160results about How to "Reduce thermal resistance" patented technology

A semiconductor chip packaging structure comprising a dielectric film having one or more through holes aligned with the one or more contact pads of at least one power semiconductor chip. A patterned electrically conductive layer adjacent to the dielectric film has one or more electrically conductive posts which extend through the one or more though holes aligned with the contact pads to electrically couple the conductive layer to the contact pads. In certain embodiments, one or more air gaps may be formed between the dielectric film and the active surface of the at least one power semiconductor chip. Methods for fabricating the semiconductor chip packaging structure are also disclosed.

A LED chip is bonded on a large submount serving as a heat sink. The submount is punched out from a thin metal sheet together with two other sections of lead frames for the LED and held together with insulating material. The planar structure makes the package thin. A transparent lens may be mounted over the submount. More than one LED of same or different color can be mounted on the submount.

A light source having a lead frame, a body, and a plurality of dies, each die having an LED thereon is disclosed. The body includes a top surface, a bottom surface and a plurality of side surfaces. The lead frame includes first, second, and third sections, the first section includes a die mounting area having a first protrusion that passes through the body and terminates in a pad on the bottom surface. The second and third sections each include a protrusion that is bent to form first and second leads that run along one of the side surfaces. Each die is bonded to the die mounting area such that a first contact is electrically connected to the die mounting area, and a second contact is connected to one of the second and third sections. The first protrusion of the first section provides improved heat transfer.

A light emitting module comprises a light emitting device (LED) mounted on a high thermal dissipation sub-mount, which performs the traditionally function of heat spread and the first part of the heat sinking. The sub-mount is a grown metal that is formed by an electroplating, electroforming, electrodeposition or electroless plating process, thereby minimising thermal resistance at this stage. An electrically insulating and thermally conducting layer is at least partially disposed across the interface between the grown semiconductor layers of the light emitting device and the formed metal layers of the sub-mount to further improve the electrical isolation of the light emitting device from the grown sub-mount. The top surface of the LED is protected from electroplating or electroforming by a wax or polymer or other removable material on a temporary substrate, mould or mandrel, which can be removed after plating, thereby releasing the LED module for subsequent processing.

Solid state lamp or bulb structures are disclosed that can provide an essentially omnidirectional emission pattern from directional emitting light sources, such as forward emitting light sources. The present invention is also directed to lamp structures using active elements to assist in thermal management of the lamp structures and in some embodiments to reduce the convective thermal resistance around certain of the lamp elements to increase the natural heat convection away from the lamp. Some embodiments include integral fans or other active elements that move air over the surfaces of a heat sink, while other embodiments comprise internal fans or other active elements that can draw air internal to the lamp. The fan's movement of the air over these surfaces can agitate otherwise stagnant air to decrease the convective thermal resistance and increasing the ability of the lamp to dissipate heat generated during operation.

The invention discloses a liquid-cooled radiation structure, which comprises a substrate and at least one radiation fins, wherein the substrate is provided with at least one liquid input pipeline, at least one liquid output pipeline and at least one groove; the inner side of the groove is communicated with the liquid input pipeline and the liquid output pipeline to form an opening respectively; in addition, the radiation fin is provided with a plate body which can be embedded into and seal the groove; and the surface of the plate body is provided with a plurality of flow deflectors which can be embedded into the groove. The flow deflectors and the groove form a plurality of runners allowing the shunting of liquid, and the liquid flowing through the liquid input pipeline and the liquid output pipeline can flow among the plurality of runners by flowing in and out of the two openings of the groove, so that continuous cyclic radiation can be realized in the substrate.

