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1198results about "Precision positioning equipment" patented technology
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Edge guide for media transport system
InactiveUS20110129278A1increase speedAutomatic control devicesPrecision positioning equipmentPrint mediaTransport system
An edge guide is provided. A structure includes curved surface over which a print media can travel. The print media includes a first edge and a second edge that is opposite the first edge. A first media guide is contactable with the first edge of the print media. A second media guide is contactable with the second edge of the print media. The second media guide is spaced apart from the first media guide. A relative spacing between the second media guide and the first media guide is adjustable such that a distance between the first media guide and the second media guide is variable. The second media guide includes a mechanism that applies a nesting force to the second edge of the print media to cause the first edge of the print media to move toward and contact the first media guide.
Owner:EASTMAN KODAK CO
Preparation method of MEMS micromirror driven by vertical comb teeth
PendingCN121426050ATelevision system detailsPiezoelectric/electrostriction/magnetostriction machinesComb driveMaterials science
The invention discloses a preparation method of a vertical comb-driven MEMS (Micro Electro Mechanical System) micromirror, which comprises the following steps of: forming a through alignment mark and a pre-etched comb structure on a device layer by using a first composite mask, and forming the through alignment mark and the pre-etched comb structure on the back surface of the device layer on a first substrate through a composite mask process, after the first substrate and the second substrate are bonded, the self-alignment composite mask of the comb tooth structure is aligned with the back face pre-etched comb tooth structure through the through alignment mark, high-precision alignment of the comb tooth structure is achieved, accumulated errors are avoided, and the yield of device preparation is improved.
Owner:NORTHWESTERN POLYTECHNICAL UNIV
Pressure sensor based on silicon-silicon bonding and preparation method thereof
PendingCN120483034ATelevision system detailsPiezoelectric/electrostriction/magnetostriction machinesWaferMetal electrodes
The invention provides a pressure sensor based on silicon-silicon bonding and a preparation method thereof. The preparation method comprises the following steps: providing a low-resistance silicon wafer, forming a silicon deep hole in a first surface of the low-resistance silicon wafer, and depositing an isolation material in the silicon deep hole to form an isolation ring; etching the first surface to form a shallow groove and a conductive silicon column to obtain a low-resistance cap wafer; providing an SOI wafer, performing ion implantation on the first surface of the SOI wafer to form a resistance region, and obtaining a substrate wafer; bonding the low-resistance cap wafer with the substrate wafer; grinding the second surface of the low-resistance cap wafer until the isolating ring is exposed; depositing an insulating layer on the second surface of the low-resistance cap wafer, and forming a metal electrode on the insulating layer; and forming a back cavity structure on the second surface of the substrate wafer, exposing the top silicon of the SOI wafer, and forming a sensitive film layer. The conductive silicon column is made of low-resistance silicon, copper ion pollution is avoided, the preparation process is simple, and the period is controllable; the device obtained based on the silicon-silicon bonding process has high bonding strength and high air tightness.
Owner:SHANGHAI IND U TECH RES INST
Method for attaching a MEMS micromirror unit and MEMS micromirror unit
The invention relates to a method for mounting a MEMS micromirror unit (100) in a higher-level assembly (200) with at least one receptacle (210) for a MEMS micromirror unit (110), as is used, for example, in projection exposure systems (1) for photolithography. The invention further relates to a MEMS micromirror unit (100) advantageously designed for this purpose. The process is characterized by the following steps: a) Inserting the MEMS micromirror unit (100) into the receptacle (210); b) Aligning the MEMS micromirror unit (100) with the recording (210); c) Applying an axial tensile force to an interface element (120) of the MEMS micromirror unit greater than the subsequent preload force, resulting in a longitudinal elongation of the interface element (120); d) Attaching the prestressing element (300) to a predetermined longitudinal position on the interface element (120); and e) Reducing and removing the axial tensile force. At the latest during the reduction of the axial tensile force, the preload element (300) comes into contact with the receptacle (210) and prevents a complete reversal of the longitudinal strain of the interface element (120), thus leaving a preload force on the interface element (120) with which the MEMS micromirror unit (100) can be fixed in the receptacle (210).
