350 results about "Thermal sensing" patented technology

Various embodiments provide compositions that exhibit positive temperature coefficient of resistance (PTCR) properties for use in thermal interactions with tissue—including thermal sensing and I2R current-limiting interactions. Embodiments also provide tissue-engaging surfaces having PTCR materials that provide very fast switching times between low resistance and high, current-limiting resistance. One embodiment provides a matrix for an electrosurgical energy delivery surface comprising a PTCR material and a heat exchange material disposed within an interior of the matrix. The PTCR material has a substantially conductive state and a substantially non-conductive state. The heat exchange material has a structure configured to have an omni-directional thermal diffusivity for exchanging heat with the PTCR material to cause rapid switching of the PTCR material between the conductive state and non-conductive state. Preferably, the structure comprises a graphite foam having an open cell configuration. The matrix can be carried by tissue contacting surfaces of various electrosurgical devices.

Various embodiments provide compositions that exhibit positive temperature coefficient of resistance (PTCR) properties for use in thermal interactions with tissue—including thermal sensing and I2R current-limiting interactions. Embodiments also provide tissue-engaging surfaces having PTCR materials that provide very fast switching times between low resistance and high, current-limiting resistance. One embodiment provides a matrix for an electrosurgical energy delivery surface comprising a PTCR material and a heat exchange material disposed within an interior of the matrix. The PTCR material has a substantially conductive state and a substantially non-conductive state. The heat exchange material has a structure configured to have an omni-directional thermal diffusivity for exchanging heat with the PTCR material to cause rapid switching of the PTCR material between the conductive state and non-conductive state. Preferably, the structure comprises a graphite foam having an open cell configuration. The matrix can be carried by tissue contacting surfaces of various electrosurgical devices.

A thermal in-situ method and apparatus are provided for recovering hydrocarbons from subterranean hydrocarbon-containing formations such as oil sands, oil shale and other heavy oil systems. Recovery of viscous hydrocarbon by hot fluid injection into subterranean formations is assisted by using a specially designed wellbore with an active hydraulic seal, with a axial communication zone with multiple injection perforations separated from the production perforations by a moveable packer. In addition, a novel downhole thermal sensing apparatus is used to monitor and control oil production. A producing mechanism including pumping equipment lifts the produced oil from the central cavity to the surface.

A sensory substitution device according to an embodiment of the invention includes a thermal imaging array for sensing thermal characteristics of an external scene. The device includes a visual prosthesis adapted to receive input based on the scene sensed by the thermal imaging array and to convey information based on the scene to a user of the sensing device. The visual prosthesis is adapted to simultaneously convey to the user different visual information corresponding to portions of the scene having different thermal characteristics. One type of thermal imaging array includes a microbolometer imaging array, and one type of visual prosthesis includes a retinal implant. According to additional embodiments, an apparatus for obtaining thermal data includes a thermal detector adapted to sense thermal characteristics of an environment using a plurality of pixels. The apparatus also includes a pixel translator, operably coupled with the thermal detector, adapted to translate pixel data of the thermal detector to a lower resolution. The apparatus also includes an interface, operably coupled with the pixel translator, adapted to communicate the thermal characteristics of the environment to a user of the apparatus at a lower resolution than sensed by the thermal detector.

A multiobjective management system for saturated traffic road networks comprising: green wave coordination of locally adaptive traffic control units, traffic movement optimization and live traffic route guidance. Current traffic congestion measurements on intersections are generated from local traffic cameras and remote air-borne conventional cameras and thermal sensing imaging cameras or satellite radar such as SAR / ISAR using optical image brightness analysis. At the first stage of traffic optimization, individual local intersection green times are computed based on current traffic congestion level. At the second stage optimization, the central traffic server uses a multiobjective approach to coordinate the current locally-optimized green times of the first stage and create input constraints for green-way coordination of plurality of traffic lights. The server updates dynamically current cycle start and green times on all network-connected traffic light controllers and also broadcasts recommended travel times, green times and green waves to all on-line client vehicle navigation units. Traffic server and individual client guidance units utilize novel time-dependent modifications of an A*-type algorithm to update current travel and recommended travel times and to execute fastest route searches.

The present invention provides a method of manufacturing a CT detector cell having an x-ray absorption component and a thermal sensing component. The thermal sensing component is configured to detect thermal differentials in the absorption component resulting from the absorption of x-rays.

