4315results about "Circuit thermal arrangements" patented technology

The invention discloses a circuit board heat management optimization method combined with quantum computing, which comprises the following steps of: predicting heat flow distribution of each heat source on a circuit board through a quantum optimization algorithm, identifying a potential overheat area, allocating cooling resources in advance, and determining whether the circuit board is abnormal or not according to a local temperature abnormal condition. A quantum gate control algorithm is adopted to adjust the conduction path and rate of heat, redundant heat is guided to a low-temperature area so as to avoid heat accumulation, the system monitors the temperature change and power consumption fluctuation of a circuit board in real time, parameters of cooling equipment are dynamically adjusted according to a feedback result, the redundant heat is converted into electric energy through a heat energy recovery device and stored, and the cooling efficiency is improved. When the power consumption is low, the heat flow is released to balance the overall heat flow of the circuit board and prolong the service life of equipment. The invention aims to realize more efficient heat dissipation management through a quantum algorithm.

An apparatus includes: at least one of a circuit board or a substrate; and a first structure attached to the at least one of a circuit board or a substrate. The first structure is configured to enable an optical module with connector to be removably coupled to the first structure, and the optical module with connector is configured to enable an optical fiber connector to be removably coupled to the optical module with connector. For example, the circuit board or the substrate includes first electrical contacts, the first structure includes walls that define a first opening, the walls also define one or more retaining mechanisms such that when the optical module with connector is inserted into the first opening, the one or more retaining mechanisms on the walls of the first structure engage one or more latch mechanisms on the optical module with connector to secure the optical module with connector to the first structure, and second electrical contacts on the optical module with connector are electrically coupled to the first electrical contacts on the circuit board or the substrate.

The embodiment of the invention discloses an embedded substrate, a power supply device and electronic equipment. The embedded substrate comprises a front surface first adding layer jointed with the first surface of the core part maintaining body, a conduction structure electrically connected with a circuit layer of the dielectric layer is arranged in the dielectric layer of the front surface first adding layer, and the conduction structure comprises a first conduction structure electrically connected with a bonding pad on the chip; the dielectric layer of the first additional layer on the front side is made of an exposable and developable material, an open pore for constructing the conduction structure is formed through exposure and development, the open window of the outer protection layer has a first projection on the first surface, the first open pore for constructing the first conduction structure has a second projection on the first surface, and the second projection covers the first projection. Through the arrangement, the first conduction structure with a larger through-flow cross section is constructed and formed by utilizing the windowing size of the chip side, so that the through-flow capability is effectively improved, and the heat conduction capability is high. In addition, the bonding stress between the circuit layer and the front surface of the chip can be reduced, the layering risk is reduced, and the reliability is better.

The invention relates to the technical field of printed embedded PCBs, and discloses an embedded PCB and a manufacturing method thereof.The embedded PCB comprises a daughter board, a first dielectric layer and a first circuit layer which are sequentially arranged in a stacked mode in the first direction, a device is embedded in the daughter board, the device is located on the side, close to the first dielectric layer, of the daughter board, and the first dielectric layer is located on the first circuit layer. One side, close to the first dielectric layer, of the device is provided with a first part, and the first part is provided with a first protection part; a first connection hole is formed in the first dielectric layer, a first conductive part is filled in the first connection hole, the first protection part is connected and electrically conducted with the first conductive part, and the first conductive part is connected and electrically conducted with the first circuit layer. The embedded PCB and the manufacturing method thereof provided by the invention are used for improving the problem of poor hole filling in the electroplating hole filling process in the related technology.

Disclosed in the present invention is a packaging structure of a half-bridge power module. The packaging structure comprises an insulating and thermal conductive plate, a multi-layer circuit board, a plastic package body and a bridge arm switch. Further disclosed in the present invention is the use of a packaging structure of a half-bridge power module in an OBC power source converter, a DCDC isolated converter, a non-isolated power source converter, a cardiac arrest awakening apparatus, and a circuit module formed by means of combining multiple half bridges such as ANPC, TNPC and Heric. Further disclosed in the present invention is a manufacturing method for a packaging structure of a half-bridge power module. The method comprises: performing assembling; providing an overflow region; and synchronously performing filling and grinding to remove the overflow region. In the present invention, a minimum size and a low impedance are achieved by means of DBC, flexible pin leading-out and welding are realized by means of a PCB, the reliability, safety and heat dissipation of modules are supported by means of a plastic packaging body, and the extension of a temperature monitoring unit and a decoupling capacitor is supported.

