11964results about "Electrical components" patented technology

A folding mechanism, where a first housing seat is provided on a first screen supporting plate, and the first screen supporting plate is rotatably fitted with the first housing seat; a second housing seat is provided on a second screen supporting plate, and the second screen supporting plate is rotatably fitted with the second housing seat; the first housing seat and the first screen supporting plate are arranged on a first side of a base, and the second housing seat and the second screen supporting plate are arranged on a second side of the base, the first side and the second side being arranged facing away from each other.

The invention relates to the technical field of high-end equipment manufacturing, and provides circuit board vertical left and right exchange frame digital exposure LDI equipment and an exposure system. The exposure assembly is arranged on the supporting seat and is used for exposing a workpiece; the first frame part is vertically arranged on the supporting seat, and is used for mounting a workpiece and enabling the workpiece to be vertical; the second frame part is vertically arranged on the supporting seat, and is used for mounting a workpiece and enabling the workpiece to be vertical; the driving assembly is used for driving the first frame part and the second frame part to move in the exposure scanning direction; and / or driving the exposure assembly to move in the exposure scanning direction. The workpiece is placed in the through hole in the vertical frame part, so that the workpiece and the frame part are both vertical, the workpiece does not need to be horizontally placed, the problems that ink on the workpiece is sucked out due to vacuumizing, and the exposure effect is poor are solved, the first frame part and the second frame part can be alternately exposed, and the exposure efficiency is improved.

The invention relates to the technical field of PCB processing, and discloses a multi-layer circuit board drilling method and device based on machine vision, and the method comprises the steps: obtaining a multi-layer circuit board image; preprocessing the multi-layer circuit board image to obtain a to-be-identified image; inputting the to-be-recognized image into a pre-trained defect detection model to obtain defect position data; carrying out point location identification and matching on the to-be-identified image to obtain an optimal hole location coordinate, and carrying out correction according to the optimal hole location coordinate to obtain hole location information data; according to the hole site information data and the defect position data, nodes are constructed respectively, distance calculation is carried out, and a hole site node graph is generated; according to the hole site node graph, performing path planning by applying an ant colony algorithm, and performing iterative search to obtain an optimal drilling path; and drilling the multilayer circuit board according to the optimal drilling path. The method has the following effect that the drilling efficiency of the multilayer circuit board can be improved.

The invention relates to automatic foam pasting and external line shaping equipment for a PCBA. The automatic foam pasting and external line shaping equipment comprises a rack, a PCBA feeding assembly, a PCBA conveying line, a foam pasting assembly and a line folding assembly. The PCBA feeding assembly comprises a feeding multi-axis mechanical arm and a feeding vacuum suction nozzle. The foam attaching assembly comprises a foam attaching frame, a foam attaching mechanical arm, a foam attaching mechanical clamping jaw and a foam attaching vacuum suction head. The line folding assembly comprises a line folding transfer assembly and a line folding mechanism; the line folding mechanism comprises a line folding frame, a line folding positioning table, a line folding fixed clamping corner air cylinder, a line folding plate and a line folding turnover driving piece, and the line folding turnover driving piece drives the line folding plate to rotate. The foam attaching manipulator of the foam attaching assembly is matched with the PCBA conveying line to achieve automatic foam attaching on the PCBA, and the efficiency is high; according to the line folding mechanism, the pins are automatically bent into the L shape through the overturned line folding plate, the foam is clamped between the pins and the PCBA, and the foam cannot be damaged by interference of the line folding plate in the whole process.

The invention relates to the technical field of PCB detection, and discloses an online defect detection method and system in the PCB production process and computer equipment, the detection accuracy can be improved by combining production parameters, image information and a design circuit diagram, potential defects can be found in the early stage, the PCB is divided into a plurality of areas, and the detection efficiency is improved. According to the PCB, each area can be independently welded and detected, the complexity of the whole PCB is reduced, the PCB is divided into a plurality of areas which are detected one by one, a specific defect area can be effectively positioned, through the regionalized detection and maintenance process, the unqualified area can be locally processed, the production efficiency is improved, and the production cost is reduced. By adopting the strategy based on multi-round detection, feedback and regional repair, through accurate positioning, local repair, detection efficiency improvement and automatic processing, the rejection rate of unqualified products is greatly reduced, the maintenance success rate is improved, and the problems of difficulty in PCB defect detection and resource waste in the prior art can be effectively solved.

