7601results about "Electrical components" patented technology

A folding mechanism, where a first housing seat is provided on a first screen supporting plate, and the first screen supporting plate is rotatably fitted with the first housing seat; a second housing seat is provided on a second screen supporting plate, and the second screen supporting plate is rotatably fitted with the second housing seat; the first housing seat and the first screen supporting plate are arranged on a first side of a base, and the second housing seat and the second screen supporting plate are arranged on a second side of the base, the first side and the second side being arranged facing away from each other.

The invention relates to the technical field of high-end equipment manufacturing, and provides circuit board vertical left and right exchange frame digital exposure LDI equipment and an exposure system. The exposure assembly is arranged on the supporting seat and is used for exposing a workpiece; the first frame part is vertically arranged on the supporting seat, and is used for mounting a workpiece and enabling the workpiece to be vertical; the second frame part is vertically arranged on the supporting seat, and is used for mounting a workpiece and enabling the workpiece to be vertical; the driving assembly is used for driving the first frame part and the second frame part to move in the exposure scanning direction; and / or driving the exposure assembly to move in the exposure scanning direction. The workpiece is placed in the through hole in the vertical frame part, so that the workpiece and the frame part are both vertical, the workpiece does not need to be horizontally placed, the problems that ink on the workpiece is sucked out due to vacuumizing, and the exposure effect is poor are solved, the first frame part and the second frame part can be alternately exposed, and the exposure efficiency is improved.

The invention relates to the technical field of PCB processing, and discloses a multi-layer circuit board drilling method and device based on machine vision, and the method comprises the steps: obtaining a multi-layer circuit board image; preprocessing the multi-layer circuit board image to obtain a to-be-identified image; inputting the to-be-recognized image into a pre-trained defect detection model to obtain defect position data; carrying out point location identification and matching on the to-be-identified image to obtain an optimal hole location coordinate, and carrying out correction according to the optimal hole location coordinate to obtain hole location information data; according to the hole site information data and the defect position data, nodes are constructed respectively, distance calculation is carried out, and a hole site node graph is generated; according to the hole site node graph, performing path planning by applying an ant colony algorithm, and performing iterative search to obtain an optimal drilling path; and drilling the multilayer circuit board according to the optimal drilling path. The method has the following effect that the drilling efficiency of the multilayer circuit board can be improved.

The invention relates to the technical field of PCB detection, and discloses an online defect detection method and system in the PCB production process and computer equipment, the detection accuracy can be improved by combining production parameters, image information and a design circuit diagram, potential defects can be found in the early stage, the PCB is divided into a plurality of areas, and the detection efficiency is improved. According to the PCB, each area can be independently welded and detected, the complexity of the whole PCB is reduced, the PCB is divided into a plurality of areas which are detected one by one, a specific defect area can be effectively positioned, through the regionalized detection and maintenance process, the unqualified area can be locally processed, the production efficiency is improved, and the production cost is reduced. By adopting the strategy based on multi-round detection, feedback and regional repair, through accurate positioning, local repair, detection efficiency improvement and automatic processing, the rejection rate of unqualified products is greatly reduced, the maintenance success rate is improved, and the problems of difficulty in PCB defect detection and resource waste in the prior art can be effectively solved.

The invention relates to the technical field of surface mounting control, and discloses an SMT surface mounting optimization control method and system based on multi-source data, and the method comprises the steps: collecting current surface mounting information, comparing the current surface mounting information with optimization judgment parameters, and judging whether to carry out surface mounting optimization control or not. When it is judged that optimization is carried out, historical SMT patch image data are collected, and defect feature vectors are obtained; and constructing an electrical attribute vector and a three-dimensional space distribution model of the soldering paste, executing thermal simulation calculation, and obtaining a thermal field distribution diagram of the component mounting area. And taking the defect feature vector, the electrical attribute vector and the thermal field distribution diagram as multi-source input, inputting the multi-source input into a multi-head attention neural network model, and outputting a patch optimization control parameter group. And driving the surface mounting equipment to execute surface mounting operation according to the surface mounting information and the surface mounting optimization control parameter group. According to the invention, the mounting reliability, customization capability and self-adaptability are improved, and precise and high-quality mounting control of complex special-shaped devices and high-temperature-sensitive elements can be realized.

