146results about "Adhesive processes" patented technology

A conductive adhesive film including an adhesive layer located on an adherend side, and a base material layer, in which a surface resistance value of the conductive adhesive film is from 1×107 Ω / □ to 1×1012 Ω / □.

A bonding method for providing an adhesive layer and a curing agent layer between a first adherend and a second adherend to bond the first adherend and the second adherend in which: the adhesive layer contains an epoxy resin as a main component and is cured by an effect of the curing agent layer; a curing agent contained in the curing agent layer is a polymerization catalyst type curing agent; and a thickness A (m) of the adhesive layer before curing and the application amount B (kg / m2) of the curing agent contained in the curing agent layer satisfy 5<B / A<900.

A sealing adhesive containing an epoxy resin, a curing agent, an inorganic filler, and a triazine thiol compound.

A label for matrix tube may have a facestock configured to have data on a first surface thereof. An adhesive layer may be on a second surface of the facestock. The facestock may define an cover label portion, a main label portion and a neck portion between the cover label portion and the main label portion, the neck portion being narrower than the cover label portion and the main label portion. A method for applying a label onto a matrix tube may also be provided.

The present application relates to a method for manufacturing a semiconductor device using a semiconductor processing adhesive sheet having a substrate, an intermediate layer, and an adhesive layer in this order, and one or more of the substrate, the intermediate layer, and the adhesive layer contains thermally expandable particles, the method comprising steps 1 to 4.

The application belongs to the technical field of new materials, and discloses a starch-based adhesive prepared by urea pre-activation and tannin acid post-crosslinking as well as a preparation method and application thereof. The starch-based adhesive comprises a base component and a modifier. The base component comprises waxy cassava starch, gelatin, citric acid, glycerol and water, and the modifier comprises urea and tannin acid. In the preparation process of the base adhesive, two modification processes of "urea pre-activation" and "tannin acid post-crosslinking" are innovatively introduced. Urea, as a hydrogen bond breaker / plasticizer, firstly inserts between the polymer chains of starch, gelatin and the like, breaks part of the original strong hydrogen bonds, increases the movement ability of the chain segments, and exposes more active sites such as hydroxyl groups and amino groups, thereby creating conditions for the subsequent crosslinking reaction of tannin acid. Then, tannin acid is added, and the rich o-benzene triol groups in the molecular structure of tannin acid are used to form multiple strong hydrogen bond interactions with the active sites exposed after activation, so that a more compact and stable double network structure is restructured.

There is provided a release agent composition containing an aqueous solvent, that is, a release agent composition for forming a release agent layer that can be released by light irradiation and is used for a laminate, in the laminate in which a support substrate and a semiconductor substrate or an electronic device layer can be firmly adhered to each other during processing of the semiconductor substrate or the electronic device layer, and the support substrate and the semiconductor substrate or the electronic device layer can be easily separated from each other by light irradiation after the substrate processing. There is provided a release agent composition for light irradiation release for forming a release agent layer of a laminate which includes a semiconductor substrate or an electronic device layer, a light-transmissive support substrate, and a release agent layer provided between the semiconductor substrate or the electronic device layer and the support substrate, in which the electronic device layer includes a plurality of semiconductor chip substrates and a sealing resin disposed between the semiconductor chip substrates, and which is used for releasing the semiconductor substrate or the electronic device layer from the support substrate after the release agent layer absorbs light irradiated from the support substrate side, in which the release agent composition contains a light-absorbing compound that contributes to making the semiconductor substrate or the electronic device layer and the support substrate easily released by absorbing the light, and a solvent, and the solvent contains water.

Silk-based adhesives are made by dehydrating a silk fibroin solution including a chaotropic salt concentration, the adhesive including a non-water mixture and residual moisture, the non-water mixture including the silk fibroin and the chaotropic salt, the dehydrating inhibiting transitions to beta sheet secondary structure and providing one or more of the following properties: i) a predetermined viscosity or ii) a predetermined adhesive strength.

