3575 results about "Laser processing" patented technology

The invention discloses a laser processing parameter autonomous generation system and method based on digital twinning, and relates to the field of digital twinning, and the method comprises the steps: collecting and preprocessing processing data in real time through a multi-source sensor; processing and analyzing the task instruction by using a natural language, extracting a constraint condition and forming a structured demand; a processing parameter candidate set is generated through a Transform model in combination with historical data transfer learning, and virtual processing is performed by means of multi-physics field simulation; an improved non-dominated sorting genetic algorithm is adopted to dynamically optimize the parameter weight, and a global optimal parameter combination is obtained through digital twin iteration verification; and after full-process virtual processing verification and task demand comparison, parameters are adaptively corrected, and model parameters are continuously optimized according to physical and simulation data deviation after actual processing. The method has the advantages that the digital twin is used as a core, multi-source real-time data, the AI algorithm and multi-physical field simulation are fused, and autonomous generation, multi-target optimization and virtual-real closed-loop iteration of laser processing parameters are achieved.

The invention relates to a tin ring automatic focusing laser soldering tin fixing and 3D welding spot detecting system, and belongs to the technical field of industrial automatic laser processing. The system is characterized in that a tin ring preparation module identifies pins in real time and dynamically optimizes winding parameters through visual positioning and a self-adaptive winding head, and performs defect identification and pre-repair analysis through multispectral imaging; the soldering tin positioning module is used for switching stations through a rotary table, and precise positioning and clamping of a product are realized by combining laser contour sensing and a focusing compensation algorithm; the laser tin soldering module can visually identify tin materials and automatically call welding parameters, laser power and action time are regulated and controlled in real time by establishing a regional heat conduction model, and gradient cooling is implemented after welding; and the 3D detection module adopts dual-mode scanning, constructs a welding spot three-dimensional model based on fusion data, recognizes microcracks through super-resolution processing, and discriminates the welding spot quality. And automation and intellectualization of the whole process from tin ring preparation to welding spot quality detection are achieved.

The invention belongs to the technical field of laser processing, and particularly relates to a laser processing control method based on a neural network, and the method specifically comprises the following steps: a target definition and input stage; a physical model and database stage: establishing a basic model library; establishing a mapping database; in the AI core engine stage, a training model learns a complex nonlinear relation among laser parameters, material response and a final processing result; searching an optimal laser parameter combination by using an optimization algorithm based on the prediction model and a target set by a user; a laser parameter automatic adjustment and execution stage; a real-time monitoring and feedback stage; and an iterative learning and system improvement stage. The invention further discloses a control system, electronic equipment and a computer storage medium. According to the method, submicron precision control is achieved, thermal damage can approach to zero, the development period is shortened, online real-time regulation and control are achieved, energy consumption is reduced, the material utilization rate is increased, and the method has an interpretable decision-making mechanism and cross-material generalization ability.

The invention relates to the technical field of path control, in particular to a combined path and laser processing planning method based on machine vision, which comprises the following steps: acquiring an image by an industrial camera to extract contour measurement parameters to identify defective materials, setting path start-stop optimization connection smooth obstacle avoidance based on a feature table, and detecting a dynamic adjustment range of a hot area. And according to the adaptive group setting threshold evaluation capability, the delay prediction adjustment power speed is calibrated, an instruction set is called to compensate, predict and correct error dynamic matching, and an optimal processing path and a synchronous processing setting table are output. According to the method, the workpiece image is obtained in real time, the machining features are analyzed, the machining precision and efficiency are improved, fine control in the machining process is achieved, effective cooperation of path planning and machining parameters is ensured, the problem of mismatching of path planning is avoided, the response precision and stability in the machining process are improved, and the machining precision and efficiency are improved. The processing quality and time management are remarkably improved, and low efficiency and quality fluctuation caused by manual adjustment in the prior art are avoided.

The invention relates to the technical field of laser processing, particularly discloses an ultrathin prepreg single-emitting laser hole forming system, and aims to solve the contradiction among precision, thermal damage and efficiency in ultrathin prepreg laser processing. According to the system, through cooperation of an ultrashort pulse laser source, precise light beam shaping and transmission, material processing and positioning, real-time monitoring and feedback and an intelligent control and optimization module, laser and material interaction is finely regulated and controlled. In a single laser event or an equivalent single laser event, high-precision and low-damage microstructure processing of the ultrathin prepreg is realized, the defects of a heat affected zone, carbonization, layering and the like are effectively reduced, and the processing quality and efficiency are improved.

