Heat pipe

Abstract

A heat pipe includes a hollow metal casing (10). The casing has an evaporating section (120) and a condensing section (160) at opposite ends thereof, and an adiabatic section (140) located between the evaporating section and the condensing section. A capillary wick (12) is arranged at an inner surface of the hollow metal casing. A working fluid is received in the metal casing. A sealed heat reservoir (20) is mounted on the condensing section of the heat pipe to increase heat dissipation area of the heat pipe. The heat reservoir has a capillary wick structure (22) and a working fluid therein.

Description

1. FIELD OF THE INVENTION[0001]The present invention relates generally to a heat pipe as heat transfer / dissipating device, and more particularly to a heat pipe which has a heat reservoir for quickly dissipating heat received from an electronic component such as a central processing unit (CPU) to increase the maximum heat transfer capacity and reduce the temperature differential across the length of the heat pipe.2. DESCRIPTION OF RELATED ART[0002]It is well known that a heat pipe is essentially a vacuum-sealed pipe with a porous wick structure provided on an inner face of the pipe, and where the pipe is filled with at least a phase changeable working media employed to carry heat. Generally, according to the direction from which heat is input or output, the heat pipe has three sections, namely, an evaporating section, a condensing section, and an adiabatic section between the evaporating section and the condensing section.[0003]In use, the heat pipe transfers heat from one place to a...

AI Technical Summary

Benefits of technology

[0008]The present invention relates to a heat pipe. A heat pipe includes a hollow metal casing. The casing has an evaporating section and a condensing section at respective opposite ends thereof, and an adiabatic section located between the evaporating section and the condensing section. A capillary wick is arranged at an inner surface of the hollow metal casing. A sealed heat reservoir is mounted on the condensing section of the heat pipe to increase heat dissipation area of the heat pipe. The heat pipe is configured so as to simultaneously reduce heat resistance and enhance maximum heat transfer capacity of the heat pipe.

Problems solved by technology

However, during the phase change of the working media, the resultant vapor and the condensed liquid flows along two opposing directions, which reduces the speed of the condensed liquid in returning back to the evaporating section and therefore limits the maximum heat transfer capacity (Qmax) of the heat pipe.

As a result, the heat pipe often suffers dry-out problems at the evaporating section as the condensed liquid cannot be quickly sent back to the evaporating section of the heat pipe.

However, by this method, the maximum heat transfer capacity of the heat pipe is reduced accordingly.

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