1042results about "Circuit thermal arrangements" patented technology

The invention relates to the technical field of printed circuit boards, and discloses a circuit board structure and a preparation method thereof, and the circuit board structure comprises a copper seat, the top of which is provided with a first groove; a chip, wherein the chip is arranged in the first groove; the ceramic substrate layer is arranged at the bottom of the copper seat, and the shape of the cross section of the ceramic substrate layer is the same as that of the bottom surface of the copper seat; the copper plate layer is arranged at the bottom of the ceramic substrate layer, and the shape of the cross section of the copper plate layer is the same as that of the cross section of the ceramic substrate layer. The ceramic substrate layer and the copper plate layer are sequentially arranged at the bottom of the copper base, the thermal resistance of the chip during working can be remarkably reduced, the overall heat dissipation performance can be improved, the cross sections of the ceramic substrate layer and the copper plate layer are consistent with the bottom surfaces of the copper base and the copper plate layer in shape, and the layers are high in structural fitting degree, uniform in stress distribution and good in plate thickness consistency after lamination; and the warping problem of the copper seat caused by thermal expansion is effectively reduced.

A controller includes a circuit board, and a module assembly arranged at the circuit board. The module assembly includes a first power module, a second power module, and a third power module. The circuit board includes a first current circuit connected to the first power module, a second current circuit connected to the second power module, and a third current circuit connected to the third power module. The first current circuit and the second current circuit share one or more circuit components.

The invention discloses a double-sided heat dissipation common drain module packaging structure, and belongs to the technical field of power semiconductor device packaging. The module comprises a common drain electrode upper copper layer, two drain electrode copper terminals, two power chips, two source electrode copper blocks, two L-shaped source electrode lower copper layers, two driving grid electrode copper terminals, two driving source electrode copper terminals and a bonding wire. Drain electrodes of the two power chips are welded on the common drain electrode upper copper layer, and source electrodes of the two power chips are respectively welded with the L-shaped source electrode lower copper layer through source electrode copper blocks. And the bonding wire is connected with the grid electrode and the source electrode of the chip and the driving copper terminal to realize Kelvin connection. Thermal resistance is reduced through a double-sided heat dissipation structure, parasitic inductance is reduced through a three-dimensional commutation loop, power density and reliability are improved, and the common drain geminate transistor is suitable for common drain geminate transistor application in a battery management system.

The invention discloses a chip packaging module structure and an electronic product, and relates to the technical field of chip packaging, the chip packaging module structure comprises a PCB, an insulating substrate, a first radiator and a second radiator; the insulation substrate is arranged on the PCB, the insulation substrate is provided with a first side and a second side, the insulation substrate is provided with a first chip in an integrated mode, the first chip is located on the second side of the insulation substrate, the insulation substrate is provided with a plurality of via holes penetrating through the first side and the second side, metal is arranged in each via hole, at least part of the via holes are conductive holes, and the first chip is arranged on the first side of the insulation substrate. The metal in the conductive hole is used as a part of an electric connection structure between the PCB and the plurality of chips; the first radiator is in thermal conduction connection with the first chip; the second radiator is arranged on the other side of the PCB, and a longitudinal heat conduction structure is formed between the second radiator and the first chip, so that the second radiator is in heat conduction connection with the first chip; the technical scheme provided by the invention aims to improve the heat dissipation efficiency.

An active compensation device including a first element group including an integrated sensing / compensation unit configured to generate a sensing signal corresponding to at least one of common-mode noise and differential-mode noise on at least two high-current paths, and a second element group including a compensation control unit including a negative impedance converter and configured to generate a compensation signal corresponding to the sensing signal and provide the compensation signal to the integrated sensing / compensation unit. The compensation control unit further including a stabilization unit configured to prevent oscillation caused by the sensed noise. The first element group and the second element group are mounted on a single substrate.