An adjustment method of a laser processing apparatus includes a spatial light modulator adjustment step of adjusting a spatial light modulator into a state ready for splitting a laser beam emitted from a laser oscillator and applying a plurality of laser beams such that laser beams will have a desired positional relation, a processing mark formation step of operating the laser oscillator to apply the laser beams to a wafer such that a plurality of processing marks is formed, an imaging step of stopping the laser oscillator, and imaging the processing marks formed at the wafer, and an aberration correction step of correcting aberration of the condenser by comparing the desired positional relation and a positional relation among the imaged processing marks, and adjusting the spatial light modulator such that the positional relation among the processing marks conforms to the desired positional relation.

The invention discloses a method and a device for correcting laser focusing aberration in a transparent material, and belongs to the technical field of laser processing. The method comprises the steps that a machining light path containing an object plane, an aspheric reflector and a 4F device is built in Zemax, the surface type of the aspheric reflector is optimized with the minimum focus aberration as the target, and a rise table is derived; an optical path difference and a laser phase are calculated through Matlab, and a phase diagram is generated; and an actual machining light path is built, and a phase diagram is loaded to achieve low-aberration machining. Simulation optimization and phase modulation are combined, aberration caused by refractive index difference is effectively counteracted, wavefront errors are reduced by 58%, the thickness of a machining damage layer is reduced by 70%, the method is suitable for various transparent materials, the machining precision and the material utilization rate are improved, and the method is suitable for high-precision laser machining scenes.

The invention discloses an ultra-high-speed imaging device based on acousto-optic filtering modulation. The ultra-high-speed imaging device comprises a spectrum modulation system, a spectrum imaging system and a data processing system. The spectrum modulation system utilizes an acousto-optic tunable filter (AOTF) to dynamically modulate broadband continuous spectrum light, narrow-band illumination light which rapidly changes along with time is generated, and time information of a dynamic scene is effectively mapped to a spectrum dimension. And the spectral imaging system images the spectral coded dynamic scene to the hyperspectral camera to realize acquisition of spectral space-time information. The data processing system performs spectral crosstalk correction, channel separation and demosaicing reconstruction on the acquired original mosaic image, and recovers a time sequence image according to a spectrum-time mapping relation, thereby realizing single-shot superspeed imaging in a dynamic process. The device has the advantages of being simple and compact in structure, flexible in time window, high in imaging fidelity and the like, and has wide application prospects in the fields of rapid dynamics such as microfluidics, laser processing and ultrafast physics.

The utility model discloses a laser with an expandable pumping source and portable laser processing equipment, and belongs to the technical field of lasers. Comprising at least one pumping source module, and the pumping source module comprises at least one pumping source body and a heat dissipation assembly; the heat dissipation assembly comprises a heat dissipation device and a heat dissipation base, the heat dissipation base is connected to one side, in the first direction, of the heat dissipation device, and the pumping source body is detachably arranged on the other side, in the first direction, of the heat dissipation base; according to the laser with the expandable pumping source, a corresponding number of pumping source modules can be matched according to the requirements of the laser with the expandable pumping source, so that the pumping source expansion of the laser is realized, and the corresponding pumping source body is cooled through the cooling assembly in the corresponding pumping source module, so that the cooling effect of the laser with the expandable pumping source is ensured, and the service life of the laser is prolonged. Meanwhile, due to the modular arrangement of the pumping source and the heat dissipation assembly, the reusability and adaptability of the pumping source module are improved, and the design and manufacturing cost is reduced.

The invention discloses an automobile sensor laser processing device which comprises a laser module and an air floatation module assembled on a processing table top, the laser module comprises a motion platform capable of driving a laser to move, and the air floatation module comprises a base and an air floatation disc. A first air outlet hole group, a first air inlet hole group and a second air outlet hole group are formed in the upper end surface of the air floating disc; the base is provided with an air inlet port and an air outlet port; the first air outlet hole group and the second air outlet hole group are communicated with each other and are connected with the air inlet port through an air inlet pipe; the first air inlet hole group is connected with the air outlet port through an air outlet pipe; control valves are respectively arranged on the air inlet pipe and the air outlet pipe; and the air floating module is configured to eject air through the first air outlet hole group and / or the second air outlet hole group so as to form an air floating surface at the bottom of the wafer, and suck air through the first air inlet hole group so as to generate negative pressure at the bottom of the wafer for non-contact limiting of the wafer.

