176 results about "Heat spreading" patented technology

The invention discloses an intelligent control method and system for real-time treatment of marine waste gas. The method comprises the following steps: collecting a ship waste gas component concentration signal and a sea condition dynamic parameter, performing vortex intensity extraction on the waste gas component concentration signal to identify a vortex flow characteristic, extracting a flow field disturbance coefficient from the sea condition dynamic parameter, and constructing a waste gas-environment interaction field; performing heat trace tracking based on the interaction field to position a high-temperature pollution source, constructing a heat propagation path and mapping a waste gas heat flow network; performing turbulence analysis on the heat flow network to identify a vortex breaking point, determining an optimal processing position and calibrating a processing axis; recombining the control parameter chain based on the processing axis, determining a steady-state processing interval and generating an adaptive adjustment matrix; the adjustment matrix and temperature gradient data are fused to recognize a phase change latent heat region, condensation release energy is extracted to construct an energy recovery tensor, and a gradient processing scheme is generated; a feedback curve is formed by monitoring the execution deviation, a waste gas treatment execution instruction is generated, and continuous and stable operation of ocean waste gas treatment is ensured.

The invention relates to the technical field of energy efficiency control, in particular to a central cabinet power environment monitoring integrated system and an energy efficiency optimization control method, and the system comprises an electrical parameter acquisition module, an environment joint detection module, a temperature rise identification module, an abnormity joint judgment module and a result feedback module. According to the method, a phase deviation sequence is extracted through a periodic electrical parameter waveform, a humidity-phase abnormal section is constructed by combining humidity trend difference at two ends of a path, a heat transfer direction is positioned, a temperature rise focusing section is screened, a path numbering sequence is further compared with node distribution consistency, and fusion identification and positioning of an abnormal area are completed. The synchronous analysis capability of electrical and environment anomalies is improved, path-level screening of humidity accumulation and heat spreading trends is realized, the identification range and response precision of potential hidden dangers in a power supply link are enhanced, the local fault diffusion risk is avoided, rapid feedback and dynamic joint judgment of multi-node power environment changes are supported, a response link is shortened, and the reliability of the power supply link is improved. The operation and maintenance efficiency is improved.

The invention provides a high-safety flexible pole piece, a preparation method and a flexible lithium ion battery, the pole piece comprises a current collector and a coating arranged on the surface of the current collector, the coating comprises a flexible isolation structure and a plurality of electrode units, the flexible isolation structure constructs a plurality of accommodating areas isolated from each other on the surface of the current collector, the number of the electrode units is multiple, and the flexible isolation structure is arranged in the accommodating areas. The plurality of electrode units are respectively and independently arranged in different accommodating areas. According to the invention, accurate prevention and control of thermal runaway are realized through the electrode structure design of partition isolation and a material system with multiple hydrogen bonds synergistic effect. The electrode is divided into independent units by the flexible isolation structure, so that heat spreading is effectively blocked; and a hydrogen bond network formed by the hydroxyl-containing comonomer I, PI, PET and hexaphenoxy cyclotriphosphazene significantly enhances the interface stability and flame retardant efficiency of the electrode and the isolation structure, and improves the intrinsic safety of the battery while ensuring the flexibility of the battery.

The embodiment of the invention relates to the field of heat dissipation, and provides a heat dissipation device, a vapor chamber and electronic equipment, the heat dissipation device is integrated with the vapor chamber and a liquid cooling module, the vapor chamber comprises an evaporation area and a condensation area, the liquid cooling module comprises a cooler, a radiator and a liquid cooling pipe, and the vapor chamber and the liquid cooling module can act synergistically. The heat dissipation performance and the temperature equalizing performance of the heat dissipation device can be improved, and the conflict between the ultrathin design and the high-performance requirement of the vapor chamber is solved. Moreover, at least part of the liquid cooling module is arranged on the periphery of the first end area of the vapor chamber in a surrounding mode along the first plane, the first end area of the vapor chamber is at least part of the area, except for at least part of the end area of the condensation area, of all the end areas of the vapor chamber, and therefore at least part of the end area of the condensation area can be exposed in the air. Enough space can be provided, at least part of the end area of the condensation area is provided with the liquid injection pipe so as to inject the cooling medium into the vapor chamber, and finally manufacturing of the vapor chamber and the heat dissipation device is completed.

