2224results about "Circuit thermal arrangements" patented technology

The invention relates to the technical field of printed embedded PCBs, and discloses an embedded PCB and a manufacturing method thereof.The embedded PCB comprises a daughter board, a first dielectric layer and a first circuit layer which are sequentially arranged in a stacked mode in the first direction, a device is embedded in the daughter board, the device is located on the side, close to the first dielectric layer, of the daughter board, and the first dielectric layer is located on the first circuit layer. One side, close to the first dielectric layer, of the device is provided with a first part, and the first part is provided with a first protection part; a first connection hole is formed in the first dielectric layer, a first conductive part is filled in the first connection hole, the first protection part is connected and electrically conducted with the first conductive part, and the first conductive part is connected and electrically conducted with the first circuit layer. The embedded PCB and the manufacturing method thereof provided by the invention are used for improving the problem of poor hole filling in the electroplating hole filling process in the related technology.

A cooler includes a plurality of protrusions disposed on a top plate surface of a top plate, protruding in a depth direction toward a bottom plate surface of a bottom plate in a flow path of refrigerant formed between the top plate surface and the bottom plate surface, and including first and second protrusions that are spaced apart from each other in a flowing direction in which the refrigerant flows in the flow path, a frame connecting the top plate to the bottom plate and having wall surfaces surrounding the plurality of protrusions, and a wall disposed on the bottom plate surface and protruding in the depth direction, between the first and second protrusions. The wall is respectively connected to a pair of the wall surfaces at opposite ends thereof in a width direction orthogonal to the flowing direction. The wall is spaced apart from the top plate surface.

The invention relates to the technical field of printed circuit boards, and discloses a circuit board structure and a preparation method thereof, and the circuit board structure comprises a copper seat, the top of which is provided with a first groove; a chip, wherein the chip is arranged in the first groove; the ceramic substrate layer is arranged at the bottom of the copper seat, and the shape of the cross section of the ceramic substrate layer is the same as that of the bottom surface of the copper seat; the copper plate layer is arranged at the bottom of the ceramic substrate layer, and the shape of the cross section of the copper plate layer is the same as that of the cross section of the ceramic substrate layer. The ceramic substrate layer and the copper plate layer are sequentially arranged at the bottom of the copper base, the thermal resistance of the chip during working can be remarkably reduced, the overall heat dissipation performance can be improved, the cross sections of the ceramic substrate layer and the copper plate layer are consistent with the bottom surfaces of the copper base and the copper plate layer in shape, and the layers are high in structural fitting degree, uniform in stress distribution and good in plate thickness consistency after lamination; and the warping problem of the copper seat caused by thermal expansion is effectively reduced.

Heat exchangers on edges of circuit boards are disclosed. An apparatus includes: a housing including an outlet for air flow; a circuit board; and a heat exchanger extending along an edge of the circuit board. The heat exchanger includes a first side and a second side opposite the first side. The first side faces away from the outlet, and the second side faces toward the outlet. The edge of the circuit board is closer to the second side of the heat exchanger than the edge is to the first side of the heat exchanger.

The invention provides an embedded substrate and a manufacturing method thereof. The manufacturing method specifically comprises the following steps: forming a conduction copper column and a shielding copper column on a first circuit layer of the substrate; pressing a second dielectric layer on the first circuit layer, the conduction copper column and the shielding copper column; mounting a component on the second dielectric layer; pressing the component into the second dielectric layer to enable the shielding copper column and the first circuit layer to surround the component; pressing a fourth dielectric layer on the second dielectric layer and the component, and curing the second dielectric layer and the fourth dielectric layer; forming an outer circuit layer on the fourth dielectric layer; and the outer circuit layer is in conducting connection with the conducting copper column, the shielding copper column and the terminal of the component. The shielding copper columns can reduce the deviation of the component in the extrusion process of the component and improve the yield, five surfaces of the embedded component are all provided with metal copper, and a good electromagnetic shielding effect can be achieved. Moreover, the second dielectric layer and the fourth dielectric layer are made of high-thermal-conductivity materials, so that heat can be quickly guided into the shielding copper columns, and the heat dissipation effect is obviously improved.

