141 results about "Solid-state lighting" patented technology

Tailored doping of barrier layers enables balancing of the radiative recombination among the multiple-quantum-wells in III-Nitride light-emitting diodes. This tailored doping enables more symmetric carrier transport and uniform carrier distribution which help to reduce electron leakage and thus reduce the efficiency droop in high-power III-Nitride LEDs. Mitigation of the efficiency droop in III-Nitride LEDs may enable the pervasive market penetration of solid-state-lighting technologies in high-power lighting and illumination.

Solid-state lighting devices including light-emitting diodes (LEDs) and more particularly current injection structures for LED chips are disclosed. Current injection structures include integrated layers or materials with high work functions as part of contact structures for epitaxial layers of active LED structures. Exemplary structures provide high work function contact layers for p-type epitaxial layers to enhance hole mobility and transport. Further contact structures include combinations of high work function layers with other current spreading layers. Exemplary materials for high work function layers include transition metal oxides.

A solid-state lighting fixture assembly having a lighting fixture with a socket configured to receive a plug associated with one or more accessories to allow for easy in-field mounting of accessories, e.g., controls, onto installed lighting fixtures. The socket may be internally electrically connected to an auxiliary power output of a driver and / or to a battery power pack within the lighting fixture assembly, thereby providing direct-current voltage power for the accessory and, also, allowing for signal transmission to and from the accessory. Each accessory includes one or more sensors and communication components to provide the connected lighting fixture assembly with specific capabilities including, but not limited to, motion detection, ambient light level detection, ambient temperature measurement and wireless communications. The wireless communication can also be used to control one or a group of lighting fixtures and transmit sensor data associated with, for example, monitoring space utilization and asset tracking.

A lighting unit (1), such as a downlight, at least part of which is arranged to be mounted in an aperture in a partition, such as a ceiling, the lighting unit (1) comprising: a first housing (3), said first housing (3) having a front side (A) and a rear side (B); a solid-state lighting device (5) mounted within the first housing (3) on the front side (A) thereof; a second housing (7) mounted to the rear side (B) of the first housing (3); a driver (9) arranged to convert a mains electrical signal to an electrical signal suitable for driving the solid-state lighting device (5), wherein the driver (9) is located in the second housing (7); and an electrical connection assembly (11) that is arranged to electrically connect the driver (9) to the solid-state lighting device (5), the electrical connection assembly (11) including first and second electrical connectors (13,15) that are releasably attachable to one another to form an electrical connection and are separable from one another to break the electrical connection; wherein the driver (9) is removably mounted in the second housing (7); the solid-state lighting device (5) is removably mounted in the first housing (3).

Solid state lighting apparatuses, systems, and related methods are provided. An example apparatus can include one or more light emitting diodes (LEDs) and a dark or black encapsulation layer surrounding and / or disposed between the one or more LEDs. The apparatus can include, e.g., a substrate or a leadframe for mounting the LEDs. A method for producing a panel of LEDs can include joining the LEDs to the panel, e.g., by bump bonding, and flooding the panel with dark or black encapsulation material so that the LED chips are surrounded by the dark or black encapsulation material.

Solid-state lighting devices including light-emitting diodes (LEDs) and more particularly structures for LED packages with multiple LED chips are disclosed. LED package structures include arrangements of one or more of body structures with multiple cavities for LED chips, encapsulants with lenses registered with the multiple cavities, and lead frame structures at least partially within the body structures. Cavities of body structures and / or corresponding lenses are disclosed with certain asymmetries configured to direct highest intensities of LED chip emissions in directions that are offset from cavity centers. Body structures are disclosed with one or more continuously planar surfaces that promote enhanced flexibility in encapsulant and / or lead frame structures and improved resistance to moisture ingress. One or more combinations of cavities and / or lenses asymmetries may be implemented in combination with one or more continuously planar body surfaces.

