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1253 results about "Led packaging" patented technology

High refraction and high adhesion large power LED packaging organosilicon material and preparation method thereof

ActiveCN102936414ASolve the problem of incomplete hydrolysis and condensationReduce air permeabilitySemiconductor devicesChemical synthesisPtru catalyst
The present invention relates to a high refraction and high adhesion large power LED packaging organosilicon material and a chemical synthesis method thereof. The organosilicon packaging material is prepared by carrying out mixing matching on a component A and a component B according to a mass ratio of 1:1, wherein the component A comprises vinyl phenyl polysiloxane, vinyl phenyl silicone oil, a platinum-containing polysiloxane catalyst and a tackifier, the component B comprises hydrogen-containing phenyl polysiloxane, dihydrideterminated phenyl polysiloxane, vinyl phenyl polysiloxane and an inhibitor, the tackifier is prepared by carrying out addition on isocyanate, methoxy silane and epoxy silane, and provides strong adhesion for PPA and a silver surface, the curing agent is prepared by compounding hydrogen-containing phenyl polysiloxane and dihydrideterminated phenyl polysiloxane, and a compounding mass ratio is preferably 4:1-2, such that the packaging material has moderate hardness and flexibility after curing so as to effectively solve contradiction of strength and cracking of the cured adhesive. With the present invention, the organosilicon packaging material with characteristics of refraction of 1.54, suitability for industrialization and fully meeting of large power LED packaging requirements can be obtained.
Owner:湖北环宇化工有限公司

Single-component high-refractivity LED (light-emitting diode) packaging adhesive and preparation method thereof

The invention provides a single-component high-refractivity LED (light-emitting diode) packaging adhesive which is prepared from the following raw materials in parts by weight: 50-80 parts of vinyl of phenyl polysiloxane, 25-40 parts of crosslinking agent, 0.1-0.5 part of platinum catalyst, 0.01-0.1 part of inhibitor and 0-5 parts of auxiliary material. The single-component high-refractivity LED packaging adhesive has the advantages of high refractivity, high light transmittance, radiation resistance, high/low temperature resistance, weather resistance and the like; the viscosity of the single-component high-refractivity LED packaging adhesive is 1000-7000 mPa.s, the storage period at normal temperature is 60 days, the storage period at 0-4 DEG C is 6 months, and the hardness after curing is 80A-70D; and the single-component high-refractivity LED packaging adhesive is suitable for packaging protection for high-power high-lighting-effect LEDs. The invention also provides a preparation method of the single-component high-refractivity LED packaging adhesive. The preparation method has the advantages of accessible raw materials, no pollution and mild conditions, and is simple to operate, easy to control and convenient for industrialization.
Owner:NICHE TECH KAISER SHANTOU

LED (light emitting diode) pixel unit device structure and preparation method thereof

The invention discloses an LED (light emitting diode) pixel unit device structure. In the structure, three LED chip units which are connected by a same substrate but electrically separated are used and are packaged in a face-down mode to reduce the packaging area of the device, thus the resolution ratio of an LED display screen can be improved; and each LED chip unit has the very same structure, an R color filter film, a G color filter film and a B color filter film are respectively formed on each LED chip unit for sending out a red light, a green light and a blue light respectively, thus each LED chip unit can have an uniform attenuation and the color consistency of the display screen can be improved. The invention also discloses a preparation method for the structure. The LED modules are arranged on a heat conducting substrate in the face-down mode, thus the procedures of chip die bond and gold wire bonding can be omitted, the manufacturing costs can be reduced, the production efficiency can be improved, the problem of light-blocking of the pad and the lead in small-sized LED packaging can be solved, the light extraction efficiency of the LED can be considerably improved, the packaging space can be saved and the further miniaturization and integration of the LED packaging size can be realized.
Owner:ENRAYTEK OPTOELECTRONICS

POSS/epoxy nanometer hybrid material and preparation method and application thereof

The invention belongs to the technical field of chemical industry and photoelectricity, and in particular relates to a high-heat-resistant POSS/epoxy nanometer hybrid material and a preparation method and application thereof. The high-heat-resistant POSS/epoxy nanometer hybrid material comprises (a) at least one epoxy resin, (b) at least one polyhedral oligomeric silsesquioxane (POSS), (c) at least one acidic curing agent, (d) unnecessary organosilane, and (e) an unnecessary auxiliary agent. The POSS/epoxy nanometer hybrid material prepared by the method does not have a phase separation phenomenon, has the characteristics of the epoxy resin such as high caking property, mechanical strength, shearing strength and processability, and has the characteristics of the POSS such as high heat resistance, insulating property, elasticity, ageing resistance and transparency; the production and preparation process is simple, and easy to control; a solvent is not used in the production process; and the method is an environmental-friendly and energy-saving method for synthesizing the POSS/epoxy nanometer hybrid material. The POSS/epoxy nanometer hybrid material is used for an adhesive, an LED packaging material, a photoelectric conversion material, an insulating material, a coating material, a circuit protection material, an optical protection material and the like.
Owner:FUDAN UNIV +1

Flat non down-lead encapsulation piece and method for producing the same

The invention discloses a flat non-lead packaging part and a production method thereof. The flat non-lead packaging part comprises a lead frame carrier, wherein the carrier is adhered with an IC chip. The front side of the lead frame carrier is provided with pits. The periphery of the front side of the lead frame carrier is provided with two circles of waterproof grooves. The back side of the lead frame carrier is provided two circles of anti-overflow grooves. The production method comprises the processes of washer thinning and slicing, core loading, press welding, plastic package, plating, printing and cutting and coiling. The method strengthens the bonding forces between the adhesive and the lead frame carrier and the IC chip and eliminates and reduces the rate of a lamination defect generated on the surface of the IC chip. The two circles of waterproof grooves are provided on the periphery of the carrier, the plastic packaging materials are embedded in the grooves so as to prevent moisture from entering the chip. The two circles of anti-overflow grooves arranged on the edge of the carrier have functions of preventing the lamination defect, moisture and material overflow. The method has the advantages of high rate of finished product, good reliability and convenient use, and effectively improves the reliability and excellent packaging rate of products.
Owner:TIANSHUI HUATIAN TECH

All-inorganic SMD LED packaging method and structure

The invention discloses an all-inorganic SMD LED packaging method. The method includes the following processes that firstly, a support is manufactured, secondly, dehumidification, baking and plasma cleaning are conducted on the whole ceramic support, thirdly, wafer expanding is conducted on a flip chip, fourthly, a ceramic substrate is baked, fifthly, a glass cover plate is closed, and a second metal layer and an LED support are welded in a seamless mode, and sixthly, cutting is conducted. The first process particularly includes the following steps that the ceramic substrate is prepared; the ceramic substrate with a circuit is manufactured; the glass cover plate is manufactured; the edge of the ceramic substrate obtained through the twelfth process and the edge of the glass cover plate obtained through the thirteenth step are ground respectively; a first metal layer is arranged around the ceramic substrate, the second metal layer is arranged around the side, covering the ceramic substrate, of the glass cover plate, and then a metalized ceramic substrate frame and a glass cover plate frame which have high heat conduction performance are formed; a groove of the ceramic plate is plated with silver; a metal heat sink body and a metal bonding pad are arranged. In the fifth process, LED device indirect high-temperature heating rapid inorganic material airtight packaging is achieved.
Owner:厦门多彩光电子科技有限公司
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