3827results about "Electrical components" patented technology

The invention relates to the technical field of surface mounting control, and discloses an SMT surface mounting optimization control method and system based on multi-source data, and the method comprises the steps: collecting current surface mounting information, comparing the current surface mounting information with optimization judgment parameters, and judging whether to carry out surface mounting optimization control or not. When it is judged that optimization is carried out, historical SMT patch image data are collected, and defect feature vectors are obtained; and constructing an electrical attribute vector and a three-dimensional space distribution model of the soldering paste, executing thermal simulation calculation, and obtaining a thermal field distribution diagram of the component mounting area. And taking the defect feature vector, the electrical attribute vector and the thermal field distribution diagram as multi-source input, inputting the multi-source input into a multi-head attention neural network model, and outputting a patch optimization control parameter group. And driving the surface mounting equipment to execute surface mounting operation according to the surface mounting information and the surface mounting optimization control parameter group. According to the invention, the mounting reliability, customization capability and self-adaptability are improved, and precise and high-quality mounting control of complex special-shaped devices and high-temperature-sensitive elements can be realized.

The invention provides an SMT patch correction system linked with AOI and a method thereof. The SMT patch correction system comprises a stokehole AOI detection module, a stokehole AOI detection module, a multi-dimensional sensing module, an intelligent data center module, an AI decision optimization module and a process simulation verification module. According to the method, the AOI detection data in front of and behind the furnace are fused through the intelligent data center module, the mapping relation of knowledge graph associated elements, the technology and offset data is constructed, a linkage closed loop is formed, and offset source tracing and full-process dynamic deviation correction are achieved; environmental parameters such as temperature, vibration and suction nozzle pressure are collected in real time through the multi-dimensional sensing module, and the environmental parameters are standardized through an intelligent data platform and then are included into correction logic of the AI decision optimization module, so that dynamic compensation of the influence of environmental factors on the mounting precision is realized; a deep learning and reinforcement learning cooperation strategy is adopted through the AI decision optimization module, parameters are dynamically optimized and corrected in combination with thermal deformation simulation and other multi-source information of the process simulation verification module, and the adaptability to different element types and production scenes is improved.

The invention relates to the technical field of electronic manufacturing, in particular to a PCB SMT mounting method and system based on optical recognition, and the method comprises the steps: carrying out the datum point collection of a pre-confirmed circuit board, obtaining an actual datum point image, carrying out the deviation calculation through employing a theoretical datum point image and the actual datum point image, obtaining an offset, obtaining a plurality of qualified mounting elements, and carrying out the recognition of the qualified mounting elements. The method comprises the following steps: carrying out offset analysis on qualified surface-mounted components to obtain a component center coordinate offset value, carrying out movement compensation on surface-mounted coordinates by utilizing the offset and the component center coordinate offset value to obtain target surface-mounted coordinates, and carrying out surface-mounted on a plurality of qualified surface-mounted components corresponding to a plurality of target surface-mounted coordinates based on the plurality of target surface-mounted coordinates. And carrying out continuous tin defect detection on the surface-mounted circuit board, and taking the surface-mounted circuit board of which the defect score is greater than a defect score threshold as a finished product circuit board. According to the invention, the problems of positioning deviation and tin connection welding quality defects during circuit board mounting can be solved.

A component mounting device comprises a mounting head being configured to mount a component from a carrier tape onto a substrate, a component supply unit being configured to convey the carrier tape, a holder, and a carrier tape holding device providing a first storage space in communication with the holder. The carrier tape holding device is configured to perform operations comprising: holding the carrier tape that, when conveyed by the component supply unit, is pulled out from a tape roll body stored in the first storage space, having a tape roll body for replenishment stored in the holder; and receiving the tape roll body for replenishment from the holder when the carrier tape of the tape roll body for replenishment is conveyed by the component supply unit.