Owner:CARL ZEISS SMT GMBH
Clamping device for wing hanging drilling operation and laser measurement drilling system
ActiveCN121156795APrecision positioning equipmentMeasurement/indication equipmentsDrilling systemMachine tool
The invention relates to the technical field of five-axis machine tool drilling, in particular to a clamping device for wing hanging drilling operation and a laser measurement drilling system. A first middle assembly and a second middle assembly are detachably and fixedly connected with corresponding rotary tables; the second middle assembly is provided with an end plate extending front and back, and two sets of connecting areas spaced front and back are formed on the end plate. The clamping device further comprises a compensation insertion piece, and the compensation insertion piece can be selectively inserted between the first middle assembly and the first connecting lug and can also be selectively inserted between the connecting area and the rotary table so as to compensate the fluctuation quantity of the corresponding distance. The clamping device has the beneficial effects that through multiple technical means such as structure reuse, rotation reference unification, spacing compensation mechanism and assembly process optimization, high-precision, high-efficiency and high-stability indexing drilling clamping of the wing hanger is achieved, and then the drilling efficiency and the drilling precision are improved.
Owner:SHENYANG GUANGDA TECH DEV
Vacuum-compatible clamping and / or braking device
ActiveJP2025522195AFluid actuated brakesPrecision positioning equipmentMechanical engineeringPhysics
Owner:MEMA MASCH & APPARATESCHUTZ GMBH
Housing part for a pneumatic clamping and / or braking device
Owner:MEMA MASCH & APPARATESCHUTZ GMBH
High-efficiency inclined double-shaft index plate
The invention relates to the technical field of index plates, in particular to a high-efficiency inclined double-shaft index plate which comprises a first rotating assembly and a moving unit. The first rotating assembly comprises a first index plate and a first cam shaft, and a plurality of first rolling wheels capable of sliding along a preset movement track are evenly distributed on the outer wall of the first index plate in the circumferential direction; a first cambered surface cam is fixedly wound on the first cam shaft, a continuous curved surface groove is formed, and the first roller is embedded into the curved surface groove. The moving unit can drive the first roller to slide on the first index plate along the preset movement track so as to change the contact position of the first roller and the globoidal cam when the first cam shaft stops rotating, and the situation that when the working platform is located at the specific angle for a long time, the meshing area of the first roller and the first globoidal cam is excessively abraded due to long-term unbalance loading is avoided; the abrasion degree is reduced, and the service life of the first index plate and the first cam shaft is prolonged.
Owner:JIAXING TIANHE MACHINERY
Batch processing technology of micro-fluidic chip
InactiveCN121134678APrecision positioning equipmentDecorative surface effectsPolyethylene terephthalate glycolPolymethyl methacrylate
The invention discloses a batch processing technology of micro-fluidic chips, and relates to the technical field of chip processing. The method comprises the following steps: firstly, providing at least two layers of polymer coiled materials, namely a first coiled material for forming a micro-channel structure and a second coiled material for closing a micro-channel, the coiled materials are continuous coiled materials selected from polyethylene glycol terephthalate (PET), cycloolefin polymer (COP), polycarbonate (PC) or polymethyl methacrylate (PMMA), and the coiled materials are continuous coiled materials selected from polyethylene glycol terephthalate (PET), cycloolefin polymer (COP), polycarbonate (PC) or polymethyl methacrylate (PMMA); the thickness of the coiled material is 50-500 microns; secondly, carrying out continuous compression molding processing on the surface of the first coiled material through a roll-to-roll processing platform; through a roll-to-roll continuous process, micro-channel mold pressing, functional deposition, precise alignment bonding and online cutting are integrated, high-efficiency, high-consistency and high-integration-level batch manufacturing of the micro-fluidic chip is realized, and manual intervention and production cost are remarkably reduced.
Owner:SUZHOU HENGXIN MICROELECTRONICS CO LTD
Multi-angle machining tool for automobile steering knuckle
The multi-angle machining tool comprises a base and a movable plate, numerical control index plates are connected to the two opposite ends of the top face of the base, a plurality of first supporting bases are connected to the top face of the movable plate, a plurality of first oil cylinders are installed on the bottom face of the movable plate, and first piston rods are connected to the first oil cylinders; the first piston rod is sleeved with a first limiting assembly. The bottom face of the movable plate is connected with a plurality of second supporting bases, a plurality of second oil cylinders are installed on the top face of the movable plate, the second oil cylinders are connected with second piston rods, and the second piston rods are sleeved with second limiting assemblies. According to the technical scheme, the steering knuckle to be machined is installed on the first bearing seat which is obliquely arranged and the second bearing seat which is horizontally arranged according to the machining size requirement, in addition, when the steering knuckle is installed on the oblique first bearing seat, a plurality of angles needing to be machined on the steering knuckle can be exposed at the same time, and machining precision is improved. And the purposes of reducing the clamping frequency of the steering knuckle in the machining process and improving the machining efficiency are achieved.
