795results about "Soldering apparatus" patented technology

The invention discloses a preparation method of a vertical comb-driven MEMS (Micro Electro Mechanical System) micromirror, which comprises the following steps of: forming a through alignment mark and a pre-etched comb structure on a device layer by using a first composite mask, and forming the through alignment mark and the pre-etched comb structure on the back surface of the device layer on a first substrate through a composite mask process, after the first substrate and the second substrate are bonded, the self-alignment composite mask of the comb tooth structure is aligned with the back face pre-etched comb tooth structure through the through alignment mark, high-precision alignment of the comb tooth structure is achieved, accumulated errors are avoided, and the yield of device preparation is improved.

This disclosure provides systems, methods, and apparatuses, including computer programs encoded on computer storage media, that provide for welding techniques for manufacturing robots, such multipass welding techniques for welding robots. For example, the welding techniques may enable generation of weld instructions based on a welding fill plan. The instructions may be generated based on a bead model or a table that indicates a wire feed speed, a travel speed, or a voltage. As another example, the techniques may enable generation of weld instructions based on the one or more dimensions of a seam. As another example, the techniques may enable generation of a joint model of a cross-section of a seam to be welded. The joint model may be generated based on a combination of a plurality of feature components to generate the joint model of the seam. Other aspects and features are also claimed and described.

The invention discloses a composite aluminum plate with an embedded mixed melting layer microstructure and a cast-rolling preparation method of the composite aluminum plate, and belongs to the technical field of aluminum alloy material preparation, the composite aluminum plate comprises a coating aluminum alloy, a matrix aluminum alloy and an embedded brazing flux mixed melting layer, the coating aluminum alloy is connected with the matrix aluminum alloy through the embedded brazing flux mixed melting layer, and the matrix aluminum alloy is connected with the embedded brazing flux mixed melting layer. The pre-embedded brazing flux mixed melting layer is a controllable mixed metal layer formed by mixing pre-embedded brazing flux metal and a fusion layer formed by a solid-liquid cast rolling process, the cast rolling preparation method is a coating-cast rolling combined preparation method, and the method has the advantages of being short in process, high in production efficiency, high in pre-embedded layer control precision and the like, and large-scale production of products is facilitated.

The invention provides an MEMS pressure sensor, a manufacturing method thereof and an electronic device, and the method comprises the steps: providing a first substrate and a second substrate, forming a first pressure structure on the first substrate, and forming a second pressure structure on the second substrate; bonding the first pressure structure and the second pressure structure; the first substrate is removed, the first pressure structure and the second pressure structure jointly form a third pressure structure, the third pressure structure comprises a first electrode layer, a second electrode layer, a third electrode layer, a fourth electrode layer and a fifth electrode layer which are arranged at intervals from top to bottom, and a dielectric layer is formed between every two adjacent electrode layers; and cavities penetrating through the dielectric layers are formed in the dielectric layers. According to the scheme, the multiple electrode layers arranged from bottom to top are formed, the multiple electrode layers form the first capacitor, the second capacitor, the third capacitor and the fourth capacitor respectively, then the Wheatstone bridge is formed jointly, the measurement precision of the MEMS pressure sensor is improved, meanwhile, the plane size of the MEMS pressure sensor is reduced, and the integration level of the device is improved.

The embodiment of the invention discloses a dynamic regulation and control system for lead-free brazing filler metal welding process parameters based on reinforcement learning. The dynamic regulation and control system comprises a data acquisition module, a data processing module and a control module. The data acquisition module is used for acquiring original welding data in real time; the data preprocessing module is used for performing space-time alignment on the original welding data to obtain a space-time consistency data set and performing feature compression on the space-time consistency data set to obtain a welding feature vector; the decision generation module is used for fusing the welding feature vectors into enhanced state vectors, and generating a parameter adjustment strategy for the enhanced state vectors through an Actor-Critic network architecture on the basis of a reinforcement learning algorithm; the decision control module is used for converting the parameter adjustment strategy into a welding equipment control instruction, implementing safety constraint on the welding equipment control instruction and outputting a safety verification control instruction; and the decision execution and optimization module is used for executing the security verification control instruction, optimizing network architecture parameters and generating an update adjustment strategy. The welding quality and the welding efficiency can be obviously improved.

