4751 results about "Laser cutting" patented technology

A method of cutting material for use in an implantable medical device employs a plotted laser cutting system. The laser cutting system is computer controlled and includes a laser combined with a motion system. The laser precisely cuts segments out of source material according to a predetermined pattern as designated by the computer. The segments are used in constructing implantable medical devices. The cutting energy of the laser is selected so that the cut edges of the segments are melted to discourage delamination or fraying, but communication of thermal energy into the segment beyond the edge is minimized to avoid damaging the segment adjacent the edge.

A packaging method comprises: forming a circuit board by forming a substantially continuous conductive layer on an insulating board and removing selected portions of the continuous conductive layer to define an electrically conductive trace; laser cutting the electrically conductive trace to define sub-traces electrically isolated from each other by a laser-cut gap formed by the laser cutting; and bonding a light emitting diode (LED) chip to the circuit board across or adjacent to the laser-cut gap, the bonding including operatively electrically connecting an electrode of the LED chip to one of the sub-traces without using an interposed submount. A semiconductor package comprises an LED chip flip-chip bonded to sub-traces of an electrically conductive trace of a circuit board, the sub-traces being electrically isolated from each other by a narrow gap of less than or about 100 microns.

Vascular treatment and methods include a plurality of self-expanding bulbs and a hypotube including interspersed patterns of longitudinally spaced rows of kerfs. Joints between woven structures and hypotubes include solder. Woven structures include patterns of radiopaque filaments measurable under x-ray. Structures are heat treated to include at least shapes at different temperatures. A catheter includes a hypotube including interspersed patterns of longitudinally spaced rows of kerfs. Heat treating systems include a detachable flange. Laser cutting systems include a fluid flow system.

The present invention disclose a laser cutter for cutting an object being cut such as a two glasses-attached panel for LCD using a laser beam. The laser cutter includes a laser unit for irradiating a laser beam with a specific wavelength along a marked cutting line of the object, a pre-scriber for forming a pre-cut groove at starting edge of the marked cutting line, and a cooling unit for cooling the cutting line which said laser beam has been irradiated.

A robotic system for forming features in orthodontic aligners includes a control system, a platen for three-dimensional positioning of the aligner, a heating station for selectively heating a small region of the aligner, and a thermoforming station for manipulating the heated region to form a desired feature in the aligner. Optionally, a laser cutting and trimming station can also be included to trim excess material from the aligner or to cut features into the aligner. The control system can include a processor with CAD software to enable a user to design features for aligners.

Expandable surfaces made from sheet materials with slits distributed on the surface of sheet material where the surfaces expand by application of force along or/and across the surface of sheet material. The unexpanded surfaces are flat sheets, or closed surfaces like cylinders, spheres, tubes, or custom-designed organic shapes marked with pre-formed or post-formed slit designs. The expanded surfaces can be single units or modules which can be attached to one another through various means. The sheet materials range from hard surfaces like metals, to softer materials like papers and plastics, or pliable materials like fabrics, rubbers, synthetic surfaces or bio-surfaces. The slits are arranged in patterns ranging from periodic, non-periodic to irregular designs. The slits can be straight, bent, curved or irregularly shaped with even or uneven spacing. Slitting can be achieved by digital cutting or punching devices like laser-cutting, water-jet cutting, digital punching, automated dies, etc. or pre-formed when casting the sheet material. Force can be applied manually with tools or through the use of machines and special set-ups. Applications range from architectural surfaces, walls, ceilings, panel systems, structures and sculpture. On a smaller scale, applications include containers, packaging material, fabrics and human wear. On micro- to nano-scale, applications range from expandable surfaces for gauzes, band-aids, stent designs, skin grafts, semi-permeable membranes and micro-filters for various industries including purification of fluids and chemical substances.

There is provided a high power laser system for powering a remotely located laser device, such as an ROV, using a high power laser fiber optic tether and a photo-conversion device, such as a laser photovoltaic assembly. Laser device systems, such as ROV systems that utilizes a high power laser cutting and/or cleaning tools are also provided.

