A 
wafer-scale apparatus and method is described for the 
automation of forming, aligning and attaching two-dimensional arrays of microoptic elements on 
semiconductor and other 
image display devices, backplanes, optoelectronic boards, and integrated optical systems. In an ordered fabrication sequence, a mold plate comprised of optically designed cavities is formed by 
reactive ion etching or alternative processes, optionally coated with a release material layer and filled with optically specified materials by an automated fluid-injection and defect-inspection subsystem. 
Optical alignment fiducials guide the disclosed transfer and attachment processes to achieve specified tolerances between the microoptic elements and corresponding optoelectronic devices and circuits. The present invention applies to spectral filters, waveguides, 
fiber-optic mode-transformers, 
diffraction gratings, refractive lenses, 
diffractive lens / 
Fresnel zone plates, reflectors, and to combinations of elements and devices, including 
microelectromechanical systems (MEMS) and 
liquid crystal device (LCD) matrices for adaptive, tunable elements. Preparation of interfacial layer properties and attachment process embodiments are taught.