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5492 results about "Thermal dilatation" patented technology

Dynamic coupling compensation method for thermal expansion and axial displacement

The invention belongs to the field of equipment coupling monitoring, and particularly relates to a dynamic coupling compensation method for thermal expansion and axial displacement, which comprises the following steps of: calculating a first characteristic value for representing reference dynamic offset of a sensor based on a three-dimensional thermal-structure coupling model by acquiring a thermal expansion parameter and axial displacement parameter sequence of a casing; calculating a second characteristic value representing the real position change of the rotor in combination with a rotor-casing axial thermodynamic model, establishing a piecewise coupling function considering a nonlinear effect, working condition self-adaption and cross interference, and eliminating the mechanical thermal inertia and measurement system lag influence through a dynamic delay compensation mechanism; an accurate axial displacement measurement total error compensation index is generated, and grading compensation actions are intelligently triggered according to error grades; the problem of measurement distortion caused by dynamic coupling of thermal expansion and axial displacement is effectively solved, and the accuracy and reliability of state monitoring of the rotating machine are remarkably improved.
Owner:SHANGHAI RUISHI INSTR & ELECTRONIC CO LTD

Numerical control machining method and system integrating thermal expansion dynamic compensation

The invention relates to the field of numerical control machining, discloses a numerical control machining method and system integrating thermal expansion dynamic compensation, and aims to solve the problem that precision is out of control due to thermal deformation in high-speed cutting of motorcycle light alloy castings. The method comprises the steps that distributed temperature and displacement sensors are arranged in a key area of a workpiece, and a temperature field and thermal expansion amount are collected in real time; constructing a local thermal deformation prediction model based on a material expansion coefficient and a geometric structure, and correcting a tool path in real time through a coordinate system dynamic offset algorithm; and an on-line measurement feedback mechanism is introduced, and model parameters are adaptively optimized, so that closed-loop compensation is realized. The system comprises a sensing module, a thermal deformation modeling and compensation calculation module, a coordinate dynamic correction module, an online measurement feedback module and a parameter adaptive updating module. Through millisecond-level dynamic compensation and closed-loop self-optimization, the size precision and form and position stability of the complex thin-wall part under the high-temperature working condition are remarkably improved, the rejection rate and cooling energy consumption are reduced, and the method is suitable for a high-precision batch machining scene.
Owner:ZHEJIANG JUNHONG MECHANICS CO LTD

Bridge structure monitoring method and device based on microwave deformation radar

The invention provides a bridge structure monitoring method and device based on a microwave deformation radar, and relates to the technical field of bridge structure monitoring, and the method comprises the steps: obtaining the multi-point three-dimensional displacement data of a bridge structure through the microwave deformation radar, carrying out the thermal expansion pseudo displacement compensation and multi-point space smoothing through combining with temperature information, and obtaining a displacement field after environment correction; secondly, extracting a vertical component and separating the vertical component into a static deformation component and a dynamic vibration component by adopting variational mode decomposition; further analyzing and identifying a decoupling region through a time window coherence coefficient, performing recursive quantitative analysis, bispectrum analysis and energy distribution entropy calculation on a dynamic signal of the region, and constructing a high-order damage sensitive feature set; and finally, the dynamic characteristics and the static curvature change are fused to form a comprehensive degradation degree index, the deviation degree is judged according to working condition classification and the mahalanobis distance, and multi-dimensional and cross-working-condition degradation identification and risk early warning of the bridge structure are achieved.
Owner:HUNAN UNIV

Comprehensive simulation model construction method based on finite element analysis and thermal expansion mismatch effect

The invention relates to the technical field of material simulation models, and particularly discloses a finite element analysis and thermal expansion mismatch effect-based comprehensive simulation model construction method, which comprises the following steps of performing geometric model construction on a target material; constructing a geometric model: adopting modeling software to create the geometric model of the target material, and obtaining a thermal mismatch target area interface; parameter data of a target material are obtained for assignment, and then a target material grid is preprocessed; performing boundary condition constraint on the geometric model of the target material, and applying a temperature load; establishing a thermal stress corresponding mechanism for the geometric model of the target material, calculating to obtain thermal stress values of the unit grids, and converting the thermal stress value on each unit grid into a cloud picture in a color manner based on the thermal stress values of the unit grids to obtain a thermal expansion mismatch effect comprehensive simulation model; the quantitative analysis capability of the thermal stress difference of multiple materials is realized; potential stress concentration areas caused by thermal expansion mismatch can be identified.
Owner:WUXI RED MICROELECTRONICS CORP

