735results about "Precision positioning equipment" patented technology

An edge guide is provided. A structure includes curved surface over which a print media can travel. The print media includes a first edge and a second edge that is opposite the first edge. A first media guide is contactable with the first edge of the print media. A second media guide is contactable with the second edge of the print media. The second media guide is spaced apart from the first media guide. A relative spacing between the second media guide and the first media guide is adjustable such that a distance between the first media guide and the second media guide is variable. The second media guide includes a mechanism that applies a nesting force to the second edge of the print media to cause the first edge of the print media to move toward and contact the first media guide.

The invention discloses a preparation method of a vertical comb-driven MEMS (Micro Electro Mechanical System) micromirror, which comprises the following steps of: forming a through alignment mark and a pre-etched comb structure on a device layer by using a first composite mask, and forming the through alignment mark and the pre-etched comb structure on the back surface of the device layer on a first substrate through a composite mask process, after the first substrate and the second substrate are bonded, the self-alignment composite mask of the comb tooth structure is aligned with the back face pre-etched comb tooth structure through the through alignment mark, high-precision alignment of the comb tooth structure is achieved, accumulated errors are avoided, and the yield of device preparation is improved.

The invention relates to the technical field of five-axis machine tool drilling, in particular to a clamping device for wing hanging drilling operation and a laser measurement drilling system. A first middle assembly and a second middle assembly are detachably and fixedly connected with corresponding rotary tables; the second middle assembly is provided with an end plate extending front and back, and two sets of connecting areas spaced front and back are formed on the end plate. The clamping device further comprises a compensation insertion piece, and the compensation insertion piece can be selectively inserted between the first middle assembly and the first connecting lug and can also be selectively inserted between the connecting area and the rotary table so as to compensate the fluctuation quantity of the corresponding distance. The clamping device has the beneficial effects that through multiple technical means such as structure reuse, rotation reference unification, spacing compensation mechanism and assembly process optimization, high-precision, high-efficiency and high-stability indexing drilling clamping of the wing hanger is achieved, and then the drilling efficiency and the drilling precision are improved.

The invention relates to the technical field of index plates, in particular to a high-efficiency inclined double-shaft index plate which comprises a first rotating assembly and a moving unit. The first rotating assembly comprises a first index plate and a first cam shaft, and a plurality of first rolling wheels capable of sliding along a preset movement track are evenly distributed on the outer wall of the first index plate in the circumferential direction; a first cambered surface cam is fixedly wound on the first cam shaft, a continuous curved surface groove is formed, and the first roller is embedded into the curved surface groove. The moving unit can drive the first roller to slide on the first index plate along the preset movement track so as to change the contact position of the first roller and the globoidal cam when the first cam shaft stops rotating, and the situation that when the working platform is located at the specific angle for a long time, the meshing area of the first roller and the first globoidal cam is excessively abraded due to long-term unbalance loading is avoided; the abrasion degree is reduced, and the service life of the first index plate and the first cam shaft is prolonged.

The invention discloses a batch processing technology of micro-fluidic chips, and relates to the technical field of chip processing. The method comprises the following steps: firstly, providing at least two layers of polymer coiled materials, namely a first coiled material for forming a micro-channel structure and a second coiled material for closing a micro-channel, the coiled materials are continuous coiled materials selected from polyethylene glycol terephthalate (PET), cycloolefin polymer (COP), polycarbonate (PC) or polymethyl methacrylate (PMMA), and the coiled materials are continuous coiled materials selected from polyethylene glycol terephthalate (PET), cycloolefin polymer (COP), polycarbonate (PC) or polymethyl methacrylate (PMMA); the thickness of the coiled material is 50-500 microns; secondly, carrying out continuous compression molding processing on the surface of the first coiled material through a roll-to-roll processing platform; through a roll-to-roll continuous process, micro-channel mold pressing, functional deposition, precise alignment bonding and online cutting are integrated, high-efficiency, high-consistency and high-integration-level batch manufacturing of the micro-fluidic chip is realized, and manual intervention and production cost are remarkably reduced.

