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1599results about "Precision positioning equipment" patented technology
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Edge guide for media transport system
InactiveUS20110129278A1increase speedAutomatic control devicesPrecision positioning equipmentPrint mediaTransport system
An edge guide is provided. A structure includes curved surface over which a print media can travel. The print media includes a first edge and a second edge that is opposite the first edge. A first media guide is contactable with the first edge of the print media. A second media guide is contactable with the second edge of the print media. The second media guide is spaced apart from the first media guide. A relative spacing between the second media guide and the first media guide is adjustable such that a distance between the first media guide and the second media guide is variable. The second media guide includes a mechanism that applies a nesting force to the second edge of the print media to cause the first edge of the print media to move toward and contact the first media guide.
Owner:EASTMAN KODAK CO
Micro-mixing chip of fishbone-Tesla valve as well as preparation method and application of micro-mixing chip
ActiveCN119425465Aincrease lateral flowImprove mixing efficiencyPrecision positioning equipmentDecorative surface effectsMechanical engineeringPhysics
The invention discloses a fishbone-Tesla valve micro-mixing chip and a preparation method and application thereof.The micro-mixing chip comprises a chip body, a Tesla valve and at least two mixing inlets are formed, the Tesla valve comprises at least one mixing unit, the mixing inlets are communicated with the unit inlets of the mixing units on the outermost side, and the mixing units are communicated with the mixing inlets of the mixing units on the outermost side; at least one mixing unit in the Tesla valve is provided with at least one fishbone structure, and the sharp corner of the fishbone structure faces the mixing inlet. At least one fishbone structure is arranged in the Tesla valve, the sharp corner of the fishbone structure faces the mixing inlet, when fluid in the Tesla valve flows through the fishbone structure, the fluid in the Tesla valve dispersedly flows towards the two sides through the fishbone structure, transverse flowing of the fluid is promoted, and therefore the mixing efficiency of the micro mixing chip is improved.
Owner:SHENZHEN INST OF ADVANCED TECH
Preparation method of MEMS micromirror driven by vertical comb teeth
PendingCN121426050ATelevision system detailsPiezoelectric/electrostriction/magnetostriction machinesComb driveMaterials science
The invention discloses a preparation method of a vertical comb-driven MEMS (Micro Electro Mechanical System) micromirror, which comprises the following steps of: forming a through alignment mark and a pre-etched comb structure on a device layer by using a first composite mask, and forming the through alignment mark and the pre-etched comb structure on the back surface of the device layer on a first substrate through a composite mask process, after the first substrate and the second substrate are bonded, the self-alignment composite mask of the comb tooth structure is aligned with the back face pre-etched comb tooth structure through the through alignment mark, high-precision alignment of the comb tooth structure is achieved, accumulated errors are avoided, and the yield of device preparation is improved.
Owner:NORTHWESTERN POLYTECHNICAL UNIV
Vacuum microcavity interferometer chip, manufacturing method and low-drift optical pressure sensor
ActiveCN119461234ASimple manufacturing processreduce thicknessTelevision system detailsPiezoelectric/electrostriction/magnetostriction machinesThin membraneEngineering
The invention discloses a vacuum microcavity interferometer chip, a manufacturing method and a low-drift optical pressure sensor, a film island structure is formed on the upper surface of a first substrate, and the film island structure comprises a protruding part and a pressure sensitive film surrounding the protruding part; a first side wall part, a getter cavity, a second side wall part and an F-P interference cavity located in the center are sequentially arranged on the lower surface of the first substrate in the radial direction, a first reflecting surface is deposited on the lower surface of the first substrate in the F-P interference cavity, and a second reflecting surface is deposited on the upper surface of the second substrate in the F-P interference cavity. A first optical antireflection film is deposited on the surface of the protruding part, and the first optical antireflection film, the protruding part, the pressure sensitive film, the first reflecting surface and the second reflecting surface have the same center; the filter further comprises a vent hole, and the vent hole is formed in the second side wall part and used for communicating the getter cavity and the F-P interference cavity.
