3355results about "Soldering apparatus" patented technology

The invention relates to the technical field of data processing, and discloses a method and system for monitoring the running state of reflow soldering equipment. The method comprises the steps of collecting data through a multi-point sensor, extracting temperature gradient, tension fluctuation and gas concentration characteristics, constructing a state recognition model, calculating a health index and setting an early warning threshold value, constructing a fault precursor extraction model to predict a future state, and finally establishing a maintenance strategy optimization system and generating an equipment maintenance plan based on fault early warning information. Through multi-dimensional data fusion and intelligent analysis, early accurate identification of the abnormal state of the equipment, accurate prediction of the fault development trend and active maintenance decision based on quality influence and cost optimization are realized, so that the welding quality stability is improved, the non-planned downtime is shortened, and the maintenance cost is reduced.

The invention provides a chip welding method based on machine vision and control, and the method comprises the steps: obtaining a three-dimensional model of a chip and a substrate, obtaining an initial relative position of a chip welding spot and a substrate welding pad, and generating a mechanical arm initial motion instruction; images of the chip and the substrate are shot, pose deviation is calculated through image registration, if the deviation exceeds a threshold value, a compensation instruction is generated to be fused with an initial instruction, and the track of a mechanical arm is adjusted to be aligned with a bonding pad; a temperature sensor array is constructed to monitor the temperature of the welding area, the average temperature is calculated, and if a difference exists between the average temperature and the ideal welding temperature interval, the heater power is adjusted through a proportional integral differential algorithm; a piezoelectric sensor is used for obtaining a mechanical arm joint vibration signal, the dominant vibration frequency and amplitude are extracted through fast Fourier transform, and a piezoelectric actuator is used for generating an anti-phase driving signal to counteract vibration.

A component includes a body having a coupon opening defined therein, and an additively manufactured (AM) metal coupon including a dense region, a porous region adjacent the dense region, and a coupon outer surface. The porous region has a first cross-sectional area at a first location at or near the coupon outer surface and a second cross-sectional area less than the first cross-sectional area at a second location distal from the coupon outer surface. A braze material couples the metal coupon in the coupon opening and infiltrates into the porous region, e.g., based at least on a characteristic of the porosity thereof. The dense region may have a third cross-sectional area at the first location and a fourth cross-sectional area greater than the third cross-sectional area at the second location so it can direct the braze material in the porous region toward an inner surface of the coupon opening.

A metal coupon (200) for repairing a component (202) includes an additively manufactured (AM) metal member (210) having at least two porous regions (300) and a braze material infiltration barrier (304) positioned between the at least two porous regions (300). The braze material infiltration barrier (304) has a lower porosity than the at least two porous regions (300). A component (202) using the metal coupon (200) may also include a braze material (310) coupling the metal coupon (200) in a coupon opening (204) in the body (206). The braze material (310) infiltrates at least one of the two porous regions (300), and the braze material infiltration barrier (304) separates the braze material (310) in the at least one of the two porous regions (300) from at least one other of the at least two porous regions (300). Different braze materials may be used in each porous region.

An additive manufactured (AM) metal coupon for a turbomachine component is provided. The component includes an airfoil body having a pressure side, a suction side, a trailing edge, and a coupon opening. The AM metal coupon has an AM metal member with at least one slanted coupon side wall at an angle of less than 90° with an exterior surface of the AM metal member. The AM metal member also has a first porous region having a first porosity and a second porous region having a second porosity different than the first porosity. A braze material couples the AM metal coupon in the coupon opening in the airfoil body and infiltrates into at least one of the first porous region based at least on a characteristic of the first porosity and the second porous region based at least on a characteristic of the second porosity.

A metal coupon includes an additively manufactured (AM) metal member having a porous region having between 2% to 50% open space volume to total volume. The metal coupon includes a first section of an anchor configured to interact with a second section of the anchor in a coupon opening of a body of a component. A component including the metal coupon may include the body including the coupon opening, and an anchor including a first section in or on one of the AM metal coupon and the body and a second section in or on the other of the AM metal coupon and the body. At least the first and second sections cooperatively hold the AM metal coupon in the coupon opening in the body. Braze material couples the coupon in the coupon opening in the body. The braze material infiltrates into the porous region.

