327 results about "Led packaging" patented technology

The invention discloses an RGB backlight partition display LED packaging module and a preparation method thereof, and belongs to the technical field of backlight display. The RGB backlight partition display LED packaging module comprises a substrate, an LED assembly, a barrier wall assembly and an optical transparent adhesive diffusion particle layer. The LED assembly is arranged on the substrate; the barrier wall assembly is arranged on the substrate and comprises a plurality of barrier walls, and the barrier walls are used for isolating an optical path; the optical transparent adhesive tape is used for isolating pollutants and carrying out primary light mixing on colored light emitted by the LED assembly; and the diffusion particle layer is used for converting the directionally propagated light into spatial random distribution so as to eliminate glare spots caused by specular reflection, and carrying out secondary light mixing on the colored light emitted by the LED assembly. According to the RGB backlight partition display LED packaging module provided for a user, the color levels displayed by the packaging module are effectively enriched, the image quality is improved, and the power consumption of a machine is reduced.

The invention provides high-stability double-layer core-shell coated pure copper silver-substituted conductive paste and a preparation method thereof, and belongs to the technical field of electronic special materials. The copper-resistant coating comprises the following components in percentage by mass: 82%-90% of antioxidant copper powder with a double-layer core-shell structure, 3%-6% of bismuth-boron-zinc lead-free low-melting-point glass powder, 3%-7% of a modified epoxy resin compound organic carrier, 2%-5% of a gradient volatilization compound solvent and 0.5%-2% of a special compound additive for copper. Through the double-layer core-shell copper powder design of inner-layer nano-silver passivation and outer-layer organic composite coating and in cooperation with a liquid-phase synergistic anti-oxidation system, the volume resistivity after slurry curing is smaller than or equal to 3.5 * 10 <-5 > omega.cm, the resistivity change rate after 1000-hour damp-heat aging at 85 DEG C / 85% RH is smaller than or equal to 10%, the normal-temperature storage period without opening a tank is larger than or equal to 6 months, direct curing can be conducted in the conventional air atmosphere of 120-160 DEG C, and the high-temperature-resistant copper paste can be applied to the field of high-temperature storage. The silver paste is completely compatible with production and application production lines of existing silver paste, equipment transformation is not needed, the comprehensive cost is reduced by more than 80% compared with pure silver paste, and the silver paste can be widely applied to the fields of PCBs, membrane switches, flexible electronics, photovoltaic back electrodes, LED packaging and the like.

The invention discloses a dynamic hot-pressing leveling control method and a yield improving system based on high-density LED packaging, and relates to the technical field of LED packaging. A viscoplastic flow area is formed through counterpoint preheating and selective thermal activation, contact pressure is built between the flexible leveling device and the surface of the LED chip array, solder paste is heated to be in a viscoplastic flow state, the flexible leveling device conducts posture correction on the chip, the solder paste is suddenly dropped to be below the freezing point of the solder paste through the semiconductor thermoelectric cooling module array, and then the solder paste is heated to be in the viscoplastic flow state. And fixation of the chip position and rapid solidification forming of a welding spot are realized. The method is characterized in that solder paste is heated to a viscoplastic flow state through a targeted thermal activation technology, the inherent contradiction between the thermal damage risk and a narrow process window caused by the fact that a component must be exposed to a high-temperature environment in order to obtain enough surface tension is solved, and the yield, the performance consistency and the long-term reliability of a product are remarkably improved.

The invention relates to the technical field of semiconductor packaging, in particular to a Micro-LED packaging structure and a manufacturing method thereof, and the packaging structure comprises a substrate, a color filter layer, a color conversion layer, an inorganic layer, a chip bonding layer, a micro light-emitting diode layer, a first filling layer, a reflecting layer and a second filling layer from bottom to top. And grinding, thinning, cutting and splitting the substrate to form an independent discrete device. By arranging the reflecting layer covering the packaging structure and the discontinuous chip bonding layer, light emitted by the quantum dots and the micro light-emitting diodes is reflected by the reflecting layer, and light crosstalk between the packaging structures is avoided. The first filling and leveling layer with the slope surface is arranged between the reflecting layer and the micro light-emitting diode, so that the side light-emitting path is kept away from the micro light-emitting diode body, and the light-emitting efficiency is improved. The micro light-emitting diodes are arranged in an offset mode, so that top damage is prevented when the packaging structure is transferred. The packaging structure has the advantages of preventing optical crosstalk and facilitating mass production of laser cutting while improving the lighting effect and preventing damage.

