206 results about "Positive temperature" patented technology

The invention discloses a temperature sensor, a temperature acquisition device and electronic equipment, in the temperature sensor, a temperature sensing current generation module responds to target temperature change, and provides a first current signal with a positive temperature coefficient for a current conversion module; the current conversion module converts the first current signal into a first voltage signal with a negative temperature coefficient and generates and outputs a second voltage signal to the voltage regulation module according to the first voltage signal, and the voltage value of the second voltage signal is an integral multiple of the voltage value of the first voltage signal; the voltage regulation module receives the second voltage signal and outputs a third voltage signal to the analog-to-digital converter, and the voltage value of the third voltage signal is smaller than that of the second voltage signal; the analog-to-digital converter receives the third voltage signal and outputs a target digital signal, and the target digital signal is used for representing the temperature measured by the temperature sensing front-end circuit. According to the arrangement, the accuracy of temperature detection can be improved, and the temperature sensor is high in accuracy, small in size and low in power consumption.

This invention provides an optical glass, its preparation method, and an optical element. The optical glass contains the following components in molar percentage: B₂O₃: 5.0%–19.9%; SiO₂: 5.0%–28.0%; La₂O₃: 0.05%–11.5%; Gd₂O₃: 0%–10.0%; Y₂O₃: 3.6%–15.0%; ZnO: 22.5%–60.0%; the refractive index n of the optical glass is... d An Abbe number of υ is above 1.78. d The temperature coefficient of refractive index is 35-45. The optical glass of this invention has a large positive temperature coefficient of refractive index. When used in combination with optical glass having a negative temperature coefficient of refractive index, it can effectively correct temperature drift caused by rapid temperature changes or high-temperature environments, fix the focus, and maintain clear imaging. It is suitable for vehicle-mounted cameras or projectors, copiers, laser printers, and playback devices that generate a lot of heat during use.

A heater element 1 includes: a honeycomb structure 10 having an outer peripheral wall 100 and partition walls 110, the partition walls 110 defining a plurality of cells 101a, each of the cells 101a extending from a first end face 10a to a second end face 10b of the honeycomb structure 10 to form a flow path, at least the partition walls 101 being made of a material having a positive temperature coefficient (PTC) property; a first electrode 11 and a second electrode 12 provided on the first end face 10a and the second end face 10b, respectively; and a first metal terminal 13 and a second metal terminal 14 provided on the first electrode 11 and the second electrode 12, respectively, wherein at least one of the first metal terminal 13 and the second metal terminal 14 has a plurality of partial electrodes 15.

The application discloses a DC-DC converter circuit based on over-temperature protection threshold adjustment, and an over-temperature detection module comprises: a first transistor circuit, the base of the transistor is connected with the reference voltage VBG output end of a band gap reference module, a positive temperature coefficient voltage proportional to absolute temperature is generated; a voltage dividing circuit input end is connected with the positive temperature coefficient voltage output end, the positive temperature coefficient voltage is divided to generate a detection voltage; a second transistor circuit, the base of the transistor is connected with the detection voltage output end, an over-temperature protection signal OTP is output to shut down the main circuit of the converter; an adjustment resistance circuit receives a digital adjustment signal; the digital adjustment signal changes the voltage dividing ratio of the positive temperature coefficient voltage divided to the detection voltage by controlling the equivalent resistance value of the adjustment resistance circuit; the change direction of the voltage dividing ratio is opposite to the change direction of the reference voltage VBG caused by adjustment. The application significantly improves the accuracy, consistency and overall reliability of the over-temperature protection threshold.

A positive temperature coefficient (PTC) heater apparatus is provided. The PTC heater apparatus includes a PTC heater, a resistance temperature detector (RTD) sensor mounted to the PTC heater and a controller logic unit electrically connected to the RTD sensor to receive readings of the RTD sensor, which, when the PTC heater is powered on, indicate whether the PTC heater is faulty.

The present disclose provides a sol-gel paste composition of matter that is provided for application to a substrate to form an electrically conductive coating which can be used, for example, as a resistor in a thick-film resistive heater, which a positive temperature coefficient of resistivity (PTCR) as a consequence of the electronic properties of the electrically conductive semiconductors used in the resistor layer and which exhibits self-limiting behavior at elevated temperatures. The composition includes a sol gel solution in which up to 90% by weight (wt. %) of the solution is comprised of conductive and insulative powders in a uniform stable solution.

The heating member includes a first substrate, a second substrate facing the first substrate, a heating layer disposed between the first substrate and the second substrate, a positive temperature coefficient (PTC) heater element disposed in the heating layer, and a negative temperature coefficient (NTC) heater element disposed in the heating layer, wherein the PTC element and the NTC element are connected in series.

