2440results about How to "Heat dissipation" patented technology

A cooled electrosurgical system includes an electrosurgical device having at least one electrode for applying electrical energy to tissue. In one embodiment, the electrode includes an internal cavity in which a cooling medium such as water is contained. The internal cavity is closed at both ends of the device such that the cooling medium is contained within the electrode at the surgical site such that the cooling medium does not contact the tissue being treated. The electrosurgical device has an electrode and a heat pipe to conduct heat from the electrodes where substantially all heat conducted from the electrode through the heat pipe is dissipated along the length of the heat pipe. The heat pipe can have a thermal time constant less than 60 seconds and preferably less than 30 seconds.

Devices and methods for the treatment of skin conditions and lesions are disclosed herein. A compact hand held device that can be safely used by those suffering from skin conditions, such as acne, warts, cold blisters, blemished skin, or fine wrinkles. The devices employ the application of ultrasound energy and heat for the treatment of skin conditions and lesions. Typically, the peak temperatures employed are about 40° C. to about 70° C. by the devices, are achieved in less than about 20 second, and maintained for less than about 40 second. Ultrasound absorption and thermal conduction transfers heat from the device to the skin and causes a biological response that accelerates acne clearing, treats blemished skin, itching, or fine wrinkles. The total heat transferred is low enough to prevent burns.

A high power light emitting diode (LED) lighting assembly incorporated with heat dissipation module is provided. The LED lighting assembly includes a heat exchange base, at least one LED array, at least one heat pipe and a heat dissipation module. The heat exchange base includes at least one LED configuration plan for mounting of the LED array and at least a hollow part for insertion of the heat pipe. The LED array is arranged at a predetermined projecting angle at the LED configuration plane. The heat pipe includes a heated section, a cooling section and a conducting section, and contains a working fluid therein. The heat exchange base is mounted to the heated section and the heat dissipation module is mounted to the cooling section. The thermal energy generated by the LEDs is conducted from the heat exchange base to the heated section of the heat pipe, whereby allowing the working fluid in the heat pipe to be heated and vaporized, and flows, from the conducting section to the cooling section for dissipation at the heat dissipation module.

A non-linear fin heat sink is provided for dissipating/removing heat uniformly from a device, where the heat generation is non-uniform over that device, while also providing a small and relatively lightweight heat sink. The heat sink has extended surface protrusions that are optimally shaped in recognition of convective heat transfer, conductive heat transfer, and flow resistance allowing the heat sink to offset the temperature rise of a coolant media and provide enhanced cooling for the coolant temperature, deliver optimized cooling efficiency per the local physical properties of the coolant media, be used with a fluid for effectuating heat transfer; either liquid coolant, gas coolant or a combination thereof. Furthermore the heat sink features turbulence enhancement of the coolant stream by a pin array through which coolant stream passes, such fin array featuring a non-linear shape, spacing, and height pattern to provide optimal cooling while simultaneously reducing volume and flow resistance.

An LED lamp includes bare LED chips, an axle, and a lampshade. The bare LED chips are mounted on surface of the axle. The axle extends across the lampshade. A heat pipe is installed inside the axle for transferring the heat generated by the LED chips to exterior of the lampshade and obtaining a better heat dissipation.

A channel letter lighting unit according to the present invention comprises a printed circuit board (PCB) having a plurality of linearly mounted light emitting elements. Input wires transmit a power signal to the PCB to illuminate the plurality of light emitting elements, and output wires transmit the power signal from the PCB. The PCB is mounted in the extrusion and the light emitting elements transmit light away from the extrusion. The extrusion promotes the dissipation of heat from the light emitting elements. A mounting mechanism is included for mounting the extrusion within a housing. A further embodiment according to the invention comprises a plurality of channel lighting units electrically connected to one another so that a power signal applied to the lighting system is transmitted to each of the plurality of lighting units. A still further embodiment according to the invention comprises an illuminated channel letter system having a housing in the shape of a letter. A translucent lens is included over the housing to transmit light from within the housing. A plurality of channel lighting units are mounted within the housing and coupled to one another in a daisy chain. A power signal applied to the first of the plurality of lighting units in the daisy chain is transmitted to the remaining of the plurality of lighting units.