Owner:CHONGQING HUIJIAN MASCH CO LTD
Gear ring fixing device for gear ring inner hole machining
InactiveCN120269378APrecision positioning equipmentFeeding apparatusMachining processMechanical engineering
The invention discloses a gear ring fixing device for gear ring inner hole machining, and belongs to the technical field of gear ring machining equipment.The gear ring fixing device for gear ring inner hole machining comprises a base, a lower chuck, an upper chuck and a drilling assembly, the lower chuck is rotationally connected to the base, the upper chuck is arranged above the lower chuck, and the drilling assembly is arranged on the base. A gear ring to be machined is arranged on the lower chuck, and the drilling assembly is arranged on one side of the base. According to the gear ring machining device, the gear ring to be machined can be clamped and fixed in the inner and outer directions, the gear ring is effectively prevented from deforming when fixed, the end face of the gear ring can be fixed through the limiting assembly, the gear ring is effectively prevented from vibrating in the machining process, the gear ring drilling precision and effect are effectively prevented from being affected, and the gear ring machining quality is improved.
Owner:TAIZHOU LIHUA MACNINERY
MEMS pressure sensor, manufacturing method thereof and electronic device
PendingCN121247717ATelevision system detailsPiezoelectric/electrostriction/magnetostriction machinesCapacitanceMems pressure sensor
The invention provides an MEMS pressure sensor and a manufacturing method thereof, and an electronic device, and the method comprises the steps: providing a first substrate, forming at least two first pressure structures on the surface of the first substrate, each first pressure structure comprises a first electrode layer, a first sacrificial layer, a first supporting layer, a second electrode layer, a second supporting layer, and a first cavity, and a first release hole; a second substrate is provided, at least two second pressure structures are formed on the surface of the second substrate, and each second pressure structure comprises a third electrode layer, a second sacrificial layer and a second cavity; bonding the second supporting layer with the second sacrificial layer; the second substrate is removed to expose the third electrode layer, the third electrode layer and the second electrode layer form a variable capacitance structure, the second electrode layer and the first electrode layer form a reference capacitance structure, and the two variable capacitance structures and the two reference capacitance structures jointly form a Wheatstone bridge. According to the scheme, the measurement precision is improved, and the device performance is further improved.
Owner:CHINA RESOURCES MICROELECTRONICS HLDG LTD
MEMS pressure sensor, manufacturing method thereof and electronic device
PendingCN121405033ATelevision system detailsPiezoelectric/electrostriction/magnetostriction machinesCapacitanceMems pressure sensor
The invention provides an MEMS pressure sensor, a manufacturing method thereof and an electronic device, and the method comprises the steps: providing a first substrate and a second substrate, forming a first pressure structure on the first substrate, and forming a second pressure structure on the second substrate; bonding the first pressure structure and the second pressure structure; the first substrate is removed, the first pressure structure and the second pressure structure jointly form a third pressure structure, the third pressure structure comprises a first electrode layer, a second electrode layer, a third electrode layer, a fourth electrode layer and a fifth electrode layer which are arranged at intervals from top to bottom, and a dielectric layer is formed between every two adjacent electrode layers; and cavities penetrating through the dielectric layers are formed in the dielectric layers. According to the scheme, the multiple electrode layers arranged from bottom to top are formed, the multiple electrode layers form the first capacitor, the second capacitor, the third capacitor and the fourth capacitor respectively, then the Wheatstone bridge is formed jointly, the measurement precision of the MEMS pressure sensor is improved, meanwhile, the plane size of the MEMS pressure sensor is reduced, and the integration level of the device is improved.
