99 results about "Heat spreading" patented technology

The invention provides a high-safety flexible pole piece, a preparation method and a flexible lithium ion battery, the pole piece comprises a current collector and a coating arranged on the surface of the current collector, the coating comprises a flexible isolation structure and a plurality of electrode units, the flexible isolation structure constructs a plurality of accommodating areas isolated from each other on the surface of the current collector, the number of the electrode units is multiple, and the flexible isolation structure is arranged in the accommodating areas. The plurality of electrode units are respectively and independently arranged in different accommodating areas. According to the invention, accurate prevention and control of thermal runaway are realized through the electrode structure design of partition isolation and a material system with multiple hydrogen bonds synergistic effect. The electrode is divided into independent units by the flexible isolation structure, so that heat spreading is effectively blocked; and a hydrogen bond network formed by the hydroxyl-containing comonomer I, PI, PET and hexaphenoxy cyclotriphosphazene significantly enhances the interface stability and flame retardant efficiency of the electrode and the isolation structure, and improves the intrinsic safety of the battery while ensuring the flexibility of the battery.

The invention relates to the technical field of industrial furnace control, and discloses a pit furnace multi-zone coupling heating method which comprises the following steps: acquiring a heat propagation characteristic model from a plurality of heating zones to a plurality of temperature sensing points of a pit furnace offline; according to a preset target temperature profile and the heat propagation characteristic model, prospectively planning a reference power output sequence of each heating area; monitoring the temperature data of the plurality of temperature sensing points on line in real time, and constructing an actual temperature field profile; comparing the actual temperature field profile with the target temperature profile at the current moment, and calculating a field form deviation function; and generating a correction vector for correcting the reference power output sequence based on the field form deviation function. By establishing a double-layer control architecture combining feedforward planning and feedback correction, a traditional passive control mode based on error tracking is converted into an active thermal field construction and adjustment mode based on model prediction.

The invention relates to the technical field of tail gas treatment, in particular to a tail gas treatment structure of a movable diesel generating set. Comprising a supporting seat and further comprises a cyclone separator, a first barrel, a flow guide part, a second barrel, a third barrel, a vibration part, a driving part and the like. Through cooperative cooperation of the cyclone separator, the impingement plate, the flow guide part, the vibration part and the driving part, in the tail gas treatment process, the cyclone separator separates and collects large particles, the impingement plate enables airflow to uniformly enter DOC for oxidation, the flow guide part sweeps high-temperature gas to the end face of the DPF to form uniform heating, and the tail gas treatment effect is improved. The vibration part transmits vibration to the DPF through the vibration transmission rod so that a soot layer can be loosened, and the driving part drives the flow guide part to rotate and the vibration part to work at the same time. Therefore, the problems that in the prior art, an ash-carbon composite layer formed by ash accumulation hinders regeneration heat transfer, and a soot layer is compacted compactly under the low-load working condition, so that regeneration starting is difficult, and heat spreading is slow are systematically solved.

The invention relates to the technical field of semiconductor packaging, in particular to a multi-chip packaging structure of an integrated heat dissipation framework, which comprises a packaging structure, the packaging structure comprises two external ventilation pipes, the outer walls of the two external ventilation pipes are fixedly connected with two external support legs, and hot air ventilation pipes are mounted at the bottom ends of the two external ventilation pipes. A plurality of external fixing frames are installed on the other sides of the outer walls of the two external ventilation pipes at equal intervals, a plurality of top end packaging plates are installed at the top ends of the external fixing frames, and packaging chips are packaged at the top ends of the top end packaging plates; heat dissipation and ventilation structures are arranged on the inner walls of the two external ventilation pipes; and a driving structure is arranged on one side of the external supporting leg close to one side. The multi-chip packaging structure has the advantages that the dual purposes of stable multi-chip packaging and efficient heat dissipation are achieved, the packaging integration level and the working stability of the chips are considered, and the working requirements of a high-power and high-density multi-chip module are met.

A heat spreading element is provided and includes first and second pyrolytic graphite sheets (PGSs) arranged to form an opening between respective proximal ends thereof and a weaved PGS. The weaved PGS includes a first section disposed above the first PGS, a second section disposed below the second PGS and a weaved section extending between respective proximal ends of the first and second sections and through the opening.