The invention relates to the technical field of vacuum brazing, and discloses a vacuum brazing method for a needle array radiator, which comprises the following steps of: fusing reference process parameters of a historical process knowledge base and multi-dimensional characteristic parameters of the needle array radiator to obtain brazing process characteristic parameters; performing process strategy matching on the needle array radiator to confirm a vacuum brazing strategy of the needle array radiator; a vacuum brazing strategy is applied, and a vacuum brazing furnace is driven to execute stage process operation of preheating degassing, brazing filler metal melting and spreading, diffusion bonding and controllable cooling; performing situation analysis on the real-time process data flow of the stage process operation to obtain deviation data; dynamic parameter reconstruction is conducted on the target brazing stage of the needle array radiator, and temperature regulation and control parameters and process logic parameters are obtained; the needle array radiator is subjected to circulating brazing control, and a post-welding component of the needle array radiator is obtained; the efficiency of the vacuum brazing method for the needle array radiator can be improved.

The invention relates to the technical field of MEMS radiator processing, in particular to a processing method of an MEMS radiator, which comprises the following steps of: 1, manufacturing an air inlet grid opening, a gas advection bin body, a vibration upper opening binding ring, a piezoelectric vibrator, a flexible circuit board, a vibrator amplification layer, a gas beam dense hole layer and an impact platform according to the size; 2, the flexible circuit board and the piezoelectric vibrator form a circuit piezoelectric vibrator through reflow soldering; 3, the air inlet advection bin body, the vibration upper opening binding ring, the circuit piezoelectric vibrator, the vibrator amplification layer, the air beam dense hole layer and the impact platform are assembled from top to bottom. According to the machining method of the MEMS radiator, firstly, solder paste is printed on a flexible circuit board steel mesh to lead welding spots, the flexible circuit board steel mesh and the piezoelectric vibrator are placed into a clamp together to be fixed, and then the flexible circuit board steel mesh is welded to the piezoelectric vibrator; the circuit piezoelectric vibrator prepared by the method is reliable and durable, and welding spots are not easy to fall off, so that the piezoelectric vibrator can have better stability in high-frequency vibration.

The invention provides a preparation method of a micro-channel pipe structural member for a liquid cooling plate, and belongs to the technical field of liquid cooling plates. The invention discloses a preparation method of a micro-channel pipe structural member for a liquid cooling plate. The preparation method comprises the following steps: S1, preparing raw materials for forming the liquid cooling plate; s2, carrying out roll bending forming treatment on the upper wallboard raw material; s3, roll bending forming treatment is conducted on the lower wall plate raw material; s4, the micro-channel pipe raw material is subjected to roll bending forming treatment; s5, the upper wall plate structural part, the lower wall plate structural part and the micro-channel pipe structural part which are subjected to roll bending forming treatment are connected and fixed through brazing, and a final three-layer structural part is assembled; and S6, a cooling water nozzle is installed at the position of the micro-channel pipe structural part. According to the method, roll bending is conducted firstly, then welding is conducted, the method has the advantages of being efficient and rapid in forming, integrated forming can be achieved on complex profiles through the process, high-temperature diffusion bonding is avoided, and therefore the service life of the three-layer plate is greatly prolonged, and the mechanical property of formed components is greatly improved.