The invention provides an MEMS pressure sensor and a manufacturing method thereof, and an electronic device, and the method comprises the steps: providing a first substrate, forming at least two first pressure structures on the surface of the first substrate, each first pressure structure comprises a first electrode layer, a first sacrificial layer, a first supporting layer, a second electrode layer, a second supporting layer, and a first cavity, and a first release hole; a second substrate is provided, at least two second pressure structures are formed on the surface of the second substrate, and each second pressure structure comprises a third electrode layer, a second sacrificial layer and a second cavity; bonding the second supporting layer with the second sacrificial layer; the second substrate is removed to expose the third electrode layer, the third electrode layer and the second electrode layer form a variable capacitance structure, the second electrode layer and the first electrode layer form a reference capacitance structure, and the two variable capacitance structures and the two reference capacitance structures jointly form a Wheatstone bridge. According to the scheme, the measurement precision is improved, and the device performance is further improved.

The invention provides an MEMS pressure sensor, a manufacturing method thereof and an electronic device, and the method comprises the steps: providing a first substrate and a second substrate, forming a first pressure structure on the first substrate, and forming a second pressure structure on the second substrate; bonding the first pressure structure and the second pressure structure; the first substrate is removed, the first pressure structure and the second pressure structure jointly form a third pressure structure, the third pressure structure comprises a first electrode layer, a second electrode layer, a third electrode layer, a fourth electrode layer and a fifth electrode layer which are arranged at intervals from top to bottom, and a dielectric layer is formed between every two adjacent electrode layers; and cavities penetrating through the dielectric layers are formed in the dielectric layers. According to the scheme, the multiple electrode layers arranged from bottom to top are formed, the multiple electrode layers form the first capacitor, the second capacitor, the third capacitor and the fourth capacitor respectively, then the Wheatstone bridge is formed jointly, the measurement precision of the MEMS pressure sensor is improved, meanwhile, the plane size of the MEMS pressure sensor is reduced, and the integration level of the device is improved.

The invention relates to a heating and cooling system for wafer bonding equipment, which comprises a basic unit, a heating unit and a cooling unit, and is characterized in that the basic unit comprises an upper disc, a heating bin and a lower disc, and the heating bin is used for accommodating a wafer to be bonded and providing a vacuum environment for the wafer; the upper disc and the lower disc can be driven to be close to each other so as to apply set pressure to the wafer; an upper heater and a lower heater of the heating unit are used for heating the wafer in the axial direction, and an edge heater is used for carrying out heat compensation in the radial direction; an upper cooler and a lower cooler of the cooling unit are used for indirectly cooling the wafer; the wafer bonding device effectively improves heating uniformity and cooling efficiency in the wafer bonding process, can provide an accurate and effective vacuum environment for wafer bonding, and is simple in structure and easier to maintain and repair.

A method for fabricating a MEMS device comprising the following steps: providing a first bonding surface (1) on a first substrate (2) with a first substrate doping; providing a second bonding surface (3) on a second substrate (4) with a second substrate doping; aligning and joining the first and second bonding surfaces (1, 3) by a Si-Si direct bonding process, wherein both bonding surfaces (1, 3) have a silicon surface, and wherein an additional near-surface first doping layer (5) is produced below at least one of the bonding surfaces (1).

The invention relates to the technical field of combined machining, and discloses a five-axis five-linkage turning, milling and drilling combined machining center which comprises an equipment box, a mounting frame is mounted on the rear side of the inner wall of the bottom end of the equipment box, an automatic tool changing system is arranged on the left side of the mounting frame, and a transmission system is arranged in the middle of the mounting frame. A feeding table is slidably mounted on the front side of the inner wall of the bottom of the equipment box through sliding rails. The five-axis five-linkage turning, milling and drilling combined machining center can effectively solve the problems that in the prior art, a five-axis turning, milling and drilling combined machining center mostly adopts the mode that two sets of clamps are matched, parts need to be repeatedly clamped in the machining mode, the machining period of a single piece is directly prolonged through repeated positioning operation, and machining efficiency is high. The clamping precision and the consistency of the two sets of clamps cannot be guaranteed; in the prior art, a worker needs to stretch the upper body into a closed machining area of equipment and manually righting a part to enable the part to be aligned to a clamping hole position and keep a horizontal state, and the process is tedious in operation steps and has safety risks.

