263results about How to "Reduce heat resistance requirements" patented technology

Provided is an LED lighting system with a smaller heat resistance of the LED, which can be produced by simpler mounting steps and is capable of three-dimensionally arranging the LEDs depending on required directivity of each system. A plurality of LEDs 2 are mounted on an FPC 1 which has a radial shape and can be flat when developed. The LEDs 2 connected by printed wiring to each other and linked to terminals 3 and 4 are attached on a surface of a core 5 made of a material having a high thermal conductivity. Heat generated at a p-n junction of the LEDs 2 is transmitted to the core 5 via the FPC 1 and a thermal-conductive adhesive.

PCT No. PCT / JP96 / 01794 Sec. 371 Date Dec. 8, 1997 Sec. 102(e) Date Dec. 8, 1997 PCT Filed Jun. 28, 1996 PCT Pub. No. WO97 / 01600 PCT Pub. Date Jan. 16, 1997A resin composition comprising a polypropylene resin, a polyphenylene ether resin and a compatibility agent wherein dispersion particles comprising the polyphenylene ether resin (b) are dispersed in a matrix comprising the polypropylene resin (a), a minor diameter of the dispersion particles is 2 mu m or less, and the ratio of major diameter / minor diameter is 1-10.

A power electronic package includes: first and second high thermal conductivity insulating non-planar substrates; and multiple semiconductor chips and electronic components between the substrates. Each substrate includes multiple electrical insulator layers and patterned electrical conductor layers connecting to the electronic components, and further includes multiple raised regions or posts, which are bonded together so that the substrates are mechanically and electrically connected. The number, arrangement, and shape of the raised regions or posts are adjusted to have mechanical separation between the substrates. The electrical conductor layers are separated and isolated one another so that multiple electric circuits are provided on at least one of the substrates.

A power electronic package includes: first and second high thermal conductivity insulating non-planar substrates; and multiple semiconductor chips and electronic components between the substrates. Each substrate includes multiple electrical insulator layers and patterned electrical conductor layers connecting to the electronic components, and further includes multiple raised regions or posts, which are bonded together so that the substrates are mechanically and electrically connected. The number, arrangement, and shape of the raised regions or posts are adjusted to have mechanical separation between the substrates. The electrical conductor layers are separated and isolated one another so that multiple electric circuits are provided on at least one of the substrates.

Propylene resin beads for molding expansion molded articles having improved high temperature resistance include as base resin metallocene-catalyzed copolymers of propylene with at least one or more of ethylene and prop-olefins of 4 to 20 carbon atoms. The metallocene-catalyzed propylene copolymers are isotactic random copolymers characterized by a melting point higher than 140° C. to 160° C. and a melt flow rate (MFR) of not higher than 12 g / 10 minutes, especially, 0.5 to 12 g / 10 minutes. Expansion molded articles produced by expansion molding the expanded beads have a high temperature degree of deflection which is lower than that of metallocene-catalyzed propylene homopolymers and lower than that of Ziegler-Natta-catalyzed random propylene copolymers having the same comonomers and melting point.

This invention relates to a light emitting diode lamp with high heat-dissipation capacity wherein the lamp has at -least one heat-dissipating unit, a plurality of air-flow channels being provided within each heat sink unit, an electrical insulation layer with high heat-conductivity being provided on the surface of the light emitting diode mounted with heat-dissipating unit, a metal circuit being formed on the electrical insulation layer with high heat-conductivity according to demand, at least one light emitting diode being packaged on the metal circuit such that provision of circuit board or coating of heat sink paste become unnecessary for the lamp.