The invention belongs to the technical field of graphite metal composite heat dissipation devices, and provides a flexible graphene film heat conduction cable and a preparation method thereof.The preparation method comprises the steps that the surface of a graphene film is cleaned and punched, and the graphene film with micron-sized pores in the surface is obtained; sequentially plating a layer of active metal film and a layer of heat-conducting metal film on the surface of the graphene film, and cutting to obtain a graphene film; graphene films are overlaid layer by layer to obtain a laminated material, and the two ends of the laminated material are clamped to a hot-pressing mold to be subjected to hot-pressing welding treatment, so that a locally connected flexible heat conduction section is obtained; and the flexible heat conduction section and the heat conduction metal shell are assembled, a soldering lug is placed for brazing and finish machining, and the flexible graphene film heat conduction cable is obtained. According to the method, the internal connection problem of the flexible section is solved by establishing a synergistic process of surface punching, double-layer coating and hot pressing, the heterogeneous connection problem of the flexible section and the shell is solved in a manner of sampling coating and brazing, and through the synergistic effect of all links, the overall performance and reliability of the heat-conducting cable are remarkably improved.

The invention discloses a computer mainboard welding temperature correction control method based on machine learning, which relates to the technical field of intelligent control, and comprises the following steps: predicting a reference welding temperature curve by using a machine learning model based on historical operation data of reflow welding of a computer mainboard; dividing a thermal management area based on the thermal characteristics of the component; determining an optimal welding temperature curve; on the basis of the divided heat management areas, regionalization adjustment is conducted on the optimal welding temperature curve, and temperature area parameter fine adjustment strategies for the different heat management areas are generated; and based on the optimal welding temperature curve and the fine adjustment strategy, a final temperature control instruction set is synthesized, and the reflow soldering furnace is controlled for batch production. The method has the advantages that through fusion of machine learning and real-time data driving optimization, on the premise that the welding reliability is guaranteed, the production efficiency and energy consumption are intelligently balanced, and the adaptability and the intelligent level of a production line are remarkably improved.

A three-dimensional vapor chamber assembly structure includes a housing, heat pipes, a capillary member and a working fluid. The housing includes a first housing plate and a second housing plate, a cavity formed between the first and second housing plates, and through holes formed on the second housing plate. The heat pipe penetrates through the through holes and includes an open end having a flange formed thereon. The flange includes lateral and longitudinal surfaces. The lateral surface of the flange is attached to the second housing plate via a welding layer, and the longitudinal surface of the flange is attached to the second housing plate via a welding product. The capillary member is arranged inside the cavity and attached to the housing. The working fluid is arranged inside the cavity. Accordingly, a firm and robust vapor chamber structure capable of preventing welding material from entering the cavity is achieved.

The invention relates to the technical field of dissimilar material connection, in particular to a method for regulating and controlling molybdenum steel brazed joint intermetallic compounds based on transition elements. According to the technical scheme, the method comprises the following steps that a transition element coating is deposited on the surface of a molybdenum matrix, transition elements are selected from one or more of Ti, V, Nb, Zr, Hf and Ta, and the molybdenum matrix and a steel matrix are brazed through boron-containing Ni-based brazing filler metal; in the brazing process, the transition element and the boron element preferentially react to generate a transition element boride, and therefore generation of MoNiBintermetallic compounds is inhibited. According to the method, the transition element coating is introduced, a brazing interface reaction path is actively intervened and reconstructed from the thermodynamic angle, and the problem of continuous generation of the brittle MoNiBintermetallic compound in the molybdenum / steel brazing joint is fundamentally solved.

The invention relates to the related technical field of welding control, in particular to a sensor pin welding control method and system.The sensor pin welding control method comprises the steps that according to a sensor pin, welding environment parameters are obtained, basic welding parameters are determined, a welding control parameter matrix is set in combination with a first welding execution instruction sequence and a second welding execution instruction sequence, and a welding path is dynamically corrected; and meanwhile, welding process restarting and welding spot forming quality compensation after basic welding parameter correction are carried out according to the dynamic back-off welding execution path. The technical problems that a preset fixed track is adopted in a welding path, sensor pin assembly errors cannot be effectively compensated, and pseudo soldering and false soldering risks exist are solved, basic welding parameters are determined, welding conditions are accurately matched with material characteristics and a real-time environment, the welding path is dynamically corrected in combination with a welding control parameter matrix, and the welding quality is improved. And after parameter correction, process restarting and welding spot forming quality compensation are carried out, and the technical effects of improving the welding yield and the product consistency are achieved.