A semiconductor package includes an interposer having a first principle surface and a second principle surface opposite the first principle surface. One or more semiconductor dies are disposed on the first principle surface of the interposer, and are electrically connected with the second principle surface of the interposer by electrical vias passing through the interposer. A heat spreading lid disposed over the one or more semiconductor dies. A thermally conductive material is disposed between the one or more semiconductor dies and the heat spreading lid. The thermally conductive material thermally couples the one or more semiconductor dies and the heat spreading lid. In some examples, the heat spreading lid may be a thermoelectric cooler. In some examples, the thermally conductive material may be a mixture of a gel and a liquid metal.

The invention relates to the technical field of industrial furnace control, and discloses a pit furnace multi-zone coupling heating method which comprises the following steps: acquiring a heat propagation characteristic model from a plurality of heating zones to a plurality of temperature sensing points of a pit furnace offline; according to a preset target temperature profile and the heat propagation characteristic model, prospectively planning a reference power output sequence of each heating area; monitoring the temperature data of the plurality of temperature sensing points on line in real time, and constructing an actual temperature field profile; comparing the actual temperature field profile with the target temperature profile at the current moment, and calculating a field form deviation function; and generating a correction vector for correcting the reference power output sequence based on the field form deviation function. By establishing a double-layer control architecture combining feedforward planning and feedback correction, a traditional passive control mode based on error tracking is converted into an active thermal field construction and adjustment mode based on model prediction.

The application discloses a kind of fresh stewed bird's nest cold chain transport process temperature field monitoring method and system, belong to cold chain monitoring technical field.Through heat inertia pulse test, heat capacity and thermal resistance are obtained, which are respectively taken as node attribute and edge attribute;Optimize sensor distribution based on the principle of random walk entropy minimization;Construct a dynamically updated directed weighted heat propagation path graph;Using sparse deconvolution combined with system impulse response function matrix, separate event excitation and identify abnormal events;Linearize the heat balance inverse problem in the rolling time domain, reconstruct the product temperature sequence and heat flow vector, calculate the equivalent heat damage dose, and generate the solidified causal directed acyclic graph evidence chain.The above scheme integrates heat inertia into the graph model, realizes event and heat response separation, risk quantification and full-process traceability, effectively improves the accuracy and reliability of cold chain temperature monitoring.

The invention relates to the technical field of tail gas treatment, in particular to a tail gas treatment structure of a movable diesel generating set. Comprising a supporting seat and further comprises a cyclone separator, a first barrel, a flow guide part, a second barrel, a third barrel, a vibration part, a driving part and the like. Through cooperative cooperation of the cyclone separator, the impingement plate, the flow guide part, the vibration part and the driving part, in the tail gas treatment process, the cyclone separator separates and collects large particles, the impingement plate enables airflow to uniformly enter DOC for oxidation, the flow guide part sweeps high-temperature gas to the end face of the DPF to form uniform heating, and the tail gas treatment effect is improved. The vibration part transmits vibration to the DPF through the vibration transmission rod so that a soot layer can be loosened, and the driving part drives the flow guide part to rotate and the vibration part to work at the same time. Therefore, the problems that in the prior art, an ash-carbon composite layer formed by ash accumulation hinders regeneration heat transfer, and a soot layer is compacted compactly under the low-load working condition, so that regeneration starting is difficult, and heat spreading is slow are systematically solved.

The invention discloses a large complex central air conditioner control method, system and equipment and a medium, and the method comprises the steps that an atrium heat source area, a first refrigeration area and a second refrigeration area are obtained; determining a heat propagation path of the large complex based on the internal space characteristics, the heat source parameters, the first temperature data and the third temperature data, wherein the heat propagation path comprises a vertical path and a horizontal path; determining a heat source direct influence area and a heat source indirect influence area in the first refrigeration area; respectively calculating a first thermal disturbance diffusion index and a second thermal disturbance diffusion index based on the internal space characteristics, the temperature change characteristics, the heat source parameters and the environmental influence factors; and a first area temperature compensation coefficient is determined based on the first thermal disturbance diffusion index, a second area temperature compensation coefficient is determined based on the second thermal disturbance diffusion index, and an air conditioner control scheme is generated according to the first area temperature compensation coefficient and the second area temperature compensation coefficient. The operation control efficiency of the air conditioning system in the large complex can be improved.