Tamper-detect assemblies and methods of fabrication are provided. A tamper-detect assembly includes a laminate carrier with embedded tamper-detect circuitry within the laminate carrier, and one or more electronic components on the laminate carrier. Further, the tamper-detect assembly includes a heat sink cover. The heat sink cover includes a heat sink and tamper-detect circuitry integrated within the heat sink cover. The heat sink cover is mounted to the laminate carrier and encloses the one or more electronic components between the laminate carrier and the heat sink cover. Together, the embedded tamper-detect circuitry of the laminate carrier and the integrated tamper-detect circuitry of the heat sink cover define, at least in part, a secure volume about the one or more electronic components.

A rack system for use, e.g., in data centers is disclosed. The rack system includes a rack frame and a rack-mounted assembly, including an electronic device disposed within the rack-mounted assembly, the electronic device including a heat-generating component. The heat-generating component is in thermal contact with a liquid cooling block through which a channelized cooling fluid is conveyed. The electronic device is immersed in a dielectric immersion cooling liquid. The rack-mounted assembly includes a non-sealed immersion case in which the electronic device is immersed in the dielectric immersion cooling liquid, the non-sealed immersion case configured to permit the rack-mounted assembly to be individually inserted into or removed from the rack frame. Also disclosed are container-based data center modules based on the disclosed rack system, and a data center using numerous such container-based modules.

The present disclosure relates to a ceramic substrate unit and a manufacturing method therefor, which can suppress warpage due to a difference between the volumes of upper and lower metal layers in a ceramic substrate by calculating the volume of the upper metal layer and forming a plurality of grooves in the lower metal layer to have a predetermined volume corresponding to the volume of an upper electrode.

A device includes a package body including a central flange and an amplifier module mounted to the central flange of the surface-mount device. The amplifier module includes a module substrate mounted to the central flange. The module substrate includes a first die mount window, a first circuitry on a first surface of the module substrate, a second circuitry on the first surface of the module substrate, and a first amplifier die mounted on the central flange. The first amplifier die is at least partially disposed within the first die mount window and the first amplifier die is electrically connected to the first circuitry and the second circuitry. The first circuitry is electrically connected to a first lead of the package body and the second circuitry is electrically connected to a second lead of the package body.

The invention relates to the technical field of thermal simulation, in particular to a thermal simulation method and system of a circuit board and the circuit board. The method comprises the following steps: acquiring circuit board design data and modeling to obtain a circuit board three-dimensional structure model; performing precision estimation according to the circuit board design data to obtain circuit board thermal simulation precision data; dividing the circuit board three-dimensional structure model according to the circuit board thermal simulation precision data to obtain circuit board assembly grid data; performing physical attribute assignment on the circuit board assembly grid data according to the circuit board design data to obtain physical grid unit data; performing circuit board thermal simulation according to the physical grid unit data to obtain circuit board thermal simulation data; and visualizing the thermal simulation data of the circuit board to obtain a thermal stress distribution diagram, and performing circuit board assembly design optimization on the three-dimensional structure model of the circuit board according to the thermal stress distribution diagram to obtain an optimized three-dimensional structure model of the circuit board. The heat management capability of the circuit board can be effectively improved.