This invention discloses a Mini-LED packaging device, a Mini-LED packaging method, an apparatus, and a computer-readable storage medium. The method, applied to a Mini-LED packaging device, involves adjusting the position of the Mini-LED chip to be fixed on a substrate to embed the electrodes of the Mini-LED chip into a groove. Solder paste is placed on a filter screen inside the groove. During the fixing of the Mini-LED chip, a height limiting plate restricts the upward displacement of the Mini-LED chip during the curing process of the solder paste, allowing the solder paste to pass through the filter screen and enter the gap during curing. This invention reduces the overly stringent requirements for solder paste usage and the process difficulty of Mini-LED chip die bonding by designing the substrate structure, thereby avoiding the adverse effects of inaccurate solder paste usage on Mini-LED chip die bonding and improving display performance.

The present application is applicable to the technical field of LED packaging. Provided are an LED device and an LED packaging method. The LED device comprises a substrate, an LED chip, a dam, an optical window and a sealing member, wherein the dam has a first end, a second end and side walls, the side walls define a chamber, and the dam is mounted on the substrate by means of the first end; the LED chip is disposed in the chamber and packaged on the substrate; the optical window is connected to the second end to cover the chamber; the sealing member is disposed between the optical window and the second end; the dam further has a mounting space, and the mounting space is configured as a region enclosed when inner and outer end portions of the second end of the dam respectively horizontally extend toward two sides until the included angle between the lines connecting the inner and outer end portions of the second end to inner and outer end portions of the first end satisfies aW70; and the optical window is connected and fixed to the dam by means of a snap-fit structure, and when the optical window is connected and fixed to the dam, the snap-fit structure is located in the mounting space. The present application overcomes the defects of semi-inorganic and all-inorganic packaging processes on the market, can ensure the airtightness of products, and greatly improves the packaging efficiency and service life of LED devices.

The invention discloses an LED packaging structure and a COB light source, the LED packaging structure comprises a metal substrate, the upper surface of the metal substrate is provided with a BT layer, the center of the BT layer is provided with a light-emitting area, the BT layer is provided with a first box dam and a second box dam which surround the light-emitting area in a stacked mode from bottom to top in sequence, the first box dam is white glue, the diameter of the first box dam is the same as that of the second box dam, and the diameter of the second box dam is the same as that of the first box dam. The inner side of the first box dam and the inner side of the second box dam are filled with fluorescent glue layers, and the fluorescent glue layers are located above the light-emitting area. According to the COB light source, the LED packaging structure is adopted, the air tightness is further enhanced, the problems of light attenuation, aging, fluorescent powder blackening and the like are solved, the overall dam width is smaller than the width of a single-layer dam for achieving the same dam height, the area of a small light-emitting area can be occupied, a larger light-emitting area can be achieved, and the product performance is improved.

The invention provides an epoxy resin adhesive for RGB-LED (Red Green Blue-Light Emitting Diode) packaging and a preparation method of the epoxy resin adhesive. The epoxy resin adhesive is prepared from the following raw materials in parts by mass: 40 to 50 parts of bisphenol A epoxy resin, 20 to 30 parts of epoxy modified phenyl organic silicon resin, 10 to 15 parts of sulfur-containing epoxy resin, 4 to 6 parts of modified branched aluminum oxide, 10 to 14 parts of modified hexagonal boron nitride, 30 to 40 parts of compound curing agent, 1 to 2 parts of compound accelerant and 0.5 to 1 part of modified nano zinc oxide ultraviolet absorbent. The epoxy resin adhesive for packaging the RGB-LED, provided by the invention, has relatively high bonding stability on a PPA (Phenyl-Phenylic Acid) base material, has a slight shrinkage degree in a curing process, can effectively avoid the structural failure problems of packaging body cracking, chip offset and the like, guarantees the structural stability of the RGB-LED in long-term operation, and improves the service life of the RGB-LED. And moreover, high reliability, high weather resistance, matte high-brightness balance and low hygroscopicity are realized.

