The present invention relates to a curable and electrochemically debondable one-component (1K) structural
adhesive composition comprising: a) a (
meth)
acrylate monomer selected from the group consisting of hydroxypropyl
acrylate,
hydroxypropyl methacrylate, hydroxybutyl
methacrylate,
isobornyl acrylate,
isobornyl methacrylate,
methyl methacrylate and mixtures thereof; b) a compound selected from the group consisting of 1-butyl-3-methylimidazolium bis (trifluoromethylsulfonyl)
imide, 1-pentyl-3-methylimidazolium bis (trifluoromethylsulfonyl)
imide, 1-hexyl-3-methylimidazolium bis (trifluoromethylsulfonyl)
imide, 1-heptyl-3-methylimidazolium bis (trifluoromethylsulfonyl) imide, 1-octyl-3-methylimidazolium bis (trifluoromethylsulfonyl) imide, and 1-octyl-3-methylimidazolium bis (trifluoromethylsulfonyl) imide; the preparation method comprises the following steps of: adding 1-(trifluoromethylsulfonyl) imide, 1-nonyl-3-methylimidazolium bis (trifluoromethylsulfonyl) imide, 1-decyl-3-methylimidazolium bis (trifluoromethylsulfonyl) imide, 1-dodecyl-3-methylimidazolium bis (trifluoromethylsulfonyl) imide, 1-tetradecyl-3-methylimidazolium bis (trifluoromethylsulfonyl) imide, 1-chloro-3-methylimidazolium bis (trifluoromethylsulfonyl) imide, 1-chloro-3-methylimidazolium bis (trifluoromethylsulfonyl) imide, 1-chloro-3-methylimidazolium bis (trifluoromethylsulfonyl) imide, 1-chloro-3-methylimidazolium bis (trifluoromethylsulfonyl) imide, 1-chloro-3-methylimidazolium bis (trifluoromethylsulfonyl) imide, 1- an
electrolyte comprising a 1-hexadecyl-3-methylimidazolium bis (trifluoromethylsulfonyl) imide, a 1-octadecyl-3-methylimidazolium bis (trifluoromethylsulfonyl) imide, a trihexyltetradecyl
phosphonium bis (trifluoromethylsulfonyl)
amide, and mixtures thereof; c) a copolymerizable acid; d) an initiator; e) a core-shell
toughening agent; and f) a
toughening agent. The composition according to the present invention can withstand harsh conditions (high temperature and
high humidity) while maintaining adhesion and deadhesion properties.