Owner:SHANGHAI BAIANTEK SENSING TECH CO LTD +1
Pressure sensor based on silicon-silicon bonding and preparation method thereof
PendingCN120483034ATelevision system detailsPiezoelectric/electrostriction/magnetostriction machinesWaferMetal electrodes
The invention provides a pressure sensor based on silicon-silicon bonding and a preparation method thereof. The preparation method comprises the following steps: providing a low-resistance silicon wafer, forming a silicon deep hole in a first surface of the low-resistance silicon wafer, and depositing an isolation material in the silicon deep hole to form an isolation ring; etching the first surface to form a shallow groove and a conductive silicon column to obtain a low-resistance cap wafer; providing an SOI wafer, performing ion implantation on the first surface of the SOI wafer to form a resistance region, and obtaining a substrate wafer; bonding the low-resistance cap wafer with the substrate wafer; grinding the second surface of the low-resistance cap wafer until the isolating ring is exposed; depositing an insulating layer on the second surface of the low-resistance cap wafer, and forming a metal electrode on the insulating layer; and forming a back cavity structure on the second surface of the substrate wafer, exposing the top silicon of the SOI wafer, and forming a sensitive film layer. The conductive silicon column is made of low-resistance silicon, copper ion pollution is avoided, the preparation process is simple, and the period is controllable; the device obtained based on the silicon-silicon bonding process has high bonding strength and high air tightness.
Owner:SHANGHAI IND U TECH RES INST
Alignment method of bonding body wafer on non-infrared exposure machine and preparation method of semiconductor device
PendingCN119200343Aavoid pollutionGuaranteed bonding strengthPrecision positioning equipmentDecorative surface effectsGraphicsWafer
The invention provides a method for aligning a bonding body wafer on a non-infrared exposure machine, which comprises the following steps of: providing the bonding body wafer which comprises a plurality of wafers in bonding connection, and forming alignment marks on the bonding surfaces of the wafers which are mutually bonded; manufacturing an alignment photomask, wherein the alignment photomask is provided with an alignment mark window pattern; forming an alignment mark window on the surface of the bonding body wafer by utilizing photoetching and etching processes through an alignment photomask, and exposing the alignment mark on the bonding surface through the alignment mark window; and carrying out photoetching alignment through the exposed alignment mark. According to the method, the alignment problem when the alignment mark on the non-infrared exposure machine is positioned in the bonding body wafer is solved. The invention further provides a preparation method of the semiconductor device, the alignment method is adopted for alignment after the front face and the back face of a bonding body wafer are thinned, then the pattern face of the device is processed, and possible pollution to the bonding face and possible damage to the pattern face are avoided.
Owner:SHANGHAI IND U TECH RES INST
System for processing a slab having a top polished face and related method
ActiveUS20240399524A1Precision positioning equipmentMeasurement/indication equipmentsDigital dataDisplay board
A system processes a stone slab having a top polished face and bottom surface. An imaging device receives and displays a digital image of the top polished face of the slab. A controller overlays a slab cut layout on the digital image of the top polished face, generates a digital slab layout file containing digital data representative of the top polished face and its slab cut layout referenced to the top end of adhered reference markers, mirror images the digital slab layout file, and projects the mirror imaged locations of the reference markers to facilitate alignment of the bottom ends of the adhered laser markers with the respective projected reference marker locations when the slab is upside down for cutting in a slab cutting position.
Owner:POSEIDON IND INC
Method for attaching a MEMS micromirror unit and MEMS micromirror unit
The invention relates to a method for mounting a MEMS micromirror unit (100) in a higher-level assembly (200) with at least one receptacle (210) for a MEMS micromirror unit (110), as is used, for example, in projection exposure systems (1) for photolithography. The invention further relates to a MEMS micromirror unit (100) advantageously designed for this purpose. The process is characterized by the following steps: a) Inserting the MEMS micromirror unit (100) into the receptacle (210); b) Aligning the MEMS micromirror unit (100) with the recording (210); c) Applying an axial tensile force to an interface element (120) of the MEMS micromirror unit greater than the subsequent preload force, resulting in a longitudinal elongation of the interface element (120); d) Attaching the prestressing element (300) to a predetermined longitudinal position on the interface element (120); and e) Reducing and removing the axial tensile force. At the latest during the reduction of the axial tensile force, the preload element (300) comes into contact with the receptacle (210) and prevents a complete reversal of the longitudinal strain of the interface element (120), thus leaving a preload force on the interface element (120) with which the MEMS micromirror unit (100) can be fixed in the receptacle (210).