A solid-state lighting fixture assembly having a lighting fixture with a socket configured to receive a plug associated with one or more accessories to allow for easy in-field mounting of accessories, e.g., controls, onto installed lighting fixtures. The socket may be internally electrically connected to an auxiliary power output of a driver and / or to a battery power pack within the lighting fixture assembly, thereby providing direct-current voltage power for the accessory and, also, allowing for signal transmission to and from the accessory. Each accessory includes one or more sensors and communication components to provide the connected lighting fixture assembly with specific capabilities including, but not limited to, motion detection, ambient light level detection, ambient temperature measurement and wireless communications. The wireless communication can also be used to control one or a group of lighting fixtures and transmit sensor data associated with, for example, monitoring space utilization and asset tracking.

Solid-state lighting devices including light-emitting diodes (LEDs) and more particularly contact structures in LED chips for reducing voiding of bonding metals are disclosed. LED chips include active LED structures on carrier submounts and contact structures arranged to receive external electrical connections adjacent the active LED structures. Exemplary contact structures include contacts electrically coupled to active LED structures and dielectric structures beneath the contacts. Dielectric structures are arranged beneath portions of the contacts while still allowing electrical connections therethrough. Such dielectric structures may be provided as regions of dielectric material with spacings that control topography of underlying bonding metals to reduce voiding.

Solid state lighting devices including light emitting diodes (LEDs), and more particularly, include a reflector for a support structure in an LED package (48). The support structure includes an arrangement of dielectric reflectors (18) relative to conductive traces (14) and LED chips (36) patterned on the submount (12). The dielectric reflector includes a plurality of dielectric layer structures that form a distributed Bragg reflector (DBR) or in some cases an aperiodic Bragg reflector. Such dielectric reflectors (18) may be disposed on one or more conductive traces (14) and on portions of the submount (12) that are not covered by the conductive traces to provide increased reflectance over various wavelengths provided by the LED chip, including wavelengths in the ultraviolet (UV) spectrum. Each disclosed LED package (34, 42, 44, 46, 48, 50, 52, 54, 56, 60, 62, 64) is also provided with a cover structure (38).

The invention discloses an NCS-doped manganese-based organic-inorganic hybrid metal halide luminescent material and a preparation method thereof, and belongs to the field of photoelectric materials. The chemical formula of the manganese-based organic-inorganic hybrid metal halide is (C12H28N) 2MnBr4: NCS-, and the manganese-based organic-inorganic hybrid metal halide can emit broadband bright yellow light with the central wavelength of 552 nm under the excitation of ultraviolet light. In addition, the preparation method of the luminescent material is simple and easy to operate, raw materials are cheap and easy to obtain, and the luminescent material is suitable for large-scale production. The luminescent material can be used in the fields of solid-state illumination, display and the like.

A solid state lighting (SSL) with a solid state emitter (SSE) having thermally conductive projections extending into an air channel, and methods of making and using such SSLs. The thermally conductive projections can be fins, posts, or other structures configured to transfer heat into a fluid medium, such as air. The projections can be electrical contacts between the SSE and a power source. The air channel can be oriented generally vertically such that air in the channel warmed by the SSE flows upward through the channel.

A vertical solid state lighting (SSL) device is disclosed. In one embodiment, the SSL device includes a light emitting structure formed on a growth substrate. Individual SSL devices can include a embedded contact formed on the light emitting structure and a metal substrate plated at a side at least proximate to the embedded contact. The plated substrate has a sufficient thickness to support the light emitting structure without bowing.

Provided are a solid-state lighting apparatus composed of a plurality of solid-state lighting units. Each solid-state lighting unit includes inter-unit communication modules, each module located on a corresponding side of the solid-state lighting unit and configured to communicate and interlock with an inter-unit communication module of a corresponding adjacent lighting unit connected to the lighting unit on the corresponding side. The invention allows flexible combination and convenient installation / rearrangement of lighting equipment to satisfy requirements for different lighting areas and working modes.