The invention provides a flexible PCBA (Printed Circuit Board Assembly) processing positioning optimization method, which relates to the technical field of accurate positioning control, and is characterized in that a temperature field area is divided based on temperature data, a mapping relation between a temperature gradient and pad displacement is established, and the thermal displacement of a reference pad is dynamically compensated in combination with a fitted stress-strain function. Meanwhile, the dynamic alignment control of the mounting head is optimized, the problem of pad position offset caused by thermal expansion and deformation in the flexible PCBA processing process can be effectively solved, the problem of accurate positioning of dislocation of an IC chip and a pad caused by thermal expansion and local deformation of a substrate in the COF mounting process of the flexible PCBA can be solved to a certain extent, and the accuracy of chip mounting is improved. Therefore, the processing quality and reliability of the flexible PCBA are obviously improved.

The invention provides a pre-pressing mechanism and a corresponding full-automatic bonding machine, the full-automatic bonding machine comprises a first feeding mechanism, a second feeding mechanism, an ACF attaching mechanism, the pre-pressing mechanism, a main pressing mechanism and a carrying system which are arranged on a base, the first feeding mechanism is used for feeding panel products, the second feeding mechanism is used for feeding chip products, and the ACF attaching mechanism is used for attaching the chip products. A butt joint groove used for being connected with a punching feeding mechanism of the COF product is formed in one side of the base. A pre-pressing mechanical arm of the pre-pressing mechanism comprises a suction block, a first suction hole and a second suction hole are formed in the suction block, the first suction hole is a round hole and used for sucking COF products, and the second suction hole is a long-strip hole and used for sucking chips. By arranging the first feeding structure and the butt joint groove, feeding of the chip products or the COF products is achieved, meanwhile, the pre-pressing mechanical arm is provided with the first suction hole and the second suction hole which can grab the chip products or the COF products in a compatible mode, equipment compatibility is high, cost is low, and benefits are high.

A magnetic bearing system (100) includes a rotary shaft (101) and a magnetic bearing (105, 107, 130) having an electromagnet coil (106, 108, 108B, 135, 136). One end of the electromagnet coil (106, 108, 108B, 135, 136) is connected to the neutral point of a first multi-phase winding (113, 115, 123, 125, 173, 181) having at least three or more phases.

Systems and methods for controlled-force thermal management device installation that helps thermal management of emerging, next-generation devices are provided. A system includes a mounting assembly for a thermal management device. The mounting assembly includes a fastener and a coupler. The system further includes a compression and locking interface configured to lock with the coupler and compress the mounting assembly to a predetermined loading point using a controlled force. The fastener is installed when the mounting assembly is at the predetermined loading point.

The invention relates to the technical field of surface mounting, and discloses an SMT (Surface Mount Technology)-based patch vision correction method, which comprises the following steps: S1, a calibration stage: constructing a double-coordinate system mapping model based on a PCB (Printed Circuit Board) plane, and establishing a nonlinear distortion compensation matrix according to the patch thickness; s2, a pickup stage: a CCD shooting camera is arranged at the top of the suction nozzle, a top CCD is triggered to shoot when the suction nozzle picks up an element, and pin coplanarity data is extracted; s3, a positioning stage: setting a reference point at the top of the PCB, scanning the PCB reference point through a CCD, and calculating a deviation between an actual position and a theoretical coordinate by using an algorithm processor; and S4, compensation execution: the motion shaft system dynamically adjusts the mounting path according to the deviation vector. The visual correction method based on SMT pasting has the advantages of accurate pasting and the like, and solves the problems of pasting position offset, low efficiency and unstable precision caused by factors such as vibration of an element feeder, mechanical transmission errors and thermal deformation of a PCB (Printed Circuit Board) due to dependence on manual calibration in the existing SMT pasting process.