A heat dissipating device includes a flat evaporator, a vapor pipe, a liquid pipe, and a condenser. The flat evaporator consists of a bottom plate, a porous material, and a top lid. The porous material is located on the bottom plate and provided with vapor flow passages. The vapor pipe and liquid pipe are communicably connected at respective one end to a vapor port and a liquid port on the evaporator, and at the other end to two sides of the condenser. The evaporator has simple structure and low manufacturing cost, and can fully effectively bear on an electronic chip to enable reduced room needed for installing the evaporator and reduced thermal resistance during heat dissipation. The heat dissipating device can be used to dissipate heat produced by computer chips, and to cool LED illuminating devices, chips for communication devices, high-power heat-producing elements in military, medical, aerial, and aerospace apparatuses.

A semiconductor package is disclosed. Particularly, a multi-chip package is disclosed, which can stably maintain insulation between a plurality of semiconductor chips and effectively release heat to the outside. The semiconductor package includes an insulation layer including a diamond layer formed by a chemical vapor deposition method between a lead frame or a heat sink and the semiconductor chips disposed thereon.

The invention discloses a light emitting diode (LED) chip with a vertical structure adopting electric conduction polymer transferring and a manufacturing method thereof, the method has the following steps: evaporating an ITO transparent conductive layer on the LED epitaxial wafer of a sapphire substrate; evaporating Al, Ag or Pt as a reflecting layer on the transparent conductive layer; coating conductive adhesive with high heat conductivity on the reflecting layer; bonding the LED epitaxial wafer on the high heat conductivity substrate by the conductive adhesive; adopting inductively coupled plasma (ICP) or reactive ion etching (RIE) n-GaN, an active layer and p-GaN; etching off the undoped GaN layer by adopting KOH solution and coarsing the n-GaN surface; evaporating n side electrode and p side electrode. The proposal improves the heat dissipation efficiency of products and the comprehensive performance of the LED chip.

An insulating circuit board includes an insulating plate, a circuit board joined to a first surface of the insulating plate, and a metal plate joined to a second surface of the insulating plate. The circuit board is formed from an Al alloy having a purity of 99.98% or more or pure Al, and the metal plate is formed from an Al alloy having a purity of 98.00% or more and 99.90% or less. The thickness (a) of the circuit board is 0.2 mm or more and 0.8 mm or less, the thickness (b) of the metal plate is 0.6 mm or more and 1.5 mm or less, and the thicknesses satisfy the expression of a/b≦1. An insulating circuit board having a cooling sink includes cooling sink joined via a second solder layer. The second solder layer contains Sn as its main component, and has a Young's modulus, 35 GPa or more, a 0.2% proof stress of, 30 MPa or more, and a tensile strength of, 40 MPa or more. The cooling sink is formed from, pure Al or an Al alloy.

The invention discloses a manufacturing method of a panel-type heat pipe, comprising the following steps: providing a mould which is provided with a first cavity and a plurality of second cavities communicated with the first cavity; providing first metal powder, second metal powder and binder mixed with the metal powder; providing a plurality of deorienting fillers arranged at interval, causing the fillers to be arranged in the first cavity and the second cavities and to be arranged at interval with each inner wall surface of the first cavity and the second cavities; injecting the first metalpowder and the second metal powder into the first cavity and the second cavities of the moulds in order; removing the deorienting fillers so as to form a flake; sintering the flake at high temperature; causing the first metal powder to form the continuous outer cavity of the panel-type heat pipe; causing the second metal powder to form continuous capillary structure formed on the inner surface ofthe outer cavity and a plurality of porous shores; then forming a brown embryo; vacuumizing the brown embryo, injecting operating fluid, and processing a seal to obtain the panel-type heat pipe.

A heat dissipation structure installed on a computer central processing unit or a heat generating device, has a thermal conductive base, at least one heat pipe and a heat sink. The thermal conductive base has a supporting part and a first interlocking part. The supporting part allows the heat pipe mounted thereon. The heat sink has a plurality of fins configured with a receiving slot and a second interlocking part. The second interlocking part is engaged with the first interlocking part, while the receiving slot and the supporting part of the thermal conductive base enclose the heat pipe therein to form the heat dissipation structure. By the connection between the thermal conductive pipe and the heat sink, the contact intensity between various devices is increased, such that the heat conduction performance is improved.

