300results about "Printed electric component incorporation" patented technology

A foldable electronic device includes a display including a first and second areas; a first and second housings; a hinge structure foldably connecting the first housing and the second housing to each other on a folding axis; a flexible printed circuit board (FPCB) extending across the folding axis from a first space between the first housing and the display to a second space between the second housing and the display and including a first bending portion and a second bending portion; a sensor configured to identify an impedance in the FPCB; and a processor configured to identify a folding angle between the first housing and the second housing based on the impedance. The first bending portion includes a first sensing pattern part including a first pattern forming a first electrical path and a second pattern forming a second electrical path.

A pressure-sensitive stacking structure for a sports training device of the present invention that is able to detect a pressure with which a player grips a grip portion may include: a conductive layer that is pressure-sensitive; a circuit layer disposed to face the conductive layer and having a plurality of conductive patterns; and a separating layer disposed between the conductive layer and the circuit layer and formed of a fibrous tissue including a plurality of fibers, wherein, when a pressure is generated, the conductive layer and the circuit layer may come into contact, and the pressure may be detected.

The present invention relates to a sensing assembly and a battery module that may have a relatively low weight, simplify a component assembly process, reduce manufacturing cost, and prevent a sensing leg from being damaged due to an assembly step or an external force. The sensing assembly may include a first substrate having at least one first terminal and at least one second terminal provided on one surface and formed of a rigid printed circuit board, a second substrate including at least one sensing line electrically connected to the first terminal and formed of a flexible printed circuit board, and a sensing leg having one end electrically connected to the second terminal and including a fuse part that is disconnected when an excessive current flows.

The invention discloses a PCB and a production method and application thereof, the PCB comprises a PCB substrate, the PCB substrate is provided with a plurality of pads, a planar transformer and a plurality of lines, the PCB substrate is provided with first grooves corresponding to the pads one by one, and the PCB substrate is provided with second grooves corresponding to the planar transformer; copper foil layers are deposited on the inner wall of the first groove and the surface of the PCB substrate corresponding to the plurality of lines, so that a bonding pad and lines are formed, and a tin alloy layer is arranged on the copper foil layer corresponding to the bonding pad area; the planar transformer is embedded in the second groove, the planar transformer comprises a magnetic core and a coil, and the coil is electrically connected with the copper foil layer. According to the invention, the generation of welding spot bubbles can be effectively avoided, the welding quality and the heat dissipation performance can be improved, the production process can be simplified, the production cost can be reduced, and the product integration can be improved.

The utility model relates to the technical field of man-machine interaction of electronic equipment, and particularly discloses a backlight touch key. The backlight touch key comprises a shell and a plurality of key assemblies, each key assembly comprises a key unit and a touch conduction unit, and each key unit is provided with a first end and a second end which are opposite to each other; the first end is embedded in the shell, the key unit penetrates through the touch conduction unit, the outer surface of the touch conduction unit is provided with a capacitive sensing surface, the capacitive sensing surface is attached to the shell, and the relative position of the shell and the touch conduction unit is fixed. According to the backlight touch key, the specific structure is improved, so that high integration of the structure and simplification of the manufacturing process are realized while the backlight uniformity and the induction sensitivity are ensured.

An electronic device is provided. The electronic device includes a housing including a first plate facing a first direction and a second plate facing a second direction opposite to the first direction, and forming a space between the first plate and the second plate, a display disposed inside the housing and exposed through the first plate, a first printed circuit board disposed between the display and the second plate, a second printed circuit board disposed between the display and the second plate, a third printed circuit board which is disposed between the display and the second plate and electrically connects the first printed circuit board and the second printed circuit board, and a first antenna coupled to the first printed circuit board, wherein the third printed circuit board may include a second antenna electrically connected to the first antenna.

Disclosed is a circuit board according to an embodiment of the present invention comprising a first insulation layer, and a second insulation layer disposed on the first insulation layer, the second insulation layer comprising protrusions disposed in dummy trenches penetrating at least a portion of the first insulation layer, and thermal expansion coefficient of the first insulation layer being smaller than that of the second insulation layer.