The present invention relates to the use of the pressure sensitive hotmelt adhesive comprising at least one polymer and at least one polyester polyol based on betulin for bonding a foam, sensor or functional part to the inside of a tire. Furthermore, the present invention relates to a method for bonding a foam, sensor or functional part inside a tire comprising an innerliner having an innerliner surface facing an interior cavity of the tire, the method comprising or consisting of the steps of: (i) applying a pressure sensitive hotmelt adhesive comprising at least one polymer and at least one polyester polyol based on betulin to the innerliner surface to form a pressure sensitive hotmelt adhesive coating; (ii) applying a foam, sensor or functional part to the coating of the pressure sensitive hotmelt adhesive. In addition, the present invention relates to a tire comprising an innerliner having an innerliner surface facing an interior cavity of the tire, a pressure sensitive hotmelt adhesive layer, wherein the pressure sensitive adhesive comprises at least one polymer and at least one polyester polyol based on betulin and a foam, sensor or functional part wherein the foam, sensor or functional part is disposed on the pressure sensitive hotmelt adhesive layer, wherein (a) the pressure sensitive hotmelt adhesive layer is disposed on the innerliner surface facing the interior cavity of the tire, or (b) a release agent is disposed on the innerliner surface facing an interior cavity of the tire and the pressure sensitive hotmelt adhesive layer being disposed on the release agent.

The present invention provides: a method of reducing an adhesive strength of an adhesion layer, the method including applying an electric pulse to an article including a portion in which two or more members are bonded to each other via an adhesion layer containing a conductive filler, to thereby reduce an adhesive strength of the adhesion layer; and a method of reusing a member or a functional part in the member, the method including removing the member from the article by using the above-mentioned method.

To provide a reinforcement film capable of preventing an adhesive force from increasing with time after adhesion onto an adherend, and capable of being strongly adhered onto the adherend by photocuring the adhesive agent.SOLUTION: A reinforcement film (10) includes an adhesive layer (2) fastened and laminated on one principal surface of a film base material (1). The adhesive layer includes a photocurable composition containing an acrylic base polymer having a crosslinking structure, a photocuring agent, and a photoinitiator, and includes, as the photocuring agent, a polyfunctional (meth)acrylate having no urethane bond and an urethane (meth)acrylate. A content of the urethane (meth)acrylate is preferably 0.5 to 23 pts.mass, based on 100 pts.mass of the acrylic base polymer.SELECTED DRAWING: Figure 1

The present invention provides a composition for temporary bonding including: (A) a polymerizable component including a (meth)acrylate containing an aromatic ring bonded to a heteroatom; (B) a photo radical polymerization initiator; and (C) an ultraviolet absorber having a polymerizable functional group, in which an equivalent amount of the aromatic ring bonded to the heteroatom in 1 g of the composition for temporary bonding is 0.50 mmol or more and 3 mmol or less.

The method for bonding metal base and rubber part of the present application comprises: preparing an adhesive, which comprises propyl methacrylate, propyl acrylate and a cross-linking agent; coating the adhesive on the surface of the metal base to form an adhesive film; performing vacuum treatment on the adhesive film to remove bubbles; placing a rubber part on the adhesive film and applying pressure to the rubber part for a predetermined time; and performing heat treatment on the rubber part together with the metal base. The bonding method is simple and easy to operate, has high internal bonding strength and is less likely to separate, can effectively protect the performance of the product and prolong the service life, and is environment-friendly, thus being suitable for popularization and application.

A removable adhesive assembly for use in a battery pack includes a UV-curable release layer configured to be positioned between a first battery pack component and a second battery pack component, and an adhesive configured to bond the battery pack component to the second component. The UV-curable release layer is activated by ultraviolet radiation to reduce the adhesive strength and facilitate separation of the battery pack component from the second component.

An article includes at least one substrate and at least one adhesive member. The at least one adhesive member includes an adhesive layer including an adhesive configured to bond the at least one adhesive member to an external surface. The at least one adhesive member further includes at least one slit extending through the at least one adhesive member. The article further includes at least one tab connected to at least the adhesive layer of the at least one adhesive member and extending from the at least one adhesive member. The at least one tab is configured to receive a pull force from a user. Upon application of the pull force on the at least one tab, the at least one adhesive member at least partially separates adjacent to the at least one slit and releases from each of the at least one substrate and the external surface.

Disclosed herein is a method for bonding a first substrate with low surface energy to a second substrate using a thermosetting adhesive composition that has been formulated to enhance the bonding performance of the first substrate. The substrates with low surface energy include thermoplastic substrates and thermoplastic composites. The thermosetting adhesive composition includes: (a) a combination of multifunctional epoxy resins or an epoxy-based pre-react; (b) at least one amine as curing agent; (c) at least one inorganic clay mineral; and (d) a flow control agent that is not inorganic clay mineral.

An electronic device includes: a first member to be adhered; a second member to be adhered; an adhesion-reducing adhesive layer adhered between the first member and the second member. An adhesion of the adhesion-reducing adhesive layer is associated with environmental conditions.