Systems and methods for positioning thermal sensors within an integrated circuit in a manner that provides useful thermal measurements corresponding to different parts of the integrated circuit. In one embodiment, an integrated circuit includes multiple, duplicate functional blocks. A separate thermal sensor is coupled to each of the duplicate functional blocks, preferably in the same relative location on each of the duplicate functional blocks, and preferably at a hotspot. One embodiment also includes thermal sensors on one or more functional blocks of other types in the integrated circuit. One embodiment includes a thermal sensor positioned at a cool spot, such as at the edge of the integrated circuit chip. Each of the thermal sensors may have ports to enable power and ground connections or data connections between the sensors and external components or devices.

Thermal sensors for calorimetry can include vanadium oxide, heavily p-doped amorphous silicon, or other materials with high temperature coefficients of resistivity. Such thermal sensors can have low noise equivalent temperature difference (NETD). For example, a thermal sensor with NETD no greater than 100 μK over a bandwidth range of approximately 3 Hz or more can include a thermistor including vanadium oxide sputtered at room temperature under conditions that yield primarily V2O5; more specifically, the NETD can be no greater than 35 μK, or even 10 μK over a bandwidth range of approximately 3 Hz or more. If a low noise thermal sensor has NETD no greater than 50 μK over such a bandwidth range, a low noise output circuitry connected to its thermistor can provide an electrical output signal that includes information about input thermal signal peaks with amplitude of approximately 100 μK.

Thermal detectors and thermal sensing cells can include a region of a support layer or support structure. Within the region can be reaction surfaces or other reaction regions, as well as contact pads and circuitry connecting the contact pads to other components. Also, a cell region can include a structure with reaction regions, contact pads, and control / detection circuitry connected to the contact pads; the control / detection circuitry controls occurrence of reactions in response to control signals, such as by drop merging, and also allows electrical detection of thermal signals from the reaction regions. The control / detection circuitry can include reaction control components such as drop merger electrodes and also thermal sensors such as thermistors, or it can include control / sensor elements such as semiconductor slabs that perform both functions. Each cell in an array can have control / detection circuitry that does not extend or connect outside the cell except through contact pads.

In thermal sensing devices, such as for calorimetry, a support layer or central layer can have a thermometer element or other thermal sensor on one side and a thermally conductive structure or component on the other. The thermally conductive structure can conduct temperature or other thermal input signals laterally across the support layer or central layer. The temperature or signals can then be provided to the thermometer element, such as by thermal contact through the support layer. An electrically conducting, thermally isolating anti-coupling layer, such as of gold or chromium, can reduce capacitive coupling between the thermally conductive structure and the thermometer element or other thermal sensor.

PCT No. PCT / GB96 / 01805 Sec. 371 Date Jan. 9, 1998 Sec. 102(e) Date Jan. 9, 1998 PCT Filed Jul. 29, 1996 PCT Pub. No. WO97 / 05742 PCT Pub. Date Feb. 13, 1997A thermal sensing system (10) including an array of photon detectors (14) produces a detector-dependent response to irradiation. Variations in individual detector characteristics produce a fixed pattern noise which degrades an image or other response. A switchable mirror (M1) may at one position (Pcal) direct infrared radiation from a light emitting diode (20) onto the detector array (14). The diode (20) is both a negative and positive luminescent emitter, the flux emitted is current controlled to be equivalent to black body radiation at a range of temperatures both colder and hotter than ambient. Calibration relationships comprising transfer functions relating incident intensity to signal response are derived for each detector. Alternatively the mirror (M1) may be at an observation position (Pobs) and infrared radiation from a remote scene reaches the detector array (14). Resulting detector signals are converted into corrected fluxes using individual calibration relationships previously derived and an image or response with reduced fixed pattern noise is obtained.

A digital frying pan provides temperature and / or food doneness information associated with food cooked within the pan. A thermal sensor coupled with the pan senses temperature and generates corresponding signals, and processing electronics coupled with the sensor convert the signals to data for display on a LCD. A warning buzzer or LED warns the user of completed cooking. The frying pan may be programmed to desired food types or personal temperatures or food doneness options. The invention also provides a remote sensing food doneness system for remotely viewing and then determining food temperature and / or food doneness. The remote system uses thermal imaging optics and thermal sensing techniques to remotely sense food temperature. Preferably a second optical element images the food onto a CCD to display an image of the food to a user. The system is mounted by a user who views the CCD to ensure appropriate placement in line of sight from the food. A warning is generated by the system to indicate food doneness or desired temperature.

