The utility model relates to a packaging structure of a non-contact intelligent card with an FPCB (Flexible
Printed Circuit Board), belongs to the technical field of packaging of intelligent cards, and solves the problem that the non-contact intelligent card with the FPCB is high in
raw material cost or high in
rejection rate of packaging lamination in the prior art. The film comprises a first covering film, a middle layer and a second covering film which are sequentially arranged, a first positioning hole is formed in the first covering film, a second positioning hole is formed in the middle layer, a third positioning hole is formed in the second covering film, and the first positioning hole, the second positioning hole and the third positioning hole are vertically aligned. The middle layer comprises an FPCB
electronic circuit module and a wound high-frequency antenna, the wound high-frequency antenna is connected with the FPCB
electronic circuit module, and the wound high-frequency antenna is an enameled wire. According to the utility model, the positioning holes are used for positioning, so that the accurate positioning of the first covering film, the second covering film and the middle layer is ensured, and the yield of packaging lamination is improved; and by adopting the high-frequency antenna in the form of the enameled wire, the area of the FPCB is reduced, and the cost of raw materials is reduced.