534 results about "Led packaging" patented technology

The invention provides an LED packaging device and a preparation method and application thereof, and relates to the technical field of semiconductor devices.The preparation method comprises the steps that packaging silica gel and fluorescent powder are mixed according to a preset proportion, and then a film with the preset thickness is prepared through a film scraping machine; curing the membrane at a first preset temperature for a first preset time, and completing primary curing to obtain a semi-cured fluorescent sheet; transferring the semi-cured fluorescent sheet to the flip LED chip which is subjected to die bonding in the bracket, and carrying out vacuum pressure sinking, so that the semi-cured fluorescent sheet is completely attached to the surface and the side surface of the flip LED chip; curing the semi-cured fluorescent sheet subjected to vacuum pressure sinking at a second preset temperature for a second preset time, and completing secondary curing to obtain a cured finished product; according to the LED packaging device and the manufacturing method thereof, the technical problems that in the prior art, the stability of the dispensing glue amount of the LED packaging device is poor, fluorescent powder is not evenly distributed, and consequently the brightness and the concentration degree are reduced can be solved.

The invention relates to a transfer method of a Micro LED packaging structure and a Micro LED display device, and relates to the technical field of semiconductor display. According to the transfer method of the Micro LED packaging structure, the ratio of the thickness of a packaging layer subjected to planarization processing to the height of a Micro LED unit is set to be larger than 10, then four symmetrically-distributed concave cavities are formed in the packaging layer of each Micro LED packaging array, the ratio of the depth of the concave cavities to the thickness of the packaging layer is 0.3-0.5, and the ratio of the depth of the concave cavities to the thickness of the packaging layer is 0.3-0.5. The distance between every two adjacent concave cavities is 800-3000 microns, through the process steps, the large-size magnetic component can be formed, the preparation process of the magnetic component is simplified, and the magnetic attraction force of the magnetic component can be improved.

The utility model discloses an LED packaging structure and a backlight source, the LED packaging structure comprises an LED chip and a support, the support is provided with a cup cavity, the bottom of the cup cavity is provided with a metal bonding pad, the LED chip is arranged on the metal bonding pad, and the cup cavity is filled with fluorescent glue to cover the LED chip; wherein a cup opening of the cup cavity is covered with a light-emitting adjusting structure layer, and the light-emitting adjusting structure layer is used for adjusting the divergence angle of first emergent light rays of the LED chip, so that the divergence angle of the first emergent light rays is converted into a second angle from a first angle. The backlight source structure can be simplified, and the cost is reduced.

The invention discloses a Mini LED package test method and test equipment. The method comprises the following steps: performing light irradiation on Mini LED package by using a reverse light path tracking technology to obtain an interference pattern and determine a function sensitive area; injecting a quantum dot fluorescent marker into the functional sensitive area to carry out multispectral dynamic monitoring; performing surface plasma resonance spectrum scanning on the functional sensitive area to obtain surface plasma resonance response data; performing an acoustic stimulation test on the functional sensitive area according to the obtained data to obtain acoustic response data; and performing a compensation test by using the nonlinear optical material layer to obtain performance attenuation prediction data. According to the technical scheme, accurate detection and performance prediction of the miniature optical structure in Mini LED packaging are achieved, and potential early failure symptoms can be effectively recognized.

The invention discloses a preparation method and structure of an omnibearing heat dissipation Micro LED packaging module. The preparation method comprises the following steps: S1, customized manufacturing of a VC vapor chamber; s2, laminating a VC vapor chamber; s3, carrying out low-thermal-resistance die bonding; s4, gold wire protection and heat dissipation are integrated; s5, the VC vapor chamber is covered with packaging glue; s6, the VC vapor chamber is attached to the bottom of the optical lens; s7, connecting the module with a driver; s8, power-on detection is carried out; the structure comprises a multi-layer composite heat dissipation substrate, an FPCB, a packaging adhesive layer, an optical lens and a driving board. The multi-layer composite heat dissipation substrate, the FPCB, the packaging adhesive layer, the optical lens and a VC soaking plate in the driving plate form a closed-loop heat dissipation network; the VC vapor chamber with active circulation heat dissipation is obtained by changing the structure of the heat dissipation substrate, and the VC vapor chamber covers the gold wire protection glue, the bottom of the optical lens, the drive board shell and the back surface of the FPCB, so that the heat dissipation efficiency is improved, the working temperature of the module is reduced, the brightness of the product is improved, and the service life of the product is prolonged.