Various embodiments of SST dies and solid state lighting (“SSL”) devices with SST dies, assemblies, and methods of manufacturing are described herein. In one embodiment, a SST die includes a substrate material, a first semiconductor material and a second semiconductor material on the substrate material, an active region between the first semiconductor material and the second semiconductor material, and a support structure defined by the substrate material. In some embodiments, the support structure has an opening that is vertically aligned with the active region.

The invention relates to the technical field of solid-state lighting, and particularly discloses a far-red light-emitting material, a preparation method thereof and a light-emitting device. The general chemical formula of the luminescent material is A (2-m) / 3BmC0. 5W0. 5O3: xMn < 4 + >, and A is one or a combination of La, Gd, Lu, Sc and Y rare earth ions; b is one or a combination of Li, Na, K, Rb and Cs alkaline earth metals; c is one or a combination of Mg, Ca, Sr and Ba alkaline earth metals; 0 < = m < = 2; 0.01 mol% < = x < = 50 mol%. The powder material is prepared by adopting a high-temperature solid-phase method, and the method is simple in process, environment-friendly and low in cost. The light-emitting material can emit far-red light, and the technical problems that an existing far-red light-emitting material is few in matrix and poor in performance are effectively solved.

A lighting system includes a solid state lighting device capable of generating mixed light and a controller. The solid state lighting device includes light sources for producing mixed light and a sensor configured to detect light from one of the light sources. The controller controls two or more of the light sources based on output from the sensor. The controller can communicate with the sensor to provide closed-loop control.

This invention proposes a high-performance perovskite quantum dot light-emitting diode (LED) based on carbazole-phosphonic acid and its derivatives, and its fabrication method. The perovskite quantum dot emitting layer and / or hole functional layer incorporate an interface modification material with a carbazole-phosphonic acid structure as the core functional layer. The resulting LED device comprises an ITO anode, a lithium fluoride interface buffer layer, a zinc oxide electron transport layer, and a metal cathode. This invention utilizes a one-step solution-blending spin-coating method to prepare a modified functional layer with surface passivation and a microscopic PN junction space charge region structure. It also demonstrates a device fabrication method using commercially available MeO-2PACz materials to replace PEDOT:PSS. The device exhibits stable and efficient structure, high bandgap matching, and the fabricated perovskite quantum dot LED demonstrates high brightness, significantly suppressed efficiency roll-off, and excellent high-current operating stability, showing great application potential in large-area displays and solid-state lighting.

An illumination device (100) provided with a support structure (10), an array of a plurality of spatially separated solid state lighting elements (11) mounted on a first side of the support structure (10), as well as an optical element (12) made from a light diffusing material for diffusing light emitted by the array of the plurality of spatially separated solid state lighting elements (11), the optical element (12) being mounted on the first side of the support structure and provided with a pattern formed of an array of a plurality of recessed portions (120) and an array of a plurality of elevated portions (122).

Solid-state lighting devices including light-emitting diodes (LEDs) and more particularly arrangements of lumiphoric materials within LEDs and related methods are disclosed. Lumiphoric materials are incorporated or otherwise embedded within LED chips and LED wafers. Embedded lumiphoric materials are provided so that at least some portions of light generated by active LED structures are subject to wavelength conversion before exiting LED chip surfaces. Lumiphoric material layers include arrangements of lumiphoric particles and binder layers positioned between reflective layers and active LED structures. Lumiphoric material layers and / or lumiphoric particles may be patterned within regions of LED chips and / or LED wafers. Related methods include depositing lumiphoric particles and binder layers before reflective layers in LED chips and LED wafers.