Owner:CHINA RESOURCES MICROELECTRONICS HLDG LTD
Flexible strain sensor and preparation method thereof
ActiveCN119665798APrecision positioning equipmentDecorative surface effectsElectrical connectionStrain gauge
The invention discloses a flexible strain sensor and a preparation method thereof, and relates to the technical field of sensors, the flexible strain sensor comprises a first flexible substrate layer and a plurality of sensor modules, the plurality of sensor modules are arranged on the first flexible substrate layer in an array structure, each sensor module comprises at least one strain gauge, and the strain gauges are arranged on the first flexible substrate layer. The strain gauges of all the sensor modules are electrically connected, each sensor module, the strain gauge of the sensor module and the first flexible substrate layer corresponding to the bottom protrude outwards to form a protruding structure, and when the protruding structure makes contact with a detected object, the strain gauge on the protruding structure is used for detecting the deformation quantity of the detected object. The flexible strain sensor provided by the embodiment of the invention not only is suitable for hard materials such as metal structures with relatively large rigidity, but also is suitable for elastic or composite materials with large deformation.
Owner:WUHAN ZHENYOU TECHNOLOGY CO LTD
Positioning a work piece
In a general aspect, a system for selectively positioning a work piece includes multiple bodies. A first body includes a first exterior surface and a boss extending from the first exterior surface along a boss axis. The boss includes a boss end surface that terminates the boss. Boss perimeter surfaces define a perimeter of the boss and extend between the first exterior surface and the boss end surface. A second body includes a second exterior surface and a pocket extending from the second exterior surface into the second body along a pocket axis. The pocket is shaped to receive the boss in a discrete number of positions when the boss axis and the pocket axis are aligned. Pocket perimeter surfaces define a perimeter of the pocket and extend into the second body from the second exterior surface.
Owner:OMMO TECHNOLOGIES INC
Method and system for high-precision alignment and transfer of microdevices in optoelectronic manufacturing
PCT designated stage expiredWO2025079041A1Precision positioning equipmentDecorative surface effectsPhysical chemistryEngineering
The invention discloses an advanced method for manufacturing optoelectronic system arrays, where microdevices are developed separately and then transferred into a system substrate. The invention discloses multiple embodiments, including distributed sacrificial reference points, real-time monitoring with various sensing technologies, laser-generated alignment marks, non-contact laser triangulation, and using polymers for marking to assess and correct alignment during each transfer stage dynamically. The invention further discloses methods, which may be AI based, for detecting and correcting errors caused by wear, environmental changes, load variability, and mechanical vibrations. In general, this system for pre-transfer calibration, monitoring, error detection, and compensatory adjustments enables precise and reliable integration of microdevices into optoelectronic systems, significantly enhancing alignment accuracy, stability, and reliability throughout the manufacturing process. The system can be further an AI-based calibration validation in a microdevice transfer system.
Owner:VUEREAL INC
Heating and cooling system for wafer bonding equipment
The invention relates to a heating and cooling system for wafer bonding equipment, which comprises a basic unit, a heating unit and a cooling unit, and is characterized in that the basic unit comprises an upper disc, a heating bin and a lower disc, and the heating bin is used for accommodating a wafer to be bonded and providing a vacuum environment for the wafer; the upper disc and the lower disc can be driven to be close to each other so as to apply set pressure to the wafer; an upper heater and a lower heater of the heating unit are used for heating the wafer in the axial direction, and an edge heater is used for carrying out heat compensation in the radial direction; an upper cooler and a lower cooler of the cooling unit are used for indirectly cooling the wafer; the wafer bonding device effectively improves heating uniformity and cooling efficiency in the wafer bonding process, can provide an accurate and effective vacuum environment for wafer bonding, and is simple in structure and easier to maintain and repair.
Owner:WENTIAN JINGCE INSTR TECH (SUZHOU) CO LTD
Method for manufacturing a MEMS component
PendingDE102024205817A1Television system detailsPiezoelectric/electrostriction/magnetostriction machinesSubstrate dopingCondensed matter physics
A method for fabricating a MEMS device comprising the following steps: providing a first bonding surface (1) on a first substrate (2) with a first substrate doping; providing a second bonding surface (3) on a second substrate (4) with a second substrate doping; aligning and joining the first and second bonding surfaces (1, 3) by a Si-Si direct bonding process, wherein both bonding surfaces (1, 3) have a silicon surface, and wherein an additional near-surface first doping layer (5) is produced below at least one of the bonding surfaces (1).