The utility model provides a moisture-proof device of an LED packaging structure. The moisture-proof device comprises a heating moisture-removing layer, a room temperature sensor used for sensing the room temperature of the space, a device temperature sensor used for sensing the temperature of a device in the LED packaging structure, and a temperature measuring and controlling circuit. The device temperature sensor and the heating moisture-removing layer are arranged in the LED packaging structure, and the room temperature sensor is arranged outside the LED packaging structure; and the heating moisture-removing layer, the room temperature sensor and the device temperature sensor are respectively connected with the temperature measuring and controlling circuit. The utility model further provides a moisture-proof LED system device assembly. The moisture-proof protection can be carried out on the KSF fluorescent powder.

The invention belongs to the field of electronic packaging materials, and particularly relates to a high-thermal-conductivity ceramic material for LED packaging and a manufacturing process of the high-thermal-conductivity ceramic material for LED packaging. The high-thermal-conductivity ceramic material is prepared from silicon nitride, aluminum nitride, magnesium fluoride, yttrium fluoride, lithium carbonate and two newly-designed modified compounds. The phase change regulator is composed of a boron-doped rare earth silicate nanocrystalline phase change regulator and a bimetallic chalcogenide compound interface modifier according to a specific weight part ratio. The preparation process mainly comprises the following steps: ball-milling and mixing the components, drying, granulating, and carrying out segmented hot pressed sintering in a protective atmosphere to finally obtain the compact ceramic material. The high-power LED packaging structure is particularly suitable for packaging of high-power LEDs, and the technical problem that heat dissipation and mechanical performance are difficult to consider at the same time is effectively solved.

The utility model relates to dispensing equipment for LED (light-emitting diode) packaging, which comprises a base, a support frame arranged on the base and a top plate arranged at one end, far away from the base, of the support frame, a fixing mechanism is arranged on the base, a dispensing mechanism and a degumming mechanism are arranged on the top plate, and the dispensing mechanism is positioned above the fixing mechanism. The glue dispensing mechanism comprises a telescopic assembly arranged on the top plate, a glue dispensing gun body driven by the telescopic assembly, a heating assembly arranged at the bottom end of the glue dispensing gun body and a glue dispensing head arranged at the bottom of the heating assembly, and the glue removing mechanism comprises wiping sponge arranged at the glue dispensing head. The glue temperature is controlled in real time through the heating assembly, the glue viscosity is effectively reduced, curing is delayed, and glue dispensing is more uniform and stable; residual glue on the dispensing head can be removed in time through the glue removing mechanism, so that the phenomena of blockage and leakage are reduced; and the adjustable fixing mechanism is adapted to LED workpieces with different sizes, so that the stability and the high precision of the dispensing process are ensured, and the overall reliability and the production efficiency are improved.

The utility model relates to LED packaging technical field, concretely relates to a lamp drive all -in -one's LED packaging structure. It includes: as the substrate's PCB board, a plurality of packaging integrated module, including the lamp pearl of PCB board front packaging and the drive chip of PCB board back packaging, every red green blue three lamp pearl constitutes a pixel point, the lamp pearl with the solder pad connection of PCB board back, and the solder pad is connected with the signal end of drive IC through PCB wiring, the drive chip is used for providing matching current for all lamp pearl and receiving the input signal of external controller and resolving into three channel's PWM control signal to independently control every the red green blue three color brightness of pixel point, solved the problem that traditional LED packaging yield is low, cost is high, maintenance is difficult, the problem of low integrated level, high power consumption.