A desired pattern may be cut into a stent preform by impinging a laser beam onto the stent preform. The laser beam is formed using a laser system comprising a resonator cavity for resonating laser radiation, a gain medium contained in the resonator cavity, a pump for periodically pumping the gain medium and an electro-optical modulator in communication with the resonator cavity. The laser system produces a radiation pulse for each pump period. Each radiation pulse is conditioned by suppressing at least a portion of the pulse. The pulse may also be modulated with an electro-optical modulator to produce a pulse train of ordered pulses of radiation. Each pulse train is output from the optical cavity as an output laser beam which is directed at the stent preform to cut a desired pattern in the stent preform.

A seamless, self-expanding implantable device having a low profile is disclosed along with methods of making and using the same. The implantable device includes a frame cut out of a single piece of material that is formed into a three-dimensional shape. The implantable device may comprise an embolic filter, stent, or other implantable structure. The present invention also allows complicated frame structures to be easily formed from planar sheets of starting material, such as through laser cutting, stamping, photo-etching, or other cutting techniques.

The invention is directed to a pair of laparoscopic scissors, comprising a pair of blades connected at a pivot, each of the blades having a length, a tip portion, a body portion, an outer surface, an inner surface and a cutting edge, the cutting edge forming an angle with the outer surface along the length of the blade such that tension during a cutting operation at the tip portion is about the same as tension at the body portion during the cutting operation. The angle formed may be greater at the tip portion which continuously decreases over the length of the blade. The tip portion may have a first body thickness and the body portion may have a second body thickness different from the first body thickness. During the cutting operation, the blades progressively move over each other to provide a point contact along the cutting edges. The blades may be thickened in a number of locations and combinations including: (1) one blade could be thicker than the other to force the opposing blade to flex; (2) both blades could be thicker at the body portions to give more strength when cutting staples; (3) each blade could be thickened on one side or the other to stiffen certain locations; and (4) the tips of each blade could be thicker than the body portions to provide increased tension at the tips. In another aspect of the invention, a process of manufacturing the pair of scissors of the invention is disclosed, comprising the steps of form grinding the blades into a desired shape from a pre-hardened block of material, and sharpening the cutting edges of the blades. The blades may also be formed through other processes including wire EDM, laser cutting, waterjet cutting, machining, cast or metal injection molding, and other independent profile manufacturing processes. The manufacturing process of the invention is beneficial in that each profile can be accurately controlled, and the parts will be exact every time.

A method of cutting an article (172) from a chemically strengthened glass substrate (110) includes generating a pulsed laser beam (108) from a laser source (106). The pulsed laser beam (108) may have a pulse duration of less than about 1000 fs and an output wavelength such that the chemically strengthened glass substrate (110) is substantially transparent to the pulsed laser beam (108). The pulsed laser beam (108) may be focused to form a beam waist (109) that is positioned in the same horizontal plane as an inner tensile region (124) of the chemically strengthened glass substrate (110). The beam waist (109) may be translated in a first pass along a cut line (116), wherein the beam waist (109) traverses an edge (111) of the chemically strengthened glass substrate. The beam waist (113) may then be translated in a second pass along the cut line (116) such that a crack (119) propagates from the edge (113) along the cut line (116) ahead of the translated beam waist (109) during the second pass.

A system and method for manufacturing a multi-layered circuit assembly. The assembly includes a webbing member, a component, and a laminate layer. The method includes providing a roll of the webbing member with the component positioned thereon and a separate roll of the laminate layer, and monitoring a position of the component on the webbing member with an imaging device. The method also includes modifying a portion of the laminate layer at a location that is based on the monitored position of the component on the webbing member, and coupling the laminate layer to the webbing member to provide a continuous sheet of multi-layered circuit. The multi-layered circuit is formed with the component positioned between the webbing member and the laminate layer and aligned with the modification in the laminate layer.