The invention discloses a preparation method of an inverted LED packaging device, and relates to the technical field of semiconductor devices.The inverted preparation method comprises the steps that stamping, electroplating and injection molding are conducted on a tape-winding type metal plate, and a tape-winding type LED support is formed; bonding the flip LED chip on the tape winding type LED bracket through soldering paste to complete die bonding; the bonding pad of the flip LED chip is connected with the conductive area on the winding type LED support through the soldering paste in a reflow soldering mode; packaging glue is filled in the groove of the tape type LED support in a glue brushing mode, and baking and curing are carried out; according to the flip LED packaging device and the manufacturing method of the flip LED packaging device, the technical problem that in the prior art, a sheet type LED support is adopted for packaging, and the process efficiency is low can be solved.

The utility model discloses an anti-dazzle, high-covering and visual color difference improving LED packaging film material, which comprises an EVA adhesive film layer, a PET film material layer is arranged at the top of the EVA adhesive film layer, the PET film material layer comprises a PET base material layer, an AG layer outer layer arranged at the top of the PET base material layer and a flexographic printing layer inner layer arranged at the bottom of the PET base material layer, and the flexographic printing layer inner layer is arranged at the top of the EVA adhesive film layer; according to the anti-dazzle, high-covering and visual color difference improving LED packaging film material, the LED packaging film material is used for being attached to the surface of an LED screen, the anti-dazzle, high-covering and visual color difference improving effects are achieved, therefore, the color difference performance of the LED screen can be greatly reduced, and finally the visual expressive force of the LED screen and the use experience of a user are greatly improved.

The invention discloses an MIP grid glue filling dam surrounding technology and a novel LED lamp bead, and relates to the technical field of LED packaging, and the technology comprises the following steps: light-emitting chips are fixed on a substrate, the light-emitting chips and the substrate form a eutectic interface through a eutectic welding technology, the substrate comprises N units, and at least one group of light-emitting chips are fixed in each unit; curing the packaging glue on the surface of the substrate through a first molding process to form a bowl cup main body covering the light-emitting chip and the eutectic interface; performing depth-controlled cutting on the bowl cup main body, and forming grid-shaped grooves between adjacent units; the grid-shaped groove is filled with dark dam glue through a second mold pressing process, and a dam structure is formed after curing; mirror polishing is conducted on the surface filled with the box dam glue; the substrate is cut and formed, the LED lamp bead finished product with the packaging glue body evenly wrapped by the box dam structure on the periphery is obtained, the MIP light interference pain point can be effectively eliminated under the condition that the dispensing input is not increased, and the reliability is improved.

The invention relates to the technical field of super-lens packaging, in particular to a super-lens LED packaging structure, a super-lens LED lamp panel and a backlight system. According to the technical scheme, the LED lamp comprises an LED support, an LED wafer and a super lens, a metal electrical connection frame is arranged in the LED support, and a mounting step is arranged on the top of the LED support; the LED wafer is fixed in the LED bracket; and the super lens is fixed on the mounting step through packaging glue. According to the invention, the ultra-thin design is realized by integrally packaging the super lens and the LED wafer, the light is accurately regulated and controlled by using the microstructure on the surface of the super lens, the light spot uniformity is improved, the LED consumption and the dependence on the optical film are obviously reduced, the system adaptability is enhanced by the flexible layout of the driving chip, and the reliability is improved and the service life is prolonged by the closed packaging structure. The ultrathin performance, the optical performance, the cost and the reliability are comprehensively optimized, and an innovative solution is provided for a backlight system with high cost performance and high performance.