A rotating shaft apparatus includes: a support assembly, including a side support member; a rotating assembly, including a rotating member and a connecting member, the rotating member is rotatably connected to the connecting member, and the side support member is rotatably connected to the connecting member; and a linkage assembly, including a linkage member, the linkage member is slidably connected to the connecting member; the side support member and the rotating member are connected to each other through a cooperation of a sliding-guiding portion and a sliding-limiting groove, the side support member and the linkage member are connected to each other through a cooperation of a sliding-stopping groove and a position-stopping portion, or the side support member and the rotating member are connected to each other through the cooperation of the sliding-stopping groove and the position-stopping portion.

The invention relates to the technical field of metal bearings, in particular to a reinforced liquid metal sliding bearing. The enhanced liquid metal sliding bearing comprises a rotor, a stator and liquid metal filled in an assembling gap between the rotor and the stator. The fixed positions of the rotor and the stator are provided with a spiral groove structure, a textured microstructure, an infiltration coating and a sealing coating. By adopting the enhanced liquid metal sliding bearing provided by the invention, the wettability and the wear resistance of a bearing rotating pair can be improved, and the problems of coating falling, wear, poor lubrication and the like of the enhanced liquid metal sliding bearing in a high-vacuum, high-temperature, high-pressure, high-speed and high-load use environment are effectively solved. High-pressure sealing is formed on the gaps between the stator and the rotor and between the limiting rings of the stator and the rotor, the liquid metal is kept in the bearing, the assembled bearing does not need a vacuum environment in the transfer process, meanwhile, external gas is prevented from entering the bearing structure, and the possibility that the liquid metal leaks or gets stuck is reduced.

The invention relates to the technical field of surface mounting control, and discloses an SMT surface mounting optimization control method and system based on multi-source data, and the method comprises the steps: collecting current surface mounting information, comparing the current surface mounting information with optimization judgment parameters, and judging whether to carry out surface mounting optimization control or not. When it is judged that optimization is carried out, historical SMT patch image data are collected, and defect feature vectors are obtained; and constructing an electrical attribute vector and a three-dimensional space distribution model of the soldering paste, executing thermal simulation calculation, and obtaining a thermal field distribution diagram of the component mounting area. And taking the defect feature vector, the electrical attribute vector and the thermal field distribution diagram as multi-source input, inputting the multi-source input into a multi-head attention neural network model, and outputting a patch optimization control parameter group. And driving the surface mounting equipment to execute surface mounting operation according to the surface mounting information and the surface mounting optimization control parameter group. According to the invention, the mounting reliability, customization capability and self-adaptability are improved, and precise and high-quality mounting control of complex special-shaped devices and high-temperature-sensitive elements can be realized.

The invention discloses a printed circuit board production parameter intelligent dynamic optimization method and system, and relates to the technical field of circuit board processing optimization, and the method comprises the steps: monitoring the real-time temperature data of a lamination part in real time; processing the real-time temperature data, and identifying a temperature unstable region in the production process; screening hot pressing roller process sections with stable temperature distribution to execute lamination operation; evaluating the risk level of the current lamination process; screening a low-risk temperature distribution mode based on the risk level to carry out lamination production, obtaining a quality deviation coefficient, and judging whether a preset process standard is met or not based on the quality deviation coefficient; and for products which do not meet the preset process standard, temperature control parameters in the production process of the products are traced, and the temperature set value of the hot pressing roller is dynamically adjusted. The method has the advantages that the real-time quantitative evaluation of the wear state of the hot pressing roller is realized, and the line width precision control capability and the interlayer alignment consistency are remarkably improved.

A bearing device includes first and second rings each having end faces and being configured to rotate relative to one another, and the second ring has an annular groove. A socket having an electrically insulating sleeve is mounted on the second ring with the insulating lining radially interposed between the second ring and the socket. End faces of the electrically insulating lining each have an annular groove with a bottom that is offset axially inward relative to the respective first and second end faces of the second ring and to the respective first and second end faces of the socket. A method includes grinding end faces of the socket and / or second ring to reduce an axial depth of the grooves in the insulating layer.

The invention provides an SMT patch correction system linked with AOI and a method thereof. The SMT patch correction system comprises a stokehole AOI detection module, a stokehole AOI detection module, a multi-dimensional sensing module, an intelligent data center module, an AI decision optimization module and a process simulation verification module. According to the method, the AOI detection data in front of and behind the furnace are fused through the intelligent data center module, the mapping relation of knowledge graph associated elements, the technology and offset data is constructed, a linkage closed loop is formed, and offset source tracing and full-process dynamic deviation correction are achieved; environmental parameters such as temperature, vibration and suction nozzle pressure are collected in real time through the multi-dimensional sensing module, and the environmental parameters are standardized through an intelligent data platform and then are included into correction logic of the AI decision optimization module, so that dynamic compensation of the influence of environmental factors on the mounting precision is realized; a deep learning and reinforcement learning cooperation strategy is adopted through the AI decision optimization module, parameters are dynamically optimized and corrected in combination with thermal deformation simulation and other multi-source information of the process simulation verification module, and the adaptability to different element types and production scenes is improved.

