The invention belongs to the technical field of back contact
cell preparation, and particularly relates to a back contact
cell of an opening
semiconductor without
etching and a preparation method thereof, and the method comprises the steps: S103, carrying out the
polishing or texturing of the back surface of a
silicon wafer obtained in S102; s104, depositing an intrinsic
crystalline silicon layer on the back surface of the
silicon wafer; s105, the non-target deposition area is masked through a
hard mask plate, and N-type
crystalline silicon layers which are alternately arranged are deposited on the back face; replacing the
mask of the
hard mask plate to form a P-type
crystalline silicon layer and an overlapping region; s106, depositing a conductive film layer on the back surface of the
silicon wafer; s107, an opening is formed in the conductive film layer to form an isolation groove, and the width W4 of the isolation groove is controlled to range from 0.03 mm to 0.15 mm; and S108, forming a
metal electrode on the back surface. According to the invention, the back
semiconductor does not need to be opened by
etching, the technological process is greatly simplified,
etching damage is avoided, and the
cell conversion efficiency, the cell stability and the production yield are improved.