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2503 results about "Led packaging" patented technology

Vulcanization-proof LED (light-emitting diode) packaging silica gel

The invention relates to an LED (light-emitting diode) packaging silica gel, and in particular relates to a vulcanization-proof LED packaging silica gel, belonging to the technical field of adhesives. The vulcanization-proof LED packaging silica gel comprises a component A and a component B, wherein the weight ratio of the component A to the component B is 1: 1; the component A comprises raw materials based on parts by weight: 50-60 parts of methyl phenyl vinyl silicone oil, 30-60 parts of methyl vinyl MQ resin, 0.1-0.3 part of platinum catalyst and 3-5 parts of bonding agent; and the component B comprises raw materials based on parts by weight: 40-50 parts of methyl phenyl vinyl silicone oil, 30-50 parts of methyl vinyl MQ resin, 5-15 parts of cross-linking agent and 0.1-0.3 part of inhibitor. The vulcanization-proof LED packaging silica gel has excellent adhesive force for silver, phenyl-propanolamine (PPA), glass and the like, and has the light transmittance of more than 98%; and phenyl-containing functional groups and branched chain type vinyl are introduced into the LED packaging silica gel, and the dosage of the vinyl MQ resin is increased, so that the crosslinking density and the curing handness are improved, and therefore, the vulcanization resistance of a packaging adhesive layer can be improved.
Owner:YANTAI DEBANG ADVANCED SILICON MATERIALS

High refraction and high adhesion large power LED packaging organosilicon material and preparation method thereof

ActiveCN102936414ASolve the problem of incomplete hydrolysis and condensationReduce air permeabilitySemiconductor devicesChemical synthesisPtru catalyst
The present invention relates to a high refraction and high adhesion large power LED packaging organosilicon material and a chemical synthesis method thereof. The organosilicon packaging material is prepared by carrying out mixing matching on a component A and a component B according to a mass ratio of 1:1, wherein the component A comprises vinyl phenyl polysiloxane, vinyl phenyl silicone oil, a platinum-containing polysiloxane catalyst and a tackifier, the component B comprises hydrogen-containing phenyl polysiloxane, dihydrideterminated phenyl polysiloxane, vinyl phenyl polysiloxane and an inhibitor, the tackifier is prepared by carrying out addition on isocyanate, methoxy silane and epoxy silane, and provides strong adhesion for PPA and a silver surface, the curing agent is prepared by compounding hydrogen-containing phenyl polysiloxane and dihydrideterminated phenyl polysiloxane, and a compounding mass ratio is preferably 4:1-2, such that the packaging material has moderate hardness and flexibility after curing so as to effectively solve contradiction of strength and cracking of the cured adhesive. With the present invention, the organosilicon packaging material with characteristics of refraction of 1.54, suitability for industrialization and fully meeting of large power LED packaging requirements can be obtained.
Owner:湖北环宇化工有限公司
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