The invention relates to the technical field of intelligent index plates, in particular to a hydraulic index plate which comprises a base. The rotating seat is rotationally connected to the upper surface of the base; the main positioning grooves are formed in the rotating seat and are annularly distributed at equal angles; the clamping and fixing assembly is movably arranged on the rotating seat and located over the main positioning groove; the interference receding assembly is arranged at the joint of the annular sliding rail and the main positioning groove. According to the hydraulic index plate, the linkage locking assembly is arranged in a matched mode, the linkage locking assembly synchronously unlocks the interference receding assembly, so that the position of the clamping and fixing assembly can be rapidly adjusted, the operation convenience is improved while interference is avoided, intelligent collaborative operation of clamping and positioning is achieved, and the working efficiency is improved. The intelligent level and operation convenience of equipment operation are improved, the problem of space interference between the clamping and fixing assembly and machining equipment is effectively avoided, interference hidden dangers are eliminated fundamentally, and the intelligence of the hydraulic index plate is improved.

The present invention provides a room-temperature quartz bonding method, comprising: S100, cleaning the surfaces of quartz wafers; S200, depositing silicon dioxide on two quartz wafers to form a silicon dioxide bonding film on the surfaces of the quartz wafers; S300, chemically mechanically polishing the silicon dioxide bonding film; S400, cleaning the quartz wafers with a hydrofluoric acid solution; and S500, bringing the silicon dioxide bonding films of the two quartz wafers into contact with each other and bonding the quartz wafers using a bonding machine. This method can achieve high-reliability bonding between quartz wafers at room temperature.

The invention relates to a housing part for a clamping and / or braking device and to a clamping and / or braking device having such a housing part. The housing part comprises: a first edge of the housing part and a second edge of the housing part opposite the first edge; an annular recess arranged between the second edge and the first edge for clamping an annular spring plate between a first bearing surface of the housing part defined by the recess and a second bearing surface of the housing part defined by the recess; a clamping element having a clamping surface which is designed, when the spring plate is clamped in the recess between the first bearing surface and the second bearing surface in such a way that a first end of the spring plate is supported on the first bearing surface and a second end of the spring plate presses onto the second bearing surface, to transmit a clamping and / or braking force to an object to be clamped and / or braked; a first housing contact surface which extends between the first edge and the first bearing surface; wherein at least one groove for receiving a sealing means is arranged on the first housing contact surface.

A system and method for transferring a part being machined from a first fixture to a second fixture so that an un-machined side of the part can be exposed for machining, where the first fixture is secured to a first actuator and the second fixture is secured to a second actuator. The method includes securing the part to the first fixture and machining the part on sides of the part except a side of the part coupled to the first fixture. The method slides the first actuator away from the second actuator, operates the first actuator and the second actuator so that the part secured to the first fixture is aligned with the second fixture, slides the first actuator back towards the second actuator, secures the part to the second fixture and releases the part from the first fixture, and slides the first actuator away from the second actuator again.

The invention provides a lead bonding and packaging device and a lead bonding and packaging method for a key process for packaging a deep cavity lead of an immersion type miniature liquid pressure sensor. The lead bonding packaging equipment comprises a rack, a movement mechanism mounting plate, an X-axis movement mechanism, a Y-axis movement mechanism, a first Z-axis movement mechanism and a second Z-axis movement mechanism, the movement mechanism mounting plate, the X-axis movement mechanism, the Y-axis movement mechanism, the first Z-axis movement mechanism and the second Z-axis movement mechanism are all mounted on the rack, a clamping mechanism is mounted on the X-axis movement mechanism or the Y-axis movement mechanism, and a visual microscopic mechanism is mounted on the first Z-axis movement mechanism. And a chopper positioning mechanism is mounted on the second Z-axis movement mechanism. According to the technical scheme provided by the invention, the alignment accuracy and stability in the wire leading process can be ensured, the yield and consistency of deep cavity bonding are improved, manual intervention and operation errors are reduced, automation of the wire bonding process is realized, the bonding precision and stability are improved, and the method has relatively high practicability and popularization value.

Devices and techniques include process steps for forming openings through stacked and bonded structures. The openings are formed by pre-etching through one or more layers of prepared dies after planarization of the bonding layer (by chemical-mechanical polishing (CMP) or the like) and prior to bonding. For instance, the openings are etched through one or more layers of dies to be bonded prior to bonding the dies to form an assembly.