Owner:ROBERT BOSCH GMBH
Vacuum-compatible clamping and / or braking device
ActiveUS20250262723A1Fluid actuated brakesPrecision positioning equipmentMechanical engineeringPhysics
Owner:MEMA MASCH & APPARATESCHUTZ GMBH
Five-axis five-linkage turning, milling and drilling combined machining center
PendingCN121571999APrecision positioning equipmentOther manufacturing equipments/toolsStructural engineeringMachining
The invention relates to the technical field of combined machining, and discloses a five-axis five-linkage turning, milling and drilling combined machining center which comprises an equipment box, a mounting frame is mounted on the rear side of the inner wall of the bottom end of the equipment box, an automatic tool changing system is arranged on the left side of the mounting frame, and a transmission system is arranged in the middle of the mounting frame. A feeding table is slidably mounted on the front side of the inner wall of the bottom of the equipment box through sliding rails. The five-axis five-linkage turning, milling and drilling combined machining center can effectively solve the problems that in the prior art, a five-axis turning, milling and drilling combined machining center mostly adopts the mode that two sets of clamps are matched, parts need to be repeatedly clamped in the machining mode, the machining period of a single piece is directly prolonged through repeated positioning operation, and machining efficiency is high. The clamping precision and the consistency of the two sets of clamps cannot be guaranteed; in the prior art, a worker needs to stretch the upper body into a closed machining area of equipment and manually righting a part to enable the part to be aligned to a clamping hole position and keep a horizontal state, and the process is tedious in operation steps and has safety risks.
Owner:GUANGDONG WUSONG WUXI PRECISION MASCH CO LTD
Hydraulic index plate
ActiveCN120755721APrecision positioning equipmentLarge fixed membersControl engineeringControl theory
The invention relates to the technical field of intelligent index plates, in particular to a hydraulic index plate which comprises a base. The rotating seat is rotationally connected to the upper surface of the base; the main positioning grooves are formed in the rotating seat and are annularly distributed at equal angles; the clamping and fixing assembly is movably arranged on the rotating seat and located over the main positioning groove; the interference receding assembly is arranged at the joint of the annular sliding rail and the main positioning groove. According to the hydraulic index plate, the linkage locking assembly is arranged in a matched mode, the linkage locking assembly synchronously unlocks the interference receding assembly, so that the position of the clamping and fixing assembly can be rapidly adjusted, the operation convenience is improved while interference is avoided, intelligent collaborative operation of clamping and positioning is achieved, and the working efficiency is improved. The intelligent level and operation convenience of equipment operation are improved, the problem of space interference between the clamping and fixing assembly and machining equipment is effectively avoided, interference hidden dangers are eliminated fundamentally, and the intelligence of the hydraulic index plate is improved.
Owner:VALVE BIWEI VALVE CO LTD
Atomic gas chamber preparation equipment and method and atomic gas chamber
ActiveCN119822317ATelevision system detailsPiezoelectric/electrostriction/magnetostriction machinesParticulatesBonding process
The invention relates to the technical field of atomic gas chamber preparation, and discloses atomic gas chamber preparation equipment and method and an atomic gas chamber. The equipment comprises a vacuum box, a wafer bonding machine and an alkali metal injection device, the alkali metal injection device comprises a vacuum pump, an injection valve body, a heating piece, a vacuum firing pin and a vacuum probe row, the alkali metal injection and bonding process is carried out in a vacuum environment, and the situation that oxygen in the atmospheric environment oxidizes alkali metal and influences the quality of an atomic gas chamber can be effectively avoided; and meanwhile, external particulate matters are prevented from contaminating between the gas chamber component and the gas chamber sealing plate to influence the bonding effect and sealing performance, and the leakage rate of the atomic gas chamber can be effectively reduced, that is, the atomic gas chamber prepared by the atomic gas chamber preparation equipment is relatively high in yield and preparation efficiency.
