3030results about "Circuit thermal arrangements" patented technology

The embodiment of the invention discloses an embedded substrate, a power supply device and electronic equipment. The embedded substrate comprises a front surface first adding layer jointed with the first surface of the core part maintaining body, a conduction structure electrically connected with a circuit layer of the dielectric layer is arranged in the dielectric layer of the front surface first adding layer, and the conduction structure comprises a first conduction structure electrically connected with a bonding pad on the chip; the dielectric layer of the first additional layer on the front side is made of an exposable and developable material, an open pore for constructing the conduction structure is formed through exposure and development, the open window of the outer protection layer has a first projection on the first surface, the first open pore for constructing the first conduction structure has a second projection on the first surface, and the second projection covers the first projection. Through the arrangement, the first conduction structure with a larger through-flow cross section is constructed and formed by utilizing the windowing size of the chip side, so that the through-flow capability is effectively improved, and the heat conduction capability is high. In addition, the bonding stress between the circuit layer and the front surface of the chip can be reduced, the layering risk is reduced, and the reliability is better.

The invention relates to the technical field of printed embedded PCBs, and discloses an embedded PCB and a manufacturing method thereof.The embedded PCB comprises a daughter board, a first dielectric layer and a first circuit layer which are sequentially arranged in a stacked mode in the first direction, a device is embedded in the daughter board, the device is located on the side, close to the first dielectric layer, of the daughter board, and the first dielectric layer is located on the first circuit layer. One side, close to the first dielectric layer, of the device is provided with a first part, and the first part is provided with a first protection part; a first connection hole is formed in the first dielectric layer, a first conductive part is filled in the first connection hole, the first protection part is connected and electrically conducted with the first conductive part, and the first conductive part is connected and electrically conducted with the first circuit layer. The embedded PCB and the manufacturing method thereof provided by the invention are used for improving the problem of poor hole filling in the electroplating hole filling process in the related technology.

A rack system for use, e.g., in data centers is disclosed. The rack system includes a rack frame and a rack-mounted assembly, including an electronic device disposed within the rack-mounted assembly, the electronic device including a heat-generating component. The heat-generating component is in thermal contact with a liquid cooling block through which a channelized cooling fluid is conveyed. The electronic device is immersed in a dielectric immersion cooling liquid. The rack-mounted assembly includes a non-sealed immersion case in which the electronic device is immersed in the dielectric immersion cooling liquid, the non-sealed immersion case configured to permit the rack-mounted assembly to be individually inserted into or removed from the rack frame. Also disclosed are container-based data center modules based on the disclosed rack system, and a data center using numerous such container-based modules.

The present disclosure relates to a ceramic substrate unit and a manufacturing method therefor, which can suppress warpage due to a difference between the volumes of upper and lower metal layers in a ceramic substrate by calculating the volume of the upper metal layer and forming a plurality of grooves in the lower metal layer to have a predetermined volume corresponding to the volume of an upper electrode.

The invention provides a multilayer circuit board and a processing method thereof, a chip system and electronic equipment, and the processing method comprises the steps: processing a second hole channel, a first conductive pattern and a second conductive pattern on a first substrate, and processing a third hole channel on a second substrate; the first substrate, the second substrate and the first insulating layer are stacked, pressed and fixed; the processing method further comprises the following steps: carrying out electroplating hole filling on the first substrate to form a second conductive channel; the processing method further comprises the steps that the second substrate is electroplated so that a sixth conductive pattern and a third conductive channel can be formed, the first insulating layer comprises a first conductive part, and the first conductive pattern, the second conductive pattern and the sixth conductive pattern are electrically connected with the second conductive channel through the third conductive channel and the first conductive part. The second hole channel and the third hole channel are filled in an electroplating hole filling mode, so that the wiring density and the chip signal transmission capability of the multilayer circuit board are improved, and the electrical performance and the thermal performance of the multilayer circuit board are improved; electroplating hole filling is suitable for mass production, and the process yield is stable.

An embedded substrate, a power supply apparatus, and an electronic device. The embedded substrate comprises a front first additional layer, which is joint with a first surface of a chip holding body, wherein a conduction structure which is electrically connected to a circuit layer of the front first additional layer is provided in a dielectric layer of the front first additional layer, the conduction structure comprising a first conduction structure electrically connected to a pad on a chip; the dielectric layer of the front first additional layer is made of an exposable and developable material, and openings for constructing the conduction structure are formed by means of exposure and development; and a window of an outer protection layer has a first projection on the first surface, a first opening for constructing the first conduction structure has a second projection on the first surface, and the second projection covers the first projection. By means of such arrangements, a first conduction structure having a relatively large through-flow section is constructed by using the size of a window on a chip side, thereby effectively improving a through-flow capability, and achieving a good thermal conductivity capability. In addition, the joining stress between a circuit layer and the front surface of the chip can be reduced, thereby lowering the risk of delamination, and providing relatively good reliability.

