the printed circuit board, the electromagnetic leakage suppression structure limits the electromagnetic waves to spread in a channel between the first through hole and the second through hole. According to the invention, a high-impedance barrier can be formed between the metal plate and the printed circuit board, the possibility that electromagnetic waves are leaked to the external environment is reduced, and the working efficiency and reliability of the system are improved.
Owner:SENWELLEN (SHENZHEN) COMM TECH CO LTD
Multilayer printed circuit board with built-in radio frequency filter
PendingCN119893835APrinted electric component incorporationPrinted circuits structural associationsElectrical performanceRadio frequency
The invention discloses a multi-layer printed circuit board with a built-in radio frequency filter. The multi-layer printed circuit board is provided with a first metal layer, a second metal layer and a third metal layer from the top end to the bottom end in sequence, a first substrate layer is arranged between the first metal layer and the second metal layer, and a second substrate layer is arranged between the second metal layer and the third metal layer; a radio frequency filter to be embedded is arranged in a groove in the second substrate layer, a window is formed in the position, located at the top of the radio frequency filter, in the first metal layer, and a lower metal layer of the radio frequency filter is electrically connected with the third metal layer through a first metal via hole. And the upper metal layer of the radio frequency filter is electrically connected with the first metal layer through the second metal via hole. Compared with a traditional mode that the filter is packaged and then welded on the printed circuit board, the multilayer printed circuit board is smaller in size and better in electrical performance, and the problems that the occupied area is large when the surface-mounted filter is welded on the traditional printed circuit board, but the filter cannot be directly processed in the printed circuit board through patterns are solved.
Owner:SOUTHWEST CHINA RES INST OF ELECTRONICS EQUIP
Silver Pastes Used for Manufacturing a Printed Antenna
PendingUS20250115792A1Adhesive processesPrinted electric component incorporationSilver pasteWeather resistance
The present invention provides silver pastes used for manufacturing a printed antenna, kit-of-parts for preparing a printed antenna for an electronic device comprising three kinds of the silver pastes, use of the silver paste as a via fill ink, a method for preparing a printed antenna circuit with the three kinds of the silver pastes, a printed antenna for an electronic device obtained with the silver pastes, and an electronic device comprising the printed antenna. The silver pastes contain: 2 to 40% by weight of at least one epoxy resin; 0 to 5% by weight of at least one curing agent selected from the group consisting of an amino resin, a low-temperature cationic curing agent, an amine or imidazole capsule curing agent, and combinations thereof; 40 to 90% by weight of at least one filler mixture comprising silver flakes and silver spheres; 10 to 25% by weight of at least one diluent, or 0 to 20% by weight of at least one curing accelerator; and 0 to 5% by weight of at least one coupling agent selected from the group consisting of a silane coupling agent, a titanium-based coupling agent, an aluminum-based coupling agent, and combinations thereof, wherein all the above weight percentages are based on the total weight of the silver paste. The silver pastes of the present invention have high reliability and high conductivity, and have good weather resistance, or good wearing resistance, or no bubbles; and the combination of three kinds of the silver pastes can be excellently used for manufacturing a printed antenna.
Owner:HENKEL KGAA
Composite metal foil, metal-clad laminated board and circuit board
PendingCN119724778APrinted electric component incorporationResistor mounting/supportingElectrical resistance and conductanceHeat management
The invention discloses a composite metal foil, a metal-clad laminated board and a circuit board. The composite metal foil includes: a resistive layer; the resistance layer has a temperature coefficient, and the activation energy of the resistance layer is 0.6-9.2 * 10 <-2 > eV. According to the embodiment of the invention, heating monitoring and even feedback adjustment of the electronic component can be realized, and the thermal management precision is high.
Owner:GUANGZHOU FANGBANG ELECTRONICS +1
Battery pack
A battery pack includes a battery module including battery cells, and busbars electrically connecting respective ones of the battery cells, and a circuit board connected to the battery module, and including a first part including wires, and extending in a length direction of the battery module, second parts extending from the first part in a direction crossing the first part, and including a circuit pattern including a fuse pattern configured to be opened based on an abnormal current, and a non-fuse pattern configured to maintain electrical connection with one or more of the busbars, and third parts respectively extending from the second parts, and connected to the busbars.