The invention relates to the technical field of automatic plug-in mounting equipment, in particular to a double-reference-point correction method, which comprises the following steps of: acquiring image information of a first reference point and a second reference point arranged on a lower camera module, and determining an actual coordinate when an upper camera is aligned with the first reference point based on the image information of the first reference point; comparing with a preset fixed coordinate value to generate a coordinate system translation correction parameter; calculating an included angle between a connecting line of two points and the X-axis direction based on the image information of the two datum points, and generating a coordinate system rotation correction parameter; according to the method, two correction parameters are integrated to update a plug-in machine coordinate system, a lead screw back clearance elimination operation is adopted to improve the basic positioning precision, a correction effect verification and historical data analysis mechanism is established, a double-reference-point design is adopted for the first time, the problems of coordinate system origin offset and X-axis orthogonality change are solved at the same time, and the precision of the plug-in machine is improved. And the long-term stable operation of the plug-in machine and the consistency among different machines are ensured.

The invention relates to automobile electronic component assembling and carrying equipment. The device is composed of a supporting mechanism, a feeding mechanism, a material dispersing mechanism, a vibration feeding machine and a feeding safety mechanism. The hopper lifts the capacitor shell to the conveying pipe through the conveying belt and the material plate; after being limited, the baffle enters the vibration feeding machine through the discharging pipe; the angle of the guide plate is adjusted through linkage of a threaded rod, a two-way rack rod and a second gear, and the drop point range can be adjusted in cooperation with a conical material scattering rod. The vibration feeding machine completes sorting and is guided out through the extending discharging plate; during feeding, the cover plate drives the eccentric bolt, the sliding rod, the swing cylinder and the swing plate through the first gear and the fluted disc, so that the I-shaped sliding sleeve enables the second coupler to be disengaged from the first coupler, and driving of the conveying belt is stopped; after closing, meshing is performed under the action of the spring; the device gives consideration to both low-material-level rapid feeding and high-material-level stable material storage, the feeding consistency is improved, and the operation safety is enhanced.

The present invention relates to a linear motor, the rotor is well sealed through a sealing module when running on the stator slide rail, so that small external dust that affects the operating accuracy and stability performance of linear motor is not easy to enter the sealed space; the lubrication module communicates with the sealed space, so that the linear motor can be effectively lubricated during operation, further improving the operational accuracy and stability of the linear motor; the ball return end cap and the first chute together form a circulation loop for ball movement, the ball retaining plate fits with rotor through locating surface to improve the installation accuracy, meanwhile contact surfaces that limit balls are provided on both sides of the locating surface, so that a ball retaining plate can be used for two rows of circulation loops.

[Problem] Reduction of the stirring resistance that arises in a motor in a coolant circulation system in which an oil-containing coolant circulates to cool and lubricate the motor.[Means of solution] A coolant circulation system 100 comprises: a motor 4 with a rotor 41, a stator 42, a rotating shaft 43 and plain bearings 44; a gas-liquid separator 12, which separates a coolant into CO2 and oil; a CO2 passage 22b, through which the CO2 separated by the gas-liquid separator is supplied to a gap between the rotor and the stator to cool the rotor and the stator; mixing channels 24a, through which a mixture of the CO2 and the oil, obtained by mixing the CO2 and the oil separated by the gas-liquid separator, is supplied to gaps between the rotating shaft and the plain bearings to lubricate the plain bearings; and mixing channels 24b, through which the CO2 supplied to the rotor and the stator from the CO2 channel 22b and the mixture of CO2 and oil supplied to the sliding bearings 44 from the mixing channels 24a are returned to the gas-liquid separator.

Disclosed is a support frame of a CT imaging system, including: a connection flat plate portion; a support body portion disposed on the connection flat plate portion; an X-ray source installation reference portion disposed on the connection flat plate portion; an electrical installation portion; a cooling component installation portion; and a through hole, wherein the through hole is surrounded by the support body portion, the X-ray source installation reference portion, the electrical installation portion and the cooling component installation portion, and the through hole penetrates the connection flat plate portion. The connection flat plate portion, the support body portion, the X-ray source installation reference portion, the electrical installation portion and the cooling component installation portion are integrally formed.

