1253 results about "Led packaging" patented technology

The present invention provides a method and apparatus for using light emitting diodes for curing and various solid state lighting applications. The method includes a novel method for cooling the light emitting diodes and mounting the same on heat pipe in a manner which delivers ultra high power in UV, visible and IR regions. Furthermore, the unique LED packaging technology of the present invention utilizes heat pipes that perform very efficiently in very compact space. Much more closely spaced LEDs operating at higher power levels and brightness are possible because the thermal energy is transported in an axial direction down the heat pipe and away from the light-emitting direction rather than a radial direction in nearly the same plane as the “p-n” junction.

A surface mount LED package having a tight footprint and small vertical image size is fabricated by a method comprising: forming light emitting diode chips each having a substrate and a plurality of layers configured to emit electroluminescence responsive to electrical energizing; forming electrical vias in a sub mount, the electrical vias passing from a front side of the sub-mount to a back-side of the sub-mount; flip chip bonding the light emitting diode chips on the front-side of the sub mount such that each light emitting diode chip electrically contacts selected electrical vias; thinning or removing the substrates of the flip-chip bonded light emitting diode chips; and after the thinning, disposing a phosphor over the flip chip bonded light emitting diode chips.

The invention relates to a side-emitting LED package and a manufacturing method thereof. The side-emitting LED package includes a substrate with an electrode formed thereon, and a light source disposed on the substrate and electrically connected to the electrode. The side-emitting LED package also includes a molded part having an upper surface with a center thereof depressed concavely, covering and protecting the substrate and the light source, and a reflection layer covering an entire upper surface of the molded part to reflect light sideward from the molded part which forms a light transmitting surface. The package is not restricted in the shape of the molded part and is not affected by the LED chip size, enabling a compact structure. The invention can also process a substrate by a PCB process, enabling mass-production.

The present invention provides a substrate for LED packaging and a fabrication method thereof. The substrate can dissipate heat quickly and enhance light emitting efficiency. For this purpose, several via holes are formed in the substrate and metal layers are coated to act as light reflector. In the substrate, the via holes are filled with the material with high thermal conductivity, such as Copper, to conduct the heat efficiently; and the reflector are coated the metal with high reflection factor to visible light, such as Ag, Au, Al, to enhance the light emitting efficiency.

The invention discloses a high power white light emitting diode (LED) packaging structure and a packaging method. The high power white LED packaging structure mainly comprises an LED chip, a substrate, an internally sealed colloid, a fluorescent powder layer or a fluorescent powder adhesive layer and an externally sealed lens. The invention is characterized in that the LED chip is stuck on the substrate, a chip electrode is connected with a circuit layer on the substrate, the LED chip is covered by the internally sealed colloid, the outer surface of the internally sealed colloid is wrapped by the fluorescent powder layer or the fluorescent powder adhesive layer, and the outer surface of the fluorescent powder layer or the fluorescent powder adhesive layer is wrapped by the externally sealed lens. The invention has the advantages of promoting the light emitting effect of each layer through optically designing and packaging each layer of enveloped colloid of the LED chip, realizing mutually separate heat diffusion through a suitable process flow manufacture to isolate the fluorescent powder and the chip, having high light emitting efficiency and good light emitting stability, and being applied to packaging high power and high brightness LED.

A spiral LED packaging filament comprises a substrate, a plurality of LED chips disposed on the top surface of the substrate, a medium layer sealing the plurality of LED chips and the top surfaces of the substrate into a sealed LED package; two electrode wires being electric connected to the plurality of LED chips, wherein the sealed LED package has a spiral shape. A light bulb with the spiral LED packaging filament comprises a bulb shell; a stem having a supporting pole, an electrical wire and a stem exhaust pipe, at least one spiral LED packaging filament is fixed on the stem; the electrode wire is connected to the electrical connector via the drive; and the bulb shell and the stem are respectively sealed.

A light module includes a light engine that has an LED package having power terminals. A base ring assembly holds the light engine. The base ring assembly has a base ring configured to be mounted to a supporting structure. The base ring has a securing feature. The base ring assembly has a contact holder that holds power contacts. The power contacts are spring biased against the power terminals to create a separable power connection with the power terminals. A top cover assembly is coupled to the base ring. The top cover assembly has a collar surrounding the base ring. The top cover assembly has a securing feature that engages the securing feature of the base ring to couple the collar to the base ring. The collar has a cavity and the optical component is received in the cavity. The optical component is positioned to receive light from the LED package and the optical component is configured to emit the light generated by the LED package.