The invention relates to an LED radiating substrate and a manufacturing method thereof. The radiating substrate is used for providing LED light source radiation, reducing heat resistance, enlarging radiating channel and simultaneously providing reliable testing points of working temperature of the LED light source. The radiating substrate is designed according to the LED light source with thermoelectric separation; the radiating substrate adopts a copper base copper-clad plate; all copper foils and heat conducting and insulating layers in a central bonding pad area of the LED are removed; simultaneously a fixed hole is respectively opened at the two sides of the central bonding pad area of the LED and is used for fixing the LED radiating substrate; then a flame retardant layer is printed and tin is plated; and finally an arc-shaped groove is arranged at a position close to the central bonding pad of the LED and is used for measuring junction temperature when the LED light source works. An electric bonding pad of the LED light source adopts different shapes to discriminate the positive electrode and the negative electrode.

The preparation process of welded heat radiator includes the following steps: 1) preparing base seat, fins and solder with welding flux; 2) setting the solder between the base seat and fins; 3) heating the solder to connect the fins to the base seat and to form the heat radiator; 4) maintaining the temperature of heat radiator to lower the temperature to the smelting point of the solder; and 5) cooling the heat radiator to lower the temperature to room temperature. The said preparation process can eliminate holes and bubbles produced during welding and make the crystal grain of the solder become large to lower the heat resistance.

The embodiment of the invention discloses an LED module and a manufacturing method thereof. The LED module comprises high thermal conductivity ceramic substrate, an LED chip welded onto the substrate through eutectic bonding and flip chip bonding, a dam formed by performing injection molding on the periphery of the LED chip, a fluorescent glue layer formed by fluorescent glue arranged in the dam in a coating manner, and an optical structure layer covering the fluorescent glue layer. By adopting the technical means that the LED chip is welded on the high thermal conductivity ceramic substrate through eutectic bonding and flip chip bonding, the LED module achieves the technical effects of low thermal resistance, high heat dispersion, good luminescence property of products and long service life, has no gold thread, does not adopt solid crystal glue package, and has the characteristics of high brightness, high lighting effect, high reliability, low thermal resistance, good color uniformity and the like.

The invention discloses a preparing method for a graphene metal heat conduction gasket. The preparing method includes the following steps that firstly, a graphene oxide dispersion solution is prepare, graphene oxide is dispersed into a solvent, a modifying agent is used for conducting surface treatment on the graphene, and the graphene oxide dispersion solution is mixed to be acid; secondly, foam metal is pretreated, wherein an oxide layer is formed on the surface of the foam metal through electrochemical oxidation; thirdly, the graphene-loaded foam metal is prepared, wherein the graphene oxide dispersion solution and a reducing agent are mixed into a mixed solution, the foam metal is immersed in the mixed solution, and sealing heat treatment is conducted under the temperature ranging from 80 DEG C to 350 DEG C; and fourthly, the graphene heat conduction gasket is prepared, wherein after the graphene-loaded foam metal is filled with a paste heat conduction material, the heat conduction material is cured, and the graphene-loaded foam metal filled with the heat conduction material is pressed into a sheet. The obtained graphene metal heat conduction gasket is high in heat conduction coefficient and can be well applied to large-power LED illumination lamps.

The invention provides a radiant heat exchange plate component. The radiant heat exchange plate component comprises a metal radiant plate, a heat exchange component and an outer cover. A nonmetal heat conduction layer is arranged between the metal radiant plate and the heat exchange component. The heat exchange component and the metal radiant plate contact with the upper side and the lower side of the nonmetal heat conduction layer respectively. Through heat conduction of the nonmetal heat conduction layer arranged between the metal radiant plate and the heat exchange component, heat resistance between the metal radiant plate and the heat exchange component can be reduced; through surface heat conduction, the metal radiant plate can acquire an uniform temperature field, so that low temperate of the surface of the metal radiant plate can be maintained through proper increase of water temperature of an refrigerant water inlet in a refrigeration working condition (or high temperature of the surface of the metal radiant plate can be maintained through proper reduction of the water temperature of the refrigerant water inlet in a heating working condition), and working efficiency of a heat pump unit can be improved.