A semiconductor module includes a fixed type and transformable type coolers and a flat semiconductor package sandwiched between the coolers. A relative positional relationship of the semiconductor package is fixed with the fixed type cooler, but variable with the transformable type cooler. The transformable type cooler includes a transformable member of a metal thin plate covering a coolant chamber. The semiconductor module includes a sandwiching mechanism causing the fixed type cooler to be pressed toward the transformable type cooler. Fastening adjustment screws of the sandwiching mechanism causes a pressing frame to approach a cooler body of the transformable type cooler. Therefore, the semiconductor package is pressed via the fixed type cooler while the transformable member is slightly transformed. This enhances a degree of contact between the semiconductor package and transformable member via an insulating member.

Disclosed is an inorganic-organic composite functional composition which comprises an organic resin and an inorganic matter having an organic layer which is formed in a solvent containing an ionic liquid. A formed article made of such an inorganic-organic composite functional composition can be prevented from deterioration in the physical properties even when a large amount of the inorganic matter is dispersed in the organic resin.

In a module including circuit elements, a plurality of wires, which are generally two-dimensionally formed, are multi-layered via electrically insulating material, which comprises a mixture including at least filler and electrically insulating resin. One or more circuit elements are electrically connected to the wires, and at least a part of those circuit elements is embedded in the electrically insulating material. The module further includes a heat sink member that has a higher thermal conductivity than the electrically insulating material, and that, when viewed from the direction of multi-layering the wires, overlaps with a circuit element, which is one of those circuit elements, exhibiting the highest temperature rise at least in the module.

A heat receiving member of a heat receiving device includes a coolant passage comprising a bag formed of a flexible sheet made up of a thermally stable, flexible plastic material and a metal film having high heat conductivity. In the coolant passage flows a coolant having an anti-corrosion property. A heat generating member including a main body and a terminal portion is supported by an adapter fitted in an opening formed in the flexible sheet. The main body of the heat generating member comes into direct contact with the coolant flowing in the coolant passage. Since the heat from the heat generating member is directly transferred to the coolant, the heat transfer path between the heat generating member and the coolant becomes shorter. Therefore, the heat resistance is reduced, so that the heat receiving efficiency is extremely high.

Embodiments of the present invention may include a turbocharger having a turbine, a turbine housing, a variable valve, a first plate, a second plate and a heat shield member. The turbine housing accommodates the turbine and has a flow path. The variable valve rotates about each pivot member provided thereon, thereby adjusting the flow velocity of fluid guided from the flow path to the turbine. The first plate supports one end of each pivot member, and defines the flow path. The second plate supports the other end of each pivot member or the variable valves, and defines the flow path. The heat shield member covers a wall surface of the turbine housing, and defines the flow path.

To provide a liquid crystal polyester composition which is suited for use as a material for forming a liquid crystal polyester film having excellent thermal conductivity. Also, an excellent electronic circuit board is provided by using an insulating film obtained from the liquid crystal polyester composition. The liquid crystal polyester composition of the present invention is composed of a liquid crystal polyester, a solvent and a thermally conductive filler. The thermally conductive filler is contained in the amount of 50 to 90 volume % based on the total amount of the liquid crystal polyester and the thermally conductive filler, and the thermally conductive filler contains 0 to 20 volume % of a first thermally conductive filler having a volume average particle diameter of 0.1 μm or more and less than 1.0 μm, 5 to 40 volume % of a second thermally conductive filler having a volume average particle diameter of 1.0 μm or more and less than 5.0 μm and 40 to 90 volume % of a third thermally conductive filler having a volume average particle diameter of 5.0 μm or more and 30.0 μm or less.

This invention relates to a rubber composition capable of using in a tread rubber of a tire to improve both an initial gripping performance and a running stability of the tire as compared with those of conventional tires, and more particularly to a rubber composition formed by compounding an indene-containing C9-based resin having a softening point of 130° C.-190° C. and an indene content of 30-80 mass % into a rubber component.