This application relates to a heat dissipation shielding structure and a processing method, a circuit board assembly, and an electronic device. The printed circuit board includes a mounting surface. Electronic components are mounted on the mounting surface. The electronic components include an active component and a passive component. The heat dissipation shielding structure includes an insulating layer. The insulating layer is covered on the mounting surface, and wraps at least a side surface of the active component, so that a side that is of the insulating layer and that faces away from the mounting surface forms a first surface together with a top surface of the active component. A shielding layer is covered on the first surface, a shape of the shielding layer matches a shape of the first surface, and the shielding layer is electrically connected to a ground network of the printed circuit board.

The invention relates to the technical field of PCB heat dissipation, and discloses a distributed heat dissipation structure and a distributed heat dissipation method for a PCB under a high-temperature working condition, the distributed heat dissipation structure comprises a PCB base material, an electronic component is mounted on the A surface of the PCB base material, and active thermal control units are mounted on the B surface of the PCB base material corresponding to the electronic component needing to be cooled in a distributed manner; according to the distributed heat dissipation structure for the PCB under the high-temperature working condition, the active thermal control units are installed in the area, corresponding to the heating element, of the B face of the PCB base material in a distributed mode, active refrigeration can be conducted on electronic components (such as a microprocessor and a storage) with the large heating value in a targeted mode, the highest working temperature of a system is increased, and the heat dissipation efficiency is improved. Normal operation of the system is guaranteed, meanwhile, energy waste caused by cooling of the whole plate is avoided, and the heat dissipation efficiency and the energy utilization rate are remarkably improved.

A circuit system includes: a plurality of integrated circuit (IC) chips on a circuit board; a first conduit configured to convey a first flow of a coolant, wherein the first conduit is arranged such that the first flow of the coolant through the first conduit cools the circuit board; a second conduit configured to convey a second flow of the coolant from a common inlet with the first conduit, wherein the second flow bypasses the first conduit; a valve configured to adjust a relative degree of flow of the coolant between the first conduit and the second conduit; and a controller configured to, based at least on data characterizing operation of the plurality of IC chips, control the valve to adjust a first flow rate of the coolant through the first conduit.

A thermal pad and an electronic device are disclosed for effectively dissipate heat of an electronic component. The thermal pad includes a first cover, a second cover, an elastic shell, and liquid metal. The elastic shell is bent and closed into a tubular structure. The first cover and the second cover are respectively mounted at two ends of the tubular structure to form a closed cavity. The closed cavity is configured to accommodate the liquid metal. Filling the liquid metal into the elastic shell implements good heat conduction effect by using high thermal conductivity of the liquid metal, and implements compression on the thermal pad during assembly of the thermal pad by using compressibility of the elastic shell, to reduce a thickness of the thermal pad.

According to various embodiments, a processing subsystem includes: a first printed circuit board (PCB) that includes an edge connector that is oriented perpendicular to a first coordinate axis and is located at a first level on the first coordinate axis, and a second PCB that is perpendicular to the first coordinate axis and located at a second level on the first coordinate axis, wherein the second level is different from the first level, and the second PCB has a topside on which a processor is mounted.

To provide a wiring circuit board capable of increasing rigidity of a wiring part in a thickness direction while allowing movement of the wiring part in a second direction.SOLUTION: The wired circuit substrate 1 includes a wired portion 3A and a supporting portion 3A supporting one end portion of the wired portion 2A. The interconnection part 3A includes a first insulating layer 12, an interconnection 133A, a metallic support layer 11, and a covering layer 15. The covering layer 15 has a first portion 151 covering the side S1 of the metallic support layer 11 and a second portion 152 covering the other side S2 of the metallic support layer 11 in the thickness direction. The thickness T12 of the second portion 152 is larger than the thickness T11 of the first portion 151.SELECTED DRAWING: Figure 2