A light-emitting diode (LED) module and an LED packaging method. As the LED module is packaged under the consideration of candela distribution, each of the lead frames of the LED chips packaged in the LED module is bended for tilting the LED chips by different angles to exhibit various lighting effects. Meanwhile, in the LED packaging method, a plurality of LED chips can be loaded on board rapidly and aligned by one operation to result in less deviation in the candela distribution curve.

A single chip multi-voltage or multi-brightness LED lighting device having at least two LED circuits having at least two LEDs connected seπes, and electrically unconnected in a parallel relationship, a forward operating dπve voltage of at least six volts and are monolithically integrated on a single substrate, configurable by means of connecting the circuits so as to provide optional operating voltage level and/or desired brightness level wherein the electrical connection at the LED packaging level when the single chips are integrated into the LED package Alternatively, the LED package may have external electrical contacts that match the integrated chips within Optionally allowable, the drive voltage level and/or the brightness level select-ability may be passed on through to the exterior of the LED package and may be selected by the LED package user, the PCB assembly facility, or the end product manufacturer.

The invention relates to the technical fields of photoelectricity and chemical industry, in particular to a low-stress epoxy/organic silicon/POSS nano hybrid material, and a preparation method and application thereof. The epoxy/organic silicon/POSS nano hybrid material comprises (a) an epoxy resin, (b) a polyorganosiloxane, (c) a cage-type polysilsesquioxane (POSS), (d) an epoxy hardener, (e) non-essential silane oxycompound and (f) non-essential assistants, wherein the polyorganosiloxane contains epoxy groups and silane oxygen groups. The cured nano hybrid system has excellent reticular cross-linked structure and does not have microphase separation. The epoxy/organic silicon/POSS nano hybrid material has the advantages of high mechanical strength, favorable heat resistance, favorable cohesive property, high chemical stability, favorable ultraviolet aging resistance, favorable optical transparency and other excellent properties, has the functions of low internal stress and pressure buffer, and can be used as an LED packaging material, optical protection material, circuit protection coating material, adhesive paint and the like.

A light emitting diode system includes a housing including a light emission opening and a light emitting diode disposed within the housing. A first film layer covers the light emission opening and includes a uniaxial collimating film configured to direct light from the light emitting diode along a first axis.

The present invention is directed to LED packages and methods utilizing waterproof and UV resistant packages with improved structural integrity. In some embodiments, the improved structural integrity is provided by various features in the lead frame that the casing material encompasses to improve the adhesion between the lead frame and the casing for a stronger, waterproof package. Moreover, in some embodiments the improved structural integrity and waterproofing is further provided by improved adhesion between the encapsulant and the casing. Some embodiments also provide for improved wire bonds, with the length, thickness, and loop height of the wire bonds controlled and optimized for improved adhesion between the wire bonds and the encapsulant as well as improved reliability.

LED packages are disclosed that are compact and efficiently emit light, and can comprise encapsulants with curved and planar surfaces. The packages can comprise a submount with a one or a plurality of LEDs, and in those with a plurality of LEDs each of the LEDs can emit the same or different wavelengths of light than the others. A blanket conversion material layer can be included on at least some of the LEDs and the submount. The encapsulant can be on the submount, over at least some of the LEDs, with each of the planar surfaces being vertical and aligned with one of the edges of the submount. The encapsulant can also have a upper curved surface with a relatively large radius of curvature, with the combination of curved and planar surfaces resulting in efficient emission of light with a relatively narrow emission profile.

LED packages and LED displays utilizing the LED packages are disclosed where the peak emission of the LED display can be tilted or shifted to customize its peak emission to the mounting height or location of the LED display. One embodiment of an LED display comprises a plurality of LED package where the peak emission from at least some of the LED packages is tilted off the package centerline. The LED packages are mounted within the display in such a way as to generate an image having a peak emission that is tilted off the perpendicular emission direction of the display.