Owner:SAMSUNG SDI CO LTD
Pressure-sensitive stacking structure for sports training device, method for manufacturing the same, and golf practice device including the same
PendingUS20260115566A1Printed electric component incorporationPrinted circuit aspectsPhysical medicine and rehabilitationPhysical therapy
A pressure-sensitive stacking structure for a sports training device of the present invention that is able to detect a pressure with which a player grips a grip portion may include: a conductive layer that is pressure-sensitive; a circuit layer disposed to face the conductive layer and having a plurality of conductive patterns; and a separating layer disposed between the conductive layer and the circuit layer and formed of a fibrous tissue including a plurality of fibers, wherein, when a pressure is generated, the conductive layer and the circuit layer may come into contact, and the pressure may be detected.
Owner:SGLAB INC
Magnetic paste, circuit member, and method for manufacturing circuit member
PCT designated stage expiredWO2024247505A1Printed electric component incorporationInorganic material magnetismHemt circuitsMechanical engineering
Provided is a magnetic paste to be used for filling a recess formed in a substrate for circuit members, the magnetic paste containing magnetic powder and a thermosetting component, wherein the volume-based particle size distribution of the magnetic powder has at least a first peak with a peak particle size of 0.5 to 6.0 µm, and a second peak with a peak particle size of 8.0 to 50.0 µm.
Owner:RESONAC CORP
Circuit board structure
ActiveCN223231377UPrinted electric component incorporationElectrical connection printed elementsSignal qualityHigh density
The utility model provides a circuit board structure, and relates to the technical field of circuit boards. The structure comprises a circuit board body, at least two resistance-capacitance devices and at least four signal wires, the circuit board body is provided with at least two signal holes, at least two backflow ground holes and at least two bonding pad assemblies, each bonding pad assembly comprises at least two bonding pads which are arranged in sequence, the same resistance-capacitance device is correspondingly connected with two adjacent bonding pads in the same bonding pad assembly, the signal wire is correspondingly connected with the bonding pads connected with the resistance-capacitance device, and the signal wire is connected with the signal wire. The through bonding pad assembly and the signal hole are both located between the at least two backflow ground holes. The quality and stability of signal transmission can be enhanced through the signal hole, the backflow ground hole provides a plurality of backflow paths, in high-speed signal transmission and high-frequency application, signal delay and distortion are reduced, the signal quality is improved, the device is suitable for high-speed signal transmission, such as 32Gbps, and the bonding pad assembly, the signal hole and the backflow ground hole are compact in layout structure, small in occupied space and high in reliability. And the high-density arrangement requirement is met.
Owner:SUMA TECH CO LTD
Parallel automatic current sharing circuit based on PCB
The utility model relates to the technical field of power supply circuits, in particular to a parallel automatic current-sharing circuit based on a PCB (Printed Circuit Board), which comprises a first current-sharing branch and a second current-sharing branch which are symmetrically designed in parallel, and each of the first current-sharing branch and the second current-sharing branch comprises an independent winding transformer. One end of the output side of the independent winding transformer is connected with the drain electrode of the third switching power MOS tube and the source electrode of the first switching power MOS tube, the other end of the output side of the independent winding transformer is connected with the source electrode of the second switching power MOS tube and the drain electrode of the fourth switching power MOS tube, and the source electrode of the third switching power MOS tube and the source electrode of the fourth switching power MOS tube are both connected with the negative electrode output end. The drain electrode of the first switch power MOS tube and the drain electrode of the second switch power MOS tube are connected with the input end of the power inductor. And one end of the first capacitor is connected with the source electrode of the third switch power MOS tube in the second current-sharing branch, and the other end of the first capacitor is connected with the output end of the power inductor in the first current-sharing branch. The utility model aims to provide the parallel automatic current sharing circuit which is low in cost, good in current sharing effect and high in stability.
Owner:SICHUAN FULKENS TECH CO LTD
Sensing assembly and battery module
ActiveUS12482906B2Printed electric component incorporationPrinted circuit aspectsManufacturing cost reductionElectrical battery
The present invention relates to a sensing assembly and a battery module that may have a relatively low weight, simplify a component assembly process, reduce manufacturing cost, and prevent a sensing leg from being damaged due to an assembly step or an external force. The sensing assembly may include a first substrate having at least one first terminal and at least one second terminal provided on one surface and formed of a rigid printed circuit board, a second substrate including at least one sensing line electrically connected to the first terminal and formed of a flexible printed circuit board, and a sensing leg having one end electrically connected to the second terminal and including a fuse part that is disconnected when an excessive current flows.