An indexing system for a lathe tool holder comprises a lower housing assembly with a rotary driver shaft interfaced with a tool turret and rotatable by the tool turret, a rotary driver clutch secured to the rotary driver shaft, and an outer rotary comprising an internally threaded pocket. A rotary pusher with an externally threaded portion mates with the internally threaded pocket. Rotation of the rotary driver shaft causes the rotary pusher to move linearly without rotation. An upper housing assembly mounted on the lower housing assembly comprises a sawtooth connection for a multiple insert lathe tool holder head. A camshaft driver interfaces with the tool holder head and has a cam channel that circumscribes a path that is interfaced with a stationary cam pin. Linear movement of the rotary pusher causes rotation of the camshaft driver and thereby rotation and linear movement of the tool holder head.

The utility model discloses a driving four-axis index plate for copper strip production, which relates to the technical field of four-axis index plates and comprises a bottom plate and an adjusting component. Two corresponding supporting plates are fixed to the right end of the upper side of the bottom plate, rotating holes are formed in the edges of the upper sides of the supporting plates, rotating shafts are rotationally connected into the rotating holes, a four-shaft index plate is fixed between the two rotating shafts, a cooling assembly is installed on the left side of the bottom plate, and a gas injection assembly is installed on the upper side of the cooling assembly. The spraying assembly and the extrusion assembly are mounted on the upper side of the bottom plate, and the gas injection assembly is connected with the spraying assembly; and the adjusting assembly comprises a connecting disc, clamping grooves, fixing blocks, clamping rods, inclined blocks and springs, the connecting disc is fixed to the end face of the rotating shaft, the clamping grooves which are evenly distributed are formed in the circumferential face of the connecting disc, the fixing blocks are fixed to the side face of the supporting plate, efficient heat dissipation can be achieved, and meanwhile rapid adjustment can be achieved according to needs.

The utility model discloses an indexing alignment template for split boring, which comprises a template body, and the template body is provided with an alignment mark and two sets of connecting hole groups corresponding to two parts. The device is respectively used for indexing and alignment of the runner hub and the handling frame during single-piece machining of the numerical control boring machine, and can ensure the consistency of positions of each group of shaft holes of the runner hub and corresponding lug holes of the handling frame, so that split type machining of the runner hub and the handling frame is realized.

The invention discloses an indexing structure and a machining center, and the indexing structure comprises a fixed end assembly which comprises a fine adjustment fluted disc, a fixed end box body and a fixed end core shaft, the fine adjustment fluted disc is arranged on the fixed end core shaft in a sleeving manner, and the fixed end box body is fixedly connected with the fixed end core shaft; the rotating end assembly comprises a rotating fluted disc and a rotating end box body, and the rotating fluted disc and the rotating end box body are fixed; the fine adjustment mechanism is arranged on the fixed end box body and is in transmission connection with the fine adjustment fluted disc; wherein the fine adjustment mechanism is used for adjusting the rotation angle of the fine adjustment fluted disc; the oil cylinder is fixedly connected with the rotating end box body; wherein the oil cylinder is used for controlling the rotating fluted disc to move, so that the fine tuning fluted disc and the rotating fluted disc are in a disengaged or engaged state. In this way, the precision and flexibility of angle adjustment of the indexing structure can be improved.

The application relates to the technical field of index plates, in particular to a high-efficiency inclined double-shaft index plate which comprises a first rotating component and a moving unit. The first rotating component comprises a first index plate and a first camshaft, and a plurality of first rollers capable of sliding along preset motion tracks are uniformly distributed on the outer wall of the first index plate; a first cam with an arc surface is fixedly arranged on the first camshaft, the first cam forms a continuous curved groove, and the first rollers are embedded in the curved groove. The moving unit can drive the first rollers to slide along the preset motion tracks on the first index plate, so that the contact position of the first rollers and the cam with an arc surface when the first camshaft stops rotating is changed; when the working platform is at a specific angle for a long time, the meshing area of the first rollers and the first cam with an arc surface is prevented from being excessively worn due to long-term partial load, the wear degree is reduced, and the service life of the first index plate and the first camshaft is prolonged.

Microphone assembly (1) comprising at least one microphone capsule (2), preferably a MEMS microphone capsule, wherein the microphone assembly (1) comprises at least one electrical contacting means (3) for supplying voltage and / or for providing microphone signals, wherein the microphone assembly (1) comprises a first printed circuit board (4), on the upper side (5) of which the microphone capsule (2) is arranged, preferably fastened, wherein the first printed circuit board (4) comprises through-openings (6, 6a), characterized in that a bottom side (7) of the first circuit board (4) is connected to a second circuit board (9) comprising through-openings (8, 8a) in such a way that through-openings (6, 6a) of the first circuit board (4) and through-openings (8, 8a) of the second circuit board (9) form channels (10, 10a) designed for the passage of sound waves, and Channels (10, 10a) are formed which are spatially separated from one another by a web (11) arranged in the first circuit board (4) and a web (12) arranged in the second circuit board (9).