The invention provides a multilayer circuit board and a processing method thereof, a chip system and electronic equipment, and the processing method comprises the steps: processing a second hole channel, a first conductive pattern and a second conductive pattern on a first substrate, and processing a third hole channel on a second substrate; the first substrate, the second substrate and the first insulating layer are stacked, pressed and fixed; the processing method further comprises the following steps: carrying out electroplating hole filling on the first substrate to form a second conductive channel; the processing method further comprises the steps that the second substrate is electroplated so that a sixth conductive pattern and a third conductive channel can be formed, the first insulating layer comprises a first conductive part, and the first conductive pattern, the second conductive pattern and the sixth conductive pattern are electrically connected with the second conductive channel through the third conductive channel and the first conductive part. The second hole channel and the third hole channel are filled in an electroplating hole filling mode, so that the wiring density and the chip signal transmission capability of the multilayer circuit board are improved, and the electrical performance and the thermal performance of the multilayer circuit board are improved; electroplating hole filling is suitable for mass production, and the process yield is stable.

An embedded substrate, a power supply apparatus, and an electronic device. The embedded substrate comprises a front first additional layer, which is joint with a first surface of a chip holding body, wherein a conduction structure which is electrically connected to a circuit layer of the front first additional layer is provided in a dielectric layer of the front first additional layer, the conduction structure comprising a first conduction structure electrically connected to a pad on a chip; the dielectric layer of the front first additional layer is made of an exposable and developable material, and openings for constructing the conduction structure are formed by means of exposure and development; and a window of an outer protection layer has a first projection on the first surface, a first opening for constructing the first conduction structure has a second projection on the first surface, and the second projection covers the first projection. By means of such arrangements, a first conduction structure having a relatively large through-flow section is constructed by using the size of a window on a chip side, thereby effectively improving a through-flow capability, and achieving a good thermal conductivity capability. In addition, the joining stress between a circuit layer and the front surface of the chip can be reduced, thereby lowering the risk of delamination, and providing relatively good reliability.

A heat sink component can include a body including a thermally conductive material that is electrically non-conductive, a lower conductive layer formed over a bottom surface of the body and electrically connected with the ground plane layer, and an upper conductive layer formed over a top surface of the body. The heat sink component can have a length in an X-direction that is parallel with the top surface of the body and a thickness in a direction perpendicular to the top surface. A ratio of the length to the thickness can be greater than about 7.

To provide a ceramic board which has good heat dissipation, and in which an integration density is high.SOLUTION: According to an embodiment, the present invention discloses a manufacturing method of an ultrathin high-density multilayer interconnection ceramic board, containing steps of: preparing a ceramic wafer, performing a laser punching to the ceramic wafer, and forming a via hole; performing a vacuum magnetron sputtering to the ceramic wafer, and forming a seed titan layer and a copper layer onto a front surface of the ceramic wafer and on a wall of the via hole by the sputtering; manufacturing a ceramic double-layer core plate; manufacturing a multilayer substrate; manufacturing a vertical interconnection multilayer substrate; and manufacturing a high-end multilayer HDI ceramic board. The multilayer ceramic plate manufactured in the above mentioned processing can be easily processed as compared with LTCC and HTCC, and an energy consumption amount for the processing is deteriorated. A heat conductivity of a finished product is improved. A wiring is more accurate; a conductive resistance is low; and a signal transmission loss is low.SELECTED DRAWING: Figure 1

Embodiments of the present application relate to the technical field of heat dissipation of chips, and provide a circuit board, a circuit board assembly, and a computer device, used for dissipating heat of an electronic device, and having a simple structure. The circuit board comprises: a first circuit substrate, comprising a first wiring layer and a first electrically conductive column, the first electrically conductive column being electrically connected to the first wiring layer, and the first electrically conductive column being led out to a first side of the first circuit substrate; a first heat dissipation plate, stacked on a second side of the first circuit substrate, the second side being the opposite side of the first side; and a heat dissipation column, connected to the first heat dissipation plate and passing through a first through hole on the first circuit substrate so as to extend to the first side of the first circuit substrate. The circuit board provided by the embodiments of the present application has a simple structure, and can dissipate heat for chips of different heights at the same time.

A cooler includes a plurality of protrusions disposed on a top plate surface of a top plate, protruding in a depth direction toward a bottom plate surface of a bottom plate in a flow path of refrigerant formed between the top plate surface and the bottom plate surface, and including first and second protrusions that are spaced apart from each other in a flowing direction in which the refrigerant flows in the flow path, a frame connecting the top plate to the bottom plate and having wall surfaces surrounding the plurality of protrusions, and a wall disposed on the bottom plate surface and protruding in the depth direction, between the first and second protrusions. The wall is respectively connected to a pair of the wall surfaces at opposite ends thereof in a width direction orthogonal to the flowing direction. The wall is spaced apart from the top plate surface.