Owner:CARL ZEISS SMT GMBH
Clamping device for wing hanging drilling operation and laser measurement drilling system
ActiveCN121156795APrecision positioning equipmentMeasurement/indication equipmentsDrilling systemMachine tool
The invention relates to the technical field of five-axis machine tool drilling, in particular to a clamping device for wing hanging drilling operation and a laser measurement drilling system. A first middle assembly and a second middle assembly are detachably and fixedly connected with corresponding rotary tables; the second middle assembly is provided with an end plate extending front and back, and two sets of connecting areas spaced front and back are formed on the end plate. The clamping device further comprises a compensation insertion piece, and the compensation insertion piece can be selectively inserted between the first middle assembly and the first connecting lug and can also be selectively inserted between the connecting area and the rotary table so as to compensate the fluctuation quantity of the corresponding distance. The clamping device has the beneficial effects that through multiple technical means such as structure reuse, rotation reference unification, spacing compensation mechanism and assembly process optimization, high-precision, high-efficiency and high-stability indexing drilling clamping of the wing hanger is achieved, and then the drilling efficiency and the drilling precision are improved.
Owner:SHENYANG GUANGDA TECH DEV
Vacuum-compatible clamping and / or braking device
ActiveJP2025522195AFluid actuated brakesPrecision positioning equipmentMechanical engineeringPhysics
Owner:MEMA MASCH & APPARATESCHUTZ GMBH
Housing part for a pneumatic clamping and / or braking device
Owner:MEMA MASCH & APPARATESCHUTZ GMBH
High-efficiency inclined double-shaft index plate
The invention relates to the technical field of index plates, in particular to a high-efficiency inclined double-shaft index plate which comprises a first rotating assembly and a moving unit. The first rotating assembly comprises a first index plate and a first cam shaft, and a plurality of first rolling wheels capable of sliding along a preset movement track are evenly distributed on the outer wall of the first index plate in the circumferential direction; a first cambered surface cam is fixedly wound on the first cam shaft, a continuous curved surface groove is formed, and the first roller is embedded into the curved surface groove. The moving unit can drive the first roller to slide on the first index plate along the preset movement track so as to change the contact position of the first roller and the globoidal cam when the first cam shaft stops rotating, and the situation that when the working platform is located at the specific angle for a long time, the meshing area of the first roller and the first globoidal cam is excessively abraded due to long-term unbalance loading is avoided; the abrasion degree is reduced, and the service life of the first index plate and the first cam shaft is prolonged.
Owner:JIAXING TIANHE MACHINERY
Vacuum microcavity interferometer chip, manufacturing method and wide-range optical pressure sensor
ActiveCN119461233AImproved zero stabilitySimple manufacturing processTelevision system detailsPiezoelectric/electrostriction/magnetostriction machinesThin membranePressure sensitive film
The invention relates to a vacuum microcavity interferometer chip, a manufacturing method and a wide-range optical pressure sensor. Comprising a first substrate and a second substrate, the second substrate and the first substrate are bonded into a whole, a pressure sensitive film is manufactured on the first substrate, a first reflecting surface is deposited on the pressure sensitive film, and a second reflecting surface corresponding to the first reflecting surface is deposited on the second substrate. After the two substrates are bonded, the first reflecting surface and the second reflecting surface form an F-P optical interference cavity, at least one getter cavity is arranged on the first substrate and / or the second substrate, a getter film is arranged on the surface of the getter cavity, and the getter cavity and the F-P optical interference cavity are separated and connected through an air channel, so that the size of the air channel can be made to be very small, and the size of the getter cavity is smaller than that of the F-P optical interference cavity. A small amount of particles generated after the getter is activated are prevented from polluting an optical film to cause device failure; the whole sensor is of a sealed structure and is not provided with a structure externally connected with the chip, so that the overall airtightness of the chip is ensured, and the vacuum degree requirement of subsequent shell packaging is reduced.
Owner:SHANGHAI BAIANTEK SENSING TECH CO LTD +1
MEMS device and preparation method thereof
PendingCN119306174Ahigh quality factoreffective absorptionTelevision system detailsPiezoelectric/electrostriction/magnetostriction machinesWaferVacuum chamber
The invention discloses an MEMS device and a preparation method thereof, and the preparation method comprises the steps: providing a first wafer, forming a cavity in the upper part of the first wafer, and forming a porous silicon layer at the bottom of the cavity; providing a second wafer with an etching stop layer on the surface, and bonding the upper side of the first wafer and the etching stop layer; a boss and a first bonding metal layer located on the boss are formed on the side, away from the first wafer, of the second wafer; forming a groove penetrating through the second wafer in the second wafer, and removing the etching stop layer between the cavity and the second wafer to form a suspended comb tooth structure; and providing a third wafer with a patterned second bonding metal layer on the surface, and bonding the second bonding metal layer and the first bonding metal layer to form a vacuum chamber. According to the technical scheme, the quality factor of the MEMS device can be remarkably improved.