The invention is suitable for the technical field of laser processing, and provides laser processing equipment. The laser processing equipment comprises a laser device used for emitting a laser beam; the light path switching system is used for deflecting the laser beam to a flat-topped light path or a Gaussian light path, the laser beam is output in a flat-topped light beam mode through the flat-topped light path, and the laser beam is output in a Gaussian light beam mode through the Gaussian light path; the processing head is used for deflecting the emergent direction of the flat-topped light beam output by the flat-topped light path or the Gaussian light beam output by the Gaussian light path and guiding the flat-topped light beam or the Gaussian light beam to a preset processing position; and the controller is coupled to the light path switching system through communication and is used for controlling the light path switching system to switch the laser beam between the flat-topped light path and the Gaussian light path according to processing requirements. In the embodiment of the invention, the laser processing equipment can be quickly switched among the laser beams in different modes, so that the processing efficiency can be improved.

The invention discloses a laser marking control card and a laser processing system, and the control card comprises a kernel module and a bus interconnection module connected with the kernel module. The control card is also provided with an input power interface for receiving an external 24V direct-current power supply, an Ethernet interface for being connected with external EtherCAT equipment, an EtherCAT interface for being connected with an industrial personal computer and a serial port for debugging; the control card is also provided with a galvanometer control interface, a motion shaft control interface and a shaft limiting interface; wherein the galvanometer control interface is connected with a galvanometer, the motion axis control interface is connected with a motion platform, and the laser interface is connected with a laser for real-time synchronous linkage control. Aiming at the problems of an existing laser marking control card, high integration and real-time synchronous linkage of motion control, galvanometer control and laser control are achieved through the integrated control card, and the speed, precision and intelligent level of laser processing are remarkably improved.

The invention provides a laser cutting production line task automatic allocation control method based on multi-device state coupling analysis, and belongs to the technical field of intelligent manufacturing and industrial automation. The method comprises the following steps: constructing a dynamic closed-loop control process through a central control scheduling system: receiving a task information packet of an MES; constructing an equipment state vector based on a real-time station state, and introducing a dynamic weight factor set to generate a weighted state vector; performing task triggering judgment through a coupling triggering judgment function in combination with the task dependency graph and historical task records; when the conditions are met, a task instruction is issued to the target station; and feeding back the state and updating the historical record after the task is completed. The invention further relates to AGV intelligent scheduling, visual positioning compensation, process parameter dynamic adjustment, predictive conflict detection, weight self-optimization and the like. According to the method, the production line cooperation efficiency is remarkably improved, manual intervention and system delay are reduced, and the method is suitable for an intelligent laser processing scene in which multiple devices run in parallel.

The invention provides an ultrafast laser drilling method for a carbon fiber composite material, and relates to the technical field of laser machining.The ultrafast laser drilling method comprises the steps that a material removal image and a plasma light intensity signal in the laser drilling process are obtained in real time, whether a fiber sputtering effect occurs in the material removal image or not is recognized, and if the fiber sputtering effect does not occur, the material removal image is recognized; if so, determining a hole-making influence area, and acquiring temperature distribution data of the hole-making influence area; analyzing to set a first revolution-rotation speed adjusting rule, and adjusting the revolution speed and the rotation speed of the laser based on the first revolution-rotation speed adjusting rule; and if the fiber sputtering effect occurs, quantifying the fiber sputtering effect to construct a rotation error signal, performing periodic analysis on the plasma light intensity signal to construct a revolution error signal, setting a second revolution-rotation speed adjustment rule, and adjusting the revolution speed and the rotation speed of the laser based on the second revolution-rotation speed adjustment rule.

The invention relates to the technical field of laser processing process control, and discloses an intelligent control method and system for a laser oscillator, and the method comprises the steps: collecting an optical signal, determining the current spectrum ratio measurement, and adjusting the laser oscillator according to the current spectrum ratio measurement; according to the method and the system, the technical problem that a static control target is easy to lose efficacy when facing working condition drift is solved, the control precision is improved by monitoring the adjusting quantity of the controller, and the control precision is improved. A fast and slow loop self-adaptive control logic is constructed, so that the system obtains the capability of self-calibrating a control target value, thereby being capable of self-adapting to working condition drift caused by material batches or equipment aging, and ensuring long-period process consistency.

