The invention relates to the technical field of
chip packaging, and discloses a
diode packaging structure facilitating
chip packaging and a photovoltaic
junction box.The structure comprises a
copper-clad plate, the top of the
copper-clad plate is fixedly connected with one or more
chip bodies, the right side of the top of the
copper-clad plate is fixedly connected with
soldering tin, and the left side of the top of the copper-clad plate is provided with a connecting port; four positioning holes are formed in the surface of the copper-clad plate, two rectangular grooves are formed in the surface of the copper-clad plate, and a cable is fixedly connected to the left side of the copper-clad plate. The chip body is packaged through resin pouring, the mold manufacturing cost required by traditional packaging is omitted, the overall production cost is greatly reduced, the resin pouring can be accurately allocated according to the characteristics of the chip and is highly matched with the
thermal expansion coefficient of the chip, the packaging stress is greatly reduced, and the packaging efficiency is improved. The conditions of
welding spot
cracking and internal structure damage caused by stress problems in the packaging process and subsequent use of the chip are effectively avoided, and the damage risk of the chip is reduced.