The invention provides a preparation method of a ceramic substrate for high-power LED packaging, comprising the following steps of: preparing for the surface-processed ceramic substrate, covering the ceramic substrate with prepared cuprous oxide slurry, forming a circuit diagram, drying, sintering, reducing and plating a film to prepare ceramic substrate with a smooth and compact metal surface. With the combination of a thick film technology and a bonded copper principle on the surface of the ceramic substrate, metallization is realized without coating equipment and a complex technology required by a thin preparation technology and a special technology for direct bonded copper. In addition, with the combination of a direct bonded copper principle, the bonding strength of the metal layer and ceramic is raised and the spalling problem caused by thermal shock is minimized. According to the invention, the technology is simple; large-scale equipment is not required; raw materials are low-priced; the yield is high; metal patterning is convenient; surface fineness is high; and the copper layer thickness on the surface of the substrate is especially controllable so as to make the operation of a power electronic device more stable.

The present invention relates to a high refraction and high adhesion large power LED packaging organosilicon material and a chemical synthesis method thereof. The organosilicon packaging material is prepared by carrying out mixing matching on a component A and a component B according to a mass ratio of 1:1, wherein the component A comprises vinyl phenyl polysiloxane, vinyl phenyl silicone oil, a platinum-containing polysiloxane catalyst and a tackifier, the component B comprises hydrogen-containing phenyl polysiloxane, dihydrideterminated phenyl polysiloxane, vinyl phenyl polysiloxane and an inhibitor, the tackifier is prepared by carrying out addition on isocyanate, methoxy silane and epoxy silane, and provides strong adhesion for PPA and a silver surface, the curing agent is prepared by compounding hydrogen-containing phenyl polysiloxane and dihydrideterminated phenyl polysiloxane, and a compounding mass ratio is preferably 4:1-2, such that the packaging material has moderate hardness and flexibility after curing so as to effectively solve contradiction of strength and cracking of the cured adhesive. With the present invention, the organosilicon packaging material with characteristics of refraction of 1.54, suitability for industrialization and fully meeting of large power LED packaging requirements can be obtained.

The invention provides a single-component high-refractivity LED (light-emitting diode) packaging adhesive which is prepared from the following raw materials in parts by weight: 50-80 parts of vinyl of phenyl polysiloxane, 25-40 parts of crosslinking agent, 0.1-0.5 part of platinum catalyst, 0.01-0.1 part of inhibitor and 0-5 parts of auxiliary material. The single-component high-refractivity LED packaging adhesive has the advantages of high refractivity, high light transmittance, radiation resistance, high/low temperature resistance, weather resistance and the like; the viscosity of the single-component high-refractivity LED packaging adhesive is 1000-7000 mPa.s, the storage period at normal temperature is 60 days, the storage period at 0-4 DEG C is 6 months, and the hardness after curing is 80A-70D; and the single-component high-refractivity LED packaging adhesive is suitable for packaging protection for high-power high-lighting-effect LEDs. The invention also provides a preparation method of the single-component high-refractivity LED packaging adhesive. The preparation method has the advantages of accessible raw materials, no pollution and mild conditions, and is simple to operate, easy to control and convenient for industrialization.

The invention discloses a light-emitting diode packaging structure and a backlight module. The light-emitting diode packaging structure is assembled in the backlight module of the liquid crystal display to be the backlight of the backlight module. The light-emitting diode packaging structure provides three independent LED packaging structures adjacent to each other, wherein the three LED packaging structures are used for respectively generating a red light, a green light and a blue light which can be mutually mixed into white light. The design can ensure that various colored lights can not be absorbed or scattered by fluorescent powder with other colors, therefore the light-emitting diode packaging structure is beneficial to regulating and controlling single colors, increasing the light-emitting efficiency of each colored light and enlarging the color gamut of the white light.

The invention relates to one LED sealing structure, which comprises circuit board, several LED light units on circuit front, wherein, the circuit board back is set with terminal to outer circuit. The invention also provides one LED sealing method, which comprises the following steps: processing special mode board; binding LED light chip; mode loading with down mode board facing down with each LED light unit contained into each module particle; glue injecting and fixing step.

The invention discloses an LED (light emitting diode) pixel unit device structure. In the structure, three LED chip units which are connected by a same substrate but electrically separated are used and are packaged in a face-down mode to reduce the packaging area of the device, thus the resolution ratio of an LED display screen can be improved; and each LED chip unit has the very same structure, an R color filter film, a G color filter film and a B color filter film are respectively formed on each LED chip unit for sending out a red light, a green light and a blue light respectively, thus each LED chip unit can have an uniform attenuation and the color consistency of the display screen can be improved. The invention also discloses a preparation method for the structure. The LED modules are arranged on a heat conducting substrate in the face-down mode, thus the procedures of chip die bond and gold wire bonding can be omitted, the manufacturing costs can be reduced, the production efficiency can be improved, the problem of light-blocking of the pad and the lead in small-sized LED packaging can be solved, the light extraction efficiency of the LED can be considerably improved, the packaging space can be saved and the further miniaturization and integration of the LED packaging size can be realized.

