699 results about "Led packaging" patented technology

The invention provides an LED packaging device and a preparation method and application thereof, and relates to the technical field of semiconductor devices.The preparation method comprises the steps that packaging silica gel and fluorescent powder are mixed according to a preset proportion, and then a film with the preset thickness is prepared through a film scraping machine; curing the membrane at a first preset temperature for a first preset time, and completing primary curing to obtain a semi-cured fluorescent sheet; transferring the semi-cured fluorescent sheet to the flip LED chip which is subjected to die bonding in the bracket, and carrying out vacuum pressure sinking, so that the semi-cured fluorescent sheet is completely attached to the surface and the side surface of the flip LED chip; curing the semi-cured fluorescent sheet subjected to vacuum pressure sinking at a second preset temperature for a second preset time, and completing secondary curing to obtain a cured finished product; according to the LED packaging device and the manufacturing method thereof, the technical problems that in the prior art, the stability of the dispensing glue amount of the LED packaging device is poor, fluorescent powder is not evenly distributed, and consequently the brightness and the concentration degree are reduced can be solved.

The invention relates to a transfer method of a Micro LED packaging structure and a Micro LED display device, and relates to the technical field of semiconductor display. According to the transfer method of the Micro LED packaging structure, the ratio of the thickness of a packaging layer subjected to planarization processing to the height of a Micro LED unit is set to be larger than 10, then four symmetrically-distributed concave cavities are formed in the packaging layer of each Micro LED packaging array, the ratio of the depth of the concave cavities to the thickness of the packaging layer is 0.3-0.5, and the ratio of the depth of the concave cavities to the thickness of the packaging layer is 0.3-0.5. The distance between every two adjacent concave cavities is 800-3000 microns, through the process steps, the large-size magnetic component can be formed, the preparation process of the magnetic component is simplified, and the magnetic attraction force of the magnetic component can be improved.

The utility model discloses an LED packaging structure and a backlight source, the LED packaging structure comprises an LED chip and a support, the support is provided with a cup cavity, the bottom of the cup cavity is provided with a metal bonding pad, the LED chip is arranged on the metal bonding pad, and the cup cavity is filled with fluorescent glue to cover the LED chip; wherein a cup opening of the cup cavity is covered with a light-emitting adjusting structure layer, and the light-emitting adjusting structure layer is used for adjusting the divergence angle of first emergent light rays of the LED chip, so that the divergence angle of the first emergent light rays is converted into a second angle from a first angle. The backlight source structure can be simplified, and the cost is reduced.

The invention provides an LED packaging structure, a multi-color LED matrix and a control method thereof, and a driving chip in the LED packaging structure is used for driving a first multi-color light-emitting unit which is in the same packaging body as the driving chip and a second multi-color light-emitting unit which is not in the same packaging body as the driving chip, so that one driving chip can be used for driving a plurality of multi-color light-emitting units. Therefore, the design cost of the LED packaging structure is reduced, and the mounting cost of the LED packaging structure can also be reduced due to the fact that the driving chip and the first multi-color light-emitting unit are located in the same packaging body. Besides, the LED packaging structure comprises two active power supply pin groups and a plurality of passive power supply pin groups, so that wiring is more convenient during PCB layout design, the problem of wiring intersection between the LED module and a power line is reduced, and single-side layout and single-layer wiring can be realized.

The invention discloses a Mini LED package test method and test equipment. The method comprises the following steps: performing light irradiation on Mini LED package by using a reverse light path tracking technology to obtain an interference pattern and determine a function sensitive area; injecting a quantum dot fluorescent marker into the functional sensitive area to carry out multispectral dynamic monitoring; performing surface plasma resonance spectrum scanning on the functional sensitive area to obtain surface plasma resonance response data; performing an acoustic stimulation test on the functional sensitive area according to the obtained data to obtain acoustic response data; and performing a compensation test by using the nonlinear optical material layer to obtain performance attenuation prediction data. According to the technical scheme, accurate detection and performance prediction of the miniature optical structure in Mini LED packaging are achieved, and potential early failure symptoms can be effectively recognized.