The invention relates to the technical field of material sealing, in particular to a high-performance insulating ceramic sealing method for a neutron tube, which comprises the following steps: sequentially carrying out organic solvent ultrasonic cleaning and argon plasma etching activation treatment on a sealing surface of a cylindrical high-purity aluminum oxide ceramic piece, and depositing a titanium transition layer through magnetron sputtering, the ceramic piece with the titanium transition layer is obtained; the sealing face of the kovar alloy cylindrical flange plate is subjected to acid pickling, an oxide layer is removed, cleaning and drying are conducted, and a metal sealing part is obtained; preparing an active brazing filler metal sheet; the components are assembled in sequence to form a pre-assembled component; the pre-assembled component is placed in a vacuum brazing furnace, axial pre-tightening force is applied to the pre-assembled component, sealing is completed, then cooling is controlled, and a sealing piece with an airtight brazing joint is formed; and carrying out annealing treatment to obtain a finished product sealing assembly. Therefore, the problems of low dielectric strength, large thermal expansion coefficient difference, difficulty in interface quality control and the like in the prior art are solved.

The invention provides a method for inhibiting the formation of Kirkendall holes in an In-based brazing filler metal welding interface by adopting a vertical twin structure, which comprises the following steps of: respectively adhering a layer of vertical twin structure to the surfaces of an upper metal substrate to be welded and a lower metal substrate to be welded which are subjected to surface treatment in an electro-deposition manner, wherein the size of the vertical twin structure is 5 * 5 mm, the thickness of the vertical twin structure is 20-40 mu m, and the thickness of the vertical twin structure is 10 * 10 mm; the method comprises the following steps: carrying out a thermocompression bonding experiment on a pure copper coating with a vertical orientation nano twin crystal structure at set bonding temperature, pressure and time; according to the technical scheme, by means of the structural characteristic that the diffusion coefficient of the vertically-arranged twin boundaries in the nano twin structure is low, the diffusion rate of interface elements is reduced, flux balance is maintained, and the low impurity characteristic of the vertically-oriented nano twin film is utilized, so that formation of Kirkendall voids in the welding interface is limited. The method provided by the invention is simple and convenient to operate, and has great significance for improving the connection reliability of the In-based low-temperature bonding system.

The embodiment of the invention provides a heat exchanger machining method and a heat exchanger. The heat exchanger machining method comprises the steps that a heat exchange pipe and a first pipe are assembled, the heat exchange pipe and the first pipe are connected, the heat exchange pipe is made of stainless steel, and the first pipe is made of stainless steel; welding the heat exchange tube and the first tube; the fins and the heat exchange tubes are assembled, specifically, at least part of the fins are installed between the adjacent heat exchange tubes, and the fins are made of aluminum or aluminum alloy; welding the heat exchange tubes and the fins; before the heat exchange tube and the fins are assembled, an aluminum material or a nickel material is arranged on at least one part of the surface of the heat exchange tube in a covering mode to form a coating. According to the machining method, welding of the heat exchanger is achieved, the welding reliability and the reliability of the heat exchanger are improved, and the heat exchanger has good corrosion resistance. The invention further provides the heat exchanger. The corrosion resistance of the heat exchanger and the heat exchange performance of the heat exchanger are improved.

The invention relates to a brazed heat exchanger incorporating an aluminium alloy baseplate and wherein the baseplate is made from an aluminium alloy having a composition, in wt. %, of: Mn 0.8-1.8, Cu 0.15-1.20, Si 0.25-1.30, Mg 0.10-0.60, Fe ≤0.8, Zn ≤0.3, Ti ≤0.20, Cr ≤0.25, Zr ≤0.25, balance aluminium and impurities.