A hybrid airfoil bearing for a shaft is provided and includes airfoil bearing components and passive magnetic bearing components. The airfoil bearing components include a top foil immediately surrounding the shaft and additional components. The passive magnetic bearing components are integrated into the shaft and the additional components of the airfoil bearing components to remove a static load of the shaft on the top foil.

The invention discloses a tunnel-type high-speed in-situ eutectic soldering station, chip mounting equipment and a chip mounting method. The device comprises a first supporting plate, a second supporting plate, a eutectic temperature control plate group and a supporting module, wherein the first supporting plate moves horizontally; the second supporting plate is arranged on the first supporting plate in an up-down moving manner; the eutectic temperature control plate group is arranged on the second supporting plate; the first driving module is arranged on the first supporting plate and drives the second supporting plate to move up and down; the second driving module drives the supporting module to move horizontally; the eutectic temperature control plate set comprises a preheating plate, an eutectic table and a cooling plate which are sequentially arranged in the movement direction of the base plate. The eutectic welding requirement of a plurality of chips on a single substrate can be met, and the chip mounting efficiency of an intensive circuit board is improved.

A self-correcting wave soldering machine for soldering a RGB in an SMT manufacturing system. The wave soldering machine includes at least one thermal infrared camera that generates thermal images of the RGB so as to provide thermal imaging processing to monitor, characterize and predict processing temperatures. The wave soldering machine generates a heat map using the thermal images and compares the heat map to a thermal gradient to provide real time profiling by digitally connecting it to heating and other mechanically controlled systems, such as flux dispensing, conveyor speed and parallelism of the wave soldering machine.

The present invention provides a working method of an automatic folding and pushing-insertion integrated device, which drives the FPC connecting end placed on the supporting component to move by setting a movable second transverse moving component, then makes one side of the FPC connecting end move to the carrier component and is adsorbed and fixed by an adsorption device set on the carrier component, and then drives the folding component to move in the X direction and the Y direction respectively by the first transverse moving component and the first longitudinal moving component, so that the folding component is aligned with the other side of the FPC connecting end, and after alignment, the other side of the FPC connecting end is adsorbed and fixed on the folding component to realize folding, so that the other side of the FPC connecting end is accurately folded above one side of the FPC connecting end, and finally completes pre-insertion by the pre-insertion device, completes pushing and inserting by the pushing and inserting device, and moves to above the pre-insertion device by the pressing buckle component and presses the FPC connecting end inserted into the material.

Disclosed are a closed type error-proofing system for an SMT production line and an operation method therefor. The system comprises an error-proofing system APP, a background management system, a real-time production line monitoring system, an intelligent line-side warehouse system, a chip mounter intelligent self-locking system, a material splitting module, a bulk material module, a material label management system, and a central control system. The error-proofing system APP is running in Raspberry Pi; the central control system is installed on the Raspberry Pi; the Raspberry Pi is separately connected to an alarm and a power supply; and the background management system, the real-time production line monitoring system, the intelligent line-side warehouse system, the chip mounter intelligent self-locking system, the material splitting module, the bulk material module, and the material label management system are separately connected to the central control system. According to the present invention, the chip mounter intelligent self-locking system of the intelligent closed type error-proofing system for an SMT production line is used to be bound with a tray on a FEEDER and is connected to the intelligent line-side warehouse system, thereby effectively eliminating the hidden dangers of wrong station scanning, wrong material taking, wrong material collection, and wrong material replacement caused by operators not understanding the processes or not following the regulations.

A two-stage fixing device includes a base member positioned on a preset circuit board, and a positioning fastener with a holder base thereof positioned on the base member. The holder base has first and second positioning blocks used to resist a first interface card and a second interface card that are plugged into respective preset electrical connectors on the preset circuit board, thereby stably positioning them on the holder base. By moving the holder base and the operating portion of the clasp, the first and second elastic members on the holder base can each retreat and tilt through elastic compression deformation. Then, the first and second interface cards can be separated from the positioning fastener, so as to achieve the purpose of rapid positioning and disassembly of multiple interface cards in the present invention.