The invention relates to the technical field of semiconductor packaging, in particular to a multi-chip packaging structure of an integrated heat dissipation framework, which comprises a packaging structure, the packaging structure comprises two external ventilation pipes, the outer walls of the two external ventilation pipes are fixedly connected with two external support legs, and hot air ventilation pipes are mounted at the bottom ends of the two external ventilation pipes. A plurality of external fixing frames are installed on the other sides of the outer walls of the two external ventilation pipes at equal intervals, a plurality of top end packaging plates are installed at the top ends of the external fixing frames, and packaging chips are packaged at the top ends of the top end packaging plates; heat dissipation and ventilation structures are arranged on the inner walls of the two external ventilation pipes; and a driving structure is arranged on one side of the external supporting leg close to one side. The multi-chip packaging structure has the advantages that the dual purposes of stable multi-chip packaging and efficient heat dissipation are achieved, the packaging integration level and the working stability of the chips are considered, and the working requirements of a high-power and high-density multi-chip module are met.

A heat spreading element is provided and includes first and second pyrolytic graphite sheets (PGSs) arranged to form an opening between respective proximal ends thereof and a weaved PGS. The weaved PGS includes a first section disposed above the first PGS, a second section disposed below the second PGS and a weaved section extending between respective proximal ends of the first and second sections and through the opening.

Provided are high quality metal-nitride, such as aluminum nitride (AlN), films for heat dissipation and heat spreading applications, methods of preparing the same, and deposition of high thermal conductivity heat spreading layers for use in RF devices such as power amplifiers, high electron mobility transistors, etc. Aspects of the inventive concept can be used to enable heterogeneously integrated compound semiconductor on silicon devices or can be used in in non-RF applications as the power densities of these highly scaled microelectronic devices continues to increase.

The utility model relates to a battery pack pressure relief and exhaust structure in the technical field of battery manufacturing, which comprises a box body, a battery cell monomer and a cross beam, the cross beam and the battery cell monomer are arranged in the box body, the cross beam is positioned on one side of the battery cell monomer, an exhaust passage is arranged in the cross beam, and an explosion-proof valve on the battery cell monomer is communicated with the exhaust passage of the cross beam. By means of the arrangement, the influence of high-temperature gas on the single battery cells during pressure relief is effectively avoided, heat spreading is prevented, and meanwhile it is guaranteed that the gas is rapidly exhausted out of the box body during pressure relief.

The invention provides a porous aluminum-based wick and a manufacturing method and application thereof. The porous aluminum-based wick comprises a heat conduction substrate and a wick structure, wherein the wick structure is arranged on the heat conduction substrate; the wick structure comprises a microporous matrix, a macroscopic channel and a nano surface layer, the microporous matrix is made of aluminum alloy, and adjacent pores are communicated with each other to form a continuous capillary network; the macroscopic channel is of a periodic three-dimensional network structure and is arranged in the microporous matrix in a penetrating manner; and the nano surface layer is arranged on the surface of the microporous substrate and the wall surface of the macroscopic channel. Due to the integrated design of the multi-scale pores, the capillary force and the permeability of the wick are effectively improved, the heat transfer resistance is reduced, and the heat dissipation efficiency is enhanced. The manufacturing method is simple, rapid and low in cost, and the obtained wick can be widely applied to phase-change heat dissipation devices such as flat heat pipes and vapor chambers and meets the heat dissipation requirements of high-heat-flux electronic devices.

The utility model discloses an efficient building heat preservation material containing graphene, and relates to the technical field of building materials, the efficient building heat preservation material containing graphene comprises a heat preservation wallboard, a starting piece, a board connecting piece and a corner connecting piece, the heat preservation wallboard is sequentially adhered with a base layer, a first heat insulation layer, a sound insulation and shock absorption layer, a second heat insulation layer and an outer protection surface layer from inside to outside; the first heat insulation layer and the second heat insulation layer comprise a heat insulation base layer, a graphene modified middle layer and a porous heat insulation layer, the first heat insulation layer and the second heat insulation layer form a double-layer heat insulation system, and a nanometer micropore heat insulation material of the heat insulation base layer limits heat conduction of gas; a graphene sheet layer in the graphene modified middle layer and nano ceramic particles have a synergistic effect to reduce the heat transfer rate, the porous heat insulation layer prevents multiple heat propagation modes by utilizing a porous structure and filling aerogel, and the structure greatly improves the heat insulation efficiency of the heat insulation wallboard.

