The application relates to a LAP
grinding fluid
shunting device and an
improved method thereof, and belongs to the technical field of
semiconductor wafer processing equipment, which comprises a lower rack, a
grinding rotary table arranged at the upper end of the lower rack, an upper rack arranged at the upper part of the lower rack and surrounding the
grinding rotary table, a grinding pressing plate movably and tightly arranged in the upper rack, a lifting cylinder arranged between the grinding pressing plate and the upper rack, a liquid guide ring groove communicated with the grinding pressing plate and arranged on the grinding pressing plate, a grinding
fluid injection pipe extended to the liquid guide ring groove and arranged at the side of the lifting cylinder, a
pipe clamp arranged between the grinding
fluid injection pipe and the upper part of the lifting cylinder and used for fixing the grinding
fluid injection pipe, a plurality of liquid distribution grooves in annular distribution and communicated with the liquid guide ring groove and arranged on the grinding pressing plate, and a plurality of liquid distribution holes communicated with the lower end surface of the grinding pressing plate and arranged in the liquid distribution grooves. The device has the characteristics of more uniform
shunting, more stable liquid path and more compact structure, and can effectively solve the problems of uneven distribution, easy blockage and unstable flow rate of the grinding fluid in the transmission process.