Provided are high quality metal-nitride, such as aluminum nitride (AlN), films for heat dissipation and heat spreading applications, methods of preparing the same, and deposition of high thermal conductivity heat spreading layers for use in RF devices such as power amplifiers, high electron mobility transistors, etc. Aspects of the inventive concept can be used to enable heterogeneously integrated compound semiconductor on silicon devices or can be used in in non-RF applications as the power densities of these highly scaled microelectronic devices continues to increase.

The invention discloses a display module and a display device. The display panel comprises a first surface and a second surface which are oppositely arranged along a first direction; the display panel further comprises a plurality of driving signal lines and a plurality of conductive wires, each conductive wire comprises a first wire branch and a second wire branch which are electrically connected, the driving signal lines and the first wire branches are arranged on the first surface, the second wire branches are arranged on the second surface, the first wire branches are electrically connected with the driving signal lines, and the second wire branches are electrically connected with the driving signal lines. And the first wiring branch part is electrically connected with the second wiring branch part. A vapor chamber is further arranged on the second surface of the display panel; in the first direction, the vapor chamber and the second wiring branch are at least partially overlapped. An anti-reflection structure is further arranged in the display panel, the anti-reflection structure at least comprises a first anti-reflection structure, and the first anti-reflection structure and the second wiring branch are not overlapped in the first direction. By arranging the anti-reflection structure, the reflectivity of different areas in the display panel can be effectively balanced, and the ink color consistency of the display panel is improved.

The application discloses a laminated heat dissipation structure continuous forming process, which comprises the following steps: after a metal material belt is continuously conveyed by a step-by-step mode and enters between an upper die and a lower die of a step-by-step continuous punching die, T-shaped holes, pilot holes, a plurality of first convexes, a plurality of second convexes, first profile holes, second profile holes, through-hole holes and connecting structures are sequentially formed on the metal material belt by continuous punching of the step-by-step continuous punching die; after the above features are formed in one forming area of the metal material belt, blanking is performed by a blanking station to finally form heat dissipation fins; each formed heat dissipation fin falls into a blanking channel, and the heat dissipation fins are connected by the connecting structures to form a laminated heat dissipation structure. The application improves production efficiency, simplifies the production mode, and does not need manual assistance in the forming process, thereby reducing production cost.

The application discloses a kind of wide band gap semiconductor double-sided heat dissipation module packaging structures based on conductive metal strip, and the semiconductor power chip of different bridge arm is arranged on different power substrate, the volume of module is reduced, and the power density of module is greatly improved;Power gasket is arranged between top and bottom power substrate, and it plays a mechanical support and electrical connection role, provides additional heat dissipation path for each semiconductor power chip on the basis of double-sided heat dissipation, reduces the degree of thermal coupling between chips, achieves chip temperature uniformity effect, while improving chip heat dissipation environment;Driving circuit and commutation circuit are close to vertical in space, and the degree of electromagnetic coupling between circuits is greatly reduced, and the reliability of module is further improved;The conductive metal strip is used in commutation circuit to complete the electrical connection required by chip, and the numerical value of module parasitic inductance is greatly reduced, wherein the hole slot is opened in the connection of source conductive metal strip, which can improve the uniformity of parasitic inductance distribution, and achieve chip current sharing effect.

The application relates to the technical field of hot riveting machines, and discloses a plastic multi-point hot riveting device with detachable hot riveting heads, which comprises a heat-conducting pressure head, two groups of heating coils are respectively arranged on the two sides of the heat-conducting pressure head, three groups of thermocouples are arranged on the front side of the heat-conducting pressure head, a heat spreading plate is arranged in the heat-conducting pressure head, a plurality of connecting pieces are arranged below the heat spreading plate, a hot riveting head is arranged in each connecting piece, and the upper end of each hot riveting head is in abutment with the heat spreading plate. The application guarantees the consistency of hot riveting machining precision: the heat spreading plate provides a unified installation reference for the hot riveting heads, the locking structure ensures the stability of the reference precision; the trigger ring and the locking ring realize synchronous action through the cooperation of a limiting groove-limiting block, the trigger rod accurately slides along a preset sliding groove track, the accurate transmission of the unlocking and locking actions is guaranteed, the installation height and stress balance of the hot riveting heads are ensured, and the consistency of hot riveting finished products is improved.