Owner:SK ON CO LTD
Resistance-embedded metal foil and protection method thereof
The invention relates to a buried resistor metal foil and a protection method thereof. The buried resistor metal foil sequentially comprises a conductive layer, a resistive layer, a passivation layer and a protection layer, the buried resistance metal foil is provided with the passivation layer through a chemical reaction, and the protection layer is arranged through a coating, electroplating or physical vapor deposition method. Through the arrangement of the passivation layer and the protection layer, the corrosion resistance and the mechanical damage resistance of the buried resistance metal foil are effectively enhanced through double guarantee, the resistance fluctuation of the buried resistance metal foil is reduced, and the service life of the buried resistance metal foil is prolonged; wherein the protective layer can be removed without damage through a physical or chemical method before PCB processing, and a stable, precise and low-fluctuation buried resistance metal foil is provided for the PCB.
Owner:JIUJIANG TELFORD ELECTRONICS MATERIAL CO LTD
Inductor Components
ActiveJP7652283B2Printed electric component incorporationTransformers/inductances coils/windings/connections
In the present invention, an inductor component comprises a glass substrate including a first main surface and a second main surface that face each other, and a coil provided on the glass substrate and wound in a helix along an axis. The coil includes: a plurality of first coil conductors arranged along the axis on the first main surface of the glass substrate; a plurality of second coil conductors arranged along the axis on the second main surface of the glass substrate; a plurality of first through conductors that penetrate the glass substrate from the first main surface toward the second main surface, and that are arranged along the axis; and a plurality of second through conductors that penetrate the glass substrate from the first main surface toward the second main surface, that are provided on the opposite side to the first through conductors relative to the axis, and that are arranged along the axis. The first coil conductors, the first through conductors, the second coil conductors, and the second through conductors are connected in the stated order to constitute at least a portion of the spiral. The plurality of first through conductors are arranged staggered along the axis, the plurality of second through conductors are arranged staggered along the axis, and the plurality of first coil conductors and / or the plurality of second coil conductors are formed in a repeated manner alternating between long and short lengths along the axis.
Owner:MURATA MFG CO LTD
MAGNETIC STRUCTURES AND INDUCTIVE COUPLING CONTROL
Owner:INFINEON TECHNOLOGIES AG
Resin composition
PendingJP2025109665APrinted electric component incorporationInorganic material magnetismAlloyFerrite (magnet)
To provide a resin composition that can produce a cured product with improved specific magnetic permeability and magnetic loss.SOLUTION: A resin composition comprising: (A) a Ni-containing iron alloy-based magnetic powder; (B) a Mn-containing ferrite-based magnetic powder; and (C) a thermosetting resin, the component (A) containing an Fe-Ni-Cr-based alloy magnetic powder, the component (B) containing or not containing a Zn-containing ferrite-based magnetic power, and the mass ratio ((Mn+Zn) / Fe) of the total amount of Mn and Zn to an amount of Fe in the entire magnetic powder contained in the component (A) and the component (B) being 0.055 or more and 0.16 or less.SELECTED DRAWING: None
Owner:AJINOMOTO CO INC
PCB and production method and application thereof
PendingCN122002694APrinted electric component incorporationConductive pattern formationEngineeringCopper foil
The invention discloses a PCB and a production method and application thereof, the PCB comprises a PCB substrate, the PCB substrate is provided with a plurality of pads, a planar transformer and a plurality of lines, the PCB substrate is provided with first grooves corresponding to the pads one by one, and the PCB substrate is provided with second grooves corresponding to the planar transformer; copper foil layers are deposited on the inner wall of the first groove and the surface of the PCB substrate corresponding to the plurality of lines, so that a bonding pad and lines are formed, and a tin alloy layer is arranged on the copper foil layer corresponding to the bonding pad area; the planar transformer is embedded in the second groove, the planar transformer comprises a magnetic core and a coil, and the coil is electrically connected with the copper foil layer. According to the invention, the generation of welding spot bubbles can be effectively avoided, the welding quality and the heat dissipation performance can be improved, the production process can be simplified, the production cost can be reduced, and the product integration can be improved.