The invention provides a sky-green light source LED packaging device, and belongs to the technical field of luminescent materials. The azure light source LED packaging device comprises a light-emitting substrate, wherein the light-emitting substrate comprises fluorescent powder; the fluorescent powder comprises blue-green fluorescent powder and green fluorescent powder; the light-emitting peak wavelength of the blue-green fluorescent powder is 490-500 nm, the molecular formula of the blue-green fluorescent powder is (Ba1-x-ySrxEuy) Si2N2O2, and x is greater than or equal to 0.001 and less than or equal to 0.3; 0.001 < = y < = 0.1; the blue-green fluorescent powder is of an orthogonal structure and is crystallized in a space group Pcca. According to the invention, on the basis of realizing azure luminescence, the luminescence performance of the azure luminescence is improved, especially the luminescence intensity of the azure luminescence is improved, and the anti-aging performance of the azure light source LED packaging device is also improved.

The invention relates to the field of LED packaging, in particular to a low-blue-light yellow-light LED device and a preparation method thereof. The solid crystal glue is arranged on the packaging carrier; a chip, wherein the chip is bonded on the solid crystal glue; the fluorescent powder layer covers the chip and is formed by mixing narrow-band yellow green powder (540-550 nm), narrow-band orange yellow powder (570-600 nm) and transparent silica gel; and the packaging colloid covers the surface of the fluorescent powder layer to form a heat dissipation structure. Compared with the prior art, the blue light component of the finally output yellow light is reduced to 0.01%-0.03%, which is significantly lower than the blue light proportion (generally greater than 5%) of the traditional blue light chip and fluorescent powder scheme, and the human eye health risk is reduced from the source.

The invention discloses a multi-channel flexible lens Mini LED light supplementing module of a disposable medical endoscope, and belongs to the technical field of medical instruments. The light supplementing module (1) is inserted into the endoscope body (2) and provides light for normal work of the endoscope. The light supplementing module (1) comprises a top cover (10), an LED (13), a printed circuit piece and a bonding pad (16). The top cover is arranged at the top end of the printed circuit piece, and the LED (13) is fixedly arranged on the top cover (10) and electrically connected with a circuit in the printed circuit piece. The bonding pad (16) is fixedly arranged at the bottom of the printed circuit piece and electrically connected with a circuit in the printed circuit piece, and meanwhile the bonding pad (16) is connected with an external power supply circuit so as to supply power to the LED. According to the invention, the problems of secondary tin dissolution, lamp failure and uneven chromatic aberration and illumination when the traditional chip LED is packaged and used can be solved.

The utility model provides an LED packaging structure and an LED light-emitting device, and relates to the technical field of LEDs, the LED packaging structure comprises a transparent support, and the transparent support is provided with an accommodating groove; the light-emitting chip is arranged in the containing groove of the transparent support, and the light-emitting chip is in a long strip shape; the fluorescent glue layer covers the light-emitting chip, the fluorescent glue layer is in an oval shape, and the fluorescent glue layer does not make contact with the side wall of the containing groove; and the convex lens layer is arranged on the transparent bracket and covers the accommodating groove. The LED light-emitting device comprises the LED packaging structure. According to the LED packaging structure provided by the utility model, the problems of insufficient light emitting angle and non-uniform light emitting of the LED packaging structure in the prior art are solved.

The utility model relates to a light emitting diode packaging structure. The LED packaging structure comprises a packaging body and at least one LED chip packaged in the packaging body, wherein each LED chip comprises a substrate, an epitaxial structure, a back reflecting mirror, a first isolation groove, a second isolation groove, a current blocking layer, a transparent conductive layer, a bonding pad structure and an insulating protection layer; the first isolation groove is formed in one side surface of the epitaxial structure and extends to the surface of the substrate from the second semiconductor layer; the second isolation groove is formed in the other side surface of the epitaxial structure and extends to the surface of the substrate from the first semiconductor layer; the insulation protection layer covers the isolation groove, the bonding pad structure and the transparent conductive layer; the packaging body comprises a packaging substrate and a packaging layer; the packaging substrate is used for bearing the LED chips; the packaging layer covers the LED chips; and KSF fluorescent powder is arranged in the packaging layer. According to the utility model, the problem that the GaN epitaxial structure is corroded due to hydrolysis of the KSF fluorescent powder in the prior art is effectively solved.

