The invention relates to the technical field of inner shaft
machining, in particular to a
wafer conveying mechanical arm inner shaft
machining method which comprises the following steps: step 1, a material pretreatment stage; 2, a composite heat treatment stage; 3, a precision
machining stage; 4, a surface treatment stage; 5, a detection and calibration stage; according to the method, through material-process-detection full-link innovation, comprehensive improvement of the performance of the inner shaft is achieved, in the aspect of materials, Cr / Ni / Cu ternary synergistic
alloy is combined with nano
precipitation strengthening, the tensile strength reaches 1200 MPa and is improved by 20% compared with traditional stainless steel, grains are refined to ASTM 10-12 level through gradient
solid solution and vacuum aging treatment, the
grain boundary area is increased by 50%, the
hardness uniformity is controlled to be HV + / -15, and the performance of the inner shaft is improved. Vibration suppression and
thermal expansion compensation models are integrated in the machining link, + / -0.5 mu m / m
thermal deformation control is achieved, the
surface roughness Ra is smaller than or equal to 0.2 mu m through PCBN tool mirror machining, an intelligent detection
system triggers nanoscale compensation
grinding through three-coordinate closed-loop feedback, and the
rejection rate is reduced to 0.1% from 5%.