Owner:NINGBO SEMICON INT CORP
Batch processing technology of micro-fluidic chip
InactiveCN121134678APrecision positioning equipmentDecorative surface effectsPolyethylene terephthalate glycolPolymethyl methacrylate
The invention discloses a batch processing technology of micro-fluidic chips, and relates to the technical field of chip processing. The method comprises the following steps: firstly, providing at least two layers of polymer coiled materials, namely a first coiled material for forming a micro-channel structure and a second coiled material for closing a micro-channel, the coiled materials are continuous coiled materials selected from polyethylene glycol terephthalate (PET), cycloolefin polymer (COP), polycarbonate (PC) or polymethyl methacrylate (PMMA), and the coiled materials are continuous coiled materials selected from polyethylene glycol terephthalate (PET), cycloolefin polymer (COP), polycarbonate (PC) or polymethyl methacrylate (PMMA); the thickness of the coiled material is 50-500 microns; secondly, carrying out continuous compression molding processing on the surface of the first coiled material through a roll-to-roll processing platform; through a roll-to-roll continuous process, micro-channel mold pressing, functional deposition, precise alignment bonding and online cutting are integrated, high-efficiency, high-consistency and high-integration-level batch manufacturing of the micro-fluidic chip is realized, and manual intervention and production cost are remarkably reduced.
Owner:SUZHOU HENGXIN MICROELECTRONICS CO LTD
Multi-angle machining tool for automobile steering knuckle
The multi-angle machining tool comprises a base and a movable plate, numerical control index plates are connected to the two opposite ends of the top face of the base, a plurality of first supporting bases are connected to the top face of the movable plate, a plurality of first oil cylinders are installed on the bottom face of the movable plate, and first piston rods are connected to the first oil cylinders; the first piston rod is sleeved with a first limiting assembly. The bottom face of the movable plate is connected with a plurality of second supporting bases, a plurality of second oil cylinders are installed on the top face of the movable plate, the second oil cylinders are connected with second piston rods, and the second piston rods are sleeved with second limiting assemblies. According to the technical scheme, the steering knuckle to be machined is installed on the first bearing seat which is obliquely arranged and the second bearing seat which is horizontally arranged according to the machining size requirement, in addition, when the steering knuckle is installed on the oblique first bearing seat, a plurality of angles needing to be machined on the steering knuckle can be exposed at the same time, and machining precision is improved. And the purposes of reducing the clamping frequency of the steering knuckle in the machining process and improving the machining efficiency are achieved.
Owner:CHONGQING HUIJIAN MASCH CO LTD
Gear ring fixing device for gear ring inner hole machining
InactiveCN120269378APrecision positioning equipmentFeeding apparatusMachining processMechanical engineering
The invention discloses a gear ring fixing device for gear ring inner hole machining, and belongs to the technical field of gear ring machining equipment.The gear ring fixing device for gear ring inner hole machining comprises a base, a lower chuck, an upper chuck and a drilling assembly, the lower chuck is rotationally connected to the base, the upper chuck is arranged above the lower chuck, and the drilling assembly is arranged on the base. A gear ring to be machined is arranged on the lower chuck, and the drilling assembly is arranged on one side of the base. According to the gear ring machining device, the gear ring to be machined can be clamped and fixed in the inner and outer directions, the gear ring is effectively prevented from deforming when fixed, the end face of the gear ring can be fixed through the limiting assembly, the gear ring is effectively prevented from vibrating in the machining process, the gear ring drilling precision and effect are effectively prevented from being affected, and the gear ring machining quality is improved.