The described apparatus can include a printed circuit board having a first side that includes an integrated circuit and a second side that is opposite the first side and that includes one or more power delivery components. The apparatus can additionally include a cooling system positioned to cool the one or more power delivery components located on the second side of the printed circuit board. Various other methods and systems are also disclosed.

A controller includes a circuit board, and a module assembly arranged at the circuit board. The module assembly includes a first power module, a second power module, and a third power module. The circuit board includes a first current circuit connected to the first power module, a second current circuit connected to the second power module, and a third current circuit connected to the third power module. The first current circuit and the second current circuit share one or more circuit components.

Presented herein is a corrosion inhibitor dispensing system that provides for the in-situ application of a corrosion inhibitor in order to protect internal elements of an apparatus from corrosion. In one example, an apparatus is provided that may include a housing to contain one or more electronic components. The housing includes air inflow ports configured to limit internal air from exiting the housing during a corrosion inhibitor dispensing processes, air outflow ports configured to limit external air from entering the housing during the dispensing process, and one or more fans to direct airflow for the housing. The apparatus further includes a corrosion inhibitor dispensing system that includes a dispensing container to hold a corrosion inhibitor in a non-vaporized state and includes one or more ports for dispensing the corrosion inhibitor in a vaporized state during the corrosion inhibitor dispensing processes. A controller is provided to manage the dispensing process.

A liquid cooling device and a server are provided. The liquid cooling device includes at least two motherboards provided in a stack, and each motherboard being provided with at least two heat generating elements; and a plurality of liquid cooling plates attached to the plurality of heat generating elements in a one-to-one correspondence. Two liquid cooling plates corresponding to two heat generating elements on the same motherboard are connected in series form a liquid cooling loop, and a plurality of liquid cooling loops are connected in parallel.

The invention discloses a double-sided heat dissipation common drain module packaging structure, and belongs to the technical field of power semiconductor device packaging. The module comprises a common drain electrode upper copper layer, two drain electrode copper terminals, two power chips, two source electrode copper blocks, two L-shaped source electrode lower copper layers, two driving grid electrode copper terminals, two driving source electrode copper terminals and a bonding wire. Drain electrodes of the two power chips are welded on the common drain electrode upper copper layer, and source electrodes of the two power chips are respectively welded with the L-shaped source electrode lower copper layer through source electrode copper blocks. And the bonding wire is connected with the grid electrode and the source electrode of the chip and the driving copper terminal to realize Kelvin connection. Thermal resistance is reduced through a double-sided heat dissipation structure, parasitic inductance is reduced through a three-dimensional commutation loop, power density and reliability are improved, and the common drain geminate transistor is suitable for common drain geminate transistor application in a battery management system.

The invention belongs to the technical field of optical communication, and relates to a miniature capillary heat conductor, miniature high-heat-density equipment and a heat conductor installation method, and the heat conductor comprises a shell and a heat conduction module packaged in the shell; the heat conduction module comprises a first heat conduction block, a second heat conduction block, a third heat conduction block and a fourth heat conduction block, each of the first heat conduction block, the second heat conduction block, the third heat conduction block and the fourth heat conduction block comprises a plurality of layers of microcirculation units, and each microcirculation unit is filled with a phase change working medium; the microcirculation unit comprises a heat absorption area, an evaporation area and a heat dissipation area which are communicated in sequence, the heat absorption area is used for making contact with the back face of the chip to conduct heat, the evaporation area extends downwards and outwards from the heat absorption area to the heat dissipation area, the heat dissipation area is used for dissipating heat to the back face of the PCB, the area of the heat dissipation area is larger than that of the heat absorption area, and the heat dissipation area is located on the outer side of the heat absorption area; the beneficial effect of the invention is that the technical problem that the heat conduction efficiency is not ideal because the existing optical module conducts heat through the PCB via hole on the back of the chip is solved.

The invention relates to the technical field of machine control, and discloses a heat dissipation control method and system for a motion and power control module and a storage medium, and the method comprises the steps: obtaining a first temperature value according to the motion control module, and obtaining a second temperature value according to the power control module; within the control duration, first temperature data are obtained according to the multiple first temperature values, and second temperature data are obtained according to the multiple second temperature values; calculating a motion temperature value according to the first temperature data, and calculating a power temperature value according to the second temperature data; if the motion temperature value is higher than the power temperature value, the heat dissipation channel is controlled to enable the heat moving direction to perform reciprocating reversing according to a preset reciprocating period between the motion control module and the power control module, and otherwise, the heat dissipation channel is controlled to enable the heat to move in the direction from the motion control module to the power control module; stable operation of the motion control module and the power control module in an integrated state is guaranteed, and efficient heat dissipation is achieved.