An electric heater, such as a flat plate electric heater, comprising a semiconductive layer comprising a first electric semiconductive composition having a positive temperature coefficient, the first semiconductive composition comprising polyethylene, polypropylene or a mixture thereof and an electrically conductive filler; a plurality of semiconductive portions located on and protruding from the electric semiconductive layer, wherein the semiconductive portions comprise a second electric semiconductive composition having a positive temperature coefficient, the second semiconductive composition comprising polyethylene, polypropylene or a mixture thereof and an electrically conductive filler; wherein the semiconductive portions are arranged in a regular pattern on the semiconductive layer; and the semiconductive portions are at least twice as thick as the semiconductive layer.

A high-power, high-temperature-stability M-type strontium ferrite belongs to the field of ferrite material preparation technology. The ferrite comprises a main formulation of SrCO3, La2O3, CaCO3, MnO, SnO2, Fe2O3, and Co2O3, and additives composed of CaCO3, SiO2, H3BO3, and La2O3. This invention introduces Sn-Mn ions for co-substitution, thereby constructing a Sn... 4+ -Mn 2+ The charge balance mechanism effectively suppressed the Fe ionization induced by the introduction of high-valence ions. 3+ To Fe 2+ Price change behavior, effective compensation after replacement due to the introduction of non-magnetic Sn 4+ This results in a loss of lattice magnetic moment. Simultaneously, through a stepped pre-sintering and sintering process, a CoFe2O4 hard magnetic spinel phase is induced to precipitate in the M-type strontium ferrite main phase. The negative coercivity temperature coefficient of the CoFe2O4 phase complements the inherent positive temperature coefficient of the matrix.

The invention relates to an iron-nickel-based medium-temperature electrothermal alloy and a preparation method thereof, and belongs to the technical field of alloy preparation. The electrothermal alloy comprises the following chemical components in percentage by mass: 0.01%-0.03% of C, 0.70%-1.50% of Al, less than or equal to 0.80% of Cr, less than or equal to 0.003% of S, less than or equal to 0.020% of P, 51%-53% of Ni, 0.04%-0.20% of rare earth, 0.80%-1.50% of Ti and a matrix element Fe, wherein the rare earth comprises at least one of Y, La and Ce. Alloy elements such as Al, rare earth and Ti are introduced, so that the oxidation resistance of the alloy is improved, and the service life of the alloy in a medium-temperature environment is greatly prolonged. And meanwhile, on the basis of ensuring excellent mechanical properties, the resistivity of the alloy material is effectively improved, and the resistance temperature coefficient of the alloy material is optimized, so that the alloy material can better meet the performance requirement of the positive temperature coefficient effect, and finally, the applicability, design flexibility and integration degree of the electrothermal alloy in a limited design space are enhanced.

A temperature regulation device for controlling the temperature of pipework. The device 1 comprises a plurality of electrically connected positive temperature coefficient heating elements 2 arranged i

This invention discloses a method for fabricating a near-zero temperature coefficient thin-film pressure sensor with a wide temperature range. The purpose of this invention is to address the common problem of insufficient environmental adaptability in existing flexible thin-film sensors, particularly the significant performance degradation under extreme temperature conditions. This invention proposes a wide-temperature-range intrinsically self-compensating flexible pressure sensor based on a PVDF / CFT / Cu composite sensing material thin film. This sensor achieves a near-zero temperature coefficient of resistance for the composite material by synergistically introducing carbon fiber tubes with negative temperature coefficients and copper nanoparticles with positive temperature coefficients into the flexible PVDF matrix and dynamically controlling their ratio, thereby constructing a temperature self-compensation mechanism at the material level. This invention provides an effective material solution for developing next-generation high-reliability, wide-temperature-range adaptive flexible sensing systems.

A surface acoustic wave resonator (100) comprises a layered substrate including a carrier substrate (110) and a dielectric layer (112) having a low acoustic velocity. Another dielectric layer (122) is disposed on a piezoelectric layer (113) and interdigitated electrodes (131, 132) having an acoustic velocity lower than the acoustic velocity of the carrier substrate (110) and a positive temperature coefficient of frequency.