Stacking packaging method and system for AI-DSP mixed audio processing chip

The invention relates to a stacking packaging method and system for AI-DSP mixed audio processing chips, and the method comprises the following steps: employing a first bonding machine to carry out the flip-chip bonding of an AI chip and a DSP chip, and obtaining a flip-chip bonding chip; the flip-chip bonding chips are interconnected, and an interconnected chip structure is obtained; vertically stacking the interconnected chip structures to obtain a stacked chip structure; packaging the stacked chip structure by adopting a second bonding machine to obtain a packaging body; according to the AI-DSP mixed audio processing chip and the packaging method thereof, the packaging body is subjected to heat dissipation treatment through the preset heat dissipation substrate, the packaged AI-DSP mixed audio processing chip is obtained, and the technical problems that in a traditional packaging scheme, an AI chip and a DSP chip generally adopt different process nodes and manufacturing processes, and thermal expansion coefficients are not matched and stress distribution is uneven during direct integration are solved.
Owner:SHENZHEN POROS TECH CO LTD

Intelligent size precision regulation and control system and method based on rolled finished product

The invention relates to the technical field of intelligent regulation and control of fusion data, in particular to a rolled finished product-based size precision intelligent regulation and control system and method, which comprises a data acquisition unit, a data fusion unit, a deep learning prediction unit and a compensation execution unit, multi-source data such as temperature gradient, roll gap fluctuation and tension spectrum are collected in real time through a sensor array, thermal expansion compensation correction is carried out through a data fusion unit based on a rolling elasticoplastic deformation equation, an anti-interference coupling feature vector is generated by using adaptive Kalman filtering, and a deep learning prediction unit is used for predicting the rolling elasticoplastic deformation through a dual-channel space-time convolutional network. The thickness error and the width error are predicted by combining the constraint of a rolling force balance equation, the compensation execution unit dynamically generates the roll gap adjusting amount and the rolling force compensation amount according to a three-level response mechanism, phase lag compensation current is injected to suppress resonance, the high-end steel yield and the rolling precision are improved, and the rolling quality is improved. And an intelligent closed-loop control scheme is provided for high-precision rolling under complex working conditions.
Owner:JINDING HEAVY IND CO LTD

Epoxy molding compound, epoxy molding film and electronic component

The embodiment of the invention discloses an epoxy molding compound, an epoxy molding film and an electronic component, the epoxy molding compound comprises epoxy resin and a zeolite imidazole framework material, and the zeolite imidazole framework material comprises imidazole ligands and metal ions. The zeolite imidazole framework material is used as a curing agent and a nano reinforced phase, imidazole groups on the surface of the zeolite imidazole framework material can be subjected to a ring-opening reaction with epoxy resin to form covalent bonds, the zeolite imidazole framework material can induce the epoxy resin to generate a microcrack deflection mechanism, and the zeolite imidazole framework material can promote curing of the epoxy resin, so that the epoxy resin is cured, and the curing effect is improved. Therefore, the thermal expansion coefficient of the epoxy molding compound is reduced, the fracture toughness of the epoxy resin is improved, and the thermal stability of the epoxy molding compound is improved.
Owner:SHENZHEN INST OF ADVANCED ELECTRONICS MATERIALS