The present invention discloses a method for producing a semiconductor device, wherein a circuit member with an adhesive is prepared by a process in which a multilayer body that comprises a semiconductor chip or a semiconductor wafer and a film adhesive is pressurized for 30 seconds to 10 minutes, while being heated at 60°C to 100°C, thereby being bonded to a main surface. If the film adhesive is subjected to a heat treatment at 80°C for 5 minutes, the melt viscosity of the film adhesive at 80°C is from 4,000 Pa·s to 10,000 Pa·s before the heat treatment, while the melt viscosity of the film adhesive at 80°C is 11,000 Pa·s or less after the heat treatment.

A method for manufacturing a connection structure, including: a step of laminating an adhesive film on a surface of a first circuit member having a first electrode, the surface being formed with the first electrode; and a step of disposing a second circuit member having a second electrode on the first circuit member on which the adhesive film is laminated, so that the first electrode and the second electrode face each other, and thermocompression bonding them, thereby electrically connecting the first electrode and the second electrode to each other, the adhesive film having a film-shaped adhesive containing a thermoplastic resin and a radical polymerizable compound, a waveform of a loss tangent (tan δ) obtained by dynamic viscoelasticity measurement after heating the film-shaped adhesive at 170°C for 5 seconds having a plurality of maximum values.

An adhesive member (100) according to the present disclosure comprises a light-diffusing film (102) that is composed of a material having a refractive index of 1.6-1.9 and through which ultraviolet (UV) light transmits, and an adhesive layer (103) formed in layers on at least one side of the light-diffusing film (102), having an adhesiveness that deactivates under UV light irradiation after curing, and having a refractive index that differs from the light-diffusing film by 0.3-0.45. When adhered by using the adhesive member (100) according to the present disclosure, objects that do not transmit UV light (300) can be easily separated even when adhered to each other.

To provide a self-propelled robot capable of improving the efficiency of adhesive bonding work for panel support legs in floor construction and reducing the physical strain on the worker. [Solution] The self-propelled robot 1 comprises a robot body 10 having a travel device, a pair of position detection units 20, 20 that detect the positions of a pair of panel support legs SF respectively, a pair of adhesive injection units 30, 30 that have the function of injecting adhesive G into the panel support legs SF to be injected, and a control unit 16 that controls the injection of adhesive G from the pair of adhesive injection units 30, 30 into the panel support legs SF to be injected based on the detection by the pair of position detection units 20, 20, and also controls the travel device.

[Problem] To provide a workpiece handling sheet with which it is possible to favorably handle even a very small workpiece item. [Solution] A workpiece handling sheet 1 is provided with a base material 11 and an interface ablation layer 12 that is laminated on one surface side of the base material 11, able to hold a small workpiece item, and undergoes interface ablation through irradiation with laser light. When the workpiece handling sheet 1 that has been subjected to first ultraviolet irradiation to perform irradiation with ultraviolet rays having a wavelength of 365 nm with a light amount of 190 mJ / cm2 is further subjected to second ultraviolet irradiation to perform irradiation with ultraviolet rays having a wavelength of 365 nm with a light amount of 950 mJ / cm2, the conversion efficiency with which the interface ablation layer 12 converts the light energy of the ultraviolet rays during the second ultraviolet irradiation into thermal energy is 60% or more.

The high-frequency dielectric heating adhesive (1A) of the present invention contains a thermoplastic resin (A) and a dielectric filler (B). When the cross-section of the high-frequency dielectric heating adhesive (1A) cut along the thickness direction is observed by scanning electron microscopy, the relationship between the nearest centroid distance Dg of the dielectric filler (B) and the particle size Dn of the dielectric filler (B) satisfies the following mathematical formula (F1): 1.55≤Dg / Dn≤1.85 ···(F1).

This invention relates to cyanoacrylate-containing compositions, which when cured provide improved bonding performance on aluminum substrates.

The present invention relates to a curable and peelable two-component adhesive composition, wherein i) the first component contains a (meth)acrylate monomer, a copolymerizable acid, and an electrolyte, and ii) the second component contains a first curing agent for the monomer of the first component, a second curing agent for the monomer of the first component, a wax, and a solubilizing agent, and the two-component (2K) adhesive composition further contains a reinforcing agent, an oxygen scavenger, and a rheology control agent. Further, in the two-component adhesive composition, the electrolyte contains at least one salt described in Formula (I) or Formula (II), or consists of the salt. JPEG2025520529000024.jpg41141