The utility model provides a graphic structure of a touch key. The graphic structure of the touch key comprises a reference signal layer, an induction channel layer and an excitation signal layer, the reference signal layer and the induction channel layer are arranged on the same side face of the excitation signal layer. The induction channel layer is square, the reference signal layer is arranged around the periphery of the induction channel layer, and the reference signal layer is close to but not in contact with the induction channel layer. The graphic structure and the circuit design of the touch key are concise, and the touch key is anti-aging, anti-short circuit and anti-electric leakage.

The invention belongs to the technical field of converters, and relates to a magnetic integrated converter for fixed switching frequency resonant conversion, which comprises a magnetic core and a PCB (printed circuit board), the magnetic core is a UI-type magnetic core, and the PCB is a multilayer board; the secondary winding layer is located between the core columns of the magnetic core, the GND layer is arranged outside the core columns of the magnetic core in a sleeving mode, and the core columns of the magnetic core are sleeved with the core column via holes of the primary winding layer respectively; the secondary winding layer is provided with an output capacitor and a synchronous rectification transistor, and the primary winding layer is provided with an input capacitor, a primary transistor and a resonant capacitor; the secondary winding layer is electrically connected to the GND layer, so that the secondary side of the transformer forms a loop; the primary winding layers are connected in series; through the magnetic integrated converter with higher integration level, the area of the converter is remarkably reduced, so that the power density of the converter is improved.

A module is used in a semiconductor composite device that supplies a direct-current voltage adjusted by a voltage regulator including a semiconductor active element to a load. The module includes a capacitor layer including at least one capacitor portion forming a capacitor, a connection terminal used for electrical connection with at least one of the voltage regulator and the load, and a through-hole conductor formed to penetrate the capacitor portion in a thickness direction of the capacitor layer. The capacitor is electrically connected to at least one of the load and the voltage regulator with the through-hole conductor interposed between the load and the voltage regulator.

A current sensing device is provided, including: a laminate having a plurality of insulating layers laminated therein; a current sensing element provided in an inner layer of the laminate; a current wire configured to flow current to the current sensing element, the current wire being provided above an interlayer insulating layer with respect to the current sensing element; a plurality of current vias configured to connect the current sensing element and the current wire in such a manner as to penetrate the interlayer insulating layer; and a voltage sensing via configured to obtain a voltage drop in the current sensing element, the voltage sensing via being electrically connected to the current sensing element.

The invention relates to a thin-film resistor modification method, which comprises the following steps of: sputtering a thin-film resistor on a rough surface of a copper foil in vacuum, and then carrying out plasma nitriding or carburizing treatment on the thin-film resistor to obtain a resistor-embedded copper foil. The modified thin-film resistor has low TCR (temperature coefficient of resistance) and small resistance fluctuation along with temperature change; the resistivity of the thin-film resistor can be controlled according to the carburizing or nitriding content, the high-resistivity buried copper foil is prepared, and the method has a good application prospect.

The purpose of the present invention is to provide a photosensitive conductive paste which makes it possible to form a high-resolution circuit pattern and exhibits low shrinkage when sintering the circuit pattern.　The present invention is a photosensitive conductive paste which contains a conductive powder (A) and a photosensitive organic component (B), wherein the median size r of the particle diameter distribution of the conductive powder (A) is 3.0-6.0μm, inclusive, and the content V1 of the conductive powder (A) constitutes 37-55 vol%, inclusive, of the solid content overall.

The application provides a multistage bandwidth regulation photodetector assembly, which comprises a first printed circuit board, a second printed circuit board, and a first printed circuit board electrically connected with the second printed circuit board; the second printed circuit board is printed with a first open loop circuit, and the first open loop circuit comprises at least one resistor which is connected in series; a third printed circuit board is electrically connected with the second printed circuit board; the third printed circuit board is printed with a second open loop circuit, and the second open loop circuit comprises at least one capacitor which is connected in series; a photodetector is arranged on the surface of the first printed circuit board and is electrically connected with the first open loop circuit and the second open loop circuit respectively; and a thin film circuit is arranged on the surface of the first printed circuit board and is electrically connected with the photodetector. The multistage bandwidth regulation photodetector assembly has a simple structure and stable circuit connection, and the resistance and capacitance of the assembly can be actively regulated, so that the bandwidth of the assembly can be autonomously regulated.

