6191 results about "Thermal dilatation" patented technology

A gas inlet manifold for a plasma chamber having a perforated gas distribution plate suspended by a side wall comprising one or more sheets. The sheets preferably provide flexibility to alleviate stress in the gas distribution plate due to thermal expansion and contraction. In another aspect, the side wall provides thermal isolation between the gas distribution plate and other components of the chamber.

This invention relates to an aluminum conductor composite core reinforced cable and method of manufacture. The composite core comprises a plurality of longitudinally extending fibers embedded in a resin matrix. The composite core comprises the following characteristics: tensile strength ranging from about 250 to about 350 Ksi; a tensile modulus of elasticity ranging from about 12 to about 16 Msi; and a coefficient of thermal expansion less than or equal to about 6×10⁻⁶ cm/cm·° C. The composite core is further manufactured according to a two die pultrusion system, the system comprising tooling designed in accordance with the processing speed, selection of composite core fibers and resin and desired physical characteristics of the end composite core.

A method for making a multilayered electronic device with at least one epitaxial layer grown on a single-crystal film bonded to a composite wherein at least one layer is polycrystalline, the method includes the step of bonding a single-crystal film at least one of the epitaxial layers on the single-crystal film wherein thermal coefficients of expansion for the substrate and the epitaxial layer are closely matched.

A CMC wall (20F) may be attached to a metal wall (22F) by a plurality of bolts (28A, 28B, 28C) passing through respective holes (24A, 24B, 24C) in the CMC wall (20F) and holes in the metal wall (22F), clamping the walls (20F, 22F) together with a force that allows sliding thermal expansion but does not allow vibrational shifting. Distal ones of the holes (24A, 24B) in the CMC wall (20F) or in the metal wall (22F) are elongated toward a central one of the bolts (24C) or at alternate angles to guide differential thermal expansion (20T) of the CMC wall (20F) versus the metal wall (22F) between desired cold and hot geometries. A second CMC wall (20R) may be mounted similarly to a second metal wall (22R) by pins (39A, 39B, 39C) that allow expansion of the CMC component (201) in a direction normal to the walls (20F, 20R).

The present invention provides a coating inorganic fiber toughened MAX phase ceramic composite material and a preparation method thereof. The composite material adopts a MAX phase ceramic material as a matrix and adopts coating inorganic fibers as a toughening phase, wherein the coating inorganic fiber content is 0.5-90% (by volume), and the coating inorganic fibers are completely dispersed in the matrix and are inorganic fibers with the surface coated with the coating. Compared with the composite material in the prior art, the composite material of the present invention has the following characteristics that: the interface reaction between the inorganic fibers and the MAX phase ceramic can be effectively inhibited, the thermal expansion coefficient and elasticity modulus matching degree between the inorganic fibers and the MAX phase ceramic can be effective regulated, the effective improvement of the fracture toughness and the high temperature resistance of the MAX phase ceramic composite material can be achieved, the problems of high brittleness and insufficient use reliability of the MAX phase ceramic can be fundamentally solved, and the coating inorganic fiber toughened MAX phase ceramic composite material has potential application prospects in the high technology fields of civil use, aviation, aerospace, nuclear industry and the like, and is especially for the fission and fusion reactor nuclear power plant inner wall structure material.

A flip-chip device and process for fabricating the device employs a multilayer encapsulant that includes a first portion encapsulant having a coefficient of thermal expansion of at most 30 ppm/.degree. C. and an elastic modulus of 2-20 GPa and a second portion comprising a polymer flux having a coefficient of thermal expansion that may exceed 30 ppm/.degree. C.