The invention belongs to the related technical field of laser processing quality detection, and discloses a laser processing real-time defect monitoring device based on scattered light detection, which comprises a scattered light detection module, a signal processing module and a display early warning module, the detection module is used for realizing a scattered light detection function of focusing, filtering and attenuating; the signal processing module carries out various processing and enhancement on the detection signal based on a coordinate attention mechanism so as to obtain a defect judgment result; and the display early warning module is used for displaying data such as defect judgment results and the like, and giving alarms of different levels according to the severity of the defects. The invention further discloses a corresponding monitoring method. According to the invention, real-time and accurate identification of surface layer and subsurface layer defects in the laser processing process can be realized, so that the method is suitable for providing a more efficient and reliable solution for laser processing quality control in the fields of semiconductors, optical elements, aerospace and the like.

The invention discloses a coaxial multi-atmosphere water-guided laser processing device. The coaxial multi-atmosphere water-guided laser processing device comprises a laser generating module, a light-water coupling module, a protective airflow generating module and a composite nozzle assembly. And the light-water coupling module performs total reflection coupling on the water jet and the laser through the liquid nozzle to form the laser water jet. The protection airflow generation module comprises a first protection airflow generation module and at least one second protection airflow generation module and can generate multiple layers of coaxial protection airflow, the first protection airflow spirally surrounds the outer side of the laser water jet, and the second protection airflow further surrounds the outer side of the first protection airflow. The composite nozzle assembly is composed of a first nozzle and at least one second nozzle which are sequentially and coaxially nested from inside to outside, and finally outputs coaxial composite jet flow composed of laser water jet flow and multiple layers of protective airflow. The technical problem that in the prior art, it is difficult to achieve efficient drainage, prevent melt from splashing back and maintain stability of water jet at the same time is solved.

The invention relates to the technical field of processing control, and discloses an intelligent control method and system for diamond compact laser processing equipment. The method comprises the following steps: scanning a diamond compact by adopting a spectral reflection sensor and an acoustic emission signal device to obtain a four-dimensional characteristic tensor; inputting the tensor into a two-channel convolutional network to identify the grain boundary type; a PDC-Lambda algorithm is executed to construct a crystal boundary-power response mapping matrix; and establishing a three-level power regulation and control framework based on the mapping matrix to realize accurate processing control. According to the invention, accurate classification and positioning of different grain boundary types are realized. The problem that a traditional method lacks a grain boundary-power mapping mechanism is solved, and the corresponding relation between grain boundary characteristics and optimal machining parameters is established. The problem of insufficient power regulation and control precision is solved, fine parameter control from macroscopic to microscopic is realized through a three-stage regulation and control architecture, and thermal damage and microcrack formation of a grain boundary region are effectively prevented.

Laser processing equipment is provided. The laser processing equipment includes a laser module, a motion axis drive module, a thickness detection module, an upper computer and a lower computer. The laser module includes a laser light source module, a focusing lens and a zoom driving module, the laser light source module is configured to emit a laser beam, and the zoom driving module is configured to drive the focusing lens to move. The motion axis drive module is configured to drive the laser module to move. The thickness detection module is configured to collect thickness information of a base material to be processed. The upper computer generates a file to be processed based on the material information, the thickness information and a pattern mode to be processed. The lower computer is configured to control laser power, a zoom parameter and a motion axis parameter based on the file.

A water-guided laser assembly and a precision machining assembly are fixed to the same side of a sliding plate of a vertical five-axis machine tool, an ultrasonic vibration platform is installed on a C-axis workbench of the vertical five-axis machine tool, and the water-guided laser assembly, the ultrasonic vibration platform and the precision machining assembly are controlled by an industrial personal computer to cooperate with each other; a positioning measuring head is adopted to realize relative compensation of the water jet and the cutter; the water jet cooling effect is utilized in water-guided laser processing to reduce the heat affected area and improve the processing quality; ultrasonic vibration auxiliary machining effectively reduces cutting force, inhibits the surface water return phenomenon, improves machining efficiency and prolongs the service life of a cutter; and precise machining (milling, grinding and drilling) is carried out, so that the machining size precision is accurately corrected, and the residual laser-induced damage layer is removed. Through multi-energy-field in-situ combined machining, collaborative optimization of technological parameters and coordinate compensation, the problems of insufficient precision, low efficiency, thermal damage and the like during machining of complex geometrical shapes and difficult-to-machine materials in a single machining technology are solved.