LED epitaxial wafer growth method capable of reducing warpage

The invention relates to the field of semiconductor optoelectronic device manufacturing, in particular to an LED epitaxial wafer growing method capable of reducing warping. Comprising the following steps of: growing a nucleating layer on a substrate at low temperature by adopting an MOCVD (Metal Organic Chemical Vapor Deposition) process, and annealing to form a three-dimensional island-shaped structure to release stress; growing an AlGaN / GaN superlattice or gradient layer as a gradient buffer layer, and adjusting lattice constants layer by layer; a heavily doped or co-doped layer is inserted before growth of n-GaN, and thermal stress is pre-compensated by using local pressure stress; and finally, continuously growing a device layer and carrying out in-situ heat treatment to obtain the LED epitaxial wafer. The method effectively counteracts the macroscopic tensile stress caused by the difference of thermal expansion coefficients in the cooling process, and greatly improves the integrity of the epitaxial wafer.
Owner:XIAMEN YINKE QIRUI SEMICON TECH CO LTD

Inertial sensor preparation method and sensor

The invention provides a preparation method of an inertial sensor and the sensor. The preparation method comprises the following steps: sequentially forming a first cavity and a first oxide layer on a first silicon wafer; bonding the first silicon wafer and a second silicon wafer, wherein the second silicon wafer is a low-resistance silicon wafer; forming an inertia sensitive structure in the second silicon wafer; correspondingly forming a second cavity on a third silicon wafer, wherein the third silicon wafer is a low-resistance silicon wafer; bonding the third silicon wafer and the second silicon wafer; an isolation groove penetrating through the third silicon wafer is formed through etching, a conductive silicon column and an electric signal isolation ring are formed, and the conductive silicon column is connected with the inertia sensitive structure; and forming a sealing insulating layer on the surface of the third silicon wafer, and forming a signal lead-out pin in the sealing insulating layer. According to the scheme, thermal stress caused by thermal expansion coefficient mismatch among the three layers of wafers is reduced through an all-silicon wafer level packaging process, and the full-temperature characteristic of the device is greatly enhanced; and the preparation process flow is optimized, the process control difficulty is reduced, and the preparation cost is reduced.
Owner:SHANGHAI IND U TECH RES INST

Pre-welding deviation rectifying device for submerged-arc welding straight seam steel pipe

The invention discloses a pre-welding deviation rectifying device for a submerged-arc welding straight seam steel pipe, and relates to the technical field of steel pipe submerged-arc welding. The submerged-arc welding device comprises a machining table, a first linear sliding rail module and a second linear sliding rail module are installed at the top of the machining table, a submerged-arc welding assembly is installed on the second linear sliding rail module, a fixed plate is fixedly installed at the left end of the top of the machining table, a movable plate is installed on the first linear sliding rail module, and three-jaw chucks are installed on the movable plate and the fixed plate correspondingly. A three-jaw chuck drives an inner correction rod to expand outwards to conduct center positioning on a steel pipe, an inner circle can be corrected, then a guide disc is rotated to enable a connecting rod to enter an arc groove part of an inner correction guide groove to lock the position of the inner correction rod, and a swing rod drives an outer correction rod to swing through a telescopic rod. The outer correcting rods correct the outer circle of the steel pipe, the two sets of outer correcting rods are pressed on the two sides of a welding seam to clamp the welding seam, and therefore welding deformation caused by thermal expansion and contraction in the welding process is reduced.
Owner:CANGZHOU HUATAO STEEL PIPE CO LTD

Lower supporting film for flexible folding display screen and preparation method of lower supporting film

The invention belongs to the technical field of film materials, and particularly relates to a lower supporting film for a flexible folding display screen and a preparation method of the lower supporting film. The supporting film sequentially comprises a protective film layer, a stainless steel base material layer, an adhesive layer and a release film layer from top to bottom; wherein the adhesive layer is prepared by coating a release film with modified organic silica gel liquid, drying and curing. The ultra-thin stainless steel is used as the base material layer, can resist external force impact and scraping, is low and stable in thermal expansion coefficient, can reduce the influence of environment temperature and humidity on the size of the supporting film, and guarantees the structural consistency of the screen module in long-term use; and through multi-component composite modification of polyurethane-thiazole-organic silicon, the peeling strength of the adhesive layer and stainless steel and the bending frequency of the supporting film are improved, and the service life of the supporting film is prolonged.
Owner:TAICANG ZHANXIN ADHESIVE MATERIAL

Special coating for lost foam of motor casing as well as preparation method and application of special coating