The invention discloses a preparation method and structure of an omnibearing heat dissipation Micro LED packaging module. The preparation method comprises the following steps: S1, customized manufacturing of a VC vapor chamber; s2, laminating a VC vapor chamber; s3, carrying out low-thermal-resistance die bonding; s4, gold wire protection and heat dissipation are integrated; s5, the VC vapor chamber is covered with packaging glue; s6, the VC vapor chamber is attached to the bottom of the optical lens; s7, connecting the module with a driver; s8, power-on detection is carried out; the structure comprises a multi-layer composite heat dissipation substrate, an FPCB, a packaging adhesive layer, an optical lens and a driving board. The multi-layer composite heat dissipation substrate, the FPCB, the packaging adhesive layer, the optical lens and a VC soaking plate in the driving plate form a closed-loop heat dissipation network; the VC vapor chamber with active circulation heat dissipation is obtained by changing the structure of the heat dissipation substrate, and the VC vapor chamber covers the gold wire protection glue, the bottom of the optical lens, the drive board shell and the back surface of the FPCB, so that the heat dissipation efficiency is improved, the working temperature of the module is reduced, the brightness of the product is improved, and the service life of the product is prolonged.

The invention discloses a preparation method of an inverted LED packaging device, and relates to the technical field of semiconductor devices.The inverted preparation method comprises the steps that stamping, electroplating and injection molding are conducted on a tape-winding type metal plate, and a tape-winding type LED support is formed; bonding the flip LED chip on the tape winding type LED bracket through soldering paste to complete die bonding; the bonding pad of the flip LED chip is connected with the conductive area on the winding type LED support through the soldering paste in a reflow soldering mode; packaging glue is filled in the groove of the tape type LED support in a glue brushing mode, and baking and curing are carried out; according to the flip LED packaging device and the manufacturing method of the flip LED packaging device, the technical problem that in the prior art, a sheet type LED support is adopted for packaging, and the process efficiency is low can be solved.

The invention relates to the technical field of liquid silicone rubber, in particular to high-refractive-index low-haze addition type liquid silicone rubber and a preparation method thereof, and the high-refractive-index low-haze addition type liquid silicone rubber is prepared from vinyl silicone oil, a catalyst, an inhibitor, a cross-linking agent, hydrophobic white carbon black, a white carbon black surface treating agent and the like. According to the method, by regulating and controlling the surface state of the white carbon black and the refractive index of the silicone oil, the addition type liquid silicone rubber with high refractive index, high light transmittance and low haze at the same time is realized, and the addition type liquid silicone rubber is good in mechanical property and fluidity, can adapt to continuous extrusion production, and is suitable for large-scale production. After vulcanization, the Shore A hardness is 50-53, the light transmittance is 94% or above, the haze is lower than 3%, the refractive index reaches 1.54 or above, and the polyurethane resin can be applied to the fields of optical devices, LED packaging and the like.

The utility model discloses an anti-dazzle, high-covering and visual color difference improving LED packaging film material, which comprises an EVA adhesive film layer, a PET film material layer is arranged at the top of the EVA adhesive film layer, the PET film material layer comprises a PET base material layer, an AG layer outer layer arranged at the top of the PET base material layer and a flexographic printing layer inner layer arranged at the bottom of the PET base material layer, and the flexographic printing layer inner layer is arranged at the top of the EVA adhesive film layer; according to the anti-dazzle, high-covering and visual color difference improving LED packaging film material, the LED packaging film material is used for being attached to the surface of an LED screen, the anti-dazzle, high-covering and visual color difference improving effects are achieved, therefore, the color difference performance of the LED screen can be greatly reduced, and finally the visual expressive force of the LED screen and the use experience of a user are greatly improved.