A remote operation notification system includes a determination section and a notification section. The determination section is configured to determine whether there is a remote operation performed by a worker of a board work machine configured to perform predetermined board work on a board. The notification section is configured to give a notification of the remote operation performed by a specific worker of the board work machine, who is the worker who performs the remote operation on the board work machine, to at least a general worker, who is the worker other than the specific worker, among the specific worker and the general worker when the determination section determines that there is the remote operation.

This invention belongs to the field of welding fixture technology, specifically a PCB board welding fixture and its welding method; it includes a fixture table; a lifting and suspending assembly is provided on the fixture table; the lifting and suspending assembly includes a lifting square tube, which is connected through to the top of a placement frame, and the two are slidably engaged; the end of the lifting square tube near the fixture table is open and slidably connected to a lifting square column; the end of the lifting square tube away from the fixture table contacts the PCB board; an air storage rectangular frame is located on the top of the fixture table; the placement frame is located inside the air storage rectangular frame; the air storage rectangular frame is provided with a light-touch anti-damage device; it avoids displacement caused by excessively loose clamping and damage caused by excessively tight clamping, while reducing surface damage caused by excessive local pressure, reducing material consumption and production costs, and improving the welding qualification rate and effect of the PCB board, thus reducing the limitations of welding fixtures in application.

The present invention relates to the field of flexible circuit board production, and particularly relates to a production device and process for die cutting and wire laminating of a double-sided combined flexible circuit board. The production device comprises a frame, and a die cutting head on the frame, used for die cutting a flexible circuit board to be processed. A wire laminating unit used for laminating wires on the flexible circuit board is provided on the side of the frame away from the die cutting head, and the die cutting head and the wire laminating unit work in conjunction with each other to achieve the effects of die cutting the front side of the flexible circuit board and laminating the wires on the back surface of the flexible circuit board. By implementing die cutting and wire laminating of a flexible circuit board on a single machine, the present invention effectively avoids the problems that materials need to be moved multiple times during use, and after the materials are moved multiple times, the relative position between the materials and the machine and the relative position of the materials need to be adjusted multiple times to ensure alignment, which affects the accuracy and consistency of a final circuit board.

Electronic component selection and recovery system (100), comprising the following stations: - a recognition and classification station (110), arranged to examine a plurality of waste electronic boards (C) identifying one or more valuable electronic components (E) to be reconditioned; - a disassembly and sorting station (120) arranged to disassemble said electronic components (E) from said waste electronic boards (C) and separate them therefrom; - a reconditioning station (130) arranged to recondition said electronic components (E), thus obtaining reconditioned electronic components (R); - a testing station (140) arranged to verify the functionality of said reconditioned electronic components (R) before new entry into a production cycle.

An electronic component mounting device (1) comprises: an electronic component supply unit (20) that supplies an electronic component having a bump electrode (EB); a transfer stage (31) that accumulates a flux (FX); a mounting stage (41) on which a substrate (BD) is placed; a plurality of heads that can each pick up an electronic component (CP); and a control unit (10) that controls movement of the plurality of heads. The control unit (10) is configured so as to cause each of the plurality of heads to function as a dipping head that dips the bump electrode (EB) of the electronic component (CP) into the flux (FX) accumulated on the transfer stage (31), or as a bonding head that mounts the electronic component (CP) to the substrate (BD) on the mounting stage (41) with the bump electrode (EB) interposed therebetween.