The invention belongs to the technical field of motor casing lost foam casting, and particularly relates to a special coating for a motor casing lost foam as well as a preparation method and application thereof. Through a quantitative formula design method, an aggregate proportion calculation formula based on thermal expansion coefficient matching and a grain size distribution correlation formula based on target air permeability, cooperative compounding of quartz powder and bauxite is achieved, and key functional components such as mullite, organic matter fibers and crystalline flake graphite are combined; the unification of high air permeability and excellent crack resistance of the motor shell lost foam coating is realized. The invention further provides a two-time coating gradient drying efficient process matched with the coating, and on the premise that the coating performance is guaranteed, the production efficiency is remarkably improved, and the energy consumption is reduced.
Owner:HEBEI YUEXIN SILICON NEW MATERIALS CO LTD

Temperature difference-deformation decoupling method for in-situ monitoring of thermal expansion coefficient

The invention discloses a temperature difference-deformation decoupling method for thermal expansion coefficient in-situ monitoring, and belongs to the technical field of material physical property testing, and the method comprises the following steps: obtaining high spatial resolution temperature distribution data and full-field deformation data; performing three-dimensional reconstruction on the high-spatial-resolution temperature distribution data to generate dynamic temperature field data; theoretical thermal stress is calculated based on the dynamic temperature field data and the material mechanical parameters, and interference deformation data is generated; a dynamic correction coefficient is introduced to decouple full-field deformation data, and a real thermal expansion deformation field is output; calculating a thermal expansion coefficient based on the real thermal expansion deformation field and the temperature change trend data; and monitoring a uniformity index of a real thermal expansion deformation field, and adjusting a dynamic correction coefficient and a material mechanical parameter on line. According to the method, the temperature field and the deformation field are synchronously collected, thermal stress interference deformation caused by temperature difference is theoretically calculated and eliminated, and a closed-loop feedback optimization mode is combined, so that high-precision dynamic monitoring of the thermal expansion coefficient of the material under the non-uniform temperature condition can be realized.
Owner:XIAN JIAHE HUAHENG THERMAL SYST CO LTD

Bonding system

The invention belongs to the technical field of semiconductor material processing equipment, and particularly relates to a bonding system, which comprises a film forming chamber used for preparing a film with active point locations on the surface of an original substrate to form an active substrate; the bonding chamber comprises a first carrier and a second carrier, and the first carrier and the second carrier are respectively used for keeping the active substrates and enabling the two kept active substrates to be opposite to each other; at least one of the first carrier and the second carrier is provided with a force output part, and the force output part is used for outputting force for crimping the active substrate held by the first carrier and the second carrier; and the transmission chamber comprises a substrate taking and placing module which is used for taking and placing the substrates on different stations. According to the bonding system provided by the invention, a very thin active film layer can be prepared on the to-be-bonded surface of the substrate to form the active substrate, bonding can be directly carried out at room temperature, the stress problem caused by mismatching of thermal expansion coefficients of heterogeneous materials can be solved, and the product quality of a bonding sheet is improved.
Owner:SABERS CO LTD

TiSiN / TiBC multilayer hydrogen-resistant wear-resistant coating as well as preparation method and application thereof

The invention discloses a TiSiN / TiBC multilayer hydrogen-resistant wear-resistant coating as well as a preparation method and application thereof, and belongs to the technical field of material preparation. The TiSiN / TiBC multi-layer structure composite hydrogen-resistant wear-resistant coating is prepared on the surface of the steel substrate through the high-frequency pulse magnetron sputtering technology, the middle transition layer is designed between the steel substrate and the hydrogen-resistant coating, and the transition layer has good toughness and the thermal expansion coefficient (8 * 10 <-6 >-12 * 10 <-6 > / DEG C) matched with the substrate; the residual stress between the coating and the steel substrate is effectively reduced, the fracture toughness and binding force of the hydrogen-resistant coating are improved, the binding force of the coating is improved, and then the wear resistance of the coating is remarkably improved. And meanwhile, a large number of vacancy bonds such as Si-bonds, B-bonds, C-bonds and N-bonds contained in the hydrogen-resistant coating can be used for capturing hydrogen atoms, so that the capturing capacity on the hydrogen atoms is improved, the permeation effect of hydrogen is further inhibited, and the hydrogen-resistant efficiency of the coating is remarkably improved.
Owner:CHENGDU CHENGGAO VALVE +2