Owner:TAIZHOU LIHUA MACNINERY
MEMS pressure sensor, manufacturing method thereof and electronic device
PendingCN121247717ATelevision system detailsPiezoelectric/electrostriction/magnetostriction machinesCapacitanceMems pressure sensor
The invention provides an MEMS pressure sensor and a manufacturing method thereof, and an electronic device, and the method comprises the steps: providing a first substrate, forming at least two first pressure structures on the surface of the first substrate, each first pressure structure comprises a first electrode layer, a first sacrificial layer, a first supporting layer, a second electrode layer, a second supporting layer, and a first cavity, and a first release hole; a second substrate is provided, at least two second pressure structures are formed on the surface of the second substrate, and each second pressure structure comprises a third electrode layer, a second sacrificial layer and a second cavity; bonding the second supporting layer with the second sacrificial layer; the second substrate is removed to expose the third electrode layer, the third electrode layer and the second electrode layer form a variable capacitance structure, the second electrode layer and the first electrode layer form a reference capacitance structure, and the two variable capacitance structures and the two reference capacitance structures jointly form a Wheatstone bridge. According to the scheme, the measurement precision is improved, and the device performance is further improved.
Owner:CHINA RESOURCES MICROELECTRONICS HLDG LTD
MEMS pressure sensor, manufacturing method thereof and electronic device
PendingCN121405033ATelevision system detailsPiezoelectric/electrostriction/magnetostriction machinesCapacitanceMems pressure sensor
The invention provides an MEMS pressure sensor, a manufacturing method thereof and an electronic device, and the method comprises the steps: providing a first substrate and a second substrate, forming a first pressure structure on the first substrate, and forming a second pressure structure on the second substrate; bonding the first pressure structure and the second pressure structure; the first substrate is removed, the first pressure structure and the second pressure structure jointly form a third pressure structure, the third pressure structure comprises a first electrode layer, a second electrode layer, a third electrode layer, a fourth electrode layer and a fifth electrode layer which are arranged at intervals from top to bottom, and a dielectric layer is formed between every two adjacent electrode layers; and cavities penetrating through the dielectric layers are formed in the dielectric layers. According to the scheme, the multiple electrode layers arranged from bottom to top are formed, the multiple electrode layers form the first capacitor, the second capacitor, the third capacitor and the fourth capacitor respectively, then the Wheatstone bridge is formed jointly, the measurement precision of the MEMS pressure sensor is improved, meanwhile, the plane size of the MEMS pressure sensor is reduced, and the integration level of the device is improved.
Owner:CHINA RESOURCES MICROELECTRONICS HLDG LTD
Flexible strain sensor and preparation method thereof
ActiveCN119665798APrecision positioning equipmentDecorative surface effectsElectrical connectionStrain gauge
The invention discloses a flexible strain sensor and a preparation method thereof, and relates to the technical field of sensors, the flexible strain sensor comprises a first flexible substrate layer and a plurality of sensor modules, the plurality of sensor modules are arranged on the first flexible substrate layer in an array structure, each sensor module comprises at least one strain gauge, and the strain gauges are arranged on the first flexible substrate layer. The strain gauges of all the sensor modules are electrically connected, each sensor module, the strain gauge of the sensor module and the first flexible substrate layer corresponding to the bottom protrude outwards to form a protruding structure, and when the protruding structure makes contact with a detected object, the strain gauge on the protruding structure is used for detecting the deformation quantity of the detected object. The flexible strain sensor provided by the embodiment of the invention not only is suitable for hard materials such as metal structures with relatively large rigidity, but also is suitable for elastic or composite materials with large deformation.
Owner:WUHAN ZHENYOU TECHNOLOGY CO LTD
Positioning a work piece
In a general aspect, a system for selectively positioning a work piece includes multiple bodies. A first body includes a first exterior surface and a boss extending from the first exterior surface along a boss axis. The boss includes a boss end surface that terminates the boss. Boss perimeter surfaces define a perimeter of the boss and extend between the first exterior surface and the boss end surface. A second body includes a second exterior surface and a pocket extending from the second exterior surface into the second body along a pocket axis. The pocket is shaped to receive the boss in a discrete number of positions when the boss axis and the pocket axis are aligned. Pocket perimeter surfaces define a perimeter of the pocket and extend into the second body from the second exterior surface.