The utility model discloses an LED packaging structure which comprises a substrate, a frame-shaped support, a transparent cover plate and a sealing glue layer, and an LED wafer is arranged on the substrate. The bottom of the frame-shaped support is connected with the substrate in a sealed mode, the LED wafer is located in the frame-shaped support, a step portion is arranged on the inner edge of the top of the frame-shaped support, and a frame-shaped glue containing groove is formed in the step face of the step portion. The transparent cover plate comprises a body and a skirt edge arranged around the body, the skirt edge is arranged close to the bottom of the body, the skirt edge is contained in the step part, and the skirt edge is arranged to be lower than the top face of the frame-shaped support; the sealing glue layer is connected with the transparent cover plate and the frame-shaped support and comprises a first part, a second part and a third part which are sequentially connected, the first part is located between the step face of the step part and the bottom face of the skirt edge, the frame-shaped glue containing groove is filled with partial area of the first part, and the second part is located between the peripheral wall of the skirt edge and the vertical face of the step part. The third portion is located on the top surface of the skirt and contacts the vertical surface of the step portion. The LED packaging structure is good in sealing performance and stable in structure.

The invention relates to the technical field of LED packaging, and discloses an LED packaging structure and a manufacturing method of the LED packaging structure. The LED packaging structure comprises a circuit substrate and a chip, wherein the chip is arranged on the circuit substrate; the reflecting glue covers the circuit substrate and surrounds the side surface of the chip; the packaging glue is covered on the reflecting glue and the top surface of the chip; the reflection cup shell is arranged on the reflection glue and is arranged on the outer side of the packaging glue in a surrounding manner; the upper portion and the lower portion of the reflection cup shell are of a structure with the thick upper portion and the thin lower portion, transition is achieved between the upper portion and the lower portion through a step face, and the step face is located below the top face of the chip. According to the LED packaging structure provided by the invention, the possibility of capillary action between the reflecting glue and the inner wall of the reflecting cup shell is avoided, so that the volume of the packaging glue and the bonding surface between the inner walls of the packaging and gluing reflecting cup shell are effectively ensured, and the reliability of the structure is improved.

The invention discloses an LED packaging tiny defect detection system based on machine vision, and relates to the field of LED packaging defect detection, the system comprises a data acquisition module, a feature preprocessing module, an edge chain construction module, a tensor construction module and an analysis decision module, the data acquisition module obtains a multispectral image and constructs an image matrix; the feature preprocessing module calculates a spectral gradient tensor and a spectral entropy value, and a multispectral enhanced image matrix is obtained after filtering; the edge chain construction module fuses multiple features to construct a joint edge response function, and generates a dynamic edge chain; the tensor construction module constructs a three-layer tensor and decomposes the three-layer tensor to obtain a defect sensitive parameter vector; the analysis decision module constructs a multi-level early warning mechanism based on parameter vectors, defect judgment and disposal are achieved in combination with a case library, the system achieves accurate detection of LED packaging tiny defects, and the detection efficiency and adaptability are improved.

The invention discloses an RGB backlight partition display LED packaging module and a preparation method thereof, and belongs to the technical field of backlight display. The RGB backlight partition display LED packaging module comprises a substrate, an LED assembly, a barrier wall assembly and an optical transparent adhesive diffusion particle layer. The LED assembly is arranged on the substrate; the barrier wall assembly is arranged on the substrate and comprises a plurality of barrier walls, and the barrier walls are used for isolating an optical path; the optical transparent adhesive tape is used for isolating pollutants and carrying out primary light mixing on colored light emitted by the LED assembly; and the diffusion particle layer is used for converting the directionally propagated light into spatial random distribution so as to eliminate glare spots caused by specular reflection, and carrying out secondary light mixing on the colored light emitted by the LED assembly. According to the RGB backlight partition display LED packaging module provided for a user, the color levels displayed by the packaging module are effectively enriched, the image quality is improved, and the power consumption of a machine is reduced.

The invention relates to an LED packaging detection method and system, and the method comprises the steps: firstly obtaining a light source image of a to-be-detected LED light source, and then carrying out the feature extraction and analysis of the light source image, thereby obtaining image feature information; meanwhile, electrical testing is carried out on the to-be-detected LED, and electrical characteristic information is obtained; carrying out a thermal shock test and a vibration shock test on the to-be-detected LED package to respectively obtain corresponding thermal characteristic information and mechanical characteristic information; and finally, inputting the image feature information, the optical feature information, the thermal feature information and the mechanical feature information into a package detection model trained by combining a plurality of machine learning classifiers to obtain an LED package quality detection report, and judging the package detection quality grade by the report according to a preset threshold value. The detection accuracy and reliability are improved by comprehensively evaluating the quality of LED packaging in multiple aspects such as optics, electricity, thermal and mechanical properties.