Precise forming process of high-performance dissimilar metal powder

The invention relates to the technical field of metal powder processing, and discloses a high-performance dissimilar metal powder precision forming process which comprises the following steps: filling powder into a mold cavity, applying vibration disturbance, monitoring the change rate of a phase lag angle, judging that the powder is dense when the change rate is lower than an offset threshold value, outputting a pressing mode switching signal, an induction heating device is used for applying transient thermal load to induce cracks of an oxide film on the surfaces of particles, the pressure load is applied, the side wall is adjusted to generate shear displacement to peel off the oxide film, and metallurgical bonding is achieved through fresh metal surface contact. An interface is activated through thermal expansion mismatch and mechanical friction synergistically, a high-density uniform green body is obtained at low temperature, generation of brittle intermetallic compounds is inhibited, and the fatigue resistance of a formed part is enhanced.
Owner:JIANGSU JUNPAI ELECTRONIC TECH CO LTD

Special composite enamel coating for chromium-nickel alloy base material and preparation method of special composite enamel coating

PendingCN121673865AAnti-corrosive paintsThermal dilatationChromium-Nickel Alloys
The invention discloses a special composite enamel coating for a chromium-nickel alloy base material and a preparation method of the special composite enamel coating, when the special composite enamel coating structurally comprises one layer, the special composite enamel coating comprises the following components in parts by mass: 40-65 parts of a basic glass phase, 30-55 parts of a high-melting-point ceramic reinforced phase, 2-10 parts of a thermal expansion coefficient regulator and 0.5-5 parts of an interface bonding accelerant. Compared with the prior art, the enamel coating can achieve nearly perfect thermal expansion coefficient matching with a chromium-nickel alloy matrix, a tough chemical bonding interface is formed, the enamel coating can stably work for a long time in the extreme high-temperature environment of 1,100 DEG C or above, and meanwhile the enamel coating has the excellent abrasion resistance, repeated rapid cooling and rapid heating cycle resistance and thermal shock resistance.
Owner:ZHEJIANG KAIER NEW MATERIALS CO LTD

Flexible PCBA processing positioning optimization method

The invention provides a flexible PCBA (Printed Circuit Board Assembly) processing positioning optimization method, which relates to the technical field of accurate positioning control, and is characterized in that a temperature field area is divided based on temperature data, a mapping relation between a temperature gradient and pad displacement is established, and the thermal displacement of a reference pad is dynamically compensated in combination with a fitted stress-strain function. Meanwhile, the dynamic alignment control of the mounting head is optimized, the problem of pad position offset caused by thermal expansion and deformation in the flexible PCBA processing process can be effectively solved, the problem of accurate positioning of dislocation of an IC chip and a pad caused by thermal expansion and local deformation of a substrate in the COF mounting process of the flexible PCBA can be solved to a certain extent, and the accuracy of chip mounting is improved. Therefore, the processing quality and reliability of the flexible PCBA are obviously improved.
Owner:深圳市卓瑞源科技有限公司

Circuit board structure and preparation method thereof

The invention relates to the technical field of printed circuit boards, and discloses a circuit board structure and a preparation method thereof, and the circuit board structure comprises a copper seat, the top of which is provided with a first groove; a chip, wherein the chip is arranged in the first groove; the ceramic substrate layer is arranged at the bottom of the copper seat, and the shape of the cross section of the ceramic substrate layer is the same as that of the bottom surface of the copper seat; the copper plate layer is arranged at the bottom of the ceramic substrate layer, and the shape of the cross section of the copper plate layer is the same as that of the cross section of the ceramic substrate layer. The ceramic substrate layer and the copper plate layer are sequentially arranged at the bottom of the copper base, the thermal resistance of the chip during working can be remarkably reduced, the overall heat dissipation performance can be improved, the cross sections of the ceramic substrate layer and the copper plate layer are consistent with the bottom surfaces of the copper base and the copper plate layer in shape, and the layers are high in structural fitting degree, uniform in stress distribution and good in plate thickness consistency after lamination; and the warping problem of the copper seat caused by thermal expansion is effectively reduced.
Owner:GUANGZHOU MEADVILLE ELECTRONICS

