258results about How to "Reduce heat resistance requirements" patented technology

Provided is an LED lighting system with a smaller heat resistance of the LED, which can be produced by simpler mounting steps and is capable of three-dimensionally arranging the LEDs depending on required directivity of each system. A plurality of LEDs 2 are mounted on an FPC 1 which has a radial shape and can be flat when developed. The LEDs 2 connected by printed wiring to each other and linked to terminals 3 and 4 are attached on a surface of a core 5 made of a material having a high thermal conductivity. Heat generated at a p-n junction of the LEDs 2 is transmitted to the core 5 via the FPC 1 and a thermal-conductive adhesive.

PCT No. PCT/JP96/01794 Sec. 371 Date Dec. 8, 1997 Sec. 102(e) Date Dec. 8, 1997 PCT Filed Jun. 28, 1996 PCT Pub. No. WO97/01600 PCT Pub. Date Jan. 16, 1997A resin composition comprising a polypropylene resin, a polyphenylene ether resin and a compatibility agent wherein dispersion particles comprising the polyphenylene ether resin (b) are dispersed in a matrix comprising the polypropylene resin (a), a minor diameter of the dispersion particles is 2 mu m or less, and the ratio of major diameter/minor diameter is 1-10.

A power electronic package includes: first and second high thermal conductivity insulating non-planar substrates; and multiple semiconductor chips and electronic components between the substrates. Each substrate includes multiple electrical insulator layers and patterned electrical conductor layers connecting to the electronic components, and further includes multiple raised regions or posts, which are bonded together so that the substrates are mechanically and electrically connected. The number, arrangement, and shape of the raised regions or posts are adjusted to have mechanical separation between the substrates. The electrical conductor layers are separated and isolated one another so that multiple electric circuits are provided on at least one of the substrates.

Provided is a polyamide composition comprising 100 parts by weight of (A) a polyamide having dicarboxylic acid units containing 60 to 100 mol % of terephthalic acid units, and diamine units containing 60 to 100 mol % of 1,9-nonanediamine units and/or 2-methyl-1,8-octanediamine units, and 5 to 100 parts by weight of (B) a titanium oxide with an average particle size of 0.1 to 0.5 mum. The polyamide composition shows excellent heat resistance enough to withstand the SMT process, and gives a molded article with excellent whiteness and surface-reflectance.

This invention relates to a light emitting diode lamp with high heat-dissipation capacity wherein the lamp has at -least one heat-dissipating unit, a plurality of air-flow channels being provided within each heat sink unit, an electrical insulation layer with high heat-conductivity being provided on the surface of the light emitting diode mounted with heat-dissipating unit, a metal circuit being formed on the electrical insulation layer with high heat-conductivity according to demand, at least one light emitting diode being packaged on the metal circuit such that provision of circuit board or coating of heat sink paste become unnecessary for the lamp.

A heat receiving member of a heat receiving device includes a coolant passage comprising a bag formed of a flexible sheet made up of a thermally stable, flexible plastic material and a metal film having high heat conductivity. In the coolant passage flows a coolant having an anti-corrosion property. A heat generating member including a main body and a terminal portion is supported by an adapter fitted in an opening formed in the flexible sheet. The main body of the heat generating member comes into direct contact with the coolant flowing in the coolant passage. Since the heat from the heat generating member is directly transferred to the coolant, the heat transfer path between the heat generating member and the coolant becomes shorter. Therefore, the heat resistance is reduced, so that the heat receiving efficiency is extremely high.

Embodiments of the present invention may include a turbocharger having a turbine, a turbine housing, a variable valve, a first plate, a second plate and a heat shield member. The turbine housing accommodates the turbine and has a flow path. The variable valve rotates about each pivot member provided thereon, thereby adjusting the flow velocity of fluid guided from the flow path to the turbine. The first plate supports one end of each pivot member, and defines the flow path. The second plate supports the other end of each pivot member or the variable valves, and defines the flow path. The heat shield member covers a wall surface of the turbine housing, and defines the flow path.

This invention relates to a rubber composition capable of using in a tread rubber of a tire to improve both an initial gripping performance and a running stability of the tire as compared with those of conventional tires, and more particularly to a rubber composition formed by compounding an indene-containing C₉-based resin having a softening point of 130° C.-190° C. and an indene content of 30-80 mass % into a rubber component.

A resin composition which has low stress, and good adhesive property in high temperature and high moisture environments and which is useful in adhesive applications in low stress, high moisture sensitivity level electronic packages. Preferably, a flexible epoxy anhydride adduct modified solid bismaleimide and solid benzoxazine resin composition that can survive high temperature and high moisture conditions and maintain good adhesion strength and minimize the stress resulting from a coefficient of thermal expansion mismatch between a silicon die and a substrate which is Ball Grid Array solder mask or a smart card polyethylene terephthalate or silver or copper metal lead frame.

A wiring substrate with improved heat dissipation capability and with reduced size is disclosed. The wiring substrate includes a metal core substrate, a buffer layer formed so as to cover at least a part of the metal core substrate and containing a phase change material or a material with an electrocaloric effect, an electronic device mounted on a surface of a base including the metal core substrate and the buffer layer or inside the base, and a thermal via formed between the electronic device and the buffer layer.