Solid-state lighting devices including light-emitting diodes (LEDs) and more particularly structures for LED packages with multiple LED chips are disclosed. LED package structures include arrangements of one or more of body structures with multiple cavities for LED chips, encapsulants with lenses registered with the multiple cavities, and lead frame structures at least partially within the body structures. Cavities of body structures and / or corresponding lenses are disclosed with certain asymmetries configured to direct highest intensities of LED chip emissions in directions that are offset from cavity centers. Body structures are disclosed with one or more continuously planar surfaces that promote enhanced flexibility in encapsulant and / or lead frame structures and improved resistance to moisture ingress. One or more combinations of cavities and / or lenses asymmetries may be implemented in combination with one or more continuously planar body surfaces.

A solid state lighting device including a light emitting diode (LED) is disclosed, and more particularly, a structure of an LED package having a plurality of LED chips is disclosed. The LED package structure includes an arrangement of one or more of a body structure having a plurality of cavities for LED chips, an encapsulation having a lens in registration with the plurality of cavities, and a lead frame structure at least partially located within the body structure. Cavities having a body structure and / or corresponding lenses with certain asymmetries configured to direct the highest intensity emitted by the LED chip to a direction offset from the center of the cavity are disclosed. A body structure is disclosed having one or more continuous flat surfaces that improve enhanced flexibility of the encapsulant and / or leadframe structure, as well as improved resistance to moisture intrusion. One or more combinations of cavity and / or lens asymmetry may be implemented in conjunction with one or more continuous flat body surfaces.

Solid-state lighting devices including light-emitting diodes (LEDs) and more particularly LED chip structures and related methods are disclosed. LED chip structures include arrangements of current spreading layers and dielectric reflective layers relative to active LED structures. Current spreading layers may be positioned to provide electron path steering toward bulk portions of active LED structures and away from associated mesa sidewalls. Dielectric reflective layers may cover current spreading layers while also extending to cover the mesa sidewalls. Dielectric reflective layers include etch stop layers followed by one or more dielectric layers. The etch stop layers allow over-etching of the dielectric layers to ensure integrity of openings for various electrical interconnects formed through the dielectric reflective layer in related methods. Arrangements of electrical interconnects are also provided that provide tailored current balancing for LED chips.

A solid-state lighting device having melatonin suppression properties that improves or alleviates symptoms of circadian rhythm disorders or other health conditions. Aspects disclosed herein are further directed to providing one or more of the aforementioned effects while maintaining a color rendering index (CRI) value that is acceptably high for the intended use, and providing a lighting device with high light efficacy and enhanced energy efficiency. A solid-state lighting device includes one or more solid-state emitters and one or more fluorescent materials that provide a concentrated emission of the solid-state lighting device. The concentrated emission has a warm correlated color temperature (CCT) whose color point deviates a certain distance from the black body locus (BBL).

Epitaxial formation support structures and associated methods of manufacturing epitaxial formation support structures and solid state lighting devices are disclosed herein. In several embodiments, a method of manufacturing an epitaxial formation support substrate can include forming an uncured support substrate that has a first side, a second side opposite the first side, and coefficient of thermal expansion substantially similar to N-type gallium nitride. The method can further include positioning the first side of the uncured support substrate on a first surface of a first reference plate and positioning a second surface of a second reference plate on the second side to form a stack. The first and second surfaces can include uniformly flat portions. The method can also include firing the stack to sinter the uncured support substrate. At least side of the support substrate can form a planar surface that is substantially uniformly flat.

A lighting circuit for solid-state lighting, such as light-emitting diodes (LEDs), is configured to produce reduced visible flicker. The lighting circuit may accept time-varying input power, such as alternating current (AC) power or rectified AC power. Within the circuit, a plurality of LED light engines are grouped in sets. Some of the sets receive unaltered input power, while other sets receive input power that has been shifted in phase. The phases of the sets of LED light engines are coordinated such that, at any time during the power cycle, at least one set of LED light engines is illuminated, and the lighting circuit as a whole produces a substantially constant luminous flux over the entire power cycle. LED light engines from different sets may be grouped or clustered together on a printed circuit board such that, in the aggregate, they do not produce the illusion of movement during illumination.

