2961results about "Thermoelectric device manufacture/treatment" patented technology

A method for fabricating a thermocouple capable of long-term operation in high temperature, hostile environments without significant signal degradation or shortened thermocouple lifetime due to heat induced brittleness.

An improved efficiency thermoelectric system and method of making such a thermoelectric system are disclosed. Significant thermal isolation between thermoelectric elements in at least one direction across a thermoelectric system provides increased efficiency over conventional thermoelectric arrays. Significant thermal isolation is also provided for at least one heat exchanger coupled to the thermoelectric elements. In one embodiment, the properties, such as resistance or current flow, of the thermoelectric elements may also be varied in at least one direction across a thermoelectric array. In addition, the mechanical configuration of the thermoelectric elements may be varied, in one embodiment, according to dynamic adjustment criteria.

A thermoelectric material comprises two or more components, at least one of which is a thermoelectric material. The first component is nanostructured, for example as an electrically conducting nanostructured network, and can include nanowires, nanoparticles, or other nanostructures of the first component. The second component may comprise an electrical insulator, such as an inorganic oxide, other electrical insulator, other low thermal conductivity material, voids, air-filled gaps, and the like. Additional components may be included, for example to improve mechanical properties. Quantum size effects within the nanostructured first component can advantageously modify the thermoelectric properties of the first component. In other examples, the second component may be a thermoelectric material, and additional components may be included.

A number of compact, high-efficiency and high-power density thermoelectric systems utilizing the advantages of thermal isolation are described. Such configurations exhibit high system efficiency and power density. Some configurations exhibit a substantial reduction in the amount of thermoelectric material required.

A thin sensor for heat flux and temperature, designed for adhesive attachment to a surface, is manufactured on a flexible insulated metallic substrate. The sensor exhibits a combination of high sensitivity for heat flux and low resistance to the flow of heat. These characteristics enable it to measure heat flux at surface boundaries with improved accuracy over conventional heat flux transducers because the temperature drop produced by the sensor is very small. The response by the sensor to radiation, convection and conduction are equal. As such, the sensor can be calibrated in one mode of heat transfer and used for measurement in other modes. The high sensitivity of the sensor makes it ideal for measuring heat flow through insulating materials, and well adapted to instrumenting heat flow in buildings, detecting fires at an early stage, or remotely measuring the temperature of string and web products in industrial processing.

An improved efficiency thermoelectric system and method of making such a thermoelectric system are disclosed. Significant thermal isolation between thermoelectric elements in at least one direction across a thermoelectric system provides increased efficiency over conventional thermoelectric arrays. Significant thermal isolation is also provided for at least one heat exchanger coupled to the thermoelectric elements. In one embodiment, the properties, such as resistance or current flow, of the thermoelectric elements may also be varied in at least one direction across a thermoelectric array. In addition, the mechanical configuration of the thermoelectric elements may be varied, in one embodiment, according to dynamic adjustment criteria.

A thermoelectric module comprising an N-type thermoelectric element having excellent characteristics in atmospheric air even when the temperature rises to a medium-to-high temperature region of about 500° C. and, further, improving the conversion efficiency of a thermoelectric module, by the combination of an excellent P-type thermoelectric material and an excellent n-type thermoelectric material containing a compound having a skutterudite structure, the module comprising an N-type thermoelectric elements each containing a compound having a skutterudite structure, P-type thermoelectric elements each connected directly or by way of a metal member to the N-type thermoelectric elements and containing an Mn-Si series compound,

Various embodiments of a semiconductor-on-insulator substrate incorporating a Peltier effect heat transfer device and methods of fabricating the same are provided. In one aspect, a circuit device is provided that includes an insulating substrate, a semiconductor structure positioned on the insulating substrate and a Peltier effect heat transfer device coupled to the insulating substrate to transfer heat between the semiconductor structure and the insulating substrate.