An LED package includes a substrate with two opposite lateral bulging portions, an LED die, an electrode structure, and a reflective layer. The substrate includes a first substrate and a second substrate stacked together; the first substrate and the second substrate are transparent; and the substrate includes an emitting surface for emitting light of the LED package. The electrode structure is sandwiched between the first substrate and the second substrate. The LED die is mounted in the substrate and electrically connected to the electrode structure. The reflective layer is formed on an outer surface of the substrate except the emitting surface and the bulging portions. The disclosure also provides a method for manufacturing such an LED package.

The invention relates to an omnibearing lighting LED (light-emitting diode) packaging method and an LED packaging part. An LED chip and an electrode are firmly fixed on one or more pieces of transparent glass or transparent films by using a transparent crystal bonding adhesive, and then a transparent support on which the LED chip, the electrode and a welding line are fixed is erected and mounted in a transparent container. When the diode is electrified, the front surface of the LED chip on the erected transparent support can emit light normally, and the bottom part of the LED chip can also emit the brighter light through the transparent glass or the transparent films. By adopting the LED packaging method and the LED packaging part, the limitation that the brightest surface of an LED can not be displayed outwards due to a power supply conducting wire in the existing packaging technology can be eliminated, and the light extraction rate of the LED can be improved.

The invention discloses a quantum dot-embedded silicon dioxide composite material, which consists of 60 to 100 weight parts of porous silicon dioxide, 0.01 to 20 weight parts of semiconductor quantum dots embedded on the surface of the porous silicon dioxide and 1 to 15 weight parts of surfactant. The quantum dot-embedded porous silicon dioxide composite material is mainly applied to the fields such as light conversion films, light-emitting diode (LED) packaging and concealed print; the prepared light conversion films have high light transmittance, high-temperature resistance, wear resistance and the like, and have high light transmittance, luminescent properties and oxidation resistance when used for LED packaging.

The invention relates to a chip scale package LED packaging method, which comprises the steps that (1) a fixing film used for fixing positions of LED chips is arranged on a carrier plate; (2) a plurality of LED chips are distributed at the surface of the fixing film, the LED chips are distributed in an array mode, and a gap is reserved between the adjacent LED chips; (3) the LED chips are covered with a layer of fluorescent glue, the gap between the adjacent LED chips can be filled with the fluorescent glue, and the top surface of four side surfaces of each LED chip are wrapped by the fluorescent glue; a protective film is attached to the surface of a fluorescent glue layer after the fluorescent glue is solidified; (5) cutting is carried out at the gap between the adjacent LED chips, the adjacent LED chips form a channel therebetween, and the channel can cut the fluorescent glue layer and the protective film; (6) each channel is filled with light blocking glue; (7) cutting is carried out on a light blocking glue layer after the light blocking glue is solidified, and the light blocking glue layer is cut to the fixing film; and (8) the single LED chip is separated from the fixing film and the protective film so as to form a single finished product.

An airtight multi-layer array type LED is disclosed, which comprises a metal substrate with an airtight metal frame formed thereon, and the metal substrate is integrally formed with the airtight metal frame, and an airtight sealing frame slot is formed around the upper surface of the airtight metal frame, the airtight metal frame is installed with two sets of sealing through hole pairs accommodating the lead frames. The interior of the airtight metal frame can be installed with packaging materials or optical components. The sealing holes are sealed with a glass or ceramic material. A fluorescent layer is formed on a silica gel layer, wherein the fluorescent layer can also be installed inside a silica glass package cover. The silica glass package cover is installed on the top surface of the airtight metal frame, and the silica glass package cover is engaged and sealed to a sealing rack. Nitrogen is filled in a space defined between the silica glass package cover and the fluorescent layer, so that moisture is prevented from permeating through the airtight metal frame and a dice protection layer. As such, a sealed-type LED packaging structure is formed and is suitable to be used in extreme or severe environments.