The invention relates to an LED packaging device and method, and belongs to the technical field of LED packaging, an electric heat recovery system is arranged to recover heat emitted by an LED assembly and convert the heat into current, the current is used for supplying power to an external battery, heat dissipation of the high-power LED assembly is achieved, meanwhile, the heat is converted into electric quantity and recovered, waste is avoided, and the environment is protected. The control assembly determines whether the power supply end of the LED assembly is the external battery or the power grid according to the electric quantity of the external battery, intelligent regulation and control of the electric quantity stored in the external power supply for power supply of the LED is achieved through two threshold values pre-stored in the control assembly, and heat dissipated by the LED is recycled more effectively. And the plurality of groups of thermoelectric conversion elements are connected in series, so that the heat emitted by the LED can be more effectively recovered.

The invention discloses an MIP grid glue filling dam surrounding technology and a novel LED lamp bead, and relates to the technical field of LED packaging, and the technology comprises the following steps: light-emitting chips are fixed on a substrate, the light-emitting chips and the substrate form a eutectic interface through a eutectic welding technology, the substrate comprises N units, and at least one group of light-emitting chips are fixed in each unit; curing the packaging glue on the surface of the substrate through a first molding process to form a bowl cup main body covering the light-emitting chip and the eutectic interface; performing depth-controlled cutting on the bowl cup main body, and forming grid-shaped grooves between adjacent units; the grid-shaped groove is filled with dark dam glue through a second mold pressing process, and a dam structure is formed after curing; mirror polishing is conducted on the surface filled with the box dam glue; the substrate is cut and formed, the LED lamp bead finished product with the packaging glue body evenly wrapped by the box dam structure on the periphery is obtained, the MIP light interference pain point can be effectively eliminated under the condition that the dispensing input is not increased, and the reliability is improved.

The invention relates to the technical field of super-lens packaging, in particular to a super-lens LED packaging structure, a super-lens LED lamp panel and a backlight system. According to the technical scheme, the LED lamp comprises an LED support, an LED wafer and a super lens, a metal electrical connection frame is arranged in the LED support, and a mounting step is arranged on the top of the LED support; the LED wafer is fixed in the LED bracket; and the super lens is fixed on the mounting step through packaging glue. According to the invention, the ultra-thin design is realized by integrally packaging the super lens and the LED wafer, the light is accurately regulated and controlled by using the microstructure on the surface of the super lens, the light spot uniformity is improved, the LED consumption and the dependence on the optical film are obviously reduced, the system adaptability is enhanced by the flexible layout of the driving chip, and the reliability is improved and the service life is prolonged by the closed packaging structure. The ultrathin performance, the optical performance, the cost and the reliability are comprehensively optimized, and an innovative solution is provided for a backlight system with high cost performance and high performance.

The invention discloses high-temperature-resistant and anti-yellowing LED (light-emitting diode) packaging glue which comprises glue A, glue B and powder C, the adhesive A comprises epoxy resin, a flexibilizer, a flatting agent, a main antioxidant, an auxiliary antioxidant, a diluent, a defoaming agent and a silane coupling agent; wherein the main antioxidant is a hindered phenol antioxidant; the auxiliary antioxidant is a phosphite ester antioxidant; the glue B comprises an anhydride curing agent and an accelerant; and the powder C comprises diffusion powder and matte powder. The hindered phenol antioxidant and the phosphite antioxidant have a synergistic effect, and the phosphite antioxidant reduces an oxidation product of the hindered phenol antioxidant, namely a benzoquinone chromophoric group, so that the color of a system is protected, and the long-term stability of the material is ensured; the heat resistance, the aging resistance, the oxidation resistance and the UV resistance of the packaging glue are improved, so that the packaging glue does not generate color change, the color of a system is protected, the long-term stability of a material is ensured, the yellowing delaying rate reaches 50% or above, and the high temperature resistance can reach 260 DEG C.