The invention discloses an optical module packaging structure, which includes a top cover, a bottom plate and a metal shell. An accommodating cavity for accommodating an electrical coupler is formed in the bottom plate, a bottom groove is formed in the bottom of the metal shell for accommodating a circuit board and the bottom plate, and the bottom plate is attached to the surface, away from the top of the metal shell, of the circuit board; and a top groove is formed in the top of the metal shell, the top cover is used for covering the top groove, a part of the groove bottom of the top groove forms a chip carrying part for carrying a chip, and a through groove communicating the bottom groove with the top groove is formed in the position near the chip carrying part. According to the opticalmodule packaging structure, the chip makes a direct contact with the metal shell, a metal heat dissipation channel to the metal shell is formed, heat generated by chip operation diffuses to the outerside of the metal shell through the heat dissipation channel, an air gap between the chip and the metal shell is removed, thermal resistance between the chip and the shell is effectively reduced, andheat dissipation of an optical module is enhanced.

A light emitting device is proposed, which emits light while connected to the power. The light emitting device includes a light emitting element having at least two electrodes disposed at the side of the light output surface thereof; and a base member having a recess and lead portions corresponding to the electrodes, the light emitting element being mounted on the base member and received in the recess, wherein the light output surface faces toward opening of the recess that becomes smaller while approaching the light output surface, and the electrodes are respectively in electrical connection with the lead portions that extend from the connection positions to outer edge of the base member for power connection. The light emitting device of the present invention has advantages of short current path, low series thermal resistance and low cost. In addition, the depth of the recess can further be increased to improve light collecting efficiency.

The invention discloses a die bonding material for LED encapsulation and a preparation method thereof. The die bonding material comprises tin-based soldering powder, high-thermal-conductivity particles and die-bonding solder paste, wherein the high-thermal-conductivity particles include one or two substances selected from diamond particles, carbon nanotubes and SiC, and the volume of the high-thermal-conductivity particles accounts for 0.1-70% of the total volume of the tin-based soldering powder and the high-thermal-conductivity particles. As the die bonding material of the invention contains the high-thermal-conductivity particles, high thermal conductivity can be achieved on the premise of meeting the bonding strength between an LED chip and a heat sink and not affecting the electrical performance, and the thermal conductivity is several times or even dozens of times that of the existing LED die bonding solder. By adopting the die bonding material of the invention, the thermal resistance of power LED devices is reduced effectively, the heat dissipation capacity of LED chips is improved, the junction temperature of LED chips is reduced, and the service life of LED devices and application products is increased.

The invention relates to a cooling method and device for a deep-sea high-power motor, which is characterized in that it includes a heat exchanger composed of a motor shell and a heat-exchange tube. The seawater in the heat exchange tube exchanges heat with the fluid medium (oil or water) in the motor casing to take away the heat, and the fluid medium in the casing cools the motor; the seawater in the heat exchange tube is flowing; The motor is coaxial and is realized by a pump submerged in seawater; the device for realizing the method includes: a motor casing, a heat exchange tube, a pump chamber installed on the front cover of the motor, an output shaft connected to the output end through a key, and installed on the pump The impeller in the room is installed on the front end cover of the pump chamber, and it is characterized in that: the motor casing is a double-layer casing, one end of the heat exchange tube communicates with seawater through the opening on the casing, and the other end passes through the opening on the casing through the connecting pipe 1. The front end cover of the pump chamber communicates with the inlet of the impeller; the outlet of the pump chamber directly communicates with sea water, and the impeller is directly mounted on the motor shaft through a key. The invention has the advantages of simple structure, high heat exchange efficiency and high reliability, and can make full use of existing motors for transformation. Therefore, it can effectively solve the cooling problem of deep-sea high-power motors and meet the requirements of long life and thermal stability.