The invention belongs to the technical field of chemical industry and photoelectricity, and in particular relates to a high-heat-resistant POSS/epoxy nanometer hybrid material and a preparation method and application thereof. The high-heat-resistant POSS/epoxy nanometer hybrid material comprises (a) at least one epoxy resin, (b) at least one polyhedral oligomeric silsesquioxane (POSS), (c) at least one acidic curing agent, (d) unnecessary organosilane, and (e) an unnecessary auxiliary agent. The POSS/epoxy nanometer hybrid material prepared by the method does not have a phase separation phenomenon, has the characteristics of the epoxy resin such as high caking property, mechanical strength, shearing strength and processability, and has the characteristics of the POSS such as high heat resistance, insulating property, elasticity, ageing resistance and transparency; the production and preparation process is simple, and easy to control; a solvent is not used in the production process; and the method is an environmental-friendly and energy-saving method for synthesizing the POSS/epoxy nanometer hybrid material. The POSS/epoxy nanometer hybrid material is used for an adhesive, an LED packaging material, a photoelectric conversion material, an insulating material, a coating material, a circuit protection material, an optical protection material and the like.

The invention discloses a flat non-lead packaging part and a production method thereof. The flat non-lead packaging part comprises a lead frame carrier, wherein the carrier is adhered with an IC chip. The front side of the lead frame carrier is provided with pits. The periphery of the front side of the lead frame carrier is provided with two circles of waterproof grooves. The back side of the lead frame carrier is provided two circles of anti-overflow grooves. The production method comprises the processes of washer thinning and slicing, core loading, press welding, plastic package, plating, printing and cutting and coiling. The method strengthens the bonding forces between the adhesive and the lead frame carrier and the IC chip and eliminates and reduces the rate of a lamination defect generated on the surface of the IC chip. The two circles of waterproof grooves are provided on the periphery of the carrier, the plastic packaging materials are embedded in the grooves so as to prevent moisture from entering the chip. The two circles of anti-overflow grooves arranged on the edge of the carrier have functions of preventing the lamination defect, moisture and material overflow. The method has the advantages of high rate of finished product, good reliability and convenient use, and effectively improves the reliability and excellent packaging rate of products.

The invention discloses an LED device and light source with a sunlight visible light part spectrum structure. The LED device comprises a blue LED chip or blue fluorescent powder, thereby mixing cyan,red, green and orange spectrum components into an emission spectrum of the LED device by using cyan fluorescent powder, green fluorescent powder, orange fluorescent powder and red fluorescent powder to obtain white light. Compared with the prior art, the LED light source has sunlight emission spectrum configuration, does not contain an ultraviolet or infrared spectrum component and is a healthy light source; the white LED device is packaged by adopting a four-primary color or five-primary color technical scheme, and different from a traditional three-primary color concept and a two-primary color technical scheme adopted for early LED packaging, the four-primary color or five-primary color technical scheme has the advantages that the condition that the most important cyan spectrum componentwith a wavelength range of 480-520nm in a solar spectrum needs to be added is emphasized; the environment-friendly, green and energy-saving requirements are met; and the human health requirements arealso met.

The invention discloses an all-inorganic SMD LED packaging method. The method includes the following processes that firstly, a support is manufactured, secondly, dehumidification, baking and plasma cleaning are conducted on the whole ceramic support, thirdly, wafer expanding is conducted on a flip chip, fourthly, a ceramic substrate is baked, fifthly, a glass cover plate is closed, and a second metal layer and an LED support are welded in a seamless mode, and sixthly, cutting is conducted. The first process particularly includes the following steps that the ceramic substrate is prepared; the ceramic substrate with a circuit is manufactured; the glass cover plate is manufactured; the edge of the ceramic substrate obtained through the twelfth process and the edge of the glass cover plate obtained through the thirteenth step are ground respectively; a first metal layer is arranged around the ceramic substrate, the second metal layer is arranged around the side, covering the ceramic substrate, of the glass cover plate, and then a metalized ceramic substrate frame and a glass cover plate frame which have high heat conduction performance are formed; a groove of the ceramic plate is plated with silver; a metal heat sink body and a metal bonding pad are arranged. In the fifth process, LED device indirect high-temperature heating rapid inorganic material airtight packaging is achieved.

An LED package includes a substrate, an LED die, and an encapsulating layer. The LED die is arranged on the substrate. The encapsulating layer covers the LED die and at least a part of the substrate. The encapsulating layer includes a light dispersing element. A light scattering intensity of the light dispersing element is proportional to the light intensity of light generated by the LED die and illuminated at the encapsulating layer. A luminance at a center of the LED package is substantially identical to that at a circumference of the LED package.