The utility model provides an LED packaging sheet for backlight, which is characterized in that a bearing sheet (2) is made of a transparent insulating sheet and is provided with a plurality of wafer embedding openings (21), and LED wafers (1) are arranged in the wafer embedding openings (21); the driving electrode disc (22) on the bearing sheet (2) and the wafer electrode disc (13) on the LED wafer (1) can be directly connected through the solder (5), no gold wire packaging is needed, the driving electrode disc (22) and the wafer electrode disc (13) can be arranged on the side wall, and the conductive connection reliability of the two electrode discs is improved.

The utility model discloses an LED packaging structure which comprises a substrate, a frame-shaped support, a transparent cover plate and a sealing glue layer, and an LED wafer is arranged on the substrate. The bottom of the frame-shaped support is connected with the substrate in a sealed mode, the LED wafer is located in the frame-shaped support, a step portion is arranged on the inner edge of the top of the frame-shaped support, and a frame-shaped glue containing groove is formed in the step face of the step portion. The transparent cover plate comprises a body and a skirt edge arranged around the body, the skirt edge is arranged close to the bottom of the body, the skirt edge is contained in the step part, and the skirt edge is arranged to be lower than the top face of the frame-shaped support; the sealing glue layer is connected with the transparent cover plate and the frame-shaped support and comprises a first part, a second part and a third part which are sequentially connected, the first part is located between the step face of the step part and the bottom face of the skirt edge, the frame-shaped glue containing groove is filled with partial area of the first part, and the second part is located between the peripheral wall of the skirt edge and the vertical face of the step part. The third portion is located on the top surface of the skirt and contacts the vertical surface of the step portion. The LED packaging structure is good in sealing performance and stable in structure.

The invention relates to the technical field of LED packaging, and discloses an LED packaging structure and a manufacturing method of the LED packaging structure. The LED packaging structure comprises a circuit substrate and a chip, wherein the chip is arranged on the circuit substrate; the reflecting glue covers the circuit substrate and surrounds the side surface of the chip; the packaging glue is covered on the reflecting glue and the top surface of the chip; the reflection cup shell is arranged on the reflection glue and is arranged on the outer side of the packaging glue in a surrounding manner; the upper portion and the lower portion of the reflection cup shell are of a structure with the thick upper portion and the thin lower portion, transition is achieved between the upper portion and the lower portion through a step face, and the step face is located below the top face of the chip. According to the LED packaging structure provided by the invention, the possibility of capillary action between the reflecting glue and the inner wall of the reflecting cup shell is avoided, so that the volume of the packaging glue and the bonding surface between the inner walls of the packaging and gluing reflecting cup shell are effectively ensured, and the reliability of the structure is improved.

The invention discloses an LED packaging tiny defect detection system based on machine vision, and relates to the field of LED packaging defect detection, the system comprises a data acquisition module, a feature preprocessing module, an edge chain construction module, a tensor construction module and an analysis decision module, the data acquisition module obtains a multispectral image and constructs an image matrix; the feature preprocessing module calculates a spectral gradient tensor and a spectral entropy value, and a multispectral enhanced image matrix is obtained after filtering; the edge chain construction module fuses multiple features to construct a joint edge response function, and generates a dynamic edge chain; the tensor construction module constructs a three-layer tensor and decomposes the three-layer tensor to obtain a defect sensitive parameter vector; the analysis decision module constructs a multi-level early warning mechanism based on parameter vectors, defect judgment and disposal are achieved in combination with a case library, the system achieves accurate detection of LED packaging tiny defects, and the detection efficiency and adaptability are improved.