The invention discloses a silicon-based structure of a micro heat pipe and a processing technology, solves the problems that in the prior art, a metal micro heat pipe for heat dissipation of a silicon-based chip increases the thickness of the chip, and interface stripping and cracking are prone to occurring, and has the beneficial effects that heat dissipation of the micro heat pipe is achieved, and meanwhile the thickness of the silicon-based chip is effectively controlled. According to the specific scheme, the silicon-based structure of the micro heat pipe comprises a silicon-based chip substrate and a glass sheet, the silicon-based chip substrate and the glass sheet are attached together, a liquid absorption core is integrated on the side, facing the glass sheet, of the silicon-based chip substrate, and the liquid absorption core comprises an evaporation section, a heat insulation section and a condensation section which are sequentially connected; the length of the heat insulation section and the condensation section is larger than that of the evaporation section, the evaporation section comprises a plurality of working medium channels, all the working medium channels communicate with the heat insulation section, the working medium channels are arranged in an array mode, and every two adjacent working medium channels communicate with each other.

A workpiece support (18) for supporting a workpiece (14), the workpiece support (18) comprising a workpiece support body (54) and a workpiece support element (20) associated with the workpiece support body (54) for engaging the workpiece (14) and a piezo electric actuator (32) being associated with the workpiece support body (54) for moving the workpiece support element (20) for supporting the workpiece (14). The workpiece support body (54) comprising one or more flexures (44) that enable a movable portion (42) of the workpiece support body (54) to move when acted on by the piezo electric actuator (32) and to move the workpiece support element (20). The workpiece support (18) can comprise two or more workpiece support bodies (54) and a piezo electric actuator (32) being associated with each workpiece support body (54) for moving the respective workpiece support elements (20).

The application provides a resonant differential pressure sensor capable of static pressure measurement and a preparation method. The differential pressure sensor comprises a cover plate structure from top to bottom, a silicon-on-insulator (SOI) structure and a pressure guide structure. The cover plate structure comprises two small cover plates, i.e., a first small cover plate and a second small cover plate, and a large cover plate. The SOI structure comprises a device layer, a buried oxygen layer and a substrate layer. The beam membrane integrated structure has a stress amplification effect, which improves the small static pressure and differential pressure measurement sensitivity in the prior art, and the problems of large hysteresis, poor repeatability and poor precision caused thereby.

The invention relates to a method for preparing a workpiece for machining in a machining arrangement, the method comprising at least the following steps: - Providing the workpiece; - aligning the workpiece relative to a workpiece holder of the machining arrangement such that a workpiece longitudinal axis of the workpiece substantially coincides with a longitudinal axis of the workpiece holder; - relative displacement of a workpiece carrier arrangement of the machining arrangement and workpiece such that a coupling section of the workpiece first contacts the workpiece holder and then the workpiece holder is displaced from an initial position along a predetermined compensation distance so that a compensation arrangement generates the restoring force; - Coupling the coupling section of the workpiece with the workpiece holder under the influence of the restoring force; - Decoupling of a workpiece handling arrangement of the machining arrangement and workpiece, so that the compensation arrangement pushes the workpiece holder into the starting position by means of the restoring force.

The invention relates to a clamp for MEMS probe annealing and an MEMS probe annealing method, and the clamp comprises a first wafer which is provided with a first PI layer on the surface of one side, and the first PI layer is provided with a first groove; a second PI layer is arranged on the surface of one side of the second wafer, and a second groove opposite to the first groove is formed in the second PI layer; the PI layers of the first wafer and the second wafer are oppositely arranged, and the first groove and the second groove are closed to form a cavity matched with the shape of the MEMS probe to be annealed. The clamp is formed by polyimide, the problem of deformation of a metal structure in high-temperature annealing is solved, meanwhile, the clamp can adapt to various complex structures, the probe is perfectly attached, a high-precision clamp does not need to be independently manufactured, and the manufacturing cost is reduced.