The invention discloses an automatic bending and tin immersion device and method based on electromagnetic coil pins, and the device comprises a loading turntable structure which is provided with a controllable rotary turntable surface and a plurality of groups of electromagnetic coil stations; the loading and unloading carrying structure is arranged corresponding to the loading turntable structure; the pin bending structure is used for outputting stamping kinetic energy to bend electromagnetic coil pins; the soldering-aid dipping structure comprises a soldering-aid shifting and transposition assembly and a soldering flux lifting assembly, the soldering-aid shifting and transposition assembly is provided with a transposition kinetic energy output end, and the soldering flux lifting assembly is provided with a soldering flux lifting end; the pin tin immersion structure comprises a tin immersion transfer assembly and a tin melting liquid storage assembly. And the impedance detection structure comprises an upper and lower limit alarm resistance meter and a test probe, and can be arranged corresponding to the plurality of groups of electromagnetic coil stations in a switchable manner. The problems that in the prior art, bending and tin immersion processes of electromagnetic coil pins generally depend on manual operation, so that the overall automation degree, the operation efficiency and the qualified rate are low, and the labor cost is high are solved.

A metal coupon for repairing a component includes an additively manufactured (AM) metal member having a conduit in an interior of the AM metal member, and a first porous region around the conduit. The conduit is hollow. The porous metal coupon with conduit allows a braze material to be directed based on characteristics of the first porous region. A second porous region may be provided inside the conduit to increase heat rejection of the conduit.

The present disclosure relates to a method of using a metal specimen block having a porous region for a component. A method of coupling a metal sample block (200) to a component (202) may include additive manufacturing a metal sample block (200) having a first porous region (300A) having a first porosity and a second porous region (300B) having a second porosity different from the first porosity. A metal specimen block (200) is positioned in a specimen block opening (204) in a body (206) of the component (202). The metallic sample block (200) may be infiltrated with a braze material (310) to couple the metallic sample block (200) in a sample block opening (204) in the body (206). The one or more brazing materials (310) are infiltrated into at least one of the first porous region (300A) and the second porous region (300B) based at least on a characteristic of the first porosity and at least on a characteristic of the second porosity. The cured braze material (310) includes different segments having different physical properties based on different porosities and / or different braze materials.

A component includes a dense base region, a dense replacement region and an additively manufactured (AM) porous region between the dense base region and the dense replacement region. The porous region has a porosity between 2% to 50% open space volume to total volume of the AM porous region. The porous region can be printed onto the base region or the replacement region. A braze material couples the base region, the porous region and the replacement region together, and infiltrates into the porous region based at least on a characteristic of the porosity. The porous region reduces stress at a joint between the dense regions and can be customized to create different physical characteristic(s) than just those of the base and replacement regions.

A component (202) is disclosed that includes a body (206) and an additive manufactured (AM) metal mass (200) that includes a first section (292) and a stress relief section (294). The stress relief section (294) includes a porous region (300) having a porosity in which an open spatial volume accounts for 2% to 50% of the total volume of the stress relief section (294). The stress relief section (294) has a smaller at least one of thermal conductivity, tensile strength, ductility, and fatigue strength than the first section (292). A braze material (310) couples the AM metal specimen block (200) to a specimen block opening (204) in the body (206). The stress relief section (294) creates a low stress zone in the metal specimen block (200), which can be located near or adjacent to a high stress zone. The stress relief section (294) reduces residual stress in the metal sample block (200), which reduces related challenges to couple the metal sample block (200) to the body (206) of the component (202), particularly in the case of the use of superalloy materials.