The invention discloses a GaN high-power device heterogeneous integrated T / R assembly based on an embedded flow channel, which belongs to the field of phased array radar T / R assemblies and comprises a packaging shell, an LTCC (Low Temperature Co-Fired Ceramic) substrate, a PCB (Printed Circuit Board) substrate, a radio frequency coaxial connector, a low-frequency connector, a power supply modulation circuit, a beam driving control circuit and a transceiving channel circuit, the T / R assembly comprises four transceiving channels, and the working frequency band of the T / R assembly is 2GHz-6GHz; a transmitting channel chip of the T / R assembly comprises a radio frequency driving amplifier chip and a final-stage radio frequency power amplifier chip; a receiving channel chip of the T / R assembly comprises a radio frequency amplitude-limiting low-noise multifunctional chip. A common part chip of the T / R assembly comprises a wave control driver chip, a radio frequency multifunctional chip, a radio frequency switch chip and a power divider chip. The T / R assembly can be widely applied to a phased array radar system with the frequency band of 2GHz-6GHz, and the thermal management requirement of the system is ensured while high performance is realized.

The invention provides a preparation process of a circuit board with an embedded copper core aluminum nitride ceramic high-heat-dissipation module. The preparation process comprises the following steps: carrying out first milling and cutting treatment on a plurality of first core plates; pre-stacking the plurality of first core boards, the plurality of second core boards, the plurality of first PP resin layers, the plurality of second PP resin layers and the third PP resin layers to obtain a multi-layer core board group; after the embedded copper core aluminum nitride ceramic high-heat-dissipation module is embedded into the semi-buried groove, the multi-layer core plate set is subjected to pressing treatment; drilling the laminated multi-layer core board group to form a conductive through hole in the multi-layer core board group; carrying out metallization treatment on the multi-layer core board group after the drilling treatment; and performing line manufacturing processing on the multi-layer core board group after metallization processing to obtain the circuit board embedded with the copper core aluminum nitride ceramic high-heat-dissipation module.

The embodiment of the invention provides a chip heat dissipation assembly and a vehicle, relates to the technical field of heat dissipation, and is used for reducing the stress borne by a chip while improving the heat dissipation capability of the chip heat dissipation assembly. The chip heat dissipation assembly comprises a circuit board, a chip, a heat dissipation structure and a heat-conducting medium. The chip is located on the circuit board. The heat dissipation structure covers the side, away from the circuit board, of the chip and is connected with the circuit board. The heat dissipation structure comprises a heat dissipation plate, a surrounding part and a boss part. The surrounding part and the boss part are located on the side, close to the chip, of the heat dissipation plate. The enclosure part and the boss part are both connected with the heat dissipation plate, and the enclosure part is arranged around the boss part; a closed space is defined by the heat dissipation plate, the enclosure part, the boss part and the chip, and a gap is formed between the boss part and the chip. The closed space is filled with the heat-conducting medium, the heat-conducting medium is in a solid state at a first temperature and is in a liquid state at a second temperature, and the second temperature is higher than the first temperature. The chip heat dissipation assembly is applied to a vehicle so as to improve the heat dissipation capacity of a chip in the vehicle.

The invention discloses an integration and optimization method of a multilayer circuit board in a photovoltaic inverter, and the method comprises at least seven layers of functional stacked structures which are an electromagnetic shielding layer, a power device layer, a first insulating dielectric layer, a control circuit layer, a second insulating dielectric layer, a heat dissipation substrate layer and a mechanical strengthening layer from top to bottom in sequence. Wherein the power device layer adopts a three-dimensional embedded packaging technology to integrate an IGBT module and a SiC MOSFET module, and a gate drive circuit of the power device layer is embedded into a first insulating dielectric layer in a coplanar waveguide structure; the heat dissipation substrate layer is provided with a micro-channel array with gradient apertures, and the inner wall of each micro-channel is subjected to anodic oxidation treatment to form an Al2O3 ceramic layer with the thickness of 20-50 microns.