Owner:BEIJING INST OF RADIO METROLOGY & MEASUREMENT
Tooth aligning clamp for position degree of long key groove of shaft part
PendingCN120095618APrecision positioning equipmentPositioning apparatusReciprocating motionMachining process
The invention provides a tooth alignment clamp for the position degree of a long key groove of a shaft part, which comprises a tooth alignment mistake proofing mechanism, the tooth alignment mistake proofing mechanism comprises a sliding block, and the sliding block is mounted on a tooth alignment seat and can reciprocate in the longitudinal direction; a tooth aligning gauge is further installed on the tooth aligning base, and the central axis of the tooth aligning gauge is arranged in the longitudinal direction. And a mistake-proof extension rod is arranged at the longitudinal rear end of the sliding block and is arranged in the transverse direction. The tooth alignment mistake-proofing mechanism further comprises a mistake-proofing tooth alignment seat, the mistake-proofing tooth alignment seat is installed on the mistake-proofing extension rod, and a mistake-proofing tooth alignment gauge measuring head is further arranged in the mistake-proofing tooth alignment seat. The central axis of the error-proof tooth gauge measuring head is arranged along the longitudinal direction. The tooth aligning gauge in the device is mainly used for aligning teeth in the machining process, and the accuracy of the position degree of the long key groove is guaranteed. The tooth alignment mistake-proofing mechanism is mainly used for preventing tooth alignment mistakes and plays a role in distinguishing and mistake proofing in advance.
Owner:BAOJI FAST GEAR
Multiple semiconductor die container load port
A multiple die container load port may include a housing with an opening, and an elevator to accommodate a plurality of different sized die containers. The multiple die container load port may include a stage supported by the housing and moveable within the opening of the housing by the elevator. The stage may include one or more positioning mechanisms to facilitate positioning of the plurality of different sized die containers on the stage, and may include different portions movable by the elevator to accommodate the plurality of different sized die containers. The multiple die container load port may include a position sensor to identify one of the plurality of different sized die containers positioned on the stage.
Owner:TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD
MEMS device, manufacturing method thereof and electronic device
PendingCN119929736ATelevision system detailsPiezoelectric/electrostriction/magnetostriction machinesDevice materialSemiconductor
The invention discloses an MEMS device and a manufacturing method thereof, and an electronic device, the MEMS device comprises a first semiconductor substrate and a second semiconductor substrate, the first semiconductor substrate and the second semiconductor substrate are bonded, and a device region is arranged between the first semiconductor substrate and the second semiconductor substrate; the semiconductor device further comprises a liquid blocking wall structure, the liquid blocking wall structure, the first semiconductor substrate and the second semiconductor substrate define cavity units, and the device area is correspondingly arranged in one cavity unit. In the manufacturing process of the MEMS device, even if cracks are generated in the semiconductor substrate, corrosive liquid entering the device regions along the cracks is difficult to diffuse in a large area among the plurality of device regions due to the blocking of the liquid blocking wall structure, so that the metal structure of the large-area device region is prevented from being corroded, and the reliability of the MEMS device is improved. Therefore, the chip yield of the whole semiconductor substrate is improved.
Owner:SEMICON MFG ELECTRONICS (SHAOXING) CORP
A quartz room temperature bonding method
ActiveCN115376966BPrecision positioning equipmentDecorative surface effectsHydrofluoric acidPhysical chemistry
The present invention provides a room-temperature quartz bonding method, comprising: S100, cleaning the surfaces of quartz wafers; S200, depositing silicon dioxide on two quartz wafers to form a silicon dioxide bonding film on the surfaces of the quartz wafers; S300, chemically mechanically polishing the silicon dioxide bonding film; S400, cleaning the quartz wafers with a hydrofluoric acid solution; and S500, bringing the silicon dioxide bonding films of the two quartz wafers into contact with each other and bonding the quartz wafers using a bonding machine. This method can achieve high-reliability bonding between quartz wafers at room temperature.
Owner:CHANGCHUN CHANGGUANG YUANCHEN MICROELECTRONICS TECH CO LTD
Monolithic integrated MEMS micro differential pressure chip and preparation method thereof
PendingCN120081332ATelevision system detailsPiezoelectric/electrostriction/magnetostriction machinesSilicon chipPhotolithography
According to the monolithic integrated MEMS micro differential pressure chip, a plurality of first injection regions (10), a second injection region (11), an all-dielectric isolation structure (6), a collector region (8), a base region (9), an emitter region (7) and a buried layer (1) are arranged on a first SOI silicon wafer, and correspondingly matched metal leads (13) are arranged on the second injection region (11), the collector region (8), the base region (9) and the emitter region (7). A second double-parabolic silicon wafer (5) is connected to the first SOI silicon wafer, and the monolithic integrated MEMS micro differential pressure chip is prepared through photoetching, injection, annealing, etching, film forming and sputtering processes. The invention has the advantages of simple structure, convenience in preparation and the like, and provides an efficient and economical solution for manufacturing a high-performance and high-reliability MEMS pressure chip.
