154274 results about "Electrically conductive" patented technology

A structure includes a first substrate including a first layer having at least one electrically conductive first portion and at least one electrically insulative second portion and a second substrate including a second layer having at least one electrically conductive third portion and at least one electrically insulative fourth portion. The structure further includes an interface layer having at least one electrically conductive oxide material between the first layer and the second layer. The at least one electrically conductive oxide material includes at least one first region between and in electrical communication with the at least one electrically conductive first portion and the at least one electrically conductive third portion, and at least one second region between the at least one electrically insulative second portion and the at least one electrically insulative fourth portion.

A semiconductor element is provided with a micro-structured metal layer over conductive features of a hybrid bonding surface. The micro-structured metal layer comprises fine metal grain microstructure, such as nanograins. The micro-structured metal layer can be formed over the conductive features by providing a metal oxide and reducing the metal oxide to metal. The micro-structured metal layer can be formed selectively if the metal oxide is formed by oxidation. When directly bonded to another element, the micro-structured metal layer forming strong bonds at the bonding interface can substantially reduce annealing temperature.

A semiconductor element is provided with a micro-structured metal oxide layer over a conductive feature at a hybrid bonding surface. The micro-structured metal oxide layer comprises fine metal oxide grains, such as nanograins. The grains can be formed over the conductive feature by oxidizing a metal comprised in the conductive feature, or by providing a metal oxide over the conductive feature. When directly bonded to another element, the micro-structured metal oxide layer can form strong bonds at the bonding interface at substantially reduced annealing temperature.

A device including a first integrated device die and a semiconductor device. The first integrated device die can include a die insulating layer and a die conductive feature at least partially embedded in the die insulating layer. The semiconductor device can include a first insulating layer on the first surface, a device conductive feature at least partially embedded in the first insulating layer, and a first heavily doped semiconductor material electrically connected to the device conductive feature. The die conductive feature can be connected to power or ground through at least the first heavily doped semiconductor material.

A device includes a backplane and a plurality of elements arranged on the backplane. The plurality of elements form an irregular pattern. The backplane includes a plurality of circuits. The plurality of elements are coupled to the plurality of circuits by conductive vias that are regularly spaced.

An electrosurgical instrument comprising an end effector is disclosed. The end effector comprises a first jaw and a second jaw. The first jaw comprises a first electrode. The end effector is movable from an open configuration to a closed configuration to grasp tissue. The second jaw comprises a second electrode configured to deliver a first monopolar energy to the tissue, a third electrode, and a conductive circuit selectively transitionable between a connected configuration with the third electrode and a disconnected configuration with the third electrode. In the connected configuration, the third electrode is configured to cooperate with the first electrode to deliver bipolar energy to the tissue. The conductive circuit defines a return path for the bipolar energy. In the disconnected configuration, the first electrode is configured to deliver a second monopolar energy to the tissue.

An aerial vehicle or another system having moving components may be configured with a capacitive sensing system for detecting body parts of humans or other animals within proximity. The capacitive sensing system includes conductive components provided in association with surfaces of housings within which motors rotate propellers or other objects. The capacitors are coupled to circuits including transistors, resistors, capacitors or other features that are configured to determine levels of capacitance on the conductive components during operations of the aerial vehicle or other system. When a body part approaches a conductive component, and disrupts a level of capacitance on a capacitor coupled to the conductive component, a change in the level of capacitance on the capacitor is detected. Where the change exceeds a predetermined threshold, predetermined actions such as stopping or otherwise altering operations of the motors may be performed.

The invention relates to a closed-loop multi-guide multi-mode time domain interference electrical stimulation system and method. The method comprises the steps that a software part determines stimulation parameters; the automatic electrode position adjusting device adjusts the spatial position of the multi-conductive-electrode device, and the multi-conductive-electrode device stimulates the position of a target spot; the current output precision and impedance monitoring module monitors the precision and impedance information of electrode output current, and the core main control and functional circuit module adjusts a control signal according to the precision and impedance information; when the multi-conducting-electrode device conducts stimulation, the electroencephalogram device synchronously collects electroencephalogram signals and uploads the electroencephalogram signals to the electroencephalogram analysis algorithm module of the software part, the electroencephalogram analysis algorithm module evaluates and feeds back the effectiveness and the effect of stimulation, and the time domain interference electrical stimulation function module and the target area dynamic adjustment algorithm module optimize stimulation parameters according to the effectiveness and the effect of stimulation. Through the arrangement, a real-time closed-loop feedback control system is formed, continuous monitoring, real-time optimization and adjustment of electrical stimulation parameters and dynamic adjustment of a stimulated brain target region are realized, and the accuracy and safety of current output are ensured.