The present invention relates to a control device for a cooling and heating system. The control device for a cooling and heating system according to one embodiment of the present invention is a control device for controlling a motor of an electric compressor for cooling and a positive temperature coefficient (PTC) heater for heating, and for performing control in response to removal of a power supply unit. The control device comprises: a DC capacitor for storing DC power inputted from the power supply unit; a power conversion unit having a plurality of switching elements and configured to convert the DC power stored in the DC capacitor into AC power on the basis of a switching operation to output the AC power to the motor; a PTC switching unit connected in series with the PTC heater to switch application of the DC power of the DC capacitor to the PTC heater; and a control unit positioned between the power supply unit and the DC capacitor to determine an active state of the power supply unit.

The invention discloses a low-temperature-drift hysteresis voltage comparator, relates to the technical field of stepping motors, and is used for solving the problem that in the prior art, the hysteresis voltage of a comparator is increased due to large temperature change of a stepping motor driving circuit, and then current control of a stepping motor is affected. Comprising a negative temperature excursion current generation module, a positive temperature excursion current generation module, a zero temperature excursion current generation module, a current operation module and a cross coupling comparison module. The cross-coupling comparison module is used for generating a hysteresis voltage based on a comparison result of the input voltage and the reference voltage; the current operation module performs weighted operation on the current generated by the negative temperature drift current generation module, the positive temperature drift current generation module and the zero temperature drift current generation module, and outputs compensation current; the compensation current is provided to the tail current source of the cross-coupling comparison module and is used for modulating the output impedance of the tail current source so as to compensate the temperature drift of the hysteresis voltage.

A heating element 1 comprises: a honeycomb structure 10 with an outer circumferential wall 100 and partitions 110 provided on an inner surface of the outer circumferential wall 100, wherein the partitions 110 define a plurality of cells 101a, each of the cells 101a extending from a first end surface 10a to a second end surface 10b of the honeycomb structure 10 to form a flow path, wherein at least the partitions 101a are made of a material having a positive temperature coefficient (PTC) property; a first electrode 11 and a second electrode 12 provided on the first end surface 10a and the second end surface 10b, respectively; and a first metal terminal 13 and a second metal terminal 14 provided on the first electrode 11 and the second electrode 12 respectively, wherein at least one of the first metal terminal 13 and the second metal terminal 14 has a plurality of partial electrodes 15.

The invention relates to the technical field of circuit protection components, in particular to a surface-mounted polymer PTC (Positive Temperature Coefficient) over-current protection component, which comprises a PTC core material, the plastic packaging layer wraps the PTC core material; the rewiring layer is arranged in the plastic packaging layer and is electrically connected with the conductive electrode of the PTC core material; the buried hole is formed in the plastic package layer; the bonding pads comprise a first bonding pad and a second bonding pad, and the first bonding pad and the second bonding pad are arranged outside the plastic packaging layer; the rewiring layer and the buried hole are combined to form an electrical connection path, and the bonding pad is electrically connected with the conductive electrode of the PTC core material through the electrical connection path. According to the invention, the rewiring layer and the buried hole are combined to form an electrical path, the traditional mode of directly manufacturing a bonding pad on an electrode is replaced, the dependence on the processing precision is reduced, the production yield is obviously improved, the cost is reduced, the electrical connection bottleneck of a miniaturized plastic package structure is overcome, and the overcurrent protection of the element is stably realized in a smaller size.

The utility model discloses a PTC (Positive Temperature Coefficient) heater fin quick-mounting structure which comprises a heater body, fin bodies are symmetrically arranged outside the heater body up and down, and fixing mechanisms are symmetrically arranged on the left side and the right side of the heater body. Wherein the fixing mechanism comprises a limiting rod, a magnet, a bidirectional lead screw, limiting grooves, a belt pulley, a connecting belt, a rotating disc, a threaded rod, a limiting pin and a handle groove, the limiting grooves are symmetrically formed in the left side and the right side of the interior of the heater body, and the bidirectional lead screw is rotationally arranged in the limiting grooves. According to the PTC heater fin quick-mounting structure, by arranging the quick-mounting mechanism, the mounting efficiency can be greatly improved, the mounting time is effectively saved, meanwhile, the fixing mechanism is arranged, the fins can be stably mounted, the loosening phenomenon cannot occur, and in addition, the convenient carrying mechanism is arranged, so that the mounting efficiency is improved. The fins installed on the two sides of the heater can be fixed together to be installed, and the carrying efficiency is greatly improved.

The invention discloses a power device with conduction voltage drop in a positive temperature coefficient and a manufacturing method thereof. The manufacturing method comprises the following steps: epitaxially growing a first N-type epitaxial layer on an N-type substrate; performing injection on the surface of the first N-type epitaxial layer to form a plurality of P-type reversal regions which are distributed at intervals; epitaxially growing a second N-type epitaxial layer on the first N-type epitaxial layer; and completing the subsequent manufacturing process of the device. According to the invention, a plurality of relatively thick p-type doped P-type reversal regions distributed at intervals are formed in the temperature coefficient reversal region, so that the positive temperature coefficient of the conduction voltage drop of the device can be improved, and the manufacturing cost of the device is reduced.

