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1745results about "Electrical equipment" patented technology

Polarizing plate

[Problem] To provide a novel polarizing plate that inhibits a poor external appearance of a polarizing film due to thermal contraction, and that excels in durability. [Solution] This polarizing plate comprises a polarizing film composed of a polyvinyl alcohol–based resin, and a supporting base material layered on at least one of the surfaces of the polarizing film with a bonding layer therebetween, said supporting base material being light-transmitting, and is characterized in that the bonding layer is composed of a molecular bonding agent that binds the polarizing film and the supporting base material together via a chemical bond.
Owner:OKURA INDUSTRIAL CO LTD

Laminated glass

A laminated glass includes: a curved first glass plate, a curved second glass plate, and an intermediate film located between the first glass plate and the second glass plate to bond the first glass plate and the second glass plate, the first glass plate including a third surface and a fourth surface, and the second glass plate includes a first surface and a second surface, the fourth surface being a surface of the first glass plate located on a side opposite to the intermediate film, the third surface being a surface of the first glass plate facing the intermediate film, the second surface being a surface of the second glass plate facing the intermediate film, the first surface being a surface of the second glass plate located on a side opposite to the intermediate film.
Owner:AGC INC

High-reflection integrally-formed back plate for single-glass assembly and preparation method of high-reflection integrally-formed back plate

The invention belongs to the technical field of photovoltaic backboards, and particularly relates to a high-reflection integrally-formed backboard for a single-glass assembly and a preparation method thereof.The preparation method comprises the following steps that S1, a PET film base material is provided, plasma surface treatment is conducted, then polyurethane coating is coated on the two sides to form an outer-layer weather-proof fluorine coating and an inner-layer functional coating respectively, and the outer-layer weather-proof fluorine coating and the inner-layer functional coating are formed; a CPC backboard base material is obtained; s2, white high-reflection EVA granules are fused and plasticized, a white EVA adhesive film is obtained through extrusion of a hanger type T-shaped flat die head, then the white EVA adhesive film is compounded with the inner functional coating of the CPC backboard base material, and a firm complex without a definite physical interface is obtained through rolling; s3, cooling the composite body through at least two stages of cooling rollers to obtain a coiled material; and S4, the coiled material is irradiated, and the high-reflection integrally-formed backboard is obtained.
Owner:CHANGZHOU BAIJIA NIANDAI FILM TECH CO LTD

Low-dielectric high-toughness alkali-free spherical glass powder modified copper-clad plate and preparation method thereof

The invention provides a low-dielectric high-toughness alkali-free spherical glass powder modified copper-clad plate. The low-dielectric high-toughness alkali-free spherical glass powder modified copper-clad plate consists of a composite resin matrix, modified alkali-free spherical glass powder, a synergistic functional filler, an auxiliary agent, a reinforced base material and a conductive layer, the modified alkali-free spherical glass powder is subjected to gradient treatment of plasma activation, silane grafting and organic silicon coating, the particle size of the modified alkali-free spherical glass powder is 0.5-2 microns, the modified alkali-free spherical glass powder accounts for 10-20 parts by weight in the raw materials, and the content of organic functional groups on the surface of the modified alkali-free spherical glass powder is larger than or equal to 1.6 mmol / g.The invention further provides a preparation method of the low-dielectric high-toughness alkali-free spherical glass powder modified copper-clad plate. Compared with the prior art, the preparation method has the following beneficial effects that a double-resin blending and elastomer toughening system is constructed through a modification process of filler activation, silane grafting and organic silicon coating, and the technical bottleneck is solved in combination with an interface compatibility technology.
Owner:HEFEI UNIV OF TECH

System and methods for manufacturing a dry electrode

A system and methods for manufacturing a dry electrode for an energy storage device are disclosed. The system includes a first dry electrode material delivery system configured to deliver a dry electrode material, a first calendering roll, a second calendering roll, and a controller. The second calendering roll is configured to form a first nip between the first calendering roll and the second calendering roll. The first nip is configured to receive the dry electrode material from the first dry electrode material delivery system, and form a dry electrode film from the dry electrode material. The controller is configured to control a rotational velocity of the second calendering roll to be greater than a rotational velocity of the first calendering roll. 62385256
Owner:TESLA INC

Cover plate, display module, and display device

The present disclosure relates to a cover plate, including a cover plate body including a bending area and non-bending areas located at two sides of the bending area, where each of the non-bending areas includes a glass substrate and the bending area includes a first optical resin coating layer formed by a coating process using an optical resin material. The present disclosure also relates to a display module and a display device. The cover plate body includes at least two structures of the first optical resin coating layer and the glass substrate, where the first optical resin coating layer with a strong bending performance is provided in the bending area and the glass substrate with a strong impact strength is provided in the non-bending areas so as to solve a problem that impact strength and bending performance of the cover plate only made of the glass substrate cannot be balanced.
Owner:CHENGDU BOE OPTOELECTRONICS TECH CO LTD +1