Disclosed are methods of microelectronic processing to reveal conductive vias that are at least partially embedded in a bulk semiconductor, and resulting structures. A method of forming a microelectronic structure includes revealing the plurality of conductive vias from a back surface of the bulk semiconductor and forming a protective cap on each of the conductive vias on the back surface of the bulk semiconductor. The protective caps can be patterned or disposed selectively onto the conductive vias. The protective caps can cover the conductive vias or also cover a portion of the bulk semiconductor surrounding the conductive vias. The back surface of the bulk semiconductor is etched to form protruding conductive vias, which can be surrounded by sleeves of the bulk semiconductor. A dielectric layer is deposited over the back surface and planarized to reveal the plurality of conductive vias from the back surface.

The invention relates to the technical field of sensor detection, and discloses a detection method and device based on a multi-mode gas sensor, and the method comprises the following steps: carrying out blending processing on a metal oxide semiconductor and a conductive material to obtain a bimodal nano composite material, and creating a multi-mode gas detection module, the preprocessed multi-mode signal data is acquired and obtained; acquiring and analyzing data of the temperature sensor and the humidity sensor to obtain environmental factor compensation parameters; performing adaptive calibration processing on the preprocessed multi-modal signal data according to the environmental factor compensation parameters to obtain calibrated multi-modal signal data; constructing a multi-input neural network model based on the calibrated multi-modal signal data, and training to obtain a gas recognition model; multi-mode signals collected and calibrated in real time are analyzed and judged based on the gas recognition model, gas type and concentration information is obtained, and high-precision and high-reliability gas detection is achieved.

A DC relay for anti-short circuit current and arc extinction includes two static contact leading-out ends, a movable contact piece in a straight sheet type, a pushing rod assembly, a fixed upper yoke, a follow-up yoke and a lower armature. The fixed upper yoke is fixed above the movable contact piece, corresponding to a position between the two movable contacts. The follow-up upper yoke is fixed on the pushing rod assembly, above the movable contact piece, corresponding to a position between the two movable contacts. The lower armature is fixed on a bottom end face of the movable contact piece. The fixed upper yoke, the follow-up upper yoke and the lower armature are respectively arranged in a width direction of the movable contact piece, and two magnetic conductive loops are formed in the width direction of the movable contact piece.

A method for circumscribing an insulating barrier region around a singular conductive microneedle structure or plurality of conductive microneedle structures adhered to a fixed substrate for the purpose of spatially defining a conduit for the routing of an electrical signal from the surface of said microneedle or microneedles to the posterior surface of the substrate is disclosed herein. A microneedle-based electrochemical biosensors structure comprises a substrate, a microneedle biosensor, a primary electrically conductive element, a secondary electrically conductive element and an electrically insulative annular barrier.

The disclosure relates to a CFET device (100) comprising: a bottom FET device (130) and a top FET device (140) stacked on top of the bottom FET device (130), the bottom FET device (130) comprising a bottom channel nanostructure (132) and a bottom gate electrode (134) comprising a side gate portion (134a) arranged along a first side surface (132a) of the bottom channel nano structure, and the top FET device (140) comprising a top channel nanosheet (142) and a top gate electrode (144) configured to define a tri-gate with respect to the top channel nanosheet and comprising a side gate portion (144b) arranged along a second side surface (142b) of the top channel nanosheet, wherein the side gate portion (134a) of the bottom gate electrode (134) defines a via contact portion protruding outside the top gate electrode (144) and the first side surface (142a) of the top channel nanosheet (142); and atop gate contact via (146) for coupling the top gate electrode (144) to a first conductive line (124) over the top FET device (140) and a bottom gate contact via (136) for coupling the via contact portion (134a) of the bottom gate electrode (134) to a second conductive line (128) over the top FET device (140).

A memory device is provided. The memory device includes a bottom electrode, a first data storage layer, a second data storage layer, an interfacial conductive layer and a top electrode. The first data storage layer is disposed on the bottom electrode and in contact with the bottom electrode. The second data storage layer is disposed over the first data storage layer. The interfacial conductive layer is disposed between the first data storage layer and the second data storage layer. The top electrode is disposed over the second data storage layer.