A solid state (light emitting diode) lamp in numerous configurations have improved thermal management by providing a direct thermal pathway from the plurality of LED chips to the threaded screw base (standard 100˜240 VAC lamp socket), or power coupling. The control circuitry is disposed opposite the printed circuit board and LED chips with respect to the heat sink so that the heat sink is interposed between the printed circuit board and the control circuitry. The LED chips are powered using a high voltage/high current configuration. The light radiation pattern is infinitely adjustable (very wide through very narrow) via a system of easily interchangeable lenses. The solid state lamps can be mass produced rapidly at significantly lower cost with very high luminous intensity. ESD protection may be included to protect the LED chips from electrostatic discharge damage.

An electronic cigarette atomization device is built in a disposable electronic cigarette or disposable smoke capsule electronic cigarette. The electronic cigarette atomization device comprises a tar storage (2) between the smoke capsule shell (4) of the electronic cigarette and a hollow tubular bracket (3), a smoking channel corresponding to the hollow tubular bracket (3), and a heating element (5) electrically connected to a battery (10) of the electronic cigarette at outlet of the tar storage in the channel. The heating element (5) and the axis of the hollow tubular bracket (3) form an angle of 10-90°, connection wires (8) at two ends of the heating element (5) are provided between the hollow tubular bracket (3) and the smoke capsule shell (4), electrically connected to the battery (10).

In addition to the effect of harmonized illumination and increased heat radiation, a LED illumination lamp provides an improved effect of hermetic seal, anti-vibration and waterproofing between components and assures prolonged life span. The illumination lamp comprises a body adapted to be placed on or around a target illumination object, a LED module lying inside the body and a cover mounted on a seat part of the body. The LED module has a printed circuit board affixed to the body and a group of red, green and blue LEDs attached to the printed circuit. The cover is provided with a semitransparent color-producing part capable of harmonizing colors of the light emitted from the LEDs and an air passageway for permitting the heat generated from the LED module to dissipate to the outside.

Both ends of the lead arrangement project outward from side surfaces of a package to form outer lead regions. Each of the outer lead regions includes a pair of outer lead projections and lead terminal smaller projections that are located between the outer lead projections. The outer lead projections and lead terminal smaller projections project outward. Adjustment is made to the projection amount of end surfaces of the lead smaller projections lying in a plane perpendicular to a longitudinal direction of the lead arrangement, whereby the end surfaces projecting less than end surfaces of the outer lead projections. Thus, cut surfaces of lead connection portions with edged corners are not exposed. This arrangement prevents that the cut surfaces damage other devices.

Aspects of the present disclosure relate to mounting electronics and optical systems in head-worn see-through computer displays. In embodiments, a head worn computer includes an optical chassis with a rigid open box structure configured to provide a stable optical mounting reference plane and a plurality of image source reference planes. The head worn computer further includes a first image source mounted on one of the image source reference planes to project first image light through a first hole in the optical mounting reference plane and a second image source mounted on a second of the image source reference planes and configured to project second image light through a second hole in the optical mounting reference plane. An outer frame holds the optical chassis such that, when worn by a user, the first and second image light is aligned with the eyes of the user.

A light emitting unit has a chamber. The light emitting unit includes at least one substrate, a plurality of light emitting diode (LED) dies and a gel or a fluid. The LED dies are disposed on the substrate and in the chamber. At least two LED dies are electrically connected to each other in series or in parallel. The gel or the fluid is filled in the chamber.