The invention discloses a chip packaging module structure and an electronic product, and relates to the technical field of chip packaging, the chip packaging module structure comprises a PCB, an insulating substrate, a first radiator and a second radiator; the insulation substrate is arranged on the PCB, the insulation substrate is provided with a first side and a second side, the insulation substrate is provided with a first chip in an integrated mode, the first chip is located on the second side of the insulation substrate, the insulation substrate is provided with a plurality of via holes penetrating through the first side and the second side, metal is arranged in each via hole, at least part of the via holes are conductive holes, and the first chip is arranged on the first side of the insulation substrate. The metal in the conductive hole is used as a part of an electric connection structure between the PCB and the plurality of chips; the first radiator is in thermal conduction connection with the first chip; the second radiator is arranged on the other side of the PCB, and a longitudinal heat conduction structure is formed between the second radiator and the first chip, so that the second radiator is in heat conduction connection with the first chip; the technical scheme provided by the invention aims to improve the heat dissipation efficiency.

The embodiment of the invention provides a power module, communication equipment, a motor driver, a power assembly and a vehicle, the power module comprises an electronic device, the power module can effectively shorten the length of a heat dissipation path for heat dissipation of the electronic device, the heat dissipation efficiency of the electronic device is improved, and it is guaranteed that heat generated by the electronic device is conducted out in time. The power module comprises a first bottom plate, a first heat dissipation bonding pad and a first electronic device, the second surface is concave inwards to form a first heat dissipation blind groove, the first heat dissipation bonding pad has a first orthographic projection on the first surface, the first heat dissipation blind groove has a second orthographic projection on the first surface, and the first orthographic projection of the first heat dissipation bonding pad is greater than the second orthographic projection of the first heat dissipation blind groove. The first orthographic projection and the second orthographic projection at least partially coincide.

Assemblies and methods of manufacturing are provided for a liquid cooled network-interface controller (NIC) assembly configured to receive and operably engage a transceiver module. An example liquid cooled NIC assembly includes a PCB, a first thermally conductive member supported by the PCB, and a second thermally conductive member supported by the first thermally conductive member. The first thermally conductive member is thermally isolated from the second thermally conductive member. A liquid cooling unit may thermally engage the first thermally conductive member and the second thermally conductive member. The first thermally conductive member and the second thermally conductive member are configured to conduct heat toward the liquid cooling unit, such that the liquid cooling unit may dissipate heat from the first thermally conductive member and the second thermally conductive member.

The invention relates to a high-efficiency heat dissipation circuit board and a manufacturing method thereof, and the manufacturing method comprises the steps: constructing a raw material performance database through the structural collection and evaluation of the physical parameters of a high-thermal-conductivity nanofiller and a resin matrix, and guiding the nanofiller to adaptively migrate and locate along the gradient through the adjustment of the partition solvent evaporation rate and the interfacial tension gradient. And an efficient heat-conducting filler network with orderly partitions is formed. Furthermore, in-situ multi-mode detection and automatic feedback optimization are combined, the dispersion uniformity of the filler and the continuity of a heat conduction channel are guaranteed, and the circuit board with uniform heat dissipation performance is prepared through a medium-low temperature step-by-step curing latch structure.

Aspects of the present disclosure are directed to a memory sub-system with isothermal cooling of components. A PCB assembly may be secured between a heat spreader and a heat sink that are thermally coupled. The heat sink radiates heat absorbed from both sides of the PCB assembly. By connecting the heat spreader to the heat sink, heat is more effectively transferred from the side of the PCB assembly not directly connected to the heat sink. The PCB assembly may be secured between a top enclosure and a bottom enclosure. The top enclosure and the bottom enclosure may be thermally coupled using a vapor chamber. The vapor chamber pumps heat from a higher-temperature side of the PCB assembly to a lower-temperature side of the PCB assembly. By using the vapor chamber to thermally couple the top and bottom enclosures, creation of hot spots is avoided.