The invention discloses a display module and a display device. The display panel comprises a first surface and a second surface which are oppositely arranged along a first direction; the display panel further comprises a plurality of driving signal lines and a plurality of conductive wires, each conductive wire comprises a first wire branch and a second wire branch which are electrically connected, the driving signal lines and the first wire branches are arranged on the first surface, the second wire branches are arranged on the second surface, the first wire branches are electrically connected with the driving signal lines, and the second wire branches are electrically connected with the driving signal lines. And the first wiring branch part is electrically connected with the second wiring branch part. A vapor chamber is further arranged on the second surface of the display panel; in the first direction, the vapor chamber and the second wiring branch are at least partially overlapped. An anti-reflection structure is further arranged in the display panel, the anti-reflection structure at least comprises a first anti-reflection structure, and the first anti-reflection structure and the second wiring branch are not overlapped in the first direction. By arranging the anti-reflection structure, the reflectivity of different areas in the display panel can be effectively balanced, and the ink color consistency of the display panel is improved.

The application discloses a laminated heat dissipation structure continuous forming process, which comprises the following steps: after a metal material belt is continuously conveyed by a step-by-step mode and enters between an upper die and a lower die of a step-by-step continuous punching die, T-shaped holes, pilot holes, a plurality of first convexes, a plurality of second convexes, first profile holes, second profile holes, through-hole holes and connecting structures are sequentially formed on the metal material belt by continuous punching of the step-by-step continuous punching die; after the above features are formed in one forming area of the metal material belt, blanking is performed by a blanking station to finally form heat dissipation fins; each formed heat dissipation fin falls into a blanking channel, and the heat dissipation fins are connected by the connecting structures to form a laminated heat dissipation structure. The application improves production efficiency, simplifies the production mode, and does not need manual assistance in the forming process, thereby reducing production cost.

The present invention relates to a battery pack comprising: a battery pack frame; and a plurality of battery modules arranged to be spaced apart from each other in a width direction inside the battery pack frame, in which the battery pack frame includes: a bottom plate; a side plate; a chamber part which is provided inside the bottom plate and in which a coolant is filled and stored without an empty space; and an outlet through which the interior of the chamber part communicates with the exterior of the battery pack frame.

A method of evaluating a convective heat transfer amount using a device for evaluating a convective heat transfer amount, the method including providing the device for evaluating a convective heat transfer amount, the device including a first cell, a second cell, a heater, and an upper plate, performing operation (a) of igniting the first cell and calculating a conductive heat transfer rate from the first cell to the second cell, and performing operation (b) of igniting the first cell, measuring a heat propagation time, the heat propagation time being a time from ignition of the first cell to a time when the second cell reaches a limit heat quantity, and calculating the convective heat transfer amount from the first cell to the second cell based on the second heat propagation time and the conductive heat transfer rate.

The application discloses a kind of wide band gap semiconductor double-sided heat dissipation module packaging structures based on conductive metal strip, and the semiconductor power chip of different bridge arm is arranged on different power substrate, the volume of module is reduced, and the power density of module is greatly improved;Power gasket is arranged between top and bottom power substrate, and it plays a mechanical support and electrical connection role, provides additional heat dissipation path for each semiconductor power chip on the basis of double-sided heat dissipation, reduces the degree of thermal coupling between chips, achieves chip temperature uniformity effect, while improving chip heat dissipation environment;Driving circuit and commutation circuit are close to vertical in space, and the degree of electromagnetic coupling between circuits is greatly reduced, and the reliability of module is further improved;The conductive metal strip is used in commutation circuit to complete the electrical connection required by chip, and the numerical value of module parasitic inductance is greatly reduced, wherein the hole slot is opened in the connection of source conductive metal strip, which can improve the uniformity of parasitic inductance distribution, and achieve chip current sharing effect.