To provide a ceramic board which has good heat dissipation, and in which an integration density is high.SOLUTION: According to an embodiment, the present invention discloses a manufacturing method of an ultrathin high-density multilayer interconnection ceramic board, containing steps of: preparing a ceramic wafer, performing a laser punching to the ceramic wafer, and forming a via hole; performing a vacuum magnetron sputtering to the ceramic wafer, and forming a seed titan layer and a copper layer onto a front surface of the ceramic wafer and on a wall of the via hole by the sputtering; manufacturing a ceramic double-layer core plate; manufacturing a multilayer substrate; manufacturing a vertical interconnection multilayer substrate; and manufacturing a high-end multilayer HDI ceramic board. The multilayer ceramic plate manufactured in the above mentioned processing can be easily processed as compared with LTCC and HTCC, and an energy consumption amount for the processing is deteriorated. A heat conductivity of a finished product is improved. A wiring is more accurate; a conductive resistance is low; and a signal transmission loss is low.SELECTED DRAWING: Figure 1

A cooler includes a plurality of protrusions disposed on a top plate surface of a top plate, protruding in a depth direction toward a bottom plate surface of a bottom plate in a flow path of refrigerant formed between the top plate surface and the bottom plate surface, and including first and second protrusions that are spaced apart from each other in a flowing direction in which the refrigerant flows in the flow path, a frame connecting the top plate to the bottom plate and having wall surfaces surrounding the plurality of protrusions, and a wall disposed on the bottom plate surface and protruding in the depth direction, between the first and second protrusions. The wall is respectively connected to a pair of the wall surfaces at opposite ends thereof in a width direction orthogonal to the flowing direction. The wall is spaced apart from the top plate surface.

The invention discloses a GaN high-power device heterogeneous integrated T / R assembly based on an embedded flow channel, which belongs to the field of phased array radar T / R assemblies and comprises a packaging shell, an LTCC (Low Temperature Co-Fired Ceramic) substrate, a PCB (Printed Circuit Board) substrate, a radio frequency coaxial connector, a low-frequency connector, a power supply modulation circuit, a beam driving control circuit and a transceiving channel circuit, the T / R assembly comprises four transceiving channels, and the working frequency band of the T / R assembly is 2GHz-6GHz; a transmitting channel chip of the T / R assembly comprises a radio frequency driving amplifier chip and a final-stage radio frequency power amplifier chip; a receiving channel chip of the T / R assembly comprises a radio frequency amplitude-limiting low-noise multifunctional chip. A common part chip of the T / R assembly comprises a wave control driver chip, a radio frequency multifunctional chip, a radio frequency switch chip and a power divider chip. The T / R assembly can be widely applied to a phased array radar system with the frequency band of 2GHz-6GHz, and the thermal management requirement of the system is ensured while high performance is realized.

The invention discloses an integration and optimization method of a multilayer circuit board in a photovoltaic inverter, and the method comprises at least seven layers of functional stacked structures which are an electromagnetic shielding layer, a power device layer, a first insulating dielectric layer, a control circuit layer, a second insulating dielectric layer, a heat dissipation substrate layer and a mechanical strengthening layer from top to bottom in sequence. Wherein the power device layer adopts a three-dimensional embedded packaging technology to integrate an IGBT module and a SiC MOSFET module, and a gate drive circuit of the power device layer is embedded into a first insulating dielectric layer in a coplanar waveguide structure; the heat dissipation substrate layer is provided with a micro-channel array with gradient apertures, and the inner wall of each micro-channel is subjected to anodic oxidation treatment to form an Al2O3 ceramic layer with the thickness of 20-50 microns.

A method of forming a heat spreader on a printed circuit board (PCB) having a power dissipating component operably coupled to the heat spreader, comprising attaching a thermally and electrically conductive structure to a first side of the PCB to define a first PCB region including the component and a second PCB region not including the component. The underside of the component is underfilled to electrically insulate its solder contacts. A first protective layer is applied to the second region of the PCB. A conductive plating film is deposited on the first region, the second region, and the structure. A second protective layer is applied over the portion of the conductive plating film covering the second region, leaving the remaining portion of the conductive plating film exposed. An electrically conductive and thermally conductive layer is electroplated onto the exposed region of the conductive plating film to form a heat exchanger in the first region.