A system for pulsed synchronized laser cutting of stents and/or other medical products includes a numerical controller and a machine for moving a tube of material during cutting. A pulsed fiber laser is configured to cut the tube into, for example, a stent, the numerical controller being in communication with the machine and configured to send movement control information to the machine. The numerical controller may also receive movement speed information from the machine. The numerical controller is also in communication with the pulsed fiber laser and is configured to send pulse control information to the pulsed fiber laser. The numerical controller is configured to cause average laser power to decrease by decreasing frequency of laser pulses as stent cutting speed decreases, and to cause average laser power to increase by increasing frequency of laser pulses as stent cutting speed increases.

A development of a laser cutting method and a laser cutter in which the adverse effects such as self burning to the cutting surface can be prevented, when the material is cut at a high speed, has been desired. In order to achieve the object, the present invention provides a laser cutting method and a laser cutter in which a cutting laser beam 22 is applied to a material 25 to be cut at a cutting point 26, while ejecting gases 23 and 24 to the cutting point 26 or its surrounding area from a plurality of nozzle openings 30 and 31 arranged in a ring or in a line, wherein the oxygen concentrations of the gases 23 and 24 ejecting from at least one of the nozzle opening 30 and 31 are changed to adjust the oxygen concentration distribution in an area within several millimeters of the cutting point 26; thereby the cutting quality can be improved.

A method of singulating a semiconductor die from a wafer is provided. The method includes etching or cutting several trenches into the wafer from a front surface of the wafer, such that each trench extends along an entire side of the die; depositing a passivation layer into the trenches to form a passivation plug on at least a bottom of the trenches to protect the dies and immobilize them during singulation; and forming a rigid carrier layer or plate at the first side of the wafer to secure the dies. The wafer is then ground from the back side to expose the bottom of each trench, a metal layer is formed on the back surface of the wafer; dicing tape is added, the carrier layer is removed, and the die is separated from the wafer by laser cutting or by flexing the tape.

Vascular treatment and methods include a plurality of self-expanding bulbs and a hypotube including interspersed patterns of longitudinally spaced rows of kerfs. Joints between woven structures and hypotubes include solder. Woven structures include patterns of radiopaque filaments measurable under x-ray. Structures are heat treated to include at least shapes at different temperatures. A catheter includes a hypotube including interspersed patterns of longitudinally spaced rows of kerfs. Heat treating systems include a detachable flange. Laser cutting systems include a fluid flow system.

A drilling apparatus for well-boring having a drill bit assembly which includes a laser cutting assembly and a vacuum assembly. The vacuum assembly is adapted to intake vapors generated by the laser cutting assembly proximate the drill bit assembly during operation of the drilling apparatus. The collected vapors may then be processed by a chromatographic analyzer to determine the characteristics of the rock formation being drilled.

The invention provides a kind of electromagnetic wave shielding films including: a film substrate with transparency on optical degree more than or equal to 87% and layers of metal net at least on one surface of the film substrate. The invention also provides a method including the following steps: first, a conductive layer is formed on the surface of film substrate by a method of physical vapor deposition, next, a metal layer is shaped on the conductive one by the technique of plating; then, metal reticular figure comes into being on such film substrate by laser-cutting technique. This invention can not only reduce the consumption of mental for electromagnetic shielding and avoid the use of solidifying glue between the layers of metal and film substrate, but also decreases the process steps to lower the cost of industrial production and increase productivity effectively.

There are provided high power laser and laser mechanical earth removing equipment, and operations using laser cutting tools having stand off distances. These equipment provide high power laser beams, greater than 1 kW to cut and volumetrically remove targeted materials and to remove laser affected material with gravity assistance, mechanical cutters, fluid jets, scrapers and wheels. There is also provided a method of using this equipment in mining, road resurfacing and other earth removing or working activities.

Vascular treatment devices and methods include a woven structure including a plurality of bulbs that may be self-expanding, a hypotube, for example including interspersed patterns of longitudinally spaced rows of kerfs, and a bonding zone between the woven structure and the hypotube. The woven structure may include patterns of radiopaque filaments measureable under x-ray. Structures may be heat treated to include various shapes at different temperatures. The woven structure may be deployable to implant in a vessel. A catheter may include a hypotube including interspersed patterns of longitudinally spaced rows of kerfs and optionally a balloon. Laser cutting systems may include fluid flow systems.