The application provides an IGBT module junction temperature monitoring device and method with a thermistor. The IGBT module junction temperature monitoring device comprises a resistance voltage division subcircuit, a voltage comparison subcircuit, a voltage / current conversion subcircuit, a current / voltage conversion subcircuit and a signal processor. The voltage comparison subcircuit comprises a first operational amplifier, a second operational amplifier, a first resistor, a second resistor, a first diode and a second diode. When the thermistor is a negative temperature coefficient thermistor, the thermistor is located between an input end of the resistance voltage division subcircuit and an output end of the resistance voltage division subcircuit in the resistance voltage division subcircuit. When the thermistor is a positive temperature coefficient thermistor, the thermistor is located between a ground end of the resistance voltage division subcircuit and the output end of the resistance voltage division subcircuit in the resistance voltage division subcircuit.

The invention discloses an automobile PTC (Positive Temperature Coefficient) core and controller assembly structure and an automobile air conditioner with the automobile PTC core and controller assembly structure. The PTC core body can be used for heating the air conditioning box; a PCB (Printed Circuit Board), wherein the PTC core body is arranged on the PCB; the PTC core body is perpendicular to the PCB, and the PTC core body and the PCB are connected to form an L-shaped structure; the PTC core body can be inserted into an air conditioning box; and the PCB does not shield the foot blowing air channel. Gaps are formed in the periphery of the PTC, interference with a foot blowing air channel is avoided, the structure change of an automobile air conditioner can be adapted, and the purposes of reducing cost and increasing efficiency are achieved.

The present specification discloses an electrode and a use thereof. The electrode includes a polymer layer that exhibits a so-called PTC (Positive Temperature Coefficient) effect at a desired level at a desired time, whereby it can be suitably applied in applications in which stability problems are caused by abnormally high heat or flames. The polymer layer can exhibit oxidation potential characteristics suitable for electrode applications, and can stably maintain such oxidation potential characteristics even in harsh environments. In the polymer layer of the electrode, the PTC effect can occur rapidly at a required time. The present specification also discloses a use of the electrode.

The utility model is suitable for the technical field of PTC heaters, and provides a PTC heater curing device which comprises a rack, a closed curing box is arranged above the rack, and the two ends of the curing box are communicated to form a curing cavity for a carrier to pass through; a set of lifting plates are slidably distributed in the curing box in the vertical direction at intervals. The curing cavity is divided into a preheating area, a heating curing area and a cooling area which are independently sealed by the two lifting plates; according to the device, electric push rods on the two sides of a bearing frame are matched with pressure sensors to stably clamp a PTC heater in the carrier clamping link, the interior of a curing cavity is designed in a partitioned mode, temperature and humidity of all the areas are independently controlled, the temperature of the PTC heater is evenly increased in a preheating area through an infrared radiation heater and a double-channel temperature sensing module, high-power rapid curing is conducted in a heating curing area, and the curing efficiency is improved. And the nitrogen protection and waste gas treatment system is used for isolating oxygen and purifying waste gas, so that the curing quality and stability of the PTC heater are comprehensively guaranteed.

A circuit optimization method and system for a digital domain correction of a temperature sensor is provided. The method includes: subjecting negative temperature coefficient voltages Vbep and Vben to a switch timing control, thereby generating a corresponding negative temperature coefficient voltage Vbep and positive temperature coefficient voltage Dvbe as inputs into an operational transconductance amplifier (OTA) that serves as a core circuit of a Sigam-Delt analog-to-digital converter (ADC); and generating, by a switch sampling circuit, Vintx by integrating; inputting the Vintx into a comparator (CMP) to acquire a final ADC output; and sending a feedback through a digital domain to an analog domain control switch logic. The circuit optimization method intelligently finds the optimal temperature factor of different processes through the digital domain correction, thereby acquiring the desired ratio value more accurately. Meanwhile, the circuit optimization method reduces the trim circuit to be implemented in the analog domain.

Self-regulating heating cables and associated production methods are provided. A self-regulating heating cable includes a first frame element coupled to a first conductive wire, with a first chip tab that extends from the first frame element toward a second conductive wire at least to a midpoint between the first and second conductive wires. A second frame element is coupled to the second conductive wire, with a second chip tab that extends from the second frame element toward the first conductive wire. A ceramic positive temperature coefficient (PTC) chip is disposed between the first conductive wire and the second conductive wire, and is retained between the first conductive wire and the second conductive wire by the first chip tab and the second chip tab.