The utility model discloses an automatic positioning mechanism of a dispensing machine for LED packaging, and relates to the technical field of LED packaging. According to the automatic positioning mechanism of the dispensing machine for LED packaging, by arranging the mounting frame, the LED working platform, the moving frame, the rack, the lead screw, the limiting block, a fixing plate, a motor, a sliding groove, a second electric telescopic rod, a connecting plate, a connecting column, an incomplete gear and a moving plate, the function of overturning the LED working platform is achieved, the LED working platform is overturned in two different directions, and the working efficiency is improved. The glue dispensing pen can perform glue dispensing treatment on the side surface of an LED product on the surface of the LED working platform, so that the practicability of the device is enhanced; by arranging the supporting frame, the mounting plate, the glue dispensing pen and the first electric telescopic rod, the function of adjusting the height of the glue dispensing pen is achieved, after the first electric telescopic rod is started, the glue dispensing pen is driven by the mounting plate to move, the height of the glue dispensing pen is adjusted, and the glue dispensing pen conducts glue dispensing treatment on the faces, with different heights, of an LED.

The invention relates to the technical field of LED packaging structures, in particular to a high-power LED packaging structure which comprises a metal substrate, a chip placing groove is formed in the middle of the top of the metal substrate, telescopic grooves are formed in the positions, on the two sides of the chip placing groove, of the metal substrate, clamping plates are elastically connected into the telescopic grooves, and limiting ring grooves are formed in the rear ends of the tops of the clamping plates; the high-power LED packaging structure has the beneficial effects that when a high-power LED chip is damaged and needs to be maintained, fixing screws in a threaded through hole of a connecting lug ring and a lead frame are taken out firstly, then the connecting lug ring is lifted, the connecting lug ring drives a fixing pressing block connected to the inner side of an inserting groove to drive a fixing inserting block to ascend, and then the high-power LED chip is fixed; the fixing inserting blocks are separated from the fixing grooves formed in the tops of the inserting blocks, then the plastic shell is rotated, the plastic shell drives the inserting blocks to rotate to the openings of the inserting grooves from the inner sides of the inserting grooves through the connecting columns, and then the plastic shell is taken down from the top of the metal substrate.

The utility model relates to the technical field of LED packaging, in particular to a side-emitting multi-color integrated LED packaging structure, which comprises a ceramic substrate provided with a common-anode RGBW chip group. The RGBW chip set is directly welded on the ceramic substrate by adopting a flip chip design, the overall thickness of the packaging structure is less than or equal to 1.2 mm, the RGBW chip set is matched with preset solder paste below the RGBW chip set to be mounted on a bonding pad, the RGBW chip set is directly welded on the ceramic substrate by adopting the flip chip design, technologies such as gold wire bonding and matching with a film pasting technology are abandoned, and the packaging structure is simple in structure, convenient to manufacture and high in packaging efficiency. The overall thickness of the packaging structure is smaller than or equal to 1.2 mm, the packaging thickness is greatly reduced, the packaging structure can perfectly adapt to ultrathin application scenes such as side-entry backlight, the problem in the aspect of ultra-thinness in the traditional technology is effectively solved, the number of bonding pads is reduced to five by adopting the design that RGBW four-in-one chips share the anode / cathode, the anodes of the RGBW chips are connected in parallel, and the thickness of the packaging structure is greatly reduced. Only one common bonding pad and four independent bonding pads are needed, and the problem that bonding pad wiring is complex in the prior art is solved.

The invention provides a processing device and method for LED packaging, and relates to the field of LED packaging. The device comprises a discharging barrel, the upper end of the discharging barrel is fixedly connected with a fixed frame; a driving motor is fixedly mounted in the middle of the top end of the fixed frame; a stirring mechanism is arranged in the discharging barrel; the upper end of the stirring mechanism penetrates through the discharging barrel and the fixing frame and is matched with the output end of the driving motor; a vibration mechanism is arranged on the outer side of the upper end of the discharging barrel, and the vibration mechanism is matched with the stirring mechanism; and a discharging mechanism is arranged at the bottom end of the discharging barrel. Through mutual cooperation of a discharging barrel, a stirring threaded blade, a stirring rod and other structures, the stirring threaded blade drives a sealant to flow while the stirring rod stirs the sealant, so that base glue and a curing agent in the sealant are mixed more uniformly, incomplete mixing of the base glue and the curing agent is reduced, and the service life of the sealant is prolonged. And the problem that the sealing glue protection effect is reduced after the LED packaging processing device dispenses the glue is solved.