Owner:OMMO TECHNOLOGIES INC
Method and system for high-precision alignment and transfer of microdevices in optoelectronic manufacturing
PCT designated stage expiredWO2025079041A1Precision positioning equipmentDecorative surface effectsPhysical chemistryEngineering
The invention discloses an advanced method for manufacturing optoelectronic system arrays, where microdevices are developed separately and then transferred into a system substrate. The invention discloses multiple embodiments, including distributed sacrificial reference points, real-time monitoring with various sensing technologies, laser-generated alignment marks, non-contact laser triangulation, and using polymers for marking to assess and correct alignment during each transfer stage dynamically. The invention further discloses methods, which may be AI based, for detecting and correcting errors caused by wear, environmental changes, load variability, and mechanical vibrations. In general, this system for pre-transfer calibration, monitoring, error detection, and compensatory adjustments enables precise and reliable integration of microdevices into optoelectronic systems, significantly enhancing alignment accuracy, stability, and reliability throughout the manufacturing process. The system can be further an AI-based calibration validation in a microdevice transfer system.
Owner:VUEREAL INC
MEMS micromirror and preparation method thereof
ActiveCN119330301ATelevision system detailsPiezoelectric/electrostriction/magnetostriction machinesWaferSemiconductor technology
The invention relates to the technical field of semiconductors, in particular to a preparation method of an MEMS micromirror, and the preparation method comprises the steps: providing a wafer substrate which is provided with a front surface and a back surface which are opposite to each other, and the front surface is a functional surface used for forming the MEMS micromirror; a conductive column and a first mark are formed on the wafer substrate, the conductive column penetrates through the wafer substrate, and the first mark is located on the back face of the wafer substrate; forming a second mark and a first functional structure on the front surface of the wafer substrate; forming a bonding layer on the front side of the wafer substrate, wherein the bonding layer is located above the conductive columns, the second marks and the first functional structures; forming a mark window for exposing the second mark on the bonding layer by taking the first mark as an overlay alignment point; and forming a second functional structure on the bonding layer by taking the second mark as an overlay alignment point, and aligning the second functional structure with the first functional structure in an overlay manner. Based on the technical scheme, the alignment precision in the MEMS micromirror preparation process can be effectively improved.
Owner:SUZHOU INNOMIC ELECTRONIC TECH CO LTD +1
Heating and cooling system for wafer bonding equipment
The invention relates to a heating and cooling system for wafer bonding equipment, which comprises a basic unit, a heating unit and a cooling unit, and is characterized in that the basic unit comprises an upper disc, a heating bin and a lower disc, and the heating bin is used for accommodating a wafer to be bonded and providing a vacuum environment for the wafer; the upper disc and the lower disc can be driven to be close to each other so as to apply set pressure to the wafer; an upper heater and a lower heater of the heating unit are used for heating the wafer in the axial direction, and an edge heater is used for carrying out heat compensation in the radial direction; an upper cooler and a lower cooler of the cooling unit are used for indirectly cooling the wafer; the wafer bonding device effectively improves heating uniformity and cooling efficiency in the wafer bonding process, can provide an accurate and effective vacuum environment for wafer bonding, and is simple in structure and easier to maintain and repair.
Owner:WENTIAN JINGCE INSTR TECH (SUZHOU) CO LTD
Low-temperature-drift MEMS piezoresistive pressure sensor and preparation method thereof
PendingCN119124412AThe test result is accurateCompensate for sensitivity temperature driftTelevision system detailsPiezoelectric/electrostriction/magnetostriction machinesPiezoresistive pressure sensorsStress sensors
The invention provides a low-temperature drift MEMS piezoresistive pressure sensor and a preparation method thereof. The pressure sensor comprises a first substrate, a second substrate, a first structural layer, a second structural layer and a piezoresistor strip, a first groove is formed in the lower surface of the first substrate, and the second substrate is fixed to the first substrate and seals the first groove; an annular second groove is formed in the periphery of the bottom surface of the first groove; a third groove is formed in the middle of the upper surface of the first substrate; the first structural layer is arranged in the third groove, and the second structural layer is arranged in the second groove; the first structure layer and the second structure layer are made of metal; the upper surface of the first substrate is provided with a plurality of piezoresistor strips surrounding the first structure layer, and the plurality of piezoresistor strips correspond to the second structure layer. The pressure sensor has the technical effect that the sensitivity and reliability of the pressure sensor are remarkably improved.