This invention discloses a patterned thin-film resistor structure with temperature compensation function, belonging to the field of resistor structure technology. It includes a substrate with an N-type layer on top. In use, the dielectric layer acts as an insulating layer. The Pt thin-film resistor layer serves as the main resistive material, ensuring the stability of the resistance value. The temperature compensation thin-film layer uses silicon material doped with copper. Platinum has a positive temperature coefficient of resistance, while copper-doped silicon material has a negative temperature coefficient of resistance. When the ambient temperature changes, the resistance of the Pt film increases, while the resistance of the copper-doped silicon material with a negative temperature coefficient decreases. When the two are connected in series or parallel, the overall resistance change can partially cancel each other out, thereby reducing the influence of temperature on the resistance.

The utility model relates to oil field casing drilling, in particular to a sensor for casing screwing-on measurement, and aims to solve the problem that the error correction result is inaccurate due to the temperature difference between the placement position of a temperature sensor and the patch position of a strain gauge and the self measurement error of the temperature sensor. According to the utility model, through the arrangement of the PCB groove, the radio frequency antenna groove and the battery hole, the number of turns of thread rotation in the threaded connection process of casing drilling equipment and the torque generated during thread matching can be monitored at the same time, and the quality of threaded connection between equipment can be ensured more effectively. And the design of a Wheatstone bridge temperature compensation circuit can be completed according to the sensitivity of the negative temperature coefficient of the strain gauge and the resistance change of the positive temperature coefficient. Through the feedback mechanism of the compensation circuit, the reduction of the output voltage of the strain gauge Wheatstone bridge circuit caused by the temperature can be effectively compensated.

The application discloses a temperature sensing circuit, a chip thereof and an electronic device. The temperature sensing circuit comprises a first feedback unit, a second feedback unit and a temperature sensing unit. The first feedback unit generates a bias voltage and a first current with a negative temperature coefficient according to a power supply voltage and a negative feedback path. The second feedback unit generates a second current with a positive temperature coefficient according to the power supply voltage, the bias voltage and a positive feedback path. The negative feedback coefficient is greater than the positive feedback coefficient, so the system is stable. The temperature sensing unit generates a third current with a negative temperature coefficient with a first slope according to the first current, generates a fourth current with a positive temperature coefficient with a second slope according to the second current, and obtains a current temperature according to the third current and the fourth current. When the third current is equal to the fourth current, the current temperature is a first threshold. The application can realize a higher-precision over-temperature protection function through a simple circuit, thereby improving the stability of the electronic device and the chip.

The present specification discloses a polymer layer, a method for manufacturing the same, and a use thereof. The polymer layer exhibits a so-called PTC (Positive Temperature Coefficient) effect at a desired level for a desired time, thereby being suitable as a material capable of securing stability in applications where stability problems are caused by abnormally high heat or flames. The polymer layer can exhibit oxidation potential characteristics suitable for applications, and stably maintain such oxidation potential characteristics even in harsh environments. In the polymer layer, the PTC effect may occur rapidly at a desired level at a desired time. The polymer layer has a flat surface and thus has excellent scratch resistance. The present specification discloses methods of making and uses of the polymer layer.

The invention discloses a BaTiO3-based high dielectric ceramic with a positive temperature coefficient at a low temperature, and belongs to the field of dielectric ceramic preparation. The BaTiO3-based high-dielectric ceramic is formed by sintering a substrate BaTiO3 and dopants MgO, XaOb, MnO2, RcOd, SiO2 and YeOf, the molar ratio of BaTiO3: MgO: XaOb: MnO2: RcOd: SiO2: YeOf is 100: x1: x2: x3: x4: x5: x6, a doping element X is at least one of Nb, W and Mo, a doping element R is at least one of rare earth elements La, Ce, Pr, Nd, Sm, Eu, Gd, Tb, Dy, Ho, Y, Er, Tm, Yb and Lu, and a doping element Y is at least one of Fe, Co and Ni; a, b, c, d, e and f are atomic ratio numbers. The BaTiO3-based dielectric ceramic of the system has a positive temperature coefficient at a low temperature, an ultrahigh dielectric constant between 4000 and 4600, dielectric loss of about 1% and high dielectric property, can meet the application of MLCC (Multiplayer Ceramic Chip Capacitors) and wafer capacitors, remarkably reduces the product size, reduces the circuit board volume, and is beneficial to miniaturization and lightweight design of electronic products.