This invention relates to the technical field of LED packaging, and discloses an LED packaging structure, packaging method, and backlight module. The LED packaging structure includes a main substrate and at least two light-emitting units. Each light-emitting unit includes a transition substrate, a connecting component, an LED chip, and a phosphor layer. The transition substrate is disposed between the main substrate and the connecting component. The connecting component includes a component body and several metal layers disposed on the surface of the component body. The LED chip is mounted on the metal layers, and the light emission direction of the LED chip is horizontal. Holes are formed between the light-emitting units to expose the transition substrate or the main substrate. The phosphor layer is disposed on the main substrate and covers the LED chip, the surface of the connecting component, and the side surface of the transition substrate, and fills the hollowed-out portions. Implementing this invention can improve the light emission angle of the LED chip, improve the visual effect of the backlight module, and eliminate uneven brightness.

The application discloses an LED wafer-level packaging method, and steps are as follows: S1, preparing a substrate; S2, making and forming a conductive path through the substrate on the substrate; S3, making and forming an optical coupling layer on the inner bottom surface of the accommodating cavity; S4, assembling a light source chip in the accommodating cavity, and the light emitting surface of the light source chip faces the optical coupling layer; S5, making and forming an optical structure on the second surface of the substrate, and the optical structure is in optical path communication with the optical coupling layer; and S6, making and forming a conductive terminal electrically connected with one end of the conductive path on the second surface of the substrate. The substrate has three functions of bearing, light transmission and optical shaping, three independent structure layers of a plastic shell, a copper embedded base and an independent lens in the prior art are cancelled, and therefore the total thickness of the LED packaging structure can be controlled to be less than 0.5 mm.

The invention relates to the technical field of LED packaging, and discloses an LED packaging structure, an LED backlight module and a preparation method of the LED backlight module. The LED packaging structure comprises an LED chip, a fluorescent adhesive film and a protective adhesive film, the fluorescent adhesive film wraps the side face and the upper surface of the LED chip, the protective adhesive film wraps the side face and the upper surface of the fluorescent adhesive film, and the fluorescent adhesive film is obtained by mixing and curing a silica gel base material and fluorescent powder; and the protective adhesive film is obtained by curing a silica gel base material of the fluorescent adhesive film. By implementing the LED packaging structure, the light emitting brightness of the LED packaging structure can be improved, the light emitting angle of the LED chip can be expanded, moisture can be prevented from being in contact with the LED chip, and the concentration ratio and the light emitting uniformity of the LED backlight module can be improved, so that the light emitting uniformity and the reliability of the LED packaging structure and the backlight module can be improved.

The present application relates to the technical field of LED packaging, and particularly relates to a CSP device with global metal pads and a preparation method and application thereof, comprising: a super-thin aluminum substrate, one side surface of the super-thin aluminum substrate is provided with an enlarged electrode pad, the enlarged electrode pad and the super-thin aluminum substrate are integrated; the surface of the super-thin aluminum substrate is provided with a first bonding layer; a flip chip, one side surface of the flip chip is provided with a metal layer, the metal layer is sequentially stacked with an adhesive metal layer, a barrier layer and a second bonding layer from the direction close to the flip chip to the direction away from the flip chip; the first bonding layer and the second bonding layer are bonded and connected; and an encapsulation layer is used for covering the super-thin aluminum substrate, the flip chip and the bonding and connecting area. The scheme effectively overcomes inherent defects such as poor heat dissipation, low welding reliability and insufficient structural stability in the traditional process, significantly improves the comprehensive performance of the device, and meets the use requirements of Mini CSP direct SMT patch and other application scenarios.