The invention provides a charging tray replacement method and system, and the method comprises the steps: receiving production data of a chip mounter through central control equipment, and determining charging tray demand data according to the production data; according to the tray demand data, the central control equipment sends a material preparation instruction to the material preparation device and sends a transportation instruction to the transportation equipment, and the material preparation instruction carries the tray demand data; the material preparation device stores an unused first material tray into a temporary storage bin according to the material tray demand data; taking out the first charging tray in the temporary storage bin through a manipulator of the transportation equipment, and transporting the first charging tray to a material changing area corresponding to the chip mounter; transferring the first material tray and a used second material tray in the chip mounter to a material receiving device of transportation equipment by using a manipulator; a material receiving device is used for trimming the material belt of the second material disc, and the trimmed material belt is attached to the material belt of the first material disc; and transferring the laminated first tray to a chip mounter by using a manipulator. The method can improve the production efficiency.

An apparatus for attaching a gimbal for an antenna to a structure, the apparatus including a pivot element for attachment to the structure, wherein the pivot element includes a first hole for rotatably attaching the gimbal to the pivot element using a first fastening element, wherein the pivot element includes a second hole, which is an oblong hole, for guiding a rotational movement of the gimbal within an angular range around an axis of rotation associated with the first hole, wherein a first surface of the pivot element, which faces the gimbal, when the gimbal is attached to the pivot element, is convex.

The invention provides a capacitive MEMS device and a manufacturing method thereof. The capacitive MEMS device comprises at least one MEMS chip, each MEMS chip comprises a wafer substrate and a structural layer arranged on the top surface of the wafer substrate, and a first cavity structure is formed in the wafer substrate. The structural layer covers the first cavity structure and comprises a vibrating diaphragm fixed on the top surface of the wafer substrate and a back polar plate which is fixed on the wafer substrate and is spaced from the vibrating diaphragm to form a capacitor, the bottom surface of the wafer substrate is provided with a groove structure which is sunken towards the direction of the structural layer, and the groove structure partially penetrates through the wafer substrate; the first cavity structure penetrates through the groove bottom of the groove structure and the top surface of the wafer substrate along a first direction; the groove structure and the first cavity structure jointly form an air flowing channel, and the groove structure is communicated with the first cavity structure and the outside of the MEMS chip. According to the capacitive MEMS device, balance control over the air pressure in the device is achieved, and the influence of the air pressure on the capacitive MEMS device is avoided.

The invention provides an optical module chuck positioning assembly, a mounting system, equipment and a mounting method. The optical module chuck positioning assembly comprises a clamping mechanism and a positioning table; the clamping mechanism is mounted on the positioning table; the positioning table is provided with a first positioning part and a second positioning part; the first positioning part is movably arranged between a feeding position and a mounting position, and the clamping mechanism and the second positioning part are arranged on the first positioning part and move along with the first positioning part; the second positioning part is configured to drive the clamping mechanism to move in the direction close to or away from the circuit board when the first positioning part is located at the mounting position. Therefore, by additionally arranging the first positioning part and the second positioning part, in the positioning process, an operator can use the first positioning part and the second positioning part to realize rapid and accurate positioning between the clamping mechanism and the circuit board, so that the positioning efficiency and the positioning accuracy are improved, and the production efficiency and the product yield are favorably improved.

The present invention relates to a quick release assembly for a pressing head and an electronic device testing apparatus having the same. The quick release assembly comprises an upper base, an actuator and a lower base. When the lower base is to be mounted on the upper base, the actuator drives a movable head to a first position; the movable head passes through an open slot of the lower base; then, the actuator drives the movable head to a second position so that the lower base is retained by the movable head. The open slot of the lower base is firstly fitted on the movable head of the actuator located on the upper base. At this time, the actuator is controlled to drive the movable head to the second position from the first position.