Method for manufacturing a housing for mounting a semiconductor element and mold release film

Method for manufacturing a housing for mounting a semiconductor element by using a forming tool with an upper tool and a lower tool, wherein the housing for mounting a semiconductor element comprises a substrate having a mounting surface for mounting a semiconductor element, and an encapsulation body formed from a cured product of a curable resin and having a frame-shaped section surrounding the mounting surface, and wherein the housing has a concave section formed by the mounting surface and the encapsulation body, and the method for manufacturing a housing for mounting a semiconductor element comprises: a step of arranging a mold release film, having a substantially constant thickness across the film, on the upper tool, which has a convex section whose shape corresponds to the concave section, arranging the substrate on the lower tool, and closing the upper and lower tools so that the convex section is in close contact with the mounting section of the substrate by means of the mold release film, a step of filling a space formed between the upper tool and the lower tool with a curable resin, whereupon the curable resin is cured, and a step of separating a cured product of the curable resin together with the substrate from the mold tool, wherein the mold release film comprises a first layer, which is intended to be in contact with the curable resin at the time of curing of the curable resin, and a second layer, the first layer has a thickness of 3 to 25 µm and furthermore has a tensile energy storage modulus at 180 °C of 10 to 40 MPa and the second layer has a product of the tensile energy storage modulus (MPa) at 180 °C and a thickness (µm) of 2000 to 13000.
Owner:AGC INC

Display device and method for fabricating display device

A display device includes a display panel comprises a display area and a non-display area surrounding the display area; a cover panel disposed on a rear surface of the display panel and comprising a front surface, a first side surface connected to the front surface and bent along a first bending line, a second side surface connected to the front surface and bent along a second bending line intersecting the first bending line, and a first corner located between the first side surface and the second side surface; and an alignment notch defined at the first corner of the cover panel.
Owner:SAMSUNG DISPLAY CO LTD

Protective cover plate and manufacturing method thereof, and display device

A protective cover plate includes an ultra-thin glass layer and at least one thermoplastic protective film. The ultra-thin glass layer has two main surfaces opposite to each other. At least one main surface in the two main surfaces is coated with a thermoplastic protective film in the at least one thermoplastic protective film.
Owner:BOE TECHNOLOGY GROUP CO LTD

Graphene composite high-thermal-conductivity aluminum substrate, preparation method and application

The invention belongs to the technical field of metal substrates, and particularly relates to a graphene composite high-thermal-conductivity aluminum substrate, a preparation method and application. The graphene composite high-thermal-conductivity aluminum substrate comprises a conductive copper foil layer, a graphene composite high-thermal-conductivity layer and an aluminum substrate layer, the graphene composite high heat conduction layer comprises an upper layer, a middle layer and a lower layer, and the upper layer is connected with the conductive copper foil layer and is a heat conduction adhesive layer; the middle layer is a graphene composite sheet layer and is a film layer formed by compounding and hot-pressing graphene and a polymer; the lower layer is connected with the aluminum substrate layer and is a graphene modified aluminum oxide film layer; graphene in the graphene composite sheet layer is arranged in a horizontal orientation manner; graphene in the aluminum oxide film layer is arranged in a vertical orientation manner. According to the graphene composite high-thermal-conductivity aluminum substrate and the preparation method thereof, the graphene is used for constructing a longitudinal efficient heat conduction path and balancing stress, and the obtained graphene composite high-thermal-conductivity aluminum substrate has ultrahigh heat conduction performance, ultralow warping rate and good reliability and can be used in high-performance electronic devices and circuit boards.
Owner:JIANGXI HONGYU CIRCUIT TECH CO LTD

Foil for forming packaging parts and housing parts

A foil for forming packaging units or housing units, comprising: a coupling layer designed to bond to a metal foil; a core layer having a layer thickness that is greater than at least half the foil thickness, and a sealing layer designed to be in permanent contact with an electrolyte.
Owner:PROFOL KUNSTE

Hard coat film for foldable displays and its applications

To provide a hard coat film for a folding type display which prevents a folding crease and a crack in a folding part, is affected by a fine crack of an easily adhesive resin layer, and is excellent in suppressing iris-like color (interference spot).SOLUTION: A hard coat film for a folding type display has an easily adhesive resin layer and a hard coat layer on at least one surface of a polyester film having a thickness of 10 to 80 μm in this order, wherein the easily adhesive resin layer is obtained by curing a composition containing at least one kind of compound selected from a titanium compound and a zirconium compound, and a polyester resin, and has the easily adhesive resin layer, and the polyester film before the hard coat layer is laminated satisfies a characteristic within a specific range.SELECTED DRAWING: Figure 1
Owner:TOYOBO CO LTD