Laser cladding layer based on copper-magnesium-titanium-zirconium gradient design and preparation method thereof

The invention relates to the technical field of metal surface engineering, and discloses a laser cladding layer based on copper-magnesium-titanium-zirconium gradient design and a preparation method thereof.The preparation method comprises gradient structure design, a microstructure strengthening mechanism, a laser cladding process and thermal field control. By constructing a copper-magnesium-titanium component gradient transition structure and matching the thermal expansion coefficient difference between a matrix and a coating in real time, interface thermal stress accumulation can be dynamically inhibited, the crack defect caused by thermal expansion mismatch of a traditional cladding layer is avoided, ordered diffusion of elements at the interface is promoted through gradual change of gradient components, and the thermal conductivity of the cladding layer is improved. The metallurgical bonding reliability of the coating and a base body is improved, meanwhile, a stable coating is formed, the long-term service stability under the extreme working condition is guaranteed, a microstructure strengthening mechanism regulation and control means is adopted, the coating has a stable and effective protective barrier in a corrosive medium environment, and the problem of performance degradation caused by structure defects of a traditional cladding layer is solved.
Owner:ANHUI UNIVERSITY OF ARCHITECTURE

Underground storage system for fluid storage

An underground storage system for storing fluid includes a hole having a bottom, a support element including at least one opening able to receive a joining element, at least one reservoir having a longitudinal axis, a bottom end and a top end, a first closure able to close the reservoir at its bottom end, and a second closure able to close the reservoir at its top end. The top end is able to be joined to the support element via the joining element such that the reservoir is hung inside the hole and such that an axial clearance able to absorb axial thermal expansion of the reservoir remains between the first closure and the bottom.
Owner:VALLOUREC MANNESMANN OIL & GAS FRANCE

Compensation method for thermal deformation of aviation large-size workpiece

The invention relates to the technical field of precision machining, in particular to a compensation method for thermal deformation of an aviation large-size workpiece, which comprises the following steps of: firstly, establishing a first mapping relation between the size change of a calibration piece at different temperatures and the temperature through a thermal deformation calibration experiment; then, by taking the experimental data as a reference, correcting a thermal expansion coefficient in the calibration piece simulation model through an optimization algorithm, and establishing a high-precision prediction model for deformation of the workpiece to be machined; in the actual machining process, real-time temperature field data are collected through a temperature sensor arranged in a key area of a machine tool, and the thermal deformation error of a workpiece to be machined and the thermal offset of the original point of a machining coordinate system are predicted through the prediction model; and finally, according to a prediction result, a machining track is compensated in real time by dynamically offsetting a machining coordinate system and modifying the scaling ratio of each axis of a numerical control system. According to the method, the problem that under the non-constant-temperature working condition, machining is out of tolerance due to thermal deformation of the aviation large-size workpiece is effectively solved, and the machining precision and the percent of pass are remarkably improved.
Owner:NORTHWESTERN POLYTECHNICAL UNIV

Fastening device and mounting structure of fusion reactor divertor system heat sink structure

The invention relates to the field of nuclear fusion devices, and discloses a fastening device and a mounting structure of a fusion reactor divertor system heat sink structure, and the fastening device of the fusion reactor divertor system heat sink structure is used for connecting the heat sink structure and a main body structure, and comprises a first connecting piece, a supporting disc, a second connecting piece, a first elastic piece and a third connecting piece, a first thread part is arranged on the outer side of the first connecting piece; the supporting disc is arranged in the first groove and is in clearance arrangement with the peripheral groove wall of the first groove; the second connecting piece penetrates through the second hole and is provided with a third groove; the first elastic piece is arranged in the second groove and elastically abuts against the skirt edge part. And the third connecting piece is arranged in the third groove and is in clearance arrangement with the peripheral groove wall of the third groove. A thermal expansion deformation space is reserved in the fastening device of the fusion reactor divertor system heat sink structure, damage to internal parts can be avoided, and the reliability of the fastening device of the fusion reactor divertor system heat sink structure is improved.
Owner:聚变新能(安徽)有限公司