Aspects of this disclosure relate to an acoustic wave resonator with a patterned conductive layer. The acoustic wave resonator can include a piezoelectric layer, an interdigital transducer electrode over the piezoelectric layer, and a temperature compensation layer over the interdigital transducer electrode. The interdigital transducer electrode can include a bus bar and fingers extending from the bus bar. The fingers can each include an edge portion and a body portion. The patterned conductive layer can overlap the edge portions of the fingers. The patterned conductive layer can conductive portions that are spaced apart from each other. A portion of the temperature compensation layer can be positioned between the patterned conductive layer and the interdigital transducer electrode.

The invention provides a photovoltaic module and a photovoltaic system, and relates to the technical field of photovoltaics. The photovoltaic module comprises an insulating part, a conductive back plate and a back contact battery piece. The back contact battery piece comprises a collector grid line; the combined parts and the non-combined parts extend in the second direction and are alternately distributed in the first direction, and each of the combined parts and the non-combined parts comprises a part of the collector grid line; the conductive back plate comprises a conductive layer and an insulating layer located between the conductive layer and the back contact battery piece; a through hole is formed in a position, corresponding to at least one combination part, in the insulating layer; the through hole is filled with a bonding material; the current collection grid line of one polarity in the combination part is electrically connected with the conductive layer through a combination material, and the current collection grid line of the other polarity is provided with an insulating part and is insulated from the conductive layer through the insulating part; for one through hole, the ratio of the width of the insulator to the width of the through hole is greater than 1 and less than or equal to 50. The photovoltaic module has the advantages of small hidden crack risk, easy mass production, long service life and good current collection effect.

A hand-held refrigeration fan is provided, including a fan head and a hand-held portion. The fan head includes a fan housing, an air duct is formed in the fan housing, and the fan housing is provided with a connecting through hole penetrating through inner and outer sides of the air duct. A conductive member is arranged on an outer surface of the hand-held portion, a refrigeration apparatus is arranged in the hand-held portion, a refrigeration end of the refrigeration apparatus is connected to the conductive member in a heat conduction manner, and a heat dissipation end of the refrigeration apparatus communicates with the air duct after penetrating through the connecting through hole. A conductive sheet is arranged on an outer surface of a hand-held portion, and a refrigeration effect is achieved by the conductive sheet through the operation of a refrigeration apparatus.

Embodiments described herein relate generally to apparatuses and processes for forming semi-solid electrodes having high active solids loading by removing excess electrolyte. In some embodiments, the semi-solid electrode material can be formed by mixing an active material and, optionally, a conductive material in a liquid electrolyte to form a suspension. In some embodiments, the semi-solid electrode material can be disposed onto a current collector to form an intermediate electrode. In some embodiments, the semi-solid electrode material can have a first composition in which the ratio of electrolyte to active material is between about 10:1 and about 1:1. In some embodiments, a method for converting the semi-solid electrode material from the first composition into the second composition includes removing a portion of the electrolyte from the semi-solid electrode material. In some embodiments, the method includes mechanically compressing the intermediate electrode to remove the portion of electrolyte from the semi-solid electrode material.

An example test station assembly of a cathodic protection monitoring assembly includes a face plate including a plurality of openings. In addition, the test station assembly includes a plurality of test posts to pass through the plurality of openings. Further, the test station assembly includes a plurality of electrically non-conductive identification indicators to connect to the plurality of test posts on the face plate. Each of the plurality of identification indicators including one or more identifying characteristics to identify a corresponding voltage source of a plurality of underground voltage sources associated with an at least partially buried structure, a cathodic protection system for the buried structure, or the cathodic protection monitoring assembly. Still further, the test station assembly includes a plurality of electrical conductors to electrically connect the plurality of test posts to the plurality of underground voltage sources.

The present invention discloses a system and method for quickly testing the anti-hydrolysis performance of LED chips, wherein the system comprises: a temperature and humidity regulator, the temperature and humidity regulator is provided with a cavity; a rotating device connected to the inner wall of the cavity, the rotating device can rotate along the inner wall of the cavity; a bracket, the bracket is a cup-shaped structure, the LED chip is mounted on the bracket and forms a conductive connection with the bracket; a test substrate, the bracket is fixed on the test substrate, and the bracket is conductively connected to the test substrate, and the test substrate is connected to the rotating device; the direction of the LED chip is adjusted by the rotating device, a reverse voltage is passed to the test substrate, and the temperature and humidity in the cavity are adjusted to perform an impact test on the LED chip. The direction of the LED chip is adjusted by the rotating device, and the hydrolysis speed of the LED chip is effectively accelerated, thereby shortening the detection time.