The invention discloses a process manufacturing method of a cut image, which belongs to the technical field of laser cutting, and comprises the following steps of: acquiring a grid area covered by a cut graph of a material to be processed, dividing the cut graph into a plurality of vector diagrams according to the grid area, and performing slotting compensation processing on each vector diagram to obtain a corresponding cutting track; obtaining attribute information of the multiple primitives, determining a reference point of the vector diagram according to the attribute information of the primitives and the cutting trajectory, determining a light-off position on the primitives according to the reference point, the included angle and the vertex, and performing path optimization on the vector diagram according to the light-off position and the cutting trajectory to obtain a target cutting trajectory, the laser machining parameters of the cutting pattern are set based on the target cutting track and the to-be-machined material, hole blasting or hole punching caused by unstable laser of the cutting starting point can be prevented, it is guaranteed that the cutting effect of the to-be-cut material is optimal, the size precision meets the requirement, and the laser cutting efficiency is also improved.

The invention discloses a shape memory polymer micro-nano column array preparation method based on femtosecond laser processing, and belongs to the technical field of bionic adhesive materials. According to the method, an epoxy resin type shape memory polymer serves as a matrix, an anodic aluminum oxide template and a femtosecond laser micromachining technology are combined, a nano-column array is formed through AAO template copying, then a micron-column array is formed on the surface of the template through femtosecond laser machining, and finally the micron-nano composite column array with the gecko foot imitating structure is obtained. The method has the advantages of being high in machining precision, high in structural controllability, simple in process, capable of achieving large-area preparation and the like, and is suitable for material preparation in the fields of bionic adhesion, micro-nano sensing, intelligent surfaces and the like.

The invention provides a laser processing method and laser processing equipment for a solar cell, and the laser processing method comprises the steps: enabling a shaping and homogenizing light spot to move in the scanning direction to form a first processing region, and enabling an edge light spot to move in the scanning direction to form a second processing region, the two second machining areas are at least partially overlapped with the two sides of the first machining area in the scanning direction, the second machining areas cover the shaping and homogenizing light spot edge contour deformation area and / or the energy defect area, and the width size of the second machining areas is larger than the size, perpendicular to the scanning direction, of the edge contour deformation area and / or the energy defect area. Wherein the first processing area and the second processing area are formed at the same time or sequentially formed in any time sequence. The laser processing method effectively solves the technical problems that the processing effect in the whole processing breadth is inconsistent and the processing quality is affected due to the fact that the contour of the edge area of the shaping and homogenizing light spot is deformed and the tiny energy of the edge area is uneven.

The invention discloses waste stripping equipment during quartz round hole forming, and relates to the technical field of laser drilling, the waste stripping equipment comprises a laser processing table, a laser drilling head is arranged on the laser processing table, and a waste stripping assembly is arranged on the laser processing table. Through operation of the waste stripping assembly, when laser finishes drilling a single round hole, hole core waste is immediately adsorbed through negative pressure and is vertically downwards separated from the round hole, the purpose of immediately stripping the waste is achieved, retention of the hole core waste in the round hole is avoided, and it is not needed to wait for laser drilling of all the round holes to be completed; the hole core waste of a single round hole is rapidly stripped in a high-temperature state, molten quartz left on the hole wall of the round hole and the hole core waste cannot be cooled and solidified, and secondary adhesion of the round hole and the hole core waste is avoided.

The invention discloses an optical fiber laser cutting machine with an automatic feeding and discharging mechanism, and relates to the technical field of laser processing equipment. Comprising a laser cutting main machine, an automatic feeding and discharging mechanism and a central control unit. The automatic feeding and discharging mechanism comprises an intelligent storage module, a transfer robot module, a self-adaptive anti-deviation and accurate positioning mechanism, a visual scanning system and an intelligent discharging automatic collection module. The visual scanning system is innovatively integrated on the combined type vacuum adsorption end effector, so that the combined type vacuum adsorption end effector assists an anti-deviation mechanism in accurate positioning in the feeding process, finished products, waste materials and micro connection are recognized in the discharging process, and function reuse of the visual system is achieved. All the modules are coordinated to work cooperatively through the central control unit, and full-process automatic production of materials from automatic feeding, accurate positioning, laser cutting to intelligent sorting is achieved. The problems that traditional equipment is low in positioning precision, insufficient in automation degree, low in sorting efficiency and the like are effectively solved, and the production efficiency and the machining quality are remarkably improved.