The present disclosure provides a heat spreading isolation structure for a semiconductor device. A structure includes an active device over a region of a substrate and a heat spreading isolation structure adjacent to the active device. The isolation structure includes a dielectric layer over a thermally conductive layer. The thermally conductive layer can include polycrystalline graphite. The thermally conductive layer provides a heat spreader that provides a high thermal conduction path with low electrical conduction. The thermally conductive layer can extend into the substrate. The substrate can include an SOI substrate, in which case the thermally conductive layer can extend through the buried insulator thereof.

The application relates to the technical field of hot riveting machines, and discloses a plastic multi-point hot riveting device with detachable hot riveting heads, which comprises a heat-conducting pressure head, two groups of heating coils are respectively arranged on the two sides of the heat-conducting pressure head, three groups of thermocouples are arranged on the front side of the heat-conducting pressure head, a heat spreading plate is arranged in the heat-conducting pressure head, a plurality of connecting pieces are arranged below the heat spreading plate, a hot riveting head is arranged in each connecting piece, and the upper end of each hot riveting head is in abutment with the heat spreading plate. The application guarantees the consistency of hot riveting machining precision: the heat spreading plate provides a unified installation reference for the hot riveting heads, the locking structure ensures the stability of the reference precision; the trigger ring and the locking ring realize synchronous action through the cooperation of a limiting groove-limiting block, the trigger rod accurately slides along a preset sliding groove track, the accurate transmission of the unlocking and locking actions is guaranteed, the installation height and stress balance of the hot riveting heads are ensured, and the consistency of hot riveting finished products is improved.

The utility model discloses a battery pack capable of preventing heat spreading. The battery pack can simultaneously take into account thermal runaway treatment of battery cells and heat dissipation during normal work. The battery pack capable of preventing heat spreading comprises a battery box body and at least one battery module installed in the battery box body, the battery box body at least comprises a heat dissipation side plate, the heat dissipation side plate is provided with a heat dissipation structure, and each battery module comprises a plurality of battery cells, a plurality of aerogel heat insulation units and two aerogel heat insulation side plates, the plurality of battery cells are sequentially arranged side by side in the left-right direction, the outer side surface of each battery cell comprises a side surface and an end surface of which the front end and the rear end are provided with tabs, each aerogel heat insulation unit covers one part of the side surface of each battery cell, and the two aerogel heat insulation side plates are respectively mounted on the front side surface and the rear side surface of the battery module; the aerogel heat insulation side plate covers the end face of the battery cell, and the part, not covered by the aerogel heat insulation unit, of the side face of the battery cell is tightly attached to the heat dissipation side plate.

A central air conditioning control method, system, device and medium of a large complex, wherein the method comprises: obtaining a central court heat source area, a first refrigeration area and a second refrigeration area; determining a heat propagation path of the large complex based on internal space characteristics, heat source parameters, first temperature data and third temperature data, the heat propagation path comprising a vertical path and a horizontal path; determining a direct influence area and an indirect influence area of the heat source in the first refrigeration area; and calculating a first heat disturbance diffusion index and a second heat disturbance diffusion index based on the internal space characteristics, temperature change characteristics, heat source parameters and environmental influence factors respectively; determining a first regional temperature compensation coefficient based on the first heat disturbance diffusion index, determining a second regional temperature compensation coefficient based on the second heat disturbance diffusion index, and generating an air conditioning control scheme according to the first regional temperature compensation coefficient and the second regional temperature compensation coefficient. The application can improve the operation control efficiency of the air conditioning system in the large complex.

The application discloses a heat spreading plate with a pressure self-compensation liquid absorbing core, and belongs to the technical field of electronic device heat dissipation, which comprises a heat spreading plate cavity, a pressure self-compensation liquid absorbing core, a composite capillary structure, a cover plate and a working medium. The pressure self-compensation liquid absorbing core can quickly transport the working medium to the heat source area, preventing the temperature of the heat source area from being too high. Since the liquid absorbing core has a pressure self-compensation function, when the working medium in a certain section of the liquid absorbing core is consumed, the internal pressure is reduced, and the working medium in other places of the liquid absorbing core can be compensated in time, realizing the continuous transportation of the working medium in the liquid absorbing core. The application has four different functional sections, namely, a collection section, a transportation section, a transition section and an evaporation section. Each section has its own function, and the transition section can not only supplement the working medium consumption of the evaporation section in time, but also draw the working medium from the transportation section, ensuring that each section can work continuously. In the process of use, the working medium can be quickly transported to the heat dissipation area, and the transportation speed is more than 3 times of the conventional capillary transportation speed.

