Patents
Literature
Hiro is an intelligent assistant for R&D personnel, combined with Patent DNA, to facilitate innovative research.
Hiro

5240results about How to "Increase heat" patented technology

Apparatus and method for treating tumors near the surface of an organ

A system for treating a target region in tissue beneath a tissue surface comprises a probe for deploying an electrode array within the tissue and a surface electrode for engaging the tissue surface above the treatment site. Preferably, surface electrode includes a plurality of tissue-penetrating elements which advance into the tissue, and the surface electrode is removably attachable to the probe. The tissue may be treated in a monopolar fashion where the electrode array and surface electrode are attached to a common pole on an electrode surgical power supply and powered simultaneously or successively, or in a bipolar fashion where the electrode array and surface electrode are attached to opposite poles of the power supply. The systems are particularly useful for treating tumors and other tissue treatment regions which lie near the surface.
Owner:BOSTON SCI SCIMED INC

High-strength and ultra heat-resistant high entropy alloy (HEA) matrix composites and method of preparing the same

A high-strength and ultra heat-resistant high entropy alloy (HEA) matrix composite material and a method of preparing the HEA matrix composite material are provided. The HEA matrix composite material may include at least four matrix elements among Co, Cr, Fe, Ni, Mn, Cu, Mo, V, Nb, Ta, Ti, Zr, W, Si, Hf and Al, and a body-centered cubic (BCC) forming alloy element.
Owner:KOREA ADVANCED INST OF SCI & TECH

High power LED package

InactiveUS20050274959A1Heat radiation property can be improvedIncrease powerSolid-state devicesSemiconductor devicesLiquid-crystal displayEngineering
Disclosed is a high power LED package, including an LED; a silicon submount to which the LED is flip chip bonded; a reflective film formed on the silicon submount and electrically connected to the LED to increase light emitting efficiency of the LED; electrical wires connected to the reflective film to connect the LED to an external circuit; an insulating body formed below the silicon submount; a heat sink formed below the insulating body; an insulating substrate formed on the heat sink; and metal lines formed on the insulating substrate and connected to the electrical wires. In the LED package, since the silicon submount having the LED flip chip bonded thereto is directly attached to the heat sink, heat generated upon operation of the LED can be effectively radiated. Also, the LED package has a simple structure, thus having drastically decreased manufacturing costs. The high power LED can be applied to backlight units of LCDs or general illumination fixtures, and as well, to backlight units of conventional PCS phones or LED packages for key pads, therefore increasing the light properties of the LED. In particular, the LED package has an array of two or more submounts each having an LED flip chip bonded thereto, and thus, it can be applied to a module of a backlight unit for LCDs, thus having remarkably reduced manufacturing costs.
Owner:LG ELECTRONICS INC

Microwave-induced localized heating of cnt filled polymer composites for enhanced inter-bead diffusive bonding of fused filament fabricated parts

A microwave-induced heating of CNT filled (or coated) polymer composites for enhancing inter-bead diffusive bonding of fused filament fabricated parts. The technique incorporates microwave absorbing nanomaterials (carbon nanotubes (CNTs)) onto the surface or throughout the volume of 3D printer polymer filament to increase the inter-bead bond strength following a post microwave irradiation treatment and / or in-situ focused microwave beam during printing. The overall strength of the final 3D printed part will be dramatically increased and the isotropic mechanical properties of fused filament part will approach or exceed conventionally manufactured counterparts.
Owner:TEXAS TECH UNIV SYST

Method and apparatus for electric arc welding

An electric arc welding apparatus for depositing molten metal from an advancing welding wire into a weld puddle in an open root between two juxtapositioned plates where the root extends in a welding path and is formed by converging walls terminating in generally parallel walls spaced to define a gap, which apparatus comprises a contact holder with a wire outlet, a switching power supply directing welding current to the wire as the wire passes from the outlet toward the open root, with the advancing wire defining an electrode stick out between the contact holder and the weld puddle, a circuit for sensing the length of the stick out, and control means for adjusting the welding current as a function of the sensed stick out length.
Owner:LINCOLN GLOBAL INC

Air conditioner for vehicle with heat pump cycle

InactiveUS20110016896A1Prevent heatDefrost time be reduceMechanical apparatusHeat pumpsCooling cycleChiller
An air conditioner for a vehicle includes a vapor compression refrigeration cycle switchable between a heat pump cycle and a cooler cycle, a heat core configured to heat air to be blown into a vehicle compartment by using coolant of an engine of the vehicle as a heat source, and a controller configured to control operation of the vapor compression refrigeration cycle. The controller controls the vapor compression refrigeration cycle to be operated as the cooler cycle so as to perform a defrosting control of the outdoor heat exchanger, and outputs an operation request signal to the engine, when the controller determines that the outdoor heat exchanger is frosted.
Owner:DENSO CORP

Hard multilayer coated tool having increased toughness

A hard multilayer coated tool including: (a) a substrate; and (b) a multilayer coating covering the substrate, the multilayer coating comprising first and second coating layers which are alternately laminated on the substrate, each of the first coating layers having and average thickness of 0.10-0.50 mum and containing titanium therein, each of the second coating layers having and average thickness of 0.10-0.50 mum and containing aluminum therein, the multilayer coating having and average thickness of 0.50-10.0 mum.
Owner:OSG

Flashlight housing

The present invention provides a lighting assembly that incorporates a high intensity LED package into an integral housing for further incorporation into other useful lighting devices. The present invention primarily includes three housing components, namely an inner mounting die, an outer enclosure and an outer housing that cooperate to enhance the heat management of the overall assembly. The inner and outer components cooperate to retain the LED package, provide electrical and control connections, provide integral heat sink capacity and includes an integrated reflector cup. Surface area enhancements on the outer surface of the outer enclosure are aligned with openings in the outer housing to allow efficient air flow around the LED assembly to enhance cooling. In this manner, high intensity LED packages can be incorporated into lighting assemblies with reduced risk of overheating and malfunction.
Owner:EMISSIVE ENERGY A DELAWARE

Multi-layer sheet comprising a protective polyurethane layer

InactiveUS6383644B2Good abrasion and scratch resistanceReadily convertFilm/foil adhesivesSynthetic resin layered productsAcid groupPolycarbonate
The present invention provides a multilayer sheet comprising a polymeric film having on a first major side a cross-linked polyurethane layer, the major part of said cross-linked polyurethane layer comprising a polycarbonate based polyurethane containing acid groups and cross-linked with a cross-linker, the polycarbonate-based polyurethane comprising the reaction product of a polycarbonate polyol or a polycarbonate polyamine and an aliphatic polyisocyanate and the uncross-linked polycarbonate-based polyurethane having a Koenig hardness of at least 150 seconds.
Owner:3M INNOVATIVE PROPERTIES CO
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products