The utility model discloses a battery pack capable of preventing heat spreading. The battery pack can simultaneously take into account thermal runaway treatment of battery cells and heat dissipation during normal work. The battery pack capable of preventing heat spreading comprises a battery box body and at least one battery module installed in the battery box body, the battery box body at least comprises a heat dissipation side plate, the heat dissipation side plate is provided with a heat dissipation structure, and each battery module comprises a plurality of battery cells, a plurality of aerogel heat insulation units and two aerogel heat insulation side plates, the plurality of battery cells are sequentially arranged side by side in the left-right direction, the outer side surface of each battery cell comprises a side surface and an end surface of which the front end and the rear end are provided with tabs, each aerogel heat insulation unit covers one part of the side surface of each battery cell, and the two aerogel heat insulation side plates are respectively mounted on the front side surface and the rear side surface of the battery module; the aerogel heat insulation side plate covers the end face of the battery cell, and the part, not covered by the aerogel heat insulation unit, of the side face of the battery cell is tightly attached to the heat dissipation side plate.

According to one embodiment of the present application, an electronic assembly is provided, comprising: a circuit board comprising a plurality of connection portions having electrical conductivity; a plurality of spaced apart semiconductor integrated circuits mounted on the circuit board and electrically connected to the plurality of connection portions; a protective layer disposed on the plurality of semiconductor integrated circuits, substantially surrounding the semiconductor integrated circuits, and having a planar upper surface; and a heat spreading copper layer disposed on the protective layer, having an average thickness greater than or equal to about 3 microns, and an average grain size greater than about 0.15 microns, wherein the heat spreading copper layer can occupy substantially the same space (coextensive) in length and width as the circuit board, and the average thickness of the protective layer can be equal to or greater than the height of the plurality of spaced apart semiconductor integrated circuits.

The invention belongs to the technical field of intelligent networked automobile electronics, and particularly relates to an intelligent vehicle-mounted terminal, which comprises an SiP core module, a main processor bare crystal, a high-bandwidth memory stack, a nonvolatile storage bare crystal, a power management integrated circuit bare crystal, a Beidou double-frequency positioning navigation bare crystal, an inertial measurement unit and a wireless communication bare crystal are integrated in the SiP core module, wherein the high-bandwidth memory stack, the nonvolatile storage bare crystal, the power management integrated circuit bare crystal, the Beidou double-frequency positioning navigation bare crystal, the inertial measurement unit and the wireless communication bare crystal are vertically stacked on the main processor bare crystal through a silicon through hole technology. The heat dissipation system comprises a vapor chamber, a heat dissipation fin group arranged on the vapor chamber and a centrifugal fan; and the metal shell is used for accommodating the SiP core module and the heat dissipation system, and an external interface is arranged on the metal shell. Functional units such as calculation, storage, communication, positioning and inertial navigation are integrated, the size is greatly reduced, the reliability is improved, an active heat dissipation scheme that the vapor chamber is combined with the centrifugal fan is adopted, and performance degradation caused by overheating is avoided.

Embodiments provide a battery pack. The battery pack includes: a battery pack case including a bottom plate, where the bottom plate includes a first cooling channel; a battery cell assembly on the battery pack case; and a cover coupled to the side wall and including a second cooling channel, in which the battery cell assembly includes a plurality of battery cells arranged in a first direction parallel to the mounting surface of the bottom plate and a plurality of heat sinks located between the plurality of battery cells, and each of the plurality of heat sinks includes a contact portion overlapping the plurality of battery cells in the first direction, a heat dissipation portion connected to the contact portion and facing the cover, and a protection portion overlapping the contact portion in the first direction.

The invention relates to a thermophotovoltaic device, comprising: - an absorber layer configured to absorb photonic radiation, particularly daylight, within a focal spot as a part of a surface of the absorber layer and convert it into heat energy; - an emitter layer positioned adjacent to the absorber layer or integrally formed with it, configured to emit thermal radiation due to the heat energy via a surface of the emitter layer; - at least one photovoltaic cell positioned to receive the emitted thermal radiation from the emitter layer and convert it into electrical energy using the photoelectric effect; - a heat spreading layer embedded within the absorber layer and / or emitter layer configured to distribute heat energy lateral over the emitter surface.