A flow heater comprising a heating plate (6) comprising a metal plate (6a), a heating conductor (6b), and an insulating layer (6c) between the heating conductor (6b) and the metal plate (6a), a housing (1) in which the heating plate (6) is arranged, the housing (1) surrounding a flow channel for liquid to be heated, which leads from an inlet opening (2) of the housing (1) to an outlet opening (3) of the housing (1), a circuit board (8) with control electronics, and an electrical connector (10) via which the heating conductor (6b) of the heating plate (6) is connected to the control electronics and which has a plastic body (11; 11a, 11b) from which a conductor (12) protrudes and is embedded in the circuit board (8), characterized in that the heating plate (6) is connected between a terminal part (13) of the electrical connector (10) and a conductor (12) protruding from the plastic body. (11;11a, 11b) protruding end section (12b) of the conductor (12) is clamped, wherein the clamping element (13) is designed as a sheet metal separate from the conductor (12) and a first end section of the sheet metal of the clamping element (13) or sheets of the clamping element (13) rests against the heating plate (6) and a second end section of the sheet metal (13) or sheets of the clamping element (13) is arranged in the plastic body (11; 11a, 11b).

Power modules with enhanced thermal conductivity are disclosed herein. In certain embodiments, a power module includes a circuit board, an inductor component attached to a first or top side of the circuit board, and a semiconductor die attached to a second or bottom side of the circuit board opposite the first side. The power module further includes a thermally conductive wrap at least partially around a dielectric body of the inductor component. The thermally conductive wrap serves to transfer heat from the semiconductor die to a cold plate or heat sink that can be attached to the inductor component opposite the circuit board.

A surgical retractor comprising a blade having first and second opposing surfaces, and a handle extending from a proximal end of the blade, wherein the first surface of the blade includes a non-slip texture having a preferential grip in a first direction corresponding to direction of extraction of the surgical retractor from an incision and having a minimal or no grip in a second direction opposite to the first direction and in a third direction transverse to the first and second directions.

The invention relates to an electronic assembly (1), having - a main printed circuit board (2) and - a semiconductor component (28) arranged on the main printed circuit board (2), characterized by - a measuring printed circuit board (26) arranged in thermally conducting contact with the semiconductor component (28), and - a temperature sensor (16) arranged on the measuring printed circuit board (26) and configured to measure a temperature, on the basis of which a junction temperature (θ_J) of the semiconductor component (28) can be determined.

A printed circuit board includes a first build-up insulating layer; an interconnect structure buried in an upper side of the first build-up insulating layer and including one or more insulating layers, one or more wiring layers, and one or more via layers; an adhesive disposed between an upper surface of the first build-up insulating layer and an upper surface of the interconnect structure, and having an upper surface exposed from the upper surface of the first build-up insulating layer; and a metal bump including a via portion penetrating the adhesive and a protrusion protruding to the upper surface of the adhesive.

The present invention relates to a printed circuit board comprising an inlay to enable simplified, robust, and cost-effective mounting of a printed circuit board (PCB) on a substrate, in particular a heat sink. Furthermore, a lighting module, in particular an interchangeable lighting module, for a motor vehicle is provided, which comprises such a printed circuit board mounted on a substrate.

The present disclosure relates to the technical field of circuit boards, and provides a method for manufacturing a chip-embedded circuit board, and a chip-embedded circuit board. The method for manufacturing a chip-embedded circuit board includes: providing a mounting recess in a pre-manufactured circuit board; embedding a chip packaging unit in the mounting recess such that upper and lower surfaces of the chip packaging unit are flush with upper and lower surfaces of the pre-manufactured circuit board, respectively; and forming an electrode lead-out structure on the upper surface of the pre-manufactured circuit board by: stacking a dielectric layer and a conductive layer on the upper surface of the pre-manufactured circuit board, providing through holes in the dielectric layer and the conductive layer to expose electrodes of the chip packaging unit, and filling the through holes with a conductive material to form electrode leads of the chip packaging unit; and providing slots in a back surface of the chip packaging unit to form heat dissipation fins in such a way that the heat dissipation fins are flush with the lower surface of the pre-manufactured circuit board. The manufacturing method of the present disclosure can manufacture a chip-embedded circuit board with a robust structure that meets the operational performance and the heat dissipation performance.