The invention relates to the field of solar cells, and discloses a buried interface modified trans-perovskite solar cell and a preparation method thereof. The trans-perovskite solar cell structurally comprises a substrate, a conductive layer, a hole transport layer, a perovskite light absorption layer, an electron transport layer and a metal counter electrode which are sequentially layered, the hole transport layer adopts a hole transport material [4-(3, 6-dimethyl-9H-carbazole-9-yl) butyl] phosphoric acid (Me-4PACz), and the hole transport layer adopts a hole transport material [4-(3, 6-dimethyl-9H-carbazole-9-yl) butyl] phosphoric acid (Me-4PACz). According to bottom-buried interface modification provided by the invention, a hole transport material Me-4PACz is modified by adopting a (2-phenethyl) phosphonic acid small molecule material, the modified Me-4PACz hole transport layer has high perovskite layer coverage rate, the preparation process is simple, the efficiency of the assembled solar cell is high, the stability is obviously improved, and the commercial application value is very good.

The invention belongs to the technical field of perovskite solar cells, and particularly discloses a self-assembly monomolecular film hole transport material based on diphosphoric acid and a preparation method and application thereof.The diphosphoric acid serves as an anchoring group, the chelation between the material and a conductive base can be effectively enhanced, the self-assembly characteristic of the material on the surface of a substrate is improved, and the hole transport efficiency is improved. The compact and smooth self-assembled monomolecular film is formed. Meanwhile, the electron and space effects of alkyl chains or benzene ring connecting units are regulated and controlled, so that the molecular stereo configuration and energy level matching are optimized. The material disclosed by the invention is simple in synthesis steps and low in preparation cost, and industrial synthesis of the material can be realized. When the material is applied to an inverted perovskite solar cell as a hole transport layer, photoelectric conversion efficiency exceeding 24.7% and excellent device stability performance can be obtained, and huge commercial prospects are shown.

The invention provides a device for generating shock waves. The device may comprise an elongated tube and a conductive sheath circumferentially mounted around the elongated tube. The device may further comprise first and second insulated wires extending along the outer surface of the elongated tube. A portion of the first insulated wire is removed to form a first inner electrode, which is adjacent to a first side edge of the conductive sheath. A portion of the second insulated wire is removed to form a second inner electrode, which is adjacent to a second side edge of the conductive sheath. Responsive to a high voltage being applied across the first inner electrode and the second inner electrode, a first shock wave is created across the first side edge and the first inner electrode, and a second shock wave is created across the second side edge and the second inner electrode.

The invention discloses a back contact cell and a photovoltaic module, relates to the technical field of photovoltaic, and aims to perform field passivation on a first region and an overlapping region through a doping layer, and the doping layer can form a favorable electric field consistent with the induction direction of a first doped silicon layer so as to improve the collection efficiency of the first doped silicon layer on current carriers. The back contact cell includes a semiconductor substrate, a tunneling passivation layer, a first doped silicon layer, an intrinsic silicon layer, a second doped silicon layer, and a doped layer. The tunneling passivation layer and the first doped silicon layer are sequentially arranged on the first region and the overlapping region in a stacked mode. The intrinsic silicon layer and the second doped silicon layer are sequentially arranged on the second area in a stacked mode and further extend to cover the tunneling passivation layer and the first doped silicon layer which are located in the overlapping area. The doped layer is disposed within the first region and the overlapping region of the semiconductor substrate. And the doping concentration of a first doping element with the same conduction type as that of the first doping silicon layer in the doping layer is greater than that of the first doping element in the second region of the semiconductor substrate.

The invention relates to the technical field of electrolytic refining, and provides an electrochemical device and method for extracting metal from molten salt. The electrochemical device comprises an anode, a cathode, an insulating container, an electrolytic bath and an ultrasonic stirring device. The cathode comprises a conductive part and liquid metal; the insulating container is provided with a containing space, the top side of the containing space is open, the liquid metal is contained in the containing space, and a part of the conductive part is inserted into the liquid metal; the electrolytic bath is provided with a containing cavity used for containing molten salt, the insulating container can be used for being immersed in the molten salt so that liquid metal can make contact with the molten salt, and one part of the anode is used for being inserted into the molten salt; a portion of the ultrasonic stirring device is inserted into the liquid metal for oscillating the liquid metal. The liquid metal is subjected to ultrasonic oscillation in the electrolysis process, so that the possibility that metal dendrites are formed on a reduction product or a high-melting-point alloy layer is formed on the surface of the liquid metal is effectively reduced, the reaction efficiency of electrolytic extraction is improved, and the quality of the extracted reduction product is improved.