Owner:SUZHOU PURPLE CORE MICROELECTRONICS CO LTD
Method for manufacturing a MEMS component
PendingDE102024205817A1Television system detailsPiezoelectric/electrostriction/magnetostriction machinesSubstrate dopingCondensed matter physics
A method for fabricating a MEMS device comprising the following steps: providing a first bonding surface (1) on a first substrate (2) with a first substrate doping; providing a second bonding surface (3) on a second substrate (4) with a second substrate doping; aligning and joining the first and second bonding surfaces (1, 3) by a Si-Si direct bonding process, wherein both bonding surfaces (1, 3) have a silicon surface, and wherein an additional near-surface first doping layer (5) is produced below at least one of the bonding surfaces (1).
Owner:ROBERT BOSCH GMBH
High-indexing-precision indexing device
ActiveCN222327542UHigh-precision indexing and positioningPrecision positioning equipmentComputer hardwareControl system
The utility model is applicable to the technical field of dividing devices, and provides a dividing device with high dividing precision, which comprises a processing table, a driving component is arranged on the processing table, a dividing plate is arranged on the driving component, a plurality of mounting seats are arranged on the dividing plate, and the mounting seats are fixedly connected with reflectors; the light emitter is fixedly connected with the processing table; the light receiver is fixedly connected with the processing table; the driving assembly drives the index plate to rotate, the light emitter and the light receiver are started, the index plate drives the reflector to rotate synchronously, when the reflector rotates to a preset position, a light signal emitted by the light emitter is received by the light receiver through reflection of the reflector, and it is proved that the mounting base rotates to the preset position at the moment, so that the mounting base rotates to the preset position. The light receiver controls the driving assembly to stop driving the indexing plate to rotate through the control system, and high-precision indexing positioning is achieved.
Owner:HANGZHOU SANKYO MACHINERY
Vacuum-compatible clamping and / or braking device
ActiveUS20250262723A1Fluid actuated brakesPrecision positioning equipmentMechanical engineeringPhysics
Owner:MEMA MASCH & APPARATESCHUTZ GMBH
Five-axis five-linkage turning, milling and drilling combined machining center
PendingCN121571999APrecision positioning equipmentOther manufacturing equipments/toolsStructural engineeringMachining
The invention relates to the technical field of combined machining, and discloses a five-axis five-linkage turning, milling and drilling combined machining center which comprises an equipment box, a mounting frame is mounted on the rear side of the inner wall of the bottom end of the equipment box, an automatic tool changing system is arranged on the left side of the mounting frame, and a transmission system is arranged in the middle of the mounting frame. A feeding table is slidably mounted on the front side of the inner wall of the bottom of the equipment box through sliding rails. The five-axis five-linkage turning, milling and drilling combined machining center can effectively solve the problems that in the prior art, a five-axis turning, milling and drilling combined machining center mostly adopts the mode that two sets of clamps are matched, parts need to be repeatedly clamped in the machining mode, the machining period of a single piece is directly prolonged through repeated positioning operation, and machining efficiency is high. The clamping precision and the consistency of the two sets of clamps cannot be guaranteed; in the prior art, a worker needs to stretch the upper body into a closed machining area of equipment and manually righting a part to enable the part to be aligned to a clamping hole position and keep a horizontal state, and the process is tedious in operation steps and has safety risks.
Owner:GUANGDONG WUSONG WUXI PRECISION MASCH CO LTD
Hydraulic index plate
ActiveCN120755721APrecision positioning equipmentLarge fixed membersControl engineeringControl theory
The invention relates to the technical field of intelligent index plates, in particular to a hydraulic index plate which comprises a base. The rotating seat is rotationally connected to the upper surface of the base; the main positioning grooves are formed in the rotating seat and are annularly distributed at equal angles; the clamping and fixing assembly is movably arranged on the rotating seat and located over the main positioning groove; the interference receding assembly is arranged at the joint of the annular sliding rail and the main positioning groove. According to the hydraulic index plate, the linkage locking assembly is arranged in a matched mode, the linkage locking assembly synchronously unlocks the interference receding assembly, so that the position of the clamping and fixing assembly can be rapidly adjusted, the operation convenience is improved while interference is avoided, intelligent collaborative operation of clamping and positioning is achieved, and the working efficiency is improved. The intelligent level and operation convenience of equipment operation are improved, the problem of space interference between the clamping and fixing assembly and machining equipment is effectively avoided, interference hidden dangers are eliminated fundamentally, and the intelligence of the hydraulic index plate is improved.
Owner:VALVE BIWEI VALVE CO LTD