The invention discloses a PCB
blind hole machining method and device,
laser drilling equipment and a storage medium, the
laser drilling equipment comprises a
picosecond or
femtosecond laser device and a CO2 laser device, after a first
machining parameter of the
picosecond or
femtosecond laser device and a second
machining parameter of the CO2 laser device are determined, on one hand, the first machining parameter of the
picosecond or
femtosecond laser device and the second machining parameter of the CO2 laser device are determined; the picosecond or femtosecond laser performs cold machining on the surface
copper layer to form the annular heat insulation groove, the surface
copper layer can be prevented from generating suspended
copper at the opening of the
blind hole, on the other hand, heat generated when the CO2 laser machines the
blind hole can be prevented from being diffused to the opening of the blind hole in the surface copper layer through the annular heat insulation groove, suspended copper is further prevented from being generated, and on the other hand, the heat dissipation efficiency is improved. The picosecond or femtosecond laser device with low
processing efficiency is adopted for annularly
cutting the annular heat insulation groove in the surface copper layer, then the CO2 laser device with high
processing efficiency is used for removing materials in the area in the outer contour of the annular heat insulation groove to achieve drilling, the
processing efficiency of the two laser devices with different processing efficiency is considered, and the
laser drilling efficiency is improved.