The invention discloses an RGB backlight partition display LED packaging module and a preparation method thereof, and belongs to the technical field of backlight display. The RGB backlight partition display LED packaging module comprises a substrate, an LED assembly, a barrier wall assembly and an optical transparent adhesive diffusion particle layer. The LED assembly is arranged on the substrate; the barrier wall assembly is arranged on the substrate and comprises a plurality of barrier walls, and the barrier walls are used for isolating an optical path; the optical transparent adhesive tape is used for isolating pollutants and carrying out primary light mixing on colored light emitted by the LED assembly; and the diffusion particle layer is used for converting the directionally propagated light into spatial random distribution so as to eliminate glare spots caused by specular reflection, and carrying out secondary light mixing on the colored light emitted by the LED assembly. According to the RGB backlight partition display LED packaging module provided for a user, the color levels displayed by the packaging module are effectively enriched, the image quality is improved, and the power consumption of a machine is reduced.

The utility model relates to the technical field of LED packaging, and provides a substrate assembly and an LED device, and the substrate assembly comprises a substrate which is provided with an installation through hole; the heat conduction block is embedded in the mounting through hole, the heat conduction block is provided with a first surface and a second surface which are opposite to each other, the first surface is used for being connected with an LED chip, and the second surface is used for being connected with a radiator and / or a circuit board. Therefore, heat generated by the LED chip is directly transmitted to the radiator or transmitted to the radiator after passing through the circuit board, the radiating path is shortened, and the heat conduction efficiency and the radiating effect are improved.

The invention relates to an LED packaging detection method and system, and the method comprises the steps: firstly obtaining a light source image of a to-be-detected LED light source, and then carrying out the feature extraction and analysis of the light source image, thereby obtaining image feature information; meanwhile, electrical testing is carried out on the to-be-detected LED, and electrical characteristic information is obtained; carrying out a thermal shock test and a vibration shock test on the to-be-detected LED package to respectively obtain corresponding thermal characteristic information and mechanical characteristic information; and finally, inputting the image feature information, the optical feature information, the thermal feature information and the mechanical feature information into a package detection model trained by combining a plurality of machine learning classifiers to obtain an LED package quality detection report, and judging the package detection quality grade by the report according to a preset threshold value. The detection accuracy and reliability are improved by comprehensively evaluating the quality of LED packaging in multiple aspects such as optics, electricity, thermal and mechanical properties.

The invention discloses an LED (light-emitting diode) packaging adhesive material and a preparation method thereof, and the LED packaging adhesive material comprises the following components in parts by weight: 100 parts of silicone oil, 1-3 parts of catalyst and 0.1-1 part of inhibitor, the silicone oil contains titanium-zirconium-containing vinyl silicone oil, hydrogen-containing silicone oil and vinyl silicone oil in a weight ratio of 1: (5-12): (2-10). According to the LED packaging adhesive material synthesized by selecting the titanium-zirconium-containing vinyl silicone oil, the hydrogen-containing silicone oil and the vinyl silicone oil with specific types and dosages, phenyl, titanium, zirconium and alkyl in the LED packaging adhesive material are high in uniform distribution degree, a formed three-dimensional network structure is compact and stable, the LED packaging adhesive material has relatively high crosslinking density, and the service life of the LED packaging adhesive material is prolonged. And the high hardness of the LED packaging adhesive material can be improved. In addition, the LED packaging adhesive material provided by the invention has high refractive index and high light transmittance.

The utility model provides an LED packaging structure and a backlight module, wherein the LED packaging structure comprises a substrate, an LED crystal arranged on the substrate, and a light-transmitting body arranged on the substrate and covering the LED crystal, the light-transmitting body is provided with a groove, a reflecting film is deposited on the groove wall of the groove, and the reflecting film is used for reflecting light emitted by the LED crystal, so that the LED crystal emits large-angle light. According to the technical scheme, the LED packaging structure has a reflective lens function compared with a traditional scheme by combining concave surface mold pressing with a reflective film deposition process, an external reflective lens and an installation process are directly omitted, loss of light reflection is reduced, brightness is improved, meanwhile, the use amount of a light-transmitting body is reduced, and cost is reduced. And the weight and the thickness are reduced.