Pressure-sensitive adhesive layer-forming organopolysiloxane composition, and use thereof

Provided is a curing reactive organopolysiloxane composition that forms a pressure-sensitive adhesive layer having excellent curing properties, a wide range of designable viscoelastic properties such as storage elastic modulus (G′) and the like, and practically sufficient pressure-sensitive adhesive strength and tensile adhesive strength. The organopolysiloxane composition comprises: (A) an organopolysiloxane having an alkenyl group; (B) an organopolysiloxane resin with 9 mol % or less of hydroxyl groups or the like relative to all silicon atoms in a molecule or resin mixture thereof; (C) an organohydrogenpolysiloxane; (D) an organic silicon compound having an alkenyl group; and (E) a hydrosilylation reaction catalyst. A ratio (molar ratio) of the substance amount of SiH groups in component (C) relative to the sum of alkenyl groups in components (A), (B) and (D) is 1.0 or more.
Owner:DOW TORAY CO LTD

Multilayer composite with thermal barrier properties

The present disclosure relates to a multi-layer composite that may include a first barrier layer and a first foam layer. The first foam layer may include a polyurethane-based matrix component and a flame-retardant filler component. The multi-layer component may also have an HBF flammability rating as measured according to ASTM D4986.
Owner:SAINT GOBAIN PERFORMANCE PLASTICS CORP

Battery module

A battery module includes a plurality of battery cells, busbars electrically connecting the plurality of battery cells, a holder positioned on the plurality of battery cells and accommodating the bus bars, and a cover portion positioned on the holder and covering the bus bars, wherein the cover portion includes a first layer, a second layer positioned on the first layer, and a third layer positioned on the second layer, and the second layer includes a material different from those of the first layer and the third layer.
Owner:SAMSUNG SDI CO LTD

Bond ply, circuit boards and striplines using the same

To provide a bond ply capable of combining low dielectric tangent and dimensional stability.SOLUTION: A bond ply comprises a first adhesive layer, a polyimide layer and a second adhesive layer, in which a) a thickness of an entire bond ply is in the range of 50 μm or more and 300 μm or less, and a ratio of the thickness of the polyimide layer to the thickness of the entire bond ply is 0.2 or more and 0.9 or less, b) after drying at 80°C for 1 hour, the moisture absorption measured after conditioning for 24 hours under constant temperature and humidity at 23°C and 50% RH is 0.4 wt.% or less, and c) the storage elastic moduli at 50°C of the first adhesive layer and the second adhesive layer are each independently 1800 MPa or lower, and the maximum value of the storage elastic moduli at 180 to 260°C are each independently 800 MPa or less.SELECTED DRAWING: None
Owner:NIPPON STEEL CHEM & MATERIAL CO LTD

Glass article, display device including the same, and electronic device

A display device includes a display panel including a plurality of pixels, a cover window located on the display panel, and an optically clear bonding layer located between the display panel and the cover window, where the cover window includes, as a glass composition, 45 to 60 mol % SiO2, greater than 35 and equal to or less than 45 mol % B2O3, 3 to less than 9 mol % Na2O, and greater than 0 to less than 8 mol % Al2O3 based on total content of the cover window.
Owner:SAMSUNG DISPLAY CO LTD

Stack structure, display module, electronic device, impact-resistant layer and preparation method therefor

A stack structure (90), a display module (2), an electronic device (1), an impact-resistant layer and a preparation method, relating to the technical field of display. The stack structure (90) comprises a protective layer (91) and impact-resistant layers. The elastic modulus of each impact-resistant layers is less than the elastic modulus of the protective layer (91), the hardness of each impact-resistant layer is greater than the hardness of the protective layer (91), and / or the rigidity of each impact-resistant layer is greater than the rigidity of the protective layer (91). The protective layer (91) and the impact-resistant layers are connected by bonding or in other manners. Therefore, the compression resistance characteristic of a high-hardness and / or high-rigidity material is combined with the impact resistance characteristic of a high-elastic-modulus material, to improve the reliability of the stack structure (90). The stack structure (90) is directly connected to a display screen (20) by means of an adhesive layer, such that a display surface layer + cover plate structure is not required any more, and the architecture of the electronic device (1) can be simplified.
Owner:HUAWEI TECH CO LTD