The invention discloses a printed circuit board production parameter intelligent dynamic optimization method and system, and relates to the technical field of circuit board processing optimization, and the method comprises the steps: monitoring the real-time temperature data of a lamination part in real time; processing the real-time temperature data, and identifying a temperature unstable region in the production process; screening hot pressing roller process sections with stable temperature distribution to execute lamination operation; evaluating the risk level of the current lamination process; screening a low-risk temperature distribution mode based on the risk level to carry out lamination production, obtaining a quality deviation coefficient, and judging whether a preset process standard is met or not based on the quality deviation coefficient; and for products which do not meet the preset process standard, temperature control parameters in the production process of the products are traced, and the temperature set value of the hot pressing roller is dynamically adjusted. The method has the advantages that the real-time quantitative evaluation of the wear state of the hot pressing roller is realized, and the line width precision control capability and the interlayer alignment consistency are remarkably improved.

The invention provides an SMT patch correction system linked with AOI and a method thereof. The SMT patch correction system comprises a stokehole AOI detection module, a stokehole AOI detection module, a multi-dimensional sensing module, an intelligent data center module, an AI decision optimization module and a process simulation verification module. According to the method, the AOI detection data in front of and behind the furnace are fused through the intelligent data center module, the mapping relation of knowledge graph associated elements, the technology and offset data is constructed, a linkage closed loop is formed, and offset source tracing and full-process dynamic deviation correction are achieved; environmental parameters such as temperature, vibration and suction nozzle pressure are collected in real time through the multi-dimensional sensing module, and the environmental parameters are standardized through an intelligent data platform and then are included into correction logic of the AI decision optimization module, so that dynamic compensation of the influence of environmental factors on the mounting precision is realized; a deep learning and reinforcement learning cooperation strategy is adopted through the AI decision optimization module, parameters are dynamically optimized and corrected in combination with thermal deformation simulation and other multi-source information of the process simulation verification module, and the adaptability to different element types and production scenes is improved.

The present invention provides a working method of an automatic folding and pushing-insertion integrated device, which drives the FPC connecting end placed on the supporting component to move by setting a movable second transverse moving component, then makes one side of the FPC connecting end move to the carrier component and is adsorbed and fixed by an adsorption device set on the carrier component, and then drives the folding component to move in the X direction and the Y direction respectively by the first transverse moving component and the first longitudinal moving component, so that the folding component is aligned with the other side of the FPC connecting end, and after alignment, the other side of the FPC connecting end is adsorbed and fixed on the folding component to realize folding, so that the other side of the FPC connecting end is accurately folded above one side of the FPC connecting end, and finally completes pre-insertion by the pre-insertion device, completes pushing and inserting by the pushing and inserting device, and moves to above the pre-insertion device by the pressing buckle component and presses the FPC connecting end inserted into the material.

The invention relates to the technical field of electronic manufacturing, in particular to a PCB SMT mounting method and system based on optical recognition, and the method comprises the steps: carrying out the datum point collection of a pre-confirmed circuit board, obtaining an actual datum point image, carrying out the deviation calculation through employing a theoretical datum point image and the actual datum point image, obtaining an offset, obtaining a plurality of qualified mounting elements, and carrying out the recognition of the qualified mounting elements. The method comprises the following steps: carrying out offset analysis on qualified surface-mounted components to obtain a component center coordinate offset value, carrying out movement compensation on surface-mounted coordinates by utilizing the offset and the component center coordinate offset value to obtain target surface-mounted coordinates, and carrying out surface-mounted on a plurality of qualified surface-mounted components corresponding to a plurality of target surface-mounted coordinates based on the plurality of target surface-mounted coordinates. And carrying out continuous tin defect detection on the surface-mounted circuit board, and taking the surface-mounted circuit board of which the defect score is greater than a defect score threshold as a finished product circuit board. According to the invention, the problems of positioning deviation and tin connection welding quality defects during circuit board mounting can be solved.