The utility model belongs to the technical field of deep ultraviolet LEDs, and particularly relates to a glue-oil separated deep ultraviolet LED packaging structure, which comprises a ceramic substrate, a light-emitting device, filling liquid, curing glue and a spherical lens, the light-emitting device is arranged at the center of the ceramic substrate, the curing glue is arranged on the inner side surface of the spherical lens, and the filling liquid is filled in the filling liquid. The spherical lens is installed on the ceramic substrate, and filling liquid is arranged between the curing glue and the light-emitting device. According to the utility model, the glue is solidified on the spherical lens, the quartz glass is bonded on the ceramic substrate dam, the liquid is filled between the position right above the light-emitting device and the spherical lens, the filling liquid is completely attached to the position above the chip and the lens, the refractive index of the filling liquid is between the refractive index of the light-emitting device and the solidifying glue, and light refractive index gradient output is realized. Therefore, the packaging structure with high light extraction rate is achieved.

The invention relates to the technical field of LED product packaging, and particularly discloses an LED packaging glue coating device, which comprises a workbench, a coating device and a coating device, a supporting frame is installed on one side of the top end of the workbench, a coating mechanism is jointly installed between the inner walls of the two sides of the supporting frame, a packaging glue box is installed at the top end of the supporting frame, two fixing mechanisms are placed in the middle of the top end of the workbench, and a curing mechanism is installed on the other side of the top end of the workbench. The coating mechanism comprises a fixing frame, a glue scraping plate, an adjusting mechanism, a distance measuring sensor, a coating roller, a flow dividing pipe, a glue conveying pipe and a material pumping pump. The packaging glue is uniformly conveyed to the coating roller through the transfer pump, the distance measuring sensor measures the distance between the packaging glue and the LED chip, and the adjusting mechanism adjusts the position of the coating roller according to the feedback of the distance measuring sensor and the thickness of the LED chip so as to keep the distance consistent, so that the packaging glue is uniformly coated on the LED chip by the coating roller. And the device can realize batch coating of the LED chips with different thicknesses.

The invention provides high-stability double-layer core-shell coated pure copper silver-substituted conductive paste and a preparation method thereof, and belongs to the technical field of electronic special materials. The copper-resistant coating comprises the following components in percentage by mass: 82%-90% of antioxidant copper powder with a double-layer core-shell structure, 3%-6% of bismuth-boron-zinc lead-free low-melting-point glass powder, 3%-7% of a modified epoxy resin compound organic carrier, 2%-5% of a gradient volatilization compound solvent and 0.5%-2% of a special compound additive for copper. Through the double-layer core-shell copper powder design of inner-layer nano-silver passivation and outer-layer organic composite coating and in cooperation with a liquid-phase synergistic anti-oxidation system, the volume resistivity after slurry curing is smaller than or equal to 3.5 * 10 <-5 > omega.cm, the resistivity change rate after 1000-hour damp-heat aging at 85 DEG C / 85% RH is smaller than or equal to 10%, the normal-temperature storage period without opening a tank is larger than or equal to 6 months, direct curing can be conducted in the conventional air atmosphere of 120-160 DEG C, and the high-temperature-resistant copper paste can be applied to the field of high-temperature storage. The silver paste is completely compatible with production and application production lines of existing silver paste, equipment transformation is not needed, the comprehensive cost is reduced by more than 80% compared with pure silver paste, and the silver paste can be widely applied to the fields of PCBs, membrane switches, flexible electronics, photovoltaic back electrodes, LED packaging and the like.

