A vacuum
interconnection system for sample exchange between MOCVD and MBE comprising an MOCVD growth chamber (1), an MOCVD transition chamber (2), a flip chamber (3), an MBE transition chamber (4) and an MBE growth chamber (5) which are connected in sequence, wherein adjacent chambers are isolated from each other by an
isolation valve; an MOCVD transition chamber
manipulator (21) is provided in the MOCVD transition chamber (2); a transfer plate (31), a
filtration plate (32), a liftable and rotatable transfer component (33), a first lifting
assembly (34) and a second lifting
assembly (35) are provided in the flip chamber (3), a plurality of
wafer carrier slots (311) being provided on the transfer plate (31), a plurality of
wafer filtration through holes (321) being provided on the
filtration plate (32), the
diameter of each of the
wafer filtration through holes (321) being greater than the
diameter of a wafer (100) and smaller than the
diameter of a wafer carrier (101), and a placement portion (322) being provided on an upper surface and a lower surface of the filtration plate (32); a
manipulator box (6) is connected to one side of the flip chamber (3), and a flipping
manipulator (61) is provided in the manipulator box (6); and an MBE transition chamber manipulator (41) is provided in the MBE transition chamber (4). According to the present invention, the need for contact with a wafer growth surface is eliminated, thereby lowering the risk of wafer surface damage and contact-induced
contamination; and the need for clamping a wafer
peripheral region is eliminated, thereby lowering the risk of chipping caused by a compressive stress.