Stacked substrate structure and manufacturing method thereof

A stacked substrate structure and a manufacturing method thereof are provided. The stacked substrate structure includes a first structure and a second structure. The first structure has a first bonding surface and includes a first circuit structure. The first circuit structure includes a plurality of first conductive layers and a first expansion modulation layer. The plurality of first conductive layers are stacked in a vertical direction. The first expansion modulation layer is disposed between the adjacent first conductive layers. A coefficient of thermal expansion of the first expansion modulation layer is greater than a coefficient of thermal expansion of the plurality of first conductive layers. The second structure has a second bonding surface, and the second bonding surface of the second structure faces the first bonding surface of the first structure.
Owner:IND TECH RES INST

Anti-shrinkage liquid bridge plug material and preparation method thereof

The invention discloses an anti-shrinkage liquid bridge plug material and a preparation method thereof, the liquid bridge plug material is prepared by taking a glue hardening agent, a bonding reinforcing agent and thermal expansion particles as raw materials, and the mass ratio of the glue hardening agent to the bonding reinforcing agent to the thermal expansion particles is (15-25): (65-70): (5-10). The preparation method comprises the following steps: mixing and stirring the glue hardener, the bonding enhancer and the thermal expansion particles according to the proportion, and curing in a drying oven to obtain the liquid bridge plug material. According to the invention, the thermal expansion particles are doped in the material and the solid connection monomer is modified, so that the volume shrinkage of the liquid bridge plug material in the curing process is successfully reduced, and the stability of the material is remarkably improved; and the adhesive property of the material is improved, the adhesive capacity of the material and the wall surface of a shaft or a leakage channel is enhanced, and challenges in fracturing and leaking stoppage construction can be effectively handled.
Owner:PETROCHINA CO LTD

Preparation process of high-performance Cu-Ni-Fe alloy calculated and designed based on first principle

The invention discloses a preparation process of a high-performance Cu-Ni-Fe alloy calculated and designed based on a first principle, and relates to the technical field of alloy material preparation. According to the process, a precise Cu-Ni-Fe ternary alloy thermodynamic database is constructed by combining a first principle with a CALPHAD method, a multivariate phase diagram is calculated based on the database to determine a component range, then optimized components of a work function, an elastic constant and a thermal expansion coefficient are calculated through the first principle, and a finished product is obtained through smelting, heat treatment and forming machining. The final alloy is composed of, by atomic percent, 30%-75% of Cu, 10%-30% of Ni and 10%-30% of Fe, the tensile strength is larger than or equal to 816.4 MPa, the total elongation at break is larger than or equal to 34.27%, the thermal expansion coefficient is smaller than 20 * 10 <-6 > / K, the excellent mechanical property and thermal stability are achieved, the problems that component design is blind and performance fluctuation is large in a traditional process are solved, and the alloy is suitable for the fields of ocean engineering, electronic packaging and the like.
Owner:南宁桂电电子科技研究院有限公司 +1

Antibacterial ceramic glaze sintering process optimization and intelligent temperature control method and system

The invention provides an antibacterial ceramic glaze sintering process optimization and intelligent temperature control method and system. According to the method, the molecular vibration characteristics of the antibacterial agent at different temperatures are dynamically obtained, and a thermal decomposition dynamic fingerprint database is constructed according to the attenuation law of the molecular vibration characteristics; meanwhile, a three-dimensional temperature field of the glaze layer is reconstructed based on a coupling relation between sound wave propagation parameters and glaze thermal expansion. And carrying out transfer learning on the fingerprint database and historical process data, predicting a glaze thermal stability attenuation parameter, and calculating a temperature gradient and molecular chain fracture compensation coefficient. And fusing the temperature field and the attenuation parameter, and dynamically regulating and controlling the sintering temperature curve and preserving heat by combining the compensation coefficient. The adjusted parameters generate closed-loop feedback by verifying the matching degree of the glaze microstructure and the antibacterial indexes, the compensation coefficient is corrected, and it is ensured that the antibacterial performance of the glaze is stabilized within the process allowance. The temperature control precision and the antibacterial performance stability of antibacterial ceramic glaze sintering are improved.
Owner:ZHEJIANG ENDERUI IND & TRADE CO LTD