A heat dissipation structure and water block having the same are provided in the present disclosure. The heat dissipation structure includes a vapor chamber and a heat dissipation component. A through opening is disposed on and through the vapor chamber, and the vapor chamber includes a heated surface. The heat dissipation component includes a base plate and multiple fins extended from the base plate, and the base plate includes a bottom surface. The heat dissipation component is configured corresponding to the through opening, and a coplanar structure is formed by the bottom surface and the heated surface. Heat conductive and heat dissipation performances of the heat dissipation structure and the water block are thereby improved.

The invention provides a common LED lamp bulb, which comprises a core column and a lamp holder which are in sealing connection with a glass envelope, wherein the bottom part of a hollow metal heat-conducting lamp column is connected with the core column through a heat-conducting adhesive; the side wall of the top part of the hollow metal heat-conducting lamp column is embedded with LED lamp beads; the tail part of the glass envelope is connected with the lamp holder through an external metal radiation piece and a plastic transitional piece; the heat-conducting adhesive is arranged between the tail part of the glass envelope and the metal radiation piece; a heat-conducting gas is charged in the glass envelope. The common LED lamp bulb solves a radiation problem that a component formed by assembling a plurality of groups of LED lamp beads influences the service life of the LEDs in use when a common lamp envelope is adopted.

The invention provides an energy-saving RGB-LED package, a package module and a display screen thereof. The energy-saving RGB-LED package comprises a substrate and a light-emitting unit arranged on the substrate; the light-emitting unit comprises a red light chip, a green light chip and a blue light chip; the positive electrode and the negative electrode of the red light chip are separately led out; and the green light chip and the blue light chip share one positive electrode or share one negative electrode. The energy-saving RGB-LED package module comprises the energy-saving RGB-LED package, and at least two light-emitting units are arranged on the energy-saving RGB-LED package. The energy-saving RGB-LED display screen includes the energy-saving RGB-LED package. The energy-saving RGB-LED package, the package module and the display screen thereof provided by the invention change the traditional chip driving mode, separate the driving circuits of the red light chip, the blue light chip and the green light chip, provide a separate power driver for the red light chip, and reduce the driving voltage, thereby greatly reducing the power consumption.

The invention relates to a flat panel liquid absorption core with a complex structure and a manufacturing method of the flat panel liquid absorption core. Based on the additive manufacturing technology, the liquid absorption core with the trans-scale three-dimensional step hole complex structure is designed, the complex hole structure and the capillary structure of the liquid absorption core are integrated, the heat dissipation capacity of parts is effectively promoted, the heat resistance can be reduced obviously, and the heat transfer efficiency is improved. Through three-dimensional software modeling, the metal 3D printing technology is adopted to manufacture the liquid absorption core with the complex structure, the liquid absorption core has the characteristics that structural design is flexible, the manufacturing method is simple and quick, the input cost is low, consumables are less, the liquid absorption core can be applied to heat dissipation components such as various forms of heat pipes and soaking plates, and heat dissipation and cooling of equipment with high heat flow density in the fields of electronics, machines and aerospace are satisfied.