An electronic device (100) which comprises a first component carrier (102) which comprises a first stack (104), having at least one first electrically conductive layer structure (106) forming an antenna structure (110) and having at least one first electrically insulating layer structure (108), wherein the first component carrier (102) further comprises at least one electronic component (112, 114), and a second component carrier (116) having at least one second electrically conductive layer structure (120) and / or at least one second electrically insulating layer structure (122), wherein the second component carrier (116) further comprises a heat removal structure (124), wherein the first component carrier (102) and the second component carrier (116) are connected so that the antenna structure (110) is positioned at one side (126) of the electronic device (100) for emitting and / or receiving electromagnetic radiation and the heat removal structure (124) is positioned at an opposing other side (128) of the electronic device (100).

To provide a technique of being able to form easily an upper element and a structure to relieve the impact of wire bonding on an electrode pad corresponding to an end part of the upper element.SOLUTION: A semiconductor device 100 includes a substrate 1, a breakdown voltage holding insulating film 4, an element part having a lower element 3 and an upper element 5, an extraction wire 7, a first electrode pad 8, a second electrode pad 10 corresponding to an end part of the upper element 5, and an uppermost protection film 6 that covers the upper element 5 so as to expose the second electrode pad 10 from a second contact hole 12. The breakdown voltage holding insulating film 4 and the uppermost protection film 6 are provided up to a region outside the first electrode pad 8 in a direction where the extraction wire 7 extends. On an upper surface of the second electrode pad 10, a pad double stack part 13 with conductivity is provided. The uppermost protection film 6 covers a peripheral part of the pad double stack part 13.SELECTED DRAWING: Figure 2

In the electronic component, a terminal electrode is formed in a manner that a proper area is exposed from a magnetic element body part. The electronic component is provided with a coil part (111) which is embedded in the magnetic element body part (M), and terminal electrodes (121, 122) of the coil part (111) are respectively exposed on main surfaces (101, 102) of the coil part (111). The conductor layer (L1) includes: terminal patterns (141, 142), the end surfaces of which are respectively exposed on the main surfaces (101, 102); and a coil pattern (C11) connected to the terminal pattern (141). The conductor layer (L2) includes terminal patterns (143, 144), the end surfaces of which are respectively exposed on the main surfaces (101, 102). The terminal patterns (141, 143) are connected to each other via a via conductor (151) having an end surface exposed on the main surface (101), and the terminal patterns (142, 144) are connected to each other via a via conductor (152) having an end surface exposed on the main surface (102). The terminal electrodes (121, 122) are respectively surrounded by an interlayer insulating film (130) on the main surfaces (101, 102).

The invention relates to the technical field of PCB layout wiring, and discloses a method and a device for improving surge capacity between an RJ45 connector and a transformer, and the method comprises the following steps: in a PCB area of the transformer, arranging a non-metal slot at a boundary between a primary side and a secondary side of the transformer; an RJ45 connector is arranged in a PCB area far away from an external interface base of a transformer, a preset linear distance between the RJ45 connector and the interface base is set, the length of a differential wire from the RJ45 connector to the transformer is controlled within the preset length of the differential wire, the differential wire is subjected to roughing processing with preset wire width and keeps continuous, and the RJ45 connector is arranged in the PCB area of the external interface base of the transformer. The accumulation of surge energy in a transmission path is reduced. According to the invention, the inherent isolation axis of the primary-secondary winding of the transformer is accurately aligned through the slotting, the central area with the most concentrated winding coupling is covered, and the conduction path of surge energy through parasitic capacitance between the windings is blocked.

A signal transmission device includes a semiconductor substrate, an insulating film, a first electrode, a second electrode, a ground, and a lead-out portion. The lead-out portion includes a connection portion connected to the first electrode, a first extension portion connected to the connection portion, and a second extension portion connected to the first extension portion and an electronic circuit. The first extension portion extends in a direction that intersects a shortest direction of a line segment connecting the connection portion and the ground in a direction perpendicular to a thickness direction. The second extension portion extends in a direction intersecting the direction in which the first extension portion extends. The signal transmission device is configured so that signals from the electronic circuit are transmitted via the second extension portion, the first extension portion, the connection portion, the first electrode, and a second electrode.