The invention discloses a light spot adjustable optical system, a diffraction optical module and laser processing equipment, and relates to the technical field of precision processing. The optical system comprises a laser, a beam expander, a diffractive optical module and a focusing module which are sequentially arranged in the light path direction, the diffractive optical module comprises at least one diffractive optical element, and the diffractive optical element is manufactured based on a geometric phase liquid crystal polymer birefringent material. The diffractive optical module is used for regulating and controlling light spot characteristic parameters corresponding to a Gaussian beam, the Gaussian beam is emitted by the laser and enters the diffractive optical module after being expanded and collimated by the beam expander, and the light spot characteristic parameters comprise a light spot distribution position and light spot energy intensity. By the adoption of the optical system, laser energy distribution can be optimized, splashing is effectively restrained, and the welding quality and the processing efficiency are improved.

The invention relates to the field of aircraft hydraulic control element machining, and particularly discloses an aircraft hydraulic kinematic pair valve element lubricating structure laser surface texturing method which comprises the steps of lubricating spherical crown texture design, texturing machining path, protection cleaning, laser parameter testing, laser machining pretreatment, test piece texturing and texturing effect inspection. Machining of the micro-nano structure on the surface of the valve element of the hydraulic kinematic pair of the airplane is achieved through high-energy and short-pulse femtosecond laser, machining precision is high, controllability is high, environmental pollution is small, and compared with the prior art, abrasion of the matching face of the valve element and the cylinder sleeve kinematic pair can be reduced to a great extent; and meanwhile, high-pressure shock waves induced by femtosecond laser are utilized to form residual compressive stress on the surface of the valve element, so that oil and scrap storage and surface lubrication wear resistance of the surface of the valve element are synergistically improved, and the overall service life of the aircraft hydraulic control element is prolonged.

1. The name of the design product: laser processing equipment and its main body. 2. The use of the design product: for laser processing. 3. The design points of the design product: the shape of design 1 to design 7, the combination of shape and color of design 8. 4. The picture or photo that best shows the design points: design 1 perspective view 1. 5. Design 1 is designated as the basic design. 6. Other circumstances that need to be explained: A, B, C, D, E, F, G, H, I, J, K, L are transparent parts; design 3 and design 7 are partial designs, the solid line in the view of design 3 and design 7 represents the main body of the laser processing equipment, the dashed line in the view of design 3 and design 7 does not constitute any part of the subject design, and the dashed line part does not require protection; the design for protection includes the color of design 8.

The invention belongs to the technical field of laser cutting, and particularly relates to cutting machining equipment for slow-rebound sponge and a using method of the cutting machining equipment, and the cutting machining equipment comprises a negative pressure adsorption assembly, a local gas recovery assembly, a sponge mounting platform assembly, a synchronous fan assembly, a laser cutting assembly, a plane supporting assembly and a fan driving assembly. Through the hollow interlayer and the floating air pipes arranged in an array mode, the sponge layer is adsorbed and fixed in a directional airflow mode under the condition that the sponge layer is not extruded and deformed; based on the scheme, the invention further provides an elastic element and a recovery cover, through negative pressure in the recovery cover, the floating air pipe located on the recovery cover can stop being communicated with the hollow interlayer and is converted into being communicated with the recovery cover, and therefore the technical effect that gas at the laser machining part is independently recovered is achieved.

The invention discloses a seesaw type optical fiber end face weak force sensor which comprises a seven-core optical fiber, a seesaw type additive structure and an interference light beam. The seven-core optical fiber is composed of a central main fiber core and six symmetrically-distributed auxiliary fiber cores. The seesaw-type additive structure is composed of a short vertical beam, a vertical beam on a central main fiber core of the seven-core optical fiber and a cross beam connected to the vertical beam, and the whole structure is prepared through the two-photon polymerization technology of a femtosecond laser processing platform; the interference light beam is composed of two light beams in an interference cavity, wherein the lower surfaces of the left side and the right side of the seesaw-type additive structure are aligned with the end faces of two auxiliary fiber cores on the left side and the right side of the seven-core optical fiber. According to the invention, a two-photon polymerization technology is used to build an additive structure on the end face of the seven-core optical fiber, so that the sensing structure is small in overall size and is suitable for application in a limited space; the Fabry-Perot interferometers on the two sides of the sensing structure are connected in parallel to form an optical dynamic vernier structure, the sensitivity is improved through differential amplification of weak mechanical disturbance, and the anti-interference capability is enhanced through common-mode denoising.