Discussed is a battery that may include an electrode assembly including a first electrode, a second electrode and a separator wound around a winding axis, wherein the first electrode includes a first active material region coated with a first active material layer and a first uncoated region not coated with the first active material layer, and at least a part of the first uncoated region being an electrode tab; a first current collector coupled to at least a part of the first uncoated region on the electrode assembly; a battery housing to accommodate the electrode assembly and the first current collector; and an insulator interposed between at least one of the first uncoated region and the first current collector and an inner surface of the battery housing facing the at least one of the first uncoated region and the first current collector to block an electrical connection between the battery housing and the at least one of the first uncoated region and the first current collector.

The present invention relates to a method of connecting a cooler module (4) to a metal plate by a sintering process, wherein the cooler module (4) comprises a metallic housing (5) having a coolant inlet (7), a coolant outlet (8) and a first housing side (9), and within the housing (5) a coolant flow structure (6), and wherein the method comprises the steps of: introducing at least one glycol between the coolant flow structure (6), applying a sinter paste and sintering to join the metal plate and the first housing side (9) under pressure and temperature.

A process for producing a solder joint includes steps for arranging a wafer in a chamber, first rinsing the chamber with formic acid, first evacuating the chamber, second rinsing the chamber with formic acid, second evacuating the chamber, rinsing the chamber with nitrogen, and producing a solder joint between a component and the wafer.

The invention relates to the field of blind slot laminated modules, in particular to a blind slot laminated module based on a multistage vertical interconnection device and a process method. A mother board module; the copper pin part is vertically connected with the copper pin part; the fixed supporting part is provided with a first tooth groove and a through hole; the adjusting support part is provided with a second tooth groove and a first threaded hole, the second tooth groove and the first tooth groove are embedded in a staggered mode, the copper pin part is clamped and fixed in an embedding gap of the second tooth groove and the first tooth groove, and the first threaded hole is aligned to the through hole and is perpendicular to the extending plane of the stepped teeth of the second tooth groove; and the clamping force of the second tooth groove on the copper pin part is controlled by the second screw arranged in a penetrating manner. The problem that high-reliability welding quality is affected due to the fact that the ultrahigh-density copper pins of the laminated module are skewed due to uneven temperature loads and inconsistent thermal deformation degrees of materials in the multiple welding processes of the vertical interconnection technology is solved, and the requirements of remote sensing satellites are met.

The invention discloses a method for improving the strength of a narrow-gap laser welding joint. The method comprises the specific steps that S1, firstly, laser welding is used for completing narrow-gap laser welding; s2, electric pulse treatment is carried out on a welding seam formed after welding; and S3, finally, the weld joint is subjected to hot rolling treatment, and the weld joint in the step S3 is subjected to hot rolling treatment for multiple times. After welding, electric pulse treatment is firstly carried out, then hot rolling treatment is carried out, and the strength of a sample can be improved through work hardening generated in the rolling process. Through rolling treatment, the grain size of the sample is changed, the dislocation density is increased, the texture strength is improved, and the Schmidt factor is reduced, so that the strength of the sample is improved; equipment used in the method is simple in structure, easy and convenient to operate and short in consumed time, and the whole treatment process is efficient and rapid.

The invention provides a lead welding method for a semiconductor chip, and belongs to the technical field of semiconductor packaging. The method comprises the following steps: processing a metal capillary tube into a through-hole-shaped female end with a preset length, and carrying out functional coating treatment on the inner surface and the outer surface of the through-hole-shaped female end; positioning the plated female end in a manner that the through hole is axially parallel to a chip bonding pad, and fixing the plated female end by reflow soldering of a first solder; carrying out pre-tinning treatment on the welding end of the metal lead; inserting a lead welding end into the female end through hole; and low-temperature reflow soldering with the peak temperature lower than the melting point of the first solder is carried out, so that the tin coating is molten and metallurgically bonded with the inner surface coating of the female end. By introducing the capillary tube female end which is low in cost and easy to process and a step-by-step low-temperature welding process, the heat damage risk of the heat-sensitive semiconductor chip is remarkably reduced while the connection reliability is ensured, the production efficiency and the process compatibility are improved, and the method is particularly suitable for wire bonding of thermoelectric refrigeration chips.