The invention provides high-stability double-layer core-shell coated pure copper silver-substituted conductive paste and a preparation method thereof, and belongs to the technical field of electronic special materials. The copper-resistant coating comprises the following components in percentage by mass: 82%-90% of antioxidant copper powder with a double-layer core-shell structure, 3%-6% of bismuth-boron-zinc lead-free low-melting-point glass powder, 3%-7% of a modified epoxy resin compound organic carrier, 2%-5% of a gradient volatilization compound solvent and 0.5%-2% of a special compound additive for copper. Through the double-layer core-shell copper powder design of inner-layer nano-silver passivation and outer-layer organic composite coating and in cooperation with a liquid-phase synergistic anti-oxidation system, the volume resistivity after slurry curing is smaller than or equal to 3.5 * 10 <-5 > omega.cm, the resistivity change rate after 1000-hour damp-heat aging at 85 DEG C / 85% RH is smaller than or equal to 10%, the normal-temperature storage period without opening a tank is larger than or equal to 6 months, direct curing can be conducted in the conventional air atmosphere of 120-160 DEG C, and the high-temperature-resistant copper paste can be applied to the field of high-temperature storage. The silver paste is completely compatible with production and application production lines of existing silver paste, equipment transformation is not needed, the comprehensive cost is reduced by more than 80% compared with pure silver paste, and the silver paste can be widely applied to the fields of PCBs, membrane switches, flexible electronics, photovoltaic back electrodes, LED packaging and the like.

The utility model relates to a high-brightness LED packaging structure which comprises a lamp holder, an LED light-emitting strip and a lampshade. The LED light-emitting strip is embedded in the lamp holder, the LED light-emitting strip is electrically connected with the lamp holder, and the lampshade is assembled on the lamp holder; at least two clamping plates are arranged on the lamp holder, and extending plates are arranged on the front side and the rear side of the lampshade and correspond to the two clamping plates. According to the high-brightness LED packaging structure, the two extension plates on the lampshade are inserted into the two clamping plates at the same time, the lampshade is pushed so that the lampshade can be completely attached to the lamp holder and cover the LED light-emitting strip, at the moment, the two extension plates completely slide into the clamping plates, and the two limiting plates are attached to the left side and the right side of the lampshade and the left side and the right side of the lamp holder correspondingly, so that the LED light-emitting strip is covered with the two limiting plates; the two limiting plates are tightly attached to the left side and the right side of the lampshade and the lamp holder correspondingly by tightening the fasteners, so that the lampshade is limited, left-right movement of the lampshade is effectively avoided, and the packaging effect between the lampshade and the lamp holder is effectively improved.

The invention discloses a dynamic hot-pressing leveling control method and a yield improving system based on high-density LED packaging, and relates to the technical field of LED packaging. A viscoplastic flow area is formed through counterpoint preheating and selective thermal activation, contact pressure is built between the flexible leveling device and the surface of the LED chip array, solder paste is heated to be in a viscoplastic flow state, the flexible leveling device conducts posture correction on the chip, the solder paste is suddenly dropped to be below the freezing point of the solder paste through the semiconductor thermoelectric cooling module array, and then the solder paste is heated to be in the viscoplastic flow state. And fixation of the chip position and rapid solidification forming of a welding spot are realized. The method is characterized in that solder paste is heated to a viscoplastic flow state through a targeted thermal activation technology, the inherent contradiction between the thermal damage risk and a narrow process window caused by the fact that a component must be exposed to a high-temperature environment in order to obtain enough surface tension is solved, and the yield, the performance consistency and the long-term reliability of a product are remarkably improved.