The invention relates to a hair curler that is easy to disassemble and assemble with stable conductivity, which comprises a curling unit and a holding control unit, wherein one end of the curling unit is equipped with a locking connection unit, which comprises a locking plate and a second elastic member connected to the locking plate; wherein one end of the holding control unit is equipped with a main conductive unit, which is used to cooperate with the locking connection unit to drive the curling unit to rotate; wherein the main conductive unit comprises a fixed conductive component fixed in the holding control unit and a rotary conductive component rotationally connected to one end of the fixed conductive component, wherein one end of the fixed conductive component is connected to a first conductive strip through at least one first elastic member, wherein the first elastic member is used to elastically push the first conductive strip to electrically conduct with the rotary conductive component, wherein the locking plate is pushed and fastened to one end of the rotary conductive component through a second elastic member. The invention has the advantages of more convenient disassembly and assembly, better and more continuous and stable conductive state, while simultaneously improvement of the assembly efficiency of products.

The invention relates to a preparation method of a self-assembled monomolecular layer in a perovskite cell, and belongs to the technical field of solar cells, and the preparation method comprises the following steps: S1, preparing an SAM layer; step S1.1, soaking the conductive glass substrate into the preheated SAM first precursor solution; step S1.2, quickly soaking in a second SAM precursor solution; s1.3, taking out and removing the residual solvent to obtain an SAM layer; step S2, annealing; s3, preparing a perovskite light absorption layer and other functional layers; and depositing a perovskite light absorption layer and other functional layers on the SAM layer in sequence, and finally preparing a complete perovskite solar cell. According to the method, the appropriate high-boiling-point solvent is selected to prepare the SAM precursor solution, then the conductive substrate is rapidly soaked in the SAM precursor solution under the condition that the high temperature is kept, SAM molecules are rapidly self-assembled within seconds at the high temperature, the self-assembled molecular layer is more uniform and compact, the perovskite buried bottom interface has fewer defects, the interface contact is better, and the performance of the conductive substrate is improved. And the efficiency and the stability of the perovskite cell are obviously improved.

The invention belongs to the technical field of copper-clad plates, and relates to a low-dielectric high-heat-resistance copper-clad plate and a preparation method thereof. By introducing the POSS resin, the dielectric constant of the copper-clad plate is effectively reduced, which is crucial for reducing signal delay and improving signal transmission efficiency. The introduction of the POSS resin not only improves the dielectric properties of the material, but also improves the glass transition temperature (Tg) of the material, which means that the physical and chemical properties of the material can be kept unchanged at a higher temperature, and the material is suitable for wider environmental conditions. By using the resin and the inorganic filler in a specific ratio, the copper-clad plate shows excellent copper foil peel strength, and ensures that the bonding force between the copper foil and the base material is not easily weakened under long-term use or severe conditions. Meanwhile, the material also has excellent CAF (conductive anode wire) resistance, can effectively prevent internal short circuit caused by moisture, and prolongs the service life of an electronic product.

An apparatus may include a substrate. The apparatus may also include a first charger terminal disposed on the substrate and configured to apply a first electric potential to a first battery terminal of a battery. The apparatus may additionally include a second charger terminal disposed on the substrate and configured to apply a second electric potential to a second battery terminal of the battery. The apparatus may further include a barrier located on the substrate between the first charger terminal and the second charger terminal and configured to electrically isolate the first charger terminal and the second charger terminal by obstructing formation of a conductive path by way of a liquid disposed on the substrate.

The invention provides a photovoltaic module and a photovoltaic system, and relates to the technical field of photovoltaics. The photovoltaic module comprises a conductive backboard and a back contact battery piece arranged on the conductive backboard. The back contact battery piece comprises a plurality of current collection grid lines and a plurality of current collection grid lines. The conductive back plate comprises a conductive layer and an insulating layer located between the conductive layer and the back contact battery piece; a through hole is formed in the position, corresponding to the bus grid line, in the insulating layer, the through hole is filled with a bonding material, and the bus grid line is electrically connected with the conducting layer through the bonding material in the through hole; in a back contact battery piece area, the ratio of the total number of the through holes in the area, corresponding to one column of bus grid lines, in the insulating layer to the total column number of the bus grid lines in one back contact battery piece is 0.17-3. The photovoltaic module is low in hidden crack risk, high in current transmission efficiency, good in insulating performance of the insulating layer, good in reliability and simple in technological process.