The invention relates to a welding control method and system for a motor circuit board of an energy-saving freezer with a stator, and relates to the field of welding technology.The method comprises the steps that a stator image is obtained in response to a preset welding signal; determining a stator category according to the stator image; searching a corresponding welding temperature and a welding scheme according to the stator category; sorting the stators corresponding to the stator categories based on the welding temperature to obtain a stator sequence; sequentially obtaining welding stator types according to the stator sequence; and controlling a stator corresponding to the welding stator category to execute a welding scheme to obtain a welding finished product. The stator welding device has the effect of improving the stator welding efficiency.

The invention discloses a silicon-based structure of a micro heat pipe and a processing technology, solves the problems that in the prior art, a metal micro heat pipe for heat dissipation of a silicon-based chip increases the thickness of the chip, and interface stripping and cracking are prone to occurring, and has the beneficial effects that heat dissipation of the micro heat pipe is achieved, and meanwhile the thickness of the silicon-based chip is effectively controlled. According to the specific scheme, the silicon-based structure of the micro heat pipe comprises a silicon-based chip substrate and a glass sheet, the silicon-based chip substrate and the glass sheet are attached together, a liquid absorption core is integrated on the side, facing the glass sheet, of the silicon-based chip substrate, and the liquid absorption core comprises an evaporation section, a heat insulation section and a condensation section which are sequentially connected; the length of the heat insulation section and the condensation section is larger than that of the evaporation section, the evaporation section comprises a plurality of working medium channels, all the working medium channels communicate with the heat insulation section, the working medium channels are arranged in an array mode, and every two adjacent working medium channels communicate with each other.

The invention discloses a novel composite pipe forming process, and relates to the technical field of metal material machining, and a composite pipe comprises an inner pipe made of a first metal material; the outer pipe is made of a second metal material, and the second metal material is different from the first metal material; the composite interface agent layer is arranged between the inner pipe and the outer pipe and is formed by compounding high-molecular anaerobic adhesive and high-temperature brazing filler metal; the composite interface agent layer is evenly distributed between the inner pipe and the outer pipe, the thickness of the composite interface agent layer ranges from 0.01 mm to 0.5 mm, and tight connection of the inner pipe and the outer pipe is achieved through a specific manufacturing process. By adopting the high-molecular anaerobic adhesive and the high-temperature brazing material as a composite interface agent and combining an innovative manufacturing process and a drawing process, the connecting strength and the high-temperature resistance between the inner pipe and the outer pipe are remarkably improved, the manufacturing cost is reduced, the production process is simplified, and the high-temperature-resistant composite pipe can be widely applied to various fields and replace part of traditional welding processes; good practicability and market potential are realized.

To provide a joint member that can improve hydrophilicity, and to provide a joint structure and a method for forming a hydrophilic film.SOLUTION: A joint member includes: a substrate containing a metal; a film provided at a surface of the substrate and containing a crystal of inorganic flux; and a plurality of linear bodies provided in the film and having hydrophilicity. Some of the linear bodies are exposed from the surface of the film.SELECTED DRAWING: Figure 1

The application relates to a method for improving the thermal fatigue resistance of a lead-free solder interconnection BGA package joint, and relates to the field of electronic packaging welding. The surface of a PCB substrate is processed by superfast laser to have a well-shaped micro-nano structure, the well-shaped micro-nano structure is a grid-shaped straight-line groove microstructure formed by a plurality of transverse parallel lines and a plurality of longitudinal parallel lines, the adjacent interval between the plurality of transverse parallel lines and the plurality of longitudinal parallel lines is 80-120 mu m, the groove width is 10-20 mu m, the groove depth is about 30-50 um, the groove parameters are adjusted by adjusting the superfast laser processing parameters, and a large number of micro-particles are covered on the inside and around the groove; the solder ball is planted on a bare chip through a heating plate, and the chip and the processed PCB substrate are welded and packaged through a hot air welding machine. The specific surface area and structural richness of the surface are improved, and the problems of poor thermal fatigue resistance and poor durability of the existing BGA package joint can be solved.