3650results about How to "Reduce thermal resistance" patented technology

Provided is an LED lighting system with a smaller heat resistance of the LED, which can be produced by simpler mounting steps and is capable of three-dimensionally arranging the LEDs depending on required directivity of each system. A plurality of LEDs 2 are mounted on an FPC 1 which has a radial shape and can be flat when developed. The LEDs 2 connected by printed wiring to each other and linked to terminals 3 and 4 are attached on a surface of a core 5 made of a material having a high thermal conductivity. Heat generated at a p-n junction of the LEDs 2 is transmitted to the core 5 via the FPC 1 and a thermal-conductive adhesive.

A power semiconductor device, having a first semiconductor region, and a second semiconductor region; mounted with a first electrode pad on a semiconductor substrate main surface at the inside surrounded by the third semiconductor region, mounted in the second semiconductor region, and a multilayer substrate having first and second wiring layers, to take out an electrode of the semiconductor chip; joining the first wiring layer part for the first electrode, mounted on the multilayer substrate, in a region opposing to the semiconductor substrate main surface at the inside surrounded by the third semiconductor region, and the first electrode pad, by a conductive material; joining the first wiring layer part for the first electrode, and the second wiring layer at a conductive part; and extending the second wiring layer to the outside of a region opposing the semiconductor substrate main surface at the inside surrounded by the third semiconductor region.

A thermally-conductive, electrically insulative interface for conductively cooling a heat-generating source, such as an electronic component, having an associated thermal dissipation member such as a heat sink. The interface is provided as a cured sheet of a curable material formulated as a blend of a curable silicone binder, and a particulate alumina, i.e., aluminum oxide (Al2O3), filler. The interface is observed to exhibit a thermal conductivity of at least about 0.8 W/m-K and a wet dielectric breakdown strength of at least about 475 Vac/mil.

A battery pack thermal management system for use in an electric car. The battery pack thermal management system includes a plurality of thermistors connected to a plurality of cells of a battery pack. A battery monitor board is connected to the thermistors. The system also includes a manifold and a plurality of cooling tubes connected to the manifold. A tube seal plug is arranged over an end of the cooling tube and an end fitting is arranged on an end of the cooling tube. The thermal management system will cool the battery pack to predetermined temperatures to increase the longevity of the battery pack within the electric vehicle.

A millimetre-wave radio antenna module (600) comprising: an antenna substrate (603) having an antenna (602) provided on a face thereof; and a semiconductor die (601) comprising a wireless system IC, the die mounted on a face of the antenna substrate and configured to provide a signal to the antenna, wherein a ball grid array (605) is formed on a face of the antenna substrate for mounting the antenna module to a circuit board, the ball grid array being configured to define an air dielectric gap (606) between the antenna and the circuit board.

A light emitting diode (LED) apparatus for mounting to a heat sink having a front surface with an opening therein is disclosed. The apparatus includes a sub-mount, at least one LED die mounted on the sub-mount, and a thermally conductive slug having first and second areas. The first area is thermally coupled to the sub-mount and the second area has a post protruding outwardly therefrom. The post is operably configured to be received in the opening in the heat sink and to secure the LED apparatus to the heat sink such that the second area is thermally coupled to the front surface of the heat sink. Other embodiments for mounting an LED apparatus utilizing adhesive thermally conductive material, spring clips, insertion snaps, or welding are also disclosed.

A power semiconductor module with its thermal resistance and overall size reduced. Insulating substrates with electrode metal layers disposed thereon are joined to both the surfaces of a power semiconductor chip by using, for example, soldering. Metal layers are disposed also on the reverse surfaces of the insulating substrates and the metal layers are joined to the heat spreaders by using brazing. Heat radiating fins are provided on the heat radiating surface of at least one of the heat spreaders. The heat radiating side of each of the heat spreaders is covered by a casing to form a refrigerant chamber through which refrigerant flows to remove heat transmitted from the semiconductor chip to the heat spreader.

A heat slug or spreader is attached directly to a surface of the die in a ball grid array (BGA) package. The heat spreader roughly conforms to the topological profile of the die, underlying substrate, and electrical interconnections between the die and the substrate, such as bond wires. The outer portion of the heat spreader substantially cover the outer portion of the substrate, or alternatively, cover only those portions extending in laterally from the sides of the chip and not the corners. An encapsulant completely covers the heat spreader and die.