The invention discloses a preparation process of a high-thermal-conductivity composite substrate, and the process comprises the steps: fixing a pre-prepared skeleton on an insulating base layer, and enabling branches of the skeleton and the surface of the insulating base layer to jointly define a plurality of heat dissipation spaces; dividing the plurality of heat dissipation spaces into at least one high heat dissipation space and at least one low heat dissipation space according to the layout and heating characteristics of a predetermined electronic component; a first heat-conducting filler is injected into the high-heat-dissipation space, a second heat-conducting filler is injected into the low-heat-dissipation space, curing treatment is conducted, the heat conductivity coefficient of the first heat-conducting filler is larger than that of the second heat-conducting filler, and the first heat-conducting filler and the second heat-conducting filler are combined with the framework to form a heat-conducting layer; a functional layer of the printed circuit board is fixed on the surface of the heat conduction layer, the area, corresponding to the high-heat-dissipation space, of the functional layer is used for installing high-heat-dissipation electronic elements, and the area, corresponding to the low-heat-dissipation space, of the functional layer is used for installing low-heat-dissipation electronic elements According to the technical scheme, different heat conduction measures can be adopted for different heating elements.

The invention belongs to the field of microwave heating, and discloses a solid-state microwave source which comprises a circuit board and a radio frequency connector connected with the circuit board, a heating element is arranged on the circuit board and connected with a first heat dissipation component through a heat sink, and one side, away from the first heat dissipation component, of the circuit board is detachably connected with a cover plate. An installation step is arranged on the surface of the first heat dissipation component and extends to at least one side edge of the first heat dissipation component, the heat sink is arranged in the installation step, and a second heat dissipation component is fixedly connected in the installation step and outside the side edge of the heat sink. The heat sink is arranged on the surface of the heat dissipation component through an open type step structure, the heat dissipation effect is further enhanced, a heating component and a radio frequency load which are prone to damage can be independently pulled out under the condition that a cover plate is not opened, replacement is more convenient, repeated work of secondary melting of welding spots to release stress is avoided, and the service life of the heat sink is prolonged. And the microwave oven is better in safety performance, free of maintenance, long in service life and suitable for microwave generation.

A thermally conductive interposer includes an interposer substrate having a first substrate surface and a second substrate surface. The first substrate surface being configured to be attached to a first device component. The second substrate surface being configured to be attached to a second device component. The interposer substrate being configured to support the second device component on the first device component and integrate the first device component and the second device component within a microelectronic device. Further, the interposer substrate is configured to transfer heat between the first device component and the second device component; and the interposer substrate is configured to be electrically nonconductive.

A method of forming a heat spreader on a printed circuit board (PCB) having a power dissipating component operably coupled to the heat spreader, comprising attaching a thermally and electrically conductive structure to a first side of the PCB to define a first PCB region including the component and a second PCB region not including the component. The underside of the component is underfilled to electrically insulate its solder contacts. A first protective layer is applied to the second region of the PCB. A conductive plating film is deposited on the first region, the second region, and the structure. A second protective layer is applied over the portion of the conductive plating film covering the second region, leaving the remaining portion of the conductive plating film exposed. An electrically conductive and thermally conductive layer is electroplated onto the exposed region of the conductive plating film to form a heat exchanger in the first region.

The invention relates to the technical field of printed circuit boards, and discloses a circuit board structure and a preparation method thereof, and the circuit board structure comprises a copper seat, the top of which is provided with a first groove; a chip, wherein the chip is arranged in the first groove; the ceramic substrate layer is arranged at the bottom of the copper seat, and the shape of the cross section of the ceramic substrate layer is the same as that of the bottom surface of the copper seat; the copper plate layer is arranged at the bottom of the ceramic substrate layer, and the shape of the cross section of the copper plate layer is the same as that of the cross section of the ceramic substrate layer. The ceramic substrate layer and the copper plate layer are sequentially arranged at the bottom of the copper base, the thermal resistance of the chip during working can be remarkably reduced, the overall heat dissipation performance can be improved, the cross sections of the ceramic substrate layer and the copper plate layer are consistent with the bottom surfaces of the copper base and the copper plate layer in shape, and the layers are high in structural fitting degree, uniform in stress distribution and good in plate thickness consistency after lamination; and the warping problem of the copper seat caused by thermal expansion is effectively reduced.