Owner:EAST CHINA INST OF OPTOELECTRONICS INTEGRATEDDEVICE
Preparation method of vacuum device, vacuum device and electronic equipment
PendingCN119898723ATelevision system detailsPiezoelectric/electrostriction/magnetostriction machinesElectrode pairMaterials science
According to the preparation method of the vacuum device, the vacuum device and the electronic equipment provided by the invention, the carrier plate groove is formed in the outer side of the bonding groove, and the carrier plate electrode is arranged outside the cavity structure, so that the influence of the carrier plate electrode on the vacuum effect of the cavity structure is avoided, and the vacuum effect of the cavity structure is improved. Moreover, the arrangement of the bonding groove not only can avoid the influence on the vacuum effect of the cavity structure due to the overflow of the solder bump to the periphery during the subsequent substrate bonding, but also can avoid the influence on the bonding effect of the substrate due to the projection of the solder bump, thereby further improving the vacuum effect of the cavity structure, and improving the bonding effect of the substrate. Besides, a carrier exposed groove is formed in the second substrate in advance, and a vacuum device formed after bonding can be directly ground to expose a carrier electrode and an alignment mark, so that the possibility of damage to the cavity structure is avoided, and the vacuum effect of the cavity structure is further improved.
Owner:GUANGZHOU ZENGXIN TECH CO LTD
Piezoresistive sensor, piezoresistive sensor structure and manufacturing method thereof
ActiveCN119509586Aeasy to quantifyTelevision system detailsPiezoelectric/electrostriction/magnetostriction machinesThin membraneNanotechnology
The invention provides a piezoresistive sensor, a piezoresistive sensor structure and a manufacturing method thereof, the piezoresistive sensor can simulate the magnitude of external pressure borne by the piezoresistive sensor structure by adjusting the voltage difference between two pressure simulation electrodes, and can simulate the magnitude of external pressure borne by the piezoresistive sensor structure by adjusting the driving voltage of the piezoresistive sensor structure. Therefore, the piezoresistive sensor can be used for generating excitation-response pairs required by the PUF technology, so that the PUF key technology can be realized on the piezoresistive sensor. The piezoresistive sensor structure comprises a first substrate and a second substrate arranged below the first substrate, the upper surface of the second substrate is provided with a cavity, and a sensitive film is formed in the first substrate area above the cavity; the Wheatstone bridge structure is arranged on the first substrate; a first pressure simulation electrode is arranged on the surface, facing the cavity, of the sensitive film; and a second pressure simulation electrode is arranged on the surface of the second substrate at the bottom of the cavity.
Owner:YONGJIANG LAB
Propeller shell machining and positioning device and machining equipment with same
PendingCN119658411Aprecise positioningPrecision positioning equipmentPositioning apparatusPropellerStructural engineering
The invention discloses a propeller shell machining and positioning device and machining equipment with the propeller shell machining and positioning device, the positioning device comprises a positioning mechanism, an indexing mechanism, a stop mechanism and a pressing mechanism, the positioning mechanism comprises an indexing disc, a base and a mandrel, and the indexing disc is provided with four positioning holes evenly distributed in the circumferential direction; the base is provided with a mounting hole corresponding to any positioning hole in position; the index plate is located at the top of the base and rotationally connected with the base. The mandrel vertically penetrates through the index plate and the base, the mandrel is fixedly connected with the index plate, and the mandrel is rotationally connected with the base; the indexing mechanism is mounted in the mounting hole so as to extend into or retreat from the positioning hole; the index plate is fixed on the base through a stop mechanism; and the pressing mechanism is mounted at the top of the mandrel to press the slurry shell on the index plate. According to the indexing mechanism, each positioning hole passing through the corresponding mounting hole can be positioned when the indexing plate rotates, so that the rotating angle of the indexing plate is controlled, four oar sleeves can be sequentially and accurately machined, operation is easy and convenient, and accurate positioning is achieved.
Owner:AVIC HUIYANG AVIATION PROPELLER