The invention discloses full-automatic FPC detaching and planting equipment which comprises a rack, a stock bin lifting track, a carrier conveying track, a pushing mechanism, a steel sheet lifting mechanism, a first tray lifting track, a second tray lifting track, a detaching and planting plate mechanical arm and a tray replacing mechanical arm, wherein the stock bin lifting track, the carrier conveying track, the pushing mechanism, the steel sheet lifting mechanism, the first tray lifting track, the second tray lifting track, the detaching and planting plate mechanical arm and the tray replacing mechanical arm are installed on the rack. According to the automatic plate dismounting and mounting device, plates can be automatically dismounted and mounted, the problem that in the prior art, the function is single is solved, the practicability and the automation degree of equipment are greatly improved, and the working efficiency is improved.

A component mounting device comprises a mounting head being configured to mount a component from a carrier tape onto a substrate, a component supply unit being configured to convey the carrier tape, a holder, and a carrier tape holding device providing a first storage space in communication with the holder. The carrier tape holding device is configured to perform operations comprising: holding the carrier tape that, when conveyed by the component supply unit, is pulled out from a tape roll body stored in the first storage space, having a tape roll body for replenishment stored in the holder; and receiving the tape roll body for replenishment from the holder when the carrier tape of the tape roll body for replenishment is conveyed by the component supply unit.

A power tool is provided including a housing having a grip portion with a grip circumference of smaller than or equal to approximately 120 mm; and a brushless direct-current (BLDC) motor at least partially disposed within the grip portion of the housing and configured to output a maximum power output of at least 450 watts. The motor includes a stator including a stator core and stator windings; and a rotor rotatably received within the stator and including a rotor shaft extending along a longitudinal axis and a series of permanent magnet rings mounted sequentially along the longitudinal axis and surrounding the rotor shaft, each permanent magnet including a plurality of magnetic poles.

The invention discloses an automatic tin plating device for circuit board chip welding, and relates to the technical field of chip welding, the automatic tin plating device comprises a tin liquid pool, a chip feeding workbench, a four-way conveying mechanism and a thermal resistance mechanism, a chip stacking cylinder is vertically installed on the chip feeding workbench, the thermal resistance mechanism comprises a rack, a lifting seat, a finger air cylinder and a cold sheet, and the lifting seat is connected with the finger air cylinder. The lifting seat is installed on the rack, a finger air cylinder is installed at one end of the lifting seat, two clamping jaws of the finger air cylinder are each provided with a cold piece, cold air is introduced into the cold pieces, the four-way conveying mechanism comprises a portal frame, a three-way conveying mechanism and an overturning plate, and the three-way conveying mechanism is installed on the portal frame; the three-direction conveying mechanism has moving freedom degrees in the X direction, the Y direction and the Z direction in a space coordinate system, the overturning plate is rotationally installed on the three-direction conveying mechanism, a rotating disc is rotationally installed at the bottom of the overturning plate, and a negative pressure suction cup is arranged on the rotating disc. And the cold sheet can isolate high temperature from being transmitted to the chip, so that the chip can be well protected from being influenced in the tin plating process.

The invention relates to the technical field of chip mounter control, and provides a chip mounter production process optimization method and system based on software and hardware co-processing, and the method comprises the steps that an upper computer issues a loading disc replacement instruction to a chip mounter sub-module through an immediate execution channel of a main control board so as to immediately execute loading disc replacement, a suction instruction and a monitoring instruction are issued to the chip mounter sub-module through the main process channel to execute a suction action; wherein the sucking instructions and the monitoring instructions are executed in sequence in a queue form, the sucking instructions comprise a feeder element sucking instruction and a loading disc element sucking instruction, and the monitoring instruction is arranged in front of each loading disc element sucking instruction so as to ensure that the loading disc element sucking instruction is executed after the corresponding loading disc replacement instruction is completed. According to the scheme, the automatic tray and the suction mounting control logic in the production process are divided into two independent modules, the sequence of instructions issued by the two modules during actual execution is guaranteed through the instruction monitoring function, and the response speed of equipment is increased.