A metal coupon (200) for repairing a component (202) includes an additively manufactured (AM) metal member (330) having a sealed cavity (296) in an interior of the AM metal member (330), and a porous region (300) around the sealed cavity (296). A metal coupon system (210) may include at least two AM metal parts (292) with each AM metal part (292) including at least a section (294) of a sealed cavity (296) therein and a porous region (300) around the at least a section (294) of the sealed cavity (296). The AM metal parts (292) combine to form the metal coupon (200), i.e., AM metal member (330), with the sealed cavity (296) in an interior thereof and the porous region (300) around the sealed cavity (296). In any event, the sealed cavity (296) is hollow. The porous metal coupon (300) with sealed cavity (296) provides reduced mass and allows braze material (310) to be directed based on characteristics of the porous region (300).

An additive manufactured (AM) metal coupon (200) for a turbomachine component (202) is provided. The component (202) includes an airfoil body (206) having a pressure side (152, 178), a suction side (154, 180), a trailing edge (158, 184), and a coupon opening (204). The AM metal coupon (200) has an AM metal member (290) with at least one slanted coupon side wall (292, 294) at an angle of less than 90° with an exterior surface (296) of the AM metal member (290). The AM metal member (290) also has a first porous region (300A) having a first porosity and a second porous region (300B) having a second porosity different than the first porosity. A braze material (310) couples the AM metal coupon (200) in the coupon opening (204) in the airfoil body (206) and infiltrates into at least one of the first porous region (300A) based at least on a characteristic of the first porosity and the second porous region (300B) based at least on a characteristic of the second porosity.

The invention relates to a porous metal sample block with a pipeline for repairing a component, the component with the porous metal sample block and a related method. A metal sample block (200) for repairing a component (202) includes an additive manufactured (AM) metal component (330) having a conduit (296) inside the AM metal component (330) and a first porous region (300) surrounding the conduit (296). The duct (296) is hollow. A porous metal sample block (200) with conduits (296) allows the brazing material (310) to be directed based on characteristics of the first porous region (300). The second porous region (350) can be disposed within the conduit (296) to increase heat dissipation of the conduit (296).

A component including a body, and an additively manufactured (AM) metal coupon including a first section and a stress-relief section, is disclosed. The stress-relief section includes a porous region having a porosity between 2% to 50% open space volume to total volume of the stress-relief section. The stress-relief section has at least one of thermal conductivity, tensile strength, ductility, or fatigue strength less than first section. A braze material couples the AM metal coupon to a coupon opening in the body. The stress-relief section creates a low-stress zone in the metal coupon that can be located near or adjacent to a high-stress zone. The stress-relief section reduces residual stress in the metal coupon, which reduces the related challenges of coupling the metal coupon to the body of the component, especially where superalloy materials are used.

A metal coupon for repairing a component includes an additively manufactured (AM) metal member having at least two porous regions and a braze material infiltration barrier positioned between the at least two porous regions. The braze material infiltration barrier has a lower porosity than the at least two porous regions. A component using the metal coupon may also include a braze material coupling the metal coupon in a coupon opening in the body. The braze material infiltrates at least one of the two porous regions, and the braze material infiltration barrier separates the braze material in the at least one of the two porous regions from at least one other of the at least two porous regions. Different braze materials may be used in each porous region.

The invention discloses a fishbone-Tesla valve micro-mixing chip and a preparation method and application thereof.The micro-mixing chip comprises a chip body, a Tesla valve and at least two mixing inlets are formed, the Tesla valve comprises at least one mixing unit, the mixing inlets are communicated with the unit inlets of the mixing units on the outermost side, and the mixing units are communicated with the mixing inlets of the mixing units on the outermost side; at least one mixing unit in the Tesla valve is provided with at least one fishbone structure, and the sharp corner of the fishbone structure faces the mixing inlet. At least one fishbone structure is arranged in the Tesla valve, the sharp corner of the fishbone structure faces the mixing inlet, when fluid in the Tesla valve flows through the fishbone structure, the fluid in the Tesla valve dispersedly flows towards the two sides through the fishbone structure, transverse flowing of the fluid is promoted, and therefore the mixing efficiency of the micro mixing chip is improved.