An acoustic sensor, such as a hydrophone, is deployable in a fluidic media having high temperature, high pressure, and/or potentially caustic chemicals. The hydrophone includes a housing filled with an internal fluid and containing a sensing mandrel. The sensing mandrel senses the acoustic pressure transmitted to the internal fluid through a diaphragm. The sensing mandrel preferably includes a polymer tubular mandrel having a coil of optical fiber wound and bonded to its outer surface. The sensing mandrel can be suspended within the housing instead of being rigidly attached thereto. To relieve pressure created by thermal expansion of the internal fluid, the flexible diaphragm, a filler member, a pressure compensator, or combinations thereof can be used. The filler member is mounted in the hydrophone and reduces the amount of internal fluid required in the housing. The compensator may be a bellows or a buffer tube.

A prepreg for a printed wiring board, comprising a cyanate ester resin having a specific structure, a non-halogen epoxy resin, a silicone rubber powder as a rubber elasticity powder, an inorganic filler and a base material, which prepreg retains heat resistance owing to a stiff resin skeleton structure, has high-degree flame retardancy without the use of a halogen compound or a phosphorus compound as a flame retardant, and has a small thermal expansion coefficient in plane direction without using a large amount of inorganic filler, and a laminate comprising the above prepreg.

The invention relates to a low thermal expansion coefficient NaMxAlySiz high entropy alloy and a preparation method thereof, the chemical components of the alloy are as follows: 75 <= a <= 100%, 0 <= x <= 10%, 0<= y<= 10%, 0<= z<= 5%, N is arbitrary three or more than three of Ta, Nb, Hf, Zr, Ti, Mo and W, and M is any one or more than one of V, Mn, Fe, Co, Ni and Cr. The alloy phase structure is as follows: a body centered cubic solid solution and an intermetallic compound. The alloy is prepared by arc melting method in three stages. The NaMxAlySiz high entropy alloy has a low thermal expansion coefficient at the temperature in the range of room temperature to 1000 DEG C, the change rate is less than 20%, and the alloy has a broad application prospect in the high temperature industrial field.

An erosion-resistant article for use as a component in plasma process chamber. The erosion-resistant article comprises a support and an oxide coating comprising yttrium, which is disposed over the support. The support and the oxide coating preferably have material compositions that differ from one another in coefficient of thermal expansion by no more than 5x10<-6>/K. Preferred oxide coating compositions include yttria and yttrium aluminum garnet. Preferred supports include alumina supports and aluminum-silicon carbide supports.

The invention relates to a high weather-proof thermosetting resin composite and prepreg and copper-clad laminate prepared thereby. The high weather-proof thermosetting resin composite comprises the following components in parts by weight: 10-40 parts of allyl compound, 8-80 parts of bismaleimide compound, 0-30 parts of epoxy resin and 0.05-5 parts of catalyst, wherein the molar ratio of allyl compound to bismaleimide compound is 1:2-4. The high weather-proof thermosetting resin composite provided by the invention has higher heat resistance, and the coefficient of thermal expansion (CTE) can be lowered to be below 2.0% to satisfy the requirements of manufacturing high multi-layer PCB. The prepreg prepared by the high weather-proof thermosetting resin composite has simple manufacture, better heat-resistant effect and high heat conductivity. The copper-clad laminate of the invention can be applied to heat-resisting and high multi-layer circuits and has simple manufacturing technology and low cost.

A spindle motor for a disk drive includes a shaft, an aluminum hub, a bearing, a magnetic steel back iron, and a magnet. The hub includes an axial wall having an inner surface. The back iron has an upper portion and a lower portion. The hub is concentrically position about the shaft such that the inner surface extends along a direction of a longitudinal axis defined by the hub. The bearing is positioned between the hub and the shaft. The back iron is secured to the hub such that the upper portion abuts the inner surface, whereas the lower portion is spaced-apart radially from the inner surface, thereby forming a single gap between the back iron and the hub. Finally, the magnet is attached to the back iron such that an axial length of the magnet is substantially coextensive with an axial length of the back iron.