Magnetic core mutual inductor with magnetic core convenient to replace

The invention provides a magnetic core mutual inductor with a magnetic core convenient to replace, and relates to the technical field of magnetic core mutual inductors. The magnetic core mutual inductor with the magnetic core convenient to replace comprises a base. Through the matching design of the limiting blocks between the base sinking groove and the connecting seat and the circumferentially distributed limiting grooves, the connecting seat can be positioned along a plurality of preset angles, the magnetic core can be adaptively adjusted along with the angle of a mounting base plane, and the magnetic core can be quickly positioned and locked by adopting a quick locking structure that the upper shell and the lower shell are hinged and matched through a transverse and longitudinal dual positioning and locking mechanism. Opening and closing of the upper shell and the lower shell can be completed through one-hand operation, the disassembly and assembly time for magnetic core replacement or maintenance is greatly shortened, through collaborative design of a graphene heat conduction layer, a phase change heat storage layer and a flexible buffer layer, heat conduction and absorption capacity are enhanced, meanwhile, thermal expansion stress is counteracted through a flexible material, heat dissipation efficiency improvement and structural reliability are both considered, and the application range is wide. And the technical defects of high-temperature accumulation and material deformation easily caused by a single heat dissipation layer design are overcome.
Owner:XUZHOU ONAFULIN ELECTRONIC TECH CO LTD

Multi-scale performance evaluation and optimization method and device for well cementation cement stone

The invention discloses a multi-scale performance evaluation and optimization method and device for well cementation cement stone, and relates to the technical field of oil exploitation, the well cementation cement stone is subjected to nanoindentation test and scanning electron microscope microstructure test, and a mechanical property-microstructure test result is obtained; performing electronic computer tomography and mercury injection test on the well cementation cement stone, and constructing a pore network three-dimensional model; performing triaxial mechanical property test, thermogravimetric analysis and thermal expansion test on the well cementation cement stone to obtain a thermal-mechanical coupling test result; performing X-ray diffraction and X-ray fluorescence spectrum analysis on the well cementation cement stone to obtain mineral phase information and element information of the cement stone; according to the method, a mechanical property-microstructure test result, topological parameters, a thermal-mechanical coupling test result, cement stone mineral phase information and element information are fused, an optimal design scheme for target well conditions is generated, multi-dimensional performance testing and characterization are achieved, and an accurate basis is provided for well cementation cement stone optimal design and quality control.
Owner:CHINA UNIV OF PETROLEUM (BEIJING)

Annular furnace heat-resistant supporting forged base plate and additive manufacturing process and fixing device of annular furnace heat-resistant supporting forged base plate

The invention discloses an annular furnace heat-resistant supporting forged chassis and an additive manufacturing process and a fixing device thereof, and belongs to the technical field of plating of metal materials, and the annular furnace heat-resistant supporting forged chassis comprises the steps that heat-resistant alloy steel base metal with specific components is prepared; carrying out laser texturing and nickel-based alloy bottom layer pretreatment on the surface of the steel plate; performing laser cladding on high-silicon high-temperature alloy powder containing niobium and rare earth elements to form a functional cladding layer, and performing gradient cladding on the edge of the atmosphere guide hole; and finally, carrying out heat treatment and assembling with a fan-shaped refractory brick fixing device. A composite oxide film and a multi-scale strengthening system are constructed, hydrogen resistance and brittleness resistance are effectively achieved, interface thermal stress is relieved, cracking and stripping of a cladding layer are avoided, a fixing device adapts to thermal expansion, the atmosphere is dredged, and the annealing uniformity of a steel coil is improved; the problems of creep deformation, hydrogen embrittlement, cladding layer stripping and thermal stress cracking of a traditional supporting component under the conditions of high temperature, heavy load and nitrogen and hydrogen atmosphere are solved.
Owner:BAOMEITE (SHANGHAI) INTELLIGENT ENG CO LTD