The utility model belongs to the field of LED packaging, and particularly discloses an automatic cleaning device for a taping process test probe in the LED packaging industry, which comprises a main body, a fixed rod, an airflow regulating valve arranged on the fixed rod, a breather pipe arranged at the rear end of the airflow regulating valve, and an air blowing pipe arranged at the front end of the airflow regulating valve, the infrared sensor is arranged in the air blowing pipe; the anti-blocking mechanism comprises an anti-blocking assembly arranged in the air blowing pipe and a reset assembly arranged between the anti-blocking assembly and the air blowing pipe. After the device is installed at a working position, the probe is automatically cleaned according to a preset cleaning period, the cleaning frequency and cleanliness of the probe are improved, the accuracy and stability of an electrical property test are ensured, the one-time yield of products is improved, the production cost is reduced, and the production efficiency is improved. And the working stability and the service life of the device can be effectively ensured through the airflow adjusting valve and the anti-blocking mechanism.

The utility model provides an LED packaging structure. The LED packaging structure comprises a support, the support comprises a connecting part and at least two bowl cups, at least one LED chip is installed in each bowl cup, the at least two bowl cups are connected through the connecting part, a plurality of pins are arranged below each bowl cup, and the pins are connected with the connecting part. Therefore, equivalently, at least two single-lamp LED packaging structures are connected together through the bracket to form a multi-lamp LED packaging structure, and the pins for fixing the LED packaging structure are multiplied, so that the welding force of the single LED packaging structure is favorably improved, and the anti-collision capability of the LED packaging structure after welding is improved. The utility model further provides an LED display module comprising the LED packaging structure and an LED display screen comprising the LED display module.

The invention relates to an LED 3D display device and a manufacturing method thereof. The LED 3D display device provided by the invention comprises an LED device layer; the LED device layer comprises a plurality of LED packaging structures arranged in an array, and each LED packaging structure at least comprises a group of RGB three-color LED chips; a polarizer layer; the polaroid layer comprises a plurality of polaroids arranged in an array, and the polaroids are in one-to-one correspondence with the LED packaging structures; wherein the polaroid comprises a left-hand polaroid and a right-hand polaroid; the left-hand polaroids and the right-hand polaroids are arranged alternately. According to the LED 3D display device, the effective visual angle range of a 3D display image can be expanded, and the definition and brightness of the 3D image are improved.

The utility model relates to a high-brightness LED packaging structure which comprises a lamp holder, an LED light-emitting strip and a lampshade. The LED light-emitting strip is embedded in the lamp holder, the LED light-emitting strip is electrically connected with the lamp holder, and the lampshade is assembled on the lamp holder; at least two clamping plates are arranged on the lamp holder, and extending plates are arranged on the front side and the rear side of the lampshade and correspond to the two clamping plates. According to the high-brightness LED packaging structure, the two extension plates on the lampshade are inserted into the two clamping plates at the same time, the lampshade is pushed so that the lampshade can be completely attached to the lamp holder and cover the LED light-emitting strip, at the moment, the two extension plates completely slide into the clamping plates, and the two limiting plates are attached to the left side and the right side of the lampshade and the left side and the right side of the lamp holder correspondingly, so that the LED light-emitting strip is covered with the two limiting plates; the two limiting plates are tightly attached to the left side and the right side of the lampshade and the lamp holder correspondingly by tightening the fasteners, so that the lampshade is limited, left-right movement of the lampshade is effectively avoided, and the packaging effect between the lampshade and the lamp holder is effectively improved.

The invention discloses an epoxy solid crystal adhesive for LED packaging, which comprises the following components in parts by weight: bisphenol A type epoxy resin, hydrogenated bisphenol A type epoxy resin, a curing agent, a curing accelerator, a silane coupling agent and a thixotropic agent, the curing accelerator is an imidazole derivative having a specific structure. The bisphenol A type epoxy resin and the hydrogenated bisphenol A type epoxy resin are compounded to serve as a resin main body, viscosity controllability is achieved on the premise that a diluent is not used, meanwhile, the curing accelerator of a specific structure is combined, the prepared solid crystal glue has excellent bonding capacity, the room-temperature operation period of about 10 days can be achieved, and the service life of the solid crystal glue is prolonged. The waste of the solid crystal glue can be effectively reduced, and the production efficiency is improved.