The invention discloses an optical module packaging structure, which includes a top cover, a bottom plate and a metal shell. An accommodating cavity for accommodating an electrical coupler is formed in the bottom plate, a bottom groove is formed in the bottom of the metal shell for accommodating a circuit board and the bottom plate, and the bottom plate is attached to the surface, away from the top of the metal shell, of the circuit board; and a top groove is formed in the top of the metal shell, the top cover is used for covering the top groove, a part of the groove bottom of the top groove forms a chip carrying part for carrying a chip, and a through groove communicating the bottom groove with the top groove is formed in the position near the chip carrying part. According to the opticalmodule packaging structure, the chip makes a direct contact with the metal shell, a metal heat dissipation channel to the metal shell is formed, heat generated by chip operation diffuses to the outerside of the metal shell through the heat dissipation channel, an air gap between the chip and the metal shell is removed, thermal resistance between the chip and the shell is effectively reduced, andheat dissipation of an optical module is enhanced.