A uniform-temperature heat storage temperature control device is provided with a shell which is used for being in direct contact with a heat source and can conduct heat, a sealed space is arranged in the shell, a heat storage area and a uniform-temperature area are arranged in the sealed space and make contact with each other, the uniform-temperature area is a vacuum cavity which can be filled with a gas-liquid phase change working medium, and a wick is arranged on the inner surface of the vacuum cavity. The periphery of the vacuum cavity is coated with a heat storage area, and the heat storage area is a sealing cavity capable of being filled with a solid-solid phase change working medium or a solid-liquid phase change working medium. The uniform temperature area and the heat storage area are compounded and integrated, heat can uniformly reach the uniform temperature area and be stored through acceleration of heat expansion of the uniform temperature area, the heat conductivity is improved, a heat source can be rapidly cooled, and the instantaneous temperature control effect of the heat storage device is improved under the condition that the size of the control device is not changed.

According to one embodiment of the present application, an electronic assembly is provided, comprising: a circuit board comprising a plurality of connection portions having electrical conductivity; a plurality of spaced apart semiconductor integrated circuits mounted on the circuit board and electrically connected to the plurality of connection portions; a protective layer disposed on the plurality of semiconductor integrated circuits, substantially surrounding the semiconductor integrated circuits, and having a planar upper surface; and a heat spreading copper layer disposed on the protective layer, having an average thickness greater than or equal to about 3 microns, and an average grain size greater than about 0.15 microns, wherein the heat spreading copper layer can occupy substantially the same space (coextensive) in length and width as the circuit board, and the average thickness of the protective layer can be equal to or greater than the height of the plurality of spaced apart semiconductor integrated circuits.

A vehicle heat shield has a first high thermal resistance composite layer, a second high thermal resistance composite layer, and a gap between the first and second layers. The gap disrupts direct heat transfer between the layers. Also, the gap acts as a thermal insulator to prevent heat buildup.

The invention belongs to the technical field of intelligent networked automobile electronics, and particularly relates to an intelligent vehicle-mounted terminal, which comprises an SiP core module, a main processor bare crystal, a high-bandwidth memory stack, a nonvolatile storage bare crystal, a power management integrated circuit bare crystal, a Beidou double-frequency positioning navigation bare crystal, an inertial measurement unit and a wireless communication bare crystal are integrated in the SiP core module, wherein the high-bandwidth memory stack, the nonvolatile storage bare crystal, the power management integrated circuit bare crystal, the Beidou double-frequency positioning navigation bare crystal, the inertial measurement unit and the wireless communication bare crystal are vertically stacked on the main processor bare crystal through a silicon through hole technology. The heat dissipation system comprises a vapor chamber, a heat dissipation fin group arranged on the vapor chamber and a centrifugal fan; and the metal shell is used for accommodating the SiP core module and the heat dissipation system, and an external interface is arranged on the metal shell. Functional units such as calculation, storage, communication, positioning and inertial navigation are integrated, the size is greatly reduced, the reliability is improved, an active heat dissipation scheme that the vapor chamber is combined with the centrifugal fan is adopted, and performance degradation caused by overheating is avoided.

Embodiments provide a battery pack. The battery pack includes: a battery pack case including a bottom plate, where the bottom plate includes a first cooling channel; a battery cell assembly on the battery pack case; and a cover coupled to the side wall and including a second cooling channel, in which the battery cell assembly includes a plurality of battery cells arranged in a first direction parallel to the mounting surface of the bottom plate and a plurality of heat sinks located between the plurality of battery cells, and each of the plurality of heat sinks includes a contact portion overlapping the plurality of battery cells in the first direction, a heat dissipation portion connected to the contact portion and facing the cover, and a protection portion overlapping the contact portion in the first direction.