The invention relates to the technical field of circuit board assembly, and discloses an automatic circuit board feeding device and method.The automatic circuit board feeding device comprises a machining platform, a feeding mechanism is installed at the bottom of the machining platform and used for controlling a plurality of supporting plates to vertically move, a material suction arm is slidably connected to the rear side of the top of the machining platform, and a mounting mold is arranged on the left side of the machining platform; a deviation rectifying mechanism is arranged in the material suction arm, a material suction plate is installed at the bottom of the material suction arm, a detection lamp is installed in the middle of the machining platform and used for visually detecting a circuit board, and a recycling mechanism is arranged on the side, close to the material suction arm, of the rear end of the machining platform. Related gears, threaded rods and other parts are driven by the motor, accurate positioning and efficient conveying of the tray are achieved, the material suction arm can automatically suck circuit boards, all the parts are in close cooperation, the automation degree is high, manual operation links are greatly reduced, and the feeding time is effectively shortened.

The invention relates to the technical field of electronic manufacturing, in particular to a PCB SMT mounting method and system based on optical recognition, and the method comprises the steps: carrying out the datum point collection of a pre-confirmed circuit board, obtaining an actual datum point image, carrying out the deviation calculation through employing a theoretical datum point image and the actual datum point image, obtaining an offset, obtaining a plurality of qualified mounting elements, and carrying out the recognition of the qualified mounting elements. The method comprises the following steps: carrying out offset analysis on qualified surface-mounted components to obtain a component center coordinate offset value, carrying out movement compensation on surface-mounted coordinates by utilizing the offset and the component center coordinate offset value to obtain target surface-mounted coordinates, and carrying out surface-mounted on a plurality of qualified surface-mounted components corresponding to a plurality of target surface-mounted coordinates based on the plurality of target surface-mounted coordinates. And carrying out continuous tin defect detection on the surface-mounted circuit board, and taking the surface-mounted circuit board of which the defect score is greater than a defect score threshold as a finished product circuit board. According to the invention, the problems of positioning deviation and tin connection welding quality defects during circuit board mounting can be solved.

Disclosed in the present invention is a method for improving the UPH of SMT mounting, the method comprising: on the basis of task information, determining information of a first component to be mounted; on the basis of the information of said first component and component information and nozzle information in a component database, analyzing parameters of influence factors, so as to determine efficiency-reducing influence factors on the basis of the parameters of the influence factors; on the basis of parameters of the efficiency-reducing influence factors, determining information of a second component to be mounted; on the basis of the information of said second component, filling an analysis report; and sending the analysis report to a user, and receiving information of a third component to be mounted that is determined on the basis of the analysis report. In the method provided in the present invention, parameters of influence factors that influence the UPH are automatically analyzed on the basis of component information of components to be mounted, so as to quickly determine efficiency-reducing influence factors, and an analysis report determined on the basis of parameters of the efficiency-reducing influence factors is sent to a user. The method can increase the speed of determining efficiency-reducing influencing factors, thereby improving the UPH and achieving the aims of energy conservation and emission reduction.

The invention discloses full-automatic FPC detaching and planting equipment which comprises a rack, a stock bin lifting track, a carrier conveying track, a pushing mechanism, a steel sheet lifting mechanism, a first tray lifting track, a second tray lifting track, a detaching and planting plate mechanical arm and a tray replacing mechanical arm, wherein the stock bin lifting track, the carrier conveying track, the pushing mechanism, the steel sheet lifting mechanism, the first tray lifting track, the second tray lifting track, the detaching and planting plate mechanical arm and the tray replacing mechanical arm are installed on the rack. According to the automatic plate dismounting and mounting device, plates can be automatically dismounted and mounted, the problem that in the prior art, the function is single is solved, the practicability and the automation degree of equipment are greatly improved, and the working efficiency is improved.

The invention relates to the technical field of PCBA chip mounters, and particularly discloses a processing device and a processing method for a display PCB, the processing device comprises a main frame and a PCBA chip mounter, and the PCBA chip mounter is arranged at the bottom end of an inner cavity of the main frame; the number of the paster assemblies is multiple, and the paster assemblies are arranged at the top of the front side of the PCBA chip mounter at equal intervals in the left-right direction. The device can monitor the downward pressure of the chip mounting claw on the PCB in real time, and ensures that the downward pressure is always maintained in a safe and reasonable range, thereby avoiding the breakage of the PCB caused by overlarge downward pressure, remarkably reducing the risks of material loss and production interruption, improving the overall stability and production efficiency of a production line, and reducing the production cost. In addition, the method can also effectively recognize and correct the condition that the components are inserted obliquely, greatly improves the reliability of circuit connection and the final performance of products, reduces the reject ratio and repair cost of the products, and brings remarkable economic benefits and competitive advantages for enterprises.