Various heat-sinked components and methods of making heat-sinked components are disclosed where diamond in thermal contact with one or more heat-generating components are capable of dissipating heat, thereby providing thermally-regulated components. Thermally conductive diamond is provided in patterns capable of providing efficient and maximum heat transfer away from components that may be susceptible to damage by elevated temperatures. The devices and methods are used to cool flexible electronics, integrated circuits and other complex electronics that tend to generate significant heat. Also provided are methods of making printable diamond patterns that can be used in a range of devices and device components.

An electric power conversion apparatus includes: a channel case in which a cooling water channel is formed; a double side cooling semiconductor module that comprises an upper and lower arms series circuit of an inverter circuit; a capacitor module; a direct current connector; and an alternate current connector. The semiconductor module comprises a first and a second heat dissipation metals whose outer surfaces are heat dissipation surfaces, the upper and lower arms series circuit is disposed tightly between the first heat dissipation metal and the second heat dissipation metal, and the semiconductor module further comprises a direct current positive terminal, a direct current negative terminal, and an alternate current terminal which protrude to outside. The channel case is provided with the cooling water channel which extends from a cooling water inlet to a cooling water outlet, and a first opening which opens into the cooling water channel.

A plurality of groups of Light Emitting Diodes (LEDs), each group being made up of three LEDs with red, green, and blue luminous colors respectively, are mounted at positioning areas of a flexible substrate, on the wiring patterns formed on the top surface of the substrate. A plurality of heat dissipation boards are adhered to the bottom surface of the substrate using an adhesive so as to cover the areas corresponding to the positioning areas of the groups of LEDs.

In one embodiment, a surgical navigation system is provided with a transmitter assembly that includes at least one coil for creating an electromagnetic field in the vicinity of a surgical operation. The surgical navigation system also includes a cooling unit thermally coupled to the transmitter assembly for dissipating heat generated by the transmitter assembly and a receiver assembly that includes at least one coil configured to generate signals induced by the field. The surgical navigation system further includes electronic circuitry coupled to and communicating with the transmitter assembly and the receiver assembly for calculating at least a position of the receiver coil.

A self-contained environmental control and power system (ECAPS) unit including an HVAC system with at least one variable-speed compressor driven by a DC motor, wherein the HVAC system is adapted to condition air and output the conditioned air and a variable-speed diesel engine connected to a generator. The generator is configured to vary in speed so as to output AC power at a variable frequency. The unit includes a rectification assembly which transforms the AC power from the generator and/or external AC power to DC power, and an inverter assembly which transforms the DC power to an export AC power. The ECAPS unit directs the DC power to the DC motor to drive the variable speed compressor and varies, in a controlled manner, at least one parameter of the outputted conditioned air from the HVAC system.

A light-emitting apparatus provides a ceramic-made base body, a frame body, a light-emitting element, a conductor layer and a light-transmitting member. The base body has on its upper surface a mounting portion for the light-emitting element. The frame body is joined to the upper surface of the base body so as to surround the mounting portion, with its inner peripheral surface shaped into a reflection surface. The wiring conductor has its one end formed on the upper surface of the base body and electrically connected to the light-emitting element, and has another end led to a side or lower surface of the base body. The light-transmitting member is disposed inside the frame body so as to cover the light-emitting element, which contains fluorescent materials for performing wavelength conversion. The base body is so designed that ceramic crystal grains range in average particle diameter from 1 to 5 μm.

A light emitting diode (LED) based light engine that can replace a conventional PAR type bulb with no modifications to a host lighting fixture is provided. The light engine includes a thermally conductive housing including a generally cylindrical wall defining a cavity, an outer surface of the wall includes a plurality of axially radiating fins and disposed on an inner surface of the wall is an annular center wall dividing the cavity into a first, upper cavity and a second, lower cavity; a light module including at least one LED is disposed in the first, upper cavity and configured to contact the annular center wall, wherein heat generated by the at least one LED is conducted to the housing; and a current driver circuit arranged on a substrate is disposed in the second, lower cavity and electrically coupled to the light module.