An electronic assembly includes a shaft assembly and housings arranged oppositely. The shaft assembly includes a first shaft case, first rotating members, and rotating units. The first rotating members are at least partially disposed at two opposite sides of the first shaft case. Each of the first rotating members has one end rotatably connected with the first shaft case and the other end connected with the housings. The rotating units are at least partially disposed at the two opposite sides of the first shaft case. Each of the rotating units includes a second rotating member and a movable plate. The second rotating member has one end rotatably connected with the first shaft case and the other end connected with the movable plate. The movable plate has one end connected to the housings.

A hub motor includes a housing rotatably disposed to a first shaft and a second shaft, and a motor installed in the housing and having a stator and a rotor. A reduction mechanism is installed in the housing, including a gear shaft connected with the rotor, a fixed bracket connected with the stator, a movable bracket disposed on the gear shaft and the second shaft, a first ring gear disposed to the fixed bracket, a second ring gear disposed to the housing, multiple first planet gears disposed to the movable bracket and meshed with the gear shaft and the first ring gear, and multiple second planet gears disposed to the second shaft and meshed with the movable bracket and the second ring gear. By 10 inserting a hollow tube into the first shaft, the gear shaft, the movable bracket, and the second shaft, the waterproof and dustproof performance can be enhanced.

The invention discloses a positioning calibration method of surface mounting equipment, equipment, a medium and a product, and relates to the technical field of printed circuit boards, a first position of a bonding pad on a circuit board and a second position of an element pin of an element to be mounted are obtained through recognition by using an image recognition model, the confidence coefficient is recorded, and when matching calculation is carried out, the positioning calibration accuracy is improved. And carrying out position transformation calculation on the positions of the bonding pad and the element pin matched in the current iteration, calculating a transformed position error in combination with the confidence coefficient, and outputting a final matching result of the bonding pad and the element pin and a corresponding final space mapping parameter after a first iterative calculation condition is met. According to the method, the influence of a low-confidence-coefficient position detection result on space mapping parameter calculation is effectively reduced, the stability and reliability of the final space mapping parameter are ensured, compared with traditional position error calculation, the method has higher anti-interference capability, and the accuracy of positioning matching of high surface mounting equipment is improved.

The utility model relates to the technical field of semiconductors, in particular to a chip mounter binding head device and a correction mounting system, and the chip mounter binding head device comprises a driving assembly and a suction nozzle assembly. The driving assembly comprises a driving part and a connecting assembly connected with the driving part, the suction nozzle assembly comprises an adsorption assembly and a suction nozzle detachably connected with one end of the adsorption assembly, and the other end of the adsorption assembly is connected with the driving part through the connecting assembly; a hollow cavity with two through ends is formed in the driving part, the suction nozzle is at least partially transparent, an adsorption hole with two through ends is formed in the suction nozzle, the driving part is communicated with the adsorption hole in the suction nozzle through the hollow cavity, and the adsorption assembly and the suction nozzle are located at an opening in one end of the hollow cavity; a first air path is arranged in the connecting assembly, a ventilation module is externally connected to the first air path, a second air path is arranged in the adsorption assembly, and when the suction nozzle is connected with the adsorption assembly, the ventilation module is in air path conduction with the suction nozzle through the first air path and the second air path in sequence.

The invention relates to the field of chip mounters, and discloses a nano-silver pre-sintering chip mounter which comprises a rack, a base material conveying device, a chip mounting head device, a heating sintering chip mounting platform, a crystal ring feeding device and a TRAY disc feeding device, the chip mounting head device is erected on the rack, the base material conveying device is arranged on the lower side of the chip mounting head device, the heating sintering chip mounting platform is arranged on the lower side of the chip mounting head device, and the TRAY disc feeding device is arranged on the lower side of the chip mounting head device. The heating platform is arranged in front of the base material conveying device; the wafer ring feeding device is arranged on the right side of the front end of the machine frame, the TRAY disc feeding device is arranged on the left side of the front end of the machine frame, components can be accurately mounted on a circuit board or other carriers, the mounting requirements of most of products in the market are met, the structure is more compact, the mounting efficiency is higher, and the mounting precision is higher.