The utility model provides an integrated uniform-temperature liquid cooling head and heat dissipation equipment. The integrated uniform-temperature liquid cooling head comprises a water inlet nozzle, a water outlet nozzle, an upper cover and a uniform-temperature heat dissipation assembly, the water inlet nozzle and the water outlet nozzle are arranged on the upper cover at intervals, the uniform-temperature heat dissipation assembly comprises a heat dissipation cover plate and a heat dissipation bottom plate, one side of the heat dissipation cover plate is connected with the upper cover, the heat dissipation cover plate is provided with heat dissipation shovel teeth, and the heat dissipation cover plate and the upper cover jointly form a liquid flowing cavity. The heat dissipation shovel teeth are located in the liquid flowing cavity. The other side of the heat dissipation cover plate is connected with the heat dissipation bottom plate, the heat dissipation bottom plate and the heat dissipation cover plate jointly form a phase change cavity, a phase change working medium is arranged in the phase change cavity, a capillary layer is arranged on the inner wall of the phase change cavity, the heat dissipation bottom plate is used for abutting against a heat source, and the phase change working medium is used for transferring heat to the heat dissipation shovel teeth during phase change conversion. After the cooling liquid circulates through the water inlet nozzle, the liquid flowing cavity and the water outlet nozzle, the cooling liquid cools the heat dissipation shovel teeth, and the capillary layer is used for enabling the liquid phase change working medium to flow back to the heat dissipation bottom plate.

The invention discloses a flexible array suction nozzle module. The device comprises a first mounting plate, a second mounting plate and a force control module, wherein the second mounting plate is movably arranged on the first mounting plate up and down; the force control module is fixed on the first mounting plate and is used for carrying out stress control on the up and down stress conditions of the second mounting plate; the fixed mounting seat is fixed on the lower surface of the second mounting plate; and the flexible suction nozzle assemblies are arranged on the fixed mounting seat in an up-down elastic floating manner and are arrayed to form at least one row. According to the invention, the array suction nozzle module with an independent flexible floating structure is adopted and is matched with an accurate linear guide mechanism and an integral force control system, so that the technical problems of uneven stress, chip damage due to overpressure and low mounting precision caused by individual thickness difference in a multi-chip synchronous mounting process are effectively solved.

The invention discloses a method for identifying a bad plate in a substrate, belongs to the technical field, and realizes high fusion of bad plate identification and a production process through a precise marking process and a dynamic data collaboration mechanism. A high-energy laser carbonization technology is adopted, an irreversible permanent mark is formed on the surface of a substrate, and a microscopic carbonized layer structure and a base material form remarkable optical contrast. The mark can still keep stable gray scale characteristics under strong light irradiation, and the problem of misrecognition caused by the fact that a traditional ink mark is prone to falling off and pollution is solved. Meanwhile, the closed-loop control of laser parameters ensures that the marking area is only modified within the depth of 0.1 mm of the surface layer, substrate warping or inner layer circuit damage caused by diffusion of a heat affected zone is avoided, and the reliability and safety of marking of the damaged plate are guaranteed from the physical level.

A work management system is applied to a work area in which a predetermined work is executed by a worker and a robot. The work management system includes a control section configured to control the robot such that a specified operation set in advance is included in an operation by the robot executing the predetermined work, an information acquisition section configured to acquire work information indicating a presence or absence of the specified operation in at least one of an execution result and an execution process of the predetermined work, and an identification section configured to identify whether a work subject of the predetermined work is the worker or the robot based on the work information acquired by the information acquisition section.

The invention discloses feeding equipment and a feeding method. The feeding equipment comprises a vibrating device and a feeding device, wherein the vibrating device is provided with a plurality of vibrating areas distributed in the circumferential direction at intervals; and the plurality of feeders are arranged on the feeding station and are used for accommodating various different components respectively. The multiple vibration areas of the vibration device can rotate around one axis, so that the multiple vibration areas can be sequentially rotated to the feeding station. When one of the multiple vibration areas is rotated to the feeding station, the parts in one feeder corresponding to one vibration area are supplied to one vibration area. The vibration device is suitable for enabling the part located in the vibration area to be overturned to a preset posture suitable for being picked up by the robot through vibration. According to the feeding device, the same feeding device can supply multiple different parts at the same time, multiple different feeding devices do not need to be provided, the production cost is greatly reduced, the size of the feeding device can be reduced, and the space needing to be occupied by the feeding device is saved.