The invention relates to the technical field of printed circuit boards, and discloses a circuit board structure and a preparation method thereof, and the circuit board structure comprises a copper seat, the top of which is provided with a first groove; a chip, wherein the chip is arranged in the first groove; the ceramic substrate layer is arranged at the bottom of the copper seat, and the shape of the cross section of the ceramic substrate layer is the same as that of the bottom surface of the copper seat; the copper plate layer is arranged at the bottom of the ceramic substrate layer, and the shape of the cross section of the copper plate layer is the same as that of the cross section of the ceramic substrate layer. The ceramic substrate layer and the copper plate layer are sequentially arranged at the bottom of the copper base, the thermal resistance of the chip during working can be remarkably reduced, the overall heat dissipation performance can be improved, the cross sections of the ceramic substrate layer and the copper plate layer are consistent with the bottom surfaces of the copper base and the copper plate layer in shape, and the layers are high in structural fitting degree, uniform in stress distribution and good in plate thickness consistency after lamination; and the warping problem of the copper seat caused by thermal expansion is effectively reduced.

The embodiment of the invention provides a packaging assembly and electronic equipment, and relates to the technical field of electronic equipment. The packaging assembly of the electronic equipment is installed on a circuit board of the electronic equipment, and by arranging a heat conduction column with one end being in heat conduction with a heat dissipation device and the other end being in heat conduction with a chip, close to the circuit board, in the packaging assembly, the chip, close to the circuit board, in the packaging assembly can transmit heat to the heat dissipation device for heat dissipation through the heat conduction column. In this way, the heat dissipation efficiency of the chip close to the circuit board in the packaging assembly is high, and the heat dissipation efficiency of the whole packaging assembly can be improved.

Heat exchangers on edges of circuit boards are disclosed. An apparatus includes: a housing including an outlet for air flow; a circuit board; and a heat exchanger extending along an edge of the circuit board. The heat exchanger includes a first side and a second side opposite the first side. The first side faces away from the outlet, and the second side faces toward the outlet. The edge of the circuit board is closer to the second side of the heat exchanger than the edge is to the first side of the heat exchanger.

The invention provides an embedded substrate and a manufacturing method thereof. The manufacturing method specifically comprises the following steps: forming a conduction copper column and a shielding copper column on a first circuit layer of the substrate; pressing a second dielectric layer on the first circuit layer, the conduction copper column and the shielding copper column; mounting a component on the second dielectric layer; pressing the component into the second dielectric layer to enable the shielding copper column and the first circuit layer to surround the component; pressing a fourth dielectric layer on the second dielectric layer and the component, and curing the second dielectric layer and the fourth dielectric layer; forming an outer circuit layer on the fourth dielectric layer; and the outer circuit layer is in conducting connection with the conducting copper column, the shielding copper column and the terminal of the component. The shielding copper columns can reduce the deviation of the component in the extrusion process of the component and improve the yield, five surfaces of the embedded component are all provided with metal copper, and a good electromagnetic shielding effect can be achieved. Moreover, the second dielectric layer and the fourth dielectric layer are made of high-thermal-conductivity materials, so that heat can be quickly guided into the shielding copper columns, and the heat dissipation effect is obviously improved.

The invention relates to the technical field of circuit boards, in particular to a production method of a circuit board, which comprises the following steps of: sequentially arranging an improved layer and a copper foil layer on the surface of a copper substrate, and then carrying out hot pressing treatment on the substrate coated with the improved layer and the copper foil layer at the hot pressing temperature of 180 DEG C for 2 hours. In the production of the circuit board, the surface of the copper substrate is matched with the improved layer and the copper foil layer, and the improved layer is formed by coating an improved material obtained by blending epoxy resin, a modified filler, a nano titanium dioxide regulator and a curing agent on the surface of the copper substrate, so that the thermal conductivity, dielectric loss and wear resistance of a product are enhanced; the performance of the product is improved in a balanced and coordinated manner, and the performance stability effect of the product is remarkable under high-heat and high-humidity conditions.