The invention discloses an integrated manufacturing method of a silicon base plate and a copper micro heat pipe of an LED (light emitting diode) apparatus for radiation of the LED apparatus. The method comprises the steps of: sputtering a copper seed layer with thickness within 50-300nm on the back of the silicon base plate; coating a 100-900micron thick photoresist on the copper seed layer; photoetching to obtain an electroforming mould and electroforming copper till the needed thickness is obtained; removing the photoresist and obtaining a copper microstructure on the silicon base plate; cutting a pure copper plate to obtain another pure copper sheet in same size; and obtaining a medium pouring hole by a mechanical machining method; bonding the pure copper sheet with the silicon base plate with a copper micro-channel; pouring the medium; and obtaining the silicon base plate integrated with the copper micro heat pipe. According to the method, no interface is available between the copper micro heat pipe and the silicon base plate, so that no interface heat resistor with large heat resistance is not available. The whole heat resistance of the apparatus is small, and the integrated apparatus is stable in heat transfer, the reliability is improved and service life of the apparatus is prolonged.

The invention relates to a heat pipe type high-power LED module. A closed cavity is formed by adopting a metal-base PCB (Printed Circuit Board) circuit board and a cavity wall, wherein a plurality of LED luminous chips are welded on the surface of the metal-base PCB circuit board, and latticed ribs are arranged on the inner wall of the metal-base PCB circuit board; the cavity wall comprises a plurality of radiating column bodies with hollow cavities, and a great quantity of radiating fins are arranged on the outer wall of each radiating column body. In the other implementation mode, the inner walls of the radiating column bodies and/or the metal-base PCB circuit board and the column surface of a supporting upright column are provided with capillary structures, the inner wall of the metal-base PCB circuit board is connected with a plurality of capillary columns, and the capillary columns extend into the hollow cavities of the radiating column bodies. The invention simultaneously realizes the functions of heating (lighting), transferring heat and radiating heat by using heat pipes and overcomes the defects that when the traditional high-power LED luminous chips work in a high-temperature environment, the heat radiation is difficult, and the service life and the reliability are greatly reduced. The invention is suitable for street lamps, tunnel lamps, projector lamps, stage lamps, and the like and other electronic devices manufactured by high-power LED modules.

The invention discloses a photoelectric photo-thermal combined vacuum straight-through heat collector for a trench light condensing system. A selective absorption coating is coated on a half cycle of an inner copper pipe of a straight-through pipe, a battery plate is attached to the other half cycle, and the inner and outer pipes are vacuumized, so that heat loss in the pipe due to heat conduction and convection heat transfer is reduced. In a light condensing photovoltaic generating system, one side attached with the battery plate can receive focused light to generate electricity, and one side coated with the selective coating can absorb shielded direct solar energy to reduce the surface temperature of the battery plate through water circulation in the copper pipe; and the generated hot water can be stored in a water tank to be used as domestic hot water. The heat collector has the advantages of simple structure, low production cost, high overall efficiency and the like, and can be widely applied to the light condensing photovoltaic generating system.

Provided are a power module having an integrated power semiconductor and a method of packaging the same. The power module according to an aspect of the present invention includes a power semiconductor chip based on silicon and insulating substrates respectively disposed at both surfaces of the power semiconductor chip and including a metal pattern electrically and directly connected to the power semiconductor chip.

The invention discloses a solar heat-collecting core which comprises a heat collecting plate and a bottom plate overlapped below the heat collecting plate. A water flowing channels is arranged between the heat collecting plate and the bottom plate; the peripheries of the heat collecting plate and the bottom plate are sealed; and the water flowing channel is formed between the heat collecting plate and the bottom plate to make cold water in the water flowing channel be directly heated by the heat collecting plate. Additionally, the heat collecting plate also comprises a plurality of protruding parts. The invention also provides a solar water heater and a heat collector of the solar water heater. The water flowing channel of the solar heat-collecting core is directly formed by the heat collecting plate and the bottom plate, cold water to be heated in the water flowing channel can be directly heated by the heat collecting plate, thus the heat transfer efficiency is remarkably improved. After the protruding parts are arranged on the heat collecting plate, the light area of the heat collecting plate is enlarged, so that the photo-thermal converting efficiency is improved; on the other hand, the arrangement of the protruding parts can enlarge the heat-exchanging area between the heat collecting plate and cold water, thereby the heat conducting efficiency can be further improved.