Semiconductor integrated thermoelectric devices are provided, which are formed having high-density arrays of thermoelectric (TE) elements using semiconductor thin-film and VLSI (very large scale integration) fabrication processes. Thermoelectric devices can be either separately formed and bonded to semiconductor chips, or integrally formed within the non-active surface of semiconductor chips, for example.

A method for fabricating an electronic device comprises providing a substrate (501), direct writing a functional material by a thermal spray on the substrate (502) and removing a portion of the function material to form the electronic or sensory device (503).

A thermoelectric material comprises core-shell particles having a core formed from a core material and a shell formed from a shell material. In representative examples, the shell material is a material showing an appreciable thermoelectric effect in bulk. The core material preferably has a lower thermal conductivity than the shell material. In representative examples, the core material is an inorganic oxide such as silica or alumina, and the shell material is a chalcogenide semiconductor such as a telluride, for example bismuth telluride. A thermoelectric material including such core-shell particles may have an improved thermoelectric figure of merit compared with a bulk sample of the shell material alone. Embodiments of the invention further include thermoelectric devices using such thermoelectric materials, and preparation techniques. The use of core-shell nanoparticles allows highly uniform nanocomposites to be formed, and embodiments of the invention also includes other materials and devices using core-shell particles.

A number of compact, high-efficiency thermoelectric system utilizing the advantages of thermal isolation in the direction of a working medium flow or movement, in manufacturable systems, are described. Such configurations exhibit high system efficiency and power density. Several different embodiments and applications are disclosed utilizing a plurality of thermoelectric modules or thermoelectric elements sandwiched between heat exchangers.

A thermoelectric material includes a composite having a first electrically conducting component and second low thermal conductivity component. The first component may include a semiconductor and the second component may include an inorganic oxide. The thermoelectric composite includes a network of the first component having nanoparticles of the second component dispersed in the network.

An instrument for performing highly accurate PCR employing an assembly, a heated cover and an internal computer. The assembly is made up of a sample block, a number of Peltier thermal electric devices and heat sink, clamped together. The sample block temperature is changed exclusively by the thermoelectric devices controlled by the computer. The sample block is of low thermal mass and is constructed of silver. The Peltier devices are designed to provide fast temperature excursions over a wide range. The heat sink has a perimeter trench to minimize edge losses and is adjacent to a continuously variable fan. A perimeter heater is used to improve the thermal uniformity across the sample block to approximately ±0.2° C. A heated platen pushes down onto the tube caps to apply a minimum acceptable force for seating the tubes into the block, ensuring good thermal contact with the block. The force is applied about the periphery of the tube caps to prevent distortion of the caps during thermal cycling. The platen is heated to provided thermal isolation from ambient conditions and to prevent evaporation from the surface of the sample into the upper portion of the sample tube. A control algorithm manipulates the current supplied to the thermoelectric coolers such that the dynamic thermal performance of the block can be controlled so that pre-defined thermal profiles for the sample temperature can be executed. The sample temperature is calculated instead of measured using a design specific model and equations. The control software includes calibration diagnostics which permit variation in the performance of thermoelectric coolers from instrument to instrument to be compensated for such that all instruments perform identically. The block / heat sink assembly can be changed to another of the same or different design. The assembly carries the necessary information required to characterize its own performance in an on-board memory device, allowing the assembly to be interchangeable among instruments while retaining its precision operating characteristics. The instrument has a graphical user interface. The instrument monitors the thermoelectric devices and warns of changes in resistance that may result in failure.

A system which can efficiently control the temperature of the battery module, and also can easily control the temperature in the intense environment by actively adapting the exterior environment. The system for controlling temperature of a secondary battery module includes a housing receiving a plurality of unit batteries. The housing has an inlet and an outlet. A heat transfer member is in contact with the unit batteries. The heat transfer member has a portion exposed to a heat transfer medium duct formed inside the housing, and a temperature controller is mounted in the heat transfer member to control temperature of the unit batteries.