The invention discloses a light condensation module for space. The light condensation module comprises a primary mirror, a secondary mirror, a secondary mirror support, a light funnel, a battery piece and a heat expansion piece. The primary mirror comprises a primary mirror base body which forms a sunny side opening of the condensation module, and an optical working surface of the primary mirror faces the secondary mirror; the secondary mirror is fixed to a reflection light path convergence area of the primary mirror through a secondary mirror support, and secondary reflection is carried out on reflection light of the primary mirror to an inlet of the light funnel. The light funnel is of a conical cavity structure and guides light to the light receiving face of the battery piece. The heat expansion piece is tightly attached between the back face of the battery piece and the primary mirror base body. The primary mirror base body is used as a heat dissipation element, a heat conduction path of'battery piece-heat expansion piece-primary mirror base body 'is constructed, integration of optical convergence and heat management is achieved, heat is radiated to a space environment through the surface of the primary mirror while the light condensation efficiency is guaranteed, the working temperature of the battery piece is effectively controlled, an independent heat dissipation component is not needed, and the cost is reduced. The device has the advantages of compact structure and light weight.

The invention discloses a three-dimensional silicon detector airtight packaging structure integrating thermoelectric refrigeration and efficient heat dissipation, and relates to the technical field of detectors, and the three-dimensional silicon detector airtight packaging structure comprises a TO tube cap, an X-ray incidence window, a first limiting ring, a second limiting ring, a TO tube seat, a detector chip and an interconnection lead, and a refrigerating mechanism for refrigerating is arranged at the top end of the vapor chamber. Through phase change circulation of a liquid working medium on the vapor chamber and pressure driving of the vapor chamber, rapid and uniform distribution and efficient diffusion of heat are achieved, formation of local hot spots is effectively eliminated, the integrated capillary structure and the multi-cavity design of the vapor chamber exert excellent heat conduction performance in a limited space, the thermal resistance of the system is remarkably reduced, the dynamic response capability is improved, and the service life of the vapor chamber is prolonged. Therefore, the stability of the working temperature of the thermoelectric refrigeration element is guaranteed, and the heat dissipation reliability and the overall performance of the detector in long-term operation are enhanced.

A semiconductor package structure for enhanced cooling is provided. The semiconductor package includes a processor die powered by a front side or back side power supply network, a plurality of memory dies and control dies stacked on the processor die, a plurality of high thermal conductivity interconnects disposed alongside or between the dies, and a substrate that carries all the dies. The substrate has a first cavity that allows a liquid to pass through and a cooling plate that is in direct thermal contact with the uppermost die and has a second cavity configured to be connected to the first cavity and to allow the liquid to flow between the first and second cavities. The semiconductor package is configured to have a topology that surpasses conventional single-sided interconnects and heat spreading, enabling two-sided or multi-sided heat spreading, power supply, and signal transmission.

The invention is suitable for the technical field of device thermal management, and provides a novel vapor chamber with adjustable thermal resistance and a preparation method thereof.The novel vapor chamber comprises a sealed steam cavity, the steam cavity is defined by an evaporation end and a condensation end, a liquid absorption core and a working medium are arranged in the steam cavity, and a liquid filling opening is formed in one side of the steam cavity; the wick is made of a water-absorbent resin material, the working medium is deionized water, and the water-absorbent resin material pre-adsorbs the deionized water. Passive self-adaptive adjustment of the heat resistance of the vapor chamber can be achieved, the vapor chamber is low in heat resistance under low heat flux density so as to achieve efficient uniform-temperature heat dissipation, and the heat resistance is remarkably improved under high heat flux density so as to achieve a heat insulation effect. The device is simple in structure, high in reliability and easy to manufacture, and can be widely applied to electronic devices, battery packs and other scenes where heat conduction paths need to be intelligently regulated and controlled.