A semiconductor device includes semiconductor elements and conductors. The conductors include a first upper conductor connected to an upper electrode of the first semiconductor element through a first upper solder, a first lower conductor connected to a lower electrode of the first semiconductor element through a first lower solder, a second upper conductor connected to an upper electrode of the second semiconductor element through a second upper solder, a second lower conductor connected to a lower electrode of the second semiconductor element through a second lower solder, and a joint conductor connecting the first upper conductor and the second lower conductor through a relay solder. Each solder contains Cu and Sn. Each solder connection target has an Ni layer. A grain size of at least one of the first upper solder, second upper solder, or relay solder is smaller than a grain size of the first and second lower solders.

The invention discloses an automatic deviation correction system and a deviation correction method for the weld of a brazed and cut part, comprising: calibrating a camera; calibrating a laser sensor; image acquisition and weld detection; feature point extraction and weld positioning; contour line fitting; extraction of the weld center axis; and weld trajectory planning. The beneficial effect is that the automatic deviation correction system and the deviation correction method for the weld of a brazed and cut part, by capturing the original image and processing it through bilateral filtering, and then using the synergistic effect of a spatial distance weight function and a pixel value similarity weight function, effectively suppress the noise salt and pepper effect, sharpen the weld boundary features, and avoid boundary misjudgment caused by noise interference; boundary detection follows the convolution operation logic, and the horizontal and vertical convolution kernels interact deeply with the image matrix, thereby realizing quantized gradient amplitude and direction; by traversing the grayscale threshold combination and maximizing the between-class variance calculation, the image is binarized and the main contour of the weld is highlighted.

The invention provides a method for predicting the bonding performance of a high-nitrogen steel / titanium interface, and the method comprises the steps: constructing a titanium crystal structure model, a titanium-based brazing filler metal crystal structure model corresponding to titanium-based brazing filler metal, and a high-nitrogen steel crystal structure model, constructing a titanium-titanium-based brazing filler metal-high-nitrogen steel interface composite model on the basis of a titanium crystal structure model according to a titanium crystal cell crystal face obtained through segmentation in a corresponding first segmentation mode, and carrying out atom replacement on atoms of the titanium-titanium-based brazing filler metal-high-nitrogen steel interface composite model for multiple times to obtain the titanium-titanium-based brazing filler metal-high-nitrogen steel interface composite model. The titanium-titanium-based brazing filler metal-high-nitrogen steel interface composite models are subjected to atom replacement, multiple different titanium-titanium-based brazing filler metal-high-nitrogen steel interface composite models obtained after atom replacement are obtained, the titanium-titanium-based brazing filler metal-high-nitrogen steel interface composite models obtained before and after atom replacement are subjected to multi-dimensional bonding performance evaluation, and multi-dimensional bonding performance parameter indexes are obtained; and a target titanium-titanium-based brazing filler metal-high nitrogen steel interface composite model meeting the target requirement is determined, and the titanium-based brazing filler metal corresponding to the target titanium-titanium-based brazing filler metal-high nitrogen steel interface composite model is determined as the target titanium-based brazing filler metal.

The invention discloses a manufacturing process of a wafer heating plate, and relates to the technical field of PECVD (Plasma Enhanced Chemical Vapor Deposition) equipment manufacturing. Comprising the steps that a containing groove is formed in the bottom of a hot plate top shell; a heating pipe body is adopted to coil a resistance heating structure, the resistance heating structure comprises a heating disc and a lead pipe, and a resistance wire is arranged in the heating disc; a resistance wire is arranged in the lead tube; the K couple is assembled in the hot plate top shell and used for measuring the temperature of the hot plate top shell; a heating disc of a resistance heating structure is placed in the containing groove, a gap between the heating disc and the containing groove is filled with aluminum powder, and vacuum brazing welding is carried out; the hot plate bottom shell is welded to the bottom of the hot plate top shell, and the lead pipe penetrates out of a first through hole of the hot plate bottom shell. The hot plate neck shell is connected to the lower portion of the hot plate bottom shell, the hot plate neck shell is provided with a second through hole which is formed in a penetrating mode, and the second through hole is communicated with the first through hole. According to the heating disc manufactured by the process, each wafer can be uniformly and stably heated through reasonable layout and an optimized resistance heating structure.