The present invention provides a thermoelectric element comprising an electrically conductive substrate, a p-type thermoelectric material, and an n-type thermoelectric material; the p-type thermoelectric material being positioned on the substrate via an electrically conductive thermal buffer material, and the n-type thermoelectric material being positioned on the substrate via an electrically conductive thermal buffer material; wherein each thermoelectric material comprises a specific oxide and each electrically conductive thermal buffer material comprises an electrically conductive material having a thermal expansion coefficient between that of the thermoelectric material to which the thermal buffer material is bonded and that of the substrate. The invention also provides a thermoelectric module comprising a plurality of the thermoelectric elements. The thermoelectric element and the thermoelectric module have both a high thermoelectric conversion efficiency and excellent properties in terms of thermal stability, chemical durability, etc.

The invention relates to coated optical fibers comprising soft primary coatings and to such primary coatings for protecting glass optical fibers having a sufficient high resistance against cavitation. In particular, the primary coatings have a cavitation strength at which a tenth cavitation appears (sigma10cav) of at least about 1.0 MPa as measured at a deformation rate of 0.20% min-1 and of at least about 1.4 times their storage modulus at 23° C. The coating preferably shows strain hardening in a relative Mooney plot, preferably has a strain energy release rate Go of about 20 J/m2 or more, and preferably has a low volumetric thermal expansion coefficient. The invention furthermore provides a method and apparatus for measuring the cavitation strength of a primary coating.

This invention relates to an aluminum conductor composite core reinforced cable (ACCC) and method of manufacture. An ACCC cable has a composite core surrounded by at least one layer of aluminum conductor. The composite core comprises a plurality of fibers from at least one fiber type in one or more matrix materials. The composite core can have a maximum operating temperature capability above 100° C. or within the range of about -45° C. to about 230° C., at least 50% fiber to resin volume fraction, a tensile strength in the range of about 160 Ksi to about 370 Ksi, a modulus of elasticity in the range of about 7 Msi to about 37 Msi and a coefficient of thermal expansion in the range of about -0.7x10<-6 >m/m/° C. to about 6x10<-6 >m/m° C. According to the invention, a B-stage forming process may be used to form the composite core at improved speeds over pultrusion processes wherein the speeds ranges from about 9 ft/min to about 60 ft/min.

Fine-grained (average grain size 1 nm to 1,000 nm) metallic coatings optionally containing solid particulates dispersed therein are disclosed. The fine-grained metallic materials are significantly harder and stronger than conventional coatings of the same chemical composition due to Hall-Petch strengthening and have low linear coefficients of thermal expansion (CTEs). The invention provides means for matching the CTE of the fine-grained metallic coating to the one of the substrate by adjusting the composition of the alloy and/or by varying the chemistry and volume fraction of particulates embedded in the coating. The fine-grained metallic coatings are particularly suited for strong and lightweight articles, precision molds, sporting goods, automotive parts and components exposed to thermal cycling. The low CTEs and the ability to match the CTEs of the fine-grained metallic coatings with the CTEs of the substrate minimize dimensional changes during thermal cycling and prevent premature failure.

A semiconductor device has a semiconductor layer of silicon which has a plurality of element formation regions, and a trench isolation region for isolating the plurality of element formation regions from each other. The trench isolation region is formed by filling a trench formed in an upper part of the semiconductor layer with an insulating metal nitride. A thermal expansion coefficient of the insulating metal nitride is closer to that of silicon than a thermal expansion coefficient of silicon oxide is to that of silicon.

Provided is a display device that can be made thin, lightweight, and flexible, has no problems of cracks and peeling caused by thermal stress, and is excellent in dimension stability and the like. The display device includes: a supporting base including a polyimide film; and a gas barrier layer formed on the supporting base, in which the polyimide film has a transmittance of 80% or more in a wavelength region of from 440 nm to 780 nm, and a coefficient of thermal expansion of 15 ppm/K or less, and has a difference in coefficient of thermal expansion from the gas barrier layer of 10 ppm/K or less.