The invention provides a flexible PCBA (Printed Circuit Board Assembly) processing positioning optimization method, which relates to the technical field of accurate positioning control, and is characterized in that a temperature field area is divided based on temperature data, a mapping relation between a temperature gradient and pad displacement is established, and the thermal displacement of a reference pad is dynamically compensated in combination with a fitted stress-strain function. Meanwhile, the dynamic alignment control of the mounting head is optimized, the problem of pad position offset caused by thermal expansion and deformation in the flexible PCBA processing process can be effectively solved, the problem of accurate positioning of dislocation of an IC chip and a pad caused by thermal expansion and local deformation of a substrate in the COF mounting process of the flexible PCBA can be solved to a certain extent, and the accuracy of chip mounting is improved. Therefore, the processing quality and reliability of the flexible PCBA are obviously improved.

The invention provides a pre-pressing mechanism and a corresponding full-automatic bonding machine, the full-automatic bonding machine comprises a first feeding mechanism, a second feeding mechanism, an ACF attaching mechanism, the pre-pressing mechanism, a main pressing mechanism and a carrying system which are arranged on a base, the first feeding mechanism is used for feeding panel products, the second feeding mechanism is used for feeding chip products, and the ACF attaching mechanism is used for attaching the chip products. A butt joint groove used for being connected with a punching feeding mechanism of the COF product is formed in one side of the base. A pre-pressing mechanical arm of the pre-pressing mechanism comprises a suction block, a first suction hole and a second suction hole are formed in the suction block, the first suction hole is a round hole and used for sucking COF products, and the second suction hole is a long-strip hole and used for sucking chips. By arranging the first feeding structure and the butt joint groove, feeding of the chip products or the COF products is achieved, meanwhile, the pre-pressing mechanical arm is provided with the first suction hole and the second suction hole which can grab the chip products or the COF products in a compatible mode, equipment compatibility is high, cost is low, and benefits are high.

A bulk feeder includes a feeder main body, a track member provided to be vibratable with respect to the feeder main body and formed with a conveyance path through which multiple components are conveyed and a supply region that communicates with the conveyance path and opens upward to collect the multiple components, an excitation device configured to apply vibration to the track member so that the multiple components are conveyed along the conveyance path, a shutter provided above the track member to close an opening of the supply region, and a driving device configured to open or close the shutter to separate the shutter from the track member when the shutter shifts from a closed state to an open state.

Methods, systems, and apparatuses for grounding of integrated external electromagnetic interference (EMI) shields are provided. A portion of a module substrate, different from a circuit board substrate, may protrude past the module as a location for one or more grounding pads to which the EMI shield is grounded. The EMI shield may cover at least a portion of the thickness of the module substrate. The EMI shield may be comprised of one or more parts, which may be coupled to one another. The module substrate may include conductive vias. The EMI shield may include a sprayed and / or printed coating. The EMI shield may include a darkened coating.

A magnetic bearing system (100) includes a rotary shaft (101) and a magnetic bearing (105, 107, 130) having an electromagnet coil (106, 108, 108B, 135, 136). One end of the electromagnet coil (106, 108, 108B, 135, 136) is connected to the neutral point of a first multi-phase winding (113, 115, 123, 125, 173, 181) having at least three or more phases.