The invention discloses a preparation method of a vertical comb-driven MEMS (Micro Electro Mechanical System) micromirror, which comprises the following steps of: forming a through alignment mark and a pre-etched comb structure on a device layer by using a first composite mask, and forming the through alignment mark and the pre-etched comb structure on the back surface of the device layer on a first substrate through a composite mask process, after the first substrate and the second substrate are bonded, the self-alignment composite mask of the comb tooth structure is aligned with the back face pre-etched comb tooth structure through the through alignment mark, high-precision alignment of the comb tooth structure is achieved, accumulated errors are avoided, and the yield of device preparation is improved.

The invention discloses a vacuum microcavity interferometer chip, a manufacturing method and a low-drift optical pressure sensor, a film island structure is formed on the upper surface of a first substrate, and the film island structure comprises a protruding part and a pressure sensitive film surrounding the protruding part; a first side wall part, a getter cavity, a second side wall part and an F-P interference cavity located in the center are sequentially arranged on the lower surface of the first substrate in the radial direction, a first reflecting surface is deposited on the lower surface of the first substrate in the F-P interference cavity, and a second reflecting surface is deposited on the upper surface of the second substrate in the F-P interference cavity. A first optical antireflection film is deposited on the surface of the protruding part, and the first optical antireflection film, the protruding part, the pressure sensitive film, the first reflecting surface and the second reflecting surface have the same center; the filter further comprises a vent hole, and the vent hole is formed in the second side wall part and used for communicating the getter cavity and the F-P interference cavity.

A self-correcting wave soldering machine for soldering a RGB in an SMT manufacturing system. The wave soldering machine includes at least one thermal infrared camera that generates thermal images of the RGB so as to provide thermal imaging processing to monitor, characterize and predict processing temperatures. The wave soldering machine generates a heat map using the thermal images and compares the heat map to a thermal gradient to provide real time profiling by digitally connecting it to heating and other mechanically controlled systems, such as flux dispensing, conveyor speed and parallelism of the wave soldering machine.

The invention relates to the technical field of brazing equipment, and discloses brazing equipment and a welding process for semiconductor heating plate machining, the brazing equipment comprises a bottom plate, the top of the bottom plate is rotatably connected with a placing table, a heating plate workpiece is placed on the top of the placing table, and the top of the bottom plate is fixedly connected with a main body frame. Through the design of the welding mechanism, a heating disc workpiece is placed on the top of a placing table, then a welding gun body works and then cooperates with a brazing filler metal bar to execute a brazing task, in the period, the welding height can be adjusted by controlling a lifting block to ascend and descend, and a connecting plate can be controlled to swing with a rotating shaft as the axis; compared with hot isostatic pressing welding, the welding mode of the welding device avoids the situation that the non-welding part of the heating plate workpiece is deformed due to the fact that the temperature is too high, and then excessive manual participation is not needed in the welding process, so that the labor cost is greatly saved.

The invention provides a pressure sensor based on silicon-silicon bonding and a preparation method thereof. The preparation method comprises the following steps: providing a low-resistance silicon wafer, forming a silicon deep hole in a first surface of the low-resistance silicon wafer, and depositing an isolation material in the silicon deep hole to form an isolation ring; etching the first surface to form a shallow groove and a conductive silicon column to obtain a low-resistance cap wafer; providing an SOI wafer, performing ion implantation on the first surface of the SOI wafer to form a resistance region, and obtaining a substrate wafer; bonding the low-resistance cap wafer with the substrate wafer; grinding the second surface of the low-resistance cap wafer until the isolating ring is exposed; depositing an insulating layer on the second surface of the low-resistance cap wafer, and forming a metal electrode on the insulating layer; and forming a back cavity structure on the second surface of the substrate wafer, exposing the top silicon of the SOI wafer, and forming a sensitive film layer. The conductive silicon column is made of low-resistance silicon, copper ion pollution is avoided, the preparation process is simple, and the period is controllable; the device obtained based on the silicon-silicon bonding process has high bonding strength and high air tightness.