The embodiment of the invention provides a packaging assembly and electronic equipment, and relates to the technical field of electronic equipment. The packaging assembly of the electronic equipment is installed on a circuit board of the electronic equipment, and by arranging a heat conduction column with one end being in heat conduction with a heat dissipation device and the other end being in heat conduction with a chip, close to the circuit board, in the packaging assembly, the chip, close to the circuit board, in the packaging assembly can transmit heat to the heat dissipation device for heat dissipation through the heat conduction column. In this way, the heat dissipation efficiency of the chip close to the circuit board in the packaging assembly is high, and the heat dissipation efficiency of the whole packaging assembly can be improved.

The invention provides a single board, a single board assembling method and communication equipment, and belongs to the technical field of communication. The single board comprises a main chip module, basic configuration, an interface device and a first circuit board. The main chip module comprises a main chip and a second circuit board, and the main chip is located on the surface of the second circuit board; the number of the first circuit board is at least one, and the basic configuration and the interface device are located on the surface of the at least one first circuit board; the main chip is electrically connected with the basic configuration and the interface device. According to the invention, resource waste can be reduced, and the cost of the single board is reduced.

The embodiment of the utility model provides a circuit board assembly and electronic equipment, and relates to the technical field of chips, the circuit board assembly comprises a circuit board, an electronic device, a shielding structure and a heat dissipation structure, the electronic device is arranged on the circuit board, the shielding structure is arranged on the circuit board, and a through opening is formed in the position, opposite to the circuit board, of the shielding structure; at least part of the heat dissipation structure covers the through opening, the heat dissipation structure and the shielding structure form a shielding cover, and the shielding cover covers the electronic device. According to the circuit board assembly provided by the invention, when the height of the electronic device is increased, the height of the shielding cover does not need to be increased, the height of the shielding cover is reduced, the occupied space in the electronic equipment is reduced, and further thinning of the electronic equipment is facilitated. The heat dissipation structure is used as a part of the shielding cover, so that the heat dissipation structure can dissipate heat of the electronic device and can also achieve the electromagnetic shielding function of the electronic device, and functional diversification of the heat dissipation structure is achieved.

The invention discloses a high-thermal-conductivity circuit board copper block embedding device, relates to the field of circuit board production, and solves the problem that an existing circuit board copper block embedding device is easy to cause glue overflow, the high-thermal-conductivity circuit board copper block embedding device comprises a device base and a placement seat fixedly mounted at the top of the device base, and a first circuit board is arranged at the top of the placement seat; a first circuit board is arranged at the top of the placement seat, a second circuit board is arranged at the top of the first circuit board, a copper block body is arranged between the first circuit board and the second circuit board, a mounting disc is slidably mounted on the outer side of the placement seat, and four scraping plates in central symmetry are arranged at the top of the mounting disc; the glue scraping mechanism is used for cleaning glue overflowing from the outer sides of the first circuit board and the second circuit board, and the glue scraping mechanism is mounted at the top of the mounting disc; through the glue scraping mechanism, glue overflowing from caulking grooves in the outer sides of the first circuit board and the second circuit board is scraped and cleaned through the four scrapers, and therefore the effect of rapid glue removal is achieved.

Heat exchangers on edges of circuit boards are disclosed. An apparatus includes: a housing including an outlet for air flow; a circuit board; and a heat exchanger extending along an edge of the circuit board. The heat exchanger includes a first side and a second side opposite the first side. The first side faces away from the outlet, and the second side faces toward the outlet. The edge of the circuit board is closer to the second side of the heat exchanger than the edge is to the first side of the heat exchanger.