18102 results about "Melting point" patented technology

An extrusion-based freeform fabrication method for making a three-dimensional object from a design created on a computer, including (a) providing a support member; (b) operating a dispensing head having at least one dispensing nozzle with a discharge orifice for dispensing continuous strands of a material composition in a fluent state at a first temperature onto the support member, the material composition including a reactive prepolymer with a melting point above 23° C. and the first temperature being greater than the prepolymer melting point; (c) operating material treatment devices for causing the dispensed strands of material composition to rapidly achieve a rigid state in which the material composition is substantially solidified to build up the 3-D object, the material treatment devices also working to convert the reactive prepolymer to a higher molecular weight thermoplastic resin; and (d) operating control devices for generating control signals in response to coordinates of the object design to control the movement of the dispensing nozzle relative to the support member and for controlling the strand dispensing of the material composition to construct the 3-D object.

An implantable medical device is disclosed. The device is fabricated at least in part from a biocompatible, biodegradable composition. The composition is composed of a biocompatible, biodegradable polymer and a biocompatible, biodegradable wax. The concentration of the wax at the surface of the device is greater than the concentration of the wax in the body of the implantable device. The increased concentration of wax at the device surface may be attained when the device is heated to a temperature greater than the melting point of the wax and the glass transition temperature of the polymer, but lower than melting point of the polymer.

A process for carrying the non-metallocene catalyst by composite carrier includes such steps as thermally activating silica gel, reacting on the solution of magnesium chloride in tetrahydrofuran-alcohol solution to obtain composite carrier, reacting on chemical treating agent to obtain modified composite carrier and carrying non-metallocene catalyst by solution method or dipping method. Said catalyst can be used for the homopolymerization or copolymerization of C2-C10 olefin, styrene, or ethylene.

Compositions suitable for film comprise at least one ethylene/α-olefin interpolymer, wherein the ethylene/α-olefin interpolymer may have, for example, a Mw/Mn from about 1.7 to about 3.5, at least one melting point, Tm, in degrees Celsius, and a density, d, in grams/cubic centimeter, wherein the numerical values of Tm and d correspond to the relationship:

Tm>−2002.9+4538.5(d)−2422.2(d)2.

A media storage device and method for fabricating said device is provided. The device comprises a data layer capable of storing and erasing data via application of an energy beam, such as a near field optical non diffraction limited beam or electron beam. A separate capping layer is deposited on the data layer. The separate capping layer is relatively transparent to the energy beam and may be formed from various materials, including but not limited to an epitaxial material, a conducting material, and a robust high melting point material, such as Molybdenum.

The present invention relates to film layers and compositions having improved hot tack properties. The compositions comprise at least one ethylene/α-olefin interpolymer, wherein the ethylene/α-olefin interpolymer may have, for example, a Mw/Mn from about 1.7 to about 3.5, at least one melting point, Tm, in degrees Celsius, and a density, d, in grams/cubic centimeter, wherein the numerical values of Tm and d correspond to the relationship:

Tm>−2002.9+4538.5(d)−2422.2(d)2.

A carrying process for the carried non-metallocene catalyst includes activating the porous carrier, washing, filtering, drying and directly carrying the nno-metallocene catalyst used for olefine polymerization. Said catalyst can be used for the slurry-type or gas-phase homopolymerization or copolymerization of C2-C10 olefin, styrene, or ethylene.

Conductive through vias are formed in electronic devices and electronic device carrier, such as, a silicon chip carrier. An annulus cavity is etched into the silicon carrier from the top side of the carrier and the cavity is filled with insulating material to form an isolation collar around a silicon core region. An insulating layer with at least one wiring level, having a portion in contact with the silicon core region, is formed on the top side of the carrier. Silicon is removed from the back side of the carrier sufficient to expose the distal portion of the isolation collar. The core region is etched out to expose the portion of the wiring level in contact with the silicon core region to form an empty via. The via is filled with conductive material in contact with the exposed portion of the wiring level to form a conductive through via to the wiring level. A solder bump formed, for example, from low melt C4 solder, is formed on the conductive via exposed on the carrier back side. The process acts to make the conductive via fill step independent of the via isolation step.

To provide the method of forming the thin coating film of fluorine-containing polymer having heat resistance and non-sticking property by adhering directly to a substrate without lowering characteristics such as reflection and light transmission which the substrate has. The thin coating film is a film which comprises a continuous layer of fluorine-containing polymer formed by adhering directly to the substrate and has a thickness of less than 3 mum, wherein the fluorine-containing polymer in the coating film has a hydrophilic functional group and a crystalline melting point of not less than 200° C.