The invention relates to the technical field of semiconductor packaging, in particular to a Micro-LED packaging structure and a manufacturing method thereof, and the packaging structure comprises a substrate, a color filter layer, a color conversion layer, an inorganic layer, a chip bonding layer, a micro light-emitting diode layer, a first filling layer, a reflecting layer and a second filling layer from bottom to top. And grinding, thinning, cutting and splitting the substrate to form an independent discrete device. By arranging the reflecting layer covering the packaging structure and the discontinuous chip bonding layer, light emitted by the quantum dots and the micro light-emitting diodes is reflected by the reflecting layer, and light crosstalk between the packaging structures is avoided. The first filling and leveling layer with the slope surface is arranged between the reflecting layer and the micro light-emitting diode, so that the side light-emitting path is kept away from the micro light-emitting diode body, and the light-emitting efficiency is improved. The micro light-emitting diodes are arranged in an offset mode, so that top damage is prevented when the packaging structure is transferred. The packaging structure has the advantages of preventing optical crosstalk and facilitating mass production of laser cutting while improving the lighting effect and preventing damage.

The invention discloses a preparation method of a microstructure. The preparation method comprises the following steps: preparing an uncured first polymer; preparing a micro-droplet generating device, and loading liquid in the micro-droplet generating device; starting a micro-droplet generation device, dispersing the liquid into micro-droplets by the micro-droplet generation device, and enabling the micro-droplets to move to the surface of the first polymer; the micro-droplets are insoluble in the first polymer; after a certain period of time, the micro-droplets form a micro-droplet array on the surface of the first polymer; and curing the first polymer, or curing the first polymer and the micro-droplets to obtain the first polymer with the microstructure on the surface. Micro-droplets are generated through a micro-droplet generation device, the micro-droplets form a micro-droplet array on the surface of a polymer under the action of power, the preparation method of the microstructure is not limited by the surface morphology of the polymer, and the microstructure can be prepared on various surfaces such as a plane and a curved surface; the problem that the microstructure cannot be prepared on the curved surface by the traditional photoetching and mold imprinting methods is solved.

This invention discloses a Mini-LED packaging device, a Mini-LED packaging method, an apparatus, and a computer-readable storage medium. The method, applied to a Mini-LED packaging device, involves adjusting the position of the Mini-LED chip to be fixed on a substrate to embed the electrodes of the Mini-LED chip into a groove. Solder paste is placed on a filter screen inside the groove. During the fixing of the Mini-LED chip, a height limiting plate restricts the upward displacement of the Mini-LED chip during the curing process of the solder paste, allowing the solder paste to pass through the filter screen and enter the gap during curing. This invention reduces the overly stringent requirements for solder paste usage and the process difficulty of Mini-LED chip die bonding by designing the substrate structure, thereby avoiding the adverse effects of inaccurate solder paste usage on Mini-LED chip die bonding and improving display performance.

The invention provides a reactive flame retardant for transparent resin and flame-retardant acrylic resin, the reactive flame retardant for transparent resin is THPO-AA or THPO-MAA, the molecular formula of the THPO-AA is as shown in the formula (1), and the molecular formula of the THPO-MAA is as shown in the formula (2). The flame retardant provided by the technical scheme of the invention has good compatibility with acrylic resin, and does not affect the transparency of the acrylic resin. In addition, THPO-AA contains hydroxyl, so that the adhesive force of THPO-AA to a base material can be improved. When the flame-retardant acrylic resin is used for LED packaging, the light extraction efficiency of an LED can be improved, chip heating is reduced, the service life is prolonged, meanwhile, the flame retardant property of the packaging resin is improved, the fire accident risk is reduced, and the flame-retardant acrylic resin has very important economic and social significance.

The present application is applicable to the technical field of LED packaging. Provided are an LED device and an LED packaging method. The LED device comprises a substrate, an LED chip, a dam, an optical window and a sealing member, wherein the dam has a first end, a second end and side walls, the side walls define a chamber, and the dam is mounted on the substrate by means of the first end; the LED chip is disposed in the chamber and packaged on the substrate; the optical window is connected to the second end to cover the chamber; the sealing member is disposed between the optical window and the second end; the dam further has a mounting space, and the mounting space is configured as a region enclosed when inner and outer end portions of the second end of the dam respectively horizontally extend toward two sides until the included angle between the lines connecting the inner and outer end portions of the second end to inner and outer end portions of the first end satisfies aW70; and the optical window is connected and fixed to the dam by means of a snap-fit structure, and when the optical window is connected and fixed to the dam, the snap-fit structure is located in the mounting space. The present application overcomes the defects of semi-inorganic and all-inorganic packaging processes on the market, can ensure the airtightness of products, and greatly improves the packaging efficiency and service life of LED devices.