A resin composition which has low stress, and good adhesive property in high temperature and high moisture environments and which is useful in adhesive applications in low stress, high moisture sensitivity level electronic packages. Preferably, a flexible epoxy anhydride adduct modified solid bismaleimide and solid benzoxazine resin composition that can survive high temperature and high moisture conditions and maintain good adhesion strength and minimize the stress resulting from a coefficient of thermal expansion mismatch between a silicon die and a substrate which is Ball Grid Array solder mask or a smart card polyethylene terephthalate or silver or copper metal lead frame.

A wiring substrate with improved heat dissipation capability and with reduced size is disclosed. The wiring substrate includes a metal core substrate, a buffer layer formed so as to cover at least a part of the metal core substrate and containing a phase change material or a material with an electrocaloric effect, an electronic device mounted on a surface of a base including the metal core substrate and the buffer layer or inside the base, and a thermal via formed between the electronic device and the buffer layer.

A polyphenylene sulfide resin composition which comprises 100 parts by weight of a polyphenylene sulfide resin (A) and, compounded therewith, 1 to 100 parts by weight of glass fibers (B) having a single-fiber diameter of 12 μm or lager and has a crystallization temperature during cooling of 205° C. or lower. Also provided is a polyphenylene sulfide resin composition which comprises 100 parts by weight of a polyphenylene sulfide resin (A) and, compounded therewith, 1 to 100 parts by weight of glass fibers (B) having a single-fiber diameter of 10 to 12 μm, excluding 12 μm, has a crystallization temperature during cooling of 205° C. or lower and a chloroform-extractable content of 0.5 wt. % or lower, and gives a 2 mm-thick molded product which has a transmittance of 15% or higher for laser beam having a wavelength of 940 nm and a heat distortion temperature of 230° C. or higher under a load of 1.82 MPa.

An electrical rotary machine includes coils including element wires wound, and a core holding the coil, wherein spaces, both between the coils and the core, and between the adjacent element wires, are filled with a heat-conductive insulating resin. A method of manufacturing the electrical rotary machine includes a first step of impregnating the coils and filling the space between the adjacent element wires with the heat-conductive insulating resin, and a second step of impregnating the coils and the core and filling the space between the coils and the core with the heat-conductive insulating resin.

A connection structure that includes a region where at least a Cu—Sn intermetallic compound, a M-Sn intermetallic compound and a Cu-M-Sn intermetallic compound (where M is Ni and / or Mn) exist in a cross-section of a connecting part when the cross-section of the connecting part is analyzed with a WDX. Further, the connection structure is configured so that when the cross-section of the connecting part is evenly divided into ten sections in a vertical direction and a lateral direction, respectively, to form 100 segmentalized squares in total, a ratio of the number of squares in which two or more kinds of intermetallic compounds having different constituent elements exist to the number of all the squares, except for squares in which only a Sn-based metal component exists, is 70% or more.

The invention discloses a steam sterilizer, which comprises an evaporating pan assembly having a disinfection chamber, wherein a heating element is arranged at bottom of the disinfection chamber, an exhaust pipe is arranged on the upper part of the disinfection chamber, an exhaust control valve is arranged on the exhaust pipe; a pressure water case, wherein, the bottom of the pressure water case is connected to the bottom of the disinfection chamber through a feed pipe, a water volume control valve is arranged on the feed pipe; a bidirectional air pump connected to the pressure water case through a pressure regulating pipeline and communicated to the disinfection chamber through a hot air pipeline, wherein a pressure regulating valve is arranged on the pressure regulating pipeline, a hot air control valve is arranged on the hot air pipeline; a circuit board assembly connected to the bidirectional air pump, the heating element, the exhaust control valve, the water volume control valve, the pressure regulating control valve and the hot air control valve; and a casing arranged at external part of the above parts for supporting and protecting the above parts. The steam sterilizer has functions of cleaning, disinfection and drying which are carried out in the disinfection chamber, artificial transfer of the disinfection articles is not required, usage is more convenient and faster, disinfection processing efficiency is increased, and secondary pollution probability during a transfer process of the disinfection articles can be reduced. An ingenious design is employed, so that structure is simpler, more compact, smaller and more flexible, comprehensive utilization rate of the parts is high, and manufacture cost and use cost can be better controlled.

