The utility model discloses a
high heat dissipation type combined circuit board connecting structure belongs to
electronic circuit packaging technical field, including circuit board,
aluminium base plate and glass board, the
aluminium base plate partial inlay is in glass board, the surface fixed with a plurality of heat conduction bosses of
aluminium base plate, the glass board inside is equipped with a plurality of heat conduction through -hole, and heat conduction through -hole and the heat conduction boss on aluminium base plate correspond inlay, and the heat conduction through -hole is filled with
graphene heat conduction glue, the surface of glass board is provided with
copper foil wiring area, and the
copper foil wiring area is covered with solder
resist layer outward. This
high heat dissipation type combined circuit board connecting structure, convenient connection has solved the contradiction of traditional circuit board heat dissipation and wiring, is applicable to
new energy automobile, industrial power supply and other
high heat consumption
electronic equipment, has the advantages such as high heat dissipation efficiency, strong reliability, good process compatibility.