The invention discloses welding equipment for a lithium battery cell, and relates to the technical field of cell welding. The hydraulic cylinder is arranged at the top of the welding machine body, and a gathering shell is arranged at the bottom and used for adjusting the lifting position of the gathering shell; the welding head is arranged at the bottom of the gathering shell and is used for receiving the focused laser to realize welding of the battery cell; the dispersing assembly is arranged in the gathering shell and used for dispersing and gathering light spots of one point in advance, the local energy density is reduced, and severe vaporization of metal is avoided; the heat expansion assembly is arranged in the gathering shell, drives the second focusing lens to swing left and right through swing of the dispersing assembly and is used for expanding a light beam heat action area so as to reinforce molten pool bridging, light spots are not concentrated at one point any more, high-speed scanning is conducted in one area, local energy density is reduced, severe vaporization of metal is avoided, and the heat dissipation efficiency is improved. And the swinging light beams intensively stir the molten pool, so that gas and impurities in the molten pool can float upwards and escape easily.

The application discloses a wide-bandgap power semiconductor module based on bypass copper column heat dissipation, a plurality of series or parallel wide-bandgap power semiconductor chips are arranged on a conductive metal substrate on the upper surface of a power substrate; the top and bottom power substrates are supported and connected by bypass copper columns and auxiliary copper columns; the layout design of the bypass copper columns makes the parallel chip heat dissipation environment similar and the thermal coupling consistent in the power module, so that the chip temperature equalization effect is achieved; the heat transfer capacity of the bypass copper columns provides a channel for the chip to conduct heat to the top power substrate, greatly improves the chip heat dissipation capacity, and is suitable for a large-current grade power module with a plurality of parallel wide-bandgap semiconductor power chips.

The invention discloses an electric vehicle battery pack liquid cooling and fireproof structure, and relates to the technical field of battery pack protection, the electric vehicle battery pack liquid cooling and fireproof structure comprises a battery pack shell, a battery module arranged in the shell, a liquid cooling system used for managing the thermal state of the battery module, and a high temperature diversion assembly, the heat exchanger is assembled on a key heat expansion path between the battery module and the inner wall of the battery pack shell; according to the liquid cooling and fireproof structure for the battery pack of the electric vehicle, the high-temperature flow guide assembly is rapidly and directionally opened, initial jet flow with the strongest destructiveness can be accurately and smoothly guided to the pressure relief channel and discharged out of the battery pack, rebounding and countercurrent of the initial jet flow in the battery pack are effectively avoided, the most direct heat spreading ignition source is cut off from the source, and the service life of the battery pack is prolonged. And meanwhile, in cooperation with the fire compartment layout in the battery pack, energy and substances generated by a thermal runaway event can be limited in a minimum initial unit or compartment, so that temperature accumulation of the battery pack and surrounding components can be reduced, and the performance and the service life of the battery are protected.

The utility model relates to the technical field of optical communication, in particular to a soaking plate embedded optical module shell structure, which comprises a shell, second solder paste is arranged at the upper end of the shell, a soaking plate is arranged at the upper end of the second solder paste, first solder paste is arranged at the upper end of the soaking plate, and buckle type fins are arranged at the upper end of the first solder paste. Through the welding of the vapor chamber and the buckle type fins, the requirements of different heights of the heat sink on the shell are met, and through the embedded structure of the vapor chamber, the temperature equalization is performed on the buckle type fins and the shell, so that the temperature of the core device of the optical module is effectively reduced.

The utility model discloses a kind of power battery thermal runaway early warning devices, belong to battery structure technical field, the power battery thermal runaway early warning device, including pressure relief valve group and battery pipeline system, wherein pressure relief valve group is made of at least two pressure relief valves.By arranging pressure relief valve on the lateral wall of shell member at different positions, the flow direction of high-temperature gas is controlled, the speed and harm degree of heat spreading are slowed down, and based on the monitoring of temperature data of each pressure relief valve position in the pressure relief valve group, the thermal runaway state of the battery can be effectively judged, ensuring the accuracy of prediction and judgment, and avoiding the use of high-cost smoke and pressure sensor.

The application relates to a graphene film skin heat control device, which comprises a graphene skin radiator and a paraffin thermal switch, the graphene skin radiator comprises a graphene core body and a polyimide film, the polyimide film is located on the outer layer of the graphene core body and encapsulates the graphene core body, the graphene skin radiator is connected with one side of the paraffin thermal switch, and the other side of the paraffin thermal switch is connected with an external heat source. The graphene film skin heat control device can realize rapid heat spreading for electronic equipment installed thereon, can realize efficient heat dissipation by using an external environment under high-temperature working conditions at a small resource cost, and can realize effective heat preservation of the electronic equipment under low-temperature working conditions.