A light emitting diode (LED) and a method of making the same are disclosed. The present invention is featured in that the LED comprises a transparent heat-conductive glue, a reflective layer, and a carrier, etc, wherein the transparent heat-conductive glue is used to adhere the epitaxial structure and the carrier of the LED; the reflective layer can make the light emitted by the epitaxial structure to be reflected more efficiently; and the carrier is used to enhance the heat-dissipation effect of the LED. Moreover, the transparent heat-conductive glue and the reflective layer can be replaced with one single adhesive reflective layer having functions of adhesion and reflection simultaneously.

Provided are a wholly aromatic liquid crystalline polyester resin compound and a method of preparing the same. The wholly aromatic liquid crystalline polyester resin compound comprises a first wholly aromatic liquid crystalline polyester resin with a low melting point, a second wholly aromatic liquid crystalline polyester resin with a high melting point, and an additive, wherein the amount of the first wholly aromatic liquid crystalline polyester resin is 5 to 10 parts by weight with respect to 100 parts by weight of the second wholly aromatic liquid crystalline polyester resin.

A heat pipe includes a hollow metal casing (10). The casing has an evaporating section (120) and a condensing section (160) at opposite ends thereof, and an adiabatic section (140) located between the evaporating section and the condensing section. A capillary wick (12) is arranged at an inner surface of the hollow metal casing. A working fluid is received in the metal casing. A sealed heat reservoir (20) is mounted on the condensing section of the heat pipe to increase heat dissipation area of the heat pipe. The heat reservoir has a capillary wick structure (22) and a working fluid therein.

The invention relates to a turbine nozzle ring used in turbochargers. Compressed air from an outlet of an air compressor of the turbocharger and / or an external source goes through a hollow internal cavity of the nozzle vanes or a hollow sandwich near the internal wall of an intake pipe of a vane-less spiral case and blows directly to the nozzle vane ring or main burning gas flow at a flow passage and / or an outlet of the vane-less spiral case through a ventilation groove gap cut between a vane-shaped back side (or front side) and / or a rear margin part or through circular arc-shaped ventilation gap of the outlet of the hollow sandwich near the zero-degree section of the tip of the vane-less spiral case, making the mixed air of blowing flow from the gaps and the main flow change the flow direction at the outlet of the nozzle ring and causing the change of the flow angle (namely flow section) at the outlet. The invention has the advantages of wide range of control simple structure, low cost, safety and reliability, high efficiency, straightforward control and being applicable for turbochargers and being capable of making use of external air, additional pressure and external energy to supply auxiliary power.

The invention discloses a resin membrane melt impregnation forming method of a fiber reinforced polyethylene terephthalate (PBT) composite material, comprising the following steps: 1) processing to form a cyclic butylenes terephthalate(CBT) resin membrane with the thickness of 15-700 mu m; 2) successively placing a demolding cloth, the CBT resin membrane, a fiber reinforced material and a demolding cloth on a mold; 3) heating up the assembly obtained by the step 2) to 180-225 DEG C under vacuum and preserving the heat for 5 min-6 h to melt the CBT resin in the CBT resin membrane and completely impregnate the fiber reinforced material, simultaneously polymerizing the CBT resin into PBT with high molecular weight, cooling, and then demolding. According to the invention, the forming method has no need to prepare a prepreg, the forming process can be realized at the temperature which is lower than the PBT melting temperature, the process is simple and easy to operate, the efficiency is high, and large members can be formed. The invention is beneficial for popularization and application.

The invention provides an exhaust gas purification catalyst comprising one or more catalyst coating layers having platinum and / or palladium with rhodium supported on a carrier, characterized in that the (platinum and / or palladium) / rhodium weight ratio is 1.0 or less.