The invention discloses an LED packaging structure and a COB light source, the LED packaging structure comprises a metal substrate, the upper surface of the metal substrate is provided with a BT layer, the center of the BT layer is provided with a light-emitting area, the BT layer is provided with a first box dam and a second box dam which surround the light-emitting area in a stacked mode from bottom to top in sequence, the first box dam is white glue, the diameter of the first box dam is the same as that of the second box dam, and the diameter of the second box dam is the same as that of the first box dam. The inner side of the first box dam and the inner side of the second box dam are filled with fluorescent glue layers, and the fluorescent glue layers are located above the light-emitting area. According to the COB light source, the LED packaging structure is adopted, the air tightness is further enhanced, the problems of light attenuation, aging, fluorescent powder blackening and the like are solved, the overall dam width is smaller than the width of a single-layer dam for achieving the same dam height, the area of a small light-emitting area can be occupied, a larger light-emitting area can be achieved, and the product performance is improved.

The invention provides an epoxy resin adhesive for RGB-LED (Red Green Blue-Light Emitting Diode) packaging and a preparation method of the epoxy resin adhesive. The epoxy resin adhesive is prepared from the following raw materials in parts by mass: 40 to 50 parts of bisphenol A epoxy resin, 20 to 30 parts of epoxy modified phenyl organic silicon resin, 10 to 15 parts of sulfur-containing epoxy resin, 4 to 6 parts of modified branched aluminum oxide, 10 to 14 parts of modified hexagonal boron nitride, 30 to 40 parts of compound curing agent, 1 to 2 parts of compound accelerant and 0.5 to 1 part of modified nano zinc oxide ultraviolet absorbent. The epoxy resin adhesive for packaging the RGB-LED, provided by the invention, has relatively high bonding stability on a PPA (Phenyl-Phenylic Acid) base material, has a slight shrinkage degree in a curing process, can effectively avoid the structural failure problems of packaging body cracking, chip offset and the like, guarantees the structural stability of the RGB-LED in long-term operation, and improves the service life of the RGB-LED. And moreover, high reliability, high weather resistance, matte high-brightness balance and low hygroscopicity are realized.

The utility model discloses a glue supply structure for delaying powder sedimentation for an LED packaging system, which comprises a glue tube, a glue outlet head communicated with the glue tube is mounted at one end of the glue tube, a glue tube sleeve head is mounted at the other end of the glue tube, a push rod is in threaded connection with the glue tube sleeve head, one end of the push rod is arranged outside the glue tube and is rotatably provided with a connecting pin, and the other end of the push rod is provided with a connecting rod. The other end of the push rod is arranged in the rubber tube and provided with the push rod head, the push rod is rotationally connected with the connecting pin, and meanwhile the push rod is in threaded connection with the rubber tube sleeve head, so that the push rod rotates while moving linearly, and the push rod can drive the push rod head to move linearly and rotate in the rubber tube. According to the utility model, the rubber material in the rubber tube is extruded through the rubber outlet head, and meanwhile, the stirring blade structure on the push rod head can rotate along with the push rod head to stir and mix the powder in the rubber material with the rubber material, so that the condition that the powder in the rubber material settles is avoided, the loss of the optical efficiency of the LED plate can be avoided, and meanwhile, the yield and the consistency of the LED plate finished product are improved.

The utility model provides a moisture-proof device of an LED packaging structure. The moisture-proof device comprises a heating moisture-removing layer, a room temperature sensor used for sensing the room temperature of the space, a device temperature sensor used for sensing the temperature of a device in the LED packaging structure, and a temperature measuring and controlling circuit. The device temperature sensor and the heating moisture-removing layer are arranged in the LED packaging structure, and the room temperature sensor is arranged outside the LED packaging structure; and the heating moisture-removing layer, the room temperature sensor and the device temperature sensor are respectively connected with the temperature measuring and controlling circuit. The utility model further provides a moisture-proof LED system device assembly. The moisture-proof protection can be carried out on the KSF fluorescent powder.