Mounting systems are provided for bringing a heat exchanger from a server rack into thermal contact with a heat exchanger from an electronics server. An engaging force is applied to the two heat exchangers to create thermal communication there between. A mounting mechanism is configured to isolate the engaging force applied to the two heat exchangers. The mounting mechanism may include an interlocking mechanism that prevents transfer of the applied force to the rest of the electronics server to lessen the possibility of disconnecting the electrical connections between the electronics server and the rack, and/or lessening mechanical stresses transferred to the electronics server and the rack chassis. The mounting mechanism also may be coupled to the electronics server locking mechanism such that the action of locking the electronics server into the rack causes the heat exchangers to engage in thermal contact.

A heat pipe with a nanostructured wick is disclosed, with the method of forming the nanostructured wick on a metal substrate. The wicking material is a pattern of metallic nanostructures in the form of bristles or nanowires attached to a substrate, where the bristles are substantially freestanding.

A device, method, and system for a fluid cooled channeled heat exchange device is disclosed. The fluid cooled channeled heat exchange device utilizes fluid circulated through a channel heat exchanger for high heat dissipation and transfer area per unit volume. The device comprises a highly thermally conductive material, preferably with less than 200 W/m-K. The preferred channel heat exchanger comprises two coupled flat plates and a plurality of fins coupled to the flat plates. At least one of the plates preferably to receive flow of a fluid in a heated state. The fluid preferably carries heat from a heat source (such as a CPU, for example). Specifically, at least one of the plates preferably comprises a plurality of condenser channels configured to receive, to condense, and to cool the fluid in the heated state. The fluid in a cooler state is preferably carried from the device to the heat source, thereby cooling the heat source.

A thermoelectric device with an improved thermal efficiency has an object to be heated or cooled having a surface, at least one electrically conductive lower pad bonded directly to the surface of the object using a thermally conductive dielectric material, at least one thermoelectric element coupled on one end to the electrically conductive pad, at least one electrically conductive upper pad coupled to an opposite end of the thermoelectric element, and electrical power connections coupled to the device.

A mounting system provides mechanisms and form factors for bringing a heat exchanger from a server rack into thermal contact with a heat exchanger from a electronics server. To ensure good thermal contact, pressure is applied between the two heat exchangers, the rejector plate and the chassis cold plate. The mounting mechanism used to engage and disengage the heat exchangers is configured to isolate the force applied to the two heat exchangers. The mounting mechanism includes an interlocking mechanism that prevents transfer of the applied force to the rest of the electronics server. Without isolating this force, the force is applied to the electronics server and/or the rack chassis, possibly disconnecting the electrical connections between the electronics server and the rack, as well as providing mechanical stress to the electronics server and the rack chassis. The mounting mechanism is also coupled to the electronics server locking mechanism such that the action of locking the electronics server into the rack causes the heat exchangers to engage in thermal contact. This is a fail safe procedure since no separate process is required to engage the electronics server cooling loop.

A method of wafer or substrate bonding a substrate made of a semiconductor material with a substrate made from a metallic material is disclosed. The method allows the bonding of the two substrates together without the use of any intermediate joining gluing, or solder layer(s) between the two substrates. The method allows the moderate or low temperature bonding of the metal and semiconductor substrates, combined with methods to modify the materials so as to enable low electrical resistance interfaces to be realized between the bonded substrates, and also combined with methods to obtain a low thermal resistance interface between the bonded substrates, thereby enabling various useful improvements for fabrication, packaging and manufacturing of semiconductor devices and systems.

A light emitting module with improved optical functionality and reduced thermal resistance is described, which comprises a light emitting device (LED), a wavelength converting (WC) element and an inorganic optically-transmissive thermally-conductive (OTTC) element. The WC element is capable of absorbing light generated from the LED at a specific wavelength and re-emitting light having a different wavelength. The re-emitted light and any unabsorbed light exits through at least one surface of the module. The OTTC is in physical contact with the WC element and at least partially located in the optical path of the light. The OTTC comprises one or more layers of inorganic material having a thermal conductivity greater than that of the WC element. As such, a compact unitary integrated module is provided with excellent thermal characteristics, which may be further enhanced when the OTTC provides a thermal barrier for vertical heat propagation through the module but not lateral propagation.