A thermoelectric conversion material and a thermoelectric conversion device having a novel structure of an increased figure of merit are provided by forming nano-wires of thermoelectric material in a smaller cross-sectional size. The thermoelectric conversion material comprises nano-wires obtained by introducing a thermoelectric material (semiconductor material) into columnar pores of a porous body. The porous body is formed by providing a structure in which columns of a column-forming material containing a first component (for example, aluminum) are distributed in a matrix containing a second component (for example, silicon or germanium or a mixture of them) being eutectic with the first component, and then removing the column-forming material from the structure. The average diameter of the nano-wires of the thermoelectric material is 0.5 nm or more and less than 15 nm, and the spacing of the nano-wires is 5 nm or more and less than 20 nm.

A vertical, monolithic, thin-film thermoelectric device is described. Thermoelectric elements of opposing conductivity types may be coupled electrically in series and thermally in parallel by associated electrodes on a single substrate, reducing the need for mechanisms to attach multiple substrates or components. Phonon transport may be separated from electron transport in a thermoelectric element. A thermoelectric element may have a thickness less than an associated thermalization length. An insulating film between an electrode having a first temperature and an electrode having a second temperature may be a low-thermal conductivity material, a low-k, or ultra-low-k dielectric. Phonon thermal conductivity between a thermoelectric element and an electrode may be reduced without a significant reduction in electron thermal conductivity, as compared to other thermoelectric devices. A phonon conduction impeding material may be included in regions coupling an electrode to an associated thermoelectric element (e.g., a liquid metal).

A forward-looking method and system is provided for determining an economically optimal energy dispatching schema to meet the combined demands of heating, cooling and electrical by an energy plant and a facilities plant. The optimal energy dispatching schema is determined for each of a plurality of incremental time segments defined in a forward-looking time period by optimizing these loads. The schema can be used for real time energy dispatching by the energy plant, in an existing energy plant optimization, and / or a new energy plant planning and design over the forward looking time period or any other forward-looking time period.

A microcavity apparatus and systems for maintaining microcavity spacing over a macroscopic area. An application of this invention is a microscale generator. This microscale generator includes a first element for receiving energy; a second element, opposite the first element for transferring energy; at least one panel on either of the first element or the second element, the panel facing the other element; a device for controlling the distance between the at least one panel and the facing element to form a predetermined, sub-micron gap between the panel and the facing element for increasing energy transfer to the element for receiving; and a device, responsive to the energy transfer, for generating electricity.

A thermoelectric chip with exposed surfaces of N-type and P-type semiconductor elements on its top and bottom surfaces is prepared by arranging the semiconductor elements in a matrix manner such that each of the N-type semiconductor elements is disposed adjacent to the P-type semiconductor element through a space, and filling the space with a first resin material having electrical insulation. A metal layer is formed on each of the exposed surfaces of the semiconductor elements. Then, first electrodes are formed on the top surface according to a first circuit pattern. Similarly, second electrodes are formed on the bottom surface according to a second circuit pattern different from the first circuit pattern. An electrical insulation sheet of a second resin material containing a ceramic powder with high thermal conductivity is bonded to the top and bottom surfaces to obtain the thermoelectric module.

A thermoelectric module 11 includes support substrates 1a and 1b, the same numbers of N-type thermoelectric elements 2a and P-type thermoelectric elements 2b disposed on the support substrates 1a and 1b, wiring conductors 3a and 3b that electrically connect between the thermoelectric elements in series and an external connection terminal 4 electrically connected to the wiring conductor 3a. The N-type thermoelectric elements 2a and the P-type thermoelectric elements 2b have different values of resistivity.

Representative configurations for improved thermoelectric power generation systems to improve and increase thermal efficiency are disclosed.

Methods and devices for controlling thermal conductivity and thermoelectric power of semiconductor nanowires are described. The thermal conductivity and the thermoelectric power are controlled substantially independently of the electrical conductivity of the nanowires by controlling dimensions and doping, respectively, of the nanowires. A thermoelectric device comprising p-doped and n-doped semiconductor nanowire thermocouples is also shown, together with a method to fabricate alternately p-doped and n-doped arrays of silicon nanowires.