To provide a mounting device and a mounting method capable of realizing high accuracy mounting in which a mounting accuracy becomes 1 μm or less in a face-down mounting for mounting a chip component and a substrate in a manner that both of electrode surfaces face each other.SOLUTION: A mounting device comprises: an attachment tool having transparency and having a tool recognition mart, for holding a chip component; chip position recognition means for acquiring position information on a chip recognition mark and the tool recognition mark at the same time in a state where the chip component is held by the attachment tool; and substrate position recognition means for acquiring the position information on a substrate recognition mark and the tool recognition marl. On the basis of information obtained by the chip position recognition means and the information obtained by the substrate position recognition means, the substrate stage or the attachment tool is moved in a substrate inner surface direction and positioning of the chip component and the substrate is performed. A mounting method is also provided.SELECTED DRAWING: Figure 1

Systems and methods for controlled-force thermal management device installation that helps thermal management of emerging, next-generation devices are provided. A system includes a mounting assembly for a thermal management device. The mounting assembly includes a fastener and a coupler. The system further includes a compression and locking interface configured to lock with the coupler and compress the mounting assembly to a predetermined loading point using a controlled force. The fastener is installed when the mounting assembly is at the predetermined loading point.

A control unit (1) with integrated energy conditioning and integrated energy management for controlling an electrically operated and / or controlled actuator (2) is proposed, comprising: a controller unit (4) for generating a control signal for the actuator (2); a connection (AC) for connecting the control unit (1) to an external electrical power supply providing a mains voltage (VAC0); a circuit arrangement (8) for conditioning, rectifying, and converting the mains voltage (VAC0) into a first DC link voltage (VCC1), wherein the level of the first DC link voltage (VCC1) is independent of the level of the mains voltage (VAC0);at least one electrical intermediate storage device (7) for the first DC link voltage (VCC1) to buffer a necessary power for maintaining at least one further voltage derived from the first DC link voltage (VCC2, VCC3) to supply the controller unit (4) in the event of failure of the external electrical power supply and for transferring the actuator (2) into a safe state, for example in the event of failure of the external electrical power supply.

The invention relates to the technical field of suction nozzle assemblies, in particular to a pickup mechanism capable of quickly replacing suction nozzles, which comprises a rack and a butt joint mechanism, a mounting ring is rotationally arranged on the rack, at least two suction nozzles are arranged on the mounting ring, a rotation driving assembly used for driving the mounting ring to rotate is arranged on the rack, and a connecting pipe communicated with an air pump is further arranged on the rack; the rack is provided with a butt joint mechanism used for controlling communication of the connecting pipe and the suction nozzle. According to the invention, the function of quickly replacing the suction nozzle is realized. When small-batch and multi-type electric devices are transferred, the suction nozzles of the corresponding types can be rapidly replaced according to the types of the electric devices. The problem that different suction nozzles of a traditional device cannot be replaced according to the requirements of small-batch parts is solved. Compared with a traditional picking mechanism, the picking mechanism has the advantages that the corresponding suction nozzles are installed on the installation ring in advance, then the air pump and the suction nozzles are communicated through the butt joint mechanism, the air pump is made to be communicated with only one suction nozzle all the time in the working state, and then needed negative pressure can be stably provided.

The utility model relates to the technical field of electronic component surface mounting, in particular to an electronic component surface mounting device. The chip mounter comprises a machine body, an air cylinder is fixedly connected to the upper surface of the machine body, a chip mounting head is fixedly connected to the output end of the air cylinder, a supporting table is arranged below the chip mounting head, the lower surface of the supporting table is fixedly connected with the machine body, a fixing device is arranged on the upper surface of the machine body, and the fixing device comprises four positioning blocks. The lower surfaces of the four positioning blocks are fixedly connected with the machine body, the four positioning blocks are evenly distributed on the upper surface of the machine body, one end of the machine body is fixedly connected with a supporting plate, a driving motor is arranged on the upper surface of the supporting plate, the output end of the driving motor is fixedly connected with a screw rod, the screw rod penetrates through the two positioning blocks in a threaded mode, and the two positioning blocks are fixedly connected with the machine body. The arc surface of the screw rod is provided with a bidirectional thread, and the arc surface of the screw rod is in threaded connection with two adjusting plates. The problem that manual fixing efficiency is low is solved.