Method for manufacturing a housing for mounting a
semiconductor element by using a forming tool with an upper tool and a lower tool, wherein the housing for mounting a
semiconductor element comprises a substrate having a mounting surface for mounting a
semiconductor element, and an encapsulation body formed from a cured product of a curable resin and having a frame-shaped section surrounding the mounting surface, and wherein the housing has a concave section formed by the mounting surface and the encapsulation body, and the method for manufacturing a housing for mounting a semiconductor element comprises: a step of arranging a mold release film, having a substantially constant thickness across the film, on the upper tool, which has a convex section whose shape corresponds to the concave section, arranging the substrate on the lower tool, and closing the upper and lower tools so that the convex section is in
close contact with the mounting section of the substrate by means of the mold release film, a step of filling a space formed between the upper tool and the lower tool with a curable resin, whereupon the curable resin is cured, and a step of separating a cured product of the curable resin together with the substrate from the mold tool, wherein the mold release film comprises a first layer, which is intended to be in contact with the curable resin at the time of curing of the curable resin, and a second layer, the first layer has a thickness of 3 to 25 µm and furthermore has a tensile
energy storage modulus at 180 °C of 10 to 40 MPa and the second layer has a product of the tensile
energy storage modulus (MPa) at 180 °C and a thickness (µm) of 2000 to 13000.