A cleaner including a suction head; a main body; and a motor to form a suction airflow from the suction head to the main body. The motor includes a stator; a rotor; and an impeller coupled to the rotor and configured to generate an airflow by being rotated. The motor includes a housing that includes a base portion including a receiving space provided to accommodate the rotor and the stator; and a cover portion including a through-hole through which the rotor passes, the cover portion provided to cover the impeller. The base portion includes a bearing hole formed in an upper portion of the base portion to install a bearing provided to support the rotor; and a stator insertion hole formed to be open on a lateral side of the base portion to allow the stator to be inserted into the receiving space.

According to the semi-automatic pushing and connecting equipment and method based on multiple stations, the materials in the material storage device are continuously conveyed to the cut-off assembly through the conveying assembly, then the situation that the materials enter the cut-off assembly is detected through the visual module, and therefore the materials can be reliably conveyed to the pre-inserting device conveniently when the front faces and the back faces of the materials are in different states; then, one side of the FPC connecting end is moved to the bearing assembly through the material supporting device and is adsorbed and fixed through the adsorption device arranged on the bearing assembly, the position of the FPC connecting end is adjusted in the plane through the turnover device to be aligned with the other side of the FPC connecting end, the FPC connecting end is turned over after alignment, pre-insertion is completed through the pre-insertion device, and push-insertion is completed through the push-insertion device; and finally, the pushed and inserted materials and the FPC connecting ends are pressed through the pressing buckle assembly, so that the FPC connecting ends of different sizes can be pushed and inserted, and different materials can be accurately connected with the FPC connecting ends of different models.

A component mounting device comprises a mounting head being configured to mount a component from a carrier tape onto a substrate, a component supply unit being configured to convey the carrier tape, a holder, and a carrier tape holding device providing a first storage space in communication with the holder. The carrier tape holding device is configured to perform operations comprising: holding the carrier tape that, when conveyed by the component supply unit, is pulled out from a tape roll body stored in the first storage space, having a tape roll body for replenishment stored in the holder; and receiving the tape roll body for replenishment from the holder when the carrier tape of the tape roll body for replenishment is conveyed by the component supply unit.

An end effector and a light bar assembling device having the end effector are provided. The light bar assembling device is configured to assemble a light bar with a backplane, and includes: an adjusting platform configured to carry the light bar to be assembled and adjust a position of the light bar to be assembled on the adjusting platform; and a robot assembling mechanism configured to obtain a light bar after being adjusted in position from the adjusting platform, and assemble the light bar with the backplane, wherein the robot assembling mechanism includes a mechanical arm and an end effector at a free end of the mechanical arm, and the end effector includes: a first connecting seat, a first frame, a first pick-and-place mechanism including at least two first suction cup groups, and a first positioning mechanism including at least two first positioning pins.

A power tool is provided including a housing having a grip portion with a grip circumference of smaller than or equal to approximately 120 mm; and a brushless direct-current (BLDC) motor at least partially disposed within the grip portion of the housing and configured to output a maximum power output of at least 450 watts. The motor includes a stator including a stator core and stator windings; and a rotor rotatably received within the stator and including a rotor shaft extending along a longitudinal axis and a series of permanent magnet rings mounted sequentially along the longitudinal axis and surrounding the rotor shaft, each permanent magnet including a plurality of magnetic poles.

The invention discloses an automatic tin plating device for circuit board chip welding, and relates to the technical field of chip welding, the automatic tin plating device comprises a tin liquid pool, a chip feeding workbench, a four-way conveying mechanism and a thermal resistance mechanism, a chip stacking cylinder is vertically installed on the chip feeding workbench, the thermal resistance mechanism comprises a rack, a lifting seat, a finger air cylinder and a cold sheet, and the lifting seat is connected with the finger air cylinder. The lifting seat is installed on the rack, a finger air cylinder is installed at one end of the lifting seat, two clamping jaws of the finger air cylinder are each provided with a cold piece, cold air is introduced into the cold pieces, the four-way conveying mechanism comprises a portal frame, a three-way conveying mechanism and an overturning plate, and the three-way conveying mechanism is installed on the portal frame; the three-direction conveying mechanism has moving freedom degrees in the X direction, the Y direction and the Z direction in a space coordinate system, the overturning plate is rotationally installed on the three-direction conveying mechanism, a rotating disc is rotationally installed at the bottom of the overturning plate, and a negative pressure suction cup is arranged on the rotating disc. And the cold sheet can isolate high temperature from being transmitted to the chip, so that the chip can be well protected from being influenced in the tin plating process.