Multilayer surface protection film and method for producing the same

Multilayer surface protection films and methods for making and using such films are provided. The surface protection films have first and second thermoplastic polyurethane (TPU) layers and an intermediate ethylene vinyl acetate (EVA) layer disposed between the first and second TPU layers. The use of the first and second TPU layers as outer layers contributes to the optical clarity of the film. These TPU layers may have different thicknesses. The use of EVA as a component of the film layers provides a film with lower cost compared to traditional single-layer TPU films. When used as a surface coating for a wide range of applications, such as automobiles, wind turbine blades, home appliances, electronic displays, and mobile devices, the EVA component properties and the total EVA ratio of the film can be used to improve the physical properties of the multilayer structure while maintaining comparable or superior performance to these films.
Owner:MATIV LUXEMBOURG

Laminated optical film and image display device

Provided is a laminated optical film in which at least a retardation film and an optical film other than a polyvinyl alcohol film are laminated via a molecular adhesive layer, the molecular adhesive layer being a cured product layer of a molecular adhesive having at least one reactive group selected from the group consisting of silanol groups and alkoxysilyl groups, and the molecular adhesive layer being a cured product layer of a molecular adhesive having at least one reactive group selected from the group consisting of silanol groups and alkoxysilyl groups. When the smoothness of a laminate of the entire laminated optical film is set as beta, beta < 0.45 arcmin is satisfied. The optical film is preferably a phase difference film. The thickness of the molecular adhesive layer is preferably 1 nm or more and 100 nm or less. The thickness of the retardation film is preferably 5 [mu] m or less.
Owner:NITTO DENKO CORP

Processed copper foil and method for manufacturing the same

PendingJP2026082390ALaminationLamination apparatus
The objective is to provide a treated copper foil that can adhere firmly to a substrate at a smooth interface with minimal irregularities, and a method for manufacturing the same. Furthermore, the objective is to provide a laminate in which the treated copper foil and the substrate are firmly adhered at a smooth interface with minimal irregularities, and a method for manufacturing the same. [Solution] By using a treated copper foil in which a conductive layer (B) containing silver (b1) is laminated onto a copper foil (A) with a smooth surface, it is possible to firmly adhere the copper foil (A) and the substrate (D) at a smooth interface with minimal irregularities, thus completing the present invention.
Owner:DIC CORP

Solid-state bonding method for the manufacture of semiconductor chucks and heaters

A layered assembly for use in a controlled atmosphere chamber includes a plurality of substrates and an electrically functioning layer embedded between two adjacent substrates of the plurality of substrates, the electrically functioning layer being a material configured to secure the two adjacent substrates together using a solid- state bonding process. An electrical termination area is integral with the electrically functioning layer, and a peripheral sealing band is embedded between and extends around a periphery of internal faces of the two adjacent substrates, the peripheral sealing band being a material configured to secure and seal the two adjacent substrates together using the solid-state bonding process. Dielectric regions are present between the two adjacent substrates and between edge boundaries of the electrically functioning layer, the dielectric regions being sealed between the two adjacent substrates by the peripheral sealing band.
Owner:WATLOW ELECTRIC MANUFACTURING CO

Component, especially for a vehicle

Component (1), in particular for a vehicle, comprising a first and at least one second material layer (2, 3, 4), wherein the two material layers (2, 3, 4) consist of mica or at least partially contain mica, wherein the at least two material layers (2, 3, 4) are joined together by means of plastic (5) in a material-bonded manner, wherein the component (1) comprises at least one reinforcing body (6) which is attached to at least one material layer (2, 3, 4) and / or to a section (7) of the component (1) formed by the plastic (5) before and / or during the execution of the material-bonded joining.
Owner:BAYERISCHE MOTOREN WERKE AG

Translucent multilayer body with a temperature- or pressure-sensitive decorative layer

The present invention relates to a multi-layer body comprising (I) a support layer made of a special thermoplastic polycarbonate molding compound and (II) a layer made of a material selected from the group consisting of stone products, leather products, textiles containing synthetic fibers, materials of plant origin or materials containing components of plant origin, or laminates containing one or more of the above-mentioned materials, where the layer (II) has a specified minimum transmittance or has at least one recess in the form of at least one symbol, pattern, hole, line or sign, or the layer has a dot-like recess. The present invention also relates to a lighting unit comprising the multi-layer body and a light source, a method for producing the multi-layer body, and the use of the special thermoplastic polycarbonate molding compound as a support layer of such a multi-layer body.
Owner:COVESTRO DEUTSCHLAND AG

Fully-automatic film applicator

A fully-automatic film applicator includes a main body. The main body is provided with a fixing structure, a positioning part and a film rolling mechanism and is also provided with a film tearing mechanism. In use, a mobile phone is fixed by the fixing structure, a mobile phone film is positioned by means of the positioning part, and a working part of the film tearing mechanism is connected to a dust-proof protective film and tears the dust-proof protective film off from a screen film in a rolling manner; and then, the screen film is rolled onto a screen of the mobile phone by means of the film rolling mechanism. The whole process is fully automatic.
Owner:HAN JIANBO