The invention belongs to the technical field of batteries, and particularly relates to a battery module as well as a preparation method and application thereof. The battery module comprises single batteries and at least three layers of composite phase change materials, and the single batteries and the composite phase change materials are arranged at intervals; the composite phase-change material comprises a phase-change material, a heat-conducting additive and a flexible material, in the direction parallel to the positive / negative electrodes of the single batteries, the phase-change temperature of the phase-change material is sequentially and symmetrically increased from the center of the battery module to the outside, and the content of the heat-conducting additive is sequentially and symmetrically decreased from the center of the battery module to the outside; the heat dissipation direction of the battery module is controllable, and heat flow is forcibly led out along the direction parallel to the positive / negative electrodes of the single batteries, so that the heat spreading protection capability is enhanced, and the heat safety is improved; according to the battery module, the heat flow can be quickly guided out, and the maximum temperature difference of the battery module is small, so that the distance between the batteries can be reduced, or more batteries can be arranged in the same space, the volume density of the battery module is improved, and the electrical properties such as cycling stability are further improved.

The invention provides a battery module, relates to the technical field of battery heat dissipation, and aims to solve the technical problem that a current battery module cannot effectively inhibit battery thermal runaway spreading. The battery module comprises a shell, a support assembly, a heat dissipation assembly, a valve and a plurality of battery cells, the support assembly is arranged in a containing cavity of the shell, the support assembly is provided with a plurality of mounting through holes arranged in a honeycomb shape, and each battery cell is arranged in the corresponding mounting through hole; the bracket assembly has a first side surface and a second side surface opposite to each other along the central axis of the mounting through hole; the positive and negative electrodes of the battery cell are exposed on the first side surface and the second side surface through the mounting through hole; the first side face and the second side face are each provided with a heat dissipation assembly, the heat dissipation assemblies are provided with heat dissipation through holes, the heat dissipation through holes communicate with the containing cavity, and a heat dissipation channel is formed in the shell. The valve is arranged on the shell and communicated with the heat dissipation channel. And the heat dissipation channel can quickly discharge high-heat eruptions of the thermal runaway battery core out of the battery, so that heat accumulation is reduced, and the problem of heat spreading of the battery is solved.

The embodiment of the utility model provides a vapor chamber and electronic equipment, and relates to the field of electronic equipment. The vapor chamber comprises a first plate body and a second plate body, the first plate body is provided with a first surface and a second surface which are opposite, the first surface is used for being attached to a heating piece, and the second plate body is connected with the second surface. A first cavity is formed in the first plate body, a second cavity is formed between the second plate body and the second surface, a heat-conducting medium is arranged in the first cavity, the second cavity is a vacuum cavity, and the orthographic projection of the second cavity on the first surface covers the orthographic projection of the heating element on the first surface. The first cavity of the vapor chamber can dissipate heat of the heating element, and the second cavity can isolate part of heat generated by the heating element in the thickness direction of the vapor chamber, so that the local temperature of the vapor chamber at the second plate body is reduced, the situation that the local temperature of the shell of the electronic equipment is too high is avoided, and the use experience of a user is improved.

A battery module comprising: a plurality of battery cells held in a respective plurality of battery receptacles; a plurality of inter-cell connectors interconnecting the plurality of battery cells; a battery tray comprising the plurality of battery receptacles; and a power interface facilitating power input and power output; wherein the inter-cell connectors are configured as heat spreading members extending through the first plurality of battery receptacles to interconnect the respective plurality of battery cells.

A non-invasive thermal dispersion flow meter with chronometric monitor for fluid leak detection includes a heater, an ambient temperature sensor and a flow rate sensor which are configured to sense the temperature of a fluid in a conduit, and then monitor the flow of that fluid through the conduit. The fluid flow sensor is incorporated into a Wheatstone bridge circuit which is used to provide increased sensitivity to the outputs of the sensors. Based upon the ambient temperature sensor readings, the flow rate sensor and heater may be adjusted to optimize the operation of the system to detect leaks. An alternative embodiment utilizes a single sensor and separate heater which work together to determine heat propagation times which in turn is used to calculate flow rate.