The invention provides a method for aligning a bonding body wafer on a non-infrared exposure machine, which comprises the following steps of: providing the bonding body wafer which comprises a plurality of wafers in bonding connection, and forming alignment marks on the bonding surfaces of the wafers which are mutually bonded; manufacturing an alignment photomask, wherein the alignment photomask is provided with an alignment mark window pattern; forming an alignment mark window on the surface of the bonding body wafer by utilizing photoetching and etching processes through an alignment photomask, and exposing the alignment mark on the bonding surface through the alignment mark window; and carrying out photoetching alignment through the exposed alignment mark. According to the method, the alignment problem when the alignment mark on the non-infrared exposure machine is positioned in the bonding body wafer is solved. The invention further provides a preparation method of the semiconductor device, the alignment method is adopted for alignment after the front face and the back face of a bonding body wafer are thinned, then the pattern face of the device is processed, and possible pollution to the bonding face and possible damage to the pattern face are avoided.

The invention discloses a ceramic-metal composite structure with a low thermal expansion coefficient and a middle layer for assisting two-step temperature control brazing and a preparation method of the ceramic-metal composite structure. The composite structure is formed by metallurgical bonding of a ceramic matrix, a titanium-containing active brazing filler metal layer, a low-thermal-expansion-coefficient (2 * 10 <-6 > / K-9 * 10 <-6 > / K) middle layer, a low-temperature brazing filler metal layer and metal base metal in sequence. During preparation, a step-by-step temperature control brazing process is adopted, wherein in the first step, ceramic / intermediate layer connection is achieved through titaniferous active brazing filler metal with the solidus larger than or equal to 780 DEG C under the vacuum condition smaller than or equal to 5 * 10 <-3 > Pa; and secondly, under the vacuum or inert atmosphere, brazing filler metal with the solidus being smaller than or equal to 650 DEG C is adopted for completing connection of the middle layer and the metal base metal. The low-stress and high-strength ceramic-metal composite structure is successfully constructed on the basis of the thermal matching design of the low-thermal-expansion-coefficient middle layer and the ceramic and the stress gradient release mechanism of the two-step temperature control brazing process in a cooperative coupling mode, and the low-stress and high-strength ceramic-metal composite structure is particularly suitable for the high-temperature and high-reliability fields of aerospace thermal protection systems, high-power electronic device packaging and the like.

A hollow vane assembly including an open body including an interior; at least one cover support structure formed in said open body proximate the interior; a cover brazed to the open body to form at least one flow passage; and the open body and the cover configured as two piece substantially symmetrical halves.

The invention discloses a niobium-zirconium alloy and nickel-based alloy vacuum brazing process and a part, and belongs to the technical field of vacuum brazing. According to the process, a vacuum brazing furnace is adopted for brazing, and BNi-2 brazing filler metal is used; the process comprises the following steps that S1, a welding assembly structure formed by a niobium-zirconium alloy part and a nickel-based alloy part is assembled, and BNi-2 brazing filler metal is arranged at the matching position of the welding assembly structure; s2, staged heating is carried out on the welding assembly structure under the preset vacuum degree of the vacuum brazing furnace, and the staged heating comprises a foreign matter removing heating stage, a brazing filler metal solid diffusion heating stage and a brazing filler metal melting wetting heating stage which are sequentially carried out; and S3, staged cooling is conducted on the welded assembly structure after welding is completed, the staged cooling comprises a furnace cooling stage and a gas quenching cooling stage which are conducted in sequence, according to the scheme, defect control over the niobium-zirconium alloy and nickel-based alloy welding joint can be effectively achieved, and the strength and sealing performance of the welding joint are guaranteed.