The invention discloses a heat dissipation piece and an electronic device. The heat dissipation piece comprises a body and a matching part, the body comprises a heat dissipation area and a contact area, the contact area is connected to the heat dissipation area, and the contact area is configured to abut against the heat conduction piece and be attached to the heat conduction piece. The matching part is arranged on the body and is configured to reduce the pressure of the heat dissipation piece on the heat conduction piece when the contact area abuts against the heat conduction piece. According to the heat dissipation piece and the electronic device, due to the arrangement of the matching part, it can be ensured that when the contact area abuts against the heat conduction piece, the contact area makes close contact with the heat conduction piece, the heat transfer performance between the contact area and the heat conduction piece is improved, and the pressure applied to the heat conduction piece by the heat dissipation piece can be reduced when the contact area abuts against the heat conduction piece; therefore, the pressure applied to the heat dissipation target by the heat conduction piece can be reduced, the possibility that the heat dissipation target is damaged due to stress extrusion of the heat conduction piece is reduced, the service life of the circuit board is prolonged, the use performance of the heat dissipation target is guaranteed, and the working stability and reliability of the circuit board are improved.

A power module and an auxiliary supporting device adapted thereto are provided. The auxiliary supporting device is used to maintain a first circuit board in a vertical state on a second circuit board. The auxiliary supporting device includes a first plate and a second plate. The first plate is parallel to and fixed to the first circuit board. The second plate is extended from the first plate in a direction away from the first circuit board. A bottom edge of the second plate is disposed on a surface of the second circuit board facing the first circuit board. The auxiliary supporting device is universally suitable for different combinations between the first plate and the second plate without the need of customized tool.

The invention relates to a printed circuit board comprising a heating circuit formed from conductor tracks, and to a heater comprising such a printed circuit board.

The present invention discloses a circuit board structure comprising: a first cavity having a horizontal cross-section size of S1 and a vertical depth of h1; a second cavity having a horizontal cross-section size of S2 and a vertical depth of h2; a T-shaped copper coin comprising a SMALL PART inserted into the first cavity and a BIG PART inserted into the second cavity; a first step groove having a width Δr and a depth Δh (Δh<h1) formed along an upper inner wall perimeter of the first cavity; a second step groove having a width Δr and a depth Δh (Δh<h2) formed along a lower inner wall perimeter of the second cavity; and a sealing material sealed in the first step groove and second step groove, and an air drain hole connecting a gap formed in the second cavity on a horizontal plane of the BIG PART.

An apparatus for retrofitting a HID lighting system includes using existing components of previously installed HID lighting systems such as its ballasts while replacing some capacitors to adjust the power supplied to a retrofit LED luminaire. Unused ballast drivers are removed, and a self-contained ballast driver assembly is mounted into the electronic control enclosure of the previously installed lighting system. Some of the retrofit LED luminaires include an uplighting lens, an optic, or a diffuser for providing uplight. An aiming bracket and an aiming plate allow for the horizontal aiming angle of a light luminaire to be set.

To provide technology that can achieve high heat dissipation performance with a simple configuration. [Solution] The electronic device 1 comprises a housing 3, a circuit board 5 disposed inside the housing 3, and a package component 45 mounted on the circuit board 5. The package component 45 comprises an interposer 7 and a chip 9 and stiffener 11 disposed on the interposer 7. A heat sink 13 is provided between the chip 9 and the housing 3. A compressible heat dissipation material 53 is provided between the chip 9 and the heat sink 13. The stiffener 11 and the heat sink 13 are joined together with an adhesive that shrinks when cured.

To provide a ceramic copper circuit board using a Ag-free brazing filler metal layer, wherein the brazing filler metal layer of the ceramic copper circuit board includes a protruding part, and a semiconductor device using the same.SOLUTION: A ceramic copper circuit board according to the embodiment includes a ceramic substrate, and a plurality of copper circuit parts bonded respectively via brazing filler metal layers on at least one surface of the ceramic substrate. The brazing filler metal layer does not contain Ag and contains Cu, Ti, and one or two kinds selected from Sn and In. The brazing filler metal layer includes a junction provided between the ceramic substrate and the copper circuit part, and a first protruding part provided around the junction and having a titanium content in the range of 70 mass% or more and 100 mass% or less. When the thickness of the copper circuit part is D and the shortest distance between adjacent copper circuit parts is P, the thickness D of the copper circuit part is 0.1 mm or more, and a region satisfying 1≤P / D≤3 is included.SELECTED DRAWING: Figure 1