The utility model relates to a circuit board, an antenna and an electronic device, the circuit board comprises a plurality of layers of substrates arranged in a stacked manner, at least one layer of substrate in the plurality of layers of substrates is set as a functional substrate, the functional substrate is integrated with an inductance coil, and the inductance coil is used for realizing tuning of a feed port of the antenna. According to the invention, the inductance coil used for tuning the feed port of the antenna is integrated on the functional substrate, and the parameters of the inductance coil integrated on the circuit board are adjusted, so that a more accurate inductance value can be obtained, and there is no need to buy a discrete inductance device with a fixed inductance value. According to the method, the performance matching precision of the inductance value and the antenna can be improved, the research and development cost for debugging and simulating the inductance coil and the antenna in the design stage is reduced, multiple times of proofing and debugging before production are not needed, waste of labor cost and material cost is avoided, and the production efficiency is improved.

The invention provides a buried resistor metal foil and application thereof.The buried resistor metal foil comprises a conductive layer and a resistance layer arranged on the surface of at least one side of the conductive layer, the resistance layer comprises nickel and chromium elements, and the nickel and the chromium elements are arranged in the thickness direction of the buried resistor metal foil from the face close to one side of the conductive layer. The mass content of nickel in the resistive layer is reduced and then increased, and the mass content of chromium is increased and then reduced. According to the buried resistor metal foil provided by the invention, the chromium content in the resistive layer is not a constant value but changes along with the thickness, and the change of the chromium content in the resistive layer is controlled, so that the material has good etchable processability and excellent corrosion resistance in a medium-high temperature severe environment, and can better adapt to high-end equipment; the performance requirement of an electronic system on the buried resistance metal foil in a severe environment is met, and the application limitation of a conventional material in a special scene is broken through.

A pressure sensor and method of manufacturing the same are provided. The pressure sensor includes a flexible sensor board. The flexible sensor board includes a dielectric layer, two circuit layers and piezoelectric sensing blocks. The dielectric layer has a first surface and a second surface opposite to the first surface. The two circuit layers are placed on the first surface and the second surface of the dielectric layer respectively. The piezoelectric sensing blocks are placed in dielectric layer and electrically connected with the two circuit layers. The mentioned pressure sensor utilizes the flexible sensor board that can be suitable for to the curvature of the diffident curved surfaces of the tested sample, which helps to improve the consistency and accuracy of the measurements.

A pressure-sensing laminate for a sports practice device according to the present invention comprises, with respect to a pressure-sensing laminate for sports practice device capable of sensing pressure applied by a player to a grip part: a conductive layer having pressure sensitivity; a circuit layer disposed to face the conductive layer and provided with a plurality of conductive patterns; and a separation layer disposed between the conductive layer and the circuit layer and made of a fiber structure comprising a plurality of fibers, wherein, when pressure is applied, the conductive layer and the circuit layer come into contact with each other to sense the pressure.

Systems, apparatus, products, and methods for supplying power through a package substrate comprising a stack of glass layers having different coefficients of thermal expansion are disclosed. [Solution] An exemplary substrate for an integrated circuit package comprises: a first glass layer having a first coefficient of thermal expansion (CTE); a second glass layer having a second CTE, the second CTE being different from the first CTE; a conductive material extending through a first hole in the first glass layer and a second hole in the second glass layer; and a magnetic material between the inner wall of the first hole and the conductive material.

This electronic device is provided with: an element body having a mounting surface and a main surface facing each other; a first electrode, a second electrode, a third electrode, and a fourth electrode disposed on the mounting surface; a first line electrically connecting the first electrode and the second electrode; a second line electrically connecting the third electrode and the fourth electrode and magnetically coupled to the first line; and a capacitor provided between the first electrode and the third electrode and / or between the second electrode and the fourth electrode.