An active compensation device including a first element group including an integrated sensing / compensation unit configured to generate a sensing signal corresponding to at least one of common-mode noise and differential-mode noise on at least two high-current paths, and a second element group including a compensation control unit including a negative impedance converter and configured to generate a compensation signal corresponding to the sensing signal and provide the compensation signal to the integrated sensing / compensation unit. The compensation control unit further including a stabilization unit configured to prevent oscillation caused by the sensed noise. The first element group and the second element group are mounted on a single substrate.

This application relates to a heat dissipation shielding structure and a processing method, a circuit board assembly, and an electronic device. The printed circuit board includes a mounting surface. Electronic components are mounted on the mounting surface. The electronic components include an active component and a passive component. The heat dissipation shielding structure includes an insulating layer. The insulating layer is covered on the mounting surface, and wraps at least a side surface of the active component, so that a side that is of the insulating layer and that faces away from the mounting surface forms a first surface together with a top surface of the active component. A shielding layer is covered on the first surface, a shape of the shielding layer matches a shape of the first surface, and the shielding layer is electrically connected to a ground network of the printed circuit board.

The invention relates to a copper block centering control method and a copper block embedded circuit board. The method comprises the following steps: S1, manufacturing an inner-layer core board; s2, groove hole processing: milling a groove hole in a copper block embedding area of each layer of core plate, wherein the opening size of the groove hole is greater than the boundary dimension of the copper block; flatness identification blocks are symmetrically arranged on the two opposite sides of the slotted hole in the core plate located on the outermost layer; s3, pre-stacking and positioning the core board; s4, embedding and curing of a copper block: embedding the copper block into the aligned slotted holes, enabling the copper block to be located between the two flatness identification blocks, and then performing curing; and S5, press-fit forming. The flatness identification blocks are arranged on the two opposite sides of the groove hole of the core plate on the outermost layer, it is ensured that the copper block is placed in the middle, and an operator can visually judge whether the copper block has obvious displacement or not by observing whether the flatness identification blocks on the two sides are damaged or not, so that defective products can be checked in time.

Improved cooling modules and methods are configured to recirculate liquid cooling fluid within the cooling module such that the same liquid cooling fluid impinges on the surface of a heat-generating electronic component (or a cooling plate in thermal communication with the heat-generating electronic component) multiple times before exiting the cooling module, thereby allowing a given flow of cooling fluid to be reused multiple times, each time reducing flow demands and reducing the infrastructure required to achieve higher performance in direct and indirect micro-convection impingement cooling applications.

The invention relates to the technical field of PCB heat dissipation, and discloses a distributed heat dissipation structure and a distributed heat dissipation method for a PCB under a high-temperature working condition, the distributed heat dissipation structure comprises a PCB base material, an electronic component is mounted on the A surface of the PCB base material, and active thermal control units are mounted on the B surface of the PCB base material corresponding to the electronic component needing to be cooled in a distributed manner; according to the distributed heat dissipation structure for the PCB under the high-temperature working condition, the active thermal control units are installed in the area, corresponding to the heating element, of the B face of the PCB base material in a distributed mode, active refrigeration can be conducted on electronic components (such as a microprocessor and a storage) with the large heating value in a targeted mode, the highest working temperature of a system is increased, and the heat dissipation efficiency is improved. Normal operation of the system is guaranteed, meanwhile, energy waste caused by cooling of the whole plate is avoided, and the heat dissipation efficiency and the energy utilization rate are remarkably improved.

The present application discloses a method for laminating and preparing a high thermal conductivity circuit board and a high thermal conductivity circuit board. The preparation method comprises: dispersing and curing a liquid metal gallium-indium alloy and a fiber mixture in an inert argon atmosphere, and fusing the mixture with a matrix to obtain an adaptive thermal conductive substrate; performing gradient deposition and etching on the adaptive thermal conductive substrate to obtain a gradient spacing template; performing electrospinning infiltration and heat treatment on the gradient spacing template to obtain a substrate containing a dynamic thermal conductive network; performing a conductive layer pre-pressing treatment on the substrate containing the dynamic thermal conductive network to obtain a pre-assembled plate; performing a staged dynamic lamination treatment on the pre-assembled plate to obtain a molded circuit board; and performing surface spraying and deposition treatment on the molded circuit board to obtain the high thermal conductivity circuit board. The present application solves the problems of poor heat flow path and poor interface bonding in the prior art, significantly improving the thermal management effect and significantly improving the reliability and performance of electronic products.