The invention relates to a printed circuit board with a ceramic substrate embedded in a local area and a preparation method of the printed circuit board, and belongs to the technical field of semiconductor devices. The preparation method comprises the following steps: performing surface treatment on the upper surface and the lower surface of the core plate to form the L3 layer and the L4 layer; processing a through groove; sticking an adhesive tape; mounting the power chip module in the through groove; forming a first bonding layer and an L2 layer on the surface of the L3 layer; removing the adhesive tape; forming a second bonding layer and an L5 layer on the surface of the L4 layer; processing a blind hole and filling copper; processing a through hole and metalizing the inner wall; performing surface treatment on the L2 layer and the L5 layer; the ceramic substrate is bonded to the area, corresponding to the power chip module, of the surface of the L5 layer through silver paste and is baked and fixed; forming a third bonding layer and an L1 layer on the surface of the L2 layer; forming a fourth bonding layer and an L6 layer on the surface of the L5 layer; processing a blind hole and filling copper; performing surface treatment on the L1 layer; and resistance welding processing, anti-oxidation treatment and cutting forming are carried out. According to the preparation method, the heat dissipation performance and the voltage tolerance of the printed circuit board can be effectively improved.

The invention provides a preparation method of a charging pile circuit board and the charging pile circuit board. The method comprises the following steps: obtaining a to-be-embedded copper block required by a charging pile circuit board; embedding the copper block to be embedded into a core plate to obtain the core plate with the copper block; laminating the copper foil, the cured sheet and the core plate with the copper block to obtain a laminated plate; performing circuit manufacturing on the laminated plate to obtain a first charging pile circuit board; obtaining a heat parameter of the first charging pile circuit board under a heat simulation model; inputting the heat parameter into a preset heat dissipation evaluation model for evaluating the heat dissipation effect of the circuit board to obtain an evaluation result; according to the evaluation result, manufacturing parameters of a target charging pile circuit board are determined; and obtaining the target charging pile circuit board according to the manufacturing parameters of the target charging pile circuit board, the target to-be-embedded copper block, the target core board, the target copper foil and the target cured sheet. The heat dissipation performance of the charging pile circuit board can be improved.

The described apparatus can include a printed circuit board having a first side that includes an integrated circuit and a second side that is opposite the first side and that includes one or more power delivery components. The apparatus can additionally include a cooling system positioned to cool the one or more power delivery components located on the second side of the printed circuit board. Various other methods and systems are also disclosed.

A controller includes a circuit board, and a module assembly arranged at the circuit board. The module assembly includes a first power module, a second power module, and a third power module. The circuit board includes a first current circuit connected to the first power module, a second current circuit connected to the second power module, and a third current circuit connected to the third power module. The first current circuit and the second current circuit share one or more circuit components.

A heatsink comprising a heat exchange device having a plurality of heat exchange elements each having a surface boundary with respect to a heat transfer fluid, having successive elements or regions having varying size scales. According to one embodiment, an accumulation of dust or particles on a surface of the heatsink is reduced by a removal mechanism. The mechanism can be thermal pyrolysis, vibration, blowing, etc. In the case of vibration, adverse effects on the system to be cooled may be minimized by an active or passive vibration suppression system.

Presented herein is a corrosion inhibitor dispensing system that provides for the in-situ application of a corrosion inhibitor in order to protect internal elements of an apparatus from corrosion. In one example, an apparatus is provided that may include a housing to contain one or more electronic components. The housing includes air inflow ports configured to limit internal air from exiting the housing during a corrosion inhibitor dispensing processes, air outflow ports configured to limit external air from entering the housing during the dispensing process, and one or more fans to direct airflow for the housing. The apparatus further includes a corrosion inhibitor dispensing system that includes a dispensing container to hold a corrosion inhibitor in a non-vaporized state and includes one or more ports for dispensing the corrosion inhibitor in a vaporized state during the corrosion inhibitor dispensing processes. A controller is provided to manage the dispensing process.

The present invention relates to a ceramic substrate unit and to a method for manufacturing same. The ceramic substrate has a plurality of line grooves, through which air flows, formed on an upper surface of a lower metal layer thereof, so that heat generated in a semiconductor chip can be released to the outside by air convection, and warping caused by a volume difference between an upper metal layer and the lower metal layer can be suppressed.

A liquid cooling device and a server are provided. The liquid cooling device includes at least two motherboards provided in a stack, and each motherboard being provided with at least two heat generating elements; and a plurality of liquid cooling plates attached to the plurality of heat generating elements in a one-to-one correspondence. Two liquid cooling plates corresponding to two heat generating elements on the same motherboard are connected in series form a liquid cooling loop, and a plurality of liquid cooling loops are connected in parallel.