A silicon production reactor comprising a reaction vessel and heating means, said reaction vessel comprising a vertically extending wall and a space surrounded by the wall, said heating means being capable of heating at least a part, including lower end portion, of the wall's surface facing the space to a temperature of not lower than the melting point of silicon, said silicon production reactor being adapted to flow raw gas for silicon deposition from an upper part of the space of the reaction vessel toward a lower part thereof, characterized in that the space of the reaction vessel is of slit form in cross-sectional view. This silicon production reactor is capable of attaining improvement with respect to problems encountered at apparatus scaleup, such as decrease of reactivity of raw gas and generation of by-products, thereby accomplishing a striking enhancement of production efficiency.

The present invention relates to compositions and methods for forming a bit body for an earth-boring bit. The bit body may comprise hard particles, wherein the hard particles comprise at least one carbide, nitride, boride, and oxide and solid solutions thereof, and a binder binding together the hard particles. The binder may comprise at least one metal selected from cobalt, nickel, and iron, and at least one melting point reducing constituent selected from a transition metal carbide in the range of 30 to 60 weight percent, boron up to 10 weight percent, silicon up to 20 weight percent, chromium up to 20 weight percent, and manganese up to 25 weight percent, wherein the weight percentages are based on the total weight of the binder. In addition, the hard particles may comprise at least one of (i) cast carbide (WC+W2C) particles, (ii) transition metal carbide particles selected from the carbides of titanium, chromium, vanadium, zirconium, hafnium, tantalum, molybdenum, niobium, and tungsten, and (iii) sintered cemented carbide particles.

An electrochemical device having excellent safety at high temperature is provided by using a separator for an electrochemical device, which is made of a porous film comprising: a porous base (5) having a heat-resistant temperature of 150° C. or higher and including filler particles (3); at least one kind of shutdown resin (6) selected from the group consisting of resin A that has a melting point in a range of 80° C. to 130° C. and resin B that absorbs an electrolyte and swells due to heating, and the swelling degree is increased as the temperature rises; and a binder (4).

Absorbent products, such as disposable diapers and incontinence garments, comprising an improved lotion formulation are disclosed. The lotion formulation is applied to the bodyfacing surface of the bodyside liner and is stable at elevated temperatures, remains on or near the surface of the absorbent product prior to use, and readily transfers to the user's skin upon use. The lotion formulations described herein have a melt point viscosity of from about 5000 cPs to about 1,000,000 cPs, and a process temperature viscosity of from about 50 cPs to about 50,000 cPs. The lotion formulations comprise an emollient, a structurant, a rheology enhancer, and other optional components.

The present invention relates to a composition comprising 1) from 1 to 98 weight % of a first propylene polymer having a melting point of 100° C. or more, 2) from 5 to 98 weight % of a second propylene polymer having a heat of fusion of 70 J/g or less and a tacticity index of 75% or more, 3) from 0.5 to 75 weight % of a non-functionalized plasticizer (“NFP”) having a viscosity index of 120 or more, based upon the weight of the first polymer, second polymer, and the NFP, and articles therefrom

Disclosed are polyester shrink films comprising a voiding agent dispersed within a continuous polyester phase. The voiding agent comprises at least one first polymer and at least one second polymer, in which the polymer components have selected physical properties such as glass transition temperature, melting point, tensile modulus, surface tension, and melt viscosity. The resulting shrink films have high opacity, a low coefficient of friction, lower density, low shrink force, and good printability. The films are useful for sleeve label and other shrink film applications, and their lower density allows them to be readily separated from soft drink bottles, food containers and the like during recycling operations. Also disclosed is a process for separating a void-containing polyester from a mixture of polymers.

Disclosed are a printed wiring board having micro-via holes highly reliable for conduction and a method of making the micro-via hole by providing a coating or sheet of an organic substance containing 3 to 97% by volume of at least one selected from a metal compound powder, a carbon powder or a metal powder having a melting point of at least 900° C. and a bond energy of at least 300 kJ/mol on a copper foil as an outermost layer of a copper-clad laminate having at least two copper layers, or providing a coating or sheet of the same after oxidizing a copper foil as an outermost layer, irradiating the coating or sheet with a carbon dioxide gas laser at an output of 20 to 60 mJ/pulse, thereby removing a micro-via-hole-forming portion of at least the copper foil as the outermost layer, then irradiating micro-via-hole-forming portions of the remaining layers with a carbon dioxide gas laser at an output of 5 to 35 mJ/pulse to make a micro-via hole which does not penetrate through the copper foil in a bottom of the micro-via hole, and electrically connecting the copper foil as the outermost layer and the copper foil in the bottom of the micro-via hole with a metal plating or an electrically conductive coating composition.