A polyphenylene sulfide resin composition which comprises 100 parts by weight of a polyphenylene sulfide resin (A) and, compounded therewith, 1 to 100 parts by weight of glass fibers (B) having a single-fiber diameter of 12 μm or lager and has a crystallization temperature during cooling of 205° C. or lower. Also provided is a polyphenylene sulfide resin composition which comprises 100 parts by weight of a polyphenylene sulfide resin (A) and, compounded therewith, 1 to 100 parts by weight of glass fibers (B) having a single-fiber diameter of 10 to 12 μm, excluding 12 μm, has a crystallization temperature during cooling of 205° C. or lower and a chloroform-extractable content of 0.5 wt. % or lower, and gives a 2 mm-thick molded product which has a transmittance of 15% or higher for laser beam having a wavelength of 940 nm and a heat distortion temperature of 230° C. or higher under a load of 1.82 MPa.

The present invention provides a liquid-crystalline polymer composition comprising:

a liquid-crystalline polymer and an aromatic polysulfone resin having oxygen-containing groups selected from among hydroxyl groups and oxyanion groups in an amount of 6×10⁻⁵ or more in number per 1 g of the polysulfone resin. The composition can suppress rise of specific gravity and reduction of heat resistance and can stably provide a molded article having excellent mechanical characteristics.

An electrical rotary machine includes coils including element wires wound, and a core holding the coil, wherein spaces, both between the coils and the core, and between the adjacent element wires, are filled with a heat-conductive insulating resin. A method of manufacturing the electrical rotary machine includes a first step of impregnating the coils and filling the space between the adjacent element wires with the heat-conductive insulating resin, and a second step of impregnating the coils and the core and filling the space between the coils and the core with the heat-conductive insulating resin.

A connection structure that includes a region where at least a Cu—Sn intermetallic compound, a M-Sn intermetallic compound and a Cu-M-Sn intermetallic compound (where M is Ni and/or Mn) exist in a cross-section of a connecting part when the cross-section of the connecting part is analyzed with a WDX. Further, the connection structure is configured so that when the cross-section of the connecting part is evenly divided into ten sections in a vertical direction and a lateral direction, respectively, to form 100 segmentalized squares in total, a ratio of the number of squares in which two or more kinds of intermetallic compounds having different constituent elements exist to the number of all the squares, except for squares in which only a Sn-based metal component exists, is 70% or more.

A light emitting diode (LED) and a method of making the same are disclosed. The present invention is featured in that the LED comprises a transparent heat-conductive glue, a reflective layer, and a carrier, etc, wherein the transparent heat-conductive glue is used to adhere the epitaxial structure and the carrier of the LED; the reflective layer can make the light emitted by the epitaxial structure to be reflected more efficiently; and the carrier is used to enhance the heat-dissipation effect of the LED. Moreover, the transparent heat-conductive glue and the reflective layer can be replaced with one single adhesive reflective layer having functions of adhesion and reflection simultaneously.

Provided are a wholly aromatic liquid crystalline polyester resin compound and a method of preparing the same. The wholly aromatic liquid crystalline polyester resin compound comprises a first wholly aromatic liquid crystalline polyester resin with a low melting point, a second wholly aromatic liquid crystalline polyester resin with a high melting point, and an additive, wherein the amount of the first wholly aromatic liquid crystalline polyester resin is 5 to 10 parts by weight with respect to 100 parts by weight of the second wholly aromatic liquid crystalline polyester resin.

A heat pipe includes a hollow metal casing (10). The casing has an evaporating section (120) and a condensing section (160) at opposite ends thereof, and an adiabatic section (140) located between the evaporating section and the condensing section. A capillary wick (12) is arranged at an inner surface of the hollow metal casing. A working fluid is received in the metal casing. A sealed heat reservoir (20) is mounted on the condensing section of the heat pipe to increase heat dissipation area of the heat pipe. The heat reservoir has a capillary wick structure (22) and a working fluid therein.

The invention relates to a turbine nozzle ring used in turbochargers. Compressed air from an outlet of an air compressor of the turbocharger and/or an external source goes through a hollow internal cavity of the nozzle vanes or a hollow sandwich near the internal wall of an intake pipe of a vane-less spiral case and blows directly to the nozzle vane ring or main burning gas flow at a flow passage and/or an outlet of the vane-less spiral case through a ventilation groove gap cut between a vane-shaped back side (or front side) and/or a rear margin part or through circular arc-shaped ventilation gap of the outlet of the hollow sandwich near the zero-degree section of the tip of the vane-less spiral case, making the mixed air of blowing flow from the gaps and the main flow change the flow direction at the outlet of the nozzle ring and causing the change of the flow angle (namely flow section) at the outlet. The invention has the advantages of wide range of control simple structure, low cost, safety and reliability, high efficiency, straightforward control and being applicable for turbochargers and being capable of making use of external air, additional pressure and external energy to supply auxiliary power.

The invention discloses a resin membrane melt impregnation forming method of a fiber reinforced polyethylene terephthalate (PBT) composite material, comprising the following steps: 1) processing to form a cyclic butylenes terephthalate(CBT) resin membrane with the thickness of 15-700 mu m; 2) successively placing a demolding cloth, the CBT resin membrane, a fiber reinforced material and a demolding cloth on a mold; 3) heating up the assembly obtained by the step 2) to 180-225 DEG C under vacuum and preserving the heat for 5 min-6 h to melt the CBT resin in the CBT resin membrane and completely impregnate the fiber reinforced material, simultaneously polymerizing the CBT resin into PBT with high molecular weight, cooling, and then demolding. According to the invention, the forming method has no need to prepare a prepreg, the forming process can be realized at the temperature which is lower than the PBT melting temperature, the process is simple and easy to operate, the efficiency is high, and large members can be formed. The invention is beneficial for popularization and application.