The present invention discloses a chip encapsulation structure (E) comprising a ceramic substrate (1), a copper structure (2), a precious metal layer (3), a chip (3a), and an encapsulation adhesive (4). The copper structure (2) is formed on the ceramic substrate (1), with a recessed recess (2c) being formed on at least one side wall (2a) of the copper structure (2). The precious metal layer (3) is formed on the copper structure (2). The chip (3a) is arranged on the precious metal layer (3). The encapsulation adhesive (4) is formed on the ceramic substrate (1) and encapsulates the copper structure (2), the precious metal layer (3), and the chip (3a).A surface treatment layer (2b) is formed on the exposed copper surface of the copper structure (2), which is not in contact with the ceramic substrate (1) and the precious metal layer (3). The encapsulation adhesive (4) is in contact with the surface treatment layer (2b) and thus bonds with the copper structure (2). The surface treatment layer (2b) extends over the inner surface of the recess (2c), while the encapsulation adhesive (4) also fills and engages with the recess (2c).

The disclosure relates to a substrate package that effectively supports signal routing for high data rate applications. An apparatus includes a substrate having a first side and a second side, where the first side is opposite the second side. The apparatus also includes a die positioned on the second side of the substrate and electrically coupled to the substrate. The apparatus includes a signal routing component positioned on a first side of the substrate. The signal routing component is configured to route a signal between the die and the external component through the substrate to the device. The apparatus includes a circuit board positioned on the second side of the substrate. The circuit board is electrically coupled to the substrate.

The application belongs to the field of gateway, and particularly relates to a multifunctional intelligent gateway based on AIoT technology, which comprises a box body, a box cover, a circuit board and a sound collector. The multifunctional intelligent gateway has the advantages that the heat dissipation fin is used to cool the heat conduction plate II, the heat conduction plate II is in contact with the chip on the circuit board, the heat conduction plate II absorbs the heat generated by the chip, and then the chip on the circuit board is cooled, so that the service life of the chip is guaranteed, the performance decline or burning of the chip caused by the excessively high operating temperature of the chip is avoided, the hot air is guided to each position in the box body, the air in the box body is heated, the damage of the electronic components caused by the condensation in the box body is avoided, the normal operation of the chip on the circuit board is not affected, the important element, i.e. the chip, in the gateway cannot be cooled, the working temperature of the chip in the gateway is excessively high, the service life of the chip is affected, and the chip is even burned due to overheating.

A ceramic circuit board according to an embodiment includes a ceramic substrate and a metal circuit. The metal circuit is bonded to a first surface of the ceramic substrate via an active metal brazing material layer. A thickness of the metal circuit is not less than 1 mm. The metal circuit has a through-hole extending through the metal circuit along a first direction perpendicular to the first surface. A portion of the first surface overlaps the through-hole in the first direction. The active metal brazing material layer is present at the portion of the first surface.

The invention discloses a three-dimensional multilayer circuit board and a production process thereof, the circuit board comprises a power supply mainboard and high-frequency transformer winding integrated press-fit structure and a thick copper circuit layer, the power supply mainboard and the high-frequency transformer winding are both PCBs with at least two layers, the high-frequency transformer winding forms a three-dimensional structure through pre-forming processing, and the thick copper circuit layer is arranged between the high-frequency transformer winding and the power supply mainboard. The circuit alignment tolerance is controlled within 100 [mu] m, and copper foils or / and copper plates are laminated on the upper surface and the lower surface of the integrated structure to form thick copper circuit layers. According to the invention, integration of the two parts is realized, assembly gaps are eliminated, volume power density is improved, accurate butt joint of lines is guaranteed, stability and reliability are improved, large-current bearing capacity is enhanced, conversion efficiency is improved, heat resistance is reduced through thick copper heat dissipation, conversion energy efficiency is improved, electromagnetic shielding performance is optimized, interference is reduced, and copper usage amount is reduced. And the assembly process is simplified and the cost is reduced.