The invention relates to a method for inverting surface temperature and emissivity from remote sensing data ASTER, comprising three steps: step one: a training and testing database is established by utilizing that an atmospherical radiation transmission simulating software carries out positive simulation aiming at the areas and seasons of the 11th, 12th, 13th and 15th thermal infrared wave bands of the obtained thermal sensing data ASTER and an atmospherical model; step two: a neural network is utilized for carrying out repeated training and test to a training and testing data set; step three: inversion calculation is carried out to the ASTER actual image data, and actual earth surface verification and application analysis are carried out. The products obtained by the method have high precision, especially when the surrounding atmospherical changes greatly.

A device comprising an acoustic detector, one or more thermal sensing elements coupled to the acoustic detector, and a light source. A method comprising directing a beam of light at a wavelength at or near one or more thermal sensing elements, wherein the thermal sensing elements are coupled to an acoustic detector, determining a resonance frequency of the acoustic detector, wherein the acoustic detector is coupled to one or more of the thermal sensing elements, and measuring the response of the acoustic detector to detect optical radiation absorption proximate to or at the surface of one or more thermal sensing elements.

A flexible thin metal film thermal sensing system is provided. A thermally-conductive film made from a thermally-insulating material is doped with thermally-conductive material. At least one layer of electrically-conductive metal is deposited directly onto a surface of the thermally-conductive film. One or more devices are coupled to the layer(s) to measure an electrical characteristic associated therewith as an indication of temperature.

A temperature monitoring technique that eliminates the need for bipolar devices. In one embodiment of the present invention, a long-channel MOS transistor is configured in a diode connection to sense change in temperature. The diode drives a linear regulator and an oscillator. The oscillator in turn drives a counter, which counts pulses for a fixed period of time. The system clock on the chip is used as a temperature-independent frequency to generate a count. The temperature-dependent frequency is counted for a fixed number of system clock cycles. The present invention eliminates band gap circuitry currently used in most thermal sensing devices to provide a temperature-independent reference.

Systems and methods for reducing the complexity and size of thermal sensors, where the voltage of a thermally sensitive device is compared to a reference voltage that varies as a function of temperature, rather than being constant. One embodiment comprises a thermal sensing system including a reference voltage generator, a thermal sensor and a comparator. The reference voltage generator is configured to generate a non-constant reference voltage that varies as a known function of temperature. The thermal sensor is configured to generate a sensor voltage that also varies as a known function of temperature. The functions of the reference and sensor voltages cross at a known temperature / voltage. The comparator is configured to compare the sensor voltage and the reference voltage and to generate a comparison output signal based on the comparison of the sensor voltage and the first reference voltage. A transition in this signal indicates the reference temperature.

A thermal gas flow sensor and method of forming such a sensor. The sensor has a substrate and a heater disposed on the substrate. At least one pair of thermal sensing elements is disposed on the substrate either side of the heater. A protective layer is disposed on at least the heater and / or the thermal sensing elements. The protective layer comprises a high temperature resistant polymer based layer which is preferably a fluoropolymer based layer. The protective layer can also cover interconnects and electrical connections also formed on the substrate so as to completely seal the sensor. A passivation layer, such as silicon nitride, can be disposed on the sensing and / or heating elements and optionally the interconnects and is arranged to interpose the protective layer and the substrate.

A novel pixel circuit and multi-dimensional array for receiving and detecting black body radiation in the SWIR, MWIR or LWIR frequency bands. An electromagnetic thermal sensor and imaging system is provided based on the treatment of thermal radiation as an electromagnetic wave. The thermal sensor and imager functions essentially as an electromagnetic power sensor / receiver, operating in the SWIR (200-375 THz), MWIR (60-100 THz), or LWIR (21-38 THz) frequency bands. The thermal pixel circuit of the invention is used to construct thermal imaging arrays, such as 1D, 2D and stereoscopic arrays. Various pixel circuit embodiments arc provided including balanced and unbalanced, biased and unbiased and current and voltage sensing topologies. The pixel circuit and corresponding imaging arrays are constructed on a monolithic semiconductor substrate using in a stacked topology. A metal-insulator-metal (MIM) structure provides rectification of the received signal at high terahertz frequencies.