The invention discloses a reflection mode fluorescence conversion white light source for communication and illumination, and belongs to the field of visible light communication and solid-state illumination. The divergence angle, the modulation bandwidth, the color rendering index, the angle color uniformity and the thermal stability of the white light source are remarkably improved, and the overall performance of a visible light communication and solid-state lighting system is enhanced. The specific implementation method comprises the following steps: 1, adjusting parameters such as fluorescence conversion material concentration and glass cavity thickness according to light source performance requirements; the cesium lead bromide and the cadmium selenide / zinc sulfide are respectively excited by 450nm laser to radiate 521nm light and 632nm light. And 2, fixing the fluorescence conversion material on the reflecting surface of the reflecting mirror so as to improve the transmitting power of the light source. Backward radiated 521nm and 632nm light and unconverted residual 450nm light are reflected by the reflecting mirror and are combined with forward radiated light to generate a white light beam. Thirdly, a radiator is assembled on the back face of the reflector, and the thermal stability of the system is improved. The method is not only suitable for the fields of visible light communication and solid-state illumination, but also provides important technical support for various related applications such as intelligent illumination and indoor wireless communication.

A solid-state lighting fixture assembly having a lighting fixture with a socket configured to receive a plug associated with one or more accessories to allow for easy in-field mounting of accessories, e.g., controls, onto installed lighting fixtures. The socket may be internally electrically connected to an auxiliary power output of a driver and / or to a battery power pack within the lighting fixture assembly, thereby providing direct-current voltage power for the accessory and, also, allowing for signal transmission to and from the accessory. Each accessory includes one or more sensors and communication components to provide the connected lighting fixture assembly with specific capabilities including, but not limited to, motion detection, ambient light level detection, ambient temperature measurement and wireless communications. The wireless communication can also be used to control one or a group of lighting fixtures and transmit sensor data associated with, for example, monitoring space utilization and asset tracking.

Solid-state lighting devices including light-emitting diodes (LEDs) and more particularly LED packages for environmental indication are disclosed. LED packages include one or more LED chips and reactive materials that preferentially react with environmental ingress. After sufficient reactant exposure, the reactive materials may degrade and exhibit reduced electrical conductivity. Reactive material arrangements relative to electrical connections are provided so that the one or more LED chips either turn on, turn off, or lose brightness to provide visual indication of environmental reactants. Reactive materials may form electrical shorting paths that bypass one or more LED chips until sufficient reactant exposure when the shorting paths fail and the one or more LED chips are electrically activated. Alternatively, reactive materials may form parts of electrically conductive paths for the one or more LED chips such that with sufficient reactant exposure, the electrically conductive paths fail and the one or more LED chips are electrically deactivated.

An inrush current protection circuit for a solid state lighting fixture is provided. The inrush current protection circuit includes one or more current limiting devices and one or more switching devices coupled in parallel with the one or more current limiting devices. The one or more switching devices are configured in a first state when the solid state lighting fixture draws an inrush current from a power source. The inrush current is provided to the one or more current limiting devices when the one or more switching devices are in the first state. The one or more switching devices are configured in a second state when the solid state lighting fixture draws a steady-state current from the power source. The steady-state current bypasses the one or more current limiting devices when the one or more switching devices are in the second state.

A light-emitting diode (LED) luminaire with dual-frequency visual stimulation flickers, comprising: two sets of LED arrays disposed on a printed circuit board in an interlaced configuration; a pulse-width modulation (PWM) pulse generator; and an LED driving circuit, is configured to replace a conventional luminaire. The PWM pulse generator is configured to generate two modulating signals at respective temporal modulation frequencies. The LED driving circuit is configured to receive the two modulating signals and generate corresponding driving currents to drive the two sets of LED arrays, thereby producing visual stimulation flickers at the two temporal modulation frequencies. The resulting dual-frequency visual stimulation flickers induce a symmetric harmonic frequency perceptible by the human brain, thereby enhancing a benign brain oscillation and endogenously triggering and entraining a gamma-band neural oscillation.