The invention discloses a packaging structure of an LED light source, and belongs to the technical field of LED packaging. A packaging structure of an LED light source comprises a hardware substrate which is provided with a first surface and a second surface; the copper-clad ceramic plate is fixedly mounted on the first surface, and the LED chips are electrically connected into the copper-clad ceramic plate; the lens is mounted on the copper-clad ceramic plate in a buckling manner; wherein a connecting assembly is arranged between the lens and the copper-clad ceramic plate, the lens can be installed and locked through simple inserting and rotating actions, complex tools or additional fasteners are not needed, the lens is gradually subjected to inward pressure in the rotating process, and therefore a sealing gasket located between the lens and the copper-clad ceramic plate begins to be compressed; when the embedded block continuously rotates and moves to the horizontal section, the position of the embedded block tends to be stable, at the moment, the sealing gasket is fully compressed, and the optimal sealing state is achieved.

The invention belongs to the field of electronic packaging materials, and particularly relates to a high-thermal-conductivity ceramic material for LED packaging and a manufacturing process of the high-thermal-conductivity ceramic material for LED packaging. The high-thermal-conductivity ceramic material is prepared from silicon nitride, aluminum nitride, magnesium fluoride, yttrium fluoride, lithium carbonate and two newly-designed modified compounds. The phase change regulator is composed of a boron-doped rare earth silicate nanocrystalline phase change regulator and a bimetallic chalcogenide compound interface modifier according to a specific weight part ratio. The preparation process mainly comprises the following steps: ball-milling and mixing the components, drying, granulating, and carrying out segmented hot pressed sintering in a protective atmosphere to finally obtain the compact ceramic material. The high-power LED packaging structure is particularly suitable for packaging of high-power LEDs, and the technical problem that heat dissipation and mechanical performance are difficult to consider at the same time is effectively solved.

The utility model relates to dispensing equipment for LED (light-emitting diode) packaging, which comprises a base, a support frame arranged on the base and a top plate arranged at one end, far away from the base, of the support frame, a fixing mechanism is arranged on the base, a dispensing mechanism and a degumming mechanism are arranged on the top plate, and the dispensing mechanism is positioned above the fixing mechanism. The glue dispensing mechanism comprises a telescopic assembly arranged on the top plate, a glue dispensing gun body driven by the telescopic assembly, a heating assembly arranged at the bottom end of the glue dispensing gun body and a glue dispensing head arranged at the bottom of the heating assembly, and the glue removing mechanism comprises wiping sponge arranged at the glue dispensing head. The glue temperature is controlled in real time through the heating assembly, the glue viscosity is effectively reduced, curing is delayed, and glue dispensing is more uniform and stable; residual glue on the dispensing head can be removed in time through the glue removing mechanism, so that the phenomena of blockage and leakage are reduced; and the adjustable fixing mechanism is adapted to LED workpieces with different sizes, so that the stability and the high precision of the dispensing process are ensured, and the overall reliability and the production efficiency are improved.

The utility model discloses a light-emitting diode (LED) packaging device, which relates to the technical field of semiconductor devices, and comprises an LED support which comprises a base and an enclosure part arranged on the outer side of the base, the enclosure part is enclosed on the base to form an accommodating space, and an LED chip is arranged on the base in the accommodating space; the fluorescent packaging layer is formed by mixing fluorescent powder and silica gel, and the containing space is filled with the fluorescent packaging layer to cover the LED chips and the wires; wherein the LED chip comprises a blue light chip and an infrared light chip, the blue light chip and the infrared light chip are both arranged on the base and connected to the positive electrode pin and the negative electrode pin respectively, the blue light chip and the infrared light chip emit white light under dimming of the fluorescent packaging layer when emitting light at the same time, and the infrared light chip emits invisible infrared light. The problem that in the prior art, LED lamp beads only serve as backlight sources of liquid crystal display and only provide white light to excite the liquid crystal panel to be lightened, and signals cannot be effectively transmitted under the low-light condition is solved.