The invention relates to the technical field of fuel pump control, and particularly discloses an intelligent control method and system based on an intelligent integrated fuel pump, and the method comprises the steps that the intelligent integrated fuel pump is started to output fuel, and a fuel pressure sensor collects a pipeline fuel pressure signal in real time, converts the pipeline fuel pressure signal into a voltage signal and transmits the voltage signal to a CPU; the CPU presets fuel pressure values required by the engine under different working conditions, converts the received voltage signal into a fuel pressure value, compares the fuel pressure value with a set value, and generates an execution signal according to a comparison result; the processor adjusts fuel pump power supply voltage according to the execution signal and changes the rotating speed of a fuel pump motor; the PCBA temperature control module comprises a temperature sensor installed in the intelligent integrated fuel pump, and the temperature sensor senses the temperature rise condition of the PCBA in real time. Through cooperative work of the CPU, the processor and the fuel pressure sensor, accurate adjustment of the fuel pressure is achieved, and the working stability of the engine and the fuel utilization rate are improved.

A method can include attaching an integrated circuit to a printed circuit board in a first solder reflow process at a first reflow temperature. A method can include soldering a heat spreader to the integrated circuit in a second solder reflow process at a second reflow temperature, wherein the second reflow temperature is lower than the first reflow temperature. A method can include attaching a cold plate to the heat spreader such that a thermal interface material is positioned between the heat spreader and the cold plate. Related integrated circuit assemblies are disclosed with thermal interface material, such as solder or a liquid metal, positioned between a heat spreader and an integrated circuit. The thermal interface material has a lower melting temperature than solder on another surface of the integrated circuit.

The invention discloses a double-sided heat dissipation common drain module packaging structure, and belongs to the technical field of power semiconductor device packaging. The module comprises a common drain electrode upper copper layer, two drain electrode copper terminals, two power chips, two source electrode copper blocks, two L-shaped source electrode lower copper layers, two driving grid electrode copper terminals, two driving source electrode copper terminals and a bonding wire. Drain electrodes of the two power chips are welded on the common drain electrode upper copper layer, and source electrodes of the two power chips are respectively welded with the L-shaped source electrode lower copper layer through source electrode copper blocks. And the bonding wire is connected with the grid electrode and the source electrode of the chip and the driving copper terminal to realize Kelvin connection. Thermal resistance is reduced through a double-sided heat dissipation structure, parasitic inductance is reduced through a three-dimensional commutation loop, power density and reliability are improved, and the common drain geminate transistor is suitable for common drain geminate transistor application in a battery management system.

An apparatus includes: at least one of a circuit board or a substrate; and a first structure attached to the at least one of a circuit board or a substrate. The first structure is configured to enable an optical module with connector to be removably coupled to the first structure, and the optical module with connector is configured to enable an optical fiber connector to be removably coupled to the optical module with connector. For example, the circuit board or the substrate includes first electrical contacts, the first structure includes walls that define a first opening, the walls also define one or more retaining mechanisms such that when the optical module with connector is inserted into the first opening, the one or more retaining mechanisms on the walls of the first structure engage one or more latch mechanisms on the optical module with connector to secure the optical module with connector to the first structure, and second electrical contacts on the optical module with connector are electrically coupled to the first electrical contacts on the circuit board or the substrate.

A component carrier, including: i) a stack comprising at least one electrically conductive layer structure and / or at least one electrically insulating layer structure; ii) a first electronic switch component and a second electronic switch component embedded side-by-side in the stack; and iii) a capacitor device, electrically connected in parallel to the first electronic switch component and the second electronic switch component; wherein the capacitor device is assembled, in particular surface-mounted, to the stack, so that the first electronic switch component and the second electronic switch component are at least partially arranged below the capacitor device in a direction z, perpendicular to the directions of main extension x, y, of the component carrier.

The invention belongs to the technical field of optical communication, and relates to a miniature capillary heat conductor, miniature high-heat-density equipment and a heat conductor installation method, and the heat conductor comprises a shell and a heat conduction module packaged in the shell; the heat conduction module comprises a first heat conduction block, a second heat conduction block, a third heat conduction block and a fourth heat conduction block, each of the first heat conduction block, the second heat conduction block, the third heat conduction block and the fourth heat conduction block comprises a plurality of layers of microcirculation units, and each microcirculation unit is filled with a phase change working medium; the microcirculation unit comprises a heat absorption area, an evaporation area and a heat dissipation area which are communicated in sequence, the heat absorption area is used for making contact with the back face of the chip to conduct heat, the evaporation area extends downwards and outwards from the heat absorption area to the heat dissipation area, the heat dissipation area is used for dissipating heat to the back face of the PCB, the area of the heat dissipation area is larger than that of the heat absorption area, and the heat dissipation area is located on the outer side of the heat absorption area; the beneficial effect of the invention is that the technical problem that the heat conduction efficiency is not ideal because the existing optical module conducts heat through the PCB via hole on the back of the chip is solved.