A circuit board assembly has a circuit board coupled to a support plane and defining a space between the circuit board and the support member. A circuit board component mounts to the circuit board and is oriented within the space defined by the circuit board and the support plane. A heat pipe assembly, located within the defined space, has a relatively high thermal conductivity, compared to other thermally conductive materials, and transfers heat from the circuit board component to the support plane or carrier tray associated with the circuit board. The heat pipe assembly has an input portion that contacts the circuit board component and an output portion that contacts the support plane. The heat pipe assembly also has a compliant portion having a lower stiffness relative to the stiffness of either the input portion or the output portion. The compliant portion of the heat pipe assembly allows for displacement of the input portion relative to the output portion to limit the amount of stress generated by the heat pipe assembly on the circuit board component.

The present invention is an inverted III-nitride light-emitting device (LED) with enhanced total light generating capability. A large area device has an n-electrode that interposes the p-electrode metallization to provide low series resistance. The p-electrode metallization is opaque, highly reflective, and provides excellent current spreading. The p-electrode at the peak emission wavelength of the LED active region absorbs less than 25% of incident light per pass. A submount may be used to provide electrical and thermal connection between the LED die and the package. The submount material may be Si to provide electronic functionality such as voltage-compliance limiting operation. The entire device, including the LED-submount interface, is designed for low thermal resistance to allow for high current density operation. Finally, the device may include a high-refractive-index (n>1.8) superstrate.

A backlight module and heat dissipation structure thereof. The heat dissipation structure is used for a backlight module which comprises a circuit board having a through hole with a light emitting diode (LED) corresponding thereto and disposed on one side of the circuit board. The heat dissipation structure comprises a heat conducting portion thermo-conductively connected to the LED and positioned in the through hole, a thermal conductive element disposed between the heat conducting portion and the LED, and a heat dissipating portion thermo-conductively connected to the heat conducting portion. Heat from the LED is conducted through the thermal conductive element and the heat conducting portion to the heat dissipation portion.

The electronic component package (10) of the present invention includes a sealed chamber; a liquid or gel (20) contained in the sealed chamber; at least one electronic component (12) disposed in the sealed chamber in physical and thermal contact with the liquid or gel (20); and at least one electrical conductor electrically coupled to the electronic component and extending out of the sealed chamber. The electronic component(s) (12) may include any one or combination of a radiation emitter, a thermal or optical sensor, a resistor, and a microprocessor or other semiconductor component.

A pressure operated valve is provided including an adjusting device, a spring and a vent connection. The adjusting device is axially movably arranged in a pressure chamber defined in the valve and comprises a valve body and a pressure intensifier. A space between the valve body and valve face defines a valve passage cross section. The spring is operatively arranged for holding the pressure intensifier in a floating arrangement in the pressure chamber. The pressure intensifier has a first side exposed to a pressure in the pressure connection opening and a second side facing away from the pressure connection opening. The second side of the pressure intensifier and the adjusting device define a low pressure chamber within the pressure chamber. The vent connection is an inflow restrictor arranged between the lower pressure chamber and a space having a lower pressure than the low pressure chamber.

A novel plate fin heat exchanger adapted for high and low velocity fluid flows for dissipating heat from a heat generating component. The heat exchanger comprises an array of fins being affixed to and in thermal communication with a thermally conductive base, wherein the fins are arranged in a fan tail configuration for minimizing flow bypass, and further providing reduced thermal resistance for fluid passing through the fin field. The fins are affixed to and in thermal communication with the base at an acute angle, such that the effective width of the array of fins exceeds the width of the base. The enlarged effective width of the fin array in comparison to conventional heat exchanger provides an increased volume for fluid flow, thereby allowing a greater volume of fluid to enter the fin field and a greater surface area of plate fins for cooling the fluid passing through the heat exchanger. In addition, the heat exchanger comprises a fin density of at least ten fins per inch or greater of base length thereby providing a narrow channel heat exchanger with a fan tail. The aspect ratio of the individual channels between the fins, as compared to parallel fins affixed perpendicular to the base through an extrusion method, generates a reduced pressure drop across the heat exchanger. Accordingly, the heat exchanger of the present invention expands the envelope of cooling performance provided by fluid flow over an array of thermally conductive plates.