The application discloses a flexible washing electronic tag preparation device and method and a flexible washing electronic tag, and relates to the technical field of
semiconductor preparation devices. The flexible washing electronic tag preparation device comprises a unwinding conveying
assembly, an ultrasonic wire implanting device, a dispensing and packaging device, a laminating and compounding device and a
die cutting and winding device. The unwinding conveying
assembly is used for unwinding and transporting a cloth glue composite layer along a conveying path. The ultrasonic wire implanting device is used for ultrasonic wire implanting of the cloth glue composite layer, so as to
implant metal wires on the cloth glue composite layer. The dispensing and packaging device is used for packaging a
chip module on the
metal wires to form a
metal coil layer. The laminating and compounding device is used for arranging a top glue layer on the metal coil layer, arranging a top cloth material layer on the top glue layer, and hot flat pressing the cloth glue composite layer, the metal coil layer, the top glue layer and the top cloth material layer to form a
label tape. The
die cutting and winding device is used for
die cutting the
label tape to form the flexible washing electronic tag, and winding the flexible washing electronic tag.