Thermal sensing devices can include two subsets of thermal sensors connected in a bridge by circuitry on the same support layer or surface with the sensors. Each thermal sensor can be formed in a patterned layer of semiconductor material, and the bridge circuitry can include leads formed in a patterned layer of conductive material, over or under the semiconductor layer. In one implementation, the bridge circuitry includes conductive portions that extend across and electrically contact the lower surface of each sensor's semiconductor slab. The bridge circuitry can also include pads that can be electrically contacted, such as by pogo pins. The device's reaction surface can be spaced apart from or over the thermal sensors. The device's components can be shaped and positioned so that the bridge's offset voltage is below the sensitivity level required for an application, such as by left-right symmetry about an axis.

A cordless electrical appliance has thermal sensing means in the appliance part and an electronic control in the base part. Two thermistors are shown for the thermal sensing means to monitor for liquid temperature during normal operation and also for dry switch-on. Also disclosed is a multi-pole 360-degree cordless connector providing two extra poles which can allow electrical connection to be made to the thermal sensing means.

A device for thermal sensing is based on only one thermopile. The junctions of the thermopile are coupled thermally to a first region which includes a first substance while the hot junctions of the thermopile are coupled thermally to a second region which includes a second substance. The first and second regions are separated and thermally isolated from each other. The device can further include a membrane to thermally and electrically isolate the thermopile and to mechanically support the thermopile.

A slider having leading and trailing edges is configured to fly on an airbearing above a data storage disk rotating from the leading edge to the trailing edge. Read and write heads are mounted on the slider proximate the trailing edge. An auxiliary thermal sensor is mounted on the slider, but preferably nearer the leading edge. Forward placement of the sensor allows it to sense mechanical defects before they reach the heads, thereby permitting a write inhibit operation, for example. The sensor may also be used to detect airbearing modulation. Appropriate action may be taken when unacceptable airbearing modulation is detected, such as notifying the user and / or scrubbing the slider. The sensor is preferably wider than the heads. This allows, for example, an in-situ glide test to be performed faster using the sensor. An arm electronics module is preferably configured to permit concurrent operation of the sensor and heads.

An arrangement for a patient lifting system, wherein the patient lifting system comprises a lifting device and a sling adapted to be coupled to the lifting device. The lifting device is during use of the lifting system adapted to lift the patient from a lowered to a raised position and said sling is adapted to be at least partly wrapped around the patient to be lifted. The arrangement of the present invention comprises at least one RFID-chip (1) provided in the sling, at least one RFID-reader (2) adapted to communicate with the RFID-chip and at least one sensing means (3) provided in the sling and adapted to communicate with the RFID-chip. The RFID-chip is adapted to contain, to store and to continuously be updated with new or updated information that is relevant to the use of said sling in the patient lifting system and further adapted to provide said information to said RFID-reader. In a preferred embodiment the sling is provided with thermal sensing means adapted to communicate with the RFID-chip and further adapted to sense when the slings is being washed.

There is provided a thermal sensing fiber including a semiconducting element having a fiber length and characterized by a bandgap energy corresponding to a selected operational temperature range for the fiber in which there can be produced a change in thermally-excited electronic charge carrier population in the semiconducting element in response to a temperature change in the selected temperature range. At least one pair of conducting electrodes is provided in contact with the semiconducting element along the fiber length, and an insulator is provided along the fiber length.

A slider having leading and trailing edges is configured to fly on an airbearing adjacent a data storage disk rotating from the leading edge to the trailing edge. Read and write heads are mounted on the slider proximate the trailing edge. An auxiliary thermal sensor is mounted on the slider, but preferably nearer the leading edge. Forward placement of the sensor allows it to sense mechanical defects before they reach the heads, thereby permitting a write inhibit operation, for example. The sensor may also be used to detect airbearing modulation. Appropriate action may be taken when unacceptable airbearing modulation is detected, such as notifying the user and / or scrubbing the slider. The sensor is preferably wider than the heads. This allows, for example, an in-situ glide test to be performed faster using the sensor. An arm electronics module is preferably configured to permit concurrent operation of the sensor and heads.