The invention relates to the technical field of display, and provides an LED packaging device and a backlight module. The LED packaging device comprises: a substrate; the red light generation component comprises a first blue light LED chip and a red wavelength conversion material used for converting blue light emitted by the first blue light LED chip into red light, and is arranged in the first optical cavity on the substrate; the red wavelength conversion material is a mixture formed by mixing nitride-based red fluorescent powder and fluoride-based red fluorescent powder according to a set proportion, and the emission peak wavelength of the nitride-based red fluorescent powder is 600-670 nm; and the blue light generation component and the green light generation component are respectively used for generating blue light and green light and are arranged in other optical cavities except the first optical cavity on the substrate.

The present application relates to the technical field of semiconductor packaging, and particularly relates to a Micro-LED packaging structure and a manufacturing method thereof. The packaging structure comprises, from bottom to top, a substrate, a color filtering layer, a color conversion layer, an inorganic layer, a chip bonding layer, a micro light emitting diode layer, a first filling layer, a reflective layer and a second filling layer. The substrate is ground, thinned, cut and split to form independent discrete devices. By setting the reflective layer covering the packaging structure and the discontinuous chip bonding layer, the light emitted by the quantum dots and the micro light emitting diodes is reflected by the reflective layer, avoiding light crosstalk between the packaging structures. The first filling layer with a slope surface is arranged between the reflective layer and the micro light emitting diodes, so that the side light path avoids the micro light emitting diode body, improving the light efficiency. The micro light emitting diodes are arranged in a bias layout, preventing top damage during transfer packaging. The packaging structure has the advantages of preventing light crosstalk and facilitating laser cutting while improving light efficiency and preventing damage.

The application belongs to the technical field of nylon 66 composite materials, and discloses a heat-conducting composite filler, a preparation method thereof and application of the heat-conducting composite filler in nylon 66. The heat-conducting composite filler is composed of boron nitride (BN@PDA) modified by dopamine and magnesium oxide (MgO-KH560) modified by a silane coupling agent, and the mass ratio is 1-3:1. Through two-step surface modification and solution chemical bonding, the close combination between components is realized, and the problems of uneven dispersion of traditional single heat-conducting filler, poor compatibility with the nylon 66 matrix and weak heat-conducting synergistic effect are effectively solved. When the heat-conducting composite filler is applied to nylon 66 composite materials at an addition amount of 10-30wt%, the thermal conductivity of the nylon 66 can be improved to more than 0.8 W / (m·K), the tensile strength is improved by 17%, and the heat-conducting composite filler has excellent processing performance, and is suitable for the fields of electronic equipment heat dissipation components, LED packaging materials, automobile heat management components and other fields with strict requirements on the thermal conductivity of materials.

The present application relates to the technical field of microelectronic packaging, and particularly relates to a bonding wire for electronic devices and a preparation method thereof.The bonding wire is composed of Cu 2-4%, Al 2-4%, Pd 0.1-0.5%, In 0.7-1.5%, Zn 0.2-0.5%, Ru 0.01-0.06%, and the balance of Ag, in terms of mass percentage.The present application discards the traditional method of adding rare earth elements to improve the corrosion resistance of silver-based bonding wires, and significantly improves the corrosion resistance of silver-based bonding wires by optimizing the alloy component design, especially the addition of In, Zn, Ru and other components, while taking into account good mechanical properties and process adaptability.The silver-based bonding wire provided by the present application can be used as an ideal substitute material for gold wire, and can be applied to the fields of microelectronic packaging such as integrated circuits, LED packaging, power devices, MEMS packaging, etc.

The invention belongs to the technical field of LED packaging, and particularly relates to an LED support unit, an LED lamp bead and a manufacturing method of the LED lamp bead. Comprising a metal support, the metal support comprises a bonding pad portion used for bearing LED lamp beads, a pin portion used for circuit connection and a supporting portion used for connecting the bonding pad portion and the pin portion, the pin portion is arranged in a plane mode and serves as an external welding face used for surface mounting, and the supporting portion is arranged in a straight line mode. The pin part 12 is arranged in a plane and directly serves as an external welding surface, a pin bending forming process required by a traditional support is thoroughly abandoned, the problem of poor pin coplanarity, namely high and low pins, caused by metal bending springback is fundamentally eliminated, and zero-clearance fit between the bottom surface of the support and a circuit board is ensured.