Owner:CHONGQING TSINGSHAN IND
Backlight touch key
ActiveCN224289779UImprove responsivenessImprove reliabilityPrinted electric component incorporationElectronic switchingCapacitanceManufacturing technology
The utility model relates to the technical field of man-machine interaction of electronic equipment, and particularly discloses a backlight touch key. The backlight touch key comprises a shell and a plurality of key assemblies, each key assembly comprises a key unit and a touch conduction unit, and each key unit is provided with a first end and a second end which are opposite to each other; the first end is embedded in the shell, the key unit penetrates through the touch conduction unit, the outer surface of the touch conduction unit is provided with a capacitive sensing surface, the capacitive sensing surface is attached to the shell, and the relative position of the shell and the touch conduction unit is fixed. According to the backlight touch key, the specific structure is improved, so that high integration of the structure and simplification of the manufacturing process are realized while the backlight uniformity and the induction sensitivity are ensured.
Owner:SHENZHEN YIXIN OPTOELECTRONICS CO LTD
Component mounting board
ActiveJP7826053B2Fluid-tightness measurement by detecting dimension changePrinted electric component incorporation
Owner:MEKTECH CO LTD
Electronic device including multiple PCBS and antennas printed on PCBS
ActiveUS12581007B2Loop antennas with ferromagnetic coreSimultaneous aerial operationsDisplay deviceElectrical connection
An electronic device is provided. The electronic device includes a housing including a first plate facing a first direction and a second plate facing a second direction opposite to the first direction, and forming a space between the first plate and the second plate, a display disposed inside the housing and exposed through the first plate, a first printed circuit board disposed between the display and the second plate, a second printed circuit board disposed between the display and the second plate, a third printed circuit board which is disposed between the display and the second plate and electrically connects the first printed circuit board and the second printed circuit board, and a first antenna coupled to the first printed circuit board, wherein the third printed circuit board may include a second antenna electrically connected to the first antenna.
Owner:SAMSUNG ELECTRONICS CO LTD
Magnetic element and circuit board including the same
Owner:LG INNOTEK CO LTD
Circuit board and semiconductor package comprising same
PCT designated stageWO2026095455A1Printed electric component incorporationSemiconductor/solid-state device detailsThermal dilatationInsulation layer
Disclosed is a circuit board according to an embodiment of the present invention comprising a first insulation layer, and a second insulation layer disposed on the first insulation layer, the second insulation layer comprising protrusions disposed in dummy trenches penetrating at least a portion of the first insulation layer, and thermal expansion coefficient of the first insulation layer being smaller than that of the second insulation layer.
Owner:LG INNOTEK CO LTD
Graphic structure of touch key
ActiveCN223463005UPrinted electric component incorporationElectronic switchingComputer hardwareGraphics
The utility model provides a graphic structure of a touch key. The graphic structure of the touch key comprises a reference signal layer, an induction channel layer and an excitation signal layer, the reference signal layer and the induction channel layer are arranged on the same side face of the excitation signal layer. The induction channel layer is square, the reference signal layer is arranged around the periphery of the induction channel layer, and the reference signal layer is close to but not in contact with the induction channel layer. The graphic structure and the circuit design of the touch key are concise, and the touch key is anti-aging, anti-short circuit and anti-electric leakage.
Owner:SUZHOU PIXCIR MICROELECTRONICS
Transformer and high-frequency module
To achieve a transformer and a high-frequency module, capable of implementing a differential power amplification circuit supporting a higher frequency or output.SOLUTION: A transformer provided at a multilayer substrate 3 having a plurality of wiring layers laminated with a dielectric layer interposed therebetween includes a balanced-side coil 41 provided between a first terminal T1 and a second terminal T2, and an unbalanced-side coil 42 provided between a third terminal T3 and a fourth terminal T4. The balanced-side coil 41 is configured such that a first inductor L1 and a second inductor L2 provided at different ones of the wiring layers are connected in parallel. The unbalanced-side coil 42 is configured such that a third inductor L3 and a fourth inductor L4 provided at different ones of the wiring layers are connected in series.SELECTED DRAWING: Figure 3
Owner:MURATA MFG CO LTD