A thermoelectric device having at least one thermoelectric unit including at least one thermoelectric pair of n-type and p-type thermoelements, a first header coupled to one side of the thermoelectric pair, and a second header coupled to a second side of the thermoelectric pair. The thermoelectric pair has a thermal conduction channel area smaller than an area of the first header or the second header such that the thermal conduction area is a fraction of the area of the first header or the second header.

A method and system for environmental control and supplementary power generation in conventional and hybrid vehicle applications is presented. A thermoelectric heat pump function regulates vehicular interior temperature environments and uses the waste heat from a vehicles engine to power thermocouples and generate supplemental electrical current to power electrical devices. Thermocouples are used to gauge changes in temperature. The Peltier Effect is used to provide both primary cabin environmental control and supplementary power generation for motorized vehicle applications. Thermoelectric generators can be used for both primary internal climate control and supplementary power generation in the vehicular environment. Thermoelectric heat pumps' special characteristics are used to provide (a) primary cabin environment control including cooling, heating, dehumidifying, defrosting, pre-heating / pre-cooling and (b) supplemental DC power generation functions for conventional fossil fueled and / or biomass-fueled vehicles as well as emerging hybrid or all electric vehicle applications.

A thermoelectric device that can exhibit substantially high specific power density is provided. The device includes core having a p-type element made from carbon nanotube and an n-type element. The device also includes a heat plate in and a cool plate, between which the core can be positioned. The design of the thermoelectric device allows the device to operate at substantially high temperature and to generate substantially high power output, despite being light weight. A method for making the thermoelectric device is also provided.

A thermoelectric module comprises an upper insulating substrate and a lower insulating substrate; an upper electric circuit metal layer and a lower electric circuit metal layer bonded respectively to the surfaces of said insulating substrates which are positioned face to face; an upper blast stopper layer and a lower blast stopper layer fabricated respectively on said electric circuit metal layers; an upper bonding layer and a lower bonding layer fabricated respectively on said blast stopper layers; and a plurality of -shaped elements consisting of a pair of the P-type semiconductor element and N-type semiconductor element which are fabricated between said upper and lower bonding layers and are electrically connected in series through said upper and lower blast stopper layers.

The main object of the present invention is to provide the thermoelectric conversion materials having a high thermoelectric conversion performance and the excellent mass productivity. The object of the present invention is achieved by providing the thermoelectric conversion materials comprising a core-shell structure having a plurality of core parts and shell parts for covering the above-mentioned core parts, wherein the plurality of the above-mentioned core parts are independent with each other and the above-mentioned shell parts are provided continuously.

The presently disclosed invention provides for the fabrication of porous anodic alumina (PAA) films on a wide variety of substrates. The substrate comprises a wafer layer and may further include an adhesion layer deposited on the wafer layer. An anodic alumina template is formed on the substrate. When a rigid substrate such as Si is used, the resulting anodic alumina film is more tractable, easily grown on extensive areas in a uniform manner, and manipulated without danger of cracking. The substrate can be manipulated to obtain free-standing alumina templates of high optical quality and substantially flat surfaces PAA films can also be grown this way on patterned and non-planar surfaces. Furthermore, under certain conditions the resulting PAA is missing the barrier layer (partially or completely) and the bottom of the pores can be readily accessed electrically. The resultant film can be used as a template for forming an array of nanowires wherein the nanowires are deposited electrochemically into the pores of the template. By patterning the electrically conducting adhesion layer, pores in different areas of the template can be addressed independently, and can be filled electrochemically by different materials. Single-stage and multi-stage nanowire-based thermoelectric devices, consisting of both n-type and p-type nanowires, can be assembled on a silicon substrate by this method.

A thermoelectric structure and device including at least first and second material systems having different lattice constants and interposed in contact with each other, and a physical interface at which the at least first and second material systems are joined with a lattice mismatch and at which structural integrity of the first and second material systems is substantially maintained. The at least first and second material systems have a charge carrier transport direction normal to the physical interface and preferably periodically arranged in a superlattice structure.