Disclosed are a medium flow channel, a flow channel plate, a liquid-cooled server, and a data center. The medium flow channel includes: at least two sub-sections sequentially bent and connected, and connecting sections connecting adjacent sub-sections; wherein a plurality of heat dissipation fins are juxtaposed in each of the sub-sections, each of the heat dissipation fins extending along an extension direction of the sub-section in which the heat dissipation fins are disposed and dividing the sub-section into a plurality of juxtaposed sub-flow channels.

A circuit system includes: a plurality of integrated circuit (IC) chips on a circuit board; a first conduit configured to convey a first flow of a coolant, wherein the first conduit is arranged such that the first flow of the coolant through the first conduit cools the circuit board; a second conduit configured to convey a second flow of the coolant from a common inlet with the first conduit, wherein the second flow bypasses the first conduit; a valve configured to adjust a relative degree of flow of the coolant between the first conduit and the second conduit; and a controller configured to, based at least on data characterizing operation of the plurality of IC chips, control the valve to adjust a first flow rate of the coolant through the first conduit.

A thermal pad and an electronic device are disclosed for effectively dissipate heat of an electronic component. The thermal pad includes a first cover, a second cover, an elastic shell, and liquid metal. The elastic shell is bent and closed into a tubular structure. The first cover and the second cover are respectively mounted at two ends of the tubular structure to form a closed cavity. The closed cavity is configured to accommodate the liquid metal. Filling the liquid metal into the elastic shell implements good heat conduction effect by using high thermal conductivity of the liquid metal, and implements compression on the thermal pad during assembly of the thermal pad by using compressibility of the elastic shell, to reduce a thickness of the thermal pad.

The invention relates to a copper substrate embedding method for separated special-shaped copper blocks and a circuit board, and the method comprises the following steps: processing a plurality of special-shaped copper blocks with preset shapes on a copper plate, and reserving a plurality of connecting ribs which are not completely cut off between the adjacent special-shaped copper blocks; a gap between every two adjacent special-shaped copper blocks is filled with resin; a heat-conducting insulating layer and a copper foil are sequentially overlaid on the two opposite faces of the copper plate to form a stacked structure, and a substrate is formed through high-temperature pressing; an isolation groove is formed in the position, corresponding to the connecting rib, of the substrate, and the isolation groove cuts off the connecting rib; the isolation groove is filled with resin, and the resin overflowing out of the plate surface is rubbed down; and conducting treatment: forming a continuous conductive copper layer on the surface of the resin filling area. According to the invention, no copper groove needs to be buried, the copper block can be processed into a specific shape, and the distance between two adjacent special-shaped copper blocks is controlled to be 1.0 mm, so that the number and the area of the copper blocks buried in the substrate are greatly increased, and the heat dissipation performance and the electrical performance of the circuit board are improved.

The invention relates to a multi-circulation-mode heat exchange device which comprises an outer shell, a heat dissipation substrate of a power element, an evaporation section and a condensation section, the evaporation section covers one side of the heat dissipation substrate in a sealing mode, an inner-layer heat exchange cavity is defined by the heat dissipation substrate, the evaporation section and the condensation section jointly, and a first working medium is arranged in the inner-layer heat exchange cavity; the liquid-state first working medium can absorb heat of the heat dissipation substrate and is gasified, and the gaseous-state first working medium can enter the inner-layer heat exchange cavity and is liquefied again. The outer shell is provided with an outer layer heat exchange cavity, the outer layer heat exchange cavity is provided with a liquid second working medium, the evaporation section and the condensation section are both arranged in the second working medium in an immersed mode, the liquid second working medium can take away heat on the surfaces of the evaporation section and the condensation section through temperature rising, and the heat of the second working medium can be transmitted to the atmospheric environment through an external heat dissipation system or the outer shell. According to the multi-circulation-mode heat exchange device, the problem that an existing cooling mode cannot meet the requirement for rapid heat dissipation of high-power power elements such as chips is solved.