Methods for making devices include providing a tubular member to be formed into a device, placing a removable sacrificial block material in the lumen of the tubular member and laser cutting the tubular member. A doping material can be added to the melted portion of the tubular member to promote the formation of brittle slag. A fixture can be used to hold a cut workpiece in order to ream sacrificial material from the surface of the workpiece. Pressurized gas can be supplied to the inner lumen of the tubular member to cause slag to form on the outside surface, rather than the inner surface, of the tubular member. A tubular member made from nickel-titanium alloy can be tightly adhered to a sacrificial sleeve utilizing the phase changes associated with nickel-titanium. A rotating mandrel can be placed within the lumen of the tubular member during laser cutting. A mandrel which includes an enlarged diameter section causes the workpiece to expand slightly within its elastic deformation range to dislodge islands from the workpiece. Such a mandrel could be formed from a tubular member which has a central lumen that can be used to deliver a pressurized medium to “blast” islands from the workpiece.

Accelerometers and capacitive touch sensors fabricated from inexpensive, lightweight, disposable substrate materials, such as paper, are provided. These can be fabricated using simple technologies, such as laser cutting and screen printing. In one embodiment, a touch sensor includes a parallel plate capacitor having a fixed plate formed of a substrate material having a conductive layer and a deflectable plate formed of a paper substrate material having a conductive layer. In a second embodiment, a touch sensor includes a parallel plate capacitor formed of an exterior conductive layer deposited on a paper substrate material and an interior conductive layer deposited on a substrate material. In a third embodiment, a touch sensor includes an active electrode and a grounded electrode patterned on the surface of a paper substrate material. In another embodiment, an accelerometer includes a parallel plate capacitor containing a fixed plate and a free plate containing a paper substrate. Upon an applied acceleration, the distance between the plate of the parallel plate capacitor in an accelerometer changes, eliciting a change in the capacitance of the sensor. Measurement of capacitance can be correlated to the acceleration or deceleration applied to the accelerometer.

The invention provides an intelligent laser cutting system provided with a master-slave camera and a cutting method thereof. The intelligent laser cutting system provided with the master-slave camera comprises a worktable, a small head stock, a local slave camera and a laser head, a global master camera, a monitoring terminal, a main controller and a driving motor, wherein the worktable is positioned at the bottom; the small head stock is arranged above the worktable; the local slave camera and the laser head are fixedly arranged with the small head stock; the global master camera is hung on the top; the monitoring terminal is used for monitoring images of the global master camera and the local slave camera; the main controller is electrically connected with the global master camera; the driving motor is controlled by the main controller and is connected with the worktable and the small head stock; a lens visual field of the global master camera comprises the entire worktable; the driving motor drives the small head stock to move; and the local slave camera moves synchronously along with the small head stock and performs local image acquisition on the worktable. High-efficiency and high-accuracy laser cutting processing can be performed on various applicable objects without depending on the accuracy of the main controller of a laser cutting machine and a mechanism.

A method of form copying laser carving processing belongs to the laser carving processing field. The method uses a CCD laser displacement sensor to detect the distance between a laser head and a workpiece for processing to generate a three-dimensional relief map of the material for carving; a PID control arithmetic is used to control the position of the laser head to ensure that a focus of the laser falls at the surface of the workpiece for processing, so as to realize laser cutting and carving towards irregular materials. A laser carving machine is also provided, including a machine frame, a leaser head, an X-axial and Y-axial flying mechanism which is connected with the laser head, a Z-axial driving mechanism which is vertical with the surface of the workpiece, a CCD laser displacement sensor and an upper controller which is used for controlling form copying carving. The present invention provides a method of form copying laser carving processing which can realize dynamic focusing and real-time focusing during the course of carving and can realize plane carving of the irregular materials, and also provides the laser carving machine of the method.

A fluid conditioning system is adapted to condition the fluid used in medical and dental cutting, irrigating, evacuating, cleaning, and drilling operations. The fluid may be conditioned by adding flavors, antiseptics and/or tooth whitening agents such as peroxide, medications, and pigments. In addition to the direct benefits obtained from introduction of these agents, the laser cutting properties may be varied from the selective introduction of the various agents.

A laser cutting apparatus and a laser cutting method are provided which are adapted to concentrate laser light into a silicon substrate to produce a plurality of internal cracks. A light concentrating position, to which laser beams included in the laser light are concentrated, is temporally and spatially displaced to appropriately change lengths of the cracks according to positions in a direction of depth of the substrate. Consequently, the lengths of the internal cracks are controlled to surely lead a crack opening, the starting point of which is the internal crack formed by laser processing, to a predetermined cutting line on a surface of the substrate.

A unitary or homogeneous patterned implant is provided. The implant is constructed of patterned cells formed by way of a molding, die casting, laser etching, laser cutting, extruding, and the like. Portions of the implant can be formed into sinusoid or other waveform strut members to control and promote elongation, expansion or contraction along single or multiple axes. As such, controlled and designated stress, tension and compression distribution is promoted across specific or localized areas of the implant.

A microsurgical probe tip and method of using same are disclosed. One embodiment of the microsurgical probe tip comprises: an outer cutting member, comprising a first tube having a wall, a closed end and a port formed in the wall near the closed end; an inner cutting member, comprising a second tube coaxial with and operable to move in a reciprocating motion within the first tube and having a first end operable to be coupled to a driving mechanism and a second end with a cutting edge for cutting tissue; a first alignment mark on the outer cutting member at a first predetermined position adjacent to the port; and a second alignment mark on the inner cutting member at a second predetermined position adjacent to the cutting edge of the inner cutting member, wherein the second alignment mark is visible through the port and operable to be aligned with the first alignment mark such that when the first and second alignment marks are aligned, a preferred relative positioning between the inner and outer cutting members is achieved. The microsurgical probe tip can further comprise one or more radial alignment marks on the inner cutting member, wherein the radial alignment marks are parallel to one another at fixed intervals from one another and positioned so that one or more of the radial alignment marks are visible through the port so as to indicate the relative lateral positioning between the inner cutting member and the outer cutting member. The radial alignment marks can be made by a method, or combination of methods, such as laser cutting, inkjet printing, and mechanical scribing. The driving mechanism can be a pneumatic driving mechanism, an electro-mechanical driving mechanism, and/or a magnetic driving mechanism. The microsurgical probe tip can further comprising a plurality of gauge marks on an outer surface of the outer cutting member, wherein the gauge marks are parallel to one another at a fixed interval (e.g., 1 millimeter) from one another and positioned so that the gauge marks can be used as a measuring tool in a surgical environment

The present invention is directed to a process which comprises removing and stripping off part of the display panel in order to expose and connect the conductor lines on an electrode plate to a driver circuitry. More specifically the process involves (1) preparing a display panel having filled display cells sandwiched between a first and a second substrate layers, preferably by a roll-to-roll process; (2) removing part of a first substrate by asymmetrical cutting by, for example, a die, diamond, knife or laser cutting method to expose the layers underneath (which may include adhesive layer, primer layer, display cell layer and in the case of a display prepared by the microcup technology, the microcup layer and the sealing layer); and (3) stripping off the exposed layers by a stripping solvent or solution. After stripping, the conductor lines on the second substrate are exposed and ready for connection to the driver circuitry.

In a piercing operation prior to the laser cutting of steel, etc., the development of a technology in which a piercing hole of the intended shape is obtained in a short time, even for a thick cut work. An oxygen gas coaxial to the laser beam applied towards the cut work and a low concentration gas with a low oxygen concentration and major components comprising nitrogen gas, air, or a mixture thereof discharged from an outer gas nozzle disposed so as to surround the outer side of the flow of this oxygen gas is supplied and disposed towards said cut work, and can realize shortening of the time, etc., of the piercing operation time by applying a laser beam to the cut work. In addition, a laser processing nozzle provided with an inner gas nozzle which discharges oxygen gas and an